A chip radiator for Loongson 3A6000 processor

Abstract

This invention relates to the field of chip heat sink technology, specifically to a chip heat sink for the Loongson 3A6000 processor. It includes a heat-conducting device and a heat-dissipating device. The heat-conducting device includes a heat-conducting body and a fixing body. The heat-conducting body includes a heat-conducting structure and multiple heat dissipation fins disposed on the heat-conducting structure. In this invention, when the speed of the variable-speed fan increases, the downward pressure exerted on the guide cavity wall by the airflow is greater than the spring force, causing the middle clamping plate to press down and drive the control plate to move downward along the heat dissipation fins. The distance from the heat-conducting plate to the bottom of the control plate decreases, thus reducing the airflow cross-sectional area of ​​the airflow channel. This leads to a further increase in the airflow velocity flowing out of the airflow channel, which promotes airflow within the chassis, improves airflow conditions within the chassis, and forms a benign circulation of air within the chassis. This further facilitates the cooling of the processor, preventing damage or performance degradation due to overheating.

Description

Technical Field

[0001] This invention relates to the field of chip heat sink technology, and more specifically, to a chip heat sink for the Loongson 3A6000 processor. Background Technology

[0002] The Loongson 3A6000 is a new generation of general-purpose processor independently developed and controlled in China. Its main function is to provide high-performance computing capabilities to meet the needs of various complex application scenarios. The Loongson 3A6000 is the first product of Loongson's fourth-generation microarchitecture. Its significant improvements in performance, security and ecosystem compatibility mark that the domestic CPU technology has reached the international advanced level.

[0003] With the iterative upgrades of equipment, high-performance processors such as the Loongson 3A6000 have increasingly higher integration levels, leading to a corresponding increase in heat generation. Overheating is a major cause of performance degradation and frequent malfunctions in electronic devices. To effectively control device temperature and ensure stability under high loads, a heatsink, as described in CN104282639A, is used to dissipate heat from processor chips. This heatsink includes a base and parallel, spaced fins vertically fixed to the base. The heatsink uses passive air cooling, utilizing cool airflow through ventilation holes to exchange heat with the fins. However, the cooling effect of this passive cooling method is limited by the natural airflow rate. Processors and motherboards are generally fixed in enclosed chassis, and the limited space within the chassis restricts the size of the heatsink. Furthermore, the poor airflow between the inside and outside of the chassis results in a low airflow rate, leading to relatively low cooling efficiency, especially under high-temperature or high-load operating environments. Summary of the Invention

[0004] The purpose of this invention is to improve the heat dissipation efficiency of heat sinks in enclosed environments to avoid processor damage or performance degradation due to overheating.

[0005] The purpose of this invention is to provide a chip heat sink for the Loongson 3A6000 processor, which improves the heat conduction efficiency of the heat sink by actively accelerating the air flow and guiding the air flow to form a circulating airflow, thereby improving the heat dissipation efficiency.

[0006] To achieve the above objectives, the present invention aims to provide a chip heat sink for the Loongson 3A6000 processor, including a heat conduction device and a heat dissipation device disposed on the heat conduction device. The heat conduction device includes a heat conduction body and a fixing body. The heat conduction body includes a heat conduction structure and a plurality of heat dissipation fins disposed on the heat conduction structure.

[0007] The heat dissipation device includes a speed-regulating fan and a control body that is elastically connected to the bottom of the speed-regulating fan. The speed-regulating fan is fixedly installed at the top of the heat-conducting structure and electrically connected to the motherboard. The bottom of the control body is inserted into the top of the heat dissipation fins. The space formed by the heat dissipation fins above the heat-conducting structure, below the control body, and adjacent heat dissipation fins is an air guide channel. The control body is used to guide the airflow blown out by the speed-regulating fan into the air guide channel.

[0008] The motherboard adjusts the speed of the variable-speed fan according to the processor temperature. When the speed of the variable-speed fan increases, the airflow velocity through the control body increases, which increases the airflow speed in the air guide channel, accelerates the heat dissipation rate of the heat sink fins, and increases the thrust of the air, causing the control body to move downward to reduce the airflow cross-sectional area of ​​the air guide channel, further increasing the airflow velocity, promoting airflow in the chassis, and forming a good circulation of air in the chassis. This is beneficial for cooling the processor and avoids problems such as processor damage or performance degradation due to overheating.

[0009] As a further improvement to this technical solution, the heat-conducting structure includes a heat-conducting base and a conductive column disposed on the top of the heat-conducting base. The bottom of the heat-conducting base is in contact with the surface of the processor, and a heat-conducting plate is fixedly connected to the top of the conductive column. Multiple heat dissipation fins are provided on the upper surface of the heat-conducting plate.

[0010] After the processor's heat is dissipated by the thermal pad, the heat is conducted along the conductive pillars and heat-conducting plate to the heat sink fins, and then dissipated outwards from the heat sink fins.

[0011] As a further improvement to this technical solution, the fixing body includes a pair of fixing plates, which are fixedly connected by a first bolt. The two ends of the fixing plates are fixed to the main plate by a second bolt, and a fixing sleeve is provided in the middle of the fixing plate.

[0012] The inner wall of the fixed sleeve is provided with a locking block, and the outer wall of the conductive column is provided with a corresponding locking groove, and the locking block is locked in the locking groove.

[0013] A complete ring structure is formed by the fixed sleeve, surrounding and securing the heat conductor, thus fixing the heat conductor and preventing its deflection, thereby ensuring the normal operation of the radiator.

[0014] As a further improvement to this technical solution, corner rods are provided at the four corners of the top of the heat-conducting plate, and the speed-regulating fan includes a cover plate and a speed-regulating fan located in the middle of the cover plate. The four corners of the cover plate are connected to the top of the corner rods by screws, and the speed-regulating fan is electrically connected to the main board.

[0015] The heat dissipation fins have a spiral structure, and multiple heat dissipation fins are symmetrically arranged about the axis of the speed-regulating fan.

[0016] The variable-speed fan drives and accelerates the air, causing it to enter the airflow channel through the control unit. By increasing the airflow velocity, the efficiency of heat dissipation by the heat sink fins is improved. Since the heat sink fins have a spiral structure, the airflow channel is also spiral. When the air flows in the spiral channel, the flow velocity increases due to centrifugal force, thereby further accelerating the air and further improving the efficiency of the heat sink fins in dissipating heat.

[0017] As a further improvement to this technical solution, the control body includes a middle clamp plate and a control plate located at the bottom of the middle clamp plate. The control plate has an opening in the middle, and the bottom of the middle clamp plate passes through the opening. The middle clamp plate is used to guide air downward through the heat dissipation fins. The bottom end of the control plate contacts the heat dissipation fins, and the top end of the control plate passes through the middle clamp plate and is elastically connected to the cover plate.

[0018] The middle clamp plate has a guide cavity that runs through the upper and lower surfaces of the middle clamp plate. The guide cavity has a cavity structure that is wider at the top and narrower at the bottom.

[0019] The control plate is also provided with a receiving groove, the top of the heat dissipation fin is located in the receiving groove, the top of the control plate is provided with a positioning rod, the top of the positioning rod passes through the middle clamp plate and the cover plate, the top of the positioning rod is threaded with a threaded pin, the surface of the threaded pin is sleeved with a spring, and the threaded pin is connected to the upper surface of the cover plate through the spring.

[0020] The inner wall of the narrow end at the bottom of the guide cavity is provided with a spiral edge, and the rotation direction of the spiral edge is consistent with the rotation direction of the heat dissipation fins.

[0021] When air flows, it exerts a downward force on the guide cavity wall. When the speed of the variable speed fan increases, the downward pressure exerted on the guide cavity wall by the air flow is greater than the elastic force of the spring, which compresses the spring and reduces the cross-sectional area of ​​the air passage. This leads to a further increase in the air velocity flowing out of the air passage, promoting air flow in the chassis and improving the air circulation conditions inside the chassis.

[0022] In this invention, the motherboard adjusts the speed of the variable speed fan according to the processor temperature. As the speed of the variable speed fan increases, the air velocity through the control body increases, and the thrust exerted by the air on the control body increases. This causes the control body to move downward, reducing the cross-sectional area of ​​the air passage and further increasing the air velocity flowing out of the air passage. This allows the outflowing air to promote airflow within the chassis, improve the air circulation conditions within the chassis, and thus prevent the processor from being damaged or experiencing performance degradation due to overheating.

[0023] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0024] 1. In the Loongson 3A6000 processor chip heatsink, when the speed of the variable-speed fan increases, the downward pressure exerted on the guide cavity wall by the airflow is greater than the spring force. This causes the middle clamping plate to press down, driving the control plate to move down along the heat dissipation fins. The distance from the heat conduction plate to the bottom of the control plate is reduced, thus reducing the cross-sectional area of ​​the airflow channel. This leads to a further increase in the airflow velocity from the airflow channel, which promotes airflow within the chassis, improves the airflow conditions within the chassis, and forms a benign circulation of air within the chassis. This further helps to cool the processor and avoid processor damage or performance degradation due to overheating.

[0025] 2. In the chip heatsink for the Loongson 3A6000 processor, a spiral edge is designed so that when air flows downward along the guide cavity, it can rotate along the spiral edge to form a spiral airflow. The spiral direction of the airflow is consistent with the rotation direction of the heatsink fins. This allows the air flowing out from the bottom of the spiral edge to smoothly enter the air guide channel, reducing energy loss caused by airflow turbulence. As a result, the air flowing out of the air guide channel can accelerate the airflow inside the chassis, thereby improving the air circulation conditions inside the chassis and facilitating further cooling of the processor. Attached Figure Description

[0026] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0027] Figure 2 This is a schematic diagram of the heat conduction device structure of the present invention;

[0028] Figure 3 This is a cross-sectional view of the disassembled structure of the heat conduction device of the present invention;

[0029] Figure 4 This is a structural diagram showing the fit between the heat conductor and the heat dissipation device of the present invention;

[0030] Figure 5 This is a diagram showing the assembly of the speed-regulating fan and the heat conductor of the present invention;

[0031] Figure 6 This is a structural assembly diagram of the heat conductor, speed-regulating fan, and control body of the present invention;

[0032] Figure 7 This is a cross-sectional view of the merging structure of the speed-regulating fan and the control body of the present invention;

[0033] Figure 8 This is a side view of the airflow direction of the heat sink of the present invention;

[0034] Figure 9 This is a top view of the airflow direction of the heat conductor of the present invention;

[0035] Figure 10 This is a schematic diagram of the activity of the regulator of the present invention.

[0036] The meaning of each number in the figure is:

[0037] 1. Heat conduction device; 11. Heat conductor; 111. Heat conduction base; 112. Conductive column; 1121. Slot; 113. Heat conduction plate; 1131. Angle rod; 114. Heat dissipation fins; 12. Fixing body; 121. Fixing plate; 122. Fixing sleeve; 1221. Locking block;

[0038] 2. Heat dissipation device; 21. Variable speed fan; 211. Cover plate; 212. Variable speed fan; 22. Control body; 221. Middle clamp plate; 2211. Guide cavity; 2212. Spiral edge; 222. Control plate; 2221. Plate opening; 2222. Receiving groove; 2223. Positioning rod; 2224. Threaded pin; 2225. Spring. Detailed Implementation

[0039] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0040] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0041] Please see Figure 1 , Figure 2 , Figure 3 , Figure 4 As shown, the purpose of this embodiment is to provide a chip heat sink for the Loongson 3A6000 processor, including a heat conduction device 1 and a heat dissipation device 2 disposed on the heat conduction device 1.

[0042] The heat conduction device 1 includes a heat conductor 11 and a fixing body 12 that fixes the heat conductor 11 to the motherboard. The heat conductor 11 includes a heat conduction structure and a plurality of heat dissipation fins 114 disposed on the heat conduction structure. The bottom end of the heat conduction structure contacts the processor to absorb the heat of the processor.

[0043] The heat dissipation device 2 includes a speed-regulating fan 21 and a control body 22 that is elastically connected to the bottom of the speed-regulating fan 21. The speed-regulating fan 21 is fixedly installed on the top of the heat-conducting structure and is electrically connected to the motherboard. The bottom of the control body 22 is inserted into the top of the heat dissipation fins 114. The space formed by the control body 22 and the adjacent heat dissipation fins 114 above the heat-conducting structure and below the control body 22 is an air guide channel. The control body 22 is used to guide the airflow blown out by the speed-regulating fan 21 into the air guide channel.

[0044] The processor's heat is absorbed by the heat-conducting structure, which then conducts the heat to the heat sink 114. The variable-speed fan 21 blows air downwards through the control body 22 into one end of the airflow channel. The air then carries away the heat from the heat sink 114 through the airflow channel to prevent the processor from overheating. The motherboard adjusts the speed of the variable-speed fan 21 according to the processor temperature. When the processor temperature is high due to high temperatures inside the chassis or high load, the speed of the variable-speed fan 21 increases, increasing the airflow speed through the control body 22, thus increasing the airflow speed within the airflow channel and further reducing heat loss. The heat dissipation rate of the heat sink 114 is increased, thereby improving the heat dissipation effect. At the same time, the increased airflow velocity through the control body 22 increases the thrust exerted by the air on the control body 22, which in turn causes the control body 22 to move downward against the elastic force, reducing the airflow cross-sectional area of ​​the air passage. This further increases the airflow velocity out of the air passage, allowing the outflowing air to promote airflow within the chassis, improve the airflow conditions within the chassis, and form a benign circulation of air within the chassis. This further helps to cool the processor and prevent the processor from being damaged or its performance from degrading due to overheating.

[0045] The above structure is disclosed below:

[0046] When dissipating heat, the first step is to dissipate the processor's heat, such as... Figure 3As shown, the heat-conducting structure includes a heat-conducting base 111 and a conductive post 112 disposed on top of the heat-conducting base 111. The bottom of the heat-conducting base 111 contacts the processor surface. To maximize the heat dissipation from the processor, the size of the heat-conducting base 111 is set to be slightly larger than the size of the processor. For example, the size of the Loongson 3A6000 processor is 35mm*35mm, so the size of the heat-conducting base 111 is not less than 35mm*35mm. The gap between the heat-conducting base 111 and the processor contact surface is filled with thermal grease to ensure full contact between the processor surface and the heat-conducting base 111, maximizing the heat dissipation from the processor. A heat-conducting plate 113 is fixedly connected to the top of the conductive post 112, and the upper surface of the heat-conducting plate 113 has... Multiple heat dissipation fins 114 are provided. The fixing body 12 includes a pair of fixing plates 121. The two fixing plates 121 are fixedly connected by a first bolt. The two ends of the fixing plates 121 are fixed to the motherboard by a second bolt. A fixing sleeve 122 is provided in the middle of the fixing plate 121. When the two fixing plates 121 are fixedly connected, the two fixing sleeves 122 form a complete ring structure, thereby surrounding the conduction column 112 and clamping the conduction column 112 to fix the heat conductor 11. This ensures that the heat conduction base 111 always remains in contact with the processor surface. After the heat of the processor is conducted out by the heat conduction base 111, the heat is conducted along the conduction column 112 and the heat conduction plate 113 to the heat dissipation fins 114, and then dissipated outward by the heat dissipation fins 114.

[0047] To improve the efficiency of heat dissipation from the heat sink 114, such as Figure 3 , Figure 4 , Figure 5 As shown, corner rods 1131 are provided at the four corners of the top of the heat conduction plate 113. The variable speed fan 21 includes a cover plate 211 and a variable speed fan 212 located in the middle of the cover plate 211. The four corners of the cover plate 211 are connected to the top of the corner rods 1131 by screws. The variable speed fan 212 is electrically connected to the motherboard. The variable speed fan 212 drives and accelerates the air, so that the air enters the air guide channel through the control body 22. By increasing the airflow rate, the efficiency of heat dissipation of the heat sink 114 is improved. Furthermore, the variable speed fan 212 is an adjustable speed fan, mainly used for... To ensure efficient heat dissipation while also prioritizing energy saving and low noise, the speed-regulating fan 212 is powered by the motherboard. The motherboard uses a temperature sensor to monitor the processor temperature in real time. When the temperature changes, the speed of the speed-regulating fan 212 is intelligently adjusted by changing the duty cycle of the output signal or the power supply voltage of the speed-regulating fan 212. When the temperature rises, the speed of the speed-regulating fan 212 increases, and when the temperature drops, the speed of the speed-regulating fan 212 decreases, ensuring that the processor temperature remains within a safe range, such as 40-80℃.

[0048] In addition, the heat dissipation fins 114 have a spiral structure, and multiple heat dissipation fins 114 are symmetrically arranged about the axis of the speed-regulating fan 212. When the airflow blown out by the speed-regulating fan 212 enters the air guide channel, the air guide channel is a spiral channel because the heat dissipation fins 114 have a spiral structure. When the air flows in the spiral channel, the flow velocity increases due to the centrifugal force, thereby further accelerating the air and further improving the efficiency of the heat dissipation fins 114 in dissipating heat.

[0049] In order to introduce the air blown by the speed-regulating fan 212 into the air guide channel, such as Figure 4 , Figure 6 , Figure 7 As shown, the structure of the regulator 22 is disclosed in detail below:

[0050] The control body 22 includes a middle clamping plate 221 and a control plate 222 located at the bottom of the middle clamping plate 221. The control plate 222 has an opening 2221 in the middle that penetrates the upper and lower surfaces. The bottom of the middle clamping plate 221 passes through the opening 2221. The middle clamping plate 221 is used to guide air downward through the heat dissipation fins 114. The bottom end of the control plate 222 contacts the heat dissipation fins 114. The top end of the control plate 222 passes through the middle clamping plate 221 and is elastically connected to the cover plate 211. The space formed by the heat conduction plate 113 above, the control plate 222 below, and the adjacent heat dissipation fins 114 is the air guide channel. The air blown out by the speed-regulating fan 212 is guided by the middle clamping plate 221, flows downward and enters the inner end of the air guide channel, and then flows out along the outer end of the air guide channel.

[0051] Specifically, the middle clamping plate 221 has a guide cavity 2211 that runs through the upper and lower surfaces of the middle clamping plate 221. The guide cavity 2211 has a cavity structure that is wider at the top and narrower at the bottom. The control plate 222 also has a number of receiving slots 2222 that are the same as the number of heat dissipation fins 114. The shape of the receiving slots 2222 matches the shape of the heat dissipation fins 114. The top of the heat dissipation fins 114 is located in the receiving slots 2222. The top of the control plate 222 is provided with a positioning rod 2223. The top of the positioning rod 2223 passes through the middle clamping plate 221 and the cover plate 211. The top of the positioning rod 2223 is threadedly connected to a threaded pin 2224. A spring 2225 is sleeved on the surface of the threaded pin 2224. The threaded pin 2224 is connected to the upper surface of the cover plate 211 through the spring 2225.

[0052] like Figure 8 , Figure 10As shown, the variable-speed fan 212 blows outside air into and downwards into the guide cavity 2211. As the air moves downwards along the guide cavity 2211, its wider top and narrower bottom structure accelerates the airflow, exerting a downward force on the wall of the guide cavity 2211. After reaching the bottom of the guide cavity 2211, the air enters through the inner end of the air guide channel and flows out to the outer end. At this point, the airflow cross-sectional area of ​​the air guide channel is 'a'. When the speed of the variable-speed fan 212 increases, the airflow is accelerated, and the air velocity increases as it passes through the air guide channel. Furthermore, due to the increased airflow velocity as it enters the guide cavity 2211... The increased airflow velocity within the cavity 1 causes the downward pressure exerted on the wall of the guide cavity 2211 by the airflow to exceed the elastic force of the spring 2225, resulting in the compression of the spring 2225. The downward pressure of the middle clamp 221 causes the control plate 222 to move downward along the heat dissipation fins 114. At this time, the airflow cross-sectional area of ​​the air guide channel is b. Since the distance between the heat conduction plate 113 and the bottom of the control plate 222 is reduced, the airflow cross-sectional area of ​​the air guide channel is reduced. The reduction in the airflow cross-sectional area leads to a further increase in the airflow velocity flowing out of the air guide channel, which enables the air flowing out of the air guide channel to promote airflow within the chassis and improve the airflow conditions within the chassis.

[0053] Further, such as Figure 7 , Figure 9 As shown, the inner wall of the narrow end of the bottom of the guide cavity 2211 is provided with a spiral edge 2212, and the rotation direction of the spiral edge 2212 is consistent with the rotation direction of the heat dissipation fins 114. By setting the spiral edge 2212, when the air flows downward along the guide cavity 2211, it can rotate along the spiral edge 2212 to form a spiral airflow, and the spiral direction of the spiral airflow is consistent with the rotation direction of the heat dissipation fins 114. This allows the air to flow out from the bottom end of the spiral edge 2212 and smoothly enter the air guide channel, reducing energy loss caused by airflow turbulence. As a result, after the air flows out through the air guide channel, it can accelerate the airflow inside the chassis, thereby improving the air circulation conditions inside the chassis and facilitating further cooling of the processor.

[0054] It is worth noting that, in order to facilitate the assembly and installation of the various components, two fixed sleeves 122 are used to form a complete ring structure to surround the conductive column 112 to ensure that the heat-conducting base 111 is in contact with the processor surface downwards. The rotation of the speed-regulating fan 212 and the air flow along the guide cavity 2211, the spiral edge 2212 and the air channel will generate rotational torque. In order to prevent the heat conductor 11 from deflecting, a locking block 1221 is provided on the inner wall of the fixed sleeve 122, and a corresponding locking groove 1121 is provided on the outer wall of the conductive column 112. The locking block 1221 is locked in the locking groove 1121. By fixing the conductive column 112 with the fixed sleeve 122, the deflection of the heat conductor 11 can be prevented, thereby ensuring the normal use of the heat sink.

[0055] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A chip heat sink for a Loongson 3A6000 processor, comprising a heat-conducting device (1) and a heat-dissipating device (2) disposed on the heat-conducting device (1), characterized in that: The heat conduction device (1) includes a heat conductor (11) and a fixing body (12). The heat conductor (11) includes a heat conduction structure and a plurality of heat dissipation fins (114) disposed on the heat conduction structure. The heat dissipation device (2) includes a speed-regulating fan (21) and a control body (22) elastically connected to the bottom of the speed-regulating fan (21). The speed-regulating fan (21) is fixedly installed at the top of the heat-conducting structure. The speed-regulating fan (21) is electrically connected to the main board. The bottom of the control body (22) is inserted into the top of the heat dissipation fins (114). The space formed by the control body (22) above the heat-conducting structure and below the control body (22) and adjacent heat dissipation fins (114) is the air guide channel. The control body (22) is used to guide the airflow blown out by the speed-regulating fan (21) into the air guide channel. When the speed of the speed-regulating fan (21) increases, the airflow velocity through the control body (22) increases, thereby increasing the thrust applied to the control body (22), causing the control body (22) to move down, reducing the airflow cross-sectional area of ​​the air guide channel to increase the airflow velocity. The heat-conducting structure includes a heat-conducting base (111) and a conductive column (112) disposed on the top of the heat-conducting base (111). The bottom of the heat-conducting base (111) is in contact with the surface of the processor. A heat-conducting plate (113) is fixedly connected to the top of the conductive column (112). Multiple heat dissipation fins (114) are provided on the upper surface of the heat-conducting plate (113). Angle rods (1131) are provided at the four corners of the top of the heat-conducting plate (113). The speed-regulating fan (21) includes a cover plate (211) and a speed-regulating fan (212) disposed in the middle of the cover plate (211). The four corners of the cover plate (211) are connected to the top of the angle rods (1131) by screws. The speed-regulating fan (212) is electrically connected to the motherboard. The control body (22) includes a middle clamping plate (221) and a control plate (222) located at the bottom of the middle clamping plate (221). The control plate (222) has an opening (2221) in the middle. The bottom of the middle clamping plate (221) passes through the opening (2221). The middle clamping plate (221) is used to guide air downward through the heat dissipation fins (114). The bottom end of the control plate (222) contacts the heat dissipation fins (114). The top end of the control plate (222) passes through the middle clamping plate (221) and is elastically connected to the cover plate (211). The middle clamping plate (221) has a guide cavity (2211) that runs through the upper and lower surfaces of the middle clamping plate (221). The guide cavity (2211) has a cavity structure that is wider at the top and narrower at the bottom. The control plate (222) is also provided with a receiving groove (2222). The top of the heat dissipation fin (114) is located in the receiving groove (2222). The top of the control plate (222) is provided with a positioning rod (2223). The top of the positioning rod (2223) passes through the middle clamping plate (221) and the cover plate (211). The top of the positioning rod (2223) is threadedly connected with a threaded pin (2224). A spring (2225) is sleeved on the surface of the threaded pin (2224). The threaded pin (2224) is connected to the upper surface of the cover plate (211) through the spring (2225).

2. The chip heat sink for the Loongson 3A6000 processor according to claim 1, characterized in that: The heat dissipation fins (114) have a spiral structure, and multiple heat dissipation fins (114) are symmetrically arranged about the axis of the speed-regulating fan (212).

3. The chip heat sink for the Loongson 3A6000 processor according to claim 1, characterized in that: The inner wall of the narrow end of the bottom of the guide cavity (2211) is provided with a spiral edge (2212), and the rotation direction of the spiral edge (2212) is consistent with the rotation direction of the heat dissipation fins (114).

4. The chip heat sink for the Loongson 3A6000 processor according to claim 1, characterized in that: The fixing body (12) includes a pair of fixing plates (121), which are fixedly connected by a first bolt. The two ends of the fixing plate (121) are fixed to the main plate by a second bolt. A fixing sleeve (122) is provided in the middle of the fixing plate (121).

5. The chip heat sink for the Loongson 3A6000 processor according to claim 4, characterized in that: The inner wall of the fixed sleeve (122) is provided with a locking block (1221), and the outer wall of the transmission column (112) is provided with a corresponding locking groove (1121), and the locking block (1221) is locked in the locking groove (1121).

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