Power module

Abstract

The invention provides a power module. The power module comprises a plurality of power chips; the plurality of power chips are arranged on the front surface and the back surface of the radiator; the first leading-out terminal, the second leading-out terminal and the third leading-out terminal are electrically connected with the corresponding power chips respectively; and a first positive input terminal, a second positive input terminal, a first negative input terminal and a second negative input terminal, the first positive input terminal and the first negative input terminal are electrically connected with the power chip located on the front surface, and the second positive input terminal and the second negative input terminal are electrically connected with the power chip located on the back surface. The power chips in the power module are arranged on the front surface and the back surface of the radiator, and the number and the arrangement mode of the power chips can be set according to requirements, so that the adaptability of the power module is improved, and meanwhile, the integration level of the power module is also improved. In addition, the arrangement mode of the anode input terminal and the cathode input terminal in the power module is beneficial to reducing stray inductance of the power module.

Description

Technical Field

[0001] This application mainly relates to the field of electric vehicles, and particularly to a power module. Background Art

[0002] The power module is one of the important components in electric vehicles. The power module is used to convert the direct current output by the battery into alternating current, and the converted alternating current is delivered to the drive motor. With the rapid development of electric vehicles, the power density of the power module has been gradually increased, and at the same time, the volume of the power module has also been gradually miniaturized. How to further improve the power density of the power module and reduce the volume of the power module has always been one of the important research directions in this field. In addition, the existing power modules also have problems such as high stray inductance and current imbalance in the commutation loop. Summary of the Invention

[0003] The technical problem to be solved by this application is to provide a power module, which has the technical effects of high integration, strong adaptability and reduced stray inductance.

[0004] To solve the above technical problem, this application provides a power module, including: a plurality of power chips; a radiator, the plurality of power chips are arranged on the front and back of the radiator, the front and the back are opposite in a first direction; a first lead terminal, a second lead terminal and a third lead terminal, which are respectively electrically connected to the corresponding power chips; and a first positive input terminal, a second positive input terminal, a first negative input terminal and a second negative input terminal, the first positive input terminal and the first negative input terminal are electrically connected to the power chips located on the front, and the second positive input terminal and the second negative input terminal are electrically connected to the power chips located on the back.

[0005] In an embodiment of this application, it further includes a mounting frame, the mounting frame includes a first bracket and a second bracket opposite to each other in the first direction, the radiator is fixed between the first bracket and the second bracket, and the plurality of power chips are located between the first bracket and the second bracket, wherein the mounting frame is insulated.

[0006] In an embodiment of this application, it further includes a plurality of first connection interfaces and a plurality of second connection interfaces, one end of the plurality of first connection interfaces is electrically connected to the corresponding power chips located on the front, and the other end is electrically connected to the corresponding lead terminals, and one end of the plurality of second connection interfaces is electrically connected to the corresponding power chips located on the back, and the other end is electrically connected to the corresponding lead terminals.

[0007] In an embodiment of the present application, a plurality of first connection columns are arranged on the first bottom plate of the first bracket, and a plurality of second connection columns are arranged on the second bottom plate of the second bracket, wherein the plurality of first connection columns and the plurality of second connection columns are used for thermocompression riveting with a printed circuit board.

[0008] In an embodiment of the present application, the first lead-out terminal includes a first upper lead-out terminal and a first lower lead-out terminal symmetrically distributed in the first direction, the second lead-out terminal includes a second upper lead-out terminal and a second lower lead-out terminal symmetrically distributed in the first direction, and the third lead-out terminal includes a third upper lead-out terminal and a third lower lead-out terminal symmetrically distributed in the first direction.

[0009] In an embodiment of the present application, the first positive input terminal, the second positive input terminal, the first negative input terminal, and the second negative input terminal all include an internal connection section and an external connection section. Wherein, one end of the internal connection section is electrically connected to the corresponding power chip, and the other end is electrically connected to the external connection section, and the external connection section is used for electrical connection with a battery.

[0010] In an embodiment of the present application, the projections of the external connection section of the first positive input terminal and the external connection section of the first negative input terminal in the second direction do not overlap with the external connection section of the second positive input terminal and the external connection section of the second negative input terminal, wherein the first direction intersects with the second direction.

[0011] In an embodiment of the present application, the external connection sections of the first positive input terminal, the external connection section of the second positive input terminal, the external connection section of the first negative input terminal, and the external connection section of the second negative input terminal are located on the same side of the power module.

[0012] In an embodiment of the present application, the projection of the external connection section of the first positive input terminal in the second direction overlaps with the external connection section of the first negative input terminal, and the projection of the external connection section of the second negative input terminal in the second direction overlaps with the external connection section of the second positive input terminal.

[0013] In an embodiment of the present application, the radiator includes a first cover part and a second cover part opposite to each other in the first direction. The first cover part has a first boss located in a first groove, and the second cover part has a second boss located in a second groove. The first boss contacts the second boss to form a cooling flow channel surrounding the first boss and the second boss in the radiator.

[0014] The power chips in the power module of the present application are arranged on the front and back of the radiator, and the number and arrangement of the power chips can be set according to requirements, which improves the adaptability of the power module to different application scenarios and also improves the integration of the power module. In addition, the arrangement of the positive input terminal and the negative input terminal in the power module is beneficial to reducing the stray inductance of the power module. Brief Description of the Drawings

[0015] The accompanying drawings are provided to further understand the present application. They are incorporated and constitute a part of the present application. The accompanying drawings show embodiments of the present application and, together with this specification, serve to explain the principles of the present application. In the accompanying drawings:

[0016] Figure 1 and Figure 2 are perspective schematic views of a power module in one embodiment of the present application from different perspectives;

[0017] Figure 3 is a perspective schematic view of the power module without showing the mounting frame in one embodiment of the present application;

[0018] Figure 4 is an exploded schematic view of a power module in one embodiment of the present application;

[0019] Figures 5 to 7 is a schematic view of the arrangement of power chips in one embodiment of the present application;

[0020] Figure 8 and Figure 9 are perspective schematic views of the first cover part and the second cover part in one embodiment of the present application, respectively;

[0021] Figure 10 is a perspective schematic view of the mounting frame in one embodiment of the present application;

[0022] Figure 11 is a perspective schematic view of the positive input terminal and the negative input terminal in one embodiment of the present application.

[0023] Drawing Reference Numerals

[0024] Power Chip 110 First Lower Lead Terminal 131b Second Negative Input Terminal 144 Radiator 120 Second Lead Terminal 132 Second Internal Connection Segment 144a

[0025] Front 121 Second Upper Lead Terminal 132a Second External Connection Segment 144b

[0026] Back 122 Second Lower Lead Terminal 132b Mounting Frame 150

[0027] The first cover part 123, the third lead-out terminal 133, the first support 151

[0028] The first groove 123a, the third upper lead-out terminal 133a, the first bottom plate 151a

[0029] The first boss 123b, the third lower lead-out terminal 133b, the first support pillar 151b

[0030] The second cover part 124, the first positive input terminal 141, the first connecting post 151c

[0031] The second groove 124a, the first internal connection section 141a, the second support 152

[0032] The second boss 124b, the first external connection section 141b, the second bottom plate 152a

[0033] The liquid inlet pipe 125, the second positive input terminal 142, the second support pillar 152b

[0034] The liquid outlet pipe 126, the second internal connection section 142a, the second connecting post 152c

[0035] The edge 127, the second external connection section 142b, the first connection interface 161 The through hole 128, the first negative input terminal 143, the second connection interface 162 The first lead-out terminal 131, the first internal connection section 143a

[0036] The first upper lead-out terminal 131a, the first external connection section 143b Detailed implementation manners

[0037] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some examples or embodiments of the present application. For those of ordinary skill in the art, without creative work, the present application can also be applied to other similar scenarios according to these drawings. Unless obvious from the language context or otherwise stated, the same reference numerals in the figures represent the same structure or operation.

[0038] As shown in the present application and the claims, unless the context clearly indicates an exception, words such as "a", "one", "a kind of" and / or "the" are not specifically singular and may also include plural. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of the clearly identified steps and elements, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements.

[0039] Unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present application. At the same time, it should be understood that for the sake of convenience of description, the dimensions of the various parts shown in the drawings are not drawn in actual proportional relationship. Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the said technologies, methods, and devices should be regarded as part of the authorization specification. In all the examples shown and discussed herein, any specific values should be construed as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that like reference numerals and letters denote like items in the following drawings, and thus, once an item is defined in one drawing, further discussion thereof is not required in subsequent drawings.

[0040] In the description of the present application, it should be understood that the orientation or positional relationships indicated by orientation terms such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal", and "top, bottom", etc. are usually based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description. Without contrary description, these orientation terms do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and thus cannot be construed as limiting the protection scope of the present application; the orientation terms "inside, outside" refer to the inside and outside relative to the contour of each component itself.

[0041] For the sake of convenience of description, spatial relative terms such as "above...", "over...", "on the upper surface of...", "above-mentioned", etc. may be used here to describe the spatial positional relationships between a device or feature shown in the drawings and other devices or features. It should be understood that the spatial relative terms are intended to encompass different orientations in use or operation in addition to the orientation described in the drawings for the device. For example, if the device in the drawing is inverted, the device described as "above other devices or structures" or "over other devices or structures" will then be positioned "below other devices or structures" or "under other devices or structures". Thus, the exemplary term "above..." can include both the orientations of "above..." and "below...". The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and corresponding interpretations will be made for the spatial relative descriptions used here.

[0042] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is solely for the purpose of distinguishing the corresponding components. Unless otherwise stated, these terms have no special meaning and therefore should not be construed as limiting the scope of protection of this application. Furthermore, while the terms used in this application are selected from commonly known and commonly used terms, some terms mentioned in this specification may have been selected by the applicant at his or her discretion, and their detailed meanings are explained in the relevant sections of this description. Furthermore, this application should be understood not only by the actual terms used, but also by the meaning implied by each term.

[0043] Next, the power module of the present application is described through embodiments.

[0044] Figure 1 and Figure 2 is a three-dimensional schematic diagram of a power module in an embodiment at different viewing angles. Figure 3 is a perspective schematic diagram of a power module in an embodiment without showing the mounting frame, Figure 4 FIG. 1 is an exploded view of a power module in an embodiment. Figures 1 to 4 As shown, the power module in the above embodiment includes multiple power chips 110, a heat sink 120, a first lead terminal 131, a second lead terminal 132, a third lead terminal 133, a first positive input terminal 141, a second positive input terminal 142, a first negative input terminal 143, and a second negative input terminal 144. The multiple power chips 110 are arranged on the front 121 and back 122 of the heat sink 120. The three lead terminals are connected to corresponding power chips, and the four input terminals are also connected to corresponding power chips. The power module can convert direct current input from the four input terminals into three-phase alternating current, and output the three-phase alternating current through the three lead terminals to an external device (such as the drive motor of an electric vehicle).

[0045] Specifically, refer to Figure 4 、 Figures 5 to 7 The arrangement diagram of the power chips 110 in one embodiment is shown, wherein: Figure 5 It is a top view. Figure 6 is the main view, Figure 7It is a bottom view. The radiator 120 has a front surface 121 and a back surface 122 that are opposite to each other in the first direction D1. Twelve power chips 110 are arranged in two rows on the front surface 121. The two rows of power chips 110 located on the front surface 121 are arranged adjacent to each other in the second direction D2, and each row includes six power chips 110 arranged in the third direction D3. Similarly, twelve power chips 110 are arranged in two rows on the back surface 122. The two rows of power chips 110 located on the back surface 122 are arranged adjacent to each other in the second direction D2, and each row includes six power chips 110 arranged in the third direction D3. The radiator 120 can dissipate heat from the power chips 110 located on the front surface 121 and the back surface 122. The second direction D2 intersects with the first direction D1, for example, they are perpendicular to each other.

[0046] This application does not limit the number of power chips 110. For example, the number of power chips 110 can also be 12, 36, etc., and the number of power chips 110 can be set according to the power requirement. This application does not limit the arrangement of the power chips 110. For example, the twelve power chips 110 located on the front surface 121 can also be arranged in three rows. When the number and arrangement of the power chips change, the volume and shape of the radiator 120 can be adaptively changed, thus improving the adaptability of the power module to different application scenarios. The power chips in the foregoing embodiments are split into single ones, and the number of power chips can be set according to requirements, so that the adaptability of the power module can be improved.

[0047] The power chips 110 can be connected to the radiator 120 by welding. In some embodiments, the front surface 121 has bosses 121a with the same number as the power chips 110 located on the front surface 121, and the power chips 110 are arranged on the corresponding bosses 121a. Similarly, the back surface 122 can also have bosses with the same number as the power chips 110 located on the back surface 122, and the power chips 110 are arranged on the corresponding bosses.

[0048] Compared with arranging all power chips on the same side of the radiator, arranging the power chips on both sides of the radiator in this application can reduce the size of the power module in the third direction D3, make the stacking of the power chips more compact, that is, improve the integration of the power module, so that the power module can be applicable to the extreme boundary space. The higher integration is also beneficial to reducing the material cost of the power module, such as reducing the size of the radiator in the third direction D3. In addition, arranging the power chips on both sides of the radiator can also improve the power density of the power module. The third direction D3 intersects with the plane where the first direction D1 and the second direction D2 are located. For example, the third direction D3 is perpendicular to the plane where the first direction D1 and the second direction D2 are located.

[0049] Figure 8 and Figure 9are respectively the three-dimensional schematic diagrams of the first cover part 123 and the second cover part 124 in an embodiment. Refer to Figure 6 , Figure 8 and Figure 9 As shown, in an embodiment, the radiator 120 includes a first cover part 123 and a second cover part 124 that are opposite in the first direction D1. The first cover part 123 has a first groove 123a and a first boss 123b. The first boss 123b is located within the first groove 123a, and the first groove 123a surrounds the first boss 123b. Similarly, the second cover part 124 has a second groove 124a and a second boss 124b. The second boss 124b is located within the second groove 124a, and the second groove 124a surrounds the second boss 124b. When the first cover part 123 and the second cover part 124 are closed, the first groove 123a is aligned with the second groove 124a, and the first boss 123b is in contact with the second boss 124b. Thus, an annular cooling channel surrounding the first boss 123b and the second boss 124b is formed within the radiator 120.

[0050] The radiator 120 also has an inlet pipe 125 and an outlet pipe 126 that are connected to the annular cooling channel. The external coolant enters the annular cooling channel from the inlet pipe 125 and then divides into two paths. These two paths of coolant flow towards the outlet pipe 126 and finally discharge from the outlet pipe 126 out of the radiator 120. Refer to Figure 5 and Figure 6 As described, the above two paths of coolant respectively correspond to two rows of power chips 110 on the front surface 121. In other words, the projections of the two rows of power chips 110 located on the front surface 121 towards the cooling channel in the first direction D1 overlap with the two paths of coolant. Similarly, refer to Figure 7 As shown, the above two paths of coolant also respectively correspond to two rows of power chips 110 on the back surface 122. The first boss and the second boss of the present application divide the grooves within the radiator 120 into an annular cooling channel. Thus, after the coolant enters the annular cooling channel, it divides into two paths, and the two paths of coolant have a better cooling balance effect.

[0051] In addition, compared with arranging all power chips on the same side of the radiator, arranging the power chips on the two sides of the radiator 120 in the present application can reduce the length of the cooling channel, thereby reducing the pressure difference between the coolant at the inlet pipe 125 and the outlet pipe 126, and reducing the temperature difference between the coolant at the inlet pipe 125 and the outlet pipe 126. Furthermore, it improves the consistency of the heat dissipation effect on the power chips near the inlet pipe 125 and the power chips near the outlet pipe 126.

[0052] Refer to Figure 1 and Figure 3As shown, the first lead terminal 131, the second lead terminal 132, and the third lead terminal 133 are electrically connected to the corresponding power chips 110 respectively. To elaborate, the first lead terminal 131, the second lead terminal 132, and the third lead terminal 133 can respectively correspond to the U, V, and W phases of the three-phase current. That is, the first lead terminal 131 is the U-phase output terminal of the power module, the second lead terminal 132 is the V-phase output terminal of the power module, and the third lead terminal 133 is the W-phase output terminal of the power module. It can be understood that the correspondence between the first lead terminal 131, the second lead terminal 132, and the third lead terminal 133 and the U, V, and W phases of the three-phase current is not limited to the above description. Combining Figure 5 and 7 As shown, the first lead terminal 131 is electrically connected to the 4 power chips 110 located on the front surface 121 and on the rightmost side in the third direction D3, and the 4 power chips 110 located on the back surface 122 and on the rightmost side in the third direction D3; the second lead terminal 132 is electrically connected to the 4 power chips 110 located on the front surface 121 and in the middle in the third direction D3, and the 4 power chips 110 located on the back surface 122 and in the middle in the third direction D3; the third lead terminal 133 is electrically connected to the 4 power chips 110 located on the front surface 121 and on the leftmost side in the third direction D3, and the 4 power chips 110 located on the back surface 122 and on the leftmost side in the third direction D3. Although the connection relationship between the power chips and the lead terminals is described herein, it can be understood that the connection relationship between the power chips and the lead terminals is not limited to the above description.

[0053] Refer to Figure 3 and Figure 4As shown, in one embodiment, the first lead terminal 131 includes a first upper lead terminal 131a and a first lower lead terminal 131b that are symmetrically distributed in the first direction D1. The first upper lead terminal 131a is electrically connected to the corresponding power chips located on the front surface 121, where the "corresponding power chips" refer to the "4 power chips 110 located on the front surface 121 and on the rightmost side in the third direction D3" described in the previous text. Similarly hereinafter, it will not be elaborated further. The first lower lead terminal 131b is electrically connected to the corresponding power chips located on the back surface 122. Similarly, the second lead terminal 132 includes a second upper lead terminal 132a and a second lower lead terminal 132b that are symmetrically distributed in the first direction D1. The second upper lead terminal 132a is electrically connected to the corresponding power chips located on the front surface 121, and the second lower lead terminal 132b is electrically connected to the corresponding power chips located on the back surface 122. The third lead terminal 133 includes a third upper lead terminal 133a and a third lower lead terminal 133b that are symmetrically distributed in the first direction D1. The third upper lead terminal 133a is electrically connected to the corresponding power chips located on the front surface 121, and the third lower lead terminal 133b is electrically connected to the corresponding power chips located on the back surface 122. The symmetrical distribution of the upper lead terminal and the lower lead terminal in the above embodiment helps to balance the current in the commutation loop.

[0054] Reference Figure 10 As shown in the perspective view of the mounting frame 150 in one embodiment, in this embodiment, the power module further includes a mounting frame 150. The mounting frame 150 includes a first bracket 151 and a second bracket 152 that are opposite to each other in the first direction D1. The first bracket 151 has a first bottom plate 151a and a plurality of first support columns 151b. One end of each first support column 151b is connected to the first bottom plate 151a, and the other end extends towards the second bracket 152 in the first direction D1. Similarly, the second bracket 152 has a second bottom plate 152a and a plurality of second support columns 152b. One end of each second support column 152b is connected to the second bottom plate 152a, and the other end extends towards the first bracket 151 in the first direction D1.

[0055] Reference Figure 1 、 Figure 2 and Figure 10 As shown, the radiator 120 is fixed between the first bracket 151 and the second bracket 152, and the power chips located on the front and back surfaces of the radiator 120 are between the first bracket 151 and the second bracket 152. Specifically, as Figure 2 shown, the edge 127 of the radiator 120 is located between the plurality of first support columns 151b and the plurality of second support columns 152b. As Figure 3As shown, a plurality of through holes 128 penetrating the edge 127 are distributed on the edge 127 of the radiator 120. There are corresponding through holes in the first bracket 151 and the second bracket 152. The radiator 120 can be fixed between the first bracket 151 and the second bracket 152 by using bolts to pass through the above through holes. Of course, the radiator 120 can also be fixed between the first bracket 151 and the second bracket 152 by other methods, such as welding. The mounting frame 150 is insulated.

[0056] Reference Figure 1 and Figure 10 As shown, a plurality of first connection columns 151c are arranged on the first bottom plate 151a of the first bracket 151. The first connection columns 151c extend away from the first bottom plate 151a. Reference Figure 2 and Figure 10 As shown, a plurality of second connection columns 152c are arranged on the second bottom plate 152a of the second bracket 152. The second connection columns 152c extend away from the second bottom plate 152a. The number and arrangement of the first connection columns 151c and the second connection columns 152c are not limited to Figure 1 、 Figure 2 and Figure 10 As shown. The first connection columns 151c and the second connection columns 152c can be used for thermo-compression riveting with a printed circuit (Printed Circuit Board, PCB) board. The first connection columns 151c and the second connection columns 152c are insulated. For example, the materials of the first connection columns 151c and the second connection columns 152c are both plastic. In addition, the first connection column 151c or the second connection column 152c may not be connected to the printed circuit, and the first connection columns 151c and the second connection columns 152c may both be connected to the printed circuit. Compared with the technical solution of using conductive connection columns to connect the mounting frame and the printed circuit, or other technical solutions of using conductive materials to connect the mounting frame and the printed circuit, using the insulated first connection columns 151c and second connection columns 152c to connect the mounting frame and the printed circuit can avoid the dense area on the printed circuit, thus improving the utilization rate of the printed circuit.

[0057] Reference Figure 4 As shown, in one embodiment, the power module further includes 3 first connection interfaces 161 and 3 second connection interfaces 162. Reference Figure 1 and Figure 4 As shown, one ends of the 3 first connection interfaces 161 pass through the openings on the first bottom plate 151a and are respectively electrically connected to the corresponding power chips, and the other ends are respectively electrically connected to the first lead terminal 131, the second lead terminal 132 and the third lead terminal 133. Similarly, reference Figure 2 and Figure 4As shown, one end of the three second connection interfaces 162 passes through the openings on the second bottom plate 152a and is electrically connected to the corresponding power chips respectively, and the other ends are electrically connected to the first lead terminal 131, the second lead terminal 132 and the third lead terminal 133 respectively. It should be noted that the electrical connection manner between the lead terminal and the power chip is not limited to the above embodiments, and other ways that can achieve the electrical connection between the lead terminal and the power chip are also within the protection scope of this application.

[0058] Refer to Figure 2 、 Figure 5 、 Figure 7 、 Figure 10 and Figure 11 As described, the first positive input terminal 141 and the first negative input terminal 143 are electrically connected to the power chip 110 located on the front surface 121, and the second positive input terminal 142 and the second negative input terminal 144 are electrically connected to the power chip 110 located on the back surface 122. Expanding it, refer to Figure 10 and Figure 11 As shown, the first positive input terminal 141 includes a first internal connection segment 141a and a first external connection segment 141b. Part of the first internal connection segment 141a is embedded inside the first bottom plate 151a, and one end is electrically connected to the drain of the corresponding power chip located on the front surface, and the other end is electrically connected to the first external connection segment 141b. The first external connection segment 141b can be electrically connected to a battery (such as a power battery in an electric vehicle). The first negative input terminal 143 includes a first internal connection segment 143a and a first external connection segment 143b. The first internal connection segment 143a is electrically connected to the source of the corresponding power chip located on the front surface and is electrically connected to the first external connection segment 143b. The first external connection segment 143b can be electrically connected to a battery (such as a power battery in an electric vehicle). Similarly, the second positive input terminal 142 includes a second internal connection segment 142a and a second external connection segment 142b. Part of the second internal connection segment 142a is embedded inside the second bottom plate 152a, Figure 10 which shows the part of the second internal connection segment 142a that is not embedded in the second bottom plate 152a. The second internal connection segment 142a is electrically connected to the second external connection segment 142b. The second external connection segment 142b can be electrically connected to a battery (such as a power battery in an electric vehicle). The second negative input terminal 144 includes a second internal connection segment 144a and a second external connection segment 144b. The second internal connection segment 144a is electrically connected to the corresponding power chip located on the back surface and is electrically connected to the second external connection segment 144b. The second external connection segment 144b is electrically connected to a battery (such as a power battery in an electric vehicle).

[0059] Refer to Figure 2 、 Figure 10 and Figure 11As shown, in one embodiment, the first external connection segment 141b of the first positive input terminal 141, the second external connection segment 142b of the second positive input terminal 142, the first external connection segment 143b of the first negative input terminal 143, and the second external connection segment 144b of the second negative input terminal 144 are located on the same side of the power module. The external connection segments being located on the same side of the power module facilitates the electrical connection of the power module to the capacitor. In some embodiments, the external connection segments can be copper bars.

[0060] Referring to Figure 11 As shown, the projection of the first external connection segment 141b of the first positive input terminal 141 along the second direction D2 towards the position where the power chip is located overlaps with the first external connection segment 143b of the first negative input terminal 143. Or rather, when observing from the right side in Figure 11 along the second direction D2 to the left, the first external connection segment 141b at least covers a part of the first external connection segment 143b. The first external connection segment 141b can completely cover the first external connection segment 143b. The above overlapping arrangement between the first external connection segment 141b and the first external connection segment 143b is beneficial to reducing the stray inductance of the power module.

[0061] Similarly, referring to Figure 10 and Figure 11 As shown, the projection of the second external connection segment 144b of the second negative input terminal 144 along the second direction D2 towards the position where the power chip is located overlaps with the second external connection segment 142b of the second positive input terminal 142. The present application does not limit the area of the overlapping part, which can be set according to requirements. The above overlapping arrangement between the second external connection segment 142b and the second external connection segment 144b is beneficial to reducing the stray inductance of the power module.

[0062] Referring to Figure 2 、 Figure 10 and Figure 11 As shown, in one embodiment, the projections of the first external connection segment 141b of the first positive input terminal 141 and the first external connection segment 143b of the first negative input terminal 143 along the second direction D2 towards the position where the power chip is located do not overlap with the second external connection segment 142b of the second positive input terminal 142 and the second external connection segment 144b of the second negative input terminal 144. In other words, when observing from the right side in Figure 10 and Figure 11 along the second direction D2 to the left, the first external connection segment 141b and the first external connection segment 143b do not cover the second external connection segment 142b and the second external connection segment 144b. The above non-overlapping arrangement is beneficial to the stray inductance and thermal coupling of the power module.

[0063] The basic concepts have been described above. Obviously, for those skilled in the art, the above application disclosure is only an example and does not constitute a limitation to this application. Although not explicitly stated here, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are proposed in this application, so such modifications, improvements, and corrections still fall within the spirit and scope of the exemplary embodiments of this application.

[0064] Meanwhile, this application uses specific terms to describe the embodiments of this application. Such as "one embodiment", "an embodiment", and / or "some embodiments" mean a certain feature, structure, or characteristic related to at least one embodiment of this application. Therefore, it should be emphasized and noted that the "one embodiment" or "an embodiment" or "an alternative embodiment" mentioned twice or more at different positions in this specification does not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of this application can be appropriately combined.

[0065] Similarly, it should be noted that, in order to simplify the expression of this application disclosure and thus help the understanding of one or more application embodiments, in the previous description of the embodiments of this application, sometimes multiple features are merged into one embodiment, drawing, or its description. However, this disclosure method does not mean that the features required by the object of this application are more than those mentioned in the claims. In fact, the features of the embodiments are less than all the features of the single embodiment disclosed above.

[0066] In some embodiments, numbers are used to describe the components and the quantity of attributes. It should be understood that such numbers used for the description of embodiments are, in some examples, modified by the modifiers "about", "approximate", or "substantially". Unless otherwise stated, "about", "approximate", or "substantially" indicate that the said numbers allow a variation of ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, and these approximate values can change according to the characteristics required by individual embodiments. In some embodiments, the numerical parameters should consider the specified significant digits and adopt the method of retaining the general number of digits. Although the numerical ranges and parameters used in some embodiments of this application to confirm the breadth of their scope are approximate values, in specific embodiments, such numerical settings are made as precise as possible within the feasible range.

[0067] Although this application has been described with reference to the current specific embodiments, those of ordinary skill in the art should recognize that the above embodiments are only used to illustrate this application, and various equivalent changes or substitutions can be made without departing from the spirit of this application. Therefore, as long as the changes and modifications to the above embodiments are within the scope of the spirit of this application, they will fall within the scope of the claims of this application.

Claims

1. A power module, characterized in that: include: a plurality of power chips (110); A heat sink (120), wherein the plurality of power chips (110) are arranged on a front side (121) and a back side (122) of the heat sink (120), and the front side (121) and the back side (122) are opposite to each other in a first direction; The first lead terminal (131), the second lead terminal (132) and the third lead terminal (133) are electrically connected to the corresponding power chip (110) respectively; and A first positive input terminal (141), a second positive input terminal (142), a first negative input terminal (143) and a second negative input terminal (144), wherein the first positive input terminal (141) and the first negative input terminal (143) are electrically connected to a power chip located on the front side (121), and the second positive input terminal (142) and the second negative input terminal (144) are electrically connected to a power chip located on the back side (122).

2. The power module according to claim 1, wherein The invention also includes a mounting frame (150), wherein the mounting frame (150) includes a first bracket (151) and a second bracket (152) opposite to each other in the first direction, the heat sink (120) is fixed between the first bracket (151) and the second bracket (152), and the plurality of power chips (110) are located between the first bracket (151) and the second bracket (152), wherein the mounting frame (150) is insulated.

3. The power module according to claim 2, characterized in that It also includes a plurality of first connection interfaces (161) and a plurality of second connection interfaces (162), wherein one end of the plurality of first connection interfaces (161) is electrically connected to the corresponding power chip located on the front side (121), and the other end is electrically connected to the corresponding lead-out terminal; and one end of the plurality of second connection interfaces (162) is electrically connected to the corresponding power chip located on the back side (122), and the other end is electrically connected to the corresponding lead-out terminal.

4. The power module according to claim 2, wherein: A plurality of first connecting pillars (151c) are arranged on the first base plate (151a) of the first bracket (151), and a plurality of second connecting pillars (152c) are arranged on the second base plate (152a) of the second bracket (152), wherein the plurality of first connecting pillars (151c) and the plurality of second connecting pillars (152c) are used for hot-press riveting with a printed circuit board.

5. The power module according to claim 1, wherein: The first lead-out terminal (131) includes a first upper lead-out terminal (131a) and a first lower lead-out terminal (131b) symmetrically distributed in the first direction, the second lead-out terminal (132) includes a second upper lead-out terminal (132a) and a second lower lead-out terminal (132b) symmetrically distributed in the first direction, and the third lead-out terminal (133) includes a third upper lead-out terminal (133a) and a third lower lead-out terminal (133b) symmetrically distributed in the first direction.

6. The power module according to claim 1, wherein: The first positive input terminal (141), the second positive input terminal (142), the first negative input terminal (143) and the second negative input terminal (144) each include an internal connection segment and an external connection segment, wherein one end of the internal connection segment is electrically connected to the corresponding power chip, and the other end is electrically connected to the external connection segment, and the external connection segment is used to be electrically connected to the battery.

7. The power module according to claim 6, wherein: Projections of the external connection section of the first positive input terminal (141) and the external connection section of the first negative input terminal (143) in a second direction do not overlap with the external connection section of the second positive input terminal (142) and the external connection section of the second negative input terminal (144), wherein the first direction intersects the second direction.

8. The power module according to claim 6, wherein: The external connection section of the first positive input terminal (141), the external connection section of the second positive input terminal (142), the external connection section of the first negative input terminal (143), and the external connection section of the second negative input terminal (144) are located on the same side of the power module.

9. The power module according to claim 6, wherein: The projection of the external connection section of the first positive input terminal (141) in the second direction overlaps with the external connection section of the first negative input terminal (143), and the projection of the external connection section of the second negative input terminal (144) in the second direction overlaps with the external connection section of the second positive input terminal (142).

10. The power module according to claim 1, wherein: The heat sink (120) includes a first cover portion (123) and a second cover portion (124) that are opposite to each other in the first direction, the first cover portion (123) having a first boss (123b) located in a first groove (123a), the second cover portion (124) having a second boss (124b) located in a second groove (124a), the first boss (123b) being in contact with the second boss (124b) to form a cooling channel surrounding the first boss (123b) and the second boss (124b) in the heat sink (120).

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