Patch welding device and method for double-sided copper substrate processing

Abstract

The invention relates to the technical field of copper substrate processing, in particular to a patch welding device and method for double-sided copper substrate processing, which comprises a stand column, a turnover motor is mounted on the back of the stand column, an output shaft of the turnover motor is connected with a turnover table, and a mechanical arm is mounted on the upper portion of the stand column. A feeding and welding integrated mechanism is installed at one end of the mechanical arm, and feeding and welding integration is achieved. The device has the beneficial effects that non-contact clamping control is realized through linkage design of the electromagnetic coil and the magnetic fluid, the conductive plate is triggered to be in contact with the copper ring when the silicon capsule is pressed down, the magnetic fluid is instantly hardened to form a rigid chain-shaped structure after being electrified, the patch is fixed in a flexible wrapping manner, and the magnetic fluid recovers a flowing state after being powered off; the silicon capsule automatically releases the patch, so that rigid impact damage of a mechanical clamping jaw is avoided, and meanwhile, the problem that the suction nozzle cannot suck the patch with the rough surface is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of copper substrate processing, and in particular to a patch welding device and method for processing a double-sided copper substrate. Background Art

[0002] In the field of electronic equipment manufacturing, double-sided copper substrates are widely used in various electronic products due to their excellent heat dissipation, mechanical properties, and electrical performance. The soldering process of double-sided copper substrate processing is a key step in the entire production process, and its processing quality and efficiency directly affect the performance and production cycle of electronic products. As a key device for automating this process, soldering equipment plays a vital role in improving production efficiency and ensuring product quality.

[0003] However, existing double-sided copper substrate processing and soldering equipment presents several pressing issues. Traditional devices typically use a nozzle to pick up the patch and place it on the substrate. However, this method places high demands on the surface flatness of the patch. If the patch surface is not smooth, the nozzle will struggle to generate sufficient suction force, making it impossible to successfully pick up the patch. If attempts are made to replace the nozzle with a robotic gripper, since the patch is generally fragile, the robot can easily damage the patch due to improper gripping force, resulting in the scrapping of the patch, increasing production costs and reducing production efficiency.

[0004] Furthermore, the existing device has irrational workflows. The patch is first placed on the substrate, and then the substrate with the patch is transported to the soldering station for soldering. This step-by-step process prevents the placement of the patch and the soldering process from proceeding simultaneously, and the solder paste applied to the substrate is in a fluid state before soldering. During the substrate transport process, the patch can easily shift on the substrate due to vibrations and shaking. This not only affects the accuracy and stability of soldering, resulting in a decrease in soldering quality, but can also cause problems such as cold solder joints and desoldering, seriously affecting the performance and reliability of the double-sided copper substrate. Summary of the Invention

[0005] The object of the present invention is to provide a patch soldering device and method for processing a double-sided copper substrate to solve the problems raised in the above background technology.

[0006] To achieve the above object, the present invention provides the following technical solutions: A patch welding device for processing double-sided copper substrates includes a column, a flip motor is installed on the back of the column, the output shaft of the flip motor is connected to a flip table, a mechanical arm is installed on the upper part of the column, and a feeding and welding integrated mechanism is installed at one end of the mechanical arm to realize feeding and welding integration; The integrated feeding and welding mechanism includes a hot air blower connected to the robotic arm, the bottom of the hot air blower is connected to a cylinder, the lower end of the cylinder is connected to a limiting shell, the lower end of the limiting shell is connected to a tube body, the lower end of the tube body is connected to a plate body, a cavity is provided inside the plate body, a spiral electromagnetic coil is distributed in the cavity, and a silicon capsule is provided at the bottom of the plate body, the interior of the silicon capsule is filled with magnetic fluid, and the integrated feeding and welding mechanism also includes a triggering part for triggering the hardening of the magnetic fluid.

[0007] The trigger part includes a push rod that slides longitudinally and is inserted into the tube body. The lower end of the push rod is rotatably provided with a base. The bottom of the base is connected to the silicone capsule through a reset spring, and the upper end of the push rod is connected to a conductive plate. The inner wall of the limit shell is provided with a copper ring that is adapted to the size of the outer edge of the conductive plate. When the copper ring is put on the conductive plate, the two contact each other, and at this time a closed loop is formed between the electromagnetic coil, so that the magnetic fluid forms a chain structure along the direction of the magnetic field and hardens.

[0008] Preferably, when the silicon capsule is in a reset state, the conductive plate is located below the copper ring and does not contact it, and the upper and lower parts of the conductive plate are both truncated cone-shaped.

[0009] Preferably, the inner wall of the tube body is provided with a spiral groove, one side of the push rod is located in the tube body and is connected to a limiting rod, and a ball is rotatably provided at one end of the limiting rod away from the push rod, and the ball is rotatably provided in the spiral groove.

[0010] Preferably, the turning platform includes a concave frame connected to the output shaft of the turning motor, hydraulic cylinders are installed on both sides of the concave frame, and the output shafts of the hydraulic cylinders are connected to clamping bars for clamping the copper substrate.

[0011] Preferably, a positioning groove is provided on one side of the clamping strip, and the positioning groove is V-shaped.

[0012] Preferably, the patch welding device for processing the double-sided copper substrate also includes a welding assembly, the welding assembly includes a movable sleeve longitudinally slidably sleeved on the outside of the cylinder, L-shaped rods are connected on both sides of the movable sleeve, an annular tube is connected between the lower ends of the two L-shaped rods, and a plurality of air outlets are equidistantly arranged on the inner ring wall of the annular tube, the air outlets are made of plastic material, and the air outlet end of the hot air blower is connected to the annular tube through an air supply pipe.

[0013] Preferably, the welding assembly also includes a driving assembly, which includes slots respectively arranged on both sides of the cylinder, gears embedded in the slots for rotation, a connecting rod hinged at the upper edge of one surface of the gear, one end of the connecting rod hinged to the L-shaped rod corresponding thereto, the driving assembly also includes a moving rod that slides longitudinally and is inserted into the lower end of the cylinder, the lower end of the moving rod slides longitudinally through the upper end of the limit shell and is located above the copper ring, and the upper end of the moving rod is located in the cylinder and connected to a limit bar, the upper end of the limit bar is connected to the inner top side of the cylinder by a limit spring, and racks are provided on both sides of the limit bar, the racks are meshed with their corresponding gears, and when the limit spring is in a reset state, the annular tube is concentric with the plate body.

[0014] A patch welding method for double-sided copper substrate processing includes welding patches using a patch welding device for double-sided copper substrate processing, and the welding method includes the following steps: S1. The robot arm drives the loading and welding integrated mechanism to move, so that the positioning loading component clamps and loads the patch, and fixes it on the copper substrate; S2, positioning the loading assembly and linking the welding assembly operation to weld the patch fixed on the copper substrate; S3. The turning table is rotated 180 degrees by the turning motor, and then steps S1-S2 are repeated to perform patch soldering on the other side of the copper substrate.

[0015] Compared with the prior art, the present invention has the following beneficial effects: Non-contact clamping control is achieved through the linkage design of the electromagnetic coil and the magnetic fluid. When the silicon capsule is pressed down, the conductive plate is triggered to contact the copper ring. After power is turned on, the magnetic fluid instantly hardens to form a rigid chain structure, fixing the patch in a flexible wrapping manner. After power is turned off, the magnetic fluid resumes its flow state, and the silicon capsule automatically releases the patch, avoiding damage caused by the rigid impact of the mechanical gripper. It also solves the problem that the nozzle cannot absorb patches with rough surfaces.

[0016] By utilizing the cooperation between the ball at the end of the limit rod and the spiral groove in the tube body, the rise of the push rod is forced to be converted into a rotating motion, so that the contact surface between the conductive plate and the copper ring is converted from sliding friction to rolling friction, thereby extending the service life of the copper ring.

[0017] When loading the patch, the welding components can be worked synchronously, so that loading and welding are carried out simultaneously, avoiding the displacement of the patch on the substrate and ensuring the welding quality of the patch. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic structural diagram of the integrated feeding and welding mechanism of the present invention; Figure 3It is a structural schematic diagram of the positioning and loading assembly of the present invention; Figure 4 This is a schematic diagram of the disassembled structure of the positioning and loading assembly of the present invention; Figure 5 Schematic diagram of the internal structure of the tube body of the present invention; Figure 6 This is a schematic structural diagram of a welding assembly according to the present invention; Figure 7 It is a schematic diagram of the internal structure of the cylinder of the present invention; Figure 8 It is a schematic structural diagram of the turning table of the present invention.

[0019] In the accompanying drawings, the list of parts represented by each number is as follows: 1. Column; 2. Flip motor; 3. Robotic arm; 4. Hot air blower; 5. Cylinder; 6. Limit shell; 7. Tube; 8. Plate; 9. Silicon capsule; 10. Cavity; 11. Electromagnetic coil; 12. Magnetic fluid; 13. Return spring; 14. Push rod; 15. Conductive plate; 16. Copper ring; 17. Base; 18. Spiral groove; 19. Limit rod; 20. Ball; 21. Moving sleeve; 22. L-shaped rod; 23. Ring tube; 24. Air outlet; 25. Notch; 26. Gear; 27. Connecting rod; 28. Moving rod; 29. Limit bar; 30. Rack; 31. Limit spring; 32. Air duct; 33. Concave frame; 34. Hydraulic cylinder; 35. Clamp; 36. Positioning groove. DETAILED DESCRIPTION

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] The present invention provides two technical solutions: Example 1: Figure 1 As shown, a patch welding device for processing a double-sided copper substrate includes a column 1, a flip motor 2 is installed on the back of the column 1, the output shaft of the flip motor 2 is connected to a flip table, a robotic arm 3 is installed on the upper part of the column 1, and an integrated feeding and welding mechanism is installed at one end of the robotic arm 3 to realize integrated feeding and welding.

[0022] like Figure 2-Figure 4As shown, the integrated feeding and welding mechanism includes a hot air blower 4 connected to the robotic arm 3, the bottom of the hot air blower 4 is connected to a cylinder 5, the lower end of the cylinder 5 is connected to a limiting shell 6, the lower end of the limiting shell 6 is connected to a tube 7, the lower end of the tube 7 is connected to a plate 8, a cavity 10 is provided inside the plate 8, a spiral electromagnetic coil 11 is distributed in the cavity 10, and a silicon capsule 9 is provided at the bottom of the plate 8, the interior of the silicon capsule 9 is filled with magnetic fluid 12, and the integrated feeding and welding mechanism also includes a triggering part for triggering the hardening of the magnetic fluid 12.

[0023] like Figure 2-Figure 4 As shown, the trigger part includes a top rod 14 that slides longitudinally and is inserted into the tube body 7. The lower end of the top rod 14 is rotatably provided with a base 17. The bottom of the base 17 is connected to the silicon capsule 9 through a reset spring 13, and the upper end of the top rod 14 is connected to a conductive plate 15. The inner wall of the limit shell 6 is provided with a copper ring 16 that is adapted to the outer edge size of the conductive plate 15. When the copper ring 16 is put on the conductive plate 15, the two are in contact with each other. At this time, a closed loop is formed between the electromagnetic coil 11, so that the magnetic fluid 12 forms a chain structure along the direction of the magnetic field and hardens.

[0024] like Figure 4 As shown, when the silicon capsule 9 is in the reset state, the conductive plate 15 is located below the copper ring 16 and does not contact it. The upper and lower parts of the conductive plate 15 are both frustum-shaped, so that the outer diameters of the upper and lower parts of the conductive plate 15 are smaller than the inner diameter of the copper ring 16, which facilitates the conductive plate 15 to pass through the copper ring 16 and contact it to connect the power supply of the electromagnetic coil 11.

[0025] In this embodiment, when in use, the movement of the loading and welding integrated mechanism is controlled by the robotic arm 3. The positioning loading assembly is first moved to the position of the patch to be welded, and then moved toward the patch position. When the silicon capsule 9 contacts the patch, the conductive plate 15 and the copper ring 16 are not in contact, that is, the electromagnetic coil 11 is not energized, the magnetic fluid 12 is in a flowing state, and the silicon capsule 9 is also in a soft state. Then the positioning loading assembly continues to be pressed down. When the silicon capsule 9 presses the patch down, the bottom of the silicon capsule 9 will be concave and wrap the upper part of the patch, thereby squeezing the reset spring 13 to move it upward. The reset spring 13 drives the push rod 14 to move upward, and the push rod 14 drives the conductive plate 15 to move upward. When the conductive plate 15 passes through the inside of the copper ring 16, the copper ring 16 will contact the outer edge of the conductive plate 15, thereby turning on the power of the electromagnetic coil 11. Under the action of the magnetic field, the magnetic fluid 12 will move along The direction of the magnetic field forms a chain structure and hardens, so that the patch wrapped by the silicon capsule 9 will not fall, and the patch will be positioned without damaging the patch. Then the robotic arm 3 transports the patch to the welding position on the substrate. After the patch contacts the substrate, the robotic arm 3 drives the silicon capsule 9 to continue to press down, thereby continuing to push the push rod 14 upward, and the push rod 14 drives the conductive plate 15 to continue to move upward, so that the conductive plate 15 moves out of the copper ring 16. At this time, the conductive plate 15 is not in contact with the copper ring 16, thereby turning off the power supply of the electromagnetic coil 11, and the electromagnetic coil 11 returns to a fluid state, so that the silicon capsule 9 will not generate a clamping force on the patch. Then the robotic arm 3 drives the silicon capsule 9 to move upward. At this time, it will reset under the elasticity of the silicon capsule 9 and the reset spring 13, thereby resetting the conductive plate 15. The conductive plate 15 will quickly move to the bottom of the copper ring 16, thereby completing the patch loading operation.

[0026] like Figure 5 As shown, on the basis of Example 1, a spiral groove 18 is provided on the inner wall of the tube body 7, and one side of the push rod 14 is located in the tube body 7 and is connected to a limit rod 19, and the end of the limit rod 19 away from the push rod 14 is rotatably provided with a ball 20, and the ball 20 is rotatably set in the spiral groove 18. When the push rod 14 moves longitudinally, the ball 20 at one end of the limit rod 19 will slide in the spiral groove 18 on the inner wall of the tube body 7, thereby causing the push rod 14 to rotate and rise, so that the conductive plate 15 contacts the copper ring 16 and slides as rotational friction, reducing the wear on the copper ring 16 and extending the service life of the copper ring 16.

[0027] Further, such as Figure 1 and Figure 8 As shown, the flip table includes a concave frame 33 connected to the output shaft of the flip motor 2, and hydraulic cylinders 34 are installed on both sides of the concave frame 33. The output shaft of the hydraulic cylinder 34 is connected to a clamping bar 35 for clamping the copper substrate. The copper substrate is placed between the two clamping bars 35, and the movement of the clamping bar 35 is controlled by the hydraulic cylinder 34 so that the two sides of the copper substrate are respectively clamped into the positioning grooves 36 on the two clamping bars 35.

[0028] like Figure 1 and Figure 8 As shown, a positioning groove 36 is provided on one side of the clamping strip 35. The positioning groove 36 is V-shaped. The inner diameter of the positioning groove 36 is smaller than the thickness of the substrate. When both sides of the substrate are inserted into the positioning groove 36, the substrate is well positioned.

[0029] Example 2: Figure 2 and Figure 6-Figure 7 As shown, the patch welding device for processing double-sided copper substrates also includes a welding assembly, which includes a movable sleeve 21 that is longitudinally slidably sleeved on the outside of the cylinder 5, and L-shaped rods 22 are connected to both sides of the movable sleeve 21. An annular tube 23 is connected between the lower ends of the two L-shaped rods 22, and a plurality of air outlets 24 are equidistantly arranged on the inner ring wall of the annular tube 23. The air outlet 24 is made of plastic material. By adjusting the angle of the air outlet 24, it can better blow air around the patch to ensure the welding quality of the patch. The air outlet end of the hot air blower 4 is connected to the annular tube 23 through an air supply pipe 32.

[0030] like Figure 2 and Figure 6-Figure 7 As shown, the welding assembly also includes a driving assembly, which includes slots 25 respectively arranged on both sides of the cylinder 5, and a gear 26 is embedded and rotatably arranged in the slot 25. A connecting rod 27 is hinged at the upper edge of one surface of the gear 26, and one end of the connecting rod 27 is hinged to the corresponding L-shaped rod 22. The driving assembly also includes a moving rod 28 that slides longitudinally through the lower end of the cylinder 5, and the lower end of the moving rod 28 slides longitudinally through the upper end of the limit shell 6 and is located above the copper ring 16, and the upper end of the moving rod 28 is located in the cylinder 5 and is connected to the limit bar 29. The upper end of the limit bar 29 is connected to the inner top side of the cylinder 5 by a limit spring 31, and racks 30 are provided on both sides of the limit bar 29, and the rack 30 is engaged with its corresponding gear 26. When the limit spring 31 is in the reset state, the annular tube 23 is concentric with the plate body 8.

[0031] In this embodiment, when the silicon capsule 9 brings the patch into contact with the substrate and continues to move downward, as the top rod 14 drives the conductive plate 15 to move upward, the conductive plate 15 will also push the moving rod 28 to move upward, and the moving rod 28 drives the limit bar 29 to move upward. The racks 30 on both sides of the limit bar 29 respectively drive the two gears 26 meshing with it to rotate. When the gear 26 rotates, it will drive the connecting rod 27 to do eccentric movement. The connecting rod 27 will pull the L-shaped rod 22 downward, causing the movable sleeve 21 to slide up and down on the cylinder 5, thereby causing the annular tube 23 to move downward and fit onto the substrate. At this time, the silicon capsule 9 will also firmly press the patch to reinforce the patch. The hot air blower 4 works to firmly stick to the solder paste on the substrate, so that the patch is not easy to loosen during welding. Then the hot air blower 4 works, and the hot air blower 4 conveys hot air to the annular tube 23, and then sprays it from the air outlet 24 to the four sides of the patch to heat and weld the solder paste around the patch. After welding, when the silicon capsule 9 leaves the patch, that is, the conductive plate 15 is reset, the conductive plate 15 will not continue to push the moving rod 28, and the limit spring 31 will reset the limit bar 29, thereby resetting the movable sleeve 21, that is, the annular tube 23 is reset, and the annular tube 23 moves to the position of the plate body 8, so that it does not affect the normal loading operation of the patch.

[0032] A patch welding method for double-sided copper substrate processing includes welding patches using a patch welding device for double-sided copper substrate processing, and the welding method includes the following steps: S1. The robot arm 3 drives the integrated loading and welding mechanism to move, so that the positioning loading assembly clamps and loads the patch, fixing it on the copper substrate; S2, positioning the loading assembly and linking the welding assembly operation to weld the patch fixed on the copper substrate; S3. The turning table is driven to rotate 180 degrees by the turning motor 2, and then steps S1-S2 are repeated to perform patch welding on the other side of the copper substrate.

[0033] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0034] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A patch welding device for processing a double-sided copper substrate, comprising a column (1), a flip motor (2) mounted on the back of the column (1), an output shaft of the flip motor (2) connected to a flip table, a mechanical arm (3) mounted on the upper portion of the column (1), characterized in that: One end of the mechanical arm (3) is equipped with a feeding and welding integrated mechanism to achieve feeding and welding integration; The integrated feeding and welding mechanism includes a hot air blower (4) connected to the robot arm (3), the bottom of the hot air blower (4) is connected to a cylinder (5), the lower end of the cylinder (5) is connected to a limiting shell (6), the lower end of the limiting shell (6) is connected to a tube (7), the lower end of the tube (7) is connected to a plate (8), a cavity (10) is provided inside the plate (8), a spiral electromagnetic coil (11) is distributed inside the cavity (10), and a silicon capsule (9) is provided at the bottom of the plate (8), the interior of the silicon capsule (9) is filled with magnetic fluid (12), and the integrated feeding and welding mechanism also includes a triggering part for triggering the hardening of the magnetic fluid (12).

2. The chip soldering device for processing a double-sided copper substrate according to claim 1, characterized in that: The triggering portion includes a top rod (14) that slides longitudinally through the tube body (7), and a base (17) is rotatably provided at the lower end of the top rod (14). The bottom of the base (17) is connected to the silicon capsule (9) via a reset spring (13), and the upper end of the top rod (14) is connected to a conductive plate (15). The inner wall of the limit shell (6) is provided with a copper ring (16) that matches the outer edge size of the conductive plate (15). When the copper ring (16) is sleeved on the conductive plate (15), the two contact each other, and at this time, a closed loop is formed between the copper ring (16) and the electromagnetic coil (11), so that the magnetic fluid (12) forms a chain structure along the direction of the magnetic field and hardens.

3. The chip soldering device for processing a double-sided copper substrate according to claim 2, characterized in that: When the silicon capsule (9) is in a reset state, the conductive plate (15) is located below the copper ring (16) and does not contact it, and the upper and lower parts of the conductive plate (15) are both truncated cone-shaped.

4. The chip soldering device for processing a double-sided copper substrate according to claim 2, characterized in that: The inner wall of the tube body (7) is provided with a spiral groove (18), one side of the push rod (14) is located in the tube body (7) and is connected to a limit rod (19), and a ball (20) is rotatably provided at one end of the limit rod (19) away from the push rod (14), and the ball (20) is rotatably provided in the spiral groove (18).

5. The chip soldering device for processing a double-sided copper substrate according to claim 1, characterized in that: The turning platform comprises a concave frame (33) connected to the output shaft of the turning motor (2), hydraulic cylinders (34) are installed on both sides of the concave frame (33), and the output shaft of the hydraulic cylinder (34) is connected to a clamping bar (35) for clamping the copper substrate.

6. The chip soldering device for processing a double-sided copper substrate according to claim 5, characterized in that: A positioning groove (36) is provided on one side of the clamping strip (35), and the positioning groove (36) is V-shaped.

7. The chip soldering device for processing a double-sided copper substrate according to claim 1, characterized in that: The patch welding device for processing a double-sided copper substrate further comprises a welding assembly, the welding assembly comprising a movable sleeve (21) longitudinally slidably sleeved on the outside of the cylinder (5), both sides of the movable sleeve (21) are connected with L-shaped rods (22), an annular tube (23) is connected between the lower ends of the two L-shaped rods (22), a plurality of air outlets (24) are equidistantly arranged on the inner ring wall of the annular tube (23), the air outlets (24) are made of plastic material, and the air outlet end of the hot air blower (4) is connected to the annular tube (23) via an air supply pipe (32).

8. The chip soldering device for processing a double-sided copper substrate according to claim 7, characterized in that: The welding assembly further comprises a driving assembly, the driving assembly comprising notches (25) respectively arranged on both sides of the cylinder (5), a gear (26) being embedded and rotatably arranged in the notch (25), a connecting rod (27) being hinged at the upper edge of one surface of the gear (26), one end of the connecting rod (27) being hinged to the L-shaped rod (22) corresponding thereto, the driving assembly further comprising a moving rod (28) which is longitudinally slidably inserted into the lower end of the cylinder (5), the lower end of the moving rod (28) longitudinally slidingly passing through the limit shell ( 6) and is located above the copper ring (16), and the upper end of the moving rod (28) is located in the cylinder (5) and connected to the limit bar (29), the upper end of the limit bar (29) and the inner top side of the cylinder (5) are connected through a limit spring (31), and racks (30) are provided on both sides of the limit bar (29), and the racks (30) are engaged with their corresponding gears (26). When the limit spring (31) is in the reset state, the annular tube (23) and the plate body (8) are concentric.

9. A patch soldering method for processing a double-sided copper substrate, characterized in that: The invention relates to a method for soldering a patch using a patch soldering device processed by a double-sided copper substrate according to any one of claims 1 to 8, wherein the soldering method comprises the following steps: S1, driving the loading and welding integrated mechanism to move by the robotic arm (3), so that the positioning loading component clamps and loads the patch, so that it is fixed on the copper substrate; S2, positioning the loading assembly and linking the welding assembly operation to weld the patch fixed on the copper substrate; S3, the turning table is driven to rotate 180 degrees by the turning motor (2), and then steps S1-S2 are repeated to perform patch welding on the other side of the copper substrate.

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