Heat dissipation device and electronic equipment

Abstract

The invention discloses a heat dissipation device and electronic equipment, and relates to the technical field of heat dissipation of the electronic equipment, the heat dissipation device comprises a first heat dissipation module, a second heat dissipation module and a heat conduction piece, a part of heat generated on an electronic element is transferred to the first heat dissipation module on the electronic element in a heat transfer mode, and the heat conduction piece is arranged on the first heat dissipation module. One part of heat is transferred to the first heat dissipation module through the heat conduction piece, conventional heat dissipation is carried out in a mode that the first heat dissipation module exchanges heat with flowing air, the other part of heat is transferred to the second heat dissipation module through the heat conduction piece, conventional heat dissipation is carried out through the second heat dissipation module and the flowing air, namely, the second heat dissipation module can cooperatively carry out heat dissipation and cooling on the electronic element, and the heat dissipation efficiency is improved; the plug-in can serve as a supporting and fixing structure of the second heat dissipation module, an idle slot in the electronic equipment can be utilized, an installation structure does not need to be additionally arranged on a machine body of the electronic equipment, space can be fully utilized, and complex installation and fixing operation is not needed.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation of electronic devices, and particularly to a heat dissipation device and an electronic device. Background Art

[0002] In the current digital age, electronic devices have become an indispensable part of our daily lives. Among these devices, various electronic components play important roles. To meet different needs of users, current electronic devices can select different configurations. Multiple slots are provided on the electronic device, and functional chips can be selectively inserted into the slots. In the idle slots, plugins that do not have any functions are inserted. Most of the plugins are plastic parts, which can prevent the idle slots from collecting dust.

[0003] With continuous big data operations, the power consumption of the electronic components themselves is not low, and the operating temperature is high. To ensure the stable operation of the electronic device, heat dissipation of the electronic components is required. However, the installation and addition of heat dissipation devices inside the body are limited by the actual space inside the chassis, and it is difficult to meet greater heat dissipation requirements. In high-load operating scenarios, the electronic components are prone to overheating, resulting in problems such as device performance degradation and data loss. Summary of the Invention

[0004] The present application provides a heat dissipation device and an electronic device to at least solve the problem of expanding the heat dissipation capacity without changing the structure of the electronic device body itself in related technologies.

[0005] The present application provides a heat dissipation device for dissipating heat from electronic components of an electronic device. The electronic device is provided with slots, and the electronic components and the plugins of the electronic device are respectively inserted into one of the slots. The heat dissipation device includes: A first heat dissipation module, which is fitted and installed on the side wall of the electronic component for heat transfer with the electronic component; A second heat dissipation module, which is fitted and installed on the side wall of the plugin; At least one heat conducting member, which is arranged at intervals between the electronic component and the plugin, and one end of the heat conducting member is fitted and installed on at least one of the first heat dissipation module and the electronic component for heat transfer with at least one of the first heat dissipation module and the electronic component, and the other end of the heat conducting member is fitted and installed on the second heat dissipation module for heat transfer with the second heat dissipation module. The present application further provides an electronic device, including an electronic component, a plugin, and the heat dissipation device as described in any one of the above. The electronic device is provided with slots, and the electronic component and the plugin are respectively inserted into one of the slots. The first heat dissipation module of the heat dissipation device is fitted and installed on the side wall of the electronic component, and the second heat dissipation module of the heat dissipation device is fitted and installed on the side wall of the plugin.

[0006] Through the present application, when the electronic device is running, a large amount of heat is generated by the electronic components. Part of the heat is transferred to the first heat dissipation module on the electronic components through heat conduction, and then the heat is dissipated conventionally through the heat exchange between the first heat dissipation module and the flowing air. That is, the first heat dissipation module can directly dissipate heat and cool down the electronic components. Another part of the heat is transferred to the second heat dissipation module through the heat conducting member, and then the heat is dissipated conventionally through the heat exchange between the second heat dissipation module and the flowing air. That is, the second heat dissipation module can cooperate to dissipate heat and cool down the electronic components, improving the heat dissipation efficiency. The plug can be used as a support and fixing structure for the second heat dissipation module, which can utilize the idle slots on the electronic device without adding additional installation structures to the body of the electronic device. It can make full use of the space and does not require complex installation and fixing operations, effectively reducing the temperature of the electronic components, extending the service life, and ensuring the stable operation of the electronic device. Description of the Drawings

[0007] In order to more clearly illustrate the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0008] Figure 1 One of the schematic diagrams of the air-cooled heat dissipation structure for the memory module in the prior art; Figure 2 Another schematic diagram of the air-cooled heat dissipation structure for the memory module in the prior art; Figure 3 Schematic diagram of the liquid-cooled heat dissipation structure for the memory module in the prior art; Figure 4 Schematic diagram of a heat dissipation device provided by an embodiment of the present application; Figure 5 Schematic diagram of a heat dissipation device provided by another embodiment of the present application.

[0009] Among them, the above-mentioned drawings include the following reference numerals: 01, additional heat sink; 02, additional heat fins; 03, liquid-cooled heat dissipation module; 10, electronic component; 20, plug; 30, first heat dissipation module; 31, first heat sink; 32, first elastic clip; 40, second heat dissipation module; 41, second heat sink; 42, second elastic clip; 50, heat conducting member; 51, first heat conducting section; 52, second heat conducting section; 53, third heat conducting section. Detailed implementation manners

[0010] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0011] It should be noted that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application. The terms "installation", "connection" and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two elements. The terms "parallel", "perpendicular" and "equal" include the described situations and situations similar to the described situations, and the range of the similar situations is within the acceptable deviation range, where the acceptable deviation range is determined by those of ordinary skill in the art considering the measurement being discussed and the errors related to the measurement of a specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallel and approximate parallel, where the acceptable deviation range of approximate parallel can be, for example, within 5° deviation; "perpendicular" includes absolute perpendicular and approximate perpendicular, where the acceptable deviation range of approximate perpendicular can also be, for example, within 5° deviation. "Equal" includes absolute equality and approximate equality, where the acceptable deviation range of approximate equality can be, for example, that the difference between the two equal ones is less than or equal to 5% of any one of them. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0012] In the current digital age, electronic devices have become an indispensable part of our daily lives. Among these devices, various electronic components play important roles. To meet the different needs of users, current electronic devices can select different configurations. Multiple slots are provided on the electronic device, and functional chips can be selectively inserted into the slots, while plugs that do not have any functions are inserted into the idle slots. Most of the plugs are plastic parts, which can prevent the idle slots from collecting dust.

[0013] Take the memory stick as an example, refer to Figure 1 and Figure 2 As shown, many existing memory sticks are typically equipped with an additional heat sink 01, commonly called a heat sink. This additional heat sink is typically made of aluminum alloy and can lower the operating temperature of the memory stick through heat conduction, improving the reliability of memory operation and effectively reducing the temperature rise during operation. Furthermore, the heat dissipation effect can be enhanced by increasing the heat sink's surface area and utilizing air convection to enhance heat exchange. Typically, additional protrusions or additional cooling fins 02 can be customized on the additional heat sink 01. Relevant tests have shown that the maximum measured temperature of the memory stick heat sink was 63.5 degrees Celsius, but with fan assistance, the temperature can be reduced to 42.8 degrees Celsius.

[0014] Generally speaking, the memory stick additional heat sink 01 usually uses an aluminum alloy heat sink clamped on both sides of the memory stick to transfer heat, and increases the heat dissipation area by increasing the surface area of the aluminum alloy heat sink or by designing additional protrusions or additional heat dissipation fins 02 of various shapes to better achieve the heat dissipation effect.

[0015] However, the heat sinks attached to the memory sticks are all designed to improve the heat dissipation of a single memory stick. Although the heat dissipation effect is quite obvious, it does not fully utilize the internal space of the chassis.

[0016] Reference Figure 3 As shown, some high-end servers use liquid cooling modules 03 to dissipate heat for multiple memory sticks. This module can dissipate heat for large memory sticks. A cooling plate is usually provided. The heat from the heat sinks 01 attached to the multiple memory sticks is collected on the cooling plate. A channel for the circulation of coolant is designed on the back of the cooling plate. The flow of coolant is used to bring the heat from the operation of the memory sticks transferred from the heat sinks 01 to the external heat exchanger of the liquid cooling system. The heat is then released by the external heat exchanger and brought back to the low-temperature coolant, and the heat cycle of the cooling system is repeated.

[0017] However, the heat dissipation modules using liquid cooling methods are generally used in large liquid-cooled server systems. Due to the complexity of the modules, special customized memory module heat dissipation modules are generally configured for products with fully equipped memory modules. This kind of memory module heat dissipation module using liquid cooling method has poor flexibility and basically belongs to the module customized based on a specific model. Moreover, a complete set of liquid cooling equipment needs to be equipped. The liquid cooling equipment includes a set of complex liquid cooling thermal cycle systems such as accessory heat sinks, cold plates, liquid cooling pipes, circulation pumps, and heat exchangers. Even a perfect liquid cooling temperature control system is required to control the rotation speed of the circulation pump according to the temperature of the coolant, and then control the flow rate of the coolant to meet the requirements of different heat dissipation temperature controls. Many of these liquid cooling systems use precious metals such as copper as heat conduction structural parts, and the coolant is also composed of a mixture of liquids such as pure water, ethylene glycol, propylene glycol, and additives. The overall cost of the heat dissipation system is very high, and general products cannot bear such high costs and such a large liquid cooling system.

[0018] It can be seen that with continuous big data operations, the power consumption of the electronic components themselves is not low, and the operating temperature is high. To ensure the stable operation of the electronic device, heat dissipation of the electronic components is required. However, the installation and addition of heat dissipation devices inside the body are limited by the actual space inside the chassis and it is difficult to meet greater heat dissipation requirements. In high-load operating scenarios, the electronic components are prone to overheating, resulting in problems such as device performance degradation and data loss.

[0019] Due to the existence of the above problems, it is necessary to design a heat dissipation device that can expand the heat dissipation capacity without changing the structure of the electronic device body itself, can make full use of the internal space of the electronic device body, and can be flexibly combined to make the installation simple.

[0020] To enable those skilled in the art of this technical field to better understand the solution of this application, the following further details this application in conjunction with the accompanying drawings and specific embodiments.

[0021] Embodiments of this application provide a heat dissipation device for dissipating heat from the electronic components 10 of an electronic device. The electronic device is provided with slots, and the electronic components 10 and the plug-ins 20 of the electronic device are respectively inserted into one slot. The heat dissipation device includes a first heat dissipation module 30, a second heat dissipation module 40, and a heat conduction member 50.

[0022] It can be understood that the electronic components 10 and the plug-ins 20 are respectively inserted into one slot, and the inside of the slot can be blocked by both the electronic components 10 and the plug-ins 20 to prevent dust from falling in and avoid risks such as short circuits. Specifically, the plug-in 20 is formed as a plastic part with an insulating effect to avoid connecting the circuit. The plug-in 20 is inserted into the idle slot to block the way for dust to fall into the idle memory slot.

[0023] The first heat dissipation module 30 is adhesively mounted on the side wall of the electronic component 10 and is used for heat transfer with the electronic component 10. That is to say, heat transfer is achieved between the first heat dissipation module 30 and the electronic component 10 through a contact fit manner, so that the heat generated on the electronic component 10 can be diffused through the first heat dissipation module 30.

[0024] The second heat dissipation module 40 is adhesively mounted on the side wall of the plug-in 20. That is to say, the second heat dissipation module 40 is fixed relative to the slot through the plug-in 20, that is, the plug-in 20 can serve as a support and fixing structure for the second heat dissipation module 40.

[0025] At least one heat conducting member 50 is disposed at intervals between the electronic component 10 and the plug-in 20, and one end of the heat conducting member 50 is adhesively mounted on at least one of the first heat dissipation module 30 and the electronic component 10 to perform heat transfer with at least one of the first heat dissipation module 30 and the electronic component 10, and the other end of the heat conducting member 50 is adhesively mounted on the second heat dissipation module 40 to perform heat transfer with the second heat dissipation module 40.

[0026] That is to say, one end of the heat conducting member 50 can be adhesively mounted on the first heat dissipation module 30, and the other end is adhesively mounted on the second heat dissipation module 40. When the electronic component 10 operates, the heat generated can, after passing through the first heat dissipation module 30, be transferred to the second heat dissipation module 40 through the heat conducting member 50, and the second heat dissipation module 40 is used for heat dissipation; one end of the heat conducting member 50 can also be adhesively mounted on the electronic component 10, and the other end is adhesively mounted on the second heat dissipation module 40. When the electronic component 10 operates, the heat generated can be directly transferred to the second heat dissipation module 40 through the heat conducting member 50, and the second heat dissipation module 40 is used for heat dissipation. At the same time, the electronic component 10 can also use the first heat dissipation module 30 for heat dissipation.

[0027] Of course, one end of the heat conducting member 50 can also be simultaneously adhered to both the first heat dissipation module 30 and the electronic component 10, or a part of the plurality of heat conducting members 50 is adhered to the first heat dissipation module 30, and the other part is adhered to the electronic component 10. In this way, when the electronic component 10 operates, the heat generated can be dissipated simultaneously according to the path passing through the first heat dissipation module 30, the heat conducting member 50 to reach the second heat dissipation module 40, and the path directly passing through the heat conducting member 50 to reach the second heat dissipation module 40, which can improve the heat conduction efficiency.

[0028] It can be understood that, compared with the solution in the prior art where only an additional heat sink 01 is provided on the electronic component 10, the heat dissipation effect for the electronic component 10 can be expanded, and there is no need to add other installation structures. The existing plug-in 20 can be directly used for the installation of the second heat dissipation module 40, which is convenient to operate. Using the plug-in 20 as a carrier for additional installation and fixation breaks through the traditional idea that only focuses on the heat-generating electronic component 10 and creates a new heat transfer path.

[0029] When the electronic device is operating, the electronic component 10 generates a large amount of heat. A part of the heat is transferred to the first heat dissipation module 30 on the electronic component 10 through heat transfer, and then the heat is dissipated conventionally through the heat exchange between the first heat dissipation module 30 and the flowing air, that is, the first heat dissipation module 30 can directly dissipate heat and cool down the electronic component 10. Another part of the heat is transferred to the second heat dissipation module 40 through the heat conducting member 50, and then the heat is dissipated conventionally through the heat exchange between the second heat dissipation module 40 and the flowing air, that is, the second heat dissipation module 40 can cooperate to dissipate heat and cool down the electronic component 10, improving the heat dissipation efficiency. The plug-in 20 can be used as a support and fixation structure for the second heat dissipation module 40, which can utilize the idle slots on the electronic device, without the need to additionally add installation structures on the body of the electronic device, can make full use of the space, and does not require complex installation and fixation operations, and can effectively reduce the temperature of the electronic component 10, extend the service life, and ensure the stable operation of the electronic device.

[0030] In specific implementation, the number of the heat conducting members 50 can be one or more, which can be specifically set according to the actual heat dissipation requirements.

[0031] It can be understood that when the heat conducting member 50 is connected between the electronic component 10 and the plug-in 20, the connection stability between the electronic component 10 and the plug-in 20 can be improved, and the overall structural strength of the heat dissipation device can be ensured, so as to be able to adapt to the layout position of the slots on the body and ensure the overall structural strength of the electronic device.

[0032] In some embodiments, the first heat dissipation module 30 includes a first heat sink 31, and the first heat sink 31 is attached to the side wall of the electronic component 10. The heat conducting member 50 is connected to the first heat sink 31 and conducts heat transfer with the first heat sink 31. That is to say, the heat generated when the electronic component 10 is operating can be transferred to the heat conducting member 50 through the first heat sink 31.

[0033] It can be understood that the heat generated when the electronic component 10 is operating is mainly the heat generated when the chip on it processes and transmits data. However, due to the too small surface area of the chip, the heat dissipation effect is limited. The first heat sink 31 can be attached to the chip to expand the heat dissipation area, and has a good heat dissipation effect compared with only relying on the chip for heat dissipation.

[0034] In specific implementation, the first heat sink 31 is made of high thermal conductivity aluminum alloy or copper alloy (thermal conductivity ≥ 200 W / mK), is in the shape of a rectangular flat plate (the thickness of the first heat sink 31 is 1.5 mm ± 0.2 mm), and its surface is anodized treated.

[0035] Specifically, the area of the first heat sink 31 can be enlarged relative to the surface area of the electronic component 10. In this way, the first heat dissipation module 30 has a larger heat dissipation area, and can make full use of the gap inside the body to improve the heat dissipation effect of the first heat sink 31 as much as possible.

[0036] Exemplarily, as shown in Figure 4 the top surface of the first heat sink 31 is higher than the top edge of the electronic component 10 to ensure the heat dissipation area of the first heat sink 31. Among them, the width of the first heat sink 31 is adapted to the width of the electronic component 10, and the top edge height can exceed the top edge height of the electronic component 10 by 1.0 cm to 1.5 cm to increase the heat dissipation area of the first heat sink 31 while adapting to the space inside the body.

[0037] In some embodiments, a silicone grease thermal conductive layer or a silica gel thermal conductive layer is provided between the first heat sink 31 and the electronic component 10. It can be understood that the silicone grease thermal conductive layer or the silica gel thermal conductive layer can fill the gap between the first heat sink 31 and the electronic component 10, making the heat conduction smoother and faster.

[0038] In specific implementation, the thermal conductive silicone grease is a high thermal conductivity insulating silicone material, which can maintain the paste state during long-term use at a temperature of -50°C to +230°C and hardly solidifies in daily use scenarios. It has both excellent electrical insulation and excellent thermal conductivity. The silicone grease thermal conductive layer is coated on the contact surface between the first heat sink 31 and the electronic component 10, which can play the role of a heat transfer medium and achieve performance such as moisture-proof, dust-proof, corrosion-proof, and shock-proof.

[0039] The silica gel thermal conductive layer, that is, the thermal conductive RTV glue, can be cured at room temperature and has a certain bonding property. In this way, the first heat sink 31 can be attached to the surface of the electronic component 10 through the silica gel thermal conductive layer, thereby ensuring the connection performance between the first heat sink 31 and the electronic component 10. When the electronic component 10 is inserted into the slot, the first heat sink 31 can be installed and fixed relative to the body slot.

[0040] Of course, other materials of the first bonding layer can also be provided between the first heat sink 31 and the electronic component 10. For example, the first heat sink 31 and the electronic component 10 are directly bonded using a double-sided adhesive layer. This application does not limit this, as long as the first heat sink 31 can be attached and installed on the side wall of the electronic component 10 to facilitate the installation of the first heat sink 31 together with the electronic component 10.

[0041] Further, the top surface of the first heat sink 31 may be provided with first heat dissipation fins and / or first convex structures to further increase the heat dissipation area of the first heat dissipation module 30 and expand the heat dissipation effect. Specifically, the first heat dissipation fins, the first convex structures and the first heat sink 31 are integrally formed by extrusion.

[0042] In some embodiments, the number of the first heat sinks 31 is two, and the two first heat sinks 31 are respectively disposed on both sides of the electronic component 10. With this arrangement, the effective heat dissipation area of the electronic component 10 is doubled, and a better heat dissipation effect is achieved.

[0043] Specifically, the two first heat sinks 31 are respectively disposed on both sides of the electronic component 10. When the electronic component 10 is inserted into the slot, the first heat sinks 31 can isolate the side wall of the electronic component 10 from the side wall of the slot. The first heat sinks 31 disposed on both sides of the electronic component 10 can protect the electronic component 10, and can ensure the service life of the electronic component 10 while ensuring the heat dissipation effect.

[0044] Of course, the number of the first heat sinks 31 may also be set to one, as long as the heat dissipation requirement can be met. The present application does not limit this.

[0045] In specific implementation, the first heat sink 31 can be arranged according to the specific position of the heat generating element on the electronic component 10. For example, when the chips are arranged on both sides of the circuit board of the electronic component 10, the first heat sinks 31 can be respectively arranged on both sides of the electronic component 10. When the chips are arranged on one side of the circuit board of the electronic component 10, the first heat sink 31 can be arranged on the side of the electronic component 10 corresponding to the chips, and can be specifically set according to actual needs.

[0046] Further, the end of the heat conducting member 50 can be connected to any one of the first heat sinks 31, or can be connected to both of the first heat sinks 31 at the same time.

[0047] In some embodiments, as shown in Figure 4 the first heat dissipation module 30 further includes a first elastic clip 32. The first elastic clip 32 is clamped on the sides of the two first heat sinks 31 away from each other, and the first elastic clip 32 is configured to be able to conduct heat.

[0048] It can be understood that the first elastic clip 32 is clamped on the sides of the two first heat sinks 31 away from each other, and can clamp and limit the electronic component 10 between the two first heat sinks 31. In this way, the heat transfer path between the electronic component 10 and the first heat sinks 31 can be ensured, so as to ensure the heat transfer effect and meet the heat dissipation requirement.

[0049] Specifically, the first elastic clip 32 is configured to be capable of heat transfer, that is, the heat on one of the first heat sinks 31 can be transferred to the other first heat sink 31 through the first elastic clip 32, and the heat on the other first heat sink 31 can be transferred to this first heat sink 31 through the first elastic clip 32. When any one of the first heat sinks 31 is in contact with the heating element on the electronic component 10, heat dissipation can be achieved through the other first heat sink 31.

[0050] In specific implementation, the first elastic clip 32 includes a connecting member and first elastic arms provided at opposite ends of the connecting member. That is to say, the first elastic clip 32 is formed into a U-shaped structure. The ends of the two first elastic arms away from the connecting member are formed into movable ends, and the two movable ends are close to each other, so that the first elastic clip 32 has the function of elastic clamping, and thus the first heat sink 31 can be pressed against the electronic component 10 through the two first elastic arms.

[0051] In some embodiments, the second heat dissipation module 40 includes a second heat sink 41. One end of the heat conducting member 50 away from the first heat dissipation module 30 is connected to the second heat sink 41, and heat transfer occurs between the heat conducting member 50 and the second heat sink 41. That is to say, the heat from the first heat dissipation module 30 through the heat conducting member 50 can be diffused into the air through the second heat sink 41 to achieve the purpose of heat dissipation.

[0052] In specific implementation, the second heat sink 41 is made of high thermal conductivity aluminum alloy or copper alloy (thermal conductivity ≥ 200W / mK), is in the shape of a rectangular flat plate (the thickness of the first heat sink 31 is 1.5mm ± 0.2mm), and its surface is treated by anodic oxidation.

[0053] Specifically, the area of the second heat sink 41 can be relatively enlarged compared to the surface area of the plug-in 20. In this way, the second heat dissipation module 40 has a larger heat dissipation area and can make full use of the gap inside the fuselage to improve the heat dissipation effect of the second heat sink 41 as much as possible.

[0054] Exemplarily, referring to Figure 4 As shown, the top surface of the second heat sink 41 is higher than the top edge of the plug-in 20 to ensure the heat dissipation area of the second heat sink 41. Among them, the width of the second heat sink 41 is adapted to the width of the plug-in 20, and the height of the top edge can exceed the height of the top edge of the plug-in 20 by 1.0 cm to 1.5 cm to increase the heat dissipation area of the second heat sink 41 while adapting to the space inside the fuselage.

[0055] Furthermore, the top surface of the second heat sink 41 can be provided with second heat dissipation fins and / or second convex structures to further increase the heat dissipation area of the second heat dissipation module 40 and expand the heat dissipation effect. Specifically, the second heat dissipation fins, the second convex structures and the second heat sink 41 are extruded and formed together.

[0056] In some embodiments, the number of the second heat sinks 41 is two, and the two second heat sinks 41 are respectively arranged on two sides of the plug-in unit 20. With this arrangement, the effective heat dissipation area of the electronic component 10 that uses both the first heat dissipation module 30 and the second heat dissipation module 40 for heat dissipation can be doubled again, and a better heat dissipation effect can be achieved.

[0057] Of course, the number of the second heat sinks 41 can also be set to one, as long as the heat dissipation requirement can be met, and the present application does not limit this.

[0058] When specifically implemented, the end of the heat conducting member 50 can be connected to any one of the second heat sinks 41, or can be connected to both of the second heat sinks 41 at the same time.

[0059] In some embodiments, referring to Figure 4 As shown, the second heat dissipation module 40 further includes a second elastic clip 42. The second elastic clip 42 is clamped on the sides of the two second heat sinks 41 that are away from each other, and the second elastic clip 42 is configured to be able to conduct heat.

[0060] It can be understood that the second elastic clip 42 is clamped on the sides of the two second heat sinks 41 that are away from each other, and can clamp and limit the plug-in unit 20 between the two second heat sinks 41. In this way, the installation stability of the second heat sink 41 relative to the plug-in unit 20 can be ensured.

[0061] Specifically, the second elastic clip 42 is configured to be able to conduct heat, that is, the heat on one of the second heat sinks 41 can be transferred to the other second heat sink 41 through the second elastic clip 42, and the heat on the other second heat sink 41 can be transferred to this second heat sink 41 through the second elastic clip 42. When any one of the second heat sinks 41 is connected to the heat conducting member 50, heat diffusion can be carried out through the other second heat sink 41.

[0062] When specifically implemented, the second elastic clip 42 includes a connecting member and second elastic arms respectively arranged at opposite ends of the connecting member. That is to say, the second elastic clip 42 is formed into a U-shaped structure. The ends of the two second elastic arms away from the connecting member are formed into movable ends, and the two movable ends are close to each other, so that the second elastic clip 42 has an elastic clamping function, and thus the second heat sink 41 can be pressed against the plug-in unit 20 through the two second elastic arms, so as to realize the installation and fixation of the second heat dissipation module 40 relative to the slot on the machine body.

[0063] Of course, a second adhesive layer may be provided between the second heat sink 41 and the plug-in 20. For example, the second heat sink 41 and the plug-in 20 are directly bonded using a double-sided adhesive layer. The present application does not limit this. As long as the second heat sink 41 can be fitted and installed on the side wall of the plug-in 20, the plug-in 20 can be used as a support and fixing structure of the second heat dissipation module 40, so that the idle slots on the electronic device can be utilized, while improving the heat dissipation effect and avoiding excessive improvement of the overall structure of the electronic device body.

[0064] In some embodiments, the heat conducting member 50 is a heat conducting tube, both ends of the heat conducting tube are closed, and a liquid heat dissipation medium is filled in the heat conducting tube. Specifically, one end of the heat conducting tube is fitted and installed on at least one of the first heat dissipation module 30 and the electronic component 10, so as to absorb the heat at the current position through the liquid heat dissipation medium, that is, absorb the heat on the electronic component 10, and the other end is fitted and installed on the second heat dissipation module 40, so that the heat absorbed by the liquid heat dissipation medium can be diffused through the second heat dissipation module 40.

[0065] Specifically, the cross section of the heat conducting tube is formed into an elliptical cross section, a rectangular cross section or a circular cross section. With such a setting, the contact area between the heat conducting tube and the first heat dissipation module 30 or the second heat dissipation module 40 can be increased, thereby enhancing the heat conduction effect and increasing the connection strength.

[0066] Specifically, the heat conducting tube is welded to the first heat dissipation module 30 by brazing, and the heat conducting tube is welded to the second heat dissipation module 40 by brazing, which has a high connection strength and can ensure the heat transfer effect.

[0067] Refer to Figure 4 As shown, the heat conducting member 50 includes a first heat conducting section 51, a second heat conducting section 52 and a third heat conducting section 53 that are connected in sequence. The first heat conducting section 51 is disposed in contact with the first heat dissipation module 30 to transfer heat with the first heat dissipation module 30. The second heat conducting section 52 is connected between the first heat conducting section 51 and the third heat conducting section 53. The third heat conducting section 53 is disposed in contact with the second heat dissipation module 40 to transfer heat with the second heat dissipation module 40.

[0068] Specifically, the first heat conducting section 51 and the second heat conducting section 52 are arranged at an angle, and the third heat conducting section 53 and the second heat conducting section 52 are arranged at an angle. When the second heat conducting section 52 extends along the arrangement direction of the electronic component 10 and the plug-in 20, the first heat conducting section 51 can be disposed in contact with the first heat dissipation module 30, and the third heat conducting section can be disposed in contact with the second heat dissipation module 40, so as to ensure that there is a large contact area between the first heat conducting section 51 and the first heat dissipation module 30, and between the third heat conducting section 53 and the second heat dissipation module 40, thus ensuring the heat conduction rate.

[0069] Exemplarily, two heat conducting members 50 are provided between any group of electronic components 10 and the plug-in 20. When the two heat conducting members 50 are connected between the electronic components 10 and the plug-in 20, a quadrilateral structure is formed among the two heat conducting members 50, the electronic components 10 and the plug-in 20, so that the heat dissipation device has high structural stability.

[0070] Of course, a single, three, four or more heat conducting members 50 can also be provided between any group of electronic components 10 and the plug-in 20. The present application does not limit this, and can be specifically set according to actual needs.

[0071] In some embodiments, the sum of the number of the first heat dissipation modules 30 and the number of the second heat dissipation modules 40 is the same as the number of slots of the electronic device, so as to make full use of the electronic components 10 and the plug-in 20 to realize the installation of the heat dissipation device, thereby meeting the sufficient heat dissipation function realization of the electronic components 10.

[0072] In a specific embodiment, the number of both the first heat dissipation module 30 and the second heat dissipation module 40 is one, and the first heat dissipation module 30 and the second heat dissipation module 40 are arranged side by side. This arrangement is applicable to the situation where the electronic device is configured with two slots and is not fully configured.

[0073] In another specific embodiment, the number of the first heat dissipation modules 30 is one, and the number of the second heat dissipation modules 40 is multiple. The multiple second heat dissipation modules 40 are arranged on the same side of the first heat dissipation module 30 or are separately arranged on different sides of the first heat dissipation module 30. This arrangement is applicable to the situation where the electronic device is configured with multiple slots and only one electronic component 10 is configured.

[0074] Specifically, the multiple second heat dissipation modules 40 are arranged on the same side of the first heat dissipation module 30, so as to use the second heat dissipation modules 40 for heat dissipation when the heat is sequentially transferred to the second heat dissipation modules 40; or, Figure 5 As shown, the multiple second heat dissipation modules 40 are arranged on different sides of the first heat dissipation module 30, that is, the multiple second heat dissipation modules 40 are separately arranged on both sides of the first heat dissipation module 30, so as to use the second heat dissipation modules 40 for heat dissipation when the heat is transferred to the second heat dissipation modules 40 on different sides through different directions on both sides at the same time.

[0075] In yet another specific embodiment, the number of both the first heat dissipation modules 30 and the second heat dissipation modules 40 is multiple, and the multiple first heat dissipation modules 30 and the multiple second heat dissipation modules 40 are alternately arranged in sequence. With such a setting, the heat of any electronic component 10 and the first heat dissipation module 30 on the electronic component 10 can be transferred to the second heat dissipation modules 40 on different sides through different directions on both sides, ensuring the heat dissipation effect.

[0076] Of course, the arrangement of the first heat dissipation module 30 and the second heat dissipation module 40 is not limited to the above-described arrangement method, and can be reasonably arranged according to the selection of the actual electronic device to form a series heat dissipation network.

[0077] In specific implementation, the electronic component 10 is a memory module, a graphics card, a central processing unit (CPU), or a network card. Specifically, the shape of the slot on the body is adapted to the shape of different electronic components 10, and different electronic components 10 can be inserted.

[0078] It should be noted that the electronic component 10 can also be other components that can be selectively installed in the slots of the electronic device, as long as the plug 20 can be used as a fixed support structure for the second heat dissipation module 40 to expand the heat dissipation effect.

[0079] The heat dissipation device of the present application has great advantages in actual use. Taking a memory module as an example, in devices with high heat dissipation requirements such as servers, multiple adjacent idle slots are common. Using the combination of multiple heat dissipation modules (i.e., the first heat dissipation module 30 and the second heat dissipation module 40) can significantly improve the heat dissipation effect of the memory module. After actual testing, in the server scenario of high-load operation, the temperature of the memory module can be reduced by about 10°C - 15°C, which can effectively avoid problems such as server performance degradation and data loss caused by overheating of the memory module, and improve the reliability and stability of the server.

[0080] The embodiment of the present application also provides an electronic device, including an electronic component 10, a plug 20, and a heat dissipation device as described in any of the above embodiments.

[0081] In specific implementation, the electronic device is provided with slots, and the electronic component 10 and the plug 20 are respectively inserted into a slot to realize the fixation of the electronic component 10 and the plug 20 relative to the slot, and to prevent dust accumulation in the slot by using the electronic component 10 and the plug 20. The first heat dissipation module 30 of the heat dissipation device is attached and installed on the side wall of the electronic component 10, and the second heat dissipation module 40 of the heat dissipation device is attached and installed on the side wall of the plug 20.

[0082] The electronic device provided by the embodiment of the present application has the beneficial effects of the heat dissipation device described in any of the above embodiments because it includes the heat dissipation device described in any of the above embodiments, and will not be elaborated here.

[0083] In some embodiments, the electronic device is a server, a computer, or a switch. Specifically, the plug 20 is inserted into multiple idle slots in the server, computer, or switch, and a heat dissipation network can be formed through the plug 20 to improve the heat dissipation effect.

[0084] It should be noted that the electronic device can also be other devices with idle slots that require heat dissipation, as long as the idle slots and the plug 20 can be used as the fixed support structure of the second heat dissipation module 40 to expand the heat dissipation effect.

[0085] Specifically, the electronic device further includes a body, the slots are provided on the body, and the number of the slots is multiple. The multiple slots include a first slot and a second slot. The electronic component 10 is inserted into the first slot, and the plug 20 is inserted into the second slot.

[0086] It should be noted that the first slot, as the slot for inserting the electronic component 10, can support the installation of at least one of a memory module, a graphics card, a central processing unit, and a network card. The second slot can support the installation of a plug 20 having the same shape as the memory module, the graphics card, the central processing unit, and the network card, and is not limited to one of them. That is to say, when the slots of the electronic device are reasonably arranged, the first heat dissipation module 30 can be installed on the network card, and the second heat dissipation module 40 can be installed on the dummy memory. Specifically, it can be set according to the actual application scenario.

[0087] The above has introduced in detail a heat dissipation device and an electronic device provided by the present application. Specific examples are used in this article to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the method and its core idea of the present application. It should be pointed out that for those of ordinary skill in the art, without departing from the principle of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A heat dissipation device for dissipating heat from electronic components of an electronic device, wherein the electronic device is provided with slots, and the electronic components and the plug-ins of the electronic device are respectively inserted into one of the slots, characterized in that, The heat dissipation device includes: A first heat dissipation module, which is attached and installed on the side wall of the electronic component for heat transfer with the electronic component; A second heat dissipation module, which is attached and installed on the side wall of the plug-in; At least one heat conducting member, which is spaced between the electronic component and the plug-in, and one end of the heat conducting member is attached and installed on at least one of the first heat dissipation module and the electronic component for heat transfer with at least one of the first heat dissipation module and the electronic component, and the other end of the heat conducting member is attached and installed on the second heat dissipation module for heat transfer with the second heat dissipation module.

2. The heat dissipation device according to claim 1, characterized in that, The first heat dissipation module includes a first heat sink, the first heat sink is attached to the side wall of the electronic component, and the heat conducting member is connected to the first heat sink and conducts heat with the first heat sink.

3. The heat dissipation device according to claim 2, wherein A silicone grease heat conducting layer or a silicone rubber heat conducting layer is provided between the first heat sink and the electronic component.

4. The heat dissipation device according to claim 2, wherein, The number of the first heat sinks is two, and the two first heat sinks are respectively arranged on two sides of the electronic component.

5. The heat dissipation device according to claim 4, wherein The first heat dissipation module further includes a first elastic clip, the first elastic clip is clamped on the mutually remote sides of the two first heat sinks, and the first elastic clip is configured to be able to conduct heat.

6. The heat dissipation device according to claim 1, characterized in that The second heat dissipation module includes a second heat sink, one end of the heat conducting member far from the first heat dissipation module is connected to the second heat sink, and the heat conducting member conducts heat with the second heat sink.

7. The heat dissipation device according to claim 6, wherein The number of the second heat sinks is two, and the two second heat sinks are respectively arranged on two sides of the plug-in.

8. The heat dissipation device according to claim 7, wherein The second heat dissipation module further includes a second elastic clip, the second elastic clip is clamped on the mutually remote sides of the two second heat sinks, and the second elastic clip is configured to be able to conduct heat.

9. The heat dissipation device according to claim 1, wherein The heat conducting member is a heat conducting tube, both ends of the heat conducting tube are closed and a liquid heat dissipation medium is filled in the heat conducting tube.

10. The heat dissipation device according to claim 9, wherein The cross section of the heat conducting tube is formed into an elliptical cross section, a rectangular cross section or a circular cross section.

11. The heat dissipation device according to claim 1, wherein The heat conducting member includes a first heat conducting section, a second heat conducting section and a third heat conducting section which are sequentially communicated, the first heat conducting section is attached to the first heat dissipation module for heat transfer with the first heat dissipation module, the second heat conducting section is connected between the first heat conducting section and the third heat conducting section, and the third heat conducting section is attached to the second heat dissipation module for heat transfer with the second heat dissipation module.

12. The heat dissipation device according to claim 1, wherein, The electronic component is a memory module, a graphics card, a central processing unit or a network card.

13. An electronic device, characterized in that, An electronic device includes an electronic component, a plug-in and the heat dissipation device according to any one of claims 1 to 12. The electronic device is provided with slots, the electronic component and the plug-in are respectively inserted into one of the slots, the first heat dissipation module of the heat dissipation device is attached and installed on the side wall of the electronic component, and the second heat dissipation module of the heat dissipation device is attached and installed on the side wall of the plug-in.

14. The electronic device according to claim 13, wherein The electronic device is a server, a computer or a switch.

15. The electronic device according to claim 13, characterized in that, The electronic device further includes a body, the slot is provided on the body, and the number of the slots is multiple. The multiple slots include a first slot and a second slot. The electronic component is inserted into the first slot, and the plug-in component is inserted into the second slot.

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