Heating and ventilation controller and heating and ventilation device

Abstract

The invention discloses a heating and ventilation controller and a heating and ventilation device, and the heating and ventilation controller comprises a circuit wiring substrate, and a power supply filter circuit, a PFC inductor, an electrolytic capacitor and a sealing device which are arranged on the circuit wiring substrate, and the power supply filter circuit and the sealing device are respectively arranged at two opposite sides of the circuit wiring substrate. The PFC inductor and the electrolytic capacitor are both located between the power supply filter circuit and the sealing device, the PFC inductor and the electrolytic capacitor are both arranged on the strong current pin side of the sealing device, and the PFC inductor and the electrolytic capacitor are both electrically connected with different strong current pins on the strong current pin side. The power supply filter circuit and the sealing device are arranged on the two opposite sides of the circuit wiring substrate, interference signals can be removed before a power supply enters the circuit, stable operation of the circuit is ensured, interference caused by strong current signals of the sealing device can be reduced, the PFC inductor and the electrolytic capacitor are arranged on the strong current pin side in the sealing period, and therefore the power supply filter circuit and the sealing device can be effectively protected. The wiring distance between a PFC inductor and an electrolytic capacitor and a sealed device is shortened, the switching stress of a switching tube is reduced, and the anti-interference performance is improved.

Description

Technical Field

[0001] The present application relates to the field of circuit technology, and in particular to a HVAC controller and a HVAC device. Background Art

[0002] The HVAC controller includes multiple high-power devices such as rectifier bridges, PFC (Power Factor Corrector) switches, diodes, inverter modules, etc. By combining the various discrete high-power devices used in the HVAC controller into an independent device, the substrate layout area of the HVAC controller can be reduced, which is conducive to the miniaturization of the electronic control design. However, for the PFC inductor and electrolytic capacitor used in the HVAC controller, if the wiring design between the encapsulated devices is unreasonable, large parasitic parameters will be generated in the wiring line, increasing the switching stress of the various switches in the HVAC controller, causing the HVAC controller to work abnormally, and even bringing the risk of device damage. Summary of the Invention

[0003] The purpose of this application is to propose a HVAC controller and HVAC device to address the deficiencies of the above-mentioned prior art, and this purpose is achieved through the following technical solutions.

[0004] The first aspect of the present application provides a HVAC controller, comprising: a circuit wiring substrate and a power filter circuit, a power factor correction (PFC) inductor, an electrolytic capacitor, and a packaged device disposed on the circuit wiring substrate;

[0005] The power filter circuit and the packaged device are respectively arranged on opposite sides of the circuit wiring substrate, the PFC inductor and the electrolytic capacitor are both located between the power filter circuit and the packaged device, the PFC inductor and the electrolytic capacitor are both arranged on the high-voltage pin side of the packaged device, and the PFC inductor and the electrolytic capacitor are both electrically connected to different high-voltage pins on the high-voltage pin side.

[0006] In some embodiments of the present application, the power filter circuit includes a power input interface;

[0007] The power input interface is arranged on a side of the power filter circuit away from the packaged device.

[0008] In some embodiments of the present application, the wiring width between the PFC inductor and the high-current pin on the high-current pin side is greater than the wiring width of the line connected to the preset pin on the packaged device, and the preset pin is the pin on the packaged device other than the high-current pin connected to the PFC inductor and the high-current pin connected to the electrolytic capacitor.

[0009] In some embodiments of the present application, the wiring width between the electrolytic capacitor and the high-power pin on the high-power pin side is greater than the wiring width of the line connected to the preset pin, and the preset pin is the pin on the packaged device except the high-power pin connected to the PFC inductor and the high-power pin connected to the electrolytic capacitor.

[0010] In some embodiments of the present application, a switching power supply circuit is further included provided on the circuit wiring substrate;

[0011] The switching power supply circuit is located between the packaged device and the power supply filter circuit.

[0012] In some embodiments of the present application, the invention further includes providing a fan control circuit on the circuit wiring substrate;

[0013] The fan control circuit is located between the switching power supply circuit and the packaged device, and the electrolytic capacitor is located between the fan control circuit and the PFC inductor.

[0014] In some embodiments of the present application, the packaged device includes a rectifier bridge, a PFC switch tube, a diode, and an inverter module. The high-voltage pin side of the packaged device includes a rectifier bridge rectifier output pin, a collector pin and an emitter pin of the PFC switch tube, and a cathode pin of the diode;

[0015] One end of the PFC inductor is electrically connected to the rectifier output pin of the rectifier bridge, and the other end of the PFC inductor is electrically connected to the collector pin of the PFC switch tube;

[0016] One end of the electrolytic capacitor is electrically connected to the cathode pin of the diode, and the other end of the electrolytic capacitor is electrically connected to the emitter pin of the PFC switch tube.

[0017] In some embodiments of the present application, a heat sink is further included, and the heat sink is used to remove heat generated by the sealed device;

[0018] The heat sink is arranged on the surface of the sealed component.

[0019] In some embodiments of the present application, the radiator includes a refrigerant circulation pipe, and the refrigerant circulation pipe is used for refrigerant circulation.

[0020] In some embodiments of the present application, the heat sink includes a support member, and the support member is used to fix the heat sink on the surface of the sealed device.

[0021] A second aspect of the present application provides a HVAC device, comprising the HVAC controller as described in the first aspect.

[0022] Based on the above HVAC controller and HVAC device, the technical solution of this application has the following beneficial effects or advantages:

[0023] On the basis of integrating the high-power devices used in the HVAC controller into an independent packaged device, when designing the layout of the circuit wiring substrate of the HVAC controller, the power supply filter circuit and the packaged device are respectively arranged on opposite sides of the circuit wiring substrate. This can not only remove unnecessary interference signals before the power enters the circuit to ensure stable operation of the circuit, but also reduce the electromagnetic interference caused by the strong electric signal of the packaged device to the weak electric signal on the circuit wiring substrate. By arranging the PFC inductor and electrolytic capacitor between the power supply filter circuit and the packaged device, since both the PFC inductor and electrolytic capacitor need to be connected to the strong electric pins on the packaged device, the PFC inductor and electrolytic capacitor are arranged on the strong electric pin side during the package, so as to shorten the wiring distance between the PFC inductor and electrolytic capacitor and the packaged device as much as possible, reduce the parasitic parameters of the wiring line, thereby reducing the switching stress of various switching tubes in the HVAC controller and improving the anti-interference and stability of the HVAC controller during operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0025] Figure 1 A schematic diagram of the circuit topology of each power device in a HVAC controller of the present application;

[0026] Figure 2 This is a pin diagram illustrating a method of integrating power devices into a packaged device according to an exemplary embodiment of the present application;

[0027] Figure 3 This is a schematic diagram showing a mapping between pins and circuit topology of a package-on-package device according to an exemplary embodiment of the present application;

[0028] Figure 4 This is a schematic diagram of a circuit layout of a HVAC controller according to an exemplary embodiment of the present application;

[0029] Figure 5 This is a schematic diagram of a circuit layout of another HVAC controller according to an exemplary embodiment of the present application;

[0030] Figure 6 This is a schematic diagram of a circuit layout of another HVAC controller according to an exemplary embodiment of the present application.

[0031] In the above figure:

[0032] 1-Circuit wiring substrate;

[0033] 10-power filter circuit;

[0034] 101-power input interface;

[0035] 102-PFC inductor;

[0036] 103-electrolytic capacitor;

[0037] 104-sealed device;

[0038] 105-switching power supply circuit;

[0039] 106- fan control circuit;

[0040] 107-Peripheral control circuit.

[0041] The realization of the objectives, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0043] It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0044] In addition, the terms "first," "second," and so on, used in this application are for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly specifying the number of the technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0045] In this application, unless otherwise specified or limited, the terms "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can mean fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0046] In addition, the technical solutions between the various embodiments of the present application can be combined with each other, but it must be based on the fact that ordinary technicians in this field can implement it. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0047] Generally, the electrical control part of the HVAC device consists of the following major circuits:

[0048] Power filter circuit: Located at the front end of the circuit, it consists of a fuse, a varistor, a discharge tube, a safety capacitor, a common-mode inductor / differential-mode inductor, and a PTC (Positive Temperature Coefficient) resistor. This power filter circuit can effectively filter out high-frequency noise and electromagnetic interference in the power supply, ensuring that the device is not affected by external interference. It can also suppress instantaneous high-voltage surges in the power supply and prevent circuit damage caused by excessive current.

[0049] Rectifier circuit: Consists of a high-power rectifier bridge and a high-voltage filter capacitor. This rectifier circuit is used to rectify and filter alternating current (AC) into direct current (DC) to power subsequent circuits.

[0050] PFC circuit: It consists of a PFC inductor, a PFC switch tube and its control and protection circuit. The PFC circuit is used to improve the power factor of the entire machine, reduce harmonic interference to the power grid and has a voltage boost effect.

[0051] Inverter circuit: It consists of an IPM (Intelligent Power Module) module (also known as an inverter module) and the IPM module's control circuit, protection circuit, and detection circuit. Under the control of the control circuit, the IPM module converts DC power into three-phase AC power and transmits it to the motor (also known as the compressor's permanent magnet synchronous motor) to drive the motor and achieve motor speed regulation.

[0052] In addition, the electrical control part of the HVAC device also includes switching power supply circuit, temperature detection circuit, communication circuit, valve body and fan control circuit and various protection circuits.

[0053] In the major circuits introduced above, the power devices involved include: rectifier bridge, PFC switch tube, diode, inverter module, etc. Figure 1 In the circuit topology of the power devices shown, diodes D1, D2, D3, and D4 all serve as rectifier diodes to form a rectifier bridge; PFC inductor L, PFC switch Q1, diode D5, and electrolytic capacitor C2n constitute a PFC circuit, that is, a single-channel PFC circuit; switches Q2, Q3, Q4, Q5, Q6, and Q7 constitute an inverter module, and the three-phase AC power output by the inverter module is transmitted to the motor M.

[0054] exist Figure 1 In the circuit topology shown, the PFC circuit and the inverter module are both high-frequency circuits, that is, they operate at a high switching frequency. When designing the circuit substrate, the wiring between the PFC inductor L, the PFC switch Q1, and the electrolytic capacitor C2n ( Figure 1 The wiring (represented by the dotted line) should be short and wide enough to reduce the parasitic parameters of the line. If there are large parasitic parameters, the switching stress of the high-power switch tube will be increased, and even excessive stress will cause damage to the device.

[0055] In the traditional composition method, the rectifier bridge, PFC switch tube, diode, inverter module, etc. are all independent devices, which is not conducive to the miniaturization of electronic control design. Therefore, by combining the discrete rectifier bridge, PFC switch tube, inverter module and diode into an independent device (also known as a sealed device), the PCB (Printed Circuit Board) layout area is reduced, which conforms to the miniaturization design of electronic control integration. In other words, these four devices are integrated into one device, which can also be called an intelligent power module. For production and manufacturing, it can at least reduce the screw fixing process and the heat dissipation volume, thereby improving production efficiency.

[0056] See also Figure 2 The pin diagram of the packaged device shown is a schematic diagram of the pins of the packaged device, which packages a rectifier bridge composed of diodes D1, D2, D3 and D4, a PFC switch tube Q1, a diode D5 and an inverter module composed of switch tubes Q2, Q3, Q4, Q5, Q6 and Q7 into a packaged device, and leads out high-current pins and low-current pins on the packaged device. The high-current pins are circuit connection ports for transmitting high-power electrical signals, and the low-current pins are circuit connection ports for transmitting low-power electrical signals.

[0057] Typically, device pinouts can be categorized as either single-sided or double-sided, depending on their pinout arrangement. Double-sided pinouts are the most common arrangement due to their ease of production and simplified design. Packaged devices with double-sided pinouts typically have high-voltage pins concentrated on one side, often referred to as the high-voltage or high-current side, and low-voltage pins on the other side, often referred to as the low-voltage or low-current side.

[0058] exist Figure 2 In the figure, the left side of the packaged device is set as the high-voltage pin side, and the right side is set as the low-voltage pin side. Among them, the high-voltage pin side includes the high-voltage pin functions such as the rectifier bridge rectifier output pin (including the bus power supply positive terminal DC+ and the bus power supply negative terminal DC-), the collector pin PF+ and emitter pin PF- of the PFC switch tube, the DC positive terminal P (that is, the cathode pin of the diode D5) and the DC negative terminal N, and the inverter module output pin (including U-phase output, V-phase output, and W-phase output); the low-voltage pin side includes the low-voltage pin functions such as the rectifier bridge input pin, the PFC control side pin, the inverter module bootstrap circuit pin, and the inverter module control side pin. As shown in Table 1, the rectifier bridge input pins include the AC input L terminal ACL and the AC input N terminal CAN; the PFC control side pins include the gate input of the PFC switch tube, the PFC signal input, the module common ground, and the module common ground; the bootstrap circuit pins of the inverter module include the U-phase high-side IGBT (Insulated Gate Bipolar Transistor) drive floating supply voltage, the U-phase high-side IGBT drive floating supply ground, the V-phase high-side IGBT drive floating supply voltage, the V-phase high-side IGBT drive floating supply ground, the W-phase high-side IGBT drive floating supply voltage, and the W-phase high-side IGBT drive floating supply ground; the inverter module control side pins include the U-phase high-side signal input, the V-phase high-side signal input, the W-phase high-side signal input, the power supply voltage for the low-side gate drive circuit, the fault output, the input for short-circuit current detection, the module common ground, and the temperature output.

[0059]

[0060] Table 1

[0061] See also Figure 3 The mapping diagram of the pins of the packaged device and the circuit topology is shown in the figure. Figure 3The circuit indicated by the dotted line is the fixed internal routing of the packaged device, while the PFC inductor L and electrolytic capacitor C2n to the functional pins of the packaged device require external design and layout (the circuits shown as L1, L2, L3, and L4 in the figure). The PFC inductor L needs to be connected to the rectifier output positive terminal DC+ of the packaged device and the collector pin PF+ of the PFC switch tube (that is, the positive electrode of the diode D5). The electrolytic capacitor C2n needs to be connected to the DC positive terminal P (that is, the negative electrode of the diode D5) and the DC negative terminal N of the packaged device and the emitter pin PF- of the PFC switch tube.

[0062] If the design of the external wiring L1, L2, L3, and L4 connecting the PFC inductor L and electrolytic capacitor C2n to the functional pins of the packaged device is unreasonable, relatively large parasitic parameters will be generated, increasing the switching stress of each switch tube in the HVAC controller, causing the HVAC controller to operate abnormally and even bringing the risk of device damage.

[0063] Based on this, when designing the PCB layout of the HVAC controller, this application places the PFC inductor and electrolytic capacitor near the high-voltage pins of the packaged device to reduce the parasitic parameters of the wiring lines between the PFC inductor and electrolytic capacitor and the high-voltage pins of the packaged device, thereby improving the circuit's anti-interference and stability.

[0064] To this end, the present application provides the following embodiments to solve or improve the problems existing in the prior art. In order to enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present application.

[0065] Example 1:

[0066] Figure 4 This is a circuit layout diagram of a HVAC controller according to an exemplary embodiment of the present application. Figure 4 In the figure, the HVAC controller includes a circuit wiring substrate 1 and a power filter circuit 10, a PFC inductor 102, an electrolytic capacitor 103 and a packaged device 104 arranged on the circuit wiring substrate 1. The packaged device 104 is an independent device that integrates the various power devices used in the HVAC controller into one. The packaged device 104 includes power devices such as a rectifier bridge, a PFC switch tube, a diode and an inverter module.

[0067] When designing the layout of the power filter circuit 10, PFC inductor 102, electrolytic capacitor 103 and packaged device 104, the present application arranges the power filter circuit 10 and the packaged device 104 on opposite sides of the circuit wiring substrate 1, that is, the power filter circuit 10 is arranged at the front end of the circuit wiring substrate 1. Before the power enters the circuit, the power filter circuit 10 can remove unnecessary interference signals to ensure stable operation of the circuit. The packaged device 104 is arranged at the back end of the circuit wiring substrate 1 to reduce the electromagnetic interference caused by the strong electric signal of the packaged device 104 to the weak electric signal in the circuit on the circuit wiring substrate 1.

[0068] The PFC inductor 102 and the electrolytic capacitor 103 are arranged between the power filter circuit 10 and the packaged device 104. Since the PFC inductor 102 and the electrolytic capacitor 103 need to be electrically connected to different high-voltage pins on the high-voltage pin side of the packaged device 104, the PFC inductor 102 and the electrolytic capacitor 103 are both arranged on the high-voltage pin side of the packaged device 104 to minimize the wiring distance between the PFC inductor 102 and the electrolytic capacitor 102 and the packaged device 104, thereby reducing the parasitic parameters of the wiring line, reducing the switching stress of various switching tubes in the HVAC controller, and improving the anti-interference and stability of the HVAC controller during operation.

[0069] In this embodiment, the circuit wiring substrate 1 can be understood as a PCB board of the HVAC controller. In the circuit wiring substrate 1, the pin connections between the electronic devices involved in the above circuit layout design are all electrically connected using metal leads.

[0070] The power filter circuit 10 may also be called an EMI (Electromagnetic Interference) filter circuit, which belongs to the front-end part of the circuit and is mainly used to protect the circuit from high-voltage surges and grid noise.

[0071] For example, the power filter circuit 10 generally includes electronic components such as fuses, varistors, discharge tubes, safety capacitors, common-mode inductors, differential-mode inductors, and PTC resistors. These electronic components have corresponding mounting locations, i.e., pads, on the circuit wiring substrate 1.

[0072] The PFC inductor 102 is an inductor element used in a power factor correction circuit. It works together with other electronic components of the power factor correction circuit (such as PFC switches, diodes, electrolytic capacitors, etc.) to reduce harmonic distortion at the power input end and improve the efficiency of power use.

[0073] Electrolytic capacitor 103 is a capacitive element used in power factor correction circuits. It typically forms one of the key components of a power factor correction circuit, along with other components such as an inductor, a diode, and a switch. Power factor correction circuits typically need to withstand high operating voltages, and therefore require a high withstand voltage. The primary function of electrolytic capacitor 103 in a power factor correction circuit is to improve the current waveform of the power supply input, making it as close to a sine waveform as possible, in conjunction with the inductor.

[0074] It should be noted that since both the PFC inductor 102 and the electrolytic capacitor 103 operate in a high-frequency switching state and need to be able to withstand high voltage, the layout area occupied by the PFC inductor 102 and the electrolytic capacitor 103 on the circuit wiring substrate 1 is usually relatively large.

[0075] On-package device 104 can be considered an intelligent power module, integrating power components such as the HVAC controller's rectifier bridge, PFC switch, diode, and inverter module. Because on-package device 104 is a high-power, high-voltage control circuit, the high-frequency, high-voltage signals it generates can cause electromagnetic interference to the low-voltage control circuits on the circuit wiring substrate 1. Therefore, on-package device 104 is placed at the lower edge of the circuit wiring substrate 1 to minimize electromagnetic interference with the low-voltage control circuits.

[0076] As mentioned above Figure 2 In the packaged device 104 shown, the high-voltage pins are concentrated on the left side, so the PFC inductor 102 and the electrolytic capacitor 103 are arranged on the left side of the packaged device 104 .

[0077] In one example, Figure 4 In the embodiment, when the packaged device 104 is placed horizontally, the high-voltage pin side can be arranged relative to the PFC inductor 102 and the electrolytic capacitor 103 to ensure that the wiring distance is short enough.

[0078] In another example, Figure 5 In the embodiment, when the packaged device 104 is placed vertically, the low-voltage pin side of the packaged device 104 can be close to the edge of the circuit wiring substrate 1, and the high-voltage pin side can be away from the edge of the circuit wiring substrate 1. This can also ensure that the wiring distance between the PFC inductor 102 and the electrolytic capacitor 103 and the packaged device 104 is short enough.

[0079] By applying the embodiment of the present application, on the basis of integrating the high-power devices used in the HVAC controller into an independent packaged device, when designing the layout of the circuit wiring substrate of the HVAC controller, by arranging the power filter circuit and the packaged device on opposite sides of the circuit wiring substrate, not only can unnecessary interference signals be removed before the power enters the circuit to ensure stable operation of the circuit, but also the electromagnetic interference caused by the strong electric signal of the packaged device to the weak electric signal on the circuit wiring substrate can be reduced. By arranging the PFC inductor and electrolytic capacitor between the power filter circuit and the packaged device, since both the PFC inductor and the electrolytic capacitor need to be connected to the high-power pins on the packaged device, the PFC inductor and the electrolytic capacitor are arranged on the high-power pin side during the package, so as to minimize the wiring distance between the PFC inductor and the electrolytic capacitor and the packaged device, reduce the parasitic parameters of the wiring line, thereby reducing the switching stress of various switching tubes in the HVAC controller and improving the anti-interference and stability of the HVAC controller during operation.

[0080] It should be noted here that, as mentioned above Figure 1 and Figure 3 In the circuit topology shown, the electrolytic capacitor C2n can be a single capacitor or multiple capacitors connected in parallel. If the electrolytic capacitor C2n is multiple capacitors, multiple capacitors need to be arranged adjacent to each other during layout design, such as Figure 6 As shown, when there are two electrolytic capacitors 103 , the two electrolytic capacitors 103 are disposed adjacent to each other.

[0081] In some embodiments of this application, see Figure 4 and Figure 5 As shown, the power filter circuit 10 further includes a power input interface 101 , which is disposed on a side of the power filter circuit 10 away from the packaged device 104 .

[0082] The power input interface 101 is used to connect an external power source to the power filter circuit 10. In the circuit wiring substrate 1 of the HVAC controller, the power input interface 101 is an AC input interface (eg, a household power source).

[0083] For example, in Figure 4 and Figure 5 In the embodiment, since the package-on-package device 104 is arranged at the lower right of the circuit wiring substrate 1, the power input interface 101 is arranged at the upper left of the circuit wiring substrate 1 to increase the layout distance between the power input interface 101 and the package-on-package device 104 as much as possible.

[0084] In this embodiment, by setting the power input interface 101 on a side of the power filter circuit 10 away from the packaged device 104, a certain designed distance can be maintained from the output of the packaged device 104, thereby reducing the impact of the power input line on the output load and improving the filtering effect of the power filter circuit 10.

[0085] In some embodiments of the present application, in addition to considering the wiring distance between the PFC inductor 102 and the electrolytic capacitor 103 and the packaged device 104 , it is also necessary to consider that the wiring width between the PFC inductor 102 and the electrolytic capacitor 103 and the packaged device 104 is wide enough.

[0086] Based on this, the wiring width between the PFC inductor 102 and the high-current pin on the high-current pin side of the packaged device 104 is greater than the wiring width of the line connected to the preset pin on the packaged device 104. The preset pin is a pin other than the high-current pin connected to the PFC inductor 102 and the high-current pin connected to the electrolytic capacitor 103.

[0087] That is to say, the wiring width of the lines connected to the pins on the packaged device 104 except for the high-current pin connected to the PFC inductor 102 and the high-current pin connected to the electrolytic capacitor 103 can be wired according to the normal width, and the wiring width between the PFC inductor 102 and the high-current pin on the packaged device 104 can use a wiring width wider than the normal width.

[0088] In this embodiment, by designing the wiring width between the PFC inductor 102 and the high-voltage pin on the high-voltage pin side of the packaged device 104 to be wider, the parasitic inductance (a type of parasitic parameter) of the circuit can be reduced, thereby improving the anti-interference performance and stability of the HVAC controller during operation.

[0089] Furthermore, the wiring width between the electrolytic capacitor 103 and the high-current pin on the high-current pin side of the packaged device 104 must also be greater than the wiring width of the line connected to the preset pin on the packaged device 104, and the preset pin is the pin other than the high-current pin connected to the PFC inductor 102 and the high-current pin connected to the electrolytic capacitor 103.

[0090] That is to say, the wiring width of the lines connected to the pins on the packaged device 104 except for the high-current pin connected to the PFC inductor 102 and the high-current pin connected to the electrolytic capacitor 103 can be wired according to the normal width, and the wiring width between the electrolytic capacitor 103 and the high-current pin on the packaged device 104 can use a wiring width wider than the normal width.

[0091] In this embodiment, by designing the wiring width between the electrolytic capacitor 103 and the high-voltage pin on the high-voltage pin side of the sealing device 104 to be wider, the parasitic capacitance (a type of parasitic parameter) of the circuit can be reduced, thereby improving the anti-interference performance and stability of the HVAC controller during operation.

[0092] It is worth noting that the wiring width between devices is subject to many considerations, usually related to temperature, current, copper foil thickness, etc. It is sufficient to ensure that the wiring width between the PFC inductor 102 and the packaged device 104, as well as the wiring width between the electrolytic capacitor 103 and the packaged device 104, are both greater than the wiring width of the lines connected to the pins on the packaged device 104 except for the high-current pins connected to the PFC inductor 102 and the high-current pins connected to the electrolytic capacitor 103.

[0093] In some embodiments of the present application, Figure 4 and Figure 5 As shown, a switching power supply circuit 105 is further provided on the circuit wiring substrate 1, and the switching power supply circuit 105 is located between the package component 104 and the power supply filter circuit 10. Furthermore, the switching power supply circuit 105 and the power supply filter circuit 10 are provided adjacent to each other.

[0094] The switching power supply circuit 105 is responsible for stabilizing power supply, providing power to other parts of the electrical control section of the HVAC device, and converting voltage levels to meet the requirements of various electronic components.

[0095] Exemplarily, the switching voltage circuit 105 includes electronic components such as a switching tube, a transformer, and a capacitor, etc. These electronic components have corresponding mounting positions, namely, pads, on the circuit wiring substrate 1 .

[0096] In this embodiment, the power supply filter circuit 10 is generally used to suppress high-frequency noise, surges, and electromagnetic interference in the input power supply, while the switching power supply circuit 105 is the source of high-frequency switching. Placing the switching power supply circuit 105 close to the power supply filter circuit 10 helps ensure that the filter circuit can effectively filter and suppress the noise generated by the switching power supply circuit as early as possible, thereby improving circuit stability.

[0097] In some embodiments of the present application, Figure 4 and Figure 5 As shown, a fan control circuit 106 is further provided on the circuit wiring substrate 1 . The fan control circuit 106 is located between the switching power supply circuit 105 and the packaged device 104 , and the electrolytic capacitor 103 is located between the fan control circuit 106 and the PFC inductor 102 .

[0098] The fan control circuit 106 is used to control the start and stop of the fan in the HVAC device to ensure the normal operation of the HVAC device. In actual application, the fan control circuit 106 is a weak current control circuit and needs to be kept a certain distance from the strong current control circuit to reduce interference.

[0099] For example, the fan control circuit 106 generally includes electronic components such as relays, MOSFET switches, sensors, etc. These electronic components have corresponding mounting positions, namely, pads, on the circuit wiring substrate 1 .

[0100] In this embodiment, since the PFC inductor 102 processes higher-frequency switching signals in the power factor correction circuit and withstands larger voltages and currents, the signals processed by the electrolytic capacitor 103 in the power factor correction circuit are generally relatively stable DC currents with smaller voltage fluctuations, and the fan control circuit 106 is a weak-current control circuit. Therefore, during the layout design, the electrolytic capacitor 103 is placed close to the fan control circuit 106, while the PFC inductor is placed away from the fan control circuit 106, so as to reduce the interference of the high-frequency switching signals processed by the PFC inductor on the fan control circuit 106.

[0101] In some embodiments of the present application, see above Figure 2 and Figure 3 As shown, the high-voltage pin side of the packaged device 104 includes the rectifier bridge output pin, the collector pin PF+ and emitter pin PF- of the PFC switch tube, and the cathode pin P of the diode. The rectifier bridge output pin includes the bus power positive terminal DC+ and the bus power negative terminal DC-.

[0102] One end of the PFC inductor 102 is electrically connected to the positive terminal DC+ of the bus power supply, and the other end of the PFC inductor 102 is electrically connected to the collector pin PF+ of the PFC switch Q1. One end of the electrolytic capacitor 103 is electrically connected to the cathode pin P of the diode D5, and the other end of the electrolytic capacitor 103 is electrically connected to the emitter pin PF- of the PFC switch Q1.

[0103] In this embodiment, the electrical connections between the PFC inductor 102 and the electrolytic capacitor 103 and the high-voltage pins on the packaged device 104 are all achieved through the copper foil layer arranged on the circuit wiring substrate 1 .

[0104] In some embodiments of the present application, the packaged device 104 generates a large amount of heat during operation due to its high power density. Therefore, in order to ensure its normal operation and lifespan, effective heat dissipation treatment is required.

[0105] Based on this, the HVAC controller further includes a radiator, which is used to take away the heat generated by the sealing device 104. The radiator is arranged on the surface of the sealing device 104 to facilitate heat dissipation of the sealing device 104.

[0106] Furthermore, the radiator may include a refrigerant circulation pipe, which is used to circulate refrigerant to remove heat generated by the sealing device 104 .

[0107] In this embodiment, the refrigerant circulation pipe can be connected to the pipe of the condenser in the HVAC device, so that the refrigerant circulating in the HVAC device is introduced into the refrigerant circulation pipe of the radiator, thereby achieving the heat dissipation purpose of the sealing device 104.

[0108] Furthermore, the heat sink may further include a support member, which is used to fix the heat sink on the surface of the sealing device 104 to prevent the heat sink from being separated from the sealing device 104 during use.

[0109] In some embodiments of this application, see Figures 4 to 6 As shown, the circuit wiring substrate 1 is further provided with a peripheral control circuit 107 , and the peripheral control circuit 107 is provided on the side where the packaged device 104 is located.

[0110] Exemplarily, the peripheral control circuit 107 includes a temperature detection circuit, a communication circuit, a valve body, and various temperature, voltage, and current protection circuits.

[0111] Example 2:

[0112] Corresponding to the above-mentioned embodiments of the HVAC controller, an embodiment of the present application further provides a HVAC device, which includes the HVAC controller described in any of the above-mentioned embodiments.

[0113] The above description is only a preferred embodiment of the present application and does not limit the patent scope of the present application. All equivalent structural transformations made based on the contents of the present application specification and drawings, or direct / indirect application in other related technical fields, are included in the patent protection scope of the present application.

Claims

1. A HVAC controller, characterized in that: include: A circuit wiring substrate and a power supply filter circuit, a power factor correction (PFC) inductor, an electrolytic capacitor, and a packaged device disposed on the circuit wiring substrate; The power filter circuit and the packaged device are respectively arranged on opposite sides of the circuit wiring substrate, the PFC inductor and the electrolytic capacitor are both located between the power filter circuit and the packaged device, the PFC inductor and the electrolytic capacitor are both arranged on the high-voltage pin side of the packaged device, and the PFC inductor and the electrolytic capacitor are both electrically connected to different high-voltage pins on the high-voltage pin side.

2. The HVAC controller according to claim 1, characterized in that: The power filter circuit includes a power input interface; The power input interface is arranged on a side of the power filter circuit away from the packaged device.

3. The HVAC controller according to claim 1, wherein: The wiring width between the PFC inductor and the high-current pin on the high-current pin side is greater than the wiring width of the line connected to the preset pin on the packaged device. The preset pin is the pin on the packaged device other than the high-current pin connected to the PFC inductor and the high-current pin connected to the electrolytic capacitor.

4. The HVAC controller according to claim 1, wherein: The wiring width between the electrolytic capacitor and the high-voltage pin on the high-voltage pin side is greater than the wiring width of the line connected to the preset pin on the packaged device, and the preset pin is the pin on the packaged device other than the high-voltage pin connected to the PFC inductor and the high-voltage pin connected to the electrolytic capacitor.

5. The HVAC controller according to claim 1, wherein: Also included is a switching power supply circuit provided on the circuit wiring substrate; The switching power supply circuit is located between the packaged device and the power supply filter circuit.

6. The HVAC controller according to claim 5, characterized in that: Also included is a fan control circuit disposed on the circuit wiring substrate; The fan control circuit is located between the switching power supply circuit and the packaged device, and the electrolytic capacitor is located between the fan control circuit and the PFC inductor.

7. The HVAC controller according to claim 1, wherein: The packaged device includes a rectifier bridge, a PFC switch tube, a diode and an inverter module. The high-voltage pin side of the packaged device includes a rectifier output pin of the rectifier bridge, a collector pin and an emitter pin of the PFC switch tube, and a cathode pin of the diode; One end of the PFC inductor is electrically connected to the rectifier output pin of the rectifier bridge, and the other end of the PFC inductor is electrically connected to the collector pin of the PFC switch tube; One end of the electrolytic capacitor is electrically connected to the cathode pin of the diode, and the other end of the electrolytic capacitor is electrically connected to the emitter pin of the PFC switch tube.

8. The HVAC controller according to any one of claims 1 to 7, characterized in that: Also includes radiator; The heat sink is arranged on the surface of the sealed component.

9. The HVAC controller according to claim 8, characterized in that: The radiator includes a refrigerant circulation pipe, and the refrigerant circulation pipe is used for circulating the refrigerant.

10. The HVAC controller according to claim 8, characterized in that: The heat sink includes a support member, and the support member is used to fix the heat sink on the surface of the sealed device.

11. A heating and ventilation device, characterized in that: The method comprises the HVAC controller according to any one of claims 1 to 10.

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