Baking oven for multilayer circuit board

Abstract

The invention discloses a baking oven for a multilayer circuit board, which comprises an oven body, and is characterized in that the interior of the oven body is divided into baking compartments which are spaced up and down through a supporting plate; the supporting plate is arranged in a hollowed-out mode, guide columns are vertically arranged on the supporting plate, the guide columns are sleeved with a pressing plate, and the number of the guide columns is larger than two. A hot air channel and a flow guide plate are arranged in each baking compartment, and the flow guide plates incline towards the surface of the supporting plate. According to the baking oven for the multilayer circuit board, the baking compartments are separated by arranging the multiple supporting plates, each baking compartment is internally provided with the hot air channel and the flow guide plate, deformation of the circuit board is avoided through the pressing plate, and the baking quality is guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of printed circuit board production, and particularly to an oven for multi-layer printed circuit boards. Background Art

[0002] During processes such as lamination, curing, and surface treatment of multi-layer printed circuit boards, high-temperature baking is required (usually at a temperature of 120 - 250 °C).

[0003] The interior of a traditional oven is hollow. When baking printed circuit boards, only a separately made baking rack can be used. However, the separately made baking rack itself will impede the air flow inside the oven, affecting the baking quality. Currently, there is a lack of an oven dedicated to multi-layer printed circuit boards. Summary of the Invention

[0004] To solve the deficiencies in the prior art, the present invention provides an oven for multi-layer printed circuit boards. The oven for multi-layer printed circuit boards separates baking compartments by arranging a plurality of support plates. Each baking compartment is provided with a hot air channel and a deflector plate, and a pressing plate is used to prevent the printed circuit board from deforming, ensuring the baking quality.

[0005] To achieve the above object, the present invention adopts the following technical solutions:

[0006] The present invention provides an oven for multi-layer printed circuit boards, including a box body. The interior of the box body is separated into upper and lower spaced baking compartments by support plates;

[0007] The support plates are provided with hollow-outs, guide posts are vertically arranged on the support plates, and pressing plates are sleeved on the guide posts. The number of the guide posts is more than 2;

[0008] Each baking compartment is provided with a hot air channel and a deflector plate, and the deflector plates are all inclined towards the surface of the support plate.

[0009] Before use, insert the multi-layer printed circuit boards between the pressing plates and the support plates in each baking compartment, release the pressing plates so that the pressing plates press the printed circuit boards on the support plates, thus completing the fixation of the printed circuit boards. After all the multi-layer printed circuit boards are placed, close the box door, start baking. The hot air flows out from the hot air channels in each baking compartment and blows towards the support plate along the deflector plates, baking the multi-layer printed circuit boards on the support plates. The independently designed hot air channels ensure uniform heating of each multi-layer printed circuit board and guarantee the baking quality of each multi-layer printed circuit board.

[0010] The oven for multi-layer printed circuit boards of the present invention separates baking compartments by arranging a plurality of support plates. Each baking compartment is provided with a hot air channel and a deflector plate, and a pressing plate is used to prevent the printed circuit board from deforming, ensuring the baking quality.

[0011] In a further technical solution, the pressing plate is of a hollow-out structure.

[0012] The hollowing of the pressing plate further facilitates the air flow and further ensures the temperature balance inside the box.

[0013] In a further technical solution, a compression spring is arranged between the pressing plate and the previous support plate.

[0014] The arrangement of the compression spring makes the pressure of the pressing plate on the circuit board more precise, which is beneficial to improving the protection effect on the circuit board.

[0015] In a further technical solution, the compression spring is sleeved on the guide post.

[0016] The compression spring arranged on the guide post ensures the effectiveness of the compression spring itself and helps to improve the service life of the compression spring.

[0017] The beneficial effects are as follows:

[0018] 1. The baking oven for multi-layer circuit boards of the present invention separates the baking compartments by arranging a plurality of support plates. Each baking compartment is provided with a hot air channel and a deflector, and the pressing plate is used to prevent the circuit board from deforming, ensuring the baking quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic structural diagram of the baking oven for multi-layer circuit boards according to an embodiment of the present invention.

[0020] 10. Box body; 20. Support plate; 30. Guide post; 40. Pressing plate. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0021] The present invention will be further described below with reference to the accompanying drawings:

[0022] Embodiment:

[0023] A baking oven for multi-layer circuit boards, as Figure 1 shown, includes a box body 10. The interior of the box body 10 is separated into upper and lower spaced baking compartments by support plates 20;

[0024] The support plates 20 are hollowly arranged. Guide posts 30 are vertically arranged on the support plates 20. A pressing plate 40 is sleeved on the guide posts 30, and the number of the guide posts 30 is more than 2;

[0025] Each baking compartment is provided with a hot air channel and a deflector, and the deflectors are all inclined towards the surface of the support plate 20.

[0026] Before use, insert the multilayer circuit board between the pressing plate 40 and the supporting plate 20 in each baking compartment, release the pressing plate 40 so that the pressing plate 40 presses the circuit board against the supporting plate 20, thus completing the fixation of the circuit board. After all the multilayer circuit boards are placed, close the box door and start baking. The hot air flows out from the hot air channels in each baking compartment and blows towards the supporting plate 20 along the guide plate, baking the multilayer circuit boards on the supporting plate 20. The independently designed hot air channels ensure uniform heating of each multilayer circuit board and guarantee the baking quality of each multilayer circuit board.

[0027] The baking oven for multilayer circuit boards of the present invention separates baking compartments by arranging a plurality of supporting plates 20. Each baking compartment is provided with a hot air channel and a guide plate, and the pressing plate 40 is used to prevent the circuit board from deforming, ensuring the baking quality.

[0028] In another embodiment, the pressing plate 40 is of a hollow structure.

[0029] The hollow of the pressing plate 40 further facilitates the flow of air and further ensures the temperature balance in the box body 10.

[0030] In another embodiment, a compression spring is arranged between the pressing plate 40 and the previous supporting plate 20.

[0031] The arrangement of the compression spring makes the pressure of the pressing plate 40 on the circuit board more precise, which is beneficial to improving the protection effect on the circuit board.

[0032] In another embodiment, the compression spring is sleeved on the guide post 30.

[0033] The compression spring is arranged on the guide post 30 to ensure the effectiveness of the compression spring itself and helps to extend the service life of the compression spring.

[0034] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed.

Claims

1. An oven for a multi-layer circuit board, characterized in that, It includes a box body, and the interior of the box body is separated into upper and lower spaced baking compartments by a support plate; The support plate is provided with hollowed-out portions, vertical guide posts are arranged on the support plate, a pressing plate is sleeved on the guide posts, and the number of the guide posts is more than 2; A hot air channel and a flow guide plate are arranged in each baking compartment, and the flow guide plates are all inclined towards the surface of the support plate.

2. The baking oven for the multi-layer circuit board according to claim 1, characterized in that, The pressing plate is of a hollowed-out structure.

3. The baking oven for the multi-layer circuit board according to claim 1, characterized in that, A compression spring is arranged between the pressing plate and the previous support plate.

4. The baking oven for a multi-layer circuit board according to claim 3, wherein, The compression spring is sleeved on the guide post.

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