Systems, apparatus, and methods for efficient thermal management

Abstract

Systems, methods, and apparatus are provided for extended heat transfer from a heat plane. In accordance with the present disclosure, an apparatus may include at least one cooling apparatus configured to transfer heat to a fluid, where the cooling apparatus is characterized in that at least two thermally conductive planes define a channel through which the fluid flows, and where a material associated with the at least two thermally conductive planes is capable of transferring thermal energy to the fluid through the channel. The apparatus may also include a heat pipe in direct thermal contact with the thermal plane. Consistent with the present disclosure, one of the at least two thermally conductive planes is aligned with and in direct thermal contact with the thermal plane, and the other of the at least two thermally conductive planes is in direct thermal contact with the heat pipe.

Description

[0001] Cross - reference to related applications

[0002] This application claims the priority and benefit of U.S. Provisional Application Serial No. 63 / 380,381, filed on October 20, 2022, the entire content of which is incorporated herein by reference. Technical Field

[0003] Systems, devices, materials, components, and methods consistent with the present disclosure relate to temperature control using hierarchical microchannel devices, systems, and methods. Background Art

[0004] For example, hierarchical microchannel devices, systems, and methods for cooling are disclosed in U.S. Patent Serial No. 10,379,582 and U.S. Patent Serial No. 11,327,540, the entire content of which is incorporated herein by reference.

[0005] For example, when used to cool devices and systems that generate heat in a single plane, it is necessary to allocate the entire cooling capacity of the hierarchical microchannel device to a single plane. Summary of the Invention

[0006] In one aspect, embodiments consistent with the present disclosure provide extended heat transfer from a hot plane. Consistent with the present disclosure, a device may include at least one cooling device configured to transfer heat to a fluid, wherein the cooling device is characterized in that at least two thermally conductive planes define a channel for fluid flow, and wherein a material associated with the at least two thermally conductive planes is capable of transferring thermal energy to the fluid through the channel. The device may also include a heat pipe in direct thermal contact with the hot plane. Consistent with the present disclosure, one of the at least two thermally conductive planes is aligned with and in direct thermal contact with the hot plane, and the other of the at least two thermally conductive planes is in direct thermal contact with the heat pipe.

[0007] In another aspect, embodiments consistent with the present disclosure may include at least one cooling device configured to transfer heat to a fluid, wherein the cooling device is characterized in that at least two thermally conductive planes define a channel for fluid flow, wherein a material associated with the at least two thermally conductive planes is capable of transferring thermal energy to the fluid through the channel, and wherein the channel includes an inlet portion and an outlet portion. The device may also include at least two heat pipes, each of which is in direct thermal contact with the hot plane. Consistent with the embodiment, one of the at least two thermally conductive planes may be in direct thermal contact with at least one of the at least two heat pipes, and the other of the at least two thermally conductive planes is in direct thermal contact with the other of the at least two heat pipes. Additionally, consistent with the embodiment, the hot plane may be substantially parallel to the cross - section of the channel, and the inlet region may be close to the hot plane.

[0008] Additional features and embodiments of the present invention will be set forth in part in the following description, in part will be obvious from the description, or may be learned by practice of the present invention. It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and do not limit the claimed subject matter. Brief Description of the Drawings

[0009] The drawings incorporated in and constituting a part of this specification illustrate exemplary embodiments and, together with the specification, serve to explain the principles of the disclosure. In the figures:

[0010] Figure 1 - Figure 5 illustrates aspects of an embodiment of a cooling system consistent with the present disclosure;

[0011] Figures 6 - 1 Figure 6 illustrates aspects of another embodiment of a cooling system consistent with the present disclosure;

[0012] Figure 11 Figure 7 illustrates Figures 1 - 1 the calculation results related to the embodiment of Figure 6;

[0013] Figures 12 - 14 illustrate aspects of yet another embodiment of a cooling system consistent with the present disclosure;

[0014] Figure 15 illustrates a part of the embodiment of Figures 12 - 14;

[0015] Figures 16 - 17 illustrate aspects of additional embodiments consistent with the present disclosure;

[0016] Figure 18 illustrates the use of the embodiment of Figures 16 - 17 in a server environment; and

[0017] Figure 19 Figure 19 illustrates the housing assembled from the embodiment of Figure 18. Detailed Description

[0018] Reference will now be made in detail to the illustrated embodiments of the present disclosure, which are shown in the accompanying drawings. Wherever possible, the same reference numerals will be used throughout the drawings to refer to the same or like parts.

[0019] Figure 1 and Figure 2 Figure 20 illustrates 181 and 182 a device for cooling a planar region 100 using a hierarchical microchannel device 181 and 182(and other hierarchical microchannel devices discussed herein, e.g.) may include stacked blades (or folded sheets forming stacked blades), as disclosed in U.S. Patent Serial No. 10,379,582 and U.S. Patent Serial No. 11,327,540. Consistent with the present disclosure, the stacked blades may include an alternating stack of first and second blades, including 100, 200, 400, 800, or 1000 or more blades (or any number less than 100, between 100 and 1000, or greater than 1000 blades), wherein, in the alternating configuration, a stack of 1000 blades may include 500 first blades and 500 second blades. Additionally, the "stack" of blades may be formed by a folded sheet, where each alternating fold corresponds to a first blade or a second blade. In an embodiment of the folded sheet, one fold may form two blades, two folds may form three blades, three folds may form four blades, and so on. Further, the blade stack (or the folds forming the stack) may be configured such that the spacing between the blades (or folds) is generally less than one of the following values: 0.5mm, 0.45mm, 0.4mm, 0.39mm, 0.38mm, 0.37mm, 0.36mm, 0.35mm, 0.34mm, 0.33mm, 0.32mm, 0.31mm, 0.3mm, 0.29mm, 0.28mm, 0.27mm, 0.26mm, 0.25mm, 0.24mm, 0.23mm, 0.22mm, 0.21mm, 0.2mm, 0.19mm, 0.18mm, 0.17mm, 0.16mm, 0.15mm, 0.14mm, 0.13mm, 0.12mm, 0.11mm, 0.1mm, 0.09mm, 0.08mm, 0.07mm, 0.06mm, 0.05mm, 0.04mm, 0.03mm, 0.02mm, and 0.01mm, or greater or less.

[0020] One of ordinary skill in the art will understand that, for example, a hierarchical microchannel device 181 may allow a fluid (such as a gas or air) to enter the chimney 190 from region 180. The hierarchical microchannel device 182 may also allow the fluid to pass from the corresponding region 183 (from the side of the device 100 opposite region 180) to similarly enter the chimney 190. Consistent with the present disclosure, a low pressure may be introduced in the vicinity of the chimney 190 to induce the fluid (e.g.) to flow from region 180 through the hierarchical microchannel device 181 towards the chimney 190.

[0021] Figure 2 is regarding Figure 1 the device 100Bottom perspective view, showing the steam chamber 170 and the steam chamber 160. The plane defined by the steam chamber 160 and the steam chamber 170 is the planar region where heat is expected to be generated or where heat originates. For example, in one embodiment, the device 100 can be used to cool a microprocessor or a central processing unit (CPU) mounted on a Printed Circuit Board (PCB). The mounting bolts 101, 102, 103, and 104 can be sized and configured (e.g.) to couple with an AMD SP3 socket or any other suitable socket, device, or component to be cooled.

[0022] As Figure 1 and Figure 2 shown, a fluid (such as air) can pass from region 183 through the hierarchical microchannel device 182 to reach the chimney 190. Therefore, the portion of the hierarchical microchannel device 182 near region 183 is the fluid inlet region. Figure 1 and Figure 2 not shown, the hierarchical microchannel device 182 includes a first edge region (or first planar region) in thermal contact with the steam chamber 170. There is also a second edge region (or second planar region) of the hierarchical microchannel device 182 opposite to the above-mentioned first edge region (first planar region). The second edge region (or second planar region) of the hierarchical microchannel device 182 is in thermal contact with portions of the heat pipes 110 and 111 configured in a "top" configuration along Figure 2 Refer to Figure 3A and Figure 3B , the portions of the heat pipes 110 and 111 in thermal contact with the second edge region (or second planar region) of the hierarchical microchannel device 182 are portions near the plate 128.

[0023] Therefore, consistent with the present disclosure, the hierarchical microchannel device 182 is characterized by a first planar region and a second planar region, each of the first planar region and the second planar region includes a thermally conductive material, and defines a channel for fluid flow (from region 183 to the chimney 190). The first planar region is in thermal contact with the steam chamber 170, and the second planar region is in thermal contact with the heat pipes 110 and 111.

[0024] Similarly, as Figure 1 and Figure 2 shown, a fluid (such as air) can pass from region 180 through the hierarchical microchannel device 181 to reach the chimney 190. Therefore, the hierarchical microchannel device 181The portion near region 180 is the fluid inlet region. Figure 1 and Figure 2 not shown in 181 the hierarchical microchannel device includes a first edge region (or first planar region) in thermal contact with the vapor chamber 160. There is also a hierarchical microchannel device 181 a second edge region (or second planar region) of which is opposite to the above-mentioned first edge region. The hierarchical microchannel device 181 the second edge region (or second planar region) of is in thermal contact with portions of the heat pipes 120 and 121 along Figure 2 the "top". Referring to Figure 3A and Figure 3B and 181 the portions of the heat pipes 120 and 121 in thermal contact with the second edge region (or second planar region) of the hierarchical microchannel device are the portions near the plate 127.

[0025] Thus, in accordance with the present disclosure, the hierarchical microchannel device 181 is characterized by a first planar region and a second planar region, each of the first planar region and the second planar region includes a thermally conductive material, and defines a channel for fluid flow (from region 180 to the chimney 190). The first planar region is in thermal contact with the vapor chamber 160, and the second planar region is in thermal contact with the heat pipes 120 and 121.

[0026] Figure 3C and Figure 3D provide other perspective views of the device disclosed herein 100 .

[0027] Figures 4A - 4D provide separate views of the heat pipes 120, 121, 110, 111, the vapor chamber 160, and the vapor chamber 170. Figures 4A - 4D Each of the components shown in can be made of a material selected from: copper, nickel-plated copper, and aluminum. In addition, each component (i.e., the heat pipes 120, 121, 110, 111, the vapor chamber 160, and the vapor chamber 170) preferably includes a hollow region under vacuum, which has a certain amount of vapor, and this can be conventionally manufactured in accordance with the vapor chamber. For example, those of ordinary skill in the art will understand that Figures 4A - 4B the sealed vapor chambers in each of the components of can help distribute the heat that may originate near the planes defined by the vapor chamber 160 and the vapor chamber 170.

[0028] Figure 4DAlso shown are slots 175 and 165 configured to receive portions of heat pipes 120 (slot 175) near vapor chamber 170 and portions of heat pipes 110 (slot 165) near vapor chamber 160. Slots in similar locations can be obtained from opposite ends of vapor chambers 170 and 160 and are configured to receive portions of heat pipes 121 and 111, respectively.

[0029] Figures 5A - 5C An apparatus consistent with the present disclosure is shown 100 in a "cut-away" view. Figure 5A Shown are the closed ends of heat pipes 111 and 121 in respective slots located on vapor chamber 170 and vapor chamber 160. Figure 5B and Figure 5C An open view of chimney 190 is provided and also shown is the "exhaust" portion of the layered microchannel device 182 (which feeds into chimney 190). Figure 5B Also marked in is the portion of plate 128 that is in thermal contact with portions of heat pipes 110 and 111 and is also in thermal contact with the second edge of the layered microchannel device 182 .

[0030] Consistent with the present disclosure, one operating principle associated with the apparatus 100 is to use heat pipes 110, 111, 120, and 121 to transfer heat generated in the planes associated with vapor chambers 160 and 170 to the "top" edges of each of the layered microchannel devices 181 and 182 .

[0031] Figure 6 and Figure 7 Show an apparatus 681 and 682 for cooling a planar area using a layered microchannel device 600 . As previously described, the layered microchannel device 681 and 682 (for example) can include stacked vanes (or folded sheets forming stacked vanes). For example, one of ordinary skill in the art will understand that the layered microchannel device 681 can allow fluid (such as gas or air, etc.) to enter chimney 690 from area 680. The layered microchannel device 682 can also allow fluid to pass through from a corresponding area 683 on the side of the device 600 opposite area 680 and into chimney 690 in a similar manner. Consistent with the present disclosure, a low pressure can be introduced in the vicinity of chimney 690 to induce (for example) flow from area 680 through the layered microchannel device 681 towards chimney 690.

[0032] Figure 7is about Figure 6 of the device 600 bottom perspective view, and shows the steam chamber 670 and the steam chamber 660. The plane defined by the steam chamber 660 and the steam chamber 670 is the plane area expected to generate heat. For example, in one embodiment, the device 600 can be used to cool a microprocessor or CPU mounted on a PCB. The mounting bolts 601, 602, 603, and 604 can be configured to couple with (for example) an AMD SP3 socket or any other suitable socket, device, or component to be cooled.

[0033] As Figure 6 and Figure 7 shown, a fluid (such as air, etc.) can pass from the area 683 through the hierarchical microchannel device 682 to reach the chimney 690. Therefore, the part of the hierarchical microchannel device 682 close to the area 683 is the fluid inlet area. Figure 6 and Figure 7 not shown in, the hierarchical microchannel device 682 includes a first edge area (or first plane area) in thermal contact with the steam chamber 670. There is also a second edge area (or second plane area) of the hierarchical microchannel device 682 opposite to the above-mentioned first edge area. The second edge area (or second plane area) of the hierarchical microchannel device 682 is in thermal contact with parts of the heat pipes 610, 611, 615, and 616. Referring to Figure 8A and Figure 8B , the parts of the heat pipes 610, 615, 611, and 616 in thermal contact with the second edge area (or second plane area) of the hierarchical microchannel device 682 are the parts close to the plate 628.

[0034] Therefore, in accordance with the present disclosure, the hierarchical microchannel device 682 is characterized by a first plane area and a second plane area, each of the first plane area and the second plane area includes a heat-conducting material, and defines a channel for fluid flow (from the area 683 to the chimney 690). The first plane area is in thermal contact with the steam chamber 670, and the second plane area is in thermal contact with the heat pipes 610, 615, 611, and 616.

[0035] Similarly, as Figure 6 and Figure 7 shown, a fluid (such as air, etc.) can pass from the area 680 through the hierarchical microchannel device 681 to reach the chimney 690. Therefore, the part of the hierarchical microchannel device 681 close to the area 680 is the fluid inlet area. Figure 6 andFigure 7 is not shown, the hierarchical microchannel device 681 includes a first edge region (or first planar region) in thermal contact with the vapor chamber 660. There is also a hierarchical microchannel device 681 a second edge region (or second planar region) of, which is opposite to the above-mentioned first edge region. The hierarchical microchannel device 681 the second edge region (or second planar region) of is in thermal contact with portions of the heat pipes 620, 625, 621 and 626. Refer to Figure 8A and Figure 8B , the portions of the heat pipes 620 and 621 in thermal contact with the second edge region (or second planar region) of the hierarchical microchannel device 682 are the portions close to the plate 627.

[0036] Thus, consistent with the present disclosure, the hierarchical microchannel device 681 is characterized by a first planar region and a second planar region, each of the first planar region and the second planar region includes a thermally conductive material, and defines a channel for fluid flow (from region 680 to the chimney 690). The first planar region is in thermal contact with the vapor chamber 660, and the second planar region is in thermal contact with the heat pipes 620, 625, 621 and 626.

[0037] Figure 8C and Figure 8D provide other perspective views of the device disclosed herein 600 .

[0038] Figures 9A - 9J provide separate views of the heat pipes 610, 611, 615, 616, 620, 621, 625, 626, the vapor chamber 660 and the vapor chamber 670. Figures 9A - 9J Each component shown in can be made of a material selected from the following: copper, nickel-plated copper, and aluminum. In addition, each component (i.e., the heat pipes 610, 611, 615, 616, 620, 621, 625, 626, the vapor chamber 660 and the vapor chamber 670) preferably includes a hollow region under vacuum, which has a certain amount of vapor, and this can be conventionally manufactured in accordance with the vapor chamber. Those of ordinary skill in the art will understand that Figures 9A - 9J the sealed vapor chambers in each component can help distribute the heat that may originate from the vicinity of the plane defined by the vapor chambers 660 and 670.

[0039] Figure 9E and Figure 9JAlso shown are slots 675 and 665 configured to receive portions of heat pipes 610 and 615 (slot 675) near vapor chamber 670 and portions of heat pipes 620 and 625 (slot 665) near vapor chamber 660. Slots at similar locations are on opposite ends of vapor chambers 670 and 660 and are configured to receive portions of heat pipes 611 and 616 and portions of heat pipes 621 and 626, respectively.

[0040] Figures 10A - 10C An apparatus consistent with the present disclosure is shown 600 in a "cut-away" view. Figure 10A Shown are the closed ends of heat pipes 611 and 616 and the closed ends of heat pipes 621 and 626 in respective slots in vapor chamber 670 and vapor chamber 660. Figure 10B and Figure 10C An open view of chimney 690 is provided and also shown is the "exhaust" portion of the hierarchical microchannel apparatus 682 (which feeds into chimney 690). Figure 10B Also marked in are portions of plate 628 that are in thermal contact with portions of heat pipes 610 and 615 and portions of heat pipes 611 and 616 and also in thermal contact with a second edge of the hierarchical microchannel apparatus 682 and.

[0041] Consistent with the present disclosure, one operating principle associated with the apparatus 600 is to use a plurality of heat pipes 610, 611, 615, 616, 620, 621, 625, and 626 to transfer heat generated in the planes associated with vapor chambers 660 and 670 to the "top" edges of each of the hierarchical microchannel apparatus 681 and 682 and.

[0042] Figure 11 Calculation results associated with an embodiment of Figures 1 - 1 0 are provided. Specifically, the embodiment associated with "2" heat pipes ( Figure 11 third column) is the embodiment of Figure 1 -Figure 5, and the embodiment associated with "4" heat pipes ( Figure 11 second column) is the embodiment of Figures 6 - 1 0. The row "temperature difference across the blade" associated with the "4" heat pipe embodiment refers to the temperature difference between the first edge region and the second edge region (or the first planar region and the second planar region) of each of the hierarchical microchannel apparatus 681 and 682 and. In essence, it is the temperature difference across the fluid cross-section flowing through the apparatus 681 and 682 and. Similarly, the row "temperature difference across the blade" associated with the "2" heat pipe embodiment refers to the temperature difference between the first edge region and the second edge region of the hierarchical microchannel apparatus 181and 182 the temperature difference between the first and second edge regions (or the first and second planar regions) of each of 181 and 182 across the fluid flowing through the device. As Figure 11 shown, using additional heat pipes has the effect of reducing the temperature difference across the fluid flow cross-section.

[0043] Figures 12A - 12C Another embodiment consistent with the present disclosure is shown. The device 1200 includes a test socket 1210 , a plenum 1290, and the device 1250 . The test socket 1210 is a test socket for a microprocessor. In Figure 12A and Figure 12B , the test socket 1210 is closed, while in Figure 12C , the test socket 1210 is open.

[0044] Figures 12A - 12B The plane associated with the heat source in 1210 is the plane associated with the top of the test socket

[0045] Figures 13A - 13E The plenum 1290 is shown in more detail in Figure 13A shows the plenum 1290 as viewed from outside the structure. Figure 13B shows a cross-sectional view of the plenum 1290 and shows a first exhaust region 1291, a second exhaust region 1292, and an inlet region 1293. Arrows 1201, as well as arrows 1202 and 1203, generally show the flow of fluid (such as air, etc.) through the plenum 1290. Specifically, the fluid can be drawn into the plenum 1290 and into the region 1293 (as discussed further below). This can be achieved by introducing a slight negative pressure (for example) in the exhaust region 1291 and the exhaust region 1292, such as by using a fan, etc. The outlet regions 1296 and 1297 are also shown.

[0046] Unlike the embodiment of Figures 1 - 1 0, the device 1250 incorporates a plurality of elevated hierarchical microchannel devices. This is shown in Figures 14A - 14D . As Figure 12A and Figure 12B shown, the test socket 1210 is shown in a closed configuration. Figure 14D provides a "top" view and shows four hierarchical microchannel devices 1481 , 1482 , 1483and 1484 As previously described, the hierarchical microchannel device 1481 、 1482 、 1483 and 1484 (e.g.) may include stacked vanes (or a folded sheet forming the stacked vanes). Unlike the Figures 1 - 1 0 embodiment, where the fluid inlet into the hierarchical microchannel device is located on the 100 and 600 sides of the device (and the fluid outlets are the chimneys 190 and 690, respectively), the fluid inlet of the device 1250 is in the region 1480 between the steam chamber 1460 (or steam chambers 1460) and the hierarchical microchannel device 1481 、 1482 、 1483 and 1484 “bottom”. The fluid outlets are located “above” the hierarchical microchannel device 1481 、 1482 、 1483 and 1484 . Each of the hierarchical microchannel devices 1481 、 1482 、 1483 and 1484 is configured to allow fluid to flow from region 1480 to region 1487.

[0047] Returning to FIG. 12, when the static pressure chamber 1290 is located above the hierarchical microchannel device 1481 、 1482 、 1483 and 1484 , introducing a lower pressure in the exhaust regions 1291 and 1292 will cause fluid (such as air, etc.) to flow from region 1480 to region 1487.

[0048] As previously described, the plane associated with the heat source is the “top” portion of the test socket 1210 . As Figure 14C shown, the steam chamber 1460 (or steam chambers 1460) can be fixed or adhered to this region, thus making thermal contact with the “top” of the test socket 1210 . Additionally, as Figures 14A - 14D shown, multiple heat pipes 1420 make thermal contact with both the “top” of the test socket 1210 and the steam chamber 1460 . As further described below, and as generally shown in Figures 14A - 14D , multiple heat pipes 1420 elevate and support multiple hierarchical microchannel devices 1481 、 1482 、 1483 and 1484 . Additionally, asFigures 14A - 14D As shown, multiple heat pipes 1420 each extend along a first or second edge of one of a plurality of layered microchannel devices 1481 , 1482 , 1483 and 1484 . Additionally, a subset of the multiple heat pipes 1420 can be configured to be along a first edge of one layered microchannel device (referred to as device 1482 ) and also along a second edge of another layered microchannel device (referred to as device 1481 ). In this way, heat from the plane defined by the vapor chamber 1460 can be distributed to the edges of the plurality of layered microchannel devices 1481 , 1482 , 1483 and 1484 .

[0049] Figures 15A - 15D A further view of the device 1210 without a test socket 1250 is provided.

[0050] Those of ordinary skill in the art will understand that the device 1200 (including the test socket 1210 , the static pressure chamber 1290, and the device 1250 ) can be configured such that the test socket 1210 can be opened to allow insertion of a microprocessor (as Figure 12C shown). That is, the plurality of layered microchannel devices 1481 , 1482 , 1483 and 1484 as well as the extent of the static pressure chamber 1290 do not obstruct the (e.g.,) 90-degree "open" configuration of the test socket 1210 . Although Figures 12A - 12B , Figures 14A - 14D and Figures 15A - 15D show configurations related to the plurality of layered microchannel devices 1481 , 1482 , 1483 and 1484 as supporting an approximately "square" area, those of ordinary skill in the art will understand that other non-square configurations are possible. Additionally, although Figures 12A - 12B and Figures 14A - 14D show the device 1250 adhered to (or otherwise in thermal contact with) the test socket device 1210 , those of ordinary skill in the art will understand that the device 1250 does not have to be used with the test socket. Instead, the device 1250The vapor chamber 1460 may be directly adhered or otherwise configured so that it is in thermal contact with the top of the microprocessor (which defines a plane relative to the heat source).

[0051] Figures 16 and 17 show another embodiment consistent with the elevated embodiment, namely the device 1650 , which includes a device for multiple layered microchannels 1681 、 1682 and 1683 As mentioned above, the hierarchical microchannel device 1681 、 1682 and 1683 For example, it may include stacked blades (or folded sheets forming stacked blades). 1620 Also shown as elevated, they are both from the steam room 1660 Transfer heat and support multiple layered microchannel devices 1681 、 1682 and 1683 . Figure 16B Provides a side view, Figure 17A Provides a "section" view from an angled perspective, Figure 17B shows a "cutaway" view from a side perspective, and Figure 17C A "top" perspective view of a "section" drawing is provided.

[0052] Figures 18A - 18C Provides an embodiment 1800 A view that includes servers 1890 and the server 1890 6 CPUs are adhered to or otherwise thermally contacted by the device 1650 Consistent 6 examples.

[0053] like Figure 18C As shown, the device 1650 Each of these can be extended to connect to the server 1890 Above the associated tray. Figure 19 As shown, the device 1650 The vertical extension of each allows for equipment 1800 Construct a complete static pressure chamber area. Specifically, Figure 19 As shown, the housing 1900 may include a 1650 When the housing 1900 is fixed to the device 1800 When the device is closed, the formation of a low pressure area above the housing 1900 can induce fluid flow (such as air) to follow the paths shown by arrows 1901 and 1902. Specifically, air can enter the device as shown by arrow 1901. 1800 , when the shell 1900 Placed on the device 1800When above, the only available path for air flow (in the low-pressure region above the outer shell 1900) is through each of the 1650 stratified microchannel devices.

[0054] Although the present disclosure utilizes a stratified microchannel device, those of ordinary skill in the art will understand that the configurations disclosed herein can be applied to any device capable of cooling a single planar region, where at least two planes are available for heat transfer to the cooling device.

[0055] For those skilled in the art, other embodiments of the present invention will be apparent from consideration of the specification and practice of the embodiments disclosed herein. It is intended that the specification and examples be considered only exemplary, with the true scope and spirit of the invention being indicated by the following claims.

Claims

1. An apparatus for extended heat transfer from a hot plane, the apparatus comprising: At least one cooling device configured to transfer heat to a fluid, wherein the cooling device is characterized in that at least two heat-conducting planes define a channel for the fluid flow, and wherein a material associated with the at least two heat-conducting planes can transfer thermal energy to the fluid through the channel; and At least one heat pipe in direct thermal contact with the hot plane; Wherein one of the at least two heat-conducting planes is aligned with and in direct thermal contact with the hot plane; and Wherein the other of the at least two heat-conducting planes is in direct thermal contact with the heat pipe.

2. The apparatus according to claim 1, further comprising a second heat pipe in direct thermal contact with the hot plane; Among them, The at least one cooling device includes at least a second cooling device configured to transfer heat to the fluid, wherein the second cooling device is characterized in that at least two heat-conducting planes define a second channel for the fluid flow, and wherein a second material associated with the at least two heat-conducting planes of the second cooling device can transfer thermal energy to the fluid through the second channel; Wherein one of the at least two heat-conducting planes of the second cooling device is aligned with and in direct thermal contact with the hot plane; and Wherein the other of the at least two heat-conducting planes of the second cooling device is in direct thermal contact with the second heat pipe.

3. An apparatus for extended heat transfer from a hot plane, the apparatus comprising: At least one cooling device configured to transfer heat to a fluid, wherein the cooling device is characterized in that at least two heat-conducting planes define a channel for the fluid flow, and wherein a material associated with the at least two heat-conducting planes can transfer thermal energy to the fluid through the channel, and wherein the channel includes an inlet portion and an outlet portion; and At least two heat pipes, each of the heat pipes being in direct thermal contact with the hot plane; Wherein one of the at least two heat-conducting planes is in direct thermal contact with at least one of the at least two heat pipes; Wherein the other of the at least two heat-conducting planes is in direct thermal contact with the other of the at least two heat pipes; and Wherein the hot plane is substantially parallel to the cross-section of the channel, and wherein the inlet region is close to the hot plane.

4. The apparatus according to claim 1, further comprising a vapor chamber in direct thermal contact with the hot plane; Among them, The vapor chamber is in direct thermal contact with one of the at least two heat-conducting planes; and Wherein the vapor chamber is in direct thermal contact with the at least one heat pipe.

5. The device according to claim 4, wherein The vapor chamber includes copper.

6. The device according to claim 1, wherein, The at least one heat pipe includes copper.

7. The apparatus according to claim 1, wherein, The fluid is air.

8. The apparatus according to claim 1, wherein The hot plane is defined by the surface of a microprocessor.

9. The apparatus according to claim 2, further comprising a vapor chamber in direct thermal contact with the hot plane; Among them, The vapor chamber is in direct thermal contact with one of the at least two heat-conducting planes of the at least one cooling device; And Wherein the vapor chamber is in direct thermal contact with the at least one heat pipe.

10. The apparatus according to claim 9, further comprising a second vapor chamber in direct thermal contact with the thermal plane; Among them, The second vapor chamber is in direct thermal contact with one of at least two heat conducting planes of the second cooling device; And wherein, the second vapor chamber is in direct thermal contact with the second heat pipe.

11. The device according to claim 10, wherein, The vapor chamber and the second vapor comprise copper.

12. The apparatus according to claim 2, wherein, The second heat pipe comprises copper.

13. The device according to claim 2, wherein The fluid is air.

14. The device according to claim 2, wherein, The thermal plane is defined by the surface of a microprocessor.

15. The apparatus according to claim 3, further comprising a vapor chamber in direct thermal contact with the thermal plane; Among them, The vapor chamber is in direct thermal contact with each of the at least two heat pipes.

16. The apparatus according to claim 15, wherein The vapor chamber comprises copper.

17. The device according to claim 3, wherein, Each of the at least two heat pipes comprises copper.

18. The apparatus according to claim 3, wherein, The fluid is air.

19. The device according to claim 3, wherein, The thermal plane is defined by the surface of a microprocessor.

20. The apparatus according to claim 3, wherein The thermal plane is defined by the surface of a test socket.

21. The apparatus according to claim 3, further comprising a plenum chamber surrounding at least a portion of the at least one cooling device; Among them, The plenum chamber includes at least one exhaust region and an inflow region, wherein the inflow region is adjacent to the at least one cooling device; wherein, the plenum chamber is configured to: by introducing a lower pressure in the at least one exhaust region, be able to induce fluid to flow from the inlet region through the at least one cooling device to the inflow region.

22. The apparatus according to claim 21, further comprising a fan within the at least one exhaust region, the fan being able to introduce the lower pressure into the at least one exhaust region.

23. The apparatus according to claim 3, further comprising a server, the server including a board, the board including at least one processor, the at least one processor defining the thermal plane; and further comprising a server housing configured to be mounted above the board and configured with a cutout such that the at least one cooling device extends above the server housing into a housing region; Among them, The server housing is configured to: by introducing a lower pressure in the housing region, be able to induce fluid to flow from the inlet region through the at least one cooling device to the housing region.

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