A high-precision high-density line impedance signal processing board pressing device

By introducing an impact component to vibrate and detach the adhesive in the pressing device and a combination of rubber plate and scraper for cleaning, the problems of poor material feeding and conveyor belt wear and contamination of high-density line impedance signal processing boards are solved, achieving a highly efficient and stable production process.

CN120417236BActive Publication Date: 2026-06-26江苏金一辰电子科技有限公司
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Patent Information

Application Number
CN202510496835.9
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-04-21
Publication Date
2026-06-26
Estimated Expiration
2045-04-21

AI Technical Summary

Technical Problem

In existing technologies, high-precision, high-density line impedance signal processing boards are prone to sticking after lamination, leading to poor material feeding or jamming, which affects production continuity, and the conveyor belt is easily worn and contaminated.

Method used

An impact component was designed to vibrate and detach the circuit board during the pressing process. A combination of rubber plate and scraper was set up to clean the conveyor belt. The flexibility of the rubber plate and the cleaning function of the scraper were used to avoid adhesion and accumulation of impurities.

Benefits of technology

It effectively solves the problems of poor circuit board feeding or jamming, extends the service life of the conveyor belt, keeps the conveyor belt clean and stable, and improves production efficiency and continuity.

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Abstract

The application relates to the technical field of signal processing plate production, and particularly discloses a high-precision high-density circuit impedance signal processing plate pressing device, the side surface of a main body is fixedly connected with a feeding component, the side, away from the feeding component, of the main body is fixedly connected with a discharging component, and the top of the feeding component and the discharging component is fixedly connected with clamping components. The high-precision high-density circuit impedance signal processing plate pressing device is provided with a striking assembly, in the pressing process, the circuit board may be slightly adhered at the inner cavity of the placing seat, the adhesion can be effectively broken through striking vibration, the circuit board can be smoothly separated from the inner cavity of the placing seat, the discharging efficiency is improved, and the problem of poor discharging or material jamming caused by adhesion is avoided; if the circuit board is jammed in the placing seat due to adhesion in production, manual intervention is needed, and the continuity of production is reduced, and the vibration design can effectively avoid such a situation.
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