LED eutectic welding equipment and welding method

Abstract

The invention relates to LED eutectic welding equipment and a welding method, and relates to the technical field of LED packaging, the LED eutectic welding equipment comprises a box body, a plurality of conveying assemblies, a clamping assembly, a cleaning assembly and a welding machine, the multiple conveying assemblies are arranged outside the box body, the multiple conveying assemblies are arranged in the height direction of the box body at intervals, and the clamping assembly is arranged between the multiple conveying assemblies. The clamping assembly comprises a first clamping piece and a plurality of second clamping pieces, the number of the second clamping pieces is matched with that of the conveying assembly, the second clamping pieces are arranged at intervals in the height direction of the box body, the first clamping piece is arranged on one side of the second clamping pieces, and a containing gap is formed between the first clamping piece and the second clamping pieces; the side, close to the conveying assembly, of the box is slidably connected with a first mounting plate, the side wall, away from the first mounting plate, of the box is slidably connected with a second mounting plate, the cleaning assembly is arranged on the second mounting plate, and the welding machine is arranged on one side of the conveying assembly. The chip welding device has the effect of improving the welding quality of chips of different specifications.

Description

Technical Field

[0001] The present application relates to the field of LED packaging technology, and in particular to an LED eutectic welding device and a welding method. Background Art

[0002] Eutectic bonding is a critical process in LED manufacturing, used to bond the LED chip to the substrate. The quality of the bond directly impacts LED performance and reliability. Before bonding, the wafer must be thoroughly cleaned to remove contaminants, ensure a clean interface, and improve bond strength and conductivity.

[0003] When eutectic welding chips and Cu pillars, the chips need to be cleaned centrally. Cleaning methods include ultrasonic cleaning, chemical cleaning and plasma cleaning. After cleaning, they also need to be dried. Only after drying can they be placed in the welding equipment for eutectic welding.

[0004] Regarding the above-mentioned related technologies, the chips have different sizes and specifications, which may cause damage in the cleaning equipment and may be secondary contaminated during the transfer process, affecting the welding quality. Summary of the Invention

[0005] In order to improve the welding quality of chips of different specifications, the present application provides an LED eutectic welding device and a welding method.

[0006] In a first aspect, the present application provides an LED eutectic welding device, which adopts the following technical solutions: An LED eutectic welding device includes a box, a conveying component, a clamping component, a cleaning component and a welding machine, wherein the conveying component is provided with multiple, multiple conveying components are arranged outside the box, multiple conveying components are arranged at intervals along the height direction of the box, the conveying component is used to place the chip on the clamping component, the clamping component is arranged in the box, the clamping component includes a first clamping member and multiple second clamping members, the number of the second clamping members is adapted to the conveying component, the multiple second clamping members are arranged at intervals along the height direction of the box, the first clamping member is arranged on one side of the multiple second clamping members, the first clamping member is arranged on one side of the multiple second clamping members, and the first clamping member is arranged on the other side of the multiple second clamping members. There is a placement gap between the component and the second clamping component, and the second clamping component is used to adjust the distance of the placement gap. The side of the box body close to the transmission component is slidably connected to the first mounting plate, and the side wall of the box body away from the first mounting plate is slidably connected to the second mounting plate. The first mounting plate and the second mounting plate are used to close both sides of the box body. The cleaning component is arranged on the second mounting plate, and the cleaning component is used to clean the chip clamped between the first clamping component and the second clamping component. The welding machine is arranged on one side of the transmission component, and the transmission component can also place the chip in the welding machine. The welding machine is used to weld the chip and the Cu column.

[0007] By adopting the above technical solution, the conveying component conveys the chip to the clamping component, that is, the conveying component can place the chip in the placement gap, the first clamping member and the second clamping member clamp the chip, and then the first mounting plate and the second mounting plate are closed, and the chip located in the box is cleaned using the cleaning component. After cleaning, the first mounting plate is opened, and the conveying component places the chip in the welding machine, so that the welding machine welds the chip and the Cu column. Since the placement gap between the first clamping member and the second clamping member can be adjusted, chips of different specifications can be cleaned and enter the welding machine for welding after cleaning, which facilitates the cleaning of chips of different specifications while improving the welding quality of chips of different specifications.

[0008] Optionally, the first clamping member includes a clamping bar and a first driving member, the clamping bar is located in the box body, the first driving member is provided outside the box body, the output end of the first driving member passes through the box body and is connected to the clamping bar, the first driving member is used to drive the clamping bar close to or away from the side wall of the box body provided with the first driving member, the second clamping member includes a conveyor belt, a second driving member and a plurality of clamping blocks provided on the conveyor belt, the conveyor belt is provided in the box body, the second driving member is connected to the plurality of conveyor belts, the second driving member is used to drive the plurality of conveyor belts to move simultaneously, the plurality of clamping blocks are arranged at intervals along the conveyor belt, and the thickness of the plurality of clamping blocks increases successively.

[0009] By adopting the above technical solution, since chips are usually made of brittle materials such as silicon and have low tensile strength, they are prone to breakage at stress concentration points, especially when the clamping force comes from two directions, which may lead to complex stress distribution inside the chip and increase the risk of breakage. Therefore, when using the first clamping member and the second clamping member to clamp the chip, first select the clamping block in the second clamping member, adjust the clamping block with moderate thickness to be close to the clamping bar, minimize the distance between the chip and the clamping bar, use the first driving member to fine-tune the clamping bar, reduce the possibility of uneven clamping force distribution, facilitate simultaneous clamping of multiple chips, and reduce the clamping force on the chip.

[0010] Optionally, the second driving member includes a driving gear, a driving belt and a rotational drive, the driving gear is connected to any rotating end of the conveyor belt, one driving gear is corresponding to one conveyor belt, the driving belt is engaged with multiple driving gears, the rotational drive is connected to the driving belt, and the rotational drive is used to drive the driving belt to move.

[0011] By adopting the above technical solution, the rotation drive is started, and the rotation drive drives the drive belt to move. When the drive belt moves, it drives multiple drive gears to rotate, and the drive gears drive the conveyor belt connected to it to move. When the transmission belt moves, the required clamping blocks are driven close to the clamping bar, making it convenient to move the clamping blocks at the same time.

[0012] Optionally, the conveying component includes a conveying part and a placing part. A bracket is provided on one side of the box body. The conveying part and the placing part are both provided on the bracket. The conveying part is located below the placing part. The placing part is used to place the chip conveyed on the conveying part in the placement gap.

[0013] By adopting the above technical solution, the chip to be cleaned is placed on the conveying member. When the chip is located under the placement member, the placement member moves the chip from the conveying member to the placement gap, and one end of the chip is attached to the end of the clamping block away from the conveyor belt. When clamping the chip, the first driving member is started to fine-tune the clamping bar so that the clamping bar and the clamping block clamp and fix the chip, which is convenient for cleaning the chip.

[0014] Optionally, the cleaning assembly includes a first nozzle, a first connecting pipe and a water spray part. There are multiple first nozzles, and the number of first nozzles is the same as the number of second clamping parts. The first nozzles are facing the placement gap, and the first connecting pipe is arranged on the side of the second mounting plate away from the second clamping part. The multiple first nozzles are all connected to the first connecting pipe, and the water spray part is connected to the first connecting pipe. The water spray part is used to supply liquid to the first connecting pipe. The first nozzles are all provided with a jet part, and the jet part is used to dry the chip.

[0015] By adopting the above technical solution, the water spray component is started, and the water spray component transports the cleaning liquid through the first connecting pipe to the first nozzle, and finally sprays it out from the first nozzle to rinse the chip. After rinsing, the chip is dried using the jet component.

[0016] Optionally, the jet component includes multiple second nozzles, a second connecting pipe and a hot air blower. There are multiple second nozzles, the second connecting pipe is provided on the second mounting plate, the second nozzles are all connected to the second connecting pipe, the hot air blower is connected to the second connecting pipe, and the hot air blower is used to transport hot air into the second connecting pipe.

[0017] By adopting the above technical solution, when drying the chip, the hot air blower is started to supply air into the second connecting pipe. The hot air is transported to the second nozzle through the second connecting pipe, and the second nozzle is used to supply air to dry the chip.

[0018] Optionally, the clamping block is detachably connected to the conveyor belt.

[0019] By adopting the above technical solution, when the clamping block is worn, it is easy to disassemble and assemble the clamping block, and it is also easy to replace the clamping material corresponding to the chip made of different materials.

[0020] Optionally, both the first mounting plate and the second mounting plate are provided with a linear drive.

[0021] By adopting the above technical solution, linear drive facilitates the opening and closing of the first mounting plate and the second mounting plate.

[0022] On the other hand, the present application also provides a welding step applicable to the above-mentioned LED eutectic welding equipment.

[0023] A method for eutectic welding of LEDs, the welding steps are as follows: The metal fixture and Cu column were ultrasonically cleaned with organic solvent and deionized water and then dried; The chip is placed and clamped between the first clamping member and the second clamping member; Close the first mounting plate and the second mounting plate to form a closed space in the box; Use cleaning components to clean and dry the chip; Place the Cu pillar in a metal fixture, position the Cu pillar and chip in a bonding machine, and use the bonding machine to perform eutectic bonding on the chip and the Cu pillar.

[0024] By adopting the above technical solution, chips of different specifications can be placed in the box for cleaning and drying, and then the chips and Cu pillars can be eutectic welded in the welding machine, which facilitates the welding of chips of different specifications, reduces the possibility of contamination during the secondary transportation of chips, and improves the welding quality.

[0025] In summary, this application includes at least one of the following beneficial technical effects: 1. By arranging movable first clamping plates and second clamping plates on the box body, it is convenient to place the chip in the box body for cleaning. The first clamping member and the second clamping member in the box body can clamp chips of various specifications, and after cleaning, the chip is placed in the welding machine by the transmission assembly for welding, thereby improving the welding quality of chips of different specifications.

[0026] 2. By configuring the first clamping member as a sticking bar and the second clamping member as a clamping block with multiple adjustable thicknesses, the possibility of uneven clamping force distribution when clamping the chip is reduced.

[0027] Figures In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0028] Figure 1 This is a schematic structural diagram of an LED eutectic welding device according to an embodiment of the present application; Figure 2 This is a transverse three-dimensional cross-sectional view of an LED eutectic welding device according to an embodiment of the present application; Figure 3This is a longitudinal stereoscopic cross-sectional view of an LED eutectic welding device according to an embodiment of the present application; Figure 4 This is a transverse stereoscopic cross-sectional view of an LED eutectic welding device from another perspective according to an embodiment of the present application; Figure 5 This is a longitudinal stereoscopic cross-sectional view of an LED eutectic welding device from another perspective according to an embodiment of the present application.

[0029] Explanation of the accompanying drawings: 1. Box body; 11. First mounting plate; 12. Second mounting plate; 13. Linear drive; 2. Conveying assembly; 21. Conveying member; 22. Placing member; 3. Clamping assembly; 31. First clamping member; 311. Clamping bar; 312. First driving member; 32. Second clamping member; 321. Conveyor belt; 322. Second driving member; 323. Driving gear; 323. Driving belt; 324. Rotational drive; 3241. Main gear; 3242. Rotating motor; 325. Clamping block; 4. Cleaning assembly; 41. First nozzle; 42. First connecting pipe; 43. Water spraying member; 431. Water pump; 432. Water tank; 44. Jet member; 441. Second nozzle; 442. Second connecting pipe; 443. Hot air blower; 5. Welding machine. DETAILED DESCRIPTION

[0030] The following is combined with Figure 1-5 This application is described in further detail.

[0031] The embodiment of the present application discloses an LED eutectic welding device.

[0032] Reference Figure 1 、 Figure 2 and Figure 3, an LED eutectic welding device includes a box 1, a conveying component 2, a clamping component 3, a cleaning component 4 and a welding machine 5, wherein the conveying components 2 are provided with multiple, and the multiple conveying components 2 are all provided outside the box 1, and the multiple conveying components 2 are arranged at intervals along the height direction of the box 1. In this embodiment, there are six conveying components 2, and the conveying component 2 is used to place the chip on the clamping component 3, and the clamping component 3 is provided in the box 1. The clamping component 3 includes a first clamping member 31 and multiple second clamping members 32, and the number of the second clamping members 32 is adapted to the conveying component 2. The multiple second clamping members 32 are arranged at equal intervals along the height direction of the box 1, and the first clamping member 31 is provided on one side of the multiple second clamping members 32. There is a placement gap between 31 and the second clamping member 32, and the placement gap is used to accommodate the chip. The second clamping member 32 is used to adjust the initial placement distance between the second clamping member 32 and the first sticking member in the placement gap. The side of the box body 1 close to the transmission component 2 is slidably connected to the first mounting plate 11 through the connection method of the slider groove, and the side of the box body 1 away from the first mounting plate 11 is also slidably connected to the second mounting plate 12 through the connection method of the slider groove. The first mounting plate 11 and the second mounting plate 12 are used to close both sides of the box body 1. A linear drive 13 is provided on the first mounting plate 11 and the second mounting plate 12. The linear drive 13 is a linear screw transmission structure. A water leakage hole and a water collecting tank are provided at the bottom of the box body 1 for collecting cleaning liquid.

[0033] Reference Figure 3 The cleaning component 4 is arranged on the second mounting plate 12. The cleaning component 4 is used to clean the chip clamped between the first clamping member 31 and the second clamping member 32. The welding machine 5 is arranged on one side of the conveying component 2. The conveying component 2 can also place the chip in the welding machine 5. The welding machine 5 is used to weld the chip and the Cu column. The welding machine 5 is a eutectic welding machine 5, and a plurality of robotic arms are also arranged in the welding machine 5. The robotic arms in the welding machine 5 are used to transport the cleaned chip on the conveying component 2 to the welding position of the welding machine 5.

[0034] Reference Figure 2 、 Figure 3 and Figure 4The first clamping member 31 includes a clamping strip 311 and a first driving member 312. The clamping strip 311 is located in the box body 1. The clamping strip 311 is a rubber strip. The first driving member 312 is located outside the box body 1. The output end of the first driving member 312 passes through the box body 1 and is connected to the clamping strip 311. The first driving member 312 is used to drive the clamping strip 311 to move closer to or away from the side wall of the box body 1 provided with the first driving member 312. In this embodiment, there are two first driving members 312, and the two first driving members 312 are symmetrically arranged up and down to improve the stability of the clamping strip 311 when clamping the chip. The first drive is a cylinder, and the second clamping member 32 includes a transmission The conveyor belt 321, the second driving member 322 and the six clamping blocks 325 arranged on the conveyor belt 321, the conveyor belt 321 is arranged in the box body 1, the second driving member 322 is connected to multiple conveyor belts 321, the second driving member 322 is used to drive multiple conveyor belts 321 to move simultaneously, the six clamping blocks 325 are arranged at intervals along the conveyor belt, the thickness of the six clamping blocks 325 increases successively, the clamping blocks 325 are rubber blocks, and the arrangement area of the six clamping blocks 325 accounts for half of the conveyor belt 321, that is, half of the conveyor belt 321 has a clamping block 325, and the clamping block 325 is fixed to the conveyor belt 321 by bolts.

[0035] Further, refer to Figure 2 、 Figure 3 and Figure 4 The second driving member 322 includes a driving gear 323, a driving belt 323 and a rotation drive 324. The driving gear 323 is connected to any rotating end of the conveyor belt 321. One driving gear 323 is corresponding to one conveyor belt 321. The driving belt 323 is engaged with six driving gears 323. The rotation drive 324 is connected to the driving belt 323. The rotation drive 324 is used to drive the driving belt 323 to move. In this embodiment, the rotation drive 324 includes a main gear 3241 and a rotation motor 3242. The main gear 3241 is arranged above the multiple driving gears 323. The main gear 3241 is meshed with the driving belt 323. The rotating motor 3242 is on the top of the box 1, and the rotating motor 3242 is located outside the box 1. The rotating motor 3242 is key-connected with the main gear 3241. The rotating motor 3242 is a servo motor, which drives the rotating motor 3242. The rotating motor 3242 drives the main gear 3241 to rotate. When the main gear 3241 rotates, it drives the driving belt 323 to move. When the driving belt 323 moves, the multiple driving gears 323 drive the conveyor belt 321 to move, so that the clamping block 325 on the transmission belt moves, which is convenient for selecting the clamping block 325 that is suitable for the size of the chip to be clamped. Specifically, refer to Figure 2 、 Figure 3 and Figure 4The conveyor assembly 2 includes a conveyor member 21 and a placement member 22. A bracket is provided on one side of the housing 1. Both the conveyor member 21 and the placement member 22 are mounted on the bracket. The conveyor member 21 is positioned below the placement member 22. The placement member 22 is used to place the chips conveyed by the conveyor member 21 into the placement gap. In this embodiment, the conveyor member 21 is a belt conveyor member 21, and the placement member 22 is a robotic arm. In another embodiment, the conveyor member 21 is a negative pressure conveyor member 21, which can reduce the possibility of chips falling during the conveying process.

[0036] Reference Figure 4 and Figure 5 The cleaning assembly 4 includes a first nozzle 41, a first connecting pipe 42 and a water spray part 43. There are six first nozzles 41. The number of first nozzles 41 is the same as the number of second clamping parts 32. The first nozzles 41 are directed toward the placement gap. The first connecting pipe 42 is provided on the side of the second mounting plate 12 away from the second clamping part 32. Multiple first nozzles 41 are connected to the first connecting pipe 42. The water spray part 43 is connected to the first connecting pipe 42. The water spray part 43 is used to supply liquid to the first connecting pipe 42. The first nozzles 41 are all provided with a jet part 44, which is used to dry the chip.

[0037] Reference Figure 4 and Figure 5 The water spraying part 43 is a water pump 431 and a water tank 432. The water tank 432 is arranged on the side of the box body 1 close to the second mounting plate 12. The end of the first connecting pipe 42 is located in the water tank 432. The water pump 431 is connected to the first connecting pipe 42 through a flange. When the water pump 431 is started, the water pump 431 pumps the cleaning liquid in the water tank 432 into the first connecting pipe 42, and the first nozzle 41 sprays it onto the chip placed in the gap to rinse the chip. After rinsing, the jet part 44 is started to dry the chip. The dried chip is welded to improve the cleanliness of the welded chip, thereby improving the welding quality of the chip.

[0038] Among them, reference Figure 4 and Figure 5 The air injection component 44 includes multiple second nozzles 441, a second connecting pipe 442, and a hot air blower 443. The second connecting pipe 442 is welded to the second mounting plate 12. The second nozzles 441 are all connected to the second connecting pipe 442. The hot air blower 443 is also connected to the second connecting pipe 442. The hot air blower 443 is used to deliver hot air into the second connecting pipe 442. In this embodiment, there are four second nozzles 441. The four second nozzles 441 are rectangular, with the first nozzle 41 placed at the center of the four second nozzles 441. To save energy, a hot air blower 443 is connected between every two adjacent second connecting pipes 442 through a connecting pipe.

[0039] The implementation principle of an LED eutectic welding device in an embodiment of the present application is as follows: the chip is transported through the conveying component 2, the rotation drive 324 is started, the rotation drive 324 belt 323 drives the conveyor belt 321 to move, the clamping block 325 in the second clamping member 32 is selected, and the clamping block 325 with moderate thickness is adjusted to be close to the clamping bar 311 to minimize the distance between the chip and the clamping bar 311. The placement member 22 places the chip between the first clamping member 31 and the second clamping member 32, and when placing, one end of the chip is in contact with the clamping block 325 away from the end of the conveyor belt 321, the first driving member 312 is used to fine-tune the clamping bar 311, the first mounting plate 11 and the second mounting plate 12 are closed, the cleaning component is used to spray and then dry, and then the first mounting plate 11 is opened, and the placement member 22 transports the cleaned chip to the welding machine 5 for welding, thereby improving the welding quality of chips of different specifications.

[0040] In addition, this application also discloses a welding step of an LED eutectic welding method: The metal fixture and Cu column were ultrasonically cleaned with organic solvent and deionized water and then dried; The chip is placed and clamped between the first clamping member 31 and the second clamping member 32; Close the first mounting plate 11 and the second mounting plate 12 to form a closed space in the box body 1; Use cleaning component 4 to clean and dry the chip; The Cu pillar is placed in a metal fixture, the Cu pillar and the chip are positioned in a bonding machine 5 , and the bonding machine 5 is used to perform eutectic bonding on the chip and the Cu pillar.

[0041] Unless otherwise defined, the technical or scientific terms used in this application shall have the usual meanings understood by persons of ordinary skill in the field to which this application belongs. The words "first", "second", "third" and similar terms used in the specification and claims of this application do not indicate any order, quantity or importance, but are only used to distinguish different components. Words such as "one" or "a" do not indicate a quantity limitation, but rather indicate the existence of at least one. Words such as "include" or "comprise" mean that the elements or objects appearing before "include" or "comprises" cover the elements or objects listed after "include" or "comprises" and their equivalents, and do not exclude other elements or objects. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0042] The above are all optional embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. An LED eutectic welding device, characterized by: The invention comprises a box body (1), a conveying assembly (2), a clamping assembly (3), a cleaning assembly (4) and a welding machine (5), wherein the conveying assembly (2) is provided with a plurality of conveying assemblies (2), the plurality of conveying assemblies (2) are all arranged outside the box body (1), the plurality of conveying assemblies (2) are arranged at intervals along the height direction of the box body (1), the conveying assembly (2) is used to place the chip on the clamping assembly (3), the clamping assembly (3) is arranged in the box body (1), the clamping assembly (3) comprises a first clamping member (31) and a plurality of second clamping members (32), the number of the second clamping members (32) is adapted to the conveying assembly (2), the plurality of second clamping members (32) are arranged at intervals along the height direction of the box body (1), the first clamping member (31) is arranged on one side of the plurality of second clamping members (32), and the first clamping member (31) and the second clamping member (32) are arranged at intervals along the height direction of the box body (1). There is a placement gap between the two clamping members (32), and the second clamping member (32) is used to adjust the distance of the placement gap. The side of the box body (1) close to the transmission component (2) is slidably connected to the first mounting plate (11), and the side wall of the box body (1) away from the first mounting plate (11) is slidably connected to the second mounting plate (12). The first mounting plate (11) and the second mounting plate (12) are used to close both sides of the box body (1). The cleaning component (4) is provided on the second mounting plate (12). The cleaning component (4) is used to clean the chip clamped between the first clamping member (31) and the second clamping member (32). The welding machine (5) is provided on one side of the transmission component (2). The transmission component (2) can also place the chip in the welding machine (5). The welding machine (5) is used to weld the chip and the Cu column.

2. The LED eutectic welding equipment according to claim 1, characterized in that: The first clamping member (31) includes a clamping bar (311) and a first driving member (312). The clamping bar (311) is located inside the box (1). The first driving member (312) is located outside the box (1). The output end of the first driving member (312) passes through the box (1) and is connected to the clamping bar (311). The first driving member (312) is used to drive the clamping bar (311) to move closer to or away from the side wall of the box (1) provided with the first driving member (312). The second clamping member (311) is provided with a first driving member (312). The member (32) includes a conveyor belt (321), a second driving member (322), and a plurality of clamping blocks (325) arranged on the conveyor belt (321); the conveyor belt (321) is arranged in the box body (1); the second driving member (322) is connected to the plurality of conveyor belts (321); the second driving member (322) is used to drive the plurality of conveyor belts (321) to move simultaneously; the plurality of clamping blocks (325) are arranged at intervals along the conveyor belt; and the thickness of the plurality of clamping blocks (325) increases in sequence.

3. The LED eutectic welding equipment according to claim 2, characterized in that: The second driving member (322) includes a driving gear (323), a driving belt (323) and a rotation drive (324). The driving gear (323) is connected to any rotating end of the conveyor belt (321). One driving gear (323) is correspondingly provided for one conveyor belt (321). The driving belt (323) is meshed with multiple driving gears (323). The rotation drive (324) is connected to the driving belt (323). The rotation drive (324) is used to drive the driving belt (323) to move.

4. The LED eutectic welding equipment according to claim 1, characterized in that: The conveying assembly (2) includes a conveying member (21) and a placing member (22). A bracket is provided on one side of the box body (1). The conveying member (21) and the placing member (22) are both provided on the bracket. The conveying member (21) is located below the placing member (22). The placing member (22) is used to place the chip conveyed on the conveying member (21) in the placement gap.

5. The LED eutectic welding equipment according to claim 1, characterized in that: The cleaning assembly (4) includes a first nozzle (41), a first connecting pipe (42) and a water spraying member (43). The first nozzle (41) is provided in plurality, and the number of the first nozzles (41) is the same as the number of the second clamping members (32). The first nozzle (41) faces the placement gap, and the first connecting pipe (42) is provided on a side of the second mounting plate (12) away from the second clamping member (32). The plurality of first nozzles (41) are all connected to the first connecting pipe (42), and the water spraying member (43) is connected to the first connecting pipe (42). The water spraying member (43) is used to supply liquid into the first connecting pipe (42). The first nozzle (41) is provided with a jetting member (44), and the jetting member (44) is used to dry the chip.

6. The LED eutectic welding equipment according to claim 5, characterized in that: The jet component (44) includes a plurality of second nozzles (441), a second connecting pipe (442) and a hot air blower (443). The second nozzles (441) are provided in plurality. The second connecting pipe (442) is provided on the second mounting plate (12). The second nozzles (441) are all connected to the second connecting pipe (442). The hot air blower (443) is connected to the second connecting pipe (442). The hot air blower (443) is used to transport hot air into the second connecting pipe (442).

7. The LED eutectic welding equipment according to claim 2, characterized in that: The clamping block (325) is detachably connected to the conveyor belt (321).

8. The LED eutectic welding equipment according to claim 1, characterized in that: The first mounting plate (11) and the second mounting plate (12) are both provided with a linear drive (13).

9. An LED eutectic welding method, used in an LED eutectic welding device according to any one of claims 1 to 8, characterized in that: The welding steps are as follows: The metal fixture and Cu column were ultrasonically cleaned with organic solvent and deionized water and then dried; The chip is placed and clamped between the first clamping member (31) and the second clamping member (32); Closing the first mounting plate (11) and the second mounting plate (12) to form a closed space in the box body (1); Cleaning and drying the chip using a cleaning component (4); The Cu column is placed in a metal fixture, the Cu column and the chip are positioned in a welding machine (5), and the chip and the Cu column are eutectic welded using the welding machine (5).

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