Server heat dissipation method, device and system

Abstract

The invention discloses a server heat dissipation method, device and system, relates to the technical field of servers, and provides a server heat dissipation device, an outlet of a first air guide channel of the server heat dissipation device faces a network card, an outlet of a second air guide channel faces a CPU radiator, and a third air guide channel communicates with the outside of a server case. Fans are arranged in the air guide channels, and a plurality of baffles are arranged at the intersections of the air guide channels and used for controlling the flow direction of air. The method comprises the steps that the heat dissipation temperature of heat dissipation air entering the second air guide channel is detected, the working state of the fan is controlled based on the relation between the heat dissipation temperature and a preset temperature threshold value, and the opening and closing state of the baffle is adjusted. According to the method, the three independent air guide channels are arranged, the fans and the adjustable baffles are arranged, the fans and the baffles in the channels are dynamically adjusted in a targeted mode, directional heat dissipation of the network card is achieved, the heat dissipation requirement during high load is guaranteed, and energy consumption is reduced during low load.

Description

Technical Field

[0001] This application relates to the technical field of servers, and in particular, to a server heat dissipation method, device, and system. Background Art

[0002] As the core device for data processing, the performance of the CPU (Central Processing Unit) and network cards of a server has been continuously improved, resulting in a sharp increase in power consumption. The high power consumption causes the temperature inside the chassis to rise during the operation of the server, affecting the stable operation of the server. Fan heat dissipation is one of the current server heat dissipation methods, and usually, the fan speed is increased according to the temperature of the inlet and outlet vents inside the chassis and the power consumption. In the current fan heat dissipation method, the front window system fan blows the heat dissipation air of the CPU to the rear window network card area, which easily causes heat dissipation obstruction of the rear window network card. In addition, if the server power consumption is too high, the fan usually runs at full power, resulting in excessive noise, and even in this case, the server may still stop running due to insufficient heat dissipation. Summary of the Invention

[0003] This application provides a server heat dissipation method, device, and system to at least solve the problem of insufficient internal heat dissipation of the server in related technologies.

[0004] This application provides a server heat dissipation method applied to a server heat dissipation system. The server heat dissipation system at least includes a first controller, a second controller, and a server heat dissipation device. The server heat dissipation device is respectively communicatively connected to the first controller and the second controller. The first controller is connected to the second controller. The outlet of the first air guide channel of the server heat dissipation device faces the network card, the outlet of the second air guide channel faces the CPU radiator, and the third air guide channel communicates with the outside of the server chassis. Fans are provided in the first air guide channel, the second air guide channel, and the third air guide channel. A plurality of baffles are provided at the intersection of the first air guide channel, the second air guide channel, and the third air guide channel. The baffles are used to control the air flow direction. The method includes: Detect the heat dissipation temperature of the heat dissipation air entering the second air guide channel, and the heat dissipation air is discharged by the CPU radiator; Based on the relationship between the heat dissipation temperature and a preset temperature threshold, control the working state of the fan and adjust the opening and closing state of the baffle.

[0005] The present application also provides a server heat dissipation device, comprising: a server heat dissipation device connected to the first controller and the second controller respectively, the outlet of the first air guide channel of the server heat dissipation device faces the network card, the outlet of the second air guide channel faces the CPU radiator, and the first air guide channel and the second air guide channel are respectively provided with a first fan and a second fan, the third air guide channel is connected to the outside of the server chassis, the third air guide channel is provided with a third fan, the third fan is an air inlet and outlet fan, a plurality of baffles are provided at the intersection of the first air guide channel, the second air guide channel and the third air guide channel, the baffles are used to control the direction of wind, the baffles include a first baffle, a second baffle and a third baffle, the first baffle is provided on the side walls of the first air guide channel and the third air guide channel, the second baffle is provided on the side walls of the first air guide channel and the second air guide channel, and the third baffle is provided on the side walls of the second air guide channel and the third air guide channel.

[0006] The present application also provides a server cooling system, which is used to execute any of the above-mentioned server cooling methods, including: a first controller connected to the server heat dissipation device, and configured to obtain a heat dissipation temperature of the heat dissipation air; a second controller, the second controller being communicatively connected to the first controller; A server heat dissipation device is communicatively connected to the first controller and the second controller respectively.

[0007] The server cooling method provided in this embodiment is applied to a server cooling system. The cooling system includes at least a first controller, a second controller, and a server cooling device. The server cooling device is communicatively connected to the first and second controllers, respectively. The first controller is connected to the second controller. The outlet of the first air guide channel of the server cooling device is directed toward the network interface card (NIC), the outlet of the second air guide channel is directed toward the CPU heat sink, and the third air guide channel is connected to the exterior of the server chassis. Fans are provided in each of the first, second, and third air guide channels. Multiple baffles are provided at the intersection of the first, second, and third air guide channels to control the direction of air flow. The method includes detecting the heat dissipation temperature of the cooling air entering the second air guide channel and, based on the relationship between the heat dissipation temperature and a preset temperature threshold, controlling the operating state of the fan and adjusting the opening and closing state of the baffle. The server cooling device of this method is provided with three independent air guide channels and equipped with fans and adjustable baffles. By comparing the heat dissipation temperature with the preset temperature threshold, the fans and baffles in the channels are dynamically adjusted in a targeted manner, thereby achieving directional cooling of the network interface card, ensuring heat dissipation requirements under high load while reducing energy consumption under low load. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] To more clearly illustrate the embodiments of the present application, the following will briefly introduce the accompanying drawings required for the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0009] Figure 1 Schematic diagram of a server heat dissipation device provided by an embodiment of the present application; Figure 2 Structural schematic diagram of a server heat dissipation method provided by an embodiment of the present application; Figure 3 Topological diagram of a server heat dissipation circuit system provided by an embodiment of the present application; Figure 4 Flowchart of a server heat dissipation method provided by an embodiment of the present application; Figure 5 Schematic diagram of a controller provided by an embodiment of the present application. Detailed implementation manners

[0010] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, rather than all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the protection scope of the present application.

[0011] It should be noted that in the description of the present application, the terms "include", "comprise" or any other variation thereof are intended to cover a non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. The terms "first", "second", etc. in the present application are used to distinguish similar objects, rather than to describe a specific order or sequence.

[0012] To enable those skilled in the art of the present technology to better understand the solution of the present application, the following will further describe the present application in detail with reference to the accompanying drawings and specific implementation manners.

[0013] Combined with the specific application environment architecture or specific hardware architecture on which the execution of the server heat dissipation method depends, the specific application environment architecture or specific hardware architecture will be described herein.

[0014] The present invention provides a server heat dissipation device. The server heat dissipation device is connected to a first controller. The outlet of the first air guiding channel of the server heat dissipation device faces the network card, and the outlet of the second air guiding channel faces the CPU radiator. Moreover, a first fan and a second fan are respectively arranged in the first air guiding channel and the second air guiding channel, and a third air guiding channel communicates with the outside of the server chassis. A third fan is arranged in the third air guiding channel. The third fan is an air inlet and outlet fan. A plurality of baffles are arranged at the intersection of the first air guiding channel, the second air guiding channel and the third air guiding channel. The baffles are used to control the air flow direction. The baffles include a first baffle, a second baffle and a third baffle. The first baffle is arranged on the side walls of the first air guiding channel and the third air guiding channel, the second baffle is arranged on the side walls of the first air guiding channel and the second air guiding channel, and the third baffle is arranged on the side walls of the second air guiding channel and the third air guiding channel.

[0015] The server heat dissipation device provided by the embodiment of the present invention is as Figure 1 shown. As Figure 2 shown, this server heat dissipation device is arranged between the network card and the CPU in the server chassis. The front window position is a fan, and the air of the fan flows from the front window to the rear window, and flows to the CPU through a separate air guiding channel. The heat dissipation air discharged by the CPU radiator flows through the server heat dissipation device to the rear window of the server (i.e., the network card position) or is discharged upward from the server chassis.

[0016] Specifically, as Figure 1 shown, the server heat dissipation device has three air guiding channels. Among them, the outlet of the first air guiding channel faces the network card, the outlet of the second air guiding channel faces the CPU radiator, and the third air guiding channel communicates with the outside of the chassis. In some optional implementation manners, the first fan and the second fan are air inlet fans, and the third fan is an air inlet and outlet fan. A first fan and a second fan are respectively arranged in the first air guiding channel and the second air guiding channel, and both are air inlet fans. A third fan is arranged in the third air guiding channel. The third fan is an air inlet and outlet fan, and the air flow direction of the third fan can be adjusted by adjusting the working mode of the third fan according to the actual situation.

[0017] In some optional implementation manners, both the first fan and the third fan are air inlet and outlet fans, and the second fan is an air inlet fan.

[0018] In some optional implementation manners, a porous adsorption structure is arranged between the first fan of the first air guiding channel and the first baffle and the second baffle, and a humidity sensor is arranged at the porous adsorption structure. A temperature sensor is arranged at the inlet of the second air guiding channel for detecting the temperature of the heat dissipation air discharged by the CPU radiator. Among them, the porous adsorption structure can adopt an adsorption honeycomb briquette.

[0019] In some optional implementation manners, air guiding holes are arranged on the side wall of the first air guiding channel at the position of the humidity sensor.

[0020] A baffle fixing device is provided at the intersection of the first air guiding channel, the second air guiding channel and the third air guiding channel of the server heat dissipation device. Taking the first baffle as an example, by controlling the connection between the first baffle and the baffle fixing device, the first baffle is adjusted to a closed state.

[0021] The present invention provides a server heat dissipation system, including: a first controller, a second controller and a server heat dissipation device. Among them, the first controller is connected to the server heat dissipation device for obtaining the heat dissipation temperature of the heat dissipation air; the second controller is communicatively connected to the first controller; the server heat dissipation device is communicatively connected to the first controller and the second controller respectively. Among them, the first controller can be a BMC (Baseboard Management Controller), and the second controller can be a CPLD (Complex Programmable Logic Device). Figure 3 This is a topology diagram of the server heat dissipation circuit system provided by an embodiment of the present invention, which includes a CPLD, a BMC, a temperature sensor, a humidity sensor, a wind deflector, a fan, a power connector (PWR Conn) and a voltage conversion module. The wind deflector includes a first baffle, a second baffle and a third baffle, and the fan includes a first fan, a second fan and a third fan. The first fan is an air inlet fan, the second fan is an air inlet fan, and the third fan is an air inlet and outlet fan.

[0022] Among them, the BMC is used to obtain the temperature and power consumption of each point of the server, communicate and transmit with the CPLD, and send the detected temperature and power consumption data to the CPLD to realize the logical control of the server heat dissipation device through the CPLD. The power connector is used to connect the power supply module, and the voltage conversion module is used to realize the conversion of different voltages to supply power to relevant chips. The baffle is used to control the flow direction of the air, and the fan is used to control the flow direction of the heat dissipation air and dissipate heat. The temperature sensor is used to monitor the temperature of the air volume after passing through the CPU radiator, and the humidity sensor is used to monitor the humidity of the air volume flowing into the chassis to avoid problems such as short circuits caused by excessive humidity.

[0023] According to an embodiment of the present invention, an embodiment of a server heat dissipation method is provided. It should be noted that the steps shown in the flowchart of the accompanying drawings can be executed in a computer system such as a set of computer executable instructions, and although the logical order is shown in the flowchart, in some cases, the steps shown or described can be executed in a different order than here.

[0024] In this embodiment, a server heat dissipation method is provided, which is applied to a server heat dissipation system. The heat dissipation system at least includes a first controller, a second controller, and a server heat dissipation device. The server heat dissipation device is communicatively connected to the first controller and the second controller respectively. The first controller is connected to the second controller. The outlet of the first air guiding channel of the server heat dissipation device faces the network card, the outlet of the second air guiding channel faces the CPU radiator, and the third air guiding channel communicates with the outside of the server chassis. Fans are provided in the first air guiding channel, the second air guiding channel, and the third air guiding channel. A plurality of baffles are provided at the intersection of the first air guiding channel, the second air guiding channel, and the third air guiding channel. The baffles are used to control the air flow direction.

[0025] Figure 4 is a flowchart of the server heat dissipation method according to an embodiment of the present invention, as Figure 4 shown. The process includes the following steps: Step S101, detect the heat dissipation temperature of the heat dissipation air entering the second air guiding channel.

[0026] Among them, the heat dissipation air is discharged from the CPU radiator. During operation, the CPU generates a large amount of heat, which is absorbed by the CPU radiator, and the heat is absorbed and carried away by the heat dissipation air blown by the fan in the front window of the server chassis. The heat dissipation air is formed after heat exchange inside the CPU radiator.

[0027] The server heat dissipation device is arranged between the CPU radiator and the network card. The second air guiding channel is a specific path in the heat dissipation system for guiding the flow of the heat dissipation air. The heat dissipation air discharged from the CPU radiator enters the server heat dissipation device through the second air guiding channel. A temperature sensor is provided at the entrance of the second air guiding channel. When the CPU radiator discharges the heat dissipation air and enters the server heat dissipation device through the second air guiding channel, the heat dissipation temperature of the heat dissipation air is detected by the temperature sensor at the entrance.

[0028] Step S102, based on the relationship between the heat dissipation temperature and a preset temperature threshold, control the working state of the fan and adjust the opening and closing state of the baffle.

[0029] The preset temperature threshold is determined comprehensively according to factors such as the heat dissipation requirements of the server, the heat resistance of internal components (such as network cards), and the design goals of the heat dissipation system. The preset temperature threshold may include one or more temperature thresholds. After the first controller detects the heat dissipation temperature of the heat dissipation air through the temperature sensor, it sends the temperature data to the second controller for logical control.

[0030] Compare the heat dissipation temperature with a preset temperature threshold, and accordingly execute corresponding control methods based on the range where the heat dissipation temperature lies. The control methods include controlling the air outlet direction of the fan. The fan can be an air inlet fan or an air outlet fan. The air inlet fan is used to introduce external air into the server heat dissipation device, and the air outlet fan is used to discharge the internal air. The baffle is used to guide the air flow and adjust the air flow distribution. By adjusting the opening and closing state of the baffle, the flow path and flow distribution of the heat dissipation air can be changed.

[0031] If the temperature of the heat dissipation air is relatively high, by closing the baffles at some positions and opening the baffles at specific positions, and combining with the fans at specific positions, more heat dissipation air can enter the area that needs to be cooled, or the heat dissipation air can be directly discharged from the chassis.

[0032] If the temperature of the heat dissipation air is relatively low, appropriately close some baffles or adjust the opening and closing angle of the baffles, and combine with the fans at specific positions, so as to reduce the air flow in some areas of the heat dissipation air, in order to optimize the overall performance and energy consumption of the heat dissipation system.

[0033] The server heat dissipation method provided in this embodiment is applied to a server heat dissipation system. The heat dissipation system at least includes a first controller, a second controller, and a server heat dissipation device. The server heat dissipation device is respectively communicatively connected to the first controller and the second controller. The first controller is connected to the second controller. The outlet of the first air guiding channel of the server heat dissipation device faces the network card, the outlet of the second air guiding channel faces the CPU radiator, and the third air guiding channel is communicated with the outside of the server chassis. Fans are provided in the first air guiding channel, the second air guiding channel, and the third air guiding channel. A plurality of baffles are provided at the intersection of the first air guiding channel, the second air guiding channel, and the third air guiding channel. The baffles are used to control the air flow direction. The method includes detecting the heat dissipation temperature of the heat dissipation air entering the second air guiding channel, controlling the working state of the fan based on the relationship between the heat dissipation temperature and the preset temperature threshold, and adjusting the opening and closing state of the baffle. The server heat dissipation device of this method is provided with three independent air guiding channels and is equipped with fans and adjustable baffles. By comparing the heat dissipation temperature and the preset temperature threshold, the fans and baffles in the channels are dynamically adjusted in a targeted manner, realizing the directional heat dissipation of the network card, ensuring the heat dissipation requirements under high load and reducing energy consumption under low load.

[0034] In this embodiment, a server heat dissipation method is provided, and the method includes the following steps: Step S201, detect the heat dissipation temperature of the heat dissipation air entering the second air guiding channel.

[0035] For details, please refer to Figure 4 Step S101 of the illustrated embodiment, which will not be elaborated here.

[0036] Step S202: Based on the relationship between the heat dissipation temperature and the preset temperature threshold, control the working state of the fan and adjust the opening and closing state of the baffle.

[0037] In some alternative embodiments, the preset temperature threshold includes a first temperature threshold and a second temperature threshold, the first temperature threshold is less than the second temperature threshold, the baffle includes a first baffle, a second baffle, and a third baffle, the first baffle is disposed on the side walls of the first air guide channel and the third air guide channel, the second baffle is disposed on the side walls of the first air guide channel and the second air guide channel, the third baffle is disposed on the side walls of the second air guide channel and the third air guide channel, and the fan includes a first fan, a second fan, and a third fan. As an example, the first temperature threshold is 46°C and the second temperature threshold is 65°C. Specifically, step S202 includes: Step S2021: If the heat dissipation temperature is less than the first temperature threshold, control the first fan and the second fan to start and control the third fan to turn off.

[0038] Among them, the first fan and the second fan are inlet fans, the first fan is disposed in the first air guide channel, the second fan is disposed in the second air guide channel, and the third fan is disposed in the third air guide channel.

[0039] Compare the heat dissipation temperature with the first temperature threshold. If the heat dissipation temperature is less than the first temperature threshold, send a start command to the first fan and the second fan, and send a turn-off command to the third fan. The first fan and the second fan start running after receiving the start command, and the third fan stops running after receiving the turn-off command.

[0040] Step S2022: Adjust the second baffle to the open state and adjust the first baffle and the third baffle to the closed state.

[0041] Among them, when the second baffle is in the open state and the first baffle and the third baffle are in the closed state, the heat dissipation air flows from the second air guide channel to the first air guide channel. Since the first baffle and the third baffle are closed, there is no flow between the first air guide channel and the third air guide channel, and there is no flow between the second air guide channel and the third air guide channel. Under the action of the second fan, the heat dissipation air entering from the second air guide channel passes through the second baffle and flows into the first air guide channel, and under the acceleration of the first fan in the first air guide channel, it continues to flow to the outlet of the first air guide channel. The heat dissipation air flowing out of the first air guide channel can be used to dissipate heat from devices such as network cards at the rear window of the server chassis.

[0042] In the embodiments of the present invention, when the heat dissipation temperature is relatively low, by controlling the fan and the baffle, the flow path of the heat dissipation air is controlled so that it is guided to the area that needs heat dissipation, thereby improving the heat dissipation efficiency and ensuring that when the heat dissipation temperature is relatively low, the network card is dissipated with heat in a reasonable air path.

[0043] In some alternative embodiments, the third fan is an air inlet and outlet fan. Specifically, step S202 includes: Step S2023, if the heat dissipation temperature is greater than or equal to the first temperature threshold and less than or equal to the second temperature threshold, control the first fan and the second fan to start, and adjust the third fan to be an air inlet fan.

[0044] Compare the heat dissipation temperature with the first temperature threshold and the second temperature threshold. If the heat dissipation temperature is greater than or equal to the first temperature threshold and less than or equal to the second temperature threshold, send a start command to the first fan, the second fan, and the third fan, and send a control signal to the third fan to adjust the third fan to be an air inlet fan, so as to adjust the third fan to be an air inlet fan.

[0045] Step S2024, adjust the first baffle and the second baffle to the open state, and adjust the third baffle to the closed state.

[0046] Wherein, when the first baffle and the second baffle are in the open state, the heat dissipation air flows from the second air guide channel to the first air guide channel, and the external air flows from the third air guide channel to the first air guide channel.

[0047] The heat dissipation air entering the server heat dissipation device from the second air guide channel, under the air guiding of the second fan, passes through the second baffle and enters the first air guide channel. At the same time, the external air refers to the air outside the server chassis. Under the air guiding of the air inlet of the third fan, it enters the third air guide channel and passes through the first baffle and enters the first air guide channel. The external air and the heat dissipation air are mixed in the first air guide channel and, under the air guiding of the first fan, continue to flow towards the outlet of the first air guide channel. The heat dissipation air flowing out of the first air guide channel can be used to dissipate heat from devices such as network cards in the rear window of the server chassis.

[0048] Further, a porous adsorption structure is provided between the first fan in the first air guide channel and the first baffle and the second baffle, and a humidity sensor is provided at the porous adsorption structure; the method further includes: detecting the humidity of the mixed air based on the humidity sensor, and adsorbing the mixed air based on the porous adsorption structure. Wherein, the mixed air is obtained by mixing the heat dissipation air and the external air.

[0049] The porous adsorption structure can adopt adsorption honeycomb pores, which have abundant pores and can provide a large surface area, facilitating the adsorption of certain substances in the air. A humidity sensor is installed at the porous adsorption structure. The humidity sensor can detect the humidity of the air passing through this position in real time and transmit the detected humidity data to the control system. When the external wind is inhaled into the first air guiding channel, the external wind will mix with the cooling wind in the first air guiding channel to form a mixed wind. The characteristics of the mixed wind, such as temperature, humidity, and composition, will be affected by the respective characteristics of the cooling wind and the external wind. The mixed wind is adsorbed by the porous adsorption structure to reduce humidity and fully mix for cooling, and the humidity of the mixed wind is detected based on the humidity sensor. The detected humidity is converted into an electrical signal and transmitted to the control system. The control system can analyze the received humidity data according to the preset humidity range to determine whether the humidity of the current mixed wind meets the requirements. If it does not meet the requirements, the fan and the baffle can be further adjusted to prevent the mixed wind with excessive humidity from damaging the components inside the chassis.

[0050] In some alternative embodiments, the third fan is an air inlet and outlet fan, and step S202 includes: Step S2025, if the cooling temperature is greater than the second temperature threshold, control the first fan to turn off and the second fan to start, and adjust the third fan to be an outlet fan.

[0051] Compare the cooling temperature with the second temperature threshold. If the cooling temperature is greater than the second temperature threshold, it indicates that the current cooling temperature is relatively high. Send a shutdown command to the first fan and startup commands to the second fan and the third fan. After receiving the shutdown command, the first fan stops working. After receiving the startup commands, the second fan and the third fan start. Send a control command to the third fan to adjust the third fan to be an outlet fan.

[0052] Step S2026, adjust the first baffle and the second baffle to the closed state, and adjust the third baffle to the open state.

[0053] Among them, when the first baffle and the second baffle are in the closed state and the third baffle is in the open state, the cooling wind flows from the second air guiding channel to the third air guiding channel. Since the first baffle and the second baffle are closed and the third baffle is open, the cooling wind, under the air guiding of the second fan, passes through the third baffle and flows into the third air guiding channel, and is discharged outside the chassis along the third air guiding channel under the air guiding of the third fan acting as an outlet fan. At the same time, the system fan speed can be increased to supplement the discharged hot air volume.

[0054] Since the current cooling wind temperature is relatively high, to prevent components such as network cards from being in a high-temperature state due to the high temperature, under the air guiding action of the second fan and the third fan, the cooling wind is discharged outside the chassis.

[0055] In some alternative embodiments, the preset temperature threshold includes a first temperature threshold and a second temperature threshold, the first temperature threshold being less than the second temperature threshold. The baffle includes a first baffle, a second baffle, and a third baffle. The first baffle is provided on the side walls of the first air guide channel and the third air guide channel, the second baffle is provided on the side walls of the first air guide channel and the second air guide channel, and the third baffle is provided on the side walls of the second air guide channel and the third air guide channel. The fan includes a first fan, a second fan, and a third fan. The first fan and the third fan are inlet and outlet fans, and the second fan is an inlet fan. The side wall of the first air guide channel is provided with air guide holes. Step S102 includes: If the heat dissipation temperature is greater than the second temperature threshold, control the second fan to start, and adjust the first fan and the third fan to be outlet fans; adjust the first baffle and the second baffle to a closed state, and the third baffle to an open state. Among them, the first fan is provided in the first air guide channel, the second fan is provided in the second air guide channel, and the third fan is provided in the third air guide channel; when the first baffle and the second baffle are in a closed state and the third baffle is in an open state, the heat dissipation air flows from the second air guide channel to the third air guide channel.

[0056] In this embodiment, both the first fan and the third fan are inlet and outlet fans. If the heat dissipation temperature is greater than the second temperature threshold, it indicates that the current heat dissipation air temperature is relatively high. Adjust the first fan and the third fan to be outlet fans. The heat dissipation air passes through the third baffle under the action of the second fan and is discharged from the chassis under the air guiding of the third fan, which can prevent devices such as the rear window network card from operating at high temperatures. The first fan accelerates the heat dissipation air at the rear window of the chassis and outputs it to the rear window, which can improve the heat dissipation performance. At the same time, the rotation speed of the control system fan is increased to supplement the discharged heat dissipation air.

[0057] If the heat dissipation temperature is less than or equal to the second temperature threshold, adjust the first fan to be an inlet fan, turn off the third fan, adjust the second baffle to an open state, and adjust the first baffle and the third baffle to a closed state. When the second baffle is in an open state and the first baffle and the third baffle are in a closed state, the heat dissipation air flows from the second air guide channel to the first air guide channel.

[0058] Through the description of the above embodiments, those skilled in the art can clearly understand that the method according to the above embodiments can be implemented by means of software plus a necessary general hardware platform. Of course, it can also be implemented by hardware, but in many cases, the former is a better implementation method.

[0059] The embodiment of the present application also provides a controller, such as Figure 5As shown, it includes a memory 10 and a processor 20. A computer program is stored in the memory 10, and the processor 20 is configured to run the computer program to execute the steps in any of the above-described server heat dissipation method embodiments. Each component communicates with each other using different buses and can be installed on a common motherboard or installed in other ways as needed. The processor can process instructions executed within the computer device, including instructions stored in the memory or on the memory to display graphical information of the GUI on an external input / output device (such as a display device coupled to the interface). In some alternative embodiments, if necessary, multiple processors and / or multiple buses can be used together with multiple memories and multiple memories. Similarly, multiple computer devices can be connected, and each device provides some necessary operations (such as a server array, a set of blade servers, or a multi-processor system). The processor 20 can be a central processing unit, a network processor, or a combination thereof. Among them, the processor 20 can further include a hardware chip. The above hardware chip can be an application-specific integrated circuit, a programmable logic device, or a combination thereof. The above programmable logic device can be a complex programmable logic device, a field programmable gate array, a generic array logic, or any combination thereof.

[0060] Among them, the memory 10 stores instructions executable by at least one processor 20, so that the at least one processor 20 executes the method shown in the above embodiment.

[0061] The memory 10 can include a program storage area and a data storage area. Among them, the program storage area can store an operating system and application programs required for at least one function; the data storage area can store data created according to the use of the computer device, etc. In addition, the memory 10 can include a high-speed random access memory and can also include a non-transitory memory, such as at least one disk storage device, a flash memory device, or other non-transitory solid-state storage devices. In some alternative embodiments, the memory 10 can optionally include a memory remotely set relative to the processor 20, and these remote memories can be connected to the computer device through a network. Examples of the above network include but are not limited to the Internet, an enterprise intranet, a local area network, a mobile communication network, and combinations thereof.

[0062] The memory 10 can include a volatile memory, such as a random access memory; the memory can also include a non-volatile memory, such as a flash memory, a hard disk, or a solid-state drive; the memory 10 can also include a combination of the above types of memories.

[0063] An embodiment of the present application also provides a computer-readable storage medium, in which a computer program is stored. Among them, the computer program is configured to execute the steps in any of the above-described server heat dissipation method embodiments when running.

[0064] In an exemplary embodiment, the above computer-readable storage medium may include, but is not limited to: various media that can store computer programs such as USB flash drives, read-only memory (ROM for short), random access memory (RAM for short), external hard drives, magnetic disks, or optical discs. The method according to the embodiments of the present invention can be implemented in hardware, firmware, or be implemented as computer code that can be recorded on a storage medium, or be implemented as computer code originally stored in a remote storage medium or a non-transitory machine-readable storage medium and to be downloaded through a network and stored in a local storage medium, so that the method described herein can be stored as such software processing on a storage medium using a general-purpose computer, a dedicated processor, or programmable or dedicated hardware. Among them, the storage medium can be a magnetic disk, an optical disc, a read-only memory, a random access memory, a flash memory, a hard disk, or a solid-state drive, etc.; further, the storage medium can also include a combination of the above types of memories. It can be understood that a computer, a processor, a microprocessor controller, or programmable hardware includes a storage component that can store or receive software or computer code, and when the software or computer code is accessed and executed by the computer, the processor, or the hardware, the method shown in the above embodiments is implemented.

[0065] An embodiment of the present application also provides a computer program product. The above computer program product includes a computer program, and when the computer program is executed by a processor, the steps in any of the above embodiments of the server heat dissipation method are implemented.

[0066] An embodiment of the present application also provides another computer program product, including a non-volatile computer-readable storage medium. The non-volatile computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in any of the above embodiments of the server heat dissipation method are implemented.

[0067] Those skilled in the art can further realize that the units and algorithm steps of each example described in combination with the embodiments disclosed herein can be implemented by electronic hardware, computer software, or a combination of the two. To clearly illustrate the interchangeability of hardware and software, the components and steps of each example have been generally described according to their functions in the above description. Whether these functions are executed in a hardware or software manner depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods for each specific application to implement the described functions, but such implementation should not be considered to exceed the scope of the present application.

[0068] The above has introduced in detail a server heat dissipation method, device, and system provided by the present application. Specific examples are used in this article to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the method and its core idea of the present application. It should be noted that for those of ordinary skill in the art in this technical field, without departing from the principle of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A server heat dissipation method, characterized in that, Applied to a server cooling system, the server cooling system at least includes a first controller, a second controller, and a server cooling device. The server cooling device is communicatively connected to the first controller and the second controller respectively. The first controller is connected to the second controller. The outlet of the first air duct of the server cooling device faces the network card, the outlet of the second air duct faces the CPU radiator, and the third air duct communicates with the outside of the server chassis. And fans are provided in the first air duct, the second air duct, and the third air duct. A plurality of baffles are provided at the intersection of the first air duct, the second air duct, and the third air duct. The baffles are used to control the flow direction of air. The method includes: Detect the cooling temperature of the cooling air entering the second air duct, and the cooling air is discharged from the CPU radiator; Based on the relationship between the cooling temperature and a preset temperature threshold, control the working state of the fans and adjust the opening and closing states of the baffles.

2. The method according to claim 1, wherein The preset temperature threshold includes a first temperature threshold and a second temperature threshold, and the first temperature threshold is less than the second temperature threshold. The baffles include a first baffle, a second baffle, and a third baffle. The first baffle is provided on the side walls of the first air duct and the third air duct, the second baffle is provided on the side walls of the first air duct and the second air duct, and the third baffle is provided on the side walls of the second air duct and the third air duct. The fans include a first fan, a second fan, and a third fan. Based on the relationship between the cooling temperature and the preset temperature threshold, controlling the working state of the fans and adjusting the opening and closing states of the baffles includes: If the cooling temperature is less than the first temperature threshold, control the first fan and the second fan to start, and control the third fan to turn off. The first fan and the second fan are inlet fans. The first fan is provided in the first air duct, the second fan is provided in the second air duct, and the third fan is provided in the third air duct; Adjust the second baffle to an open state, and adjust the first baffle and the third baffle to a closed state. When the second baffle is in the open state and the first baffle and the third baffle are in the closed state, the cooling air flows from the second air duct to the first air duct.

3. The method according to claim 2, wherein The third fan is an inlet and outlet fan. Based on the relationship between the cooling temperature and the preset temperature threshold, controlling the working state of the fans and adjusting the opening and closing states of the baffles further includes: If the cooling temperature is greater than or equal to the first temperature threshold and less than or equal to the second temperature threshold, control the first fan and the second fan to start, and adjust the third fan to an inlet fan; Adjust the first baffle and the second baffle to an open state, and adjust the third baffle to a closed state. When the first baffle and the second baffle are in the open state, the cooling air flows from the second air duct to the first air duct, and the outside air flows from the third air duct to the first air duct.

4. The method according to claim 3, wherein A porous adsorption structure is provided between the first fan of the first air guiding channel and the first baffle and the second baffle, and a humidity sensor is provided at the porous adsorption structure; the method further includes: Detecting the humidity of the mixed air based on the humidity sensor, and adsorbing the mixed air based on the porous adsorption structure, where the mixed air is obtained by mixing the cooling air and the external air.

5. The method according to claim 2, characterized in that, The third fan is an air inlet and outlet fan. Based on the relationship between the cooling temperature and a preset temperature threshold, controlling the working state of the fan and adjusting the opening and closing state of the baffle further includes: If the cooling temperature is greater than the second temperature threshold, controlling the first fan to turn off and the second fan to start, and adjusting the third fan to an outlet fan; Adjusting the first baffle and the second baffle to a closed state, and adjusting the third baffle to an open state. When the first baffle and the second baffle are in the closed state and the third baffle is in the open state, the cooling air flows from the second air guiding channel to the third air guiding channel.

6. The method according to claim 1, wherein The preset temperature threshold includes a first temperature threshold and a second temperature threshold, the first temperature threshold is less than the second temperature threshold, the baffle includes a first baffle, a second baffle and a third baffle, the first baffle is provided on the side walls of the first air guiding channel and the third air guiding channel, the second baffle is provided on the side walls of the first air guiding channel and the second air guiding channel, the third baffle is provided on the side walls of the second air guiding channel and the third air guiding channel, the fan includes a first fan, a second fan and a third fan, the first fan and the third fan are air inlet and outlet fans, the second fan is an inlet fan, and air guiding holes are provided on the side wall of the first air guiding channel. Based on the relationship between the cooling temperature and the preset temperature threshold, controlling the working state of the fan and adjusting the opening and closing state of the baffle includes: If the cooling temperature is greater than the second temperature threshold, controlling the second fan to start, and adjusting the first fan and the third fan to outlet fans, the first fan is provided in the first air guiding channel, the second fan is provided in the second air guiding channel, and the third fan is provided in the third air guiding channel; Adjusting the first baffle and the second baffle to a closed state, and the third baffle to an open state. When the first baffle and the second baffle are in the closed state and the third baffle is in the open state, the cooling air flows from the second air guiding channel to the third air guiding channel.

7. A server heat dissipation device, characterized in that, The server heat dissipation device is respectively connected to the first controller and the second controller. The outlet of the first air guiding channel of the server heat dissipation device faces the network card, the outlet of the second air guiding channel faces the CPU radiator, and the third air guiding channel communicates with the outside of the server chassis. Fans are provided in the first air guiding channel, the second air guiding channel, and the third air guiding channel. A plurality of baffles are provided at the intersection of the first air guiding channel, the second air guiding channel, and the third air guiding channel, and the baffles are used to control the air flow direction. A first fan and a second fan are respectively provided in the first air guiding channel and the second air guiding channel, and a third fan is provided in the third air guiding channel. The baffles include a first baffle, a second baffle, and a third baffle.

8. The device according to claim 7, characterized in that, The first fan and the second fan are inlet fans, and the third fan is an inlet and outlet fan. The first baffle is provided on the side walls of the first air guiding channel and the third air guiding channel, the second baffle is provided on the side walls of the first air guiding channel and the second air guiding channel, and the third baffle is provided on the side walls of the second air guiding channel and the third air guiding channel.

9. The device according to claim 7, characterized in that, A porous adsorption structure is provided between the first fan of the first air guiding channel and the first baffle and the second baffle, and a humidity sensor is provided at the porous adsorption structure. A temperature sensor is provided at the inlet of the second air guiding channel for detecting the temperature of the heat dissipation air discharged by the CPU radiator.

10. A server heat dissipation system, characterized in that, The server heat dissipation system is used to execute the server heat dissipation method according to any one of claims 1 to 6 above, and includes: A first controller, which is connected to the server heat dissipation device and is used to obtain the heat dissipation temperature of the heat dissipation air. A second controller, which is communicatively connected to the first controller. A server heat dissipation device, which is communicatively connected to the first controller and the second controller respectively.

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