A semiconductor laser package stacked array sintering fixture and method

Abstract

The present invention relates to the technical field of semiconductor laser packaging, and specifically to a semiconductor laser packaging stacked array sintering fixture and method, comprising a base and a cavity opened on the top of the base for placing a semiconductor laser, and also comprising a fixture, which is constructed with an inclined surface and is evenly constructed inside the cavity, and the fixture is symmetrically arranged along the center of the cavity, and the inclined surface of the fixture is provided with multiple slots, the interior of the base is constructed with a positioning component for driving the multiple fixtures to move, a positioning plate, which is evenly constructed in the multiple slots, a hollow push rod connected to the positioning plate is provided inside the fixture, a transmission component for driving the hollow push rod to move is provided inside the fixture, and the power of the transmission component comes from the positioning component, a gas cylinder, which is fixedly connected to the interior of the base and stores gas, and a gas transmission component that provides power to the positioning component is provided on one side of the gas cylinder, and the gas of the gas transmission component eventually flows into the transmission component and is discharged through the positioning plate to cool the semiconductor laser.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor laser packaging, in particular to a semiconductor laser packaging stacked array sintering fixture and method. Background Art

[0002] As an important optoelectronic device, semiconductor lasers have been widely used in many fields such as communications, industrial processing, medical treatment, and military defense due to their significant advantages such as small size, high efficiency, long life, and wide wavelength coverage. With the continuous improvement of various industries' requirements for laser output power, beam quality, and system integration, semiconductor laser packaging stacking technology has emerged and developed rapidly. Semiconductor laser packaging stacking is to integrate multiple semiconductor lasers through a specific packaging process to form a device with higher output power and specific beam characteristics. Through stacking technology, power superposition can be achieved in a limited space, meeting the demand for high-energy lasers such as high-power laser cutting, welding, and pumping solid-state lasers. At the same time, the structural design of the package stacking array also helps to optimize the beam quality and improve the overall performance of the laser system.

[0003] For example, the patent document with the prior art announcement number CN107104358B discloses a semiconductor laser package stack sintering fixture; it relates to the field of optoelectronic technology; it includes a fixture body and several fixed clamps; a placement groove is provided on the fixture body; the inner clamp of the fixed clamp is placed in the placement groove and cooperates with the inner wall of the placement groove; the outer clamp of the fixed clamp is fixedly connected to the outer wall of the fixture body; the inner clamp and the outer clamp are connected by a connecting plate; the inner clamp of the fixed clamp is provided with a slot hole that cooperates with the semiconductor laser to be sintered, and the slot hole passes through the lower part of the inner clamp; the semiconductor laser to be sintered is placed between the inner clamp and the inner wall of the placement groove; the structure is simple, so that the sintering of the regular polygon semiconductor laser package stack is simple, the operation is convenient, and the sintering position is not easy to shift.

[0004] In the existing technical solution, although a fixed clamp is provided to apply axial pressure to the semiconductor laser to achieve limited fixation, this design has significant disadvantages in actual production application scenarios. After the semiconductor laser completes the sintering process, a large amount of heat will accumulate inside. If only relying on natural cooling methods, the heat dissipation process is extremely slow. This will not only greatly extend the entire production cycle, resulting in low production efficiency and failure to meet large-scale, high-efficiency production needs; moreover, being in a high temperature state for a long time will pose a potential threat to the performance and reliability of the semiconductor laser. Excessive temperature may cause changes in the internal material properties of the chip, decreased electrode connection stability and other problems, thereby affecting the output power, beam quality and service life of the laser, and ultimately increasing the defective rate and production cost of the product. To this end, the present application proposes a semiconductor laser package stack sintering fixture and method. Summary of the Invention

[0005] The object of the present invention is to provide a semiconductor laser package stack array sintering fixture and method to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned object, the present invention provides the following technical solution: a semiconductor laser package stack sintering fixture, comprising a base and a cavity opened on the top thereof for placing the semiconductor laser, and further comprising:

[0007] A fixture having an inclined surface and uniformly arranged inside the cavity, and the fixtures are symmetrically arranged along the center of the cavity, the inclined surface of the fixture is provided with a plurality of slots, and the interior of the base is provided with a positioning assembly for driving the movement of the plurality of fixtures;

[0008] The positioning plate is evenly structured in a plurality of slots. A hollow push rod connected to the positioning plate is provided inside the fixture. A transmission assembly for driving the hollow push rod to move is provided inside the fixture, and the power of the transmission assembly comes from the positioning assembly.

[0009] The gas cylinder is fixedly connected to the inside of the base and stores gas. A gas delivery component that provides power to the positioning component is provided on one side of the gas cylinder. The gas of the gas delivery component eventually flows into the transmission component and is discharged through the positioning plate to cool the semiconductor laser.

[0010] Preferably, the positioning assembly includes a common plate fixedly connected to the bottom of the clamp, and the bottom of the common plate is rotatably connected to a transmission crank, the interior of the base is rotatably connected to a connecting crank rotatably connected to the transmission crank, and the interior of the base is provided with a connecting rod rotatably connected to the connecting crank.

[0011] Preferably, a partition is fixedly connected to the inside of the cavity, and a plurality of lifting grooves for sliding connection of the clamp are opened inside the partition, and a folding net is slidably connected inside the lifting groove, and the inclined surface of the clamp is provided with a guide groove slidably connected to the folding net.

[0012] Preferably, the transmission assembly includes an air cylinder opened inside the clamp, and a hollow push rod is slidably connected to the inside of the air cylinder. A ventilation cavity is opened inside the clamp, and a plurality of air grooves connected to the air cylinder are opened on one side of the ventilation cavity. A connecting piece is provided inside the air groove, and the connecting piece and the hollow push rod are fixedly connected by a spring.

[0013] Preferably, the gas delivery assembly includes an air collection pipe connected to one side of the gas cylinder, and one end of the air collection pipe is connected to the gas cylinder, the top of the gas cylinder is slidably connected to a pneumatic push rod adapted thereto, and the top of the pneumatic push rod is sleeved on the outer surface of the connecting rod and slidably connected thereto.

[0014] Preferably, both sides of the air cylinder are connected to an air vent pipe connected to the connecting rod, and the top of the connecting rod is connected to a soft air tube connected to the ventilation cavity. The interior of the air groove is slidably connected to a movable tube adapted thereto, and the movable tube is fixedly connected to the connecting piece.

[0015] Preferably, one end of the movable tube is provided with a plug for sealing it, and one end of the plug is fixedly connected to a resisting piece, the internal sliding connection of the connecting piece is provided with a sliding rod that can resist the resisting piece, and one end of the sliding rod is fixedly connected to a push rod, and one end of the hollow push rod is fixedly connected to a ventilation frame that can limit the movement of the push rod.

[0016] Preferably, one end of the hollow push rod is fixedly connected to a connector communicating with the interior thereof, and the connector is fixedly connected to the positioning plate and communicates with the interior thereof, and the interior of the gas collecting pipe is fixedly connected to a one-way valve.

[0017] Preferably, a pressing piece adapted to the air storage cylinder is provided inside the air storage cylinder, and a push cylinder for driving the pressing piece to move is fixedly connected to the top of the air storage cylinder.

[0018] The present invention also provides a semiconductor laser package stack sintering method, comprising the following steps:

[0019] S1. When in use, first place the semiconductor laser inside the cavity;

[0020] S2, then operate the gas cylinder to release gas and cooperate with the gas delivery component to drive the positioning component to operate, thereby gradually raising the fixture to make the semiconductor laser be stuck in the card slot;

[0021] S3, while the gas is being delivered, the transmission assembly is operated to move the positioning plate to clamp the semiconductor laser;

[0022] S4. The base is then placed in a sintering furnace to heat the solder to melt it and complete high-temperature sintering. The base is then taken out and the operating gas is discharged through the positioning plate to accurately cool the semiconductor laser.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] 1. The cavity opened at the top of the base provides space for the semiconductor laser. At the same time, solder can be placed in the cavity in advance to contact the semiconductor laser, facilitating the subsequent sintering process and ensuring full contact between the solder and the laser during the sintering process, achieving good electrical and mechanical connection. The fixture is constructed with inclined surfaces and evenly distributed inside the cavity. The slots on the inclined surfaces provide a fixed space for the semiconductor laser. This design enables the fixture to adapt to semiconductor lasers of different sizes. As the fixture moves upward, the inclined surface gradually approaches the semiconductor laser, achieving clamping and fixing of lasers of different sizes, improving the versatility and adaptability of the fixture. The fixture is symmetrically arranged along the center of the cavity, ensuring uniform pressure on the semiconductor laser during the clamping process, avoiding deformation or damage to the laser due to uneven pressure. It also helps to improve the collimation and coupling efficiency of the beam. Multiple fixtures are connected together through a common plate. The connecting rod moves to adjust the connection angle between the connecting crank and the transmission crank, thereby changing the height of the common plate and achieving synchronous adjustment of multiple fixtures.

[0025] 2. The positioning plate is evenly constructed in multiple slots and is connected to the transmission assembly through a hollow push rod. It can move and contact the semiconductor laser when the semiconductor laser is inserted into the slot, thereby achieving secondary fixation of the semiconductor laser. This dual fixation method greatly improves the stability of the clamping, ensuring that the semiconductor laser will not be displaced or loosened during the sintering process, thereby ensuring the sintering quality. A plug is set at one end of the moving tube, and one end of the plug is fixedly connected to the stopper. The internal sliding connection of the connecting piece can contact the slide rod of the stopper. One end of the slide rod is fixedly connected to the ejector rod, and one end of the hollow push rod is fixedly connected to the ventilation frame that can limit the movement of the ejector rod. When the positioning plate is restricted from moving after contacting the semiconductor laser, the connecting piece continues to move to squeeze the spring to shrink, driving the ejector rod to contact the ventilation frame, thereby pushing the slide rod to contact the stopper to open the plug. The gas in the gas supply groove is transported to the positioning plate through the moving tube for discharge, thereby achieving gas leakage.

[0026] 3. A gas reservoir is fixedly connected to the interior of the base and is used to store gases (such as high-purity nitrogen or argon). These gases play a vital role in the sintering process, providing a protective atmosphere to prevent oxidation of the semiconductor laser at high temperatures. They are also used to cool the semiconductor laser after sintering, improving production efficiency and product quality. Two gas reservoirs can be used to store different gases, respectively. A one-way valve prevents the gases in the two reservoirs from mixing. Before sintering, one reservoir can be independently controlled to release argon to clamp and purge the semiconductor laser. Argon, with a higher specific gravity than air, forms a sunken gas shield. After sintering, during cooling, the other reservoir is operated to release nitrogen. Nitrogen quickly enters the gas path, initially pushing out the argon gas originally stored in the path for purging. The rapid oxygen diffusion rate in the high-temperature zone and the high specific gravity of argon effectively isolate the air. Subsequently, the increasing amount of nitrogen introduced gradually mixes with the other gases, achieving a gradual decrease in temperature. This gas switching function meets the needs of different stages of the sintering process, improving sintering quality and product reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0028] Figure 2 This is a schematic diagram of the structure of the present invention with some clamps removed;

[0029] Figure 3 Schematic diagram of the cross-sectional structure of the base in the present invention;

[0030] Figure 4 This is a schematic diagram of the structure of the present invention without the base;

[0031] Figure 5 Schematic diagram of the structure of the clamp in the present invention;

[0032] Figure 6 For the present invention Figure 5 A schematic diagram of the structure at center A;

[0033] Figure 7 Schematic diagram of the cross-sectional structure of the gas storage cylinder of the present invention;

[0034] Figure 8 Schematic diagram of the structure of the ventilation cavity in the present invention;

[0035] Figure 9 For the present invention Figure 8 A magnified schematic diagram of the structure at B in the middle;

[0036] Figure 10 Schematic diagram of the cross-sectional structure of the air tank in the present invention;

[0037] Figure 11 For the present invention Figure 10Schematic diagram of the enlarged structure at point C in the middle.

[0038] In the figure: 100, base; 101, cavity; 102, partition; 200, fixture; 201, lifting groove; 202, folding net; 203, guide groove; 204, clamping groove; 205, common connecting plate; 206, connecting crank; 207, driving crank; 208, connecting rod; 209, air cylinder; 210, pneumatic push rod; 211, movable seat; 300, positioning plate; 301, soft air tube; 302, Air cavity; 303, air groove; 304, air push cylinder; 305, hollow push rod; 306, connecting piece; 307, ventilation frame; 308, moving tube; 309, connecting piece; 310, spring; 311, push rod; 312, sliding rod; 313, stopper; 314, plug; 400, air storage cylinder; 401, push cylinder; 402, pressing plate; 403, air collecting pipe; 404, one-way valve; 405, vent pipe. DETAILED DESCRIPTION

[0039] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0040] Example 1: Please refer to Figure 1-Figure 3 The present invention provides a technical solution: a semiconductor laser package stack sintering fixture, comprising a base 100 and a cavity 101 opened on the top thereof for placing the semiconductor laser. The cavity 101 can provide space for placing the semiconductor laser, and solder can be placed in the cavity 101 in advance to contact the semiconductor laser for subsequent sintering.

[0041] See also Figure 4-Figure 6 , also includes a fixture 200, which has an inclined surface and is evenly constructed inside the cavity 101, and the fixture 200 is symmetrically arranged along the center of the cavity 101, and a plurality of slots 204 are opened on the inclined surface of the fixture 200. The internal structure of the base 100 is provided with a positioning component for driving the movement of the plurality of fixtures 200. By setting the positioning component, the fixture 200 can be effectively pushed up, so that the inclined surface of the fixture 200 gradually approaches the semiconductor laser, so that semiconductor lasers of different sizes can be clamped and fixed, and the slots 204 can provide a fixed space for the semiconductor laser, thereby achieving positioning.

[0042] Furthermore, the positioning assembly includes a common plate 205 fixedly connected to the bottom of the clamp 200, and the bottom of the common plate 205 is rotatably connected to a transmission crank 207, the interior of the base 100 is rotatably connected to a connecting crank 206 rotatably connected to the transmission crank 207, and the interior of the base 100 is provided with a connecting rod 208 rotatably connected to the connecting crank 206. By setting the connecting rod 208 movable, the connection angle between the connecting crank 206 and the transmission crank 207 can be adjusted, thereby changing the height of the common plate 205, thereby adjusting the height of the clamp 200, and realizing synchronous adjustment of multiple clamps 200.

[0043] Among them, the interior of the cavity 101 is fixedly connected to a partition 102, and the interior of the partition 102 is provided with a plurality of lifting grooves 201 for the sliding connection of the clamp 200, and the interior of the lifting grooves 201 is slidably connected to a folding net 202, and the inclined surface of the clamp 200 is provided with a guide groove 203 that is slidably connected to the folding net 202. By setting the lifting grooves 201, the clamp 200 can be guided to improve its movement stability, and the folding net 202 can effectively block the lifting grooves 201, so that the cavity 101 forms a complete cavity.

[0044] In summary, the cavity 101 opened on the top of the base 100 provides a placement space for the semiconductor laser. At the same time, the solder can be placed in the cavity 101 in advance to contact the semiconductor laser, which is convenient for the subsequent sintering process and ensures that the solder and the laser are in full contact during the sintering process to achieve good electrical and mechanical connection. The fixture 200 is constructed with an inclined surface and is evenly distributed inside the cavity 101. The slots 204 on the inclined surface provide a fixed space for the semiconductor laser. This design enables the clamp 200 to adapt to semiconductor lasers of different sizes. By moving the clamp 200 upward, the inclined surface gradually approaches the semiconductor laser, thereby achieving clamping and fixing of lasers of different sizes, improving the versatility and adaptability of the clamp. The clamp 200 is symmetrically arranged along the center of the cavity 101, ensuring that the pressure applied to the semiconductor laser during the clamping process is uniform, avoiding deformation or damage to the laser due to uneven pressure, and also helping to improve the collimation and coupling efficiency of the light beam. Multiple clamps 200 are connected together by a common plate 205, and the connecting rod 208 can move to adjust the connection angle between the connecting crank 206 and the transmission crank 207, thereby changing the height of the common plate 205 and achieving synchronous adjustment of multiple clamps 200.

[0045] See also Figures 8-11, and also includes a positioning plate 300, which is evenly constructed in multiple slots 204. A hollow push rod 305 connected to the positioning plate 300 is provided inside the clamp 200, and a transmission component for driving the hollow push rod 305 to move is provided inside the clamp 200, and the power of the transmission component comes from the positioning component. By setting the positioning plate 300, the semiconductor laser can be fixed for a second time, thereby improving the stability of clamping, and the transmission component can be set to drive the positioning plate 300 located in the slot 204 to move when the semiconductor laser is inserted into the slot 204 to resist the semiconductor laser, wherein the transmission component and the positioning component run in sequence to effectively improve the stability of clamping.

[0046] Furthermore, the transmission assembly includes an air cylinder 304 provided inside the clamp 200, and a hollow push rod 305 is slidably connected to the inside of the air cylinder 304. A ventilation cavity 302 is provided inside the clamp 200, and a plurality of air grooves 303 connected to the air cylinder 304 are provided on one side of the ventilation cavity 302. A connecting piece 309 is provided inside the air groove 303, and the connecting piece 309 and the hollow push rod 305 are fixedly connected by a spring 310. By providing the ventilation cavity 302 for gas to enter, the connecting piece 309 is forced to move, thereby squeezing the spring 310 and transmitting the hollow push rod 305 to move, thereby pushing the positioning plate 300 to move against the semiconductor laser for clamping.

[0047] Among them, one end of the movable tube 308 is provided with a plug 314 for sealing it, and one end of the plug 314 is fixedly connected to a piece 313, the internal sliding connection of the connecting piece 309 is connected to a slide rod 312 that can resist the piece 313, and one end of the slide rod 312 is fixedly connected to a push rod 311, one end of the hollow push rod 305 is fixedly connected to a ventilation frame 307 that can limit the movement of the push rod 311, one end of the hollow push rod 305 is fixedly connected to a connector 306 that is in communication with the interior thereof, and the connector 306 is fixedly connected to the positioning plate 300 and is in communication with the interior thereof. By setting the movable tube 308 The cooperation between the movable tube 308 and the plug 314 allows it to be forced to move when the gas in the gas groove 303 increases, thereby squeezing the spring 310 to make it move. When the hollow push rod 305 pushes the positioning plate 300 to hit the semiconductor laser, it will be restricted from moving. At this time, the movement of the connecting piece 309 will continue to squeeze the spring 310 to make it contract, thereby driving the top rod 311 to hit the ventilation frame 307, thereby pushing the sliding rod 312 to hit the plate 313 and open the plug 314. The gas in the gas supply groove 303 is transported to the positioning plate 300 for discharge through the movable tube 308, thereby achieving gas leakage.

[0048] It is worth mentioning that after the gas in the ventilation cavity 302 increases, the gas in each gas groove 303 will expand, thereby pushing the multiple moving tubes 308 to move the same distance. At this time, the multiple positioning plates 300 will also move the same distance. At this time, only the positioning plates 300 that are in contact with the semiconductor laser are restricted from moving, thereby achieving the contact between the top rod 311 and the ventilation frame 307. The remaining positioning plates 300 will continue to move, making it impossible for the top rod 311 to contact the ventilation frame 307. Therefore, only the positioning plates 300 that are in contact with the semiconductor laser will release gas, thereby ensuring the effective use of the gas.

[0049] In summary, the positioning plate 300 is evenly constructed within the plurality of slots 204 and is connected to the transmission assembly via a hollow push rod 305. When the semiconductor laser is inserted into the slot 204, it can move and contact the semiconductor laser, thereby achieving secondary fixation of the semiconductor laser. This dual fixation method greatly improves the stability of the clamping, ensuring that the semiconductor laser will not shift or loosen during the sintering process, thereby ensuring the sintering quality. A plug 314 is provided at one end of the movable tube 308. One end of the plug 314 is fixedly connected to the abutment 313. The connecting piece 309 is internally slidably connected to a slide rod 312 that can contact the abutment 313. One end of the slide rod 312 is fixedly connected to the ejector rod 311. One end of the hollow push rod 305 is fixedly connected to a ventilation frame 307 that can limit the movement of the ejector rod 311. When the positioning plate 300 contacts the semiconductor laser and is restricted from moving, the connecting piece 309 continues to move to squeeze the spring 310 to shrink it, driving the push rod 311 to contact the ventilation frame 307, thereby pushing the sliding rod 312 to contact the plate 313 to open the plug 314, and the gas in the gas supply groove 303 is transported to the positioning plate 300 through the moving tube 308 for discharge, thereby achieving gas leakage.

[0050] See also Figure 4-Figure 7 , and also includes a gas cylinder 400, which is fixedly connected to the inside of the base 100 and stores gas. A gas delivery component that provides power to the positioning component is provided on one side of the gas cylinder 400, and the gas of the gas delivery component eventually flows into the transmission component and is discharged through the positioning plate 300 to cool the semiconductor laser. By setting up the gas cylinder 400, gas can be stored, and the gas can be high-purity nitrogen or argon. The gas delivery component can be provided to transport the gas to generate power and then release it to cool the sintered semiconductor laser or to purge the semiconductor laser before sintering.

[0051] Furthermore, the gas delivery assembly includes an air manifold 403 connected to one side of the air cylinder 400, a one-way valve 404 is fixedly connected to the interior of the air manifold 403, and one end of the air manifold 403 is connected to the air cylinder 209, the top of the air cylinder 209 is slidably connected to a pneumatic push rod 210 adapted thereto, and the top of the pneumatic push rod 210 is sleeved on the outer surface of the connecting rod 208 and slidably connected thereto, the interior of the air cylinder 400 is provided with a pressing plate 402 adapted thereto, and the top of the air cylinder 400 is fixedly connected to a push cylinder 401 for driving the pressing plate 402 to move, and the air manifold 403 is provided for gas delivery and enters the interior of the air cylinder 209, and as the gas in the air cylinder 209 pushes the connecting rod 208 upward, the clamp 200 is driven upward.

[0052] Among them, both sides of the air cylinder 209 are connected with the air release pipe 405 connected with the connecting rod 208, and the top of the connecting rod 208 is connected with the soft air tube 301 connected with the ventilation cavity 302. The interior of the air groove 303 is slidably connected with the movable tube 308 adapted thereto, and the movable tube 308 is fixedly connected to the connecting piece 309. As the pneumatic push rod 210 is lifted to the extreme position, it will pass over the air release pipe 405, allowing the gas to enter the interior of the connecting rod 208 through the air release pipe 405, and then the gas enters the interior of the ventilation cavity 302 to provide power for the transmission assembly. In this process, the clamp 200 is first lifted to perform a preliminary positioning of the semiconductor laser, and then the positioning plate 300 is moved to fix it for a second time, so as to achieve continuous work and improve the clamping efficiency.

[0053] It is worth mentioning that two gas cylinders 400 are provided to store different gases respectively. Under the action of the one-way valve 404, the gases in the two gas cylinders 400 will not mix with each other. Before sintering, one gas cylinder 400 can be controlled separately to release argon to achieve clamping and purging of the semiconductor laser. The specific gravity of argon is greater than that of air, which can form a sinking gas protection layer. After the sintering is completed and cooled, the other gas cylinder 400 can be operated to release nitrogen. The nitrogen will quickly enter the gas path and first push out the argon originally stored in the gas path for purging. The oxygen diffusion rate in the high-temperature section is fast, and the high specific gravity of argon can effectively isolate the air. Then the amount of nitrogen inflow increases and gradually mixes to achieve a gradual decrease in temperature.

[0054] Specifically, by starting the push cylinder 401, the pressure plate 402 is driven to move downward, so that the gas in the gas storage cylinder 400 is transported to the inside of the gas manifold 403 through the one-way valve 404, so that the gas in the gas cylinder 209 increases and pushes the pneumatic push rod 210 to move upward, thereby changing the position of the connecting rod 208, causing the transmission crank 207 to tilt and change the position of the clamp 200, thereby gradually lifting it up and gradually contacting the semiconductor laser so that it is stuck in the slot 204. At the same time, when the gas in the gas cylinder 209 gradually expands and pushes the pneumatic push rod 210 to move, part of the gas enters the interior of the connecting rod 208, so that the gas passes through the soft air tube 301 and enters the interior of the ventilation cavity 302, so that the gas pushes the plug 314 to change the position of the moving tube 308, and cooperates with the spring 310 to synchronously push the hollow push rod 305 to move, so that the positioning plate 300 moves and squeezes the semiconductor laser stuck in the slot 204, thereby performing a After the solder is clamped, the base 100 is placed in a sintering furnace to heat the solder so that it melts and completes high-temperature sintering. The base 100 is then taken out and the pressing piece 402 is continued to be pushed to move, so that the gas is continuously pumped into the ventilation cavity 302. When the gas in the ventilation cavity 302 continues to increase, the plugs 314 in the multiple gas grooves 303 are moved, and the positioning plate 300 that contacts the semiconductor laser will be restricted from moving. At this time, the movement of the connecting piece 309 will squeeze the spring 310 to contract it, so that the push rod 311 contacts the ventilation frame 307, so that the sliding rod 312 contacts the piece 313, thereby opening the plug 314 and allowing the gas to pass through the moving tube 308 and enter the interior of the positioning plate 300 that contacts the semiconductor laser through the hollow push rod 305. Then the gas is discharged through the positioning plate 300 to purge the semiconductor laser, while the other positioning plates 300 will not release gas, thereby completing the precise cooling of the semiconductor laser.

[0055] In summary, the gas cylinder 400 is fixedly connected to the interior of the base 100 and is used to store gases such as high-purity nitrogen or argon. These gases play an important role in the sintering process. They can provide a protective gas environment for the sintering process and prevent the semiconductor laser from being oxidized at high temperatures. At the same time, they can also be used to cool the semiconductor laser after sintering, thereby improving production efficiency and product quality. Two gas cylinders 400 are provided to store different gases respectively. Under the action of the one-way valve 404, the gases in the two gas cylinders 400 will not cross each other. Before sintering, one gas cylinder 400 can be controlled separately to release argon gas to achieve clamping and purging of the semiconductor laser. The specific gravity of argon is greater than that of air, which can form a sinking gas protective layer. After sintering is completed and cooling is carried out, the other gas cylinder 400 is operated to release nitrogen gas. Nitrogen gas quickly enters the gas path and first pushes out the argon gas originally stored in the gas path for purging. The oxygen diffusion rate in the high-temperature section is fast, and the high specific gravity of argon gas can effectively isolate the air. Subsequently, the amount of nitrogen gas introduced increases and gradually mixes to achieve a gradual decrease in temperature. This gas switching function can meet the needs of different stages in the sintering process, improving the sintering quality and product reliability.

[0056] Example 2: Please refer to Figures 1-11 The present invention further provides a technical solution, which is different from the technical solution of the first embodiment: a method for sintering a semiconductor laser package stack, comprising the following steps:

[0057] S1. When in use, first place the semiconductor laser inside the cavity 101;

[0058] S2. Then, the push cylinder 401 is activated to drive the pressing plate 402 downward, so that the gas in the gas reservoir 400 is transported to the inside of the gas manifold 403 through the one-way valve 404, so that the gas in the gas cylinder 209 increases and pushes the pneumatic push rod 210 upward, thereby changing the position of the connecting rod 208 and tilting the transmission crank 207 to change the position of the clamp 200, thereby gradually raising it and gradually contacting the semiconductor laser so that it is clamped into the clamping slot 204;

[0059] S3. Simultaneously, as the gas in the gas cylinder 209 gradually expands and pushes the pneumatic push rod 210 to move, part of the gas enters the interior of the connecting rod 208, causing the gas to pass through the soft air tube 301 and enter the interior of the ventilation cavity 302. The gas pushes the plug 314 to change the position of the movable tube 308, and in conjunction with the spring 310, the hollow push rod 305 is synchronously pushed to move, causing the positioning plate 300 to move and squeeze the semiconductor laser stuck in the slot 204, thereby clamping it.

[0060] S4. The base 100 is then placed in a sintering furnace to heat the solder so that it melts and completes high-temperature sintering. The base 100 is then taken out and the pressing piece 402 is continued to be pushed to move so that the gas is continuously pumped into the ventilation cavity 302. When the gas continues to increase in the ventilation cavity 302, the plugs 314 in the multiple gas grooves 303 are moved, and the positioning plate 300 that contacts the semiconductor laser will be restricted from moving. At this time, the movement of the connecting piece 309 will squeeze the spring 310 to cause it to contract, thereby causing the top rod 311 to contact the ventilation frame 307, thereby causing the sliding rod 312 to contact the piece 313, thereby opening the plug 314, allowing the gas to pass through the moving tube 308 and enter the interior of the positioning plate 300 that contacts the semiconductor laser through the hollow push rod 305. The gas is then discharged through the positioning plate 300 to purge the semiconductor laser, while the remaining positioning plates 300 will not release gas, thereby completing the precise cooling of the semiconductor laser.

[0061] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0062] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor laser package stack sintering fixture, comprising a base (100) and a cavity (101) opened on the top thereof for placing the semiconductor laser, characterized in that: Also includes: A clamp (200) having an inclined surface and uniformly arranged inside the cavity (101), and the clamp (200) is symmetrically arranged along the center of the cavity (101), the inclined surface of the clamp (200) is provided with a plurality of slots (204), and the interior of the base (100) is provided with a positioning assembly for driving the plurality of clamps (200) to move; A positioning plate (300) is evenly arranged in the plurality of slots (204); a hollow push rod (305) connected to the positioning plate (300) is provided inside the fixture (200); a transmission assembly for driving the hollow push rod (305) to move is provided inside the fixture (200); and power for the transmission assembly comes from the positioning assembly; A gas cylinder (400) is fixedly connected to the interior of the base (100) and stores gas. A gas delivery assembly for providing power to the positioning assembly is provided on one side of the gas cylinder (400), and gas from the gas delivery assembly eventually flows into the transmission assembly and is discharged through the positioning plate (300) to cool the semiconductor laser.

2. The semiconductor laser package stack sintering fixture according to claim 1, characterized in that: The positioning assembly comprises a common plate (205) fixedly connected to the bottom of the clamp (200), and the bottom of the common plate (205) is rotatably connected to a transmission crank (207), the interior of the base (100) is rotatably connected to a connecting crank (206) rotatably connected to the transmission crank (207), and the interior of the base (100) is provided with a connecting rod (208) rotatably connected to the connecting crank (206).

3. The semiconductor laser package stack sintering fixture according to claim 2, characterized in that: The interior of the cavity (101) is fixedly connected to a partition (102), and a plurality of lifting grooves (201) for sliding connection of the clamp (200) are provided inside the partition (102), and a folding net (202) is slidably connected inside the lifting groove (201), and a guide groove (203) is provided on the inclined surface of the clamp (200) for sliding connection with the folding net (202).

4. The semiconductor laser package stack sintering fixture according to claim 2, characterized in that: The transmission assembly includes an air cylinder (304) opened inside the clamp (200), and a hollow push rod (305) is slidably connected to the inside of the air cylinder (304), a ventilation cavity (302) is opened inside the clamp (200), and a plurality of air grooves (303) connected to the air cylinder (304) are opened on one side of the ventilation cavity (302), a connecting piece (309) is provided inside the air groove (303), and the connecting piece (309) and the hollow push rod (305) are fixedly connected by a spring (310).

5. The semiconductor laser package stack sintering fixture according to claim 4, characterized in that: The gas delivery assembly comprises an air collection pipe (403) connected to one side of the gas storage cylinder (400), and one end of the air collection pipe (403) is connected to the gas cylinder (209). The top of the gas cylinder (209) is slidably connected to a pneumatic push rod (210) adapted thereto, and the top of the pneumatic push rod (210) is sleeved on the outer surface of the connecting rod (208) and slidably connected thereto.

6. The semiconductor laser package stack sintering fixture according to claim 5, characterized in that: Both sides of the air cylinder (209) are connected to an air release pipe (405) connected to the connecting rod (208), and the top of the connecting rod (208) is connected to a soft air tube (301) connected to the ventilation cavity (302). The interior of the air groove (303) is slidably connected to a movable pipe (308) adapted thereto, and the movable pipe (308) is fixedly connected to the connecting piece (309).

7. The semiconductor laser package stack sintering fixture according to claim 6, characterized in that: One end of the movable tube (308) is provided with a plug (314) for sealing it, and one end of the plug (314) is fixedly connected to a resisting piece (313), the interior of the connecting piece (309) is slidably connected to a sliding rod (312) that can resist the resisting piece (313), and one end of the sliding rod (312) is fixedly connected to a push rod (311), and one end of the hollow push rod (305) is fixedly connected to a ventilation frame (307) that can limit the movement of the push rod (311).

8. The semiconductor laser package stack sintering fixture according to claim 5, characterized in that: One end of the hollow push rod (305) is fixedly connected to a connector (306) in communication with the interior thereof, and the connector (306) is fixedly connected to the positioning plate (300) and the interiors thereof are in communication with each other. The interior of the gas collecting pipe (403) is fixedly connected to a one-way valve (404).

9. The semiconductor laser package stack sintering fixture according to claim 1, characterized in that: A pressing piece (402) adapted thereto is provided inside the gas storage cylinder (400), and a push cylinder (401) for driving the pressing piece (402) to move is fixedly connected to the top of the gas storage cylinder (400).

10. A semiconductor laser package stack sintering method, according to a semiconductor laser package stack sintering fixture according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1. When in use, first place the semiconductor laser inside the cavity (101); S2, then operating the gas cylinder (400) to release gas to cooperate with the gas delivery component to drive the positioning component to operate, thereby gradually raising the clamp (200) so that the semiconductor laser is clamped into the clamping slot (204); S3, while the gas is being transported, the transmission assembly is operated to move the positioning plate (300) to clamp the semiconductor laser; S4. The base (100) is then placed in a sintering furnace to heat the solder to melt it and complete high-temperature sintering. The base (100) is then taken out, and the operating gas is discharged through the positioning plate (300) to accurately cool the semiconductor laser.

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