Printed circuit board and printed circuit board manufacturing method

Abstract

The invention discloses a printed circuit board and a printed circuit board manufacturing method. The printed circuit board includes a substrate, a first circuit metal path, a second circuit metal path, a first barrier structure, and a second barrier structure. The first barrier structure is disposed on the first device placement end of the first circuit metal path to form a first pad region. The second barrier structure is disposed on the second device placement end of the second circuit metal path to form a second pad region. A height value of a first pad region height of the first pad region is the same as a height value of a first barrier height of the first barrier structure. A height value of a second pad region height of the second pad region is the same as a height value of a second barrier height of the second barrier region.

Description

Technical Field

[0001] The present invention relates to a printed circuit board and a method for manufacturing the printed circuit board, and in particular to a printed circuit board and a method for manufacturing the printed circuit board with reduced manufacturing costs. Background Art

[0002] The printed circuit boards of existing small-pad component products (such as Mini LED direct-lit displays or direct-lit backlight products) are quite small (e.g., less than 225*225um) and are all equipped with solder mask layers. Therefore, during printing, the solder paste thickness increases and the difference in solder paste between the pads on both sides of the component increases. This can easily cause component short circuits and component tilting after reflow. Because components such as Mini LEDs are set on unbalanced (tilted) pads on both sides, there will be uneven brightness after lighting. This requires rework, which reduces product yield and increases costs.

[0003] How to overcome the above-mentioned defects through structural design improvements and effectively reduce the probability of component short circuits and tilting after reflow soldering to improve product yield has become one of the important issues that this industry wants to solve. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a printed circuit board (PCB) to address the deficiencies of the prior art. The printed circuit board comprises: a substrate; a first circuit metal path disposed on the substrate, the first circuit metal path including a first component-setting end; a second circuit metal path disposed on the substrate, the second circuit metal path including a second component-setting end, the first component-setting end of the first circuit metal path being disposed opposite the second component-setting end of the first circuit metal path; a first barrier structure disposed on the first component-setting end of the first circuit metal path to form a first pad area, the first barrier structure including a first barrier height; and a second barrier structure disposed on the second component-setting end of the second circuit metal path to form a second pad area, the second barrier structure including a second barrier height; wherein the first pad area includes a first pad area height, the height of the first pad area being the same as the height of the first barrier height; and wherein the second pad area includes a second pad area height, the height of the second pad area being the same as the height of the second barrier height.

[0005] Optionally, a first pad material layer and a second pad material layer are respectively provided in the first pad region and the second pad region.

[0006] Optionally, the first barrier structure is arranged on most of the first circuit metal path except the first pad area to form the first pad area, and the second barrier structure is arranged on most of the second circuit metal path except the first pad area to form the second pad area, the first barrier structure and the second barrier structure are respectively a nickel-containing material layer, the first pad structure and the second pad structure are respectively provided with a first pad material layer and a second pad material layer, and the first pad material layer and the second pad material layer are respectively a gold-containing material layer.

[0007] Optionally, the first barrier structure is partially disposed on the first circuit metal path and is disposed around the first pad area, and the second barrier structure is partially disposed on the second circuit metal path and is disposed around the second pad area.

[0008] Optionally, the first barrier structure and the second barrier structure are respectively a gold-containing material layer or a nickel-containing material layer.

[0009] Optionally, the first barrier structure and the second barrier structure are formed through a laser masking process.

[0010] The present invention also discloses a method for manufacturing a printed circuit board, which is characterized in that it includes: setting a first circuit metal path and a second circuit metal path on a substrate; setting a metal material layer on the first circuit metal path and the second circuit metal path respectively; setting a protective layer on the metal material layer on the first circuit metal path and the metal material layer on the second circuit metal path respectively; and forming a first barrier structure to form a first solder pad area at a first component setting end of the first circuit metal path, and forming a second barrier structure to form a second solder pad area at a second component setting end of the second circuit metal path; setting a first solder pad material layer and a second solder pad material layer in the first solder pad area and the second solder pad area respectively; and removing the protective layer on the first circuit metal path and the protective layer on the second circuit metal path.

[0011] Optionally, a height value of a first barrier height of the first barrier structure is the same as a height value of a first pad area height of the first pad area, a height value of a second barrier height of the second barrier structure is the same as a height value of a second pad area height of the second pad area, and the metal material layer, the first barrier structure and the second barrier structure are respectively nickel-containing material layers.

[0012] The present invention also discloses a method for manufacturing a printed circuit board, which is characterized in that it includes: setting a first circuit metal path and a second circuit metal path on a substrate; setting a metal material layer on the first circuit metal path and the second circuit metal path respectively; using a laser masking process to form a first barrier structure at a first component setting end of the first circuit metal path to enclose a first solder pad area, and forming a second barrier structure at a second component setting end of the second circuit metal path to enclose a second solder pad area.

[0013] Optionally, the metal material layer is a gold-containing material layer or a nickel-containing material layer.

[0014] One of the beneficial effects of the present invention is that the printed circuit board and printed circuit board manufacturing method provided by the present invention include multiple barrier structures and do not provide a solder mask layer. This can effectively improve the short circuit and tilt of the component after reflow soldering caused by the increase in solder paste thickness and the difference in solder paste volume on the solder pads on both sides of the component when the solder mask layer is provided. It also eliminates the variation in solder paste volume caused by the influence of the solder mask layer thickness when printing solder paste.

[0015] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and illustration and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 FIG. 1 is a schematic diagram of a printed circuit board according to a first embodiment of the present invention.

[0017] Figure 2 yes Figure 1 Cross-sectional view of the printed circuit board along section line II-II.

[0018] Figure 3 FIG. 1 is a schematic diagram of a printed circuit board according to a second embodiment of the present invention.

[0019] Figure 4 yes Figure 3 Cross-sectional view of the printed circuit board along section line IV-IV.

[0020] Figure 5 1 is a process diagram of a method for manufacturing a printed circuit board according to a third embodiment of the present invention.

[0021] Figures 6A to 6F yes Figure 5 Schematic diagram of a printed circuit board manufacturing method.

[0022] Figure 7 1 is a process diagram of a method for manufacturing a printed circuit board according to a fourth embodiment of the present invention.

[0023] Figures 8A to 8C yes Figure 7 Schematic diagram of a printed circuit board manufacturing method. DETAILED DESCRIPTION

[0024] The following is an explanation of the implementation methods of the "printed circuit board and printed circuit board manufacturing method" disclosed in the present invention through specific specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following embodiments will further explain the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of protection of the present invention. In addition, the term "or" used in this article may include any one or more combinations of the associated listed items depending on the actual situation.

[0025] [First embodiment]

[0026] See also Figure 1 as well as Figure 2 , Figure 1 FIG. 1 is a schematic diagram of a printed circuit board according to a first embodiment of the present invention. Figure 2 yes Figure 1 Cross-sectional view of the printed circuit board along section line II-II.

[0027] In this embodiment, a printed circuit board (PCB) 1 is provided. The printed circuit board (PCB) 1 of this embodiment includes multiple barrier structures and does not include a solder mask layer. This effectively mitigates the effects of increased solder paste thickness and volume differences between solder paste pads on both sides of a component during printing, which can cause short circuits and component tilting after reflow soldering. Furthermore, the PCB 1 eliminates variations in solder paste volume caused by the thickness of the solder mask layer during solder paste printing.

[0028] The printed circuit board PCB1 of this embodiment includes a substrate SB1, a first metal path MP1, a second metal path MP2, a first barrier structure BS1, and a second barrier structure BS2. The first metal path MP1 and the second metal path MP2 are both disposed on the substrate SB1.

[0029] The first circuit metal path MP1 includes a first component setting end CDT1. The second circuit metal path MP2 includes a second component setting end CDT2. The first component setting end CDT1 of the first circuit metal path MP1 is disposed opposite to the second component setting end CDT2 of the second circuit metal path MP2.

[0030] The first barrier structure BS1 is disposed on the first component placement end CDT1 of the first circuit metal path MP1 to form a first pad region SP1. The first barrier structure BS1 includes a first barrier height BH1.

[0031] The second barrier structure BS2 is disposed on the second component-setting end CDT2 of the second circuit metal path MP2 to form a second pad area SP2. The first barrier structure BS1 includes a first barrier height BH1, and the second barrier structure BS2 includes a second barrier height BH2. The first pad area height SP1 includes a first pad area height SH1. The height value of the first pad area height SH1 is the same as the height value of the first barrier height BH1. Furthermore, the second pad area height SP2 includes a second pad area height SH2. The height value of the second pad area height SH2 is the same as the height value of the second barrier height BH2. Furthermore, the height values of the first circuit metal path MP1 and the second circuit metal path MP2 are preset to be the same. Moreover, the height value of the first pad area height SH1 of the first pad area SP1 and the height value of the second pad area height SH2 of the second pad area SP2 are also the same.

[0032] The first barrier structure BS1 is disposed on most of the first circuit metal path MP1 (except the first pad region SP1) and surrounds the first pad region SP1. The second barrier structure BS2 is disposed on most of the second circuit metal path MP2 (except the second pad region SP2) and surrounds the second pad region SP2.

[0033] In this embodiment, the first barrier structure BS1 surrounds and is adjacent to the first pad region SP1 in three directions, so that the first pad region SP1 in a direction not provided with the first barrier structure BS1 can face the second pad region SP2, allowing the component CP1 to be positioned between the first pad region SP1 and the second pad region SP2. Similarly, the second barrier structure BS2 surrounds and is adjacent to the second pad region SP2 in three directions, so that the second pad region SP2 in a direction not provided with the second barrier structure BS2 can face the first pad region SP1, allowing the component CP1 to be positioned between the first pad region SP1 and the second pad region SP2.

[0034] In this embodiment, multiple sets of first pad areas SP1 of first circuit metal paths MP1 and second pad areas SP2 of second circuit metal paths MP2 can be provided on the printed circuit board PCB1. The number of first pad areas SP1 (including first barrier structures BS1) and second pad areas SP2 (including second barrier structures BS2) can be adjusted based on actual needs and are not limited in the present invention. Furthermore, the first barrier structures BS1 and the second barrier structures BS2 are layers containing nickel.

[0035] Furthermore, a first pad material layer SL1 and a second pad material layer SL2 are respectively provided in the first pad region SP1 and the second pad region SP2. The first pad material layer SL1 and the second pad material layer SL2 are respectively a gold-containing material layer. Figure 1 as well as Figure 2 As shown, the component CP1 is, for example but not limited to, a mini LED, and can be connected between the first component setting terminal CDT1 and the second component setting terminal CDT2.

[0036] [Second embodiment]

[0037] See also Figure 3 as well as Figure 4 , Figure 3 FIG. 1 is a schematic diagram of a printed circuit board according to a second embodiment of the present invention. Figure 4 yes Figure 3 Cross-sectional view of the printed circuit board along section line IV-IV.

[0038] The printed circuit board PCB2 of this embodiment is similar to the printed circuit board PCB1 of the first embodiment, with the main difference being that the first barrier structure BS1 and the second barrier structure BS2 are formed by a laser blocking process. The only difference is that the U-shaped areas of the first barrier structure BS1 and the second barrier structure BS2 are laser blocked.

[0039] In addition, the first barrier structure BS1 and the second barrier structure BS2 are only disposed around the first pad region SP1 and the second pad region SP2 , and do not widely cover the first circuit metal path MP1 and the second circuit metal path MP2 , respectively.

[0040] Similarly, the first barrier structure BS1 surrounds and is adjacent to the first pad area SP1 in three directions, so that the direction of the first pad area SP1 not provided with the first barrier structure BS1 can face the second pad area SP2, allowing the component CP1 to be placed between the first pad area SP1 and the second pad area SP2. Similarly, the second barrier structure BS2 surrounds and is adjacent to the second pad area SP2 in three directions, so that the direction of the second pad area SP2 not provided with the second barrier structure BS2 can face the first pad area SP1, allowing the component CP1 to be placed between the first pad area SP1 and the second pad area SP2.

[0041] Similarly, in this embodiment, the height of the first circuit metal path MP1 and the height of the second circuit metal path MP2 are preset to be the same. Furthermore, the height of the first pad region SP1, the first pad region height SH1, and the height of the second pad region SP2, the second pad region height SH2, are also the same.

[0042] [Third embodiment]

[0043] Please also see Figure 5 、 Figures 6A to 6F , Figure 5 1 is a process diagram of a method for manufacturing a printed circuit board according to a third embodiment of the present invention. Figures 6A to 6F yes Figure 5 Schematic diagram of a printed circuit board manufacturing method.

[0044] In this embodiment, a method for manufacturing a printed circuit board is provided, which is suitable for manufacturing a printed circuit board PCB1.

[0045] See also Figures 6A to 6F , Figure 6A The step S301 is to dispose a first circuit metal path MP1 and a second circuit metal path MP2 on a substrate SB1. The substrate SB1 can be a rigid substrate or a flexible substrate, which is not limited in the present invention.

[0046] Figure 6B as well as Figure 6C It shows that in step S302 and step S303 , the first metal material layer MT1 and the second metal material layer MT2 and the first protection layer PL1 and the second protection layer PL2 are respectively disposed on the first circuit metal path MP1 and the second circuit metal path MP2 .

[0047] Step S304 and Figure 6DPart of the metal material layer where the first pad region SP1 and the second pad region SP2 are predetermined is removed to form the first barrier structure BS1, the second barrier structure BS2, the first pad region SP1 and the second pad region SP2.

[0048] In step S305 and Figure 6E In the embodiment, a first bonding pad material layer SL1 and a second bonding pad material layer SL2 are respectively disposed in the first bonding pad region SP1 and the second bonding pad region SP2. In this embodiment, the first bonding pad material layer SL1 and the second bonding pad material layer SL2 are gold-containing material layers.

[0049] Furthermore, a first barrier height BH1 of the first barrier structure BS1 is identical to a first pad region height SH1 of the first pad region SP1. A second barrier height BH2 of the second barrier structure BS2 is identical to a second pad region height SH2 of the second pad region SP2. Furthermore, in this embodiment, the heights of the first circuit metal path MP1 and the second circuit metal path MP2 are preset to be identical. Furthermore, the first pad region height SH1 of the first pad region SP1 and the second pad region height SH2 of the second pad region SP2 are also identical.

[0050] In step S306 and Figure 6F In the example, the first circuit metal path MP1 and the first protective layer PL1 on the first barrier structure BS1, as well as the second circuit metal path MP2 and the second protective layer PL2 on the second barrier structure BS2, are removed. A component (not shown) can then be placed between the first pad area SP1 and the second pad area SP2.

[0051] [Fourth embodiment]

[0052] Please also see Figure 7 、 Figure 8A 、 Figure 8B as well as Figure 8C , Figure 7 1 is a process diagram of a method for manufacturing a printed circuit board according to a fourth embodiment of the present invention. Figures 8A to 8C yes Figure 7 Schematic diagram of a printed circuit board manufacturing method.

[0053] In this embodiment, a method for manufacturing a printed circuit board is provided, which is suitable for manufacturing the printed circuit board PCB2 of the second embodiment.

[0054] In step S401 and Figure 8AIn the present invention, the first circuit metal path MP1 and the second circuit metal path MP2 are first disposed on the substrate SB1. The first circuit metal path MP1 and the second circuit metal path MP2 are both disposed on the same side of the substrate SB1. The substrate SB1 can be a rigid substrate or a flexible substrate, and the present invention does not limit this.

[0055] In step S402 and Figure 8B In the embodiment, the first metal material layer MT1 and the second metal material layer MT2 are respectively disposed on the first circuit metal path MP1 and the second circuit metal path MP2.

[0056] In step S403 and Figure 8C In this embodiment, a laser masking process is used to form a first barrier structure BS1 at a first device placement end CDT1 of a first circuit metal trace MP1 to enclose a first bonding pad area SP1. A second barrier structure BS2 is formed at a second device placement end CDT2 of a second circuit metal trace MP2 to enclose a second bonding pad area SP2. In this embodiment, both the first barrier structure BS1 and the second barrier structure BS2 are U-shaped structures.

[0057] The first barrier structure BS1 surrounds and is adjacent to the first pad area SP1 in three directions (including the first circuit metal path MP1 and the three directions adjacent to the first pad area SP1), so that the direction of the first pad area SP1 not provided with the first barrier structure BS1 can face the second pad area SP2. Similarly, the second barrier structure BS2 surrounds and is adjacent to the second pad area SP2 in three directions, so that the direction of the second pad area SP2 not provided with the second barrier structure BS2 can face the first pad area SP1.

[0058] In this embodiment, the metal material layers (first metal material layer MT1 and second metal material layer MT2) are respectively a gold-containing material layer or a nickel-containing material layer. The only difference is that the first barrier structure BS1 and the second barrier structure BS2 have undergone a laser masking process. Furthermore, in this embodiment, the height of the first circuit metal path MP1 and the height of the second circuit metal path MP2 are preset to be the same. Furthermore, the height of the first pad area SP1, the first pad area height SH1, and the height of the second pad area SP2, the second pad area height SH2, are also the same.

[0059] [Beneficial Effects of Embodiments]

[0060] One of the beneficial effects of the present invention is that the printed circuit board and printed circuit board manufacturing method provided by the present invention include multiple barrier structures and do not provide a solder mask layer. This can effectively improve the short circuit and tilt of the component after reflow soldering caused by the increase in solder paste thickness and the difference in solder paste volume on the solder pads on both sides of the component when the solder mask layer is provided. It also eliminates the variation in solder paste volume caused by the influence of the solder mask layer thickness when printing solder paste.

[0061] The contents disclosed above are only preferred feasible embodiments of the present invention and are not intended to limit the claims of the present invention. Therefore, any equivalent technical changes made using the contents of the present invention's description and drawings are included in the claims of the present invention.

Claims

1. A printed circuit board, characterized in that: include: a substrate; a first circuit metal path disposed on the substrate, wherein the first circuit metal path includes a first component placement end; a second circuit metal path disposed on the substrate, the second circuit metal path including a second component placement end, the first component placement end of the first circuit metal path being disposed opposite to the second component placement end of the first circuit metal path; a first barrier structure disposed on the first component-disposing end of the first circuit metal path to form a first pad area, the first barrier structure comprising a first barrier height; as well as a second barrier structure disposed on the second component-disposing end of the second circuit metal path to form a second pad area, the second barrier structure comprising a second barrier height; Wherein, the first pad area includes a first pad area height, and a height value of the first pad area is the same as the height value of the first barrier height; The second pad region includes a second pad region height, and the height value of the second pad region height is the same as the height value of the second barrier height.

2. The printed circuit board according to claim 1, wherein: A first pad material layer and a second pad material layer are respectively disposed in the first pad region and the second pad region.

3. The printed circuit board according to claim 1, wherein: The first barrier structure is arranged on most of the first circuit metal path except the first pad area to form the first pad area, and the second barrier structure is arranged on most of the second circuit metal path except the first pad area to form the second pad area. The first barrier structure and the second barrier structure are respectively a nickel-containing material layer, and the first pad structure and the second pad structure are respectively provided with a first pad material layer and a second pad material layer, and the first pad material layer and the second pad material layer are respectively a gold-containing material layer.

4. The printed circuit board according to claim 1, wherein: The first barrier structure is partially disposed on the first circuit metal path and surrounds the first pad area. The second barrier structure is partially disposed on the second circuit metal path and surrounds the second pad area.

5. The printed circuit board according to claim 4, wherein: The first barrier structure and the second barrier structure are respectively a gold-containing material layer or a nickel-containing material layer.

6. The printed circuit board according to claim 5, wherein: The first barrier structure and the second barrier structure are formed through a laser masking process.

7. A method for manufacturing a printed circuit board, characterized in that: include: Disposing a first circuit metal path and a second circuit metal path on a substrate; Disposing a metal material layer on a first circuit metal path and a second circuit metal path respectively; A protective layer is respectively provided on the metal material layer on the first circuit metal path and the metal material layer on the second circuit metal path; as well as forming a first barrier structure to form a first pad region at a first component placement end of the first circuit metal path, and forming a second barrier structure to form a second pad region at a second component placement end of the second circuit metal path; Disposing a first pad material layer and a second pad material layer in the first pad area and the second pad area respectively; as well as The protective layer on the first circuit metal path and the protective layer on the second circuit metal path are removed.

8. The method for manufacturing a printed circuit board according to claim 7, wherein: A height value of a first barrier height of the first barrier structure is the same as a height value of a first pad area height of the first pad area, a height value of a second barrier height of the second barrier structure is the same as a height value of a second pad area height of the second pad area, and the metal material layer, the first barrier structure and the second barrier structure are respectively a nickel-containing material layer.

9. A method for manufacturing a printed circuit board, characterized in that: include: Disposing a first circuit metal path and a second circuit metal path on a substrate; Disposing a metal material layer on a first circuit metal path and a second circuit metal path respectively; A laser masking process is used to form a first barrier structure at a first component setting end of the first circuit metal path to enclose a first pad area, and a second barrier structure is formed at a second component setting end of the second circuit metal path to enclose a second pad area.

10. The method for manufacturing a printed circuit board according to claim 9, wherein: The metal material layer is a gold-containing material layer or a nickel-containing material layer.

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