Semiconductor wafer cleaning and recycling equipment and recycling method thereof

Abstract

The present invention relates to the field of wafer cleaning and recycling technology, and discloses a semiconductor wafer cleaning and recycling equipment, comprising: a collecting trough, a filter, a waste trough and a cleaning component, wherein a discharge pipe is installed at the bottom of the collecting trough, and the discharge pipe is connected with the lowest point of the bottom of the collecting trough; the filter is fixedly installed in the collecting trough, and the filter covers the bottom of the collecting trough, and the filter can filter the cleaning agent passing through its surface; the waste trough is annular and can be detachably installed on the inner wall of the collecting trough, and the surface of the filter is connected with the upper opening of the waste trough, and the inner bottom surface of the waste trough is provided with a penetrating filter hole; the cleaning component can scrape and clean the surface of the filter, and the scraped waste will be transported to the waste trough during scraping, and air will be blown from the bottom of the filter to the top of the filter synchronously during scraping; the present application can effectively ensure the recovery of the cleaning outflow of the front-end semiconductor cleaning equipment, and avoid the situation where impurities in the cleaning agent clog the filter and cause poor recovery.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer cleaning and recycling, and more particularly to a semiconductor wafer cleaning and recycling device and a recycling method thereof. Background Art

[0002] In the semiconductor wafer cleaning process, many special cleaning agents are generally used. Most of these cleaning agents are highly corrosive or even toxic. Therefore, these used cleaning agents need to be recycled and then specially treated to meet emission standards for discharge or reuse.

[0003] At present, conventional semiconductor wafer cleaning agent recovery equipment mainly collects through collection tanks and pipes. The general principle is to gather the cleaning agent after cleaning the wafer through the collection tank, and then collect it into a special container through the pipe. Its structure is simple, so it is widely used.

[0004] However, the above-mentioned recycling equipment still has certain defects, namely:

[0005] There is usually a filter at the connection between the collection tank and the pipeline, and most of them are located in the middle of the collection tank to filter impurities in the waste cleaning agent. Under this structure, as impurities accumulate, the filter will be clogged, causing the cleaning agent to remain in the collection tank, ultimately resulting in poor cleaning agent recovery. In addition, if too much cleaning agent remains in the collection tank, it will produce a large amount of toxic and harmful gases after volatilization, which can easily affect the workshop environment. Summary of the Invention

[0006] In order to overcome the above-mentioned defects of the prior art, the present invention provides a semiconductor wafer cleaning and recycling device and a recycling method thereof to solve the problems existing in the above-mentioned background technology.

[0007] The present invention provides the following technical solution: a device for cleaning and recycling semiconductor wafers, comprising:

[0008] The collecting tank has a discharge pipe installed at the bottom thereof, and the discharge pipe is connected to the lowest point of the bottom of the collecting tank;

[0009] The filter is fixedly installed in the collection tank, and the filter covers the bottom of the collection tank. At the same time, the filter can filter the cleaning agent passing through its surface;

[0010] The waste trough is annular and detachably mounted on the inner wall of the collection trough, with the filter surface communicating with the upper opening of the waste trough and a penetrating filter hole being provided on the inner bottom surface of the waste trough;

[0011] The cleaning component includes a scraping component, a discharging component and a back-blowing component. The scraping component can scrape and clean the surface of the filter, and when the scraping component is running, it will drive the discharging component to operate. The operation of the discharging component can transport the waste scraped off the scraping component to the waste trough. At the same time, the operation of the scraping component will also synchronously drive the back-blowing component to operate. The operation of the back-blowing component will blow air from the bottom of the filter to the top of the filter.

[0012] Furthermore, the scraping assembly includes a scraping bar and a driving assembly. The scraping bar is rotatably arranged on the filter screen, and the scraping bar contacts the surface of the filter screen. At the same time, the scraping bar rotates to scrape away the debris trapped on the surface of the filter screen. The driving assembly is connected to the scraping bar, and the scraping bar is driven to rotate by the driving assembly.

[0013] Furthermore, the driving assembly includes a motor and a connecting seat. The motor is fixedly installed on the side of the collecting tank, the connecting seat is rotatably installed in the middle of the filter, the scraper bar is fixedly connected to the surface of the connecting seat, and the output end of the motor and the rotating shaft of the connecting seat are transmitted through the engagement of two transmission bevel gears. A protective box is fixedly installed inside the collecting tank, which is located below the filter, and the two transmission bevel gears are both installed in the protective box.

[0014] Furthermore, the discharge assembly includes an auger, a mounting frame and a transmission assembly. The mounting frame is fixedly mounted on the scraper bar and can move synchronously with the scraper bar. The auger is rotatably mounted on the mounting frame, and when the scraper bar rotates, the debris scraped from the filter screen will gather in the middle of the mounting frame. The mounting frame is provided with a discharge port at the end near the waste trough, and the rotation of the auger will drive the debris in the mounting frame to be discharged from the discharge port and flow into the waste trough. The transmission assembly is installed between the auger shaft and the connecting seat, and when the connecting seat rotates, it will drive the auger to rotate through the transmission assembly.

[0015] Furthermore, the transmission assembly includes a fixed bevel gear and a rotating bevel gear, and a cavity is provided inside the connecting seat. The fixed bevel gear and the rotating bevel gear are both installed in the cavity. The rotating shaft of the fixed bevel gear extends to the bottom of the collecting tank and is fixedly connected to the collecting tank. The rotating bevel gear is connected to the connecting seat and moves synchronously with the connecting seat, and the rotating bevel gear can also rotate around its own rotating shaft. The fixed bevel gear and the rotating bevel gear are engaged with each other. At the same time, the rotating shaft of the auger extends into the cavity and is coaxially connected to the rotating shaft of the rotating bevel gear.

[0016] Furthermore, the backblowing assembly includes an air blowing pipe and an air supply assembly. The air blowing pipe is fixedly connected to the connecting seat and is located below the filter. A number of air outlet holes are provided on the surface of the air blowing pipe, and the air outlet holes are facing the filter. The air supply assembly is connected between the air blowing pipe and the external compressed air, and when the air blowing pipe rotates with the connecting seat, the external compressed air can be supplied to the air blowing pipe through the air supply assembly.

[0017] Furthermore, the air supply component includes an air supply pipeline, which is opened in the fixed bevel gear shaft, and the bottom end of the air supply pipeline is connected to the external compressed air. The fixed bevel gear and the connecting seat shaft are coaxial, and the connecting seat can rotate on the fixed bevel gear shaft. A connecting component is provided between the air supply pipeline and the blowing pipe, and when the connecting seat rotates on the fixed bevel gear, the connecting component can keep the air supply pipeline and the blowing pipe connected.

[0018] Furthermore, the connecting component includes two sealing plates, both of which are fixedly installed inside the connecting seat. The air supply pipeline seal is rotated through the middle of the two sealing plates. At the same time, a connecting cavity is formed between the two sealing plates, the inner wall of the connecting seat and the outer wall of the fixed bevel gear shaft. The air blowing pipe is connected to the connecting cavity. A through hole is opened on the surface of the fixed bevel gear in the connecting cavity, and the through hole connects the air supply pipeline to the connecting cavity.

[0019] Furthermore, a protective net is provided in the middle of the collecting trough, and the protective net can be detachably mounted on the waste trough.

[0020] A recovery method for cleaning and recycling semiconductor wafers, based on the above-mentioned device for cleaning and recycling semiconductor wafers, comprises:

[0021] S1, installing a collecting tank below the semiconductor wafer cleaning agent to be collected and allowing the cleaning agent to flow into the collecting tank;

[0022] S2, start the cleaning component.

[0023] The present application provides a filter that can cover the entire bottom surface of the collection tank, which can effectively increase the filtering area of ​​the cleaning agent, ensuring that when a part of the filter is blocked, there is still enough passing area to ensure the normal passage of the cleaning agent, effectively ensuring the recovery stability of the front-end semiconductor cleaning agent. In addition, the scraping component can also be used to scrape and clean the surface of the filter, and the operation of the scraping component will drive the discharge component to transport the debris scraped by the scraping component to the waste tank to further ensure the cleanliness of the filter. At the same time, the operation of the scraping component will also drive the back-blowing component to blow air to the filter to blow out the debris stuck in the middle of the filter mesh, thereby further improving the cleanliness of the filter, and further improving the stability of the front-end cleaning agent recovery. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic diagram of the three-dimensional structure of the present invention from a first viewing angle;

[0025] Figure 2 This is a schematic diagram of the three-dimensional structure of the present invention from a second viewing angle;

[0026] Figure 3 This is a schematic diagram of the internal structure of the collecting tank of the present invention;

[0027] Figure 4This is a schematic diagram of the internal structure of the collecting tank of the present invention;

[0028] Figure 5 For the present invention Figure 4 A in the middle is an enlarged structural diagram;

[0029] Figure 6 For the present invention Figure 5 The enlarged structural diagram at C in the middle;

[0030] Figure 7 For the present invention Figure 4 The enlarged structural diagram at B in the middle;

[0031] Figure 8 It is a schematic diagram of the three-dimensional structure of the scraping component of the present invention.

[0032] The accompanying drawings are:

[0033] 100. Collection trough; 110. Discharge pipe; 200. Filter; 300. Waste trough; 400. Scraping assembly; 410. Scraping bar; 420. Drive assembly; 421. Motor; 422. Connecting seat; 423. Transmission bevel gear; 424. Protection box; 500. Discharge assembly; 510. Auger; 520. Mounting frame; 530. Transmission assembly; 540. Discharge port; 531. Fixed bevel gear; 532. Rotating bevel gear; 600. Backflush assembly; 610. Air blow pipe; 620. Air supply assembly; 630. Connecting assembly; 621. Air supply pipeline; 631. Sealing plate; 632. Connecting cavity; 633. Through hole; 700. Protective net. DETAILED DESCRIPTION

[0034] The technical solutions of the present invention will be clearly and completely described below in conjunction with the drawings in the present invention. In addition, the forms of the various structures described in the following embodiments are merely examples and are not limited to the various structures described in the following embodiments. All other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0035] Reference Figure 3-6The present invention provides a semiconductor wafer cleaning and recycling device, comprising: a collecting tank 100, a filter screen 200, a waste tank 300 and a cleaning component. A discharge pipe 110 is installed at the bottom of the collecting tank 100, and the discharge pipe 110 is connected to the lowest point of the bottom of the collecting tank 100; the filter screen 200 is fixedly installed in the collecting tank 100, and the filter screen 200 covers the bottom of the collecting tank 100, and the filter screen 200 can filter the cleaning agent passing through its surface; the waste tank 300 is annular and can be detachably installed on the inner wall of the collecting tank 100, and the surface of the filter screen 200 is connected to the waste tank 300. 0 is connected, and a penetrating filter hole is provided on the inner bottom surface of the waste trough 300; the cleaning component includes a scraping component 400, a discharging component 500 and a back-blowing component 600. The scraping component 400 can scrape and clean the surface of the filter screen 200, and the operation of the scraping component 400 will drive the discharging component 500 to operate. The operation of the discharging component 500 can transport the waste scraped off by the scraping component 400 to the waste trough 300. At the same time, the operation of the scraping component 400 will also synchronously drive the operation of the back-blowing component 600, and the operation of the back-blowing component 600 will blow air from the bottom of the filter screen 200 to the top of the filter screen 200.

[0036] During use, it is only necessary to install the collection tank 100 below the semiconductor wafer cleaning agent that needs to be collected and allow the cleaning agent to flow into the collection tank 100. After that, the used semiconductor cleaning agent will fall into the collection tank 100 and pass through the filter 200 to flow into the bottom of the collection tank 100, and finally flow out from the discharge pipe 110. In this process, when the cleaning agent passes through the surface of the filter 200, the photoresist, wafer fragments and other impurities doped in the cleaning agent will be intercepted by the filter 200 on its surface, and since the filter 200 directly covers the entire bottom of the collection tank 100, its filtration area is greatly increased. In this way, the passing efficiency of the cleaning agent on the filter 200 can be guaranteed for a long time, ensuring the stable recovery of the cleaning agent.

[0037] In addition, during the recycling process, the surface of the filter 200 can be scraped and cleaned by the scraping component 400, and the operation of the scraping component 400 will drive the discharge component 500 to transport the debris scraped by the scraping component 400 to the waste trough 300 to further ensure the cleanliness of the filter 200. At the same time, the operation of the scraping component 400 will also drive the back-blowing component 600 to blow air to the filter 200 to blow out the debris stuck in the middle of the mesh of the filter 200, thereby further improving the cleanliness of the filter 200, and further improving the stability of the front-end cleaning agent recovery.

[0038] The middle of the filter 200 is a concave structure, so that impurities on the filter 200 can be gathered toward the middle, thereby ensuring that the surrounding area is clean, ensuring that the cleaning agent can pass smoothly without aggregation, and facilitating the recovery of the cleaning agent.

[0039] like Figure 5and Figure 6 As shown, the scraping assembly 400 includes a scraping bar 410 and a driving assembly 420. The scraping bar 410 is rotatably set on the filter 200, and the scraping bar 410 is in contact with the surface of the filter 200. At the same time, the scraping bar 410 rotates to scrape away the trapped debris on the surface of the filter 200. The driving assembly 420 is connected to the scraping bar 410, and the scraping bar 410 is driven to rotate by the driving assembly 420.

[0040] In this way, it is only necessary to start the driving component 420 to drive the scraper 410 to rotate, and the scraper 410 can scrape away the debris intercepted by the filter 200, thereby ensuring that most of the area on the filter 200 is clean, further ensuring the filtering capacity of the filter 200, and thus ensuring the normal recovery of the cleaning agent.

[0041] like Figure 4 、 Figure 5 and Figure 6 As shown, the drive assembly 420 includes a motor 421 and a connecting seat 422. The motor 421 is fixedly installed on the side of the collection tank 100, and the connecting seat 422 is rotatably installed in the middle of the filter 200. The scraper 410 is fixedly connected to the surface of the connecting seat 422, and the output end of the motor 421 and the rotating shaft of the connecting seat 422 are transmitted through the engagement of two transmission bevel gears 423. A protective box 424 is fixedly installed inside the collection tank 100, which is below the filter 200, and the two transmission bevel gears 423 are both installed in the protective box 424.

[0042] In this way, it is only necessary to start the motor 421 , which will drive the transmission bevel gear 423 to rotate, thereby driving the connecting base 422 to rotate, and the rotation of the connecting base 422 will drive the scraper 410 to rotate.

[0043] like Figure 5 、 Figure 6 Figure 7 As shown, the discharge assembly 500 includes an auger 510, a mounting frame 520 and a transmission assembly 530. The mounting frame 520 is fixedly mounted on the scraper bar 410 and can move synchronously with the scraper bar 410. The auger 510 is rotatably mounted on the mounting frame 520, and when the scraper bar 410 rotates, the debris scraped from the filter 200 will gather in the middle of the mounting frame 520. The mounting frame 520 is provided with a discharge port 540 at the end near the waste trough 300, and the rotation of the auger 510 will drive the debris in the mounting frame 520 to be discharged from the discharge port 540 and flow to the waste trough 300. The transmission assembly 530 is installed between the rotating shaft of the auger 510 and the connecting seat 422, and when the connecting seat 422 rotates, it will drive the auger 510 to rotate through the transmission assembly 530.

[0044] In this way, when the connecting seat 422 rotates, the auger 510 will be driven to rotate through the transmission assembly 530. The rotation of the auger 510 will push the debris in the middle of the mounting frame 520 toward the waste trough 300 and discharge it from the discharge port 540 into the waste trough 300, thereby realizing automatic cleaning of the surface of the filter 200, ensuring that the filter 200 can be kept clean for a long time, and further ensuring that the cleaning agent can be stably recovered.

[0045] like Figure 5 and Figure 6 As shown, the transmission assembly 530 includes a fixed bevel gear 531 and a rotating bevel gear 532. A cavity is provided inside the connecting seat 422. The fixed bevel gear 531 and the rotating bevel gear 532 are both installed in the cavity. The rotating shaft of the fixed bevel gear 531 extends to the bottom of the collecting tank 100 and is fixedly connected to the collecting tank 100. The rotating bevel gear 532 is connected to the connecting seat 422 and moves synchronously with the connecting seat 422. The rotating bevel gear 532 can also rotate around its own rotating shaft. The fixed bevel gear 531 and the rotating bevel gear 532 are engaged with each other. At the same time, the rotating shaft of the auger 510 extends into the cavity and is coaxially connected to the rotating shaft of the rotating bevel gear 532.

[0046] In this way, when the connecting seat 422 drives the scraper 410 to move, it will also synchronously drive the rotating bevel gear 532 connected thereto to move. In this way, under the action of the fixed bevel gear 531, the rotating bevel gear 532 will rotate, thereby driving the auger 510 to rotate.

[0047] Continue as Figure 5 and Figure 6 As shown, the back-blowing assembly 600 includes an air blowing pipe 610 and an air supply assembly 620. The air blowing pipe 610 is fixedly connected to the connecting seat 422 and is located below the filter 200. A plurality of air outlet holes are provided on the surface of the air blowing pipe 610, and the air outlet holes are facing the filter 200. The air supply assembly 620 is connected between the air blowing pipe 610 and the external compressed air. When the air blowing pipe 610 rotates with the connecting seat 422, the external compressed air can be supplied to the air blowing pipe 610 through the air supply assembly 620.

[0048] In this way, when the connecting seat 422 rotates, it will also drive the blowing pipe 610 to rotate synchronously. In this way, the external compressed air will enter the blowing pipe 610 through the air supply component 620, and finally be blown out from the air outlet on the blowing pipe 610 to clean the filter 200 again. It can blow out the debris stuck in the middle of the mesh of the filter 200, further ensure that the cleaning agent can pass through the filter 200 stably, and further improve the recovery stability of the cleaning agent.

[0049] Continue as Figure 5 and Figure 6As shown, the air supply component 620 includes an air supply pipeline 621, which is opened in the rotating shaft of the fixed bevel gear 531. At the same time, the bottom end of the air supply pipeline 621 is connected to the external compressed air. The fixed bevel gear 531 is coaxial with the rotating shaft of the connecting seat 422. At the same time, the connecting seat 422 can rotate on the rotating shaft of the fixed bevel gear 531. A connecting component 630 is provided between the air supply pipeline 621 and the air blowing pipe 610, and when the connecting seat 422 rotates on the fixed bevel gear 531, the connecting component 630 can keep the air supply pipeline 621 and the air blowing pipe 610 connected.

[0050] In this way, compressed air only needs to be introduced into the air supply line 621 , and the compressed air will enter the air blowing pipe 610 through the air supply line 621 and remain connected during the continuous rotation of the connecting seat 422 .

[0051] Continue as Figure 5 and Figure 6 As shown, the connecting component 630 includes a sealing plate 631, which has two sealing plates 631 and is fixedly installed inside the connecting seat 422. The air supply pipe 621 is sealed and rotated through the middle of the two sealing plates 631. At the same time, a connecting cavity 632 is formed between the two sealing plates 631, the inner wall of the connecting seat 422 and the outer wall of the rotating shaft of the fixed bevel gear 531. The air blowing pipe 610 is connected to the connecting cavity 632. A through hole 633 is provided on the surface of the fixed bevel gear 531 in the connecting cavity 632, and the through hole 633 connects the air supply pipe 621 with the connecting cavity 632.

[0052] In this way, part of the compressed air will enter the connecting cavity 632 from the air supply line 621, and then enter the air blowing pipe 610. During this process, since the rotating shaft of the fixed bevel gear 531 and the sealing plate 631 are rotatably connected, the through hole 633 connects the air supply line 621 and the connecting cavity 632. Therefore, when the connecting seat 422 rotates, the connection between the air supply line 621 and the air blowing pipe 610 can also be guaranteed.

[0053] like Figure 2 As shown, a protective net 700 is provided in the middle of the collection trough 100, and the protective net 700 can be detachably mounted on the waste trough 300. The protective net 700 can prevent things from falling into the collection trough 100 and directly falling on the surface of the filter 200, preventing them from being damaged by the rotating scraper 410, and also plays a role in protecting the scraper 410.

[0054] Therefore, the complete usage process is to first install the collection tank 100 under the semiconductor cleaning agent that needs to be collected. After that, the semiconductor cleaning agent that needs to be collected will fall into the collection tank 100, then pass through the filter 200 and flow into the bottom of the collection tank 100, and finally flow out from the discharge pipe 110. In this process, when the cleaning agent passes through the surface of the filter 200, the photoresist, wafer fragments and other impurities doped in the cleaning agent will be intercepted by the filter 200 on its surface, and because the filter 200 directly covers the entire bottom of the collection tank 100, its filtration area is greatly increased. In this way, the passing efficiency of the cleaning agent on the filter 200 can be guaranteed for a long time, ensuring the stable recovery of the cleaning agent.

[0055] In addition, during the recycling process, the motor 421 can also be started. The motor 421 will drive the transmission bevel gear 423 to rotate, and then drive the connecting seat 422 to rotate. The rotation of the connecting seat 422 will drive the scraper 410 to rotate. The rotation of the scraper 410 will scrape away the debris intercepted on the filter 200, thereby gathering most of the impurities on the filter 200 at the front end of the movement direction of the scraper 410, thereby ensuring that most of the area on the filter 200 is clean, further ensuring the filtering capacity of the filter 200, and thus ensuring the normal recovery of the cleaning agent.

[0056] When the scraper 410 rotates, when a certain amount of debris accumulates at the front end of the scraper 410 in the direction of movement, these debris will enter the mounting bracket 520, and the rotation of the scraper 410 will synchronously drive the mounting bracket 520 to move, and the mounting bracket 520 will synchronously drive the auger 510 to move. At the same time, when the connecting seat 422 drives the scraper 410 to move, it will also synchronously drive the rotating bevel gear 532 connected to it to move. In this way, under the action of the fixed bevel gear 531, the rotating bevel gear 532 will rotate, thereby driving the auger 510 to rotate. The rotation of the auger 510 will push the debris in the middle of the mounting bracket 520 toward the waste trough 300, and discharge it from the discharge port 540 into the waste trough 300, so as to realize automatic cleaning of the surface of the filter 200, ensure that the filter 200 can be kept clean for a long time, and further ensure that the cleaning agent can be stably recovered.

[0057] In addition, when the connecting seat 422 rotates, it will also drive the air blowing pipe 610 to rotate synchronously. In this way, the external compressed air will enter the connecting cavity 632 from the air supply pipe 621, and then enter the air blowing pipe 610, and finally be blown out from the air outlet on the air blowing pipe 610 to clean the filter 200 again. It can blow out the debris stuck in the middle of the mesh of the filter 200, further ensure that the cleaning agent can pass through the filter 200 stably, and further improve the recovery stability of the cleaning agent.

[0058] A recovery method for cleaning and recycling semiconductor wafers, based on the above-mentioned device for cleaning and recycling semiconductor wafers, comprises:

[0059] S1, installing a collecting tank 100 below the semiconductor wafer cleaning agent to be collected and allowing the cleaning agent to flow into the collecting tank 100;

[0060] S2, start the cleaning component.

[0061] Finally, it should be noted that the drawings of the embodiments disclosed herein only relate to structures related to the embodiments disclosed herein. Other structures may refer to conventional designs. The same embodiment and different embodiments of the present invention may be combined with each other without conflict.

[0062] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A semiconductor wafer cleaning and recycling device, characterized in that: include: A collecting tank (100) is provided with a discharge pipe (110) at the bottom thereof, and the discharge pipe (110) is communicated with the lowest point of the bottom of the collecting tank (100); A filter screen (200) is fixedly mounted in the collecting tank (100), and the filter screen (200) covers the bottom of the collecting tank (100), and the filter screen (200) can filter the cleaning agent passing through its surface; The waste trough (300) is annular and detachably mounted on the inner wall of the collecting trough (100); the surface of the filter screen (200) is in communication with the upper opening of the waste trough (300); and the inner bottom surface of the waste trough (300) is provided with a penetrating filter hole; A cleaning component, comprising a scraping component (400), a discharging component (500) and a back-blowing component (600), wherein the scraping component (400) can scrape and clean the surface of the filter screen (200), and when the scraping component (400) is in operation, it drives the discharging component (500) to operate, and the operation of the discharging component (500) can transport the waste scraped from the scraping component (400) to the waste trough (300), and the operation of the scraping component (400) synchronously drives the back-blowing component (600) to operate, and the back-blowing component (600) blows air from the bottom of the filter screen (200) to the top of the filter screen (200); The scraping assembly (400) includes a scraping bar (410) and a driving assembly (420). The scraping bar (410) is rotatably arranged on the filter screen (200), and the scraping bar (410) contacts the surface of the filter screen (200). The scraping bar (410) rotates to scrape away debris trapped on the surface of the filter screen (200). The driving assembly (420) is connected to the scraping bar (410), and the scraping bar (410) is driven to rotate by the driving assembly (420). The driving assembly (420) includes a motor (421) and a connecting seat (422), wherein the motor (421) is fixedly mounted on the side of the collecting tank (100), and the connecting seat (422) is rotatably mounted in the middle of the filter screen (200). The scraper (410) is fixedly connected to the surface of the connecting seat (422), and the output end of the motor (421) and the rotating shaft of the connecting seat (422) are meshed with two transmission bevel gears (423) to achieve transmission. A protection box (424) is fixedly mounted inside the collecting tank (100) and is located below the filter screen (200), and the two transmission bevel gears (423) are both mounted in the protection box (424); The discharge assembly (500) includes an auger (510), a mounting frame (520) and a transmission assembly (530), wherein the mounting frame (520) is fixedly mounted on the scraper (410) and can move synchronously with the scraper (410), the auger (510) is rotatably mounted on the mounting frame (520), and when the scraper (410) rotates, debris scraped from the filter (200) is gathered in the middle of the mounting frame (520), and an end of the mounting frame (520) close to the waste trough (300) is provided with a discharge port (540), and the rotation of the auger (510) drives the debris in the mounting frame (520) to be discharged from the discharge port (540) and flow into the waste trough (300), and the transmission assembly (530) is mounted between the rotating shaft of the auger (510) and the connecting seat (422), and when the connecting seat (422) rotates, the auger (510) is driven to rotate through the transmission assembly (530); The transmission assembly (530) includes a fixed bevel gear (531) and a rotating bevel gear (532). A cavity is provided inside the connecting seat (422). The fixed bevel gear (531) and the rotating bevel gear (532) are both installed in the cavity. The rotating shaft of the fixed bevel gear (531) extends to the bottom of the collecting tank (100) and is fixedly connected to the collecting tank (100). The rotating bevel gear (532) is connected to the connecting seat (422) and moves synchronously with the connecting seat (422). The rotating bevel gear (532) can also rotate around its own rotating shaft. The fixed bevel gear (531) and the rotating bevel gear (532) are meshed with each other. At the same time, the rotating shaft of the auger (510) extends into the cavity and is coaxially connected to the rotating shaft of the rotating bevel gear (532). The back-blowing assembly (600) includes an air blowing pipe (610) and an air supply assembly (620). The air blowing pipe (610) is fixedly connected to the connecting seat (422) and is located below the filter (200). A plurality of air outlet holes are provided on the surface of the air blowing pipe (610), and the air outlet holes face the filter (200). The air supply assembly (620) is connected between the air blowing pipe (610) and external compressed air. When the air blowing pipe (610) rotates with the connecting seat (422), external compressed air can be supplied to the air blowing pipe (610) through the air supply assembly (620).

2. The semiconductor wafer cleaning and recycling equipment according to claim 1, characterized in that: The air supply assembly (620) includes an air supply pipeline (621), which is opened in the rotating shaft of the fixed bevel gear (531). At the same time, the bottom end of the air supply pipeline (621) is connected to the external compressed air. The fixed bevel gear (531) and the connecting seat (422) are coaxial. At the same time, the connecting seat (422) can rotate on the rotating shaft of the fixed bevel gear (531). A connecting assembly (630) is provided between the air supply pipeline (621) and the air blowing pipe (610). When the connecting seat (422) rotates on the fixed bevel gear (531), the connecting assembly (630) can keep the air supply pipeline (621) and the air blowing pipe (610) connected.

3. The semiconductor wafer cleaning and recycling equipment according to claim 2, characterized in that: The communication component (630) includes two sealing plates (631), and both sealing plates (631) are fixedly installed inside the connecting seat (422). The air supply pipeline (621) is sealed and rotated through the middle of the two sealing plates (631). At the same time, a communication cavity (632) is formed between the two sealing plates (631), the inner wall of the connecting seat (422), and the outer wall of the rotating shaft of the fixed bevel gear (531). The air blowing pipe (610) is connected to the communication cavity (632). A through hole (633) is opened on the surface of the fixed bevel gear (531) in the communication cavity (632), and the through hole (633) allows the air supply pipeline (621) to be connected to the communication cavity (632).

4. The semiconductor wafer cleaning and recycling equipment according to claim 3, characterized in that: A protective net (700) is provided in the middle of the collecting trough (100), and the protective net (700) is detachably mounted on the waste trough (300).

5. A method for cleaning and recycling semiconductor wafers, using the semiconductor wafer cleaning and recycling apparatus according to any one of claims 1 to 4, the method comprising: S1, installing a collection tank (100) below the semiconductor wafer cleaning agent to be collected and allowing the cleaning agent to flow into the collection tank (100); S2, start the cleaning component.

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