A waste cutting method based on laser cutting machine system

Abstract

The present invention provides a waste cutting method based on a laser cutting machine system, which relates to the technical field of laser cutting and comprises the following steps: S1: setting initialization parameters; S2: initializing part coordinates; S3: obtaining horizontal and vertical cutting line coordinates; S4: generating horizontal and vertical cutting lines; the present invention automatically generates cutting lines, eliminates the need for manual division of cutting lines, improves cutting line efficiency, is simple and convenient to use, and is easy to operate; the obtained cutting lines can pass through the vertices of the parts as much as possible, effectively solving the problem of adhesion between the parts and the waste; the initialization parameters are set according to the actual situation of the plate, avoids over-dense cutting grids, increases cutting time, reduces cutting efficiency, and increases production costs; the internal and external relationships are accurately judged, the cutting lines are correctly cut, misjudgment is avoided, and damage to the cut parts is avoided, thereby ensuring the quality of the parts.

Description

Technical Field

[0001] The present invention relates to the field of laser cutting technology, and in particular to a waste cutting method based on a laser cutting machine system. Background Art

[0002] Laser cutting is a process that uses a high-intensity, focused laser beam as a heat source to melt, vaporize, or burn the material. The molten or burned material is then blown away with an assist gas (such as oxygen, nitrogen, air, or an inert gas), creating a precise, narrow cut in the material. Conventional technology often encounters a problem when removing a workpiece after cutting, whether by robotic or manual means. Because parts typically have closed contours, surrounding scrap material often adheres to the part during grasping due to burrs and other factors. This can cause the scrap material to be dragged along during grasping or prevent the target part from being grasped. Currently, based on experience and the material's specific conditions, manual cutoff lines are added to create a grid-like cutoff line around the target workpiece, dividing the scrap into smaller pieces. This approach aims to reduce the chance of scrap material sticking to the workpiece during grasping. However, this grid-like cutoff line approach is not ideal. This is primarily because small scrap pieces often remain attached to the target part on two or more sides after cutting, thus failing to fundamentally address the sticking problem. In addition, when the grid is set too densely, although it may reduce adhesion to a certain extent, it will significantly increase the processing time of laser cutting, reduce production efficiency, and increase production costs. Summary of the Invention

[0003] The purpose of the present invention is to solve the shortcomings of the prior art and to propose a waste cutting method based on a laser cutting machine system.

[0004] To achieve the above object, the present invention adopts the following technical solutions:

[0005] A waste cutting method based on a laser cutting machine system comprises the following steps:

[0006] S1: Set initialization parameters;

[0007] The user inputs the motherboard parameters, minimum grid line distance and grid density according to the actual board conditions;

[0008] S2: Initialize part coordinates;

[0009] Get the outer contour coordinates of all parts, and arrange the horizontal coordinates and vertical coordinates in order of size to obtain the horizontal coordinate point set and the vertical coordinate point set;

[0010] S3: Obtain the coordinates of the horizontal and vertical cutting lines;

[0011] Obtain a set of horizontal coordinate points, starting from the first horizontal coordinate, discarding horizontal coordinates whose distance is less than the minimum distance of the grid line, and filtering to obtain the first point set; perform secondary processing on the first point set, comparing whether the difference between two adjacent horizontal coordinates exceeds twice the grid density, if so, insert the horizontal coordinate of the grid point at the midpoint of the two adjacent horizontal coordinates, add the midpoint of the two adjacent horizontal coordinates to the first point set, traverse and compare all horizontal coordinates to obtain the second point set, and obtain all the coordinates of the longitudinal cutting line; process the vertical coordinate point set in the same way to obtain all the coordinates of the transverse cutting line;

[0012] S4: Generate horizontal and vertical cutting lines;

[0013] According to the coordinates of the obtained transverse cutting line and the longitudinal cutting line, the motherboard is divided into grids, and the grids falling into the outer contour of the part are cut out to obtain all the cutting lines.

[0014] Furthermore, it also includes:

[0015] S21: Draw part graphics;

[0016] Create a motherboard in the laser cutting system according to the motherboard parameters, draw part graphics on the motherboard, or import pre-completed design drawings into the motherboard;

[0017] S22: Get the outer contour coordinates of all parts;

[0018] Obtain all edges of the part graphics in the motherboard, convert all edges into line segments, obtain the coordinates of the two end points of the line segments, remove the duplicate point coordinates, and obtain the coordinates of the part's outer contour;

[0019] S23: Obtain abscissa point set and ordinate point set;

[0020] Arrange the horizontal coordinates and vertical coordinates of the part's outer contour coordinates in order of size to obtain a horizontal coordinate point set and a vertical coordinate point set.

[0021] Furthermore, step S22 is specifically as follows: obtain all edges of the part graphics, determine the type of edge, if it is a straight line trajectory, directly convert the straight line trajectory into a line segment, and obtain the coordinates of the two endpoints of the line segment; if it is a non-straight line trajectory, discretize and cut it into several line segments, obtain the coordinates of the two endpoints of the line segment, obtain the coordinates of all line segments and compare whether they have the same coordinates. If so, remove the duplicate line segment endpoint coordinates and only retain one endpoint coordinate. After processing is completed, the outer contour coordinates of all parts are obtained.

[0022] Furthermore, step S3 includes:

[0023] S31: Filter the horizontal coordinate point set to obtain the first point set;

[0024] Get the abscissa point set, set the first abscissa as the reference point, check the difference between the next abscissa and the reference point, if the difference is less than the minimum grid line distance, discard the abscissa; if the difference is greater than or equal to the minimum grid line distance, retain the abscissa and update the value of the retained abscissa as the reference point, continue comparing subsequent coordinates, traverse all abscissas in the abscissa point set, and get the first point set;

[0025] S32: reprocess the first point set to obtain a second point set;

[0026] Traverse the first point set and calculate whether the difference between two adjacent horizontal coordinates exceeds twice the grid density. If so, add 1 / 2 of the sum of the two horizontal coordinates to the first point set, traverse and compare all horizontal coordinates to obtain the second point set, and obtain all coordinates of the longitudinal cutting line;

[0027] S33: Process the ordinate point set in the same way to obtain a second ordinate point set;

[0028] A set of vertical coordinate points is obtained, and the same processing logic as in step S31 and step S32 is used to obtain all coordinates of the horizontal cutting line.

[0029] Furthermore, step S4 is specifically as follows:

[0030] S41: Divide the grid on the motherboard;

[0031] Generate multiple straight lines parallel to the y-axis on the motherboard based on the abscissa points in the second point set obtained from the abscissa point set, and generate multiple straight lines parallel to the x-axis on the motherboard based on the ordinate points in the second point set obtained from the ordinate point set;

[0032] S42: Clip the mesh that falls inside the outer contour of the part;

[0033] Obtain the intersection of the straight line and the part graphic, connect the adjacent intersection points into a line segment, use the ray method to determine whether the point of the line segment is inside the part graphic, determine the positional relationship between the line segment and the part graphic, and cut the line segment inside the part graphic.

[0034] Furthermore, step S42 includes: selecting a straight line as the target straight line, obtaining the intersection of the target straight line and the part graphic in the motherboard, connecting adjacent intersections into a line segment, obtaining the coordinates of the starting point and the ending point of the line segment as the test point, first taking the starting point as the test point, selecting a ray in the positive direction of the X-axis to emit, and obtaining the number of intersections between the ray and the part graphic, if the number of intersections is odd, the test point is inside the part graphic, and if the number of intersections is even, the test point is outside the part graphic, using the same method as the ending point as the test point, obtaining the number of intersections between the ending point and the emitted ray and the part graphic, if the starting point is outside the part graphic and the ending point is inside the part graphic, then it is determined that the line segment is inside the part graphic, and the line segment where the test point is located is deleted, otherwise, the line segment where the test point is located is retained, and all line segments are traversed to obtain the cut-off line after cropping; traversing all straight lines, deleting the line segments within the outline of the part graphic, and obtaining the final cut-off line.

[0035] Furthermore, it also includes:

[0036] S421: retain or remove overlapping line segments of the part graphic boundary according to the processing method of the cut-off line of the custom part graphic boundary;

[0037] When setting initialization parameters, you can also customize the processing method of the cut-off line of the part graphics boundary, which includes retaining or removing.

[0038] Obtain all edges of the part graphics in the motherboard, convert all edges into line segments, set the line segment where the test point is located as the target line segment, and compare whether the target line segment and the line segments converted from all edges overlap. If they overlap, obtain a customized processing method to retain or remove the target line segment that overlaps with the part graphics boundary;

[0039] S422: Identify that the ray emitted by the point to be measured passes through the vertex of the part graphic, adjust the ray angle, and determine whether the point to be measured is inside or outside the part graphic;

[0040] Obtain the coordinates of the intersection of the ray of the test point and the part figure and the coordinates of the vertex of the part figure, and compare whether they have the same coordinates. If so, the ray emitted by the test point passes through the vertex of the part figure. The initial ray direction is along the positive direction of the X-axis. When it is recognized that it passes through the polygon vertex, adjust the ray direction, offset the disturbance angle to emit the ray, obtain the intersection coordinates again, and identify whether it passes through the vertex. If it still passes through the vertex, repeat this process until it does not pass through the vertex of the part figure. Then, through the ray method, according to the number of intersections between the ray and the part figure, obtain the internal and external relationship between the test point and the part figure, and crop or retain the line segment where the test point is located;

[0041] S423: Identify whether the ray emitted from the point to be measured coincides with the edge of the part graphic, adjust the ray angle, and determine whether the point to be measured is inside or outside the part graphic;

[0042] Convert all edges of the part graphic into line segments, and compare whether the converted line segments coincide with the rays. If so, it is recognized that the ray emitted by the test point coincides with the edge of the part graphic. Adjust the direction of the ray, offset the disturbance angle to emit the ray, and compare again whether the converted line segments coincide with the ray. If there is still overlap, repeat this process until the ray does not coincide with the edge of the part graphic. Then, through the ray method, according to the number of intersections between the ray and the part graphic, obtain the internal and external relationship between the test point and the part graphic, and crop or retain the line segment where the test point is located.

[0043] Furthermore, the motherboard parameters include position and size.

[0044] Compared with the prior art, the present invention has the following beneficial effects: (1) The present invention automatically generates a cutting line, eliminating the need for manual division of the cutting line, thereby improving the efficiency of the cutting line and being simple, convenient, and easy to operate; the obtained cutting line can pass through the vertex of the part as much as possible, and the vertex is more likely to be hung with material, and after cutting it, the problem of adhesion between the part and the waste material is effectively solved.

[0045] (2) The present invention sets initialization parameters according to the actual situation of the plate to ensure the density of the cutting line, avoid cutting the grid too densely, increase the cutting time, reduce the cutting efficiency, and increase the production cost. The waste cutting line of the present invention matches the outline of the part graphic, ensuring that the waste block is completely separated from the part, solving the problem of waste adhesion caused by traditional grid cutting, and avoiding the problem of traditional manual division of grid lines to divide the waste into small pieces, resulting in the small pieces still adhering to the parts.

[0046] (3) The present invention optimizes the ray method. After optimization, the ray method can correctly judge the positional relationship between a point and a figure, and thus the positional relationship between a line segment and a figure can also be correctly judged. This solves the following special cases: 1. The point is on the polygon boundary; 2. The ray emitted from the point passes through the polygon vertex; 3. The ray emitted from the point coincides with a certain edge of the polygon, and in corresponding composite cases, the ray method cannot accurately judge the relationship between the point and the polygon, or may misjudge. This ensures that the internal and external relationships are accurately judged, the cutting line is correctly cut, misjudgment is avoided, and damage to the cut parts is damaged, thus ensuring the quality of the parts. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 This is a flowchart of the steps of a waste cutting method based on a laser cutting machine system of the present invention. DETAILED DESCRIPTION

[0048] In order to provide a further understanding of the purpose, structure, features, and functions of the present invention, the present invention is described in detail below with reference to the embodiments.

[0049] like Figure 1As shown, a waste cutting method based on a laser cutting machine system includes the following steps:

[0050] S1: Set initialization parameters;

[0051] The user inputs the motherboard parameters, minimum grid line distance, grid density, etc. according to the actual board conditions.

[0052] The motherboard parameters include position and size.

[0053] You can also customize how to handle the cut-off lines of part graphics boundaries, including retaining or removing them.

[0054] S2: Initialize part coordinates;

[0055] Get the outer contour coordinates of all parts, and arrange the horizontal coordinates and vertical coordinates in order of size to obtain the horizontal coordinate point set and the vertical coordinate point set respectively.

[0056] S21: Draw part graphics;

[0057] Create a motherboard in the laser cutting system according to the motherboard parameters, draw part graphics on the motherboard, or import pre-completed CAD design drawings into the drawing motherboard;

[0058] S22: Get the outer contour coordinates of all parts;

[0059] The outer contour refers to the part boundary trajectory. All edges of the part graphics in the motherboard are obtained, all edges are converted into line segments, the coordinates of the two endpoints of the line segments are obtained, and the coordinates of the duplicate points are removed to obtain the coordinates of the part outer contour.

[0060] Specifically, the method includes: obtaining all edges of the part graphics, determining the type of edge, and if it is a straight line trajectory, directly converting the straight line trajectory into a line segment and obtaining the coordinates of the two endpoints of the line segment; if it is a non-straight line trajectory, discretizing and cutting it into several line segments, obtaining the coordinates of the two endpoints of the line segment, obtaining the coordinates of all line segments and comparing whether they have the same coordinates. If so, removing the duplicate line segment endpoint coordinates and retaining only one endpoint coordinate. After the processing is completed, the coordinates of the outer contour of all parts are obtained. The present invention converts the edges of the part into line segments to obtain contour points, ensuring that the number of contour point coordinates obtained is controllable and the processing speed is guaranteed.

[0061] S23: Obtain abscissa point set and ordinate point set;

[0062] Arrange the horizontal coordinates and vertical coordinates of the part's outer contour coordinates in order of size to obtain a horizontal coordinate point set and a vertical coordinate point set.

[0063] S3: Obtain the coordinates of the horizontal and vertical cutting lines;

[0064] Obtain a set of horizontal coordinate points, starting with the first horizontal coordinate. Horizontal coordinates that are too close, i.e., smaller than the minimum distance between grid lines, are discarded. The filtered horizontal coordinate point set yields the first point set. The first point set is processed again, comparing whether the difference between two adjacent horizontal coordinates exceeds twice the grid density. If so, interpolate the horizontal coordinates of the grid points at the midpoints of the two adjacent horizontal coordinates. These midpoints are added to the first point set. All horizontal coordinates are compared to obtain the second point set, obtaining all the coordinates of the longitudinal cutting line. Similarly, all the coordinates of the transverse cutting line are obtained.

[0065] S31: Filter the horizontal coordinate point set to obtain the first point set;

[0066] Get the abscissa point set, set the first abscissa as the reference point, check the difference between the next abscissa and the reference point, if the difference is less than the minimum grid line distance, discard the abscissa; if the difference is greater than or equal to the minimum grid line distance, retain the abscissa, update the value of the retained abscissa to the reference point, continue to compare subsequent coordinates, traverse all abscissas in the abscissa point set, and get the first point set.

[0067] S32: Process the first point set a second time to obtain a second point set.

[0068] Traverse the first point set and calculate whether the difference between two adjacent horizontal coordinates exceeds twice the grid density. If so, add 1 / 2 of the sum of the two horizontal coordinates to the first point set, traverse and compare all horizontal coordinates to obtain the second point set, and obtain all coordinates of the longitudinal cutting line;

[0069] S33: Process the ordinate point set in the same way to obtain a second ordinate point set.

[0070] Obtain a set of ordinate points, and use the same processing logic as step S31 and step S32 to obtain a second set of ordinate points, thereby obtaining all coordinates of the horizontal cutting line.

[0071] S4: Generate horizontal and vertical cutting lines;

[0072] According to the coordinates of the obtained transverse cutting line and the longitudinal cutting line, the motherboard is divided into grids, and the grids falling into the outer contour of the part are cut out to obtain all the cutting lines.

[0073] The cutting line obtained by this method can pass through the vertex of the part as much as possible, and the vertex is more prone to material hanging. Cutting it off here is more helpful in solving the problem of surrounding waste and parts usually sticking together due to burrs and other reasons.

[0074] S41: Divide the grid on the motherboard;

[0075] Based on the abscissa points in the second point set obtained from the abscissa point set, multiple straight lines parallel to the y-axis are generated on the motherboard; based on the ordinate points in the second point set obtained from the ordinate point set, multiple straight lines parallel to the x-axis are generated on the motherboard.

[0076] S42: Clip the mesh that falls inside the outer contour of the part;

[0077] The judgment method is based on an optimization of the traditional ray method. The intersection points of a line and all shapes within the plate are found. Adjacent intersection points are connected to form a line segment. The optimized ray method is used to determine whether the points of the line segment are inside the closed shape to determine the positional relationship between the line segment and the shape.

[0078] The ray method starts from the point to be measured, emits a "ray" in any direction, obtains the number of intersections between this ray and the polygon boundary, and determines the positional relationship of the point. The direction is usually selected as the positive direction of the X-axis.

[0079] Select a straight line as the target line, obtain the intersection points between the target line and the part graphics on the motherboard, connect adjacent intersection points into a line segment, and obtain the coordinates of the starting and ending points of the line segment as the test point. First, use the starting point as the test point and select a ray in the positive direction of the X-axis to obtain the number of intersections between the ray and the part graphics. If the number of intersections is odd, the test point is inside the part graphics. If the number of intersections is even, the test point is outside the part graphics. The same method is used to use the end point as the test point, and obtain the number of intersections between the end point and the emitted ray and the part graphics. If the starting point is outside the part graphics and the end point is inside the part graphics, the line segment is judged to be inside the part graphics and the line segment where the test point is located is deleted. Otherwise, the line segment where the test point is located is retained. Traverse all line segments to obtain the cut-off line after cropping. Traverse all lines, delete the line segments within the part graphics outline, and obtain the final cut-off line.

[0080] Furthermore, it also includes special case handling:

[0081] S421: retain or remove overlapping line segments of the part graphic boundary according to the processing method of the cut-off line of the custom part graphic boundary;

[0082] All edges of the part graphics on the motherboard are obtained and converted into line segments. The line segment containing the point to be tested is set as the target line segment. The target line segment is compared with the converted line segments to see if they overlap. If so, a customized processing method is obtained to retain or remove the target line segment that overlaps with the part graphics boundary. The processing method for points on the boundary will vary in different scenarios and can be adjusted according to different scenario requirements, ensuring high flexibility and wide adaptability to meet market needs.

[0083] The method of converting all edges into line segments is the same as step S22, that is, the straight line trajectory is directly converted into line segments, and the non-straight line trajectory is discretized and cut into several line segments.

[0084] S422: Identify that the ray emitted by the point to be measured passes through the vertex of the part graphic, adjust the ray angle, and determine whether the point to be measured is inside or outside the part graphic;

[0085] Obtain the coordinates of the intersection of the ray of the test point and the part graphic, as well as the coordinates of the vertex of the part graphic, and compare whether they have the same coordinates. If so, the ray emitted by the test point passes through the vertex of the part graphic. The initial ray direction is along the positive direction of the X-axis. When it is recognized that it passes through the polygon vertex, adjust the ray direction, offset the disturbance angle to emit the ray (a very small disturbance is a very small angle), obtain the intersection coordinates again, and identify whether it passes through the vertex. If it still passes through the vertex, repeat this process until it does not pass through the vertex of the part graphic. At this time, the correct internal and external relationship judgment can be obtained. According to the internal and external relationship between the starting point and the end point of the line segment, the line segment where the test point is located can be cropped or retained.

[0086] S423: Identify whether the ray emitted from the point to be measured coincides with the edge of the part graphic, adjust the ray angle, and determine whether the point to be measured is inside or outside the part graphic.

[0087] Convert all edges of the part graphic into line segments, and compare whether the converted line segments coincide with the rays. If so, it is recognized that the ray emitted by the test point coincides with the edge of the part graphic. The same processing method as S422 is used to adjust the ray direction and emit the ray at an offset disturbance angle (a small disturbance is a very small angle). Compare again whether the converted line segments of all edges coincide with the ray. If there is still overlap, repeat this process until the ray does not coincide with the edge of the part graphic. According to the number of intersections between the ray and the part graphic, the correct internal and external relationship between the test point and the part graphic is obtained, and the line segment where the test point is located is cropped or retained.

[0088] The optimized ray method can correctly determine the positional relationship between points and shapes, and thus the positional relationship between line segments and shapes. This solves the following special cases: 1. The point is on the polygon boundary; 2. The ray emitted from the point passes through the polygon vertex; 3. The ray emitted from the point coincides with a polygon edge, and in other cases, the ray method cannot accurately determine the relationship between the point and the polygon, or may misjudge. This ensures accurate judgment of the internal and external relationships, correctly cuts the cutting line, avoids misjudgment, damages the cut parts, and ensures the quality of the parts.

[0089] The present invention has been described with reference to the above embodiments. However, the above embodiments are merely exemplary embodiments of the present invention. It should be noted that the disclosed embodiments do not limit the scope of the present invention. On the contrary, modifications and improvements that do not depart from the spirit and scope of the present invention are intended to be protected by the present invention.

Claims

1. A waste cutting method based on a laser cutting machine system, characterized in that: The following steps are involved: S1: Set initialization parameters; The user inputs the motherboard parameters, minimum grid line distance and grid density according to the actual board conditions; S2: Initialize part coordinates; Get the coordinates of all part outer contours, and arrange the horizontal and vertical coordinates in order of size to obtain the horizontal coordinate point set and the vertical coordinate point set; the part outer contour refers to the part boundary trajectory; Also includes: S21: Draw part graphics; Create a motherboard in the laser cutting system according to the motherboard parameters, draw part graphics on the motherboard, or import pre-completed design drawings into the motherboard; S22: Get the outer contour coordinates of all parts; Obtain all edges of the part graphics in the motherboard, convert all edges into line segments, obtain the coordinates of the two end points of the line segments, remove the duplicate point coordinates, and obtain the coordinates of the part's outer contour; S23: Obtain abscissa point set and ordinate point set; Arrange the horizontal coordinates and vertical coordinates of the part's outer contour coordinates in order of size to obtain a horizontal coordinate point set and a vertical coordinate point set; S3: Obtain the coordinates of the horizontal and vertical cutting lines; Obtain a set of horizontal coordinate points, starting from the first horizontal coordinate, discarding horizontal coordinates whose distance is less than the minimum distance of the grid line, and filtering to obtain the first point set; perform secondary processing on the first point set, comparing whether the difference between two adjacent horizontal coordinates exceeds twice the grid density, if so, insert the horizontal coordinate of the grid point at the midpoint of the two adjacent horizontal coordinates, add the midpoint of the two adjacent horizontal coordinates to the first point set, traverse and compare all horizontal coordinates to obtain the second point set, and obtain all the coordinates of the longitudinal cutting line; process the vertical coordinate point set in the same way to obtain all the coordinates of the transverse cutting line; S4: Generate horizontal and vertical cutting lines; According to the coordinates of the obtained transverse cutting line and the longitudinal cutting line, the motherboard is divided into grids, and the grids falling into the outer contour of the part are cut out to obtain all the cutting lines.

2. The waste cutting method based on the laser cutting machine system according to claim 1, characterized in that: Step S22 specifically includes: obtaining all edges of the part graphic, determining the type of the edge, and if it is a straight line trajectory, directly converting the straight line trajectory into a line segment, and obtaining the coordinates of the two endpoints of the line segment; If it is a non-straight line trajectory, it is discretized and cut into several line segments, and the coordinates of the two endpoints of the line segment are obtained. The coordinates of all line segments are obtained and compared to see if there are the same coordinates. If so, the duplicate line segment endpoint coordinates are removed and only one endpoint coordinate is retained. After the processing is completed, the outer contour coordinates of all parts are obtained.

3. The waste cutting method based on the laser cutting machine system according to claim 1, characterized in that: Step S3 includes: S31: Filter the horizontal coordinate point set to obtain the first point set; Get the abscissa point set, set the first abscissa as the reference point, check the difference between the next abscissa and the reference point, if the difference is less than the minimum grid line distance, discard the abscissa; if the difference is greater than or equal to the minimum grid line distance, retain the abscissa and update the value of the retained abscissa as the reference point, continue comparing subsequent coordinates, traverse all abscissas in the abscissa point set, and get the first point set; S32: reprocess the first point set to obtain a second point set; Traverse the first point set and calculate whether the difference between two adjacent horizontal coordinates exceeds twice the grid density. If so, add 1 / 2 of the sum of the two horizontal coordinates to the first point set, traverse and compare all horizontal coordinates to obtain the second point set, and obtain all coordinates of the longitudinal cutting line; S33: Process the ordinate point set in the same way to obtain a second ordinate point set; A set of vertical coordinate points is obtained, and the same processing logic as in step S31 and step S32 is used to obtain all coordinates of the horizontal cutting line.

4. The waste cutting method based on the laser cutting machine system according to claim 1, characterized in that: Step S4 is specifically as follows: S41: Divide the grid on the motherboard; Generate multiple straight lines parallel to the y-axis on the motherboard based on the abscissa points in the second point set obtained from the abscissa point set, and generate multiple straight lines parallel to the x-axis on the motherboard based on the ordinate points in the second point set obtained from the ordinate point set; S42: Clip the mesh that falls inside the outer contour of the part; Obtain the intersection of the straight line and the part graphic, connect the adjacent intersection points into a line segment, use the ray method to determine whether the point of the line segment is inside the part graphic, determine the positional relationship between the line segment and the part graphic, and cut the line segment inside the part graphic.

5. The waste cutting method based on the laser cutting machine system according to claim 4, characterized in that: Step S42 includes: selecting a straight line as the target straight line, obtaining the intersection points of the target straight line and the part graphic in the motherboard, connecting adjacent intersection points into a line segment, obtaining the coordinates of the starting point and the ending point of the line segment as the test point, first taking the starting point as the test point, selecting a ray in the positive direction of the X-axis to emit, and obtaining the number of intersection points of the ray and the part graphic, if the number of intersection points is odd, the test point is inside the part graphic, and if the number of intersection points is even, the test point is outside the part graphic, using the same method as the ending point as the test point, obtaining the number of intersection points of the ending point and the emitted ray with the part graphic, if the starting point is outside the part graphic and the ending point is inside the part graphic, it is determined that the line segment is inside the part graphic, and the line segment where the test point is located is deleted, otherwise, the line segment where the test point is located is retained, and all line segments are traversed to obtain the cut-off line after clipping; traversing all straight lines, deleting the line segments within the outline of the part graphic, and obtaining the final cut-off line.

6. The waste cutting method based on the laser cutting machine system according to claim 5, characterized in that: Also includes: S421: retain or remove overlapping line segments of the part graphic boundary according to the processing method of the cut-off line of the custom part graphic boundary; When setting initialization parameters, you can also customize the processing method of the cut-off line of the part graphics boundary, which includes retaining or removing. Obtain all edges of the part graphics in the motherboard, convert all edges into line segments, set the line segment where the test point is located as the target line segment, and compare whether the target line segment and the line segments converted from all edges overlap. If they overlap, obtain a customized processing method to retain or remove the target line segment that overlaps with the part graphics boundary; S422: Identify that the ray emitted by the point to be measured passes through the vertex of the part graphic, adjust the ray angle, and determine whether the point to be measured is inside or outside the part graphic; Obtain the coordinates of the intersection of the ray of the test point and the part figure and the coordinates of the vertex of the part figure, and compare whether they have the same coordinates. If so, the ray emitted by the test point passes through the vertex of the part figure. The initial ray direction is along the positive direction of the X-axis. When it is recognized that it passes through the polygon vertex, adjust the ray direction, offset the disturbance angle to emit the ray, obtain the intersection coordinates again, and identify whether it passes through the vertex. If it still passes through the vertex, repeat this process until it does not pass through the vertex of the part figure. Then, through the ray method, according to the number of intersections between the ray and the part figure, obtain the internal and external relationship between the test point and the part figure, and crop or retain the line segment where the test point is located; S423: Identify whether the ray emitted from the point to be measured coincides with the edge of the part graphic, adjust the ray angle, and determine whether the point to be measured is inside or outside the part graphic; Convert all edges of the part graphic into line segments, and compare whether the converted line segments coincide with the rays. If so, it is recognized that the ray emitted by the test point coincides with the edge of the part graphic. Adjust the direction of the ray, offset the disturbance angle to emit the ray, and compare again whether the converted line segments coincide with the ray. If there is still overlap, repeat this process until the ray does not coincide with the edge of the part graphic. Then, through the ray method, according to the number of intersections between the ray and the part graphic, obtain the internal and external relationship between the test point and the part graphic, and crop or retain the line segment where the test point is located.

7. The waste cutting method based on a laser cutting machine system according to claim 1, characterized in that: The motherboard parameters include position and size.

Images