Elastic contactor with enhanced binding force

Abstract

The present invention provides an elastic contactor with enhanced binding force, and relates to a contactor in contact with a test inspector and a terminal of a semiconductor element during an inspection process of a semiconductor, and more particularly, to an elastic contactor comprising a hard head tip and a conductive soft bulk silicon, according to the present invention, by inserting a coupling rod formed in a bulk silicon into a coupling hole formed in a tip end, peeling of the tip end and the bulk silicon can be suppressed and the coupling force can be enhanced even under repeated buffer action.

Description

Technical Field

[0001] The present invention relates to a contactor that contacts a test inspector and a terminal of a semiconductor element during a semiconductor inspection process. More specifically, the present invention relates to an elastic contactor comprising a hard tip and conductive soft silicon body. By inserting a coupling rod formed in the silicon body into a coupling hole formed in the tip, the tip and the silicon body can be prevented from peeling off and the coupling force can be enhanced even under repeated buffering effects. Background Art

[0002] Typically, semiconductors undergo testing to determine their electrical performance after completing the manufacturing process. This testing is performed after a semiconductor test socket, designed to electrically contact the semiconductor device's terminals, is attached to a substrate and the semiconductor is then bonded to the socket.

[0003] Pins are components included in test sockets used to test circuits in semiconductors and other electronic devices. One end of the pin contacts a lead terminal of the semiconductor being tested, while the other end contacts the circuitry of the test device. Testing is performed by analyzing input or output signals through the test circuitry.

[0004] With the advancement of semiconductor component integration technology and the trend toward miniaturization, the size and spacing of semiconductor component terminals, or leads, are also becoming increasingly smaller. Consequently, methods are required to minimize the spacing between conductive modules in test sockets. Consequently, there are limitations in using existing pogo pin-type semiconductor test sockets to manufacture semiconductor test sockets for testing integrated semiconductor components.

[0005] The structure of a conventional ultra-high current pogo pin, disclosed in Korean Patent No. 10-2259074, shows a spring embedded in a hollow outer cylinder. The upper probe is supported by the spring at its upper end, while the lower probe is supported by the spring at its lower end. The pogo pin is manufactured by machining and assembling three to four parts.

[0006] In order to achieve the up and down buffering action based on the spring, existing pogo pins must form a mechanical gap. When this gap is insufficient (narrow), the load applied to the probe or spring will increase, causing damage to the object being tested. When the gap is large, the contact resistance increases, resulting in unstable contact and other problems.

[0007] Furthermore, in the field of test contactors, which have been miniaturized in recent years, existing spring pins have minute gaps and deviations due to machining tolerances and assembly tolerances, leading to unstable contact characteristics.

[0008] The movement of the pogo pins due to this gap can cause instantaneous resistance and load instability before the pogo pins reach their end of life, making it difficult to perform precise semiconductor testing.

[0009] Therefore, it is necessary to develop a semiconductor test contactor that is not only miniaturized but also structurally stable so as to stably maintain load and contact resistance characteristics and reduce costs.

[0010] Prior art literature

[0011] Patent Literature

[0012] Patent Document 1: KR10-2259074(B1)2021.05.26

[0013] Patent Document 2: KR10-2091339(B1) 2020.03.13 Summary of the Invention

[0014] Problems to be solved by the invention

[0015] In order to solve the above problems, the purpose of the present invention is to provide an elastic contactor, which includes a hard head tip and a conductive soft body silicon, and by inserting a binding rod formed on the body silicon into a binding hole formed on the head tip, it is possible to suppress the peeling of the head tip and the body silicon and strengthen the binding force even under repeated buffering action.

[0016] Another object of the present invention is to provide an elastic contactor with enhanced bonding force, in which the bonding rods formed on the silicon bonding part are respectively inserted into a plurality of bonding holes formed on the head tip connecting part which are spaced apart from each other along the length direction, thereby suppressing the peeling of the head tip and the body silicon and maintaining the close contact force. At the same time, the connecting part acts as a skeleton, so that the buffer part will not bend, thereby improving the straightness. Even under repeated buffering action, the positions of the upper and lower parts of the contactor will not change and can remain stable.

[0017] Another object of the present invention is to provide an elastic contactor with enhanced bonding force, wherein the connecting portion of the head tip is composed of a convex portion and a concave portion formed with different widths, thereby forming a height difference in the buffering direction, so that the silicon bonding portion of the body silicon forms a snap-fit structure at the connecting portion of the head tip, and will not be peeled off even after long-term repeated use and can enhance durability.

[0018] Another object of the present invention is to provide an elastic contactor with enhanced bonding force, which forms a flat bonding plane on one side of the connecting portion to ensure a wider filling space for silicon of the conductive material, thereby significantly reducing the contact resistance by filling large and numerous conductive particles.

[0019] Another object of the present invention is to provide an elastic contactor with enhanced bonding force, wherein the width of the probe portion is formed to be smaller than the width of the lens barrel support portion, and in the buffer portion, the width of the contact portion is formed to be smaller than the width of the main body portion to form a snap-fit structure, thereby preventing detachment when the contactor is inserted into the test housing.

[0020] Another object of the present invention is to provide a spring contactor with enhanced bonding force. Unlike existing spring pins manufactured by assembly, this contactor is produced by molding a single structure, thereby saving cost and time by omitting the assembly process. It also eliminates the need for forming a mechanical gap and can stably maintain load and contact resistance characteristics even under repeated buffering effects.

[0021] Methods used to solve problems

[0022] In order to achieve the above-mentioned purpose, the contactor of the present invention includes a head tip 100 formed of a hard metal material and a body silicon 200 formed of a soft conductive material, wherein the head tip 100 includes: a probe part 110, which is located at the upper part of the head tip 100 and contacts the terminal; a barrel support part 120, which is located in the middle part of the head tip 100 and is integrally formed with the probe part 110 at the lower part of the probe part 110; and a connecting part 130, which is located at the lower part of the head tip 100, protrudes below the barrel support part 120, and is formed with one or more coupling holes 134, and the body silicon 200 includes: a silicon coupling part 210, which is formed with an insertion groove 211 for accommodating the connecting part 130; a coupling rod 214, which is integrally formed with the silicon coupling part 210 and inserted into the coupling hole 134; and a main body 231, which is arranged below the silicon coupling part 210.

[0023] In addition, a plurality of the coupling holes 134 and the coupling rods 214 of the present invention are provided and are spaced apart from each other along the vertical direction of the connecting portion 130 and the insertion groove 211 .

[0024] In addition, the coupling hole 134 of the present invention is formed so that its vertical length is longer than its horizontal width.

[0025] In addition, the connecting portion 130 of the present invention includes: a convex portion 133, whose width is formed to be smaller than the width of the lens barrel support portion 120; and a concave portion 132, whose width is formed to be smaller than the width of the convex portion 133, and is alternately arranged with the convex portion 133, thereby forming a concave-convex structure together with the convex portion 133, and the insertion groove 211 includes: a convex groove 213, which accommodates the convex portion 133; and a concave groove 212, which accommodates the concave portion 132 and forms a snap-fit structure with the convex portion 133.

[0026] In addition, the connection portion 130 of the present invention is formed in a cylindrical shape protruding downward from the lens barrel support portion 120 , and a flat coupling plane 131 is formed on one side surface.

[0027] In addition, the present invention also includes a contact portion 232, which is arranged at the lower part of the main body 231 so as to contact the terminal. The width of the main body 231 is formed to be larger than the width of the contact portion 232, thereby forming a height difference. The widths of the lens barrel support portion 120 and the silicon bonding portion 210 are the same as each other.

[0028] In addition, the length of the silicon bonding portion 210 bonded to the connection portion 130 is shorter than the length of the main body portion 231 .

[0029] Effects of the Invention

[0030] According to the present invention, a hard head tip and conductive soft silicon body are included, and a binding rod formed in the silicon body is inserted into a binding hole formed in the head tip. Thus, even under repeated buffering action, the peeling of the head tip and the silicon body can be suppressed and the binding force can be enhanced.

[0031] In addition, in the present invention, the coupling rods formed in the silicon coupling part are respectively inserted into a plurality of coupling holes formed in the connecting part of the head tip and separated from each other along the length direction, thereby having the following effects: the peeling of the head tip and the body silicon can be suppressed, and the adhesion can be maintained. At the same time, the connecting part plays the role of a skeleton, so that the buffer part does not bend, thereby improving the straightness. Even under repeated buffering action, the positions of the upper and lower parts remain stable without change.

[0032] In addition, in the present invention, the connection portion of the head tip is composed of convex portions and concave portions formed with different widths, forming a height difference in the buffering direction. As a result, the silicon bonding portion of the body silicon forms a snap-fit structure at the connection portion of the head tip, thereby having the effect of not being peeled off even after long-term repeated use and enhancing durability.

[0033] In addition, in the present invention, a flat bonding plane is formed on one side of the connection portion to ensure a wider filling space for silicon, a conductive material, so that large and numerous conductive particles can be filled, thereby significantly reducing contact resistance.

[0034] In addition, in the present invention, the width of the probe portion is formed to be smaller than the width of the lens barrel support portion, and in the buffer portion, the width of the contact portion is formed to be smaller than the width of the main body portion to form a snap-fit structure, thereby having the effect of preventing the contactor from detaching when inserted into the test housing.

[0035] In addition, unlike the existing method of manufacturing spring pins by assembly, the present invention is produced by molding a single structure, thereby saving costs and time by omitting the assembly process, and stably maintaining load and contact resistance characteristics under repeated buffering without forming mechanical gaps. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 FIG. 1 is a perspective view of an elastic contactor for enhancing coupling force according to an embodiment of the present invention.

[0037] Figure 2 yes Figure 1 Exploded three-dimensional diagram.

[0038] Figure 3 yes Figure 1 A cross-sectional view of Figure 3 (a) is a vertical sectional view. Figure 3 (b) is a partially cutaway stereoscopic view.

[0039] Figure 4 1 is a diagram showing a coupling hole of another embodiment of an elastic contactor having enhanced coupling force according to the present invention, Figure 4 (a) is a side view. Figure 4 (b) is the other side view.

[0040] Figure 5 It is a perspective view showing the connecting portion of another embodiment of the elastic contactor with enhanced bonding force according to the present invention.

[0041] Figure 6 yes Figure 5 A cross-sectional view of Figure 6 (a) is a vertical sectional view. Figure 6 (b) is a partially cutaway stereoscopic view.

[0042] Description of Reference Numerals

[0043] 100: tip of head;

[0044] 110: probe portion; 120: lens barrel support portion;

[0045] 130: connecting portion; 131: coupling plane; 132: concave portion; 133: convex portion; 134: coupling hole;

[0046] 200: bulk silicon;

[0047] 210: Silicon bonding portion; 211: Insertion groove; 212: Recessed groove; 213: Protruding groove; 214: Bonding rod;

[0048] 230: Buffering portion; 231: Main body; 232: Contact portion. DETAILED DESCRIPTION

[0049] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings so that those skilled in the art can easily implement them.

[0050] The elastic contactor with enhanced bonding force according to the present invention involves the following: in a contactor used in a semiconductor testing process, the structure of the existing spring pin is improved, and a conductive silicon material is used instead of a spring to suppress the peeling phenomenon between the hard material head tip 100 and the soft material body silicon 200.

[0051] The contactor includes a head tip 100 formed of a hard metal material and a body silicon 200 formed of a soft conductive material, wherein the head tip 100 includes: a probe part 110, which is located at the upper part of the head tip 100 and contacts the terminal; a barrel support part 120, which is located in the middle part of the head tip 100 and is integrally formed with the probe part 110 at the lower part of the probe part 110; and a connecting part 130, which is located at the lower part of the head tip 100, protrudes below the barrel support part 120, and is formed with one or more coupling holes 134, and the body silicon 200 includes: a silicon coupling part 210, which is formed with an insertion groove 211 for accommodating the connecting part 130; a coupling rod 214, which is integrally formed with the silicon coupling part 210 and inserted into the coupling hole 134; and a main body 231, which is arranged below the silicon coupling part 210.

[0052] After semiconductor manufacturing is complete, a testing process is performed to verify that each component mounted on the semiconductor is functioning properly. During this testing process, test signals are sent to and received from each semiconductor component under inspection, and these electrical signals are analyzed to confirm whether the semiconductor component is functioning properly.

[0053] In order to carry out the above-mentioned test process, an inspection device is provided for generating an electrical signal for transmitting to the semiconductor element. The electrical signal of the inspection device is then transmitted through a contactor in contact with the inspection device. The semiconductor element contacts the contactor and receives the electrical signal from the inspection device, thereby returning the electrical signal to the inspection device again.

[0054] The contactor of the present invention is a pin inserted into a test housing (not shown) of a test socket (not shown), and is supported by the test housing to exist in an upright state. It is elastically supported by the force applied by the inspection device and the semiconductor element approaching each other, thereby improving the contact efficiency between the inspection device and the semiconductor element, and at the same time playing a buffering role to minimize damage caused by pressure.

[0055] Conventional pogo pins incorporate a spring for cushioning, and are manufactured by assembling a barrel housing the spring and upper and lower plungers located above and below the spring. However, conventional pogo pin structures are difficult to manufacture within a certain size, taking into account the spring force and barrel thickness, and this poses a problem in the testing process of miniaturized semiconductor devices.

[0056] Therefore, the present invention forms a single structure that can be integrally molded and manufactured, making it easy to manufacture in a small size, making it suitable for testing processes for miniaturized semiconductor devices. Specifically, it consists of a tip 100 that contacts the upper terminal and a bulk silicon 200 that contacts the lower terminal. A coupling rod 214 formed in the bulk silicon 200 is inserted through a coupling hole 134 formed in the tip 100 to connect the tip.

[0057] The tip 100 is formed of a hard conductive material, and the bulk silicon 200 is formed of a soft conductive material. The tip 100 and bulk silicon 200, which are made of different materials, are joined together through the joining holes 134 and the joining rods 214 to be integrally molded.

[0058] In the testing process of the present invention, when the contactor is subjected to pressure in the up and down directions, the bulk silicon 200 made of the soft material plays a buffering role through its elasticity, thereby minimizing damage applied to the terminal.

[0059] During the molding process of the body silicon 200, by mixing a silicone bonding primer, the tip 100 and the contact portion 232 of the body silicon 200 can be in strong contact. Then, the coupling rod 214 of the body silicon 200 is inserted into the coupling hole 134 of the tip 100. Thus, the contactor can suppress the peeling of the tip 100 and the body silicon 200 even under the buffering effect in the up and down directions, and can maintain a very strong bonding force, and can also keep the contact resistance at a low state under long-term use.

[0060] Figure 1 is a perspective view illustrating a contactor according to an embodiment of the present invention, Figure 2 Yes Figure 1 Exploded perspective view of the figure. Figure 1 and Figure 2 According to one embodiment of the present invention, a contactor is inserted into a test housing of a test socket, contacts terminals of an inspection device and a semiconductor component, electrically connecting them and transmitting and receiving electrical signals. The inspection device and semiconductor component are placed above and below the contactor, respectively, and the upper and lower positions can be interchanged.

[0061] The contactor of the present invention is formed by combining a tip 100 and a bulk silicon 200 , wherein the tip 100 is formed of a hard material and has excellent conductivity, and the bulk silicon 200 is formed of a soft material and has excellent elasticity and has conductivity by mixing conductive powder.

[0062] The upper end of the tip 100 contacts the upper terminal of the contactor, while the lower end of the bulk silicon 200 contacts the lower terminal of the contactor. To improve contact between the inspection device, the contactor, and the semiconductor element, pressure is applied to the contactor toward the inspection device and the semiconductor element, and the contactor's elasticity provides a buffer to prevent damage to the terminals.

[0063] To this end, as one embodiment, the bulk silicon 200 is made of elastic silicon material, and conductive powder (particles) are mixed into the silicon to transmit electrical signals. Furthermore, the tip 100 is made of a material that is both hard and conductive, specifically a metal such as BeCu, SUS, SK4, or PD Alloy. As a result, the tip 100 and bulk silicon 200 possess conductivity, enabling electrical connection between the inspection device and the semiconductor device, and enabling testing procedures.

[0064] The tip 100 is provided with a probe portion 110 having a pointed shape with a tapered upper end so as to contact a terminal (a terminal of an inspection device or a semiconductor element) located at the upper portion of a contactor. A lens barrel support portion 120 is provided at the lower portion of the probe portion 110, and its width is formed to be larger than the width of the probe portion 110. The probe portion 110 and the lens barrel support portion 120 can be formed integrally, but are formed to have different widths. A connecting portion 130 is provided at the lower portion of the lens barrel support portion 120 as a portion for bonding to the bulk silicon 200. That is, the probe portion 110, the lens barrel support portion 120, and the connecting portion 130 are integrally formed from the upper portion to the lower portion of the tip 100. "Width" refers to the length in the horizontal direction of the cross section. If the cross section is circular, it can refer to the diameter, and if the cross section is square, it can refer to the side length.

[0065] In the head tip 100 , the barrel support portion 120 is formed to have the largest width compared to the probe portion 110 and the connection portion 130 , and the connection portion 130 is formed to have a width smaller than that of the barrel support portion 120 .

[0066] The bulk silicon 200 includes a silicon bonding portion 210, which bonds with the connection portion 130 of the tip 100. A buffer portion 230 is provided below the silicon bonding portion 210 to buffer external forces applied to the contactor. More specifically, the buffer portion 230 comprises a main body 231, which forms the main structure, and a contact portion 232, which is located below the main body 231 and has a smaller width than the main body 231 and contacts the terminals (terminals of the inspection device or semiconductor device) at the bottom of the contactor. In other words, the bulk silicon 200 integrally forms the silicon bonding portion 210, the main body 231 of the buffer portion 230, and the contact portion 232 of the buffer portion 230 from top to bottom.

[0067] The main body portion 231 and the contact portion 232 are elastic bodies that contract when pressure is applied and expand when the pressure is released. The length of the silicon bonding portion 210 is shorter than that of the main body portion 231 .

[0068] The silicon coupling portion 210 , the main body portion 231 , and the buffer portion 230 are formed by molding silicon mixed with conductive powder, and thus may have the same elasticity and conductivity, or may be molded to have different elasticities and conductivity.

[0069] The probe part 110 may be formed to have a width smaller than that of the barrel support part 120 , and the silicon bonding part 210 of the bulk silicon 200 and the main body 231 of the buffer part 230 may have the same width as that of the barrel support part 120 .

[0070] As structures for bonding the tip tip 100 and the bulk silicon 200, a connection portion 130 is formed on the tip tip 100, and a silicon bonding portion 210 is formed on the bulk silicon 200. During the manufacturing and molding of the bulk silicon 200, a conductive powder is mixed in the pre-curing state to enable electrical signal transmission, and a silicon bonding primer is further mixed to bond with the tip tip 100. After molding, the silicon bonding portion 210 is strongly bonded to the bottom surface of the barrel support 120 and the outer surface of the connection portion 130, thereby forming an integrated structure.

[0071] Further observing the structures of the connecting portion 130 and the silicon bonding portion 210 in detail, the width of the connecting portion 130 is formed to be smaller than the width of the lens barrel support portion 120 and is formed to protrude downward, and an insertion groove 211 for inserting the connecting portion 130 is formed in the silicon bonding portion 210.

[0072] Furthermore, the connecting portion 130 is formed with a hole, i.e., a coupling hole 134, which passes through the connecting portion 130 in a horizontal direction, and the insertion groove 211 of the silicon coupling portion 210 is formed with a bar, i.e., a coupling bar 214, which passes through the coupling hole 134 in a horizontal direction. The coupling bar 214 passes through the insertion groove 211 in a horizontal direction. In this case, the horizontal direction refers to a direction perpendicular to the longitudinal direction of the contactor arranged in a long vertical direction. In the area where the connecting portion 130 and the silicon coupling portion 210 are coupled, except for the volume occupied by the connecting portion 130 and the coupling hole 134, the silicon coupling portion 210 is filled with a conductive powder. Therefore, the coupling bar 214 is also made of a conductive material, thereby being able to transmit an electrical signal based on the contact with the connecting portion 130.

[0073] When the tip 100 and the bulk silicon 200 are bonded together using a silicon bonding primer, there is a problem of peeling of the tip 100 and the bulk silicon 200 at the bonding site due to repeated buffering over a long period of time. In the present invention, in order to prevent peeling of the tip 100 and the bulk silicon 200, a bonding hole 134 is formed in the connecting portion 130, and a bonding rod 214 formed integrally with the silicon bonding portion 210 is inserted horizontally into the bonding hole 134. Therefore, even if the contactor of the present invention is subjected to repeated buffering, the tip 100 and the bulk silicon 200 will not peel off, and the contact resistance can be stably maintained.

[0074] The bulk silicon 200 of the present invention is manufactured by filling silicon mixed with conductive powder into a mold for shaping the bulk silicon 200 before it hardens, thereby integrally manufacturing it with the tip 100. Therefore, the silicon bonding portion 210 and the bonding rod 214 are made of the same material and are formed integrally.

[0075] The connecting portion 130 is formed into a cylindrical shape protruding downward from the lens barrel support portion 120, and a flat bonding plane 131 is formed on one side. The bonding plane 131 can be formed as one or more than one on the outer surface of the connecting portion 130. The silicon connecting portion 210 manufactured by the above-mentioned manufacturing method is formed and manufactured by filling the space between the connecting portions 130 without any gaps. Therefore, a flat shape consistent with the bonding plane 131 of the connecting portion 130 can also be formed on one side of the insertion groove 211. The engagement structure of the bonding plane 131 of the connecting portion 130 and the insertion groove 211 can prevent the silicon connecting portion 210 from rotating along the circumferential direction of the connecting portion 130.

[0076] Furthermore, the space filled with silicon bonding portion 210 is further expanded at the junction of connection portion 130 and silicon bonding portion 210. Specifically, when the outer surface of connection portion 130 is viewed as a cross-section, it is formed of arcs and straight lines (the surface forming bonding plane 131). This allows for a larger amount of conductive powder to be filled than a cylindrical connection portion 130 not cut by bonding plane 131, thereby further reducing contact resistance.

[0077] Furthermore, in the overlapping region between the tip 100 and the bulk silicon 200, namely the connection portion 130 and the silicon bonding portion 210, the connection portion 130, made of a hard material, supports the silicon bonding portion 210. Thus, the connection portion 130 acts as a framework supporting the bulk silicon 200. Consequently, the contactor of the present invention, when inserted into the test housing of a test socket, is protected from bending (compression) even by the cushioning effect, and its straightness is improved. Consequently, the probe portion 110 and the contact portion 232 remain in contact with the upper and lower terminals without deviating from their original positions, thereby improving contact accuracy.

[0078] Figure 3 This is a cross-sectional view showing the connection portion 130 and the silicon bonding portion 210. Figure 3 The coupling holes 134 may be provided in plurality and spaced apart from each other along the length direction of the connecting portion 130. Here, the length direction refers to the direction from the probe portion 110 of the contactor toward the contact portion 232. Depending on the number of the coupling holes 134, the coupling rods 214 are also spaced apart from each other along the length direction of the insertion slot 211.

[0079] Among the multiple coupling holes 134 and coupling rods 214, the coupling hole 134 and coupling rod 214 closest to the barrel support 120 are used to prevent peeling at the portion where the bulk silicon 210 contacts the bottom surface of the barrel support 120. This maintains smooth contact between the tip 100 and the bulk silicon 200 and prevents an increase in contact resistance.

[0080] Furthermore, the coupling hole 134 and coupling rod 214 structure, which is furthest from the lens barrel support portion 120, improves the straightness of the soft silicon body 200. The connection portion 130, which serves as a skeletal structure and protrudes downward to support the silicon body 200, minimizes bending or buckling of the silicon body 200, thereby preventing the probe portion 110 and the contact portion 232 from deviating from the terminal.

[0081] Figure 4 FIG. 1 is a diagram showing a coupling hole 134 of a contactor according to another embodiment of the present invention. Figure 4A coupling hole 134 is formed in the connecting portion 130 for inserting the coupling rod 214 of the silicon coupling portion 210. The coupling hole 134 is formed long along the length direction of the connecting portion 130, and is formed so that the length in the vertical direction is longer than the width in the horizontal direction. Figure 4 The coupling hole 134 shown in FIG. Figures 1 to 3 The embodiment shown has different coupling holes 134, and the structures of the tip 100 and the bulk silicon 200 are the same except for the coupling holes 134. Figure 4 As shown, the coupling hole 134 having a length longer than its width may be configured as one, or a shape not shown in the figure, that is, two or more coupling holes 134 having a length longer than its width may be formed spaced apart from each other.

[0082] When the coupling hole 134 is formed to be longer than its width, the coupling rod 214 is also formed to be longer than its width, thereby filling the coupling hole 134. Therefore, the coupling rod 214 filling the coupling hole 134 formed into a long hole shape can prevent the silicon coupling portion 210 from being peeled off from the bottom surface of the barrel support portion 120, and further ensure that the area where the connecting portion 130 and the silicon coupling portion 210 are coupled can be filled with silicon mixed with conductive powder, thereby improving the contact resistance characteristics.

[0083] In an embodiment where the coupling hole 134 is formed to have a length longer than a width, the connection portion 130 may form a flat surface, ie, a coupling plane 131 .

[0084] Figure 5 is a perspective view showing a connecting portion 130 according to another embodiment of the present invention, Figure 6 Yes Figure 5 Refer to the cross-sectional diagram of Figures 5 and 6 In a contactor according to another embodiment of the present invention, a tip 100 formed of a hard conductive material and a bulk silicon 200 formed of a soft silicon material mixed with conductive powder are bonded to each other.

[0085] The head tip 100 includes a probe portion 110, which is located at the upper part of the head tip 100 and contacts the terminal at the upper part of the contactor. The lower part of the probe portion 110 includes a barrel support portion 120, and a connection portion 130 for combining with the bulk silicon 200 is formed in a concave-convex shape at the lower part of the barrel support portion 120.

[0086] The bulk silicon 200 includes a silicon bonding portion 210 bonded to a concave-convex connection portion 130, and a buffer portion 230 that acts as a buffer at the lower portion of the silicon bonding portion 210. The buffer portion 230 includes: a main body portion 231 that forms a main body; and a contact portion 232 that is arranged at the lower portion of the main body portion 231 so as to contact the terminal at the lower portion of the contactor.

[0087] The connection portion 130 for combining with the bulk silicon 200 includes: a convex portion 133 whose width is formed to be smaller than the width of the lens barrel support portion 120; and a concave portion 132 whose width is formed to be smaller than the width of the convex portion 133 and is alternately arranged with the convex portion 133 to form a concave-convex structure together with the convex portion 133.

[0088] There may be more than one concave portion 132 and more than one convex portion 133. In one embodiment of the present invention, two convex portions 133 are provided, with one concave portion 132 disposed between the convex portions 133. However, the present invention is not limited thereto. Multiple concave portions 132 and convex portions 133 may be alternately disposed to form a concave-convex structure by varying their widths. Preferably, a convex portion 133 having a width wider than the concave portion 132 is disposed last at the lower end of the connecting portion 130.

[0089] Since the connecting portion 130 forms a concave-convex structure by arranging the concave portion 132 and the convex portion 133, the insertion groove 211 for inserting the connecting portion 130 is also formed into a concave-convex structure. More specifically, the insertion groove 211 includes: a convex groove 213, which accommodates the convex portion 133; and a concave groove 212, which accommodates the concave portion 132. As a preferred embodiment, a convex portion 133 having a width wider than the concave portion 132 is provided at the rearmost end of the connecting portion 130, so that the concave groove 212 engages with the convex portion 133 located at the rearmost end of the connecting portion 130, thereby preventing the bulk silicon 200 from peeling off toward the bottom of the tip 100.

[0090] Furthermore, a coupling hole 134 is formed in the convex portion 133, which is wider than the concave portion 132. A coupling rod 214, which is formed to extend horizontally through the insertion groove 211 of the silicon coupling portion 210, is inserted into the coupling hole 134, thereby coupling the connecting portion 130 to the silicon coupling portion 210. Therefore, in order to mold the bulk silicon 200, a silicone bonding primer is mixed to bond the outer surfaces of the lens barrel support portion 120 and the connecting portion 130. The concave-convex structure formed by the concave portion 132 and the convex portion 133 allows the silicon coupling portion 210 to be inserted into the connecting portion 130 with a height difference, thereby coupling. Furthermore, by inserting the coupling rod 214 of the silicon coupling portion 210 into the coupling hole 134 formed in the convex portion 133, the coupling force can be further strengthened.

[0091] In the accompanying drawings, coupling holes 134 are formed in the convex portion 133, and the same number of coupling rods 214 as the convex portion 133 are formed in the silicon coupling portion 210. However, coupling holes 134 may also be formed in the concave portion 132, and coupling rods 214 may be further formed to be inserted into the coupling holes 134 formed in the concave portion 132.

[0092] Because convex portion 133 is wider than concave portion 132, a flat surface, or bonding plane 131, is formed on convex portion 133. Bonding plane 131 prevents silicon bonding portion 210 from rotating circumferentially around connecting portion 130 and further ensures a space for silicon mixed with conductive powder, thereby reducing contact resistance. Although not shown in the drawings, bonding plane 131 may also be formed on concave portion 132.

[0093] In another contact portion of the present invention, the width of the probe portion 110 is formed to be smaller than the width of the lens barrel support portion 120, thereby forming a height difference at the top of the contactor. In addition, in the buffer portion 230, the width of the main body 231 is formed to be larger than the width of the contact portion 232, thereby forming a height difference at the bottom of the contactor. When the contactor of the present invention is inserted into the test housing by the height difference generated by the width difference between the probe portion 110 and the lens barrel support portion 120 and the width difference between the main body 231 and the contact portion 232, it is possible to prevent the contactor from being disengaged.

Claims

1. An elastic contactor for strengthening bonding force, comprising a tip (100) formed of a hard metal material and a bulk silicon (200) formed of a soft conductive material, wherein: The head tip (100) comprises: a probe portion (110) located on the upper portion of the head tip (100) and in contact with the terminal; a barrel support portion (120) located in the middle of the head tip (100) and formed integrally with the probe portion (110) at the lower portion of the probe portion (110); and A connecting portion (130) is located at the lower portion of the head tip (100), protrudes downward from the lens barrel support portion (120), and is formed with one or more coupling holes (134). The bulk silicon (200) comprises: a silicon bonding portion (210) formed with an insertion groove (211) for accommodating the connecting portion (130); a coupling rod (214) formed integrally with the silicon coupling portion (210) and inserted into the coupling hole (134); and The main body (231) is arranged below the silicon bonding portion (210).

2. The elastic contactor for enhancing bonding force according to claim 1, wherein: The elastic contactor for strengthening the combining force is provided with a plurality of combining holes (134) and combining rods (214), and the plurality of combining holes (134) and the plurality of combining rods (214) are spaced apart from each other along the upper and lower directions of the connecting portion (130) and the insertion groove (211).

3. The elastic contactor with enhanced bonding force according to claim 1, wherein: The coupling hole (134) is formed such that its vertical length is longer than its horizontal width.

4. The elastic contactor with enhanced bonding force according to claim 1, wherein: The connecting portion (130) includes: a convex portion (133) having a width smaller than that of the lens barrel support portion (120); and The concave portion (132) is formed to have a width smaller than that of the convex portion (133), and is alternately arranged with the convex portion (133), thereby forming a concave-convex structure together with the convex portion (133). The insertion slot (211) comprises: a convex groove (213) for receiving the convex portion (133); and The groove (212) accommodates the concave portion (132) and forms a snap-fit structure with the convex portion (133).

5. The elastic contactor according to any one of claims 1 to 4, wherein: The connecting portion (130) is formed in a cylindrical shape protruding downward from the lens barrel support portion (120), and a flat coupling plane (131) is formed on one side surface.

6. The elastic contactor with enhanced bonding force according to claim 1, wherein: The elastic contactor for strengthening the bonding force further includes a contact portion (232), which is arranged at the lower portion of the main body (231) so as to contact the terminal. The width of the main body (231) is formed to be larger than the width of the contact portion (232), thereby forming a height difference. The lens barrel supporting portion (120) and the silicon bonding portion (210) have the same width.

7. The elastic contactor with enhanced bonding force according to claim 1, wherein: The length of the silicon bonding portion (210) bonded to the connection portion (130) is shorter than the length of the main body portion (231).

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