Heat dissipation control device, method and server

Abstract

The present application provides a heat dissipation control device, method, and server, which can be applied in the field of server technology. The heat dissipation control device includes: a heat dissipation controller, the heat dissipation controller including a storage unit for storing the device addresses of multiple power supply units and the heat dissipation device operation strategy; a signal processing module electrically connected to the multiple power supply units via a power bus, and electrically connected to the heat dissipation controller and the baseboard management controller via an inter-integrated circuit communication bus; the heat dissipation controller is further configured to obtain power information of the multiple power supply units through the signal processing module based on the device addresses of the multiple power supply units when the baseboard management controller is in an abnormal operating state, and to control the operating state of the multiple heat dissipations based on the power information and the heat dissipation device operation strategy.

Description

Technical Field

[0001] The present application relates to the field of server technology, and in particular to a heat dissipation control device, method, and server. Background Art

[0002] The server has a limited size, and many high-power electronic components will run for a long time and at high load inside the server. Therefore, the heat dissipation of the server is directly related to the stability of the server operation.

[0003] The server cooling strategy used in related technologies involves real-time fan speed control based on server temperature when the BMC (Baseboard Management Controller) is operational. However, when the BMC malfunctions, the CPLD (Complex Programmable Logic Device) takes over fan speed control. Since the CPLD cannot obtain relevant information such as the server's internal temperature, it can only control the fan at a fixed speed. This can result in ineffective cooling under varying workloads and ambient temperatures, impacting server performance and stability. Summary of the Invention

[0004] In view of the above problems, the present application provides a heat dissipation control device, method and server.

[0005] According to the first aspect of the present application, a heat dissipation control device is provided, comprising: a heat dissipation controller, the heat dissipation controller comprising a storage unit, the storage unit being used to store the device addresses of each of a plurality of power supply units and a heat dissipation device operation strategy; a signal processing module being electrically connected to the plurality of power supply units via a power bus, and being electrically connected to the heat dissipation controller and a baseboard management controller via an inter-integrated circuit communication bus; the heat dissipation controller is further used to obtain power information of the plurality of power supply units through the signal processing module according to the device addresses of the plurality of power supply units when the baseboard management controller is in an abnormal working state, and to control the operation status of the plurality of heat dissipations according to the power information and the heat dissipation device operation strategy.

[0006] According to an embodiment of the present application, the above-mentioned heat dissipation control device also includes a power board and a heat dissipation plate, the above-mentioned multiple power supply units are arranged on the above-mentioned power board, and the above-mentioned heat dissipation controller and the above-mentioned multiple heat dissipation devices are arranged on the above-mentioned heat dissipation plate; the above-mentioned signal processing module includes one of the following: a multiplexer, a power management logic.

[0007] According to an embodiment of the present application, the above-mentioned signal processing module includes the above-mentioned multiplexer, and the above-mentioned heat dissipation controller is also used to send a first level signal to the above-mentioned multiplexer when the above-mentioned baseboard management controller is in normal working state, so that the above-mentioned baseboard management controller is used to obtain the power information of the above-mentioned multiple power supply units through the above-mentioned multiplexer, thereby determining the pulse width modulation signal for adjusting the operating state of the above-mentioned multiple heat dissipation devices according to the above-mentioned power information and the above-mentioned heat dissipation device operating strategy.

[0008] According to an embodiment of the present application, the heat dissipation controller is also used to send a second level signal to the multiplexer when the baseboard management controller is in an abnormal working state, so that the heat dissipation controller obtains the power information of the multiple power supply units through the multiplexer.

[0009] According to an embodiment of the present application, the above-mentioned signal processing module includes the above-mentioned power management logic, and the above-mentioned power management logic is arranged on the above-mentioned power board. When the above-mentioned baseboard management controller is in a normal working state, the inter-integrated circuit communication bus between the above-mentioned power management logic and the above-mentioned heat dissipation controller is in a non-working state; the above-mentioned baseboard management controller is also used to: obtain the power information of the above-mentioned multiple power supply units through the above-mentioned power management logic; determine the target speed of the above-mentioned multiple heat dissipation devices based on the above-mentioned power information; send the above-mentioned target speed to the above-mentioned heat dissipation controller, and the above-mentioned heat dissipation controller is used to adjust the operating status of the above-mentioned multiple heat dissipation devices according to the above-mentioned target speed.

[0010] According to an embodiment of the present application, the above-mentioned heat dissipation controller is also used to obtain the power information of the above-mentioned multiple power supply units through the above-mentioned power management logic when the above-mentioned baseboard management controller is in an abnormal working state; and determine the pulse width modulation signal for adjusting the operating state of the above-mentioned multiple heat dissipation devices based on the above-mentioned power information and the above-mentioned heat dissipation device operating strategy.

[0011] According to an embodiment of the present application, the above-mentioned storage unit is also used to store a first preset speed and a second preset speed; the above-mentioned heat dissipation controller is also used to control the operating status of the above-mentioned multiple heat dissipation devices according to the above-mentioned first preset speed when the server is powered on and not turned on; the above-mentioned heat dissipation controller is also used to control the operating status of the above-mentioned multiple heat dissipation devices according to the above-mentioned second preset speed when the server is turned on and the above-mentioned baseboard management controller is in an initialized state, wherein the above-mentioned second preset speed is greater than the above-mentioned first preset speed.

[0012] According to an embodiment of the present application, the above-mentioned device also includes a management board, and the above-mentioned baseboard management controller and management logic are arranged on the above-mentioned management board, and the above-mentioned management logic is used to: receive a watchdog timer signal from the above-mentioned baseboard management controller; determine the working status of the above-mentioned baseboard management controller based on the above-mentioned watchdog timer signal; and send the working status signal of the above-mentioned baseboard management controller to the above-mentioned heat dissipation controller.

[0013] The second aspect of the present application provides a heat dissipation control method, which is applied to the above-mentioned heat dissipation control device, including: using a heat dissipation controller, when a baseboard management controller is in an abnormal working state, obtaining the power information of the above-mentioned multiple power supply units through a signal processing module based on the respective device addresses of the multiple power supply units stored in the storage unit; controlling the operating status of the multiple heat dissipation devices based on the above-mentioned power information and the heat dissipation device operating strategy stored in the above-mentioned storage unit.

[0014] A third aspect of the present application provides a server, comprising the above-mentioned heat dissipation control device.

[0015] According to the heat dissipation control device, method, and server provided in this application, a signal processing module connects the heat dissipation controller and baseboard management controller simultaneously via an inter-integrated circuit communication bus. This ensures that the heat dissipation controller can obtain power information from all power supply units when the baseboard management controller is malfunctioning. Furthermore, the heat dissipation device operation strategy proactively controls the heat dissipation device's operating status when the baseboard management controller is malfunctioning. This ensures that the heat dissipation device maintains sufficient speed to cool the server, ensuring server reliability. It also reduces the heat dissipation device's speed when the server generates less heat, reducing energy consumption and achieving energy conservation and cost reduction. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above contents and other objects, features and advantages of the present application will become more apparent through the following description of the embodiments of the present application with reference to the accompanying drawings.

[0017] Figure 1 A schematic diagram of a heat dissipation control device according to an embodiment of the present application is shown.

[0018] Figure 2 A schematic diagram of a power supply board and a heat dissipation board according to an embodiment of the present application is shown.

[0019] Figure 3 A schematic diagram showing a signal processing module as a multiplexer according to an embodiment of the present application is shown.

[0020] Figure 4 A schematic diagram showing a signal processing module as a power management logic according to an embodiment of the present application is shown.

[0021] Figure 5 A schematic diagram of a management board in a heat dissipation control device according to an embodiment of the present application is shown.

[0022] Figure 6 A flow chart of a heat dissipation control method according to an embodiment of the present application is shown.

[0023] Figure 7 A control flow chart of a heat dissipation controller according to an embodiment of the present application is shown. DETAILED DESCRIPTION

[0024] Hereinafter, embodiments of the present application will be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of the present application. In the detailed description below, for ease of explanation, many specific details are set forth to provide a comprehensive understanding of the embodiments of the present application. However, it is apparent that one or more embodiments may also be implemented without these specific details. In addition, in the following description, descriptions of known structures and technologies are omitted to avoid unnecessarily confusing the concepts of the present application.

[0025] The terms used herein are only for describing specific embodiments and are not intended to limit this application. The terms "comprise," "include," etc. used herein indicate the presence of the features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0026] All terms used herein (including technical and scientific terms) have the meanings commonly understood by those skilled in the art unless otherwise defined. It should be noted that the terms used herein should be interpreted as having a meaning consistent with the context of this specification and should not be interpreted in an idealized or overly rigid manner.

[0027] When expressions such as "at least one of A, B, and C, etc." are used, they should generally be interpreted in accordance with the meaning commonly understood by those skilled in the art (for example, "a system having at least one of A, B, and C" should include but is not limited to a system having A alone, B alone, C alone, A and B, A and C, B and C, and / or A, B, C, etc.).

[0028] During the implementation of this application, it was discovered that when the BMC malfunctions, the CPLD controls the fan to run at a fixed speed based on preset speed information to dissipate heat. However, due to a lack of access to relevant information such as the server's internal temperature, the CPLD cannot adjust the fan speed based on the temperature of key components within the server and can only control the fan to run at a fixed speed. Furthermore, when the server is operating under high load, the components within the server heat up rapidly, preventing effective heat dissipation and affecting the server's performance and stability. Furthermore, when the server is operating under low load, the fan still runs at a high speed, wasting power.

[0029] To this end, an embodiment of the present application provides a heat dissipation control device, which can automatically control the fan speed when the BMC is abnormally operating and unable to control the fan speed.

[0030] Figure 1 A schematic diagram of a heat dissipation control device according to an embodiment of the present application is shown.

[0031] like Figure 1 As shown, the heat dissipation control device of the present application may include a heat dissipation controller 110 , a signal processing module 120 and a baseboard management controller 130 .

[0032] In which, the heat dissipation controller 110 may include a storage unit 111, which can be used to store the device addresses and heat dissipation device operation strategies of multiple power supply units, that is, the storage unit 111 is used to store the device addresses and heat dissipation device operation strategies of the power supply unit 1_1, the power supply unit 1_2,..., the power supply unit 1_m.

[0033] In one embodiment, the storage unit 111 may include a register. The heat dissipation controller 110 may include a CPLD (load programmable logic device).

[0034] In one embodiment, the number of power supply units may be m, where m is an integer greater than or equal to 1. The power supply unit 1_1 , the power supply unit 1_2 , . . . , the power supply unit 1_m may refer to a power supply unit (PSU).

[0035] According to an embodiment of the present application, the signal processing module 120 may be electrically connected to a plurality of power supply units via a power bus, and electrically connected to the heat dissipation controller 110 and the baseboard management controller 130 via an inter-IC communication bus.

[0036] The power bus may be a power management bus (Power Management Bus); and the inter-integrated circuit communication bus may be an I2C (Inter-Integrated Circuit).

[0037] exist Figure 1 In the example, the power bus is connected to all power supply units, that is, the power bus is connected to the power supply unit 1_1, the power supply unit 1_2, ..., the power supply unit 1_m, and can be used to monitor the power information of each power supply unit in the server.

[0038] According to an embodiment of the present application, the heat dissipation controller 110 is also used to obtain power information of multiple power supply units through the signal processing module 120 according to the respective device addresses of the multiple power supply units when the baseboard management controller 130 is in an abnormal working state, and control the operating status of multiple heat dissipation devices according to the power information and the heat dissipation device operating strategy, that is, control the operating status of heat dissipation device 2_1, heat dissipation device 2_2,..., heat dissipation device 2_n.

[0039] In one embodiment, the number of heat dissipation devices may be n, where n is an integer greater than or equal to 1. For example, the heat dissipation device may include a fan. The operating state of the heat dissipation device may represent a rotation speed of the heat dissipation device.

[0040] Specifically, the device address can represent the address of the power supply unit in the power bus, so as to facilitate the query of the power information of the power supply unit based on the device address; the heat dissipation device operation strategy can represent the operation strategy for controlling heat dissipation based on information such as the power change curve of the power supply unit, the fan speed boundary value, and the PWM (Pulse Width Modulation) calculation formula.

[0041] In one embodiment, when power information is known, a pulse width modulation signal for controlling the operating states of the plurality of heat dissipation devices may be determined according to the heat dissipation device operating strategy.

[0042] According to an embodiment of the present application, a signal processing module connects the heat dissipation controller and the baseboard management controller simultaneously via an inter-IC communication bus. This ensures that the heat dissipation controller can obtain power information from all power supply units when the baseboard management controller is malfunctioning. Furthermore, the heat dissipation device operation strategy proactively controls the heat dissipation device's operation status when the baseboard management controller is malfunctioning. This ensures that the heat dissipation device maintains sufficient speed to cool the server, ensuring server reliability. Furthermore, the heat dissipation device's speed can be reduced to minimize energy consumption when the server generates less heat, achieving energy conservation and cost reduction.

[0043] According to an embodiment of the present application, the heat dissipation control device may further include a power supply board and a heat dissipation board.

[0044] Figure 2 A schematic diagram of a power supply board and a heat dissipation board according to an embodiment of the present application is shown.

[0045] like Figure 2As shown, multiple power supply units are arranged on a power board 210, that is, power supply unit 1_1, power supply unit 1_2, ..., power supply unit 1_m are arranged on the power board 210. The heat dissipation controller 110 and multiple heat dissipation devices are arranged on a heat dissipation plate 220, that is, heat dissipation device 2_1, heat dissipation device 2_2, ..., heat dissipation device 2_n are arranged on the heat dissipation plate 220.

[0046] According to an embodiment of the present application, the signal processing module 120 may include one of the following: a multiplexer, a power management logic.

[0047] The multiplexer may include an I2C DEMUX (I2C Demultiplexer); and the power management logic may include a CPLD (Load Programmable Logic Device).

[0048] According to an embodiment of the present application, the signal processing module 120 can be one of a multiplexer and a power management logic unit, so that when the baseboard management controller 130 is in an abnormal working state, the heat dissipation controller 110 can obtain the power information of each power supply unit through the signal processing module 120, thereby adjusting the operating status of multiple heat dissipation devices.

[0049] Figure 3 A schematic diagram showing a signal processing module as a multiplexer according to an embodiment of the present application is shown.

[0050] like Figure 3 As shown, the signal processing module may include a multiplexer 310 .

[0051] In one embodiment, the multiplexer 310 can be controlled by a level signal sent by the heat dissipation controller 110 to control the transmission of the acquired power signals of each power supply unit to the heat dissipation controller 110 or the baseboard management controller 130, so that the heat dissipation controller 110 or the baseboard management controller 130 can obtain the power information of multiple power supply units.

[0052] Specifically, when the signal processing module is a multiplexer 310, the heat dissipation controller 110 can also be used to send a first level signal to the multiplexer 310 when the baseboard management controller 130 is in a normal working state, so that the baseboard management controller 130 can be used to obtain power information of multiple power supply units through the multiplexer 310, thereby determining a pulse width modulation signal for adjusting the operating status of multiple heat dissipation devices according to the power information and the heat dissipation device operating strategy.

[0053] In one embodiment, when the baseboard management controller 130 is in normal operation, the thermal controller 110 may set the level signal it sends to a low level. That is, when the baseboard management controller 130 is in normal operation, the first level signal sent by the thermal controller 110 is a low level. The thermal controller 110 sends the first level signal to the multiplexer 310. Based on the low first level signal, the multiplexer 310 determines that the baseboard management controller 130 controls the power bus, allowing the baseboard management controller 130 to obtain power information of multiple power supply units.

[0054] According to an embodiment of the present application, after acquiring power information from multiple power supply units, baseboard management controller 130 can determine the speed to which the heat sink's operating state needs to be modulated based on the power information and the heat sink's operating strategy. Baseboard management controller 130 then sends the determined speed to heat sink controller 110, which then converts the speed into a pulse-width modulation signal based on the received speed and according to preset rules.

[0055] In one embodiment, the baseboard management controller 130 may send the rotation speed to the thermal controller 110 via an I2C bus.

[0056] The preset rule may represent a conversion rule between the rotation speed and the pulse width modulation signal.

[0057] According to an embodiment of the present application, the heat dissipation controller 110 sends a pulse width modulation signal to a plurality of heat dissipation devices, so that the heat dissipation devices adjust their own operating states, that is, adjust their own rotation speeds, based on the pulse width modulation signal.

[0058] According to an embodiment of the present application, the signal processing module is a multiplexer. When the baseboard management controller 130 is in normal working state, the heat dissipation controller 110 will issue a first level signal (low level) and send the first level signal to the multiplexer, so that the baseboard management controller 130 can obtain the power information of each power supply unit, and thus, based on the power information and the heat dissipation device operation strategy, a pulse width modulation signal for adjusting the operating status of multiple heat dissipation devices can be determined, so that the heat dissipation device can adjust its own operating status based on the pulse width modulation signal.

[0059] According to an embodiment of the present application, when the signal processing module is a multiplexer 310, the heat dissipation controller 110 can also be used to send a second level signal to the multiplexer when the baseboard management controller 130 is in an abnormal working state, so that the heat dissipation controller 110 obtains power information of multiple power supply units through the multiplexer.

[0060] In one embodiment, when the baseboard management controller 130 is in an abnormal operating state, the thermal controller 110 may set the level signal it sends to a high level. That is, when the baseboard management controller 130 is in an abnormal operating state, the second level signal sent by the thermal controller 110 is a high level. The thermal controller 110 sends the second level signal to the multiplexer 310. Based on the high second level signal, the multiplexer 310 determines that the thermal controller 110 controls the power bus. This allows the thermal controller 110 to obtain power information of multiple power units through the multiplexer based on the device addresses stored in the storage unit 111.

[0061] According to an embodiment of the present application, after obtaining power information from multiple power supply units, the heat dissipation controller 110 can first determine the speed to which the heat dissipation device's operating state needs to be modulated based on the power information and the heat dissipation device operating strategy, and then convert the speed into a pulse-width modulation signal according to a preset rule. Thus, the heat dissipation controller 110 sends the pulse-width modulation signal to the multiple heat dissipation devices, causing the heat dissipation devices to adjust their operating state, that is, adjust their speed, based on the pulse-width modulation signal.

[0062] According to an embodiment of the present application, the signal processing module is a multiplexer. When the baseboard management controller 130 is in an abnormal working state, the heat dissipation controller 110 will send a second level signal (high level) and send the second level signal to the multiplexer, so that the heat dissipation controller 110 can obtain the power information of each power supply unit, and thus based on the power information and the heat dissipation device operation strategy, a pulse width modulation signal for adjusting the operating status of multiple heat dissipation devices can be determined, so that the heat dissipation device can adjust its own operating status based on the pulse width modulation signal, thereby realizing flexible control of the operating status of the heat dissipation device when the baseboard management controller is in an abnormal working state.

[0063] Figure 4 A schematic diagram showing a signal processing module as a power management logic according to an embodiment of the present application is shown.

[0064] like Figure 4 As shown, the signal processing module may further include a power management logic 410 . In the case where the signal processing module is the power management logic 410 , the power management logic 410 is disposed on the power board 210 .

[0065] According to an embodiment of the present application, the power management logic 410 is connected to all power supply units through a power bus, that is, the power management logic 410 is connected to the power supply unit 1_1, the power supply unit 1_2, ..., the power supply unit 1_m through the power bus.

[0066] In one embodiment, the baseboard management controller 130 and the thermal controller 110 are each connected to the power management logic 410 via a set of I2C buses. Both sets of I2C buses can obtain the power information of each power unit through the power management logic 410, that is, the baseboard management controller 130 and the thermal controller 110 can each obtain the power information of each power unit through the power management logic 410.

[0067] In one embodiment, when the baseboard management controller 130 is in normal working condition, the inter-IC communication bus between the power management logic 410 and the thermal controller 110 is in a non-operating state. Therefore, when the baseboard management controller 130 is in normal working condition, the inter-IC communication bus between the power management logic 410 and the thermal controller 110 is in a non-operating state by default. Only the baseboard management controller 130 can access the power management logic 410 via the I2C bus. In other words, only the baseboard management controller 130 can access the power management logic 410 via the inter-IC communication bus.

[0068] On this basis, the baseboard management controller 130 is further configured to obtain power information of multiple power supply units through the power management logic 410, and determine target rotational speeds for the multiple heat sinks based on the power information and the heat sink operation strategy. The baseboard management controller 130 can then send the target rotational speeds to the heat sink controller 110. The heat sink controller 110 is configured to convert the received target rotational speeds into pulse-width modulation signals according to preset rules, and send the pulse-width modulation signals to each heat sink. This causes the heat sink to adjust its operating state, i.e., its rotational speed, based on the pulse-width modulation signals, thereby adjusting the operating state of the multiple heat sinks.

[0069] According to an embodiment of the present application, the signal processing module is a power management logic 410. When the baseboard management controller is in a normal working state, the inter-integrated circuit communication bus between the power management logic 410 and the heat dissipation controller 110 is in an inoperative state, that is, the inter-integrated circuit communication bus between the power management logic 410 and the heat dissipation controller 110 is not working by default. Only the baseboard management controller 130 obtains the power information of each power supply unit through the power management logic 410, so that the baseboard management controller 130 determines the target speed of multiple heat dissipation devices, and then adjusts the operating state of each heat dissipation device based on the target speed through the heat dissipation controller 110, that is, adjusts the speed of each heat dissipation device.

[0070] According to an embodiment of the present application, when the signal processing module is the power management logic 410, the thermal controller 110 is further configured to obtain power information of multiple power supply units through the power management logic 410 when the baseboard management controller 130 is in an abnormal operating state. Thus, the thermal controller 110 can access the power management logic 410 through the I2C bus only when the baseboard management controller 130 is in an abnormal operating state.

[0071] On this basis, the heat dissipation controller 110 can determine the pulse width modulation signals used to adjust the operating states of the multiple heat dissipation devices based on the power information and the heat dissipation device operating strategy. That is, the heat dissipation controller 110 can first determine the speed to which the operating state of the heat dissipation device needs to be modulated based on the power information and the heat dissipation device operating strategy, and then convert the speed into a pulse width modulation signal according to a preset rule. As a result, the heat dissipation controller 110 sends the pulse width modulation signals to the multiple heat dissipation devices, so that the heat dissipation devices adjust their own operating states, that is, adjust their own speeds, based on the pulse width modulation signals.

[0072] According to an embodiment of the present application, the signal processing module is a power management logic 410. When the baseboard management controller 130 is in an abnormal working state, the heat dissipation controller 110 is used to obtain the power information of each power supply unit through the power management logic 410, so that the heat dissipation controller 110 determines the pulse width modulation signal for adjusting the operating state of multiple heat dissipation devices based on the power information, thereby realizing the flexible control of the operating state of the heat dissipation device when the baseboard management controller is in an abnormal working state.

[0073] According to an embodiment of the present application, the storage unit 111 is also used to store a first preset speed and a second preset speed; the heat dissipation controller 110 is also used to control the operating status of multiple heat dissipation devices according to the first preset speed when the server is powered on and not turned on; the heat dissipation controller 110 is also used to control the operating status of multiple heat dissipation devices according to the second preset speed when the server is turned on and the baseboard management controller 130 is in an initialized state, wherein the second preset speed is greater than the first preset speed.

[0074] According to the embodiment of the present application, since the server does not generate heat if it is powered on but not turned on, the heat dissipation device does not need to rotate at a high speed to avoid wasting power. Therefore, after the server is powered on, it is necessary to monitor whether the server is turned on. Thus, when the server is powered on but not turned on, the heat dissipation controller 110 can control the operating status of the multiple heat dissipation devices according to the first preset speed.

[0075] According to an embodiment of the present application, while the server is powered on, it is also necessary to monitor the operating status of the baseboard management controller 130. If the baseboard management controller 130 is in the initialization state, it cannot monitor the temperature information within the server and control the rotation speed of the heat dissipation device. Therefore, the heat dissipation controller 110 can control the operating status of multiple heat dissipation devices according to the second preset rotation speed.

[0076] The first preset rotational speed and the second preset rotational speed are fixed rotational speeds set according to needs.

[0077] According to an embodiment of the present application, the storage unit 111 also stores a first preset speed and a second preset speed, which are used by the heat dissipation controller 110 to control the speed of the heat dissipation device based on the first preset speed or the second preset speed when the server is only powered on but not turned on and the baseboard management controller 130 is in an initialized state.

[0078] Figure 5 A schematic diagram of a management board in a heat dissipation control device according to an embodiment of the present application is shown.

[0079] like Figure 5 As shown, the heat dissipation control device may further include a management board 510 , on which the baseboard management controller 130 and the management logic 511 are disposed.

[0080] In one embodiment, the management logic 511 may include a CPLD.

[0081] Specifically, the management logic 511 can be used to: receive a watchdog timer signal from the baseboard management controller 130 , determine the working status of the baseboard management controller 130 according to the watchdog timer signal, and send the working status signal of the baseboard management controller 130 to the cooling controller 110 .

[0082] In one embodiment, when the watchdog timer signal is abnormal, the baseboard management controller 130 is in an abnormal working state; when the watchdog timer signal is normal, the baseboard management controller 130 is in a normal working state.

[0083] According to an embodiment of the present application, the working status signal may be used to indicate whether the baseboard management controller 130 is in a normal working state, an abnormal working state, or an initialization state.

[0084] According to an embodiment of the present application, the heat dissipation controller 110 can determine the working status of the baseboard management controller 130 based on the received working status signal, so that when the baseboard management controller 130 is in a normal working state, the baseboard management controller 130 controls the power bus; when the baseboard management controller 130 is in an abnormal working state or an initialization state, the heat dissipation controller 110 controls the power bus.

[0085] According to an embodiment of the present application, the baseboard management controller 130 is disposed on the management board 510. The management board 510 is also provided with a management logic unit 511 for receiving a watchdog timer signal from the baseboard management controller 130. This allows the baseboard management controller 130's operating status to be determined based on the watchdog timer signal, and the baseboard management controller 130's operating status signal to be sent to the thermal controller 110. Thus, the thermal controller 110 can determine the real-time operating status of the baseboard management controller 130 and promptly control and adjust the speed of the heat dissipation device using the corresponding module. Specifically, based on the real-time operating status of the baseboard management controller 130, the thermal controller 110 determines whether the baseboard management controller 130 or the thermal controller 110 is responsible for controlling and adjusting the speed of the heat dissipation device.

[0086] Based on the above-mentioned heat dissipation control device, the baseboard management controller 130 in the heat dissipation control device can also be connected to the heat dissipation controller 110 through the I2C bus to complete functions such as monitoring the temperature of the heat dissipation controller 110, reading FRU (Field Replaceable Unit), and communicating information with the heat dissipation controller 110.

[0087] In the heat dissipation control device, the heat dissipation controller 110 is connected to each heat dissipation device and controls the rotation speed of each heat dissipation device by sending a pulse width modulation signal to each heat dissipation device. In addition, each heat dissipation device can also convert the real-time rotation speed of the heat dissipation device into a TACH (Tachometer) signal and return it to the heat dissipation controller 110, so that the heat dissipation controller 110 can monitor the speed adjustment of the heat dissipation device according to the TACH (Tachometer) signal returned by the heat dissipation device.

[0088] The heat dissipation controller 110 can also convert the TACH (Tachometer) signal into I2C data and store it in the storage unit 111, so that the baseboard management controller 130 can read the real-time speed information of the heat dissipation device from the storage unit 111 to realize real-time monitoring of the speed control status of the heat dissipation device.

[0089] Figure 6 A flow chart of a heat dissipation control method according to an embodiment of the present application is shown.

[0090] like Figure 6 As shown, the heat dissipation control method 600 includes operation S610 and operation S620.

[0091] According to an embodiment of the present application, the heat dissipation control method 600 can be applied to the above Figures 1 to 5 Thermal control device shown.

[0092] In operation S610 , the heat dissipation controller obtains power information of the plurality of power supply units through a signal processing module according to respective device addresses of the plurality of power supply units stored in a storage unit when the baseboard management controller is in an abnormal working state.

[0093] In operation S620, operating states of the plurality of heat dissipation devices are controlled according to the power information and the heat dissipation device operating policies stored in the storage unit.

[0094] According to an embodiment of the present application, a signal processing module connects the heat dissipation controller and the baseboard management controller simultaneously via an inter-IC communication bus. This ensures that the heat dissipation controller can obtain power information from all power supply units when the baseboard management controller is malfunctioning. Furthermore, the heat dissipation device operation strategy proactively controls the heat dissipation device's operation status when the baseboard management controller is malfunctioning. This ensures that the heat dissipation device maintains sufficient speed to cool the server, ensuring server reliability. Furthermore, the heat dissipation device's speed can be reduced to minimize energy consumption when the server generates less heat, achieving energy conservation and cost reduction.

[0095] Figure 7 A control flow chart of a heat dissipation controller according to an embodiment of the present application is shown.

[0096] like Figure 7 As shown, the method 700 includes operations S710 to S790.

[0097] In operation S710 , it is determined whether the server is powered on.

[0098] According to an embodiment of the present application, if the server is powered on, operation S720 is performed; if the server is not powered on, no operation is performed.

[0099] In operation S720 , it is determined whether the server is powered on.

[0100] According to an embodiment of the present application, if the server is powered on, operation S740 is performed; if the server is not powered on, operation S730 is performed.

[0101] In operation S730, the heat dissipation controller controls the operating states of the plurality of heat dissipation devices according to a first preset speed.

[0102] In operation S740 , it is determined whether the baseboard management controller is in an initialization state.

[0103] According to an embodiment of the present application, if the baseboard management controller is in the initialization state, operation S750 is performed; if the baseboard management controller is not in the initialization state, operation S760 is performed.

[0104] In operation S750, the heat dissipation controller controls the operating states of the plurality of heat dissipation devices according to a second preset speed.

[0105] According to an embodiment of the present application, the heat dissipation controller continuously monitors whether the baseboard management controller is in the initialization state, so that when the baseboard management controller is not in the initialization state, the baseboard management controller controls the operating state of the heat dissipation device; when the baseboard management controller is still in the initialization state, the heat dissipation controller continues to control the operating state of the heat dissipation device.

[0106] In operation S760 , the baseboard management controller controls the operating state of the heat dissipation device.

[0107] In operation S770 , it is determined whether the baseboard management controller operates normally.

[0108] According to an embodiment of the present application, if the baseboard management controller is in normal operation, operation S760 is performed; if the baseboard management controller is not in normal operation, operation S780 is performed.

[0109] In operation S780, the heat dissipation controller obtains power information of the multiple power supply units through the signal processing module according to their respective device addresses, and controls the operation states of the multiple heat dissipation devices according to the power information and the heat dissipation device operation strategy.

[0110] In operation S790 , it is determined whether the baseboard management controller recovers to normal.

[0111] According to an embodiment of the present application, if the baseboard management controller recovers to normal, operation S760 is performed; if the baseboard management controller does not recover to normal, operation S780 is performed.

[0112] Based on the above content, whether the server is powered on, whether the server is turned on, whether the baseboard management controller is in the initialization state, whether the baseboard management controller is working normally, and whether the baseboard management controller has returned to normal, determine whether the operating status of multiple cooling devices is controlled by the cooling controller or the baseboard management controller controls the operating status of multiple cooling devices.

[0113] In one embodiment, the heat dissipation controller also continuously monitors the working status of the baseboard management controller. If the baseboard management controller returns to normal working status, the control of the power bus is returned to the baseboard management controller. The heat dissipation controller adjusts the speed of the heat dissipation device according to the information sent by the baseboard management controller and uploads the speed information of the heat dissipation device; if the baseboard management controller has not returned to normal working status, that is, the baseboard management controller is still in an abnormal working state, the control of the power bus and the speed control of the heat dissipation device are still controlled by the heat dissipation controller.

[0114] Based on the above content, it can be seen that the heat dissipation control device of the present application can flexibly control the rotation speed of the heat dissipation device as needed according to the power information of each power supply unit by the heat dissipation controller when the baseboard management controller is malfunctioning. This can ensure that the heat dissipation device has sufficient rotation speed to perform air cooling on the server and ensure the reliability of the server operation; it can also reduce the rotation speed of the heat dissipation device to reduce energy consumption when the server generates less heat, thereby achieving the purpose of energy saving and consumption reduction.

[0115] The present application also provides a server, comprising the above-mentioned heat dissipation control device.

[0116] Since the server includes the above-mentioned heat dissipation control device, it has the beneficial effects of the above-mentioned heat dissipation control device, which will not be described in detail here.

[0117] Those skilled in the art will appreciate that the features described in the various embodiments of this application may be combined and / or coupled in various ways, even if such combinations or couplings are not explicitly described in this application. In particular, the features described in the various embodiments of this application may be combined and / or coupled in various ways without departing from the spirit and teachings of this application. All such combinations and / or couplings fall within the scope of this application.

[0118] The embodiments of the present application have been described above. However, these embodiments are for illustrative purposes only and are not intended to limit the scope of the present application. Although each embodiment has been described separately above, this does not mean that the measures in each embodiment cannot be advantageously used in combination. Without departing from the scope of the present application, those skilled in the art may make various substitutions and modifications, and these substitutions and modifications should all fall within the scope of the present application.

Claims

1. A heat dissipation control device, characterized in that: The heat dissipation control device comprises: A heat dissipation controller, the heat dissipation controller comprising a storage unit, the storage unit being used to store the device addresses and heat dissipation device operation strategies of the respective power supply units; a signal processing module electrically connected to the plurality of power supply units via a power bus, and electrically connected to the heat dissipation controller and the baseboard management controller via an inter-integrated circuit communication bus; The heat dissipation controller is further configured to, when the baseboard management controller is in an abnormal working state, obtain power information of the multiple power supply units through the signal processing module according to the device addresses of the multiple power supply units, and control the operating states of the multiple heat dissipation devices according to the power information and the heat dissipation device operating strategy; The heat dissipation device operation strategy represents an operation strategy for controlling heat dissipation based on a power change curve of a power supply unit, a fan speed boundary value, and a pulse width calculation formula; The heat dissipation controller is also used to monitor the speed adjustment of the heat dissipation device according to the tachometer signal sent back by the heat dissipation device, and store the tachometer signal in the storage unit so that the baseboard management controller can read the real-time speed information of the heat dissipation device from the storage unit.

2. The heat dissipation control device according to claim 1, characterized in that: The heat dissipation control device also includes a power supply board and a heat dissipation board, the multiple power supply units are arranged on the power supply board, and the heat dissipation controller and the multiple heat dissipation devices are arranged on the heat dissipation board; the signal processing module includes one of the following: a multiplexer, a power management logic.

3. The heat dissipation control device according to claim 2, characterized in that: The signal processing module includes the multiplexer, The heat dissipation controller is also used for, when the baseboard management controller is in normal working state, A first level signal is sent to the multiplexer so that the baseboard management controller is used to obtain power information of the multiple power supply units through the multiplexer, thereby determining a pulse width modulation signal for adjusting the operating status of the multiple heat dissipation devices according to the power information and the heat dissipation device operating strategy.

4. The heat dissipation control device according to claim 3, characterized in that: The heat dissipation controller is also used for, when the baseboard management controller is in an abnormal working state, A second level signal is sent to the multiplexer, so that the heat dissipation controller obtains power information of the multiple power supply units through the multiplexer.

5. The heat dissipation control device according to claim 2, characterized in that: The signal processing module includes the power management logic, which is arranged on the power board. When the baseboard management controller is in a normal working state, the inter-integrated circuit communication bus between the power management logic and the thermal controller is in a non-working state; The baseboard management controller is further configured to: Acquiring power information of the plurality of power supply units through the power management logic; determining target rotational speeds of the plurality of heat dissipation devices according to the power information; The target rotational speed is sent to the heat dissipation controller, and the heat dissipation controller is used to adjust the operating states of the multiple heat dissipation devices according to the target rotational speed.

6. The heat dissipation control device according to claim 5, characterized in that: The heat dissipation controller is also used for, when the baseboard management controller is in an abnormal working state, Acquiring power information of the plurality of power supply units through the power management logic; A pulse width modulation signal for adjusting the operating states of the plurality of heat dissipation devices is determined according to the power information and the heat dissipation device operating strategy.

7. The heat dissipation control device according to any one of claims 1 to 6, characterized in that: The storage unit is further configured to store a first preset rotational speed and a second preset rotational speed; The heat dissipation controller is further configured to control the operating states of the plurality of heat dissipation devices according to the first preset rotational speed when the server is powered on but not turned on; The heat dissipation controller is further configured to control the operating states of the plurality of heat dissipation devices according to the second preset speed when the server is powered on and the baseboard management controller is in an initialized state, wherein the second preset speed is greater than the first preset speed.

8. The heat dissipation control device according to claim 1, wherein: The heat dissipation control device further includes a management board, and the baseboard management controller and management logic are arranged on the management board. The management logic is used to: receiving a watchdog timer signal from the baseboard management controller; determining the operating state of the baseboard management controller according to the watchdog timer signal; The operating status signal of the baseboard management controller is sent to the heat dissipation controller.

9. A heat dissipation control method, applied to the heat dissipation control device according to any one of claims 1 to 8, characterized in that: The heat dissipation control method includes: Using the heat dissipation controller, when the baseboard management controller is in an abnormal working state, the signal processing module obtains the power information of the multiple power supply units according to the device addresses of the multiple power supply units stored in the storage unit; The operating states of the plurality of heat dissipation devices are controlled according to the power information and the heat dissipation device operating strategies stored in the storage unit.

10. A server, characterized in that: It comprises the heat dissipation control device according to any one of claims 1 to 8.

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