Optical module

Abstract

The invention provides an optical module comprising an optical fiber adapter, one end of which is used for connecting an external optical fiber; an optical accommodation member including a first housing; wherein one end of the first shell is connected with the other end of the optical fiber adapter; one side of the first shell is connected with a first light receiving part, a second light receiving part and a third light receiving part, and the first light receiving part, the second light receiving part and the third light receiving part are configured to receive a fourth wavelength light signal, a fifth wavelength light signal and a sixth wavelength light signal which are input through the optical fiber adapter respectively; one end of the light emitting component is connected with the other end of the optical containing component, the light emitting component comprises a second cavity and a first laser assembly, a second laser assembly, a third laser assembly and a wave combining assembly which are arranged in the second cavity, the first laser assembly generates a first wavelength optical signal, the second laser assembly generates a second wavelength optical signal, and the third laser assembly generates a third wavelength optical signal; the third laser assembly generates a third wavelength optical signal.

Description

optical modules

[0001] This application claims the priority of application number 202311542497.5 filed with the China Patent Office on November 17, 2023; the priority of application number 202311539987.X filed with the China Patent Office on November 17, 2023; and the priority of application number 202420062434.3 filed with the China Patent Office on January 10, 2024; all of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Art

[0003] With the development of new services and applications such as cloud computing, mobile internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for converting optical and electrical signals, and are key components in optical communication equipment. Furthermore, the transmission rates of optical modules are constantly increasing as optical communication technology evolves.

[0004] Summary of the Invention

[0005] An embodiment of the present disclosure provides an optical module, including:

[0006] Fiber optic adapter, one end of which is used to connect to an external optical fiber;

[0007] An optical receiving component comprising a first housing; wherein one end of the first housing is connected to the other end of the optical fiber adapter; and one side of the first housing is connected to a first light receiving component, a second light receiving component, and a third light receiving component, wherein the first light receiving component, the second light receiving component, and the third light receiving component are configured to respectively receive a fourth wavelength optical signal, a fifth wavelength optical signal, and a sixth wavelength optical signal input through the optical fiber adapter;

[0008] an optical emitting component, one end of which is connected to the other end of the optical accommodating component, wherein the optical emitting component includes a second cavity and a first laser component, a second laser component, a third laser component, and a wavelength combining component disposed in the second cavity, wherein the first laser component generates an optical signal of a first wavelength, the second laser component generates an optical signal of a second wavelength, and the third laser component generates an optical signal of a third wavelength;

[0009] Multiple rows of pins are provided on the side walls of the second cavity, the bottom row of pins includes high-frequency pins, the ends of the high-frequency pins extend into the second cavity, and the first laser assembly, the second laser assembly and the third laser assembly are electrically connected to the corresponding high-frequency pins respectively; a light outlet is provided at one end of the second cavity, the light outlet is optically connected to the optical accommodation component, the combining component is provided on the side of the light outlet, and the combining component is configured to combine the first wavelength optical signal, the second wavelength optical signal and the third wavelength optical signal, and transmit them to the optical fiber adapter through the optical accommodation component. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0011] FIG1 is a partial architecture diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0012] FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0013] FIG3 is a schematic structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0014] FIG4 is an exploded view of an optical module according to some embodiments of the present disclosure;

[0015] FIG5 is a first schematic diagram of the internal structure of an optical module according to some embodiments of the present disclosure;

[0016] FIG6 is a second schematic diagram of the internal structure of an optical module provided according to some embodiments of the present disclosure;

[0017] FIG7 is an exploded schematic diagram of the internal structure of an optical module according to some embodiments of the present disclosure;

[0018] FIG8 is an exploded schematic diagram of a fiber optic adapter and a first housing according to some embodiments of the present disclosure;

[0019] FIG9 is a cross-sectional view of an internal structure of an optical module according to some embodiments of the present disclosure;

[0020] FIG10 is a first structural schematic diagram of a first housing according to some embodiments of the present disclosure;

[0021] FIG11 is an exploded schematic diagram of a first housing according to some embodiments of the present disclosure;

[0022] FIG12 is a second structural schematic diagram of a first housing according to some embodiments of the present disclosure;

[0023] FIG13 is a first view of a first housing in use according to some embodiments of the present disclosure;

[0024] FIG14 is a second diagram of a first housing in use according to some embodiments of the present disclosure;

[0025] FIG15 is a cross-sectional view of an optical receiving component according to some embodiments of the present disclosure;

[0026] FIG16 is a light path diagram inside an optical receiving component according to some embodiments of the present disclosure;

[0027] FIG17 is a first structural diagram of a light emitting component according to some embodiments of the present disclosure;

[0028] FIG18 is a second structural diagram of a light emitting component provided according to some embodiments of the present disclosure;

[0029] FIG19 is an exploded schematic diagram of a light emitting component according to some embodiments of the present disclosure;

[0030] FIG20 is a schematic diagram of a partial structure of a light emitting component according to some embodiments of the present disclosure;

[0031] FIG21 is a second schematic diagram of a partial structure of a light emitting component provided according to some embodiments of the present disclosure;

[0032] FIG22 is a third schematic diagram of a partial structure of a light emitting component according to some embodiments of the present disclosure;

[0033] FIG23 is a first cross-sectional view of a light emitting component according to some embodiments of the present disclosure;

[0034] FIG24 is a second cross-sectional view of a light emitting component according to some embodiments of the present disclosure;

[0035] FIG25 is a third cross-sectional view of a light emitting component according to some embodiments of the present disclosure;

[0036] FIG26 is a transmission optical path diagram of an optical transmission signal according to some embodiments of the present disclosure;

[0037] FIG27 is a first structural diagram of a mounting bracket according to some embodiments of the present disclosure;

[0038] FIG28 is a second structural diagram of a mounting bracket according to some embodiments of the present disclosure;

[0039] FIG29 is a diagram illustrating a mounting bracket in use according to some embodiments of the present disclosure;

[0040] FIG30 is an exploded view of a light emitting component according to some embodiments of the present disclosure;

[0041] FIG31 is an exploded view of a first optical assembly and a transmitting housing according to some embodiments of the present disclosure;

[0042] FIG32 is a structural diagram of a launch housing according to some embodiments of the present disclosure;

[0043] FIG33 is a light path diagram of a first optical component according to some embodiments of the present disclosure;

[0044] FIG34 is another optical path diagram of the first optical assembly according to some embodiments of the present disclosure;

[0045] FIG35 is a combined optical path diagram of a first optical assembly and a light receiving component according to some embodiments of the present disclosure;

[0046] FIG36 is a schematic diagram illustrating the optical axis of a wave plate, the polarization direction of an incident light signal, and the polarization direction of an outgoing light signal according to some embodiments of the present disclosure;

[0047] FIG37 is an exploded view of a supporting member, a second polarization combining member, and a third polarization combining member according to some embodiments of the present disclosure;

[0048] FIG38 is a structural diagram of a supporting member according to some embodiments of the present disclosure;

[0049] FIG39 is a structural diagram of a supporting member provided in accordance with some embodiments of the present disclosure from another perspective;

[0050] FIG40 is a cross-sectional view of a support member according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0051] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0052] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0053] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0054] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components are in direct physical or electrical contact with each other. For another example, when describing some embodiments, the term "coupled" may be used to indicate that two or more components are in direct physical or electrical contact. However, the term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0055] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0056] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0057] The use of "adapted to" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0058] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0059] In optical communication technology, to establish information transmission between information processing devices, it is necessary to load the information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When transmitting optical signals within information transmission equipment, they can reduce optical power loss, thereby enabling high-speed, long-distance, and low-cost information transmission. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment typically includes optical fibers and optical waveguides.

[0060] Optical modules can convert optical signals into electrical signals between information processing devices and information transmission devices. For example, at least one of the optical signal input or output ends of an optical module is connected to an optical fiber, and at least one of the electrical signal input or output ends of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber. Because multiple information processing devices can transmit information via electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is referred to as the optical module's host computer. Furthermore, the optical signal input or output end of the optical module can be referred to as an optical port, and the electrical signal input or output end of the optical module can be referred to as an electrical port.

[0061] FIG1 is a partial structural diagram of an optical communication system according to some embodiments. As shown in FIG1 , the optical communication system mainly includes a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 , and a network cable 103 .

[0062] One end of optical fiber 101 extends toward remote information processing device 1000, and the other end of optical fiber 101 is connected to optical module 200 through the optical port of optical module 200. Optical signals can be totally reflected in optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal undergoes multiple total reflections in optical fiber 101 to transmit the optical signal from remote information processing device 1000 to optical module 200, and vice versa, thereby achieving long-distance, low-power information transmission.

[0063] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 may be detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0064] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0065] The host computer 100 also includes an external electrical interface that can access an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to access a network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing device 2000 and the host computer 100 via the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is then transmitted to the remote server device 1000 via the optical fiber 101. For example, a first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that optical modules are tools for converting optical signals into electrical signals. During this conversion process, the information does not change, but the encoding and decoding methods of the information can change.

[0066] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0067] Figure 2 is a partial structural diagram of a host computer according to some embodiments. To clearly illustrate the connection between the optical module 200 and the host computer 100, Figure 2 only shows the structure of the host computer 100 related to the optical module 200. As shown in Figure 2, the host computer 100 also includes a PCB circuit board 105 disposed within the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed within the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has raised structures such as fins to increase the heat dissipation area.

[0068] The optical module 200 is inserted into the cage 106 of the host computer 100. The cage 106 secures the optical module 200. Heat generated by the optical module 200 is transferred to the cage 106 and then dissipated through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 connects with the electrical connector inside the cage 106, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, thereby establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0069] Figure 3 is a structural diagram of an optical module according to some embodiments of the present disclosure, and Figure 4 is an exploded schematic diagram of an optical module according to some embodiments of the present disclosure. As shown in Figures 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed within the housing, a light-emitting component 400, and an optical receiving component 500. The optical receiving component 500 is provided with at least one light-receiving component. However, the present disclosure is not limited to this. In some embodiments, the optical module 200 includes either the light-emitting component 400 or the optical receiving component 500.

[0070] The housing includes an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing with two openings. The outer contour of the housing is generally a square.

[0071] In some embodiments of the present disclosure, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicular to the base plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0072] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to achieve the upper shell 201 covering the lower shell 202.

[0073] The direction of the line connecting the two openings 203 and 204 can be consistent with the length direction of the optical module 200, or it can be inconsistent with the length direction of the optical module 200. For example, the opening 203 is located at the end of the optical module 200 (the right end in FIG3 ), and the opening 204 is also located at the end of the optical module 200 (the left end in FIG3 ). Alternatively, the opening 203 is located at the end of the optical module 200, and the opening 204 is located on the side of the optical module 200. The opening 203 is an electrical port, from which the gold finger of the circuit board 300 extends and is inserted into the host computer (for example, the optical network terminal 100); the opening 204 is an optical port, which is configured to receive the optical fiber 101 so that the optical fiber 101 can connect to the optical emitting component 400 and / or the optical receiving component 500 in the optical module 200.

[0074] The combined assembly of the upper and lower housings 201 and 202 facilitates the installation of components such as the circuit board 300, the light-emitting component 400, and the optical receiving component 500 into the housing, with the upper and lower housings 201 and 202 providing encapsulation and protection for these components. Furthermore, during the assembly of the circuit board 300, the light-emitting component 400, and the optical receiving component 500, the positioning components, heat dissipation components, and electromagnetic shielding components of these components are easily arranged, facilitating automated production.

[0075] In some embodiments, the upper housing 201 and the lower housing 202 are generally made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0076] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0077] Exemplarily, the unlocking component 600 is located on the outside of the two lower side panels 2022 of the lower housing 202 and includes a snap-fit ​​component that mates with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 secures the optical module 200 in the cage 106. When the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection between the snap-fit ​​component and the host computer, thereby releasing the optical module 200 from the cage 106 and allowing the optical module 200 to be removed from the cage 106.

[0078] The circuit board 300 includes circuit traces, electronic components, and chips. The circuit traces connect the electronic components and chips together according to the circuit design to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips include, for example, microcontroller units (MCUs), laser driver chips, limiting amplifiers (LAs), clock and data recovery (CDR) chips, power management chips, and digital signal processing (DSP) chips.

[0079] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the upper computer cage.

[0080] The circuit board 300 also includes a gold finger 310 formed on its end surface, and the gold finger 310 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 310 is electrically connected to the electrical connector in the cage 106. The gold finger 310 can be set only on the surface of one side of the circuit board 300 (for example, the upper surface shown in Figure 4), or it can be set on the upper and lower surfaces of the circuit board 300 to adapt to occasions where a large number of pins are required. The gold finger 310 is configured to establish an electrical connection with the host computer to achieve power supply, grounding, I2C signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0081] In some embodiments, the light emitting component 400 and the optical receiving component 500 are physically separated from the circuit board 300 and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0082] FIG5 is a schematic diagram of the internal structure of an optical module according to some embodiments of the present disclosure, and FIG6 is a schematic diagram of the internal structure of an optical module according to some embodiments of the present disclosure. As shown in FIG5 and FIG6, one end of the optical receiving component 500 is connected to the optical fiber adapter 700, and the other end of the optical receiving component 500 is connected to the optical emitting component 400. The optical signal generated by the optical emitting component 400 is first transmitted to the optical receiving component 500, then transmitted to the optical fiber adapter 700 through the optical receiving component 500, and finally output through the optical fiber adapter 700; the external input optical signal is input to the optical receiving component 500 through the optical fiber adapter 700, so that the optical receiving component 500 and the optical emitting component 400 share the optical fiber adapter 700, thereby allowing the uplink optical signal and the downlink optical signal of the optical module to share the optical fiber 101.

[0083] In some embodiments, the optical emitting component 400 generates optical transmit signals of multiple wavelengths and is capable of combining the optical transmit signals of multiple wavelengths into a single optical transmit signal. The optical receiving component 500 is provided with multiple optical receiving components, enabling the optical receiving component 500 to receive optical receive signals comprising multiple wavelengths. For example, the optical emitting component 400 generates optical transmit signals of three wavelengths, each having different rates, such as a first wavelength optical signal, a second wavelength optical signal, and a third wavelength optical signal having different rates. The optical receiving component 500 receives optical receive signals of three wavelengths, each having different rates, such as a fourth wavelength optical signal, a fifth wavelength optical signal, and a sixth wavelength optical signal having different rates.

[0084] In some embodiments, the wavelength range of the first wavelength optical signal is 1340-1344 nm, such as the wavelength of the first wavelength optical signal is 1342 nm; the wavelength range of the second wavelength optical signal is 1575-1580 nm, such as the wavelength of the second wavelength optical signal is 1577 nm; the wavelength range of the third wavelength optical signal is 1480-1500 nm, such as the wavelength of the third wavelength optical signal is 1490 nm; the wavelength range of the fourth wavelength optical signal is 1260-1280 nm, such as the wavelength of the fourth wavelength optical signal is 1270 nm; the wavelength range of the fifth wavelength optical signal is 1284-1288 nm, such as the wavelength of the fifth wavelength optical signal is 1286 nm; and the wavelength range of the sixth wavelength optical signal is 1290-1330 nm, such as the wavelength of the sixth wavelength optical signal is 1310 nm.

[0085] In some embodiments, the receiving rates of the photodetector in the first light receiving component 530, the receiving rates of the photodetector in the second light receiving component 540, and the receiving rates of the photodetector in the third light receiving component 550 are different. For example, the receiving rate of the photodetector in the second light receiving component 540 is greater than the receiving rate of the photodetector in the first light receiving component 530, and the receiving rate of the photodetector in the second light receiving component 540 is greater than the receiving rate of the photodetector in the third light receiving component 550. This ensures that the optical path of the fifth wavelength optical signal with the highest transmission rate from the output of the wavelength division multiplexer 564 to the photodetector is relatively short and the optical path is simplest, so that the photodetector in the second light receiving component 540 can receive the optical signal with high coupling efficiency. For example, the receiving rate of the photodetector in the first light receiving component 530 is 10G, the receiving rate of the photodetector in the second light receiving component 540 is 50G, and the receiving rate of the photodetector in the third light receiving component 550 is 2.5G. It should be noted that the locations of the light receiving components with different receiving rates are also different.

[0086] As shown in Figure 5, in some embodiments, the optical receiving component 500 includes a first housing 510 and a first upper cover 520. The first housing 510 and the first upper cover 520 are connected to form a first cavity. The sidewalls of the first housing 510 are provided with a first light receiving component 530, a second light receiving component 540, and a third light receiving component 550. The interior of the first cavity forms a receiving chamber, which is used to accommodate components and enable connections or communication between components. Exemplarily, a displacement prism, a reflector, etc. are provided in the receiving chamber.

[0087] In some embodiments, an inner cavity is provided on the first shell 510 , so that the first upper cover 520 covers the first shell 510 to form an accommodating cavity; the first upper cover 520 is located on a side of the first shell 510 facing the cover plate 2011 .

[0088] As shown in FIG5 , in some embodiments, one end of the first housing 510 is connected to the fiber optic adapter 700, and the other end of the first housing 510 is connected to the light emitting component 400. A first light receiving component 530, a second light receiving component 540, and a third light receiving component 550 are disposed on one side of the first housing 510. This allows the fiber optic adapter 700, the light emitting component 400, the first light receiving component 530, the second light receiving component 540, and the third light receiving component 550 to be encapsulated within the first housing 510, thereby optically connecting the fiber optic adapter 700, the light emitting component 400, the first light receiving component 530, the second light receiving component 540, and the third light receiving component 550 to the first receiving cavity. The light emitting component 400, the first light receiving component 530, the second light receiving component 540, and the third light receiving component 550 are electrically connected to the circuit board 300 via a flexible circuit board.

[0089] As shown in Figure 6, in some embodiments, the optical transmission component 400 includes a second housing 410 and a second upper cover 420. The second upper cover 420 covers and connects to the second housing 410 to form a second cavity. A plurality of pins 430 are provided on the sidewalls of the second housing 410. The second housing 410 contains components for generating and transmitting optical transmission signals. The pins 430 connect to a flexible printed circuit board (FPCB) to electrically connect to the circuit board 300. For example, one end of the second housing 410 connects to the other end of the first housing 510; the second upper cover 420 is located on the side of the second housing 410 facing the base plate 2021.

[0090] In some embodiments, multiple rows of pins are respectively disposed on two connected side walls of the second housing 410 , and the pins in the bottom row of the two connected side walls include high-frequency pins.

[0091] As shown in FIG6 , in some embodiments, the bottom of the first housing 510 is provided with an inclined surface 510a. The inclined surface 510a slopes from the bottom of the first housing 510 toward the other end of the first housing 510 to facilitate the avoidance of tooling associated with assembling the light emitting component 400. For example, when the second upper cover 420 and the second housing 410 are connected by seam welding, the inclined surface 510a avoids the seam welding machine.

[0092] In some embodiments, the optical module includes multiple flexible circuit boards. For example, the light emitting component 400 is electrically connected to the circuit board 300 via two flexible circuit boards, and the first light receiving component 530, the second light receiving component 540, and the third light receiving component 550 are electrically connected to the circuit board 300 via corresponding flexible circuit boards.

[0093] FIG7 is a schematic diagram of an exploded view of the internal structure of an optical module provided according to some embodiments of the present disclosure. As shown in FIG7 , the first light receiving component 530, the second light receiving component 540, and the third light receiving component 550 are coaxially packaged. For example, a first connection hole 511, a second connection hole 512, and a third connection hole 513 are provided on the side wall of the first shell 510, and the first connection hole 511, the second connection hole 512, and the third connection hole 513 are respectively connected to the first accommodating cavity; the first light receiving component 530 is embedded in the first connection hole 511, the second light receiving component 540 is embedded in the second connection hole 512, and the third light receiving component 550 is embedded in the third connection hole 513.

[0094] The other end of the first housing 510 is formed with a notched corner 510b, located to the side of the third connection hole 513. A connection seat 5101 is disposed within the notched corner 510b. One end of the connection seat 5101 is connected to a side wall of the first housing 510, and the other end of the connection seat 5101 is connected to the second housing 410. Exemplarily, the connection seat 5101 is integrally formed with the first housing 510. A fifth connection hole 5102 is disposed on the connection seat 5101, connecting the first housing 510 and the second housing 410.

[0095] Figure 8 is an exploded schematic diagram of a fiber optic adapter and a first housing according to some embodiments of the present disclosure. Figure 9 is a cross-sectional view of the internal structure of an optical module according to some embodiments of the present disclosure, showing the cross-sectional structure of the fiber optic adapter. As shown in Figures 8 and 9, a fourth connection hole 514 is provided on the sidewall of one end of the first housing 510, and the fourth connection hole 514 communicates with the first accommodating cavity. A connecting sleeve 515 is provided at one end of the first housing 510, one end of which is connected to the fiber optic adapter 700, and the other end of which is connected to the outer wall of the first housing 510. The connecting sleeve 515 communicates with the fourth connection hole 514.

[0096] A first lens 516 is disposed within the fourth connection hole 514. The first lens 516 is used to converge the optical transmit signal and collimate the optical receive signal. Exemplarily, the fourth connection hole 514 includes a lens mounting hole 5141, which is a stepped hole formed on the fourth connection hole 514. A lens mounting seat 5161 is disposed on the first lens 516. The lens mounting seat 5161 is embedded within the lens mounting hole 5141 to securely connect the first lens 516 to the first housing 510. A step is formed on the outer side of one end of the lens mounting seat 5161 to facilitate movement and clamping, thereby facilitating assembly of the first lens 516.

[0097] Figure 10 is a schematic diagram of the structure of a first housing according to some embodiments of the present disclosure, Figure 11 is an exploded schematic diagram of the structure of a first housing according to some embodiments of the present disclosure, and Figure 12 is a schematic diagram of the structure of a first housing according to some embodiments of the present disclosure. As shown in Figures 10-12, a receiving cavity 517 is formed inside the first housing 510, and a first connection hole 511, a second connection hole 512, a third connection hole 513, and a fourth connection hole 514 are respectively connected to the receiving cavity 517.

[0098] In some embodiments, a first displacement prism 561, a first reflector 562, a first filter 563, a wavelength division multiplexer 564, a second displacement prism 565, a third displacement prism 566, and a fourth displacement prism 567 are disposed within the accommodating cavity 517. A first mounting surface 518 is provided on the top of the first housing 510, and the first mounting surface 518 supports and connects to the first upper cover 520.

[0099] Figure 13 shows a first housing in use according to some embodiments of the present disclosure, and Figure 14 shows a second first housing in use according to some embodiments of the present disclosure. As shown in Figures 10-14, the accommodating chamber 517 includes a first accommodating chamber 5171, a second accommodating chamber 5172, and a third accommodating chamber 5173. The first side of the first accommodating chamber 5171 communicates with the fourth connection hole 514. The second accommodating chamber 5172 is disposed on the second side of the first accommodating chamber 5171. A first baffle 5174 is disposed between the second accommodating chamber 5172 and the first accommodating chamber 5171. The first baffle 5174 defines a first through cavity 5175, which connects the first accommodating chamber 5171 with the second accommodating chamber 5172. The top support of the first baffle 5174 is connected to the first upper cover 520. A third accommodating cavity 5173 is provided on the third side of the first accommodating cavity 5171. A second baffle 5176 is provided between the first and third accommodating cavities 5171 and 5173. A second through cavity 5177 is defined in the second baffle 5176, connecting the first and third accommodating cavities 5171 and 5173. The second accommodating cavity 5172 extends from one end of the first housing 510 to the other end of the first housing 510, with the other end of the second accommodating cavity 5172 extending to the side of the notched corner 510b. The third accommodating cavity 5173 is located on the side of the fifth connecting hole 5102 and is connected to the fifth connecting hole 5102.

[0100] The first displacement prism 561, the first reflector 562, the first optical filter 563, and the wavelength division multiplexer 564 are disposed in the first accommodating cavity 5171, the second displacement prism 565 and the third displacement prism 566 are disposed in the second accommodating cavity 5172, and the fourth displacement prism 567 is disposed in the third accommodating cavity 5173. Exemplarily, the sides of the second displacement prism 565 and the third displacement prism 566 abut against the sidewall of the first baffle 5174, which fixedly supports the second displacement prism 565 and the third displacement prism 566. The first optical filter 563 is disposed on the second baffle 5176, which fixedly supports the first optical filter 563.

[0101] In the embodiment of the present disclosure, the fourth displacement prism 567 is used to make the fifth connecting hole 5102 closer to the center line of the first shell 510 to adapt to the light emitting component 400, and to make the assembly of the light emitting component 400 and the optical accommodating component 500 more concentrated, thereby facilitating the reduction of the space occupied by assembling the light emitting component 400 and the optical accommodating component 500 in the optical module, and adapting to the requirements of multiple transmission channels of the optical module.

[0102] In some embodiments, a mounting base 568 is further disposed within the accommodating cavity 517. The bottom of the mounting base 568 is connected to the bottom of the first accommodating cavity 5171, and the side of the mounting base 568 securely supports the first reflector 562. For example, the first reflector 562 is first secured to the mounting base 568, then positioned to a predetermined position through optical coupling, and the mounting base 568 is secured. The mounting base 568 facilitates securing the first reflector 562 within the first accommodating cavity 5171.

[0103] In some embodiments, an opening 519 is provided on the fourth side of the first accommodating cavity 5171. The opening 519 is located on the side of the mounting base 568, and a sealing plate 5191 is provided in the opening 519. The opening 519 is provided on the fourth side of the first accommodating cavity 5171 to facilitate the fixed installation of the mounting base 568, thereby facilitating the fixation of the first reflector 562 in the first accommodating cavity 5171. Exemplarily, when the first reflector 562 is set to a preset position through optical coupling, an optical fixing device irradiates the mounting base 568 with light for optical fixation through the opening 519, thereby fixing the mounting base 568 to the bottom plate of the first accommodating cavity 5171. After the mounting base 568 is optically fixed to the first accommodating cavity 5171, the sealing plate 5191 is fixed to the opening 519.

[0104] FIG15 is a cross-sectional view of an optical receiving component according to some embodiments of the present disclosure, illustrating the optical transmission paths of optical receiving and transmitting signals within the optical receiving component. The optical transmitting signal output by the optical transmitting component 400 is transmitted through the fifth connection hole 5102 to the incident surface of the fourth displacement prism 567, then transmitted through the incident surface of the fourth displacement prism 567 to the first reflection surface of the fourth displacement prism 567. The optical transmitting signal is then reflected from the first reflection surface of the fourth displacement prism 567 to the second reflection surface of the fourth displacement prism 567, then transmitted to the light exiting surface of the fourth displacement prism 567. The light exiting surface of the fourth displacement prism 567 is then transmitted to the first optical filter 563, then to the first displacement prism 561, and then out of the fourth connection hole 514 along the output optical path of the first displacement prism 561. The light is then converged by the first lens 516 and transmitted to the optical fiber adapter 700. The optical receiving signal is transmitted to the first lens 516 through the optical fiber adapter 700, collimated by the first lens 516 and transmitted to the light incident surface of the first displacement prism 561, then transmitted to the first reflection surface of the first displacement prism 561 through the light incident surface of the first displacement prism 561, reflected by the first reflection surface of the first displacement prism 561 and transmitted to the second reflection surface of the first displacement prism 561, then reflected by the second reflection surface of the first displacement prism 561 and transmitted to the light exit surface of the first displacement prism 561, then transmitted through the light exit surface of the first displacement prism 561 to the first filter 563, reflected by the first filter 563 and transmitted to the first reflection mirror 562, and then reflected by the first reflection mirror 562 and transmitted to the wavelength division multiplexer 564. If the received optical signal includes an optical signal with a fourth wavelength, the fourth wavelength optical signal is transmitted to the second shifting prism 565 via the wavelength division multiplexer 564, and then transmitted to the first optical receiving component 530 via the second shifting prism 565. If the received optical signal includes an optical signal with a fifth wavelength, the fifth wavelength optical signal is transmitted to the second optical receiving component 540 via the wavelength division multiplexer 564. If the received optical signal includes an optical signal with a sixth wavelength, the sixth wavelength optical signal is transmitted to the third shifting prism 566 via the wavelength division multiplexer 564, and then transmitted to the third optical receiving component 550 via the third shifting prism 566.

[0105] Figure 16 is a diagram of the optical path within an optical container according to some embodiments of the present disclosure. As shown in Figure 16, the optical signal emitted by the optical emitting component 400 is first adjusted in the Y direction by the fourth displacement prism 567 before entering the first filter 563. The signal then passes through the first filter 563 and enters the first displacement prism 561. The signal then passes through the first displacement prism 561 and enters the first lens 516, where it is finally converged.

[0106] A beam of received optical signals including the fourth wavelength optical signal, the fifth wavelength optical signal, and the sixth wavelength optical signal is first collimated by the first lens 516 and then transmitted to the first displacement prism 561. Then, the received optical signals are adjusted in the Y direction by the first displacement prism 561 and then incident on the first filter 563. The received optical signals are again reflected by the first filter 563 and transmitted to the first reflector 562. Then, the received optical signals are reflected by the first reflector 562 and transmitted to the wavelength division multiplexer 564. Finally, the received optical signals are split into the fourth wavelength optical signal, the fifth wavelength optical signal, and the sixth wavelength optical signal according to the wavelength of the optical signals by the wavelength division multiplexer 564.

[0107] The light signal is reflected by the first reflection surface of the first displacement prism 561 to the second reflection surface of the first displacement prism 561 , and then reflected by the second reflection surface of the first displacement prism 561 to the exit surface of the first displacement prism 561 , and then emitted through the exit surface of the first displacement prism 561 .

[0108] The fourth wavelength optical signal is transmitted to the incident surface of the second displacement prism 565. The optical signal passes through the incident surface of the second displacement prism 565 and is incident on the first reflection surface of the second displacement prism 565. The optical signal is reflected from the first reflection surface of the second displacement prism 565 to the second reflection surface of the second displacement prism 565. The optical signal is reflected from the second reflection surface of the second displacement prism 565 to the exit surface of the second displacement prism 565. The optical signal is emitted from the exit surface of the second displacement prism 565 to the first light receiving element 530. The fifth wavelength optical signal is transmitted through the optical filter 541 and is transmitted to the second light receiving element 540. The sixth wavelength optical signal is transmitted to the incident surface of the third displacement prism 566. The optical signal passes through the incident surface of the third displacement prism 566 and is incident on the first reflection surface of the third displacement prism 566. The optical signal is reflected by the first reflection surface of the third displacement prism 566 to the second reflection surface of the third displacement prism 566. The optical signal is reflected by the second reflection surface of the third displacement prism 566 to the exit surface of the third displacement prism 566. The optical signal is emitted to the third light receiving component 550 through the exit surface of the third displacement prism 566.

[0109] The fourth wavelength optical signal is transmitted to the first optical receiving component 530, the fifth wavelength optical signal is transmitted to the second optical receiving component 540, and the sixth wavelength optical signal is transmitted to the third optical receiving component 550. Of course, in some embodiments, the optical signal transmitted to the first optical receiving component 530 is not limited to the fourth wavelength optical signal and may also include optical signals of other wavelengths, but is mainly the fourth wavelength optical signal; the optical signal transmitted to the second optical receiving component 540 is not limited to the fifth wavelength optical signal and may also include optical signals of other wavelengths, but is mainly the fifth wavelength optical signal; the optical signal transmitted to the third optical receiving component 550 is not limited to the sixth wavelength optical signal and may also include optical signals of other wavelengths, but is mainly the sixth wavelength optical signal.

[0110] In some embodiments, a filter 541 is provided at the light input front end of the second light receiving component 540 , and the filter 541 is used to filter out the clutter in the optical signal that is about to be incident on the second light receiving component 540 , thereby improving the quality of the optical signal incident on the second light receiving component 540 .

[0111] In some embodiments, an isolator 569 is provided in the fifth connection hole 5102. The isolator 569 is used to prevent the light emission signal reflected back by the fourth displacement prism 567 from re-entering the second shell 410, thereby reducing the impact of the reflected light emission signal on the light emission signal generated by the light emission component 400.

[0112] Figure 17 is a schematic diagram of the structure of a light emitting component according to some embodiments of the present disclosure. Figure 18 is a schematic diagram of the structure of a light emitting component according to some embodiments of the present disclosure. Figure 19 is an exploded schematic diagram of a light emitting component according to some embodiments of the present disclosure. As shown in Figures 17-19, the light emitting component 400 includes a second housing 410 and a second upper cover 420. The second upper cover 420 covers and connects to the second housing 410 to form a second cavity. The second housing 410 includes a bottom plate 411, a first side wall 412, a second side wall 413, a third side wall 414, and a fourth side wall 415. The first, second, third, and fourth side walls 412, 413, 414, and 415 are sequentially connected, with their bottoms connected to the bottom plate 411, forming a second inner cavity. The tops of the first, second, third, and fourth side walls 412, 413, 414, and 415 are supported and connected to the second upper cover 420. The bottom plate 411 is used to support the device.

[0113] In some embodiments, the second housing 410 is a housing integrally formed of metal material.

[0114] The first sidewall 412 is located at one end of the second housing 410. A sixth connection hole 4121 is provided on the first sidewall 412. The sixth connection hole 4121 communicates with the second inner cavity and serves as a light outlet for the second cavity. The sixth connection hole 4121 connects to the first housing 510, connecting the second housing 410 to the accommodating cavity 517 through the sixth connection hole 4121. For example, the sixth connection hole 4121 is embedded in the other end of the connector 5101.

[0115] In some embodiments, a boss 4122 is provided on the outer side of the first side wall 412 , one end of the sixth connection hole 4121 passes through the boss 4122 , and the end of the connection seat 5101 is embedded with the connection boss 4122 .

[0116] The second sidewall 413 is located on a side of the first housing 510, within the notched corner 510b and adjacent to the third light receiving element 550. The third sidewall 414 is located at the other end of the first housing 510, adjacent to the circuit board 300. The fourth sidewall 415 is located on a side of the first housing 510, with the second sidewall 413 located at the edge of the notched corner 510b. Exemplarily, two rows of pins are provided on each of the third and fourth sidewalls 414, 415, each row including a plurality of pins 430. For ease of description, the row of pins on the third and fourth sidewalls 414, 415 that is adjacent to the bottom plate 411 is referred to as the bottom row of pins on the third and fourth sidewalls 414, 415. The pins 430 on the third and fourth sidewalls 414, 415 are electrically connected to the circuit board 300 via corresponding flexible printed circuit boards.

[0117] As shown in FIG19 , a first laser assembly 440, a second laser assembly 450, and a third laser assembly 460 are disposed within the second housing 410. In some embodiments, the first laser assembly 440 is located on the sides of the second sidewall 413 and the third sidewall 414; the second laser assembly 450 and the third laser assembly 460 are located on the sides of the fourth sidewall 415, with the third laser assembly 460 located on the side of the second laser assembly 450 away from the third sidewall 414. The third laser assembly 460 is located on the side of the first sidewall 412. This arrangement allows the first laser assembly 440, the second laser assembly 450, and the third laser assembly 460 to be distributed on the sides of two adjacent sidewalls of the second housing 410. This arrangement results in a triangular distribution of the first laser assembly 440, the second laser assembly 450, and the third laser assembly 460, rather than being arranged in a row, to reduce the packaging volume of the light-emitting component 400. Illustratively, the first laser assembly 440 generates an optical signal of a first wavelength, the second laser assembly 450 generates an optical signal of a second wavelength, and the third laser assembly 460 generates an optical signal of a third wavelength.

[0118] In some embodiments, the third sidewall 414 is disposed along the width direction of the second housing 410, and the fourth sidewall is disposed along the length direction of the second housing 410. This allows the first laser assembly 440 to be disposed within the width direction of the second housing 410, thereby reducing the width dimension of the second housing 410. The second laser assembly 450 and the third laser assembly 460 are disposed within the length direction of the second housing 410, in conjunction with the first laser assembly 440 disposed within the width direction of the second housing 410. This allows sufficient laser assemblies to be disposed within the second housing 410, while reducing the overall dimension of the second housing 410 and, consequently, the dimension of the light-emitting component 400.

[0119] In some embodiments, the first laser assembly 440, the second laser assembly 450, and the third laser assembly 460 have different transmission rates. For example, the transmission rate of the first laser assembly 440 is greater than the transmission rate of the second laser assembly 450, and the transmission rate of the second laser assembly 450 is greater than the transmission rate of the third laser assembly 460. For example, the transmission rate of the first laser assembly 440 is 50G, the transmission rate of the second laser assembly 450 is 10G, and the transmission rate of the third laser assembly 460 is 2.5G.

[0120] A second filter 416 and a third filter 417 are also disposed on the side of the light outlet in the second housing 410. The second filter 416 and the third filter 417 are disposed on the side of the sixth connection hole 4121 and are located on the output optical paths of the first laser assembly 440, the second laser assembly 450, and the third laser assembly 460. The second filter 416 and the third filter 417 are disposed side by side. The second filter 416 and the third filter 417 are used to change the transmission optical paths of the first wavelength optical signal, the second wavelength optical signal, and the third wavelength optical signal, allowing the first wavelength optical signal, the second wavelength optical signal, and the third wavelength optical signal to pass through the sixth connection hole 4121. Exemplarily, the third filter 417 and the second filter 416 transmit the first wavelength optical signal, the third filter 417 reflects the second wavelength optical signal, and the second filter 416 transmits the second wavelength optical signal and reflects the third wavelength optical signal.

[0121] In some embodiments, the second filter 416 and the third filter 417 are arranged on the side where the first side wall 412 and the second side wall 413 are connected, so that the second filter 416, the third filter 417 and the first laser assembly 440 are arranged compactly, which facilitates controlling the length direction of the second shell 410.

[0122] In some embodiments, second filter 416 is disposed at the intersection of the output optical paths of first laser assembly 440 and third laser assembly 460, and third filter 417 is disposed at the intersection of the output optical paths of first laser assembly 440 and second laser assembly 450. First laser assembly 440 is located on the transmissive side of third filter 417, second laser assembly 450 is located on the reflective side of third filter 417, and third laser assembly 460 is located on the reflective side of second filter 416. Exemplarily, second filter 416 includes a first optical surface and a second optical surface, which are primary optical surfaces of second filter 416. Third filter 417 includes a third optical surface and a fourth optical surface, which are primary optical surfaces of third filter 417. The first optical surface faces third laser assembly 460, the second optical surface faces third filter 417, the third optical surface faces second laser assembly 450, and the fourth optical surface faces first laser assembly 440.

[0123] In some embodiments, a mounting bracket 470 is further disposed within the second housing 410. The mounting bracket 470 is disposed on the side of the sixth connection hole 4121 and is fixed within the second housing 410. The mounting bracket 470 supports and connects the second optical filter 416 and the third optical filter 417. The second optical filter 416 and the third optical filter 417 are fixed within the second housing 410 via the mounting bracket 470, facilitating the fixing of the second optical filter 416 and the third optical filter 417 within the second housing 410.

[0124] In some embodiments, a lens 418 is further disposed within the second housing 410. The lens 418 is disposed on the optical path from the first laser assembly 440, the second laser assembly 450, and the third laser assembly 460 to the second filter 416 or the third filter 417. For example, a first lens 4181 is disposed on the optical path from the first laser assembly 440 to the third filter 417 to collimate the first wavelength optical signal; a second lens 4182 is disposed on the optical path from the second laser assembly 450 to the third filter 417 to collimate the second wavelength optical signal; and a third lens 4183 is disposed on the optical path from the third laser assembly 460 to the second filter 416 to collimate the third wavelength optical signal.

[0125] Figure 20 is a partial structural schematic diagram of a light emitting component provided according to some embodiments of the present disclosure, Figure 21 is a partial structural schematic diagram of a light emitting component provided according to some embodiments of the present disclosure, Figure 22 is a partial structural schematic diagram of a light emitting component provided according to some embodiments of the present disclosure, Figure 23 is a cross-sectional view of a light emitting component provided according to some embodiments of the present disclosure, Figure 24 is a cross-sectional view of a light emitting component provided according to some embodiments of the present disclosure, and Figure 25 is a cross-sectional view of a light emitting component provided according to some embodiments of the present disclosure. Figures 20 to 25 show the internal structure of the light emitting component in the embodiments of the present disclosure.

[0126] In some embodiments, the first laser assembly 440 includes a first substrate 441 and a first laser chip 442. The first laser chip 442 is mounted on the first substrate 441 and integrates an electro-absorption modulated laser and a semiconductor optical amplifier. A ground layer 4410, a first high-frequency pad 4411, a first LD pad 4412, and a first SOA pad 4413 are provided on the first substrate 441. The first laser chip 442 is mounted on the ground layer 4410, with the first high-frequency pad 4411, the first LD pad 4412, and the first SOA pad 4413 located on the sides of the first laser chip 442. The first high-frequency pad 4411, the first LD pad 4412, and the first SOA pad 4413 are each wire-bonded to the first laser chip 442. A first high-frequency pin 4301, a first SOA pin 4302, and a first LD pin 4303 are disposed on the third sidewall 414. These pins are embedded in the third sidewall 414, with their ends extending into the inner cavity of the second housing 410. These pins are insulated from the third sidewall 414 by insulating layers. The first high-frequency pin 4301 is located in the bottom row of pins on the third sidewall 414. The first high-frequency pin 4301 is electrically connected to the first high-frequency pad 4411, the first SOA pin 4302 is electrically connected to the first SOA pad 4413, and the first LD pin 4303 is electrically connected to the first LD pad 4412. In some embodiments, one end of the first high frequency pin 4301 is wired to the first high frequency pad 4411 , one end of the first SOA pin 4302 is wired to the first SOA pad 4413 , and one end of the first LD pin 4303 is wired to the first LD pad 4412 .

[0127] In some embodiments, the height of the first high-frequency pin 4301 on the third sidewall 414 is lower than the height of the first SOA pin 4302 and the first LD pin 4303 on the third sidewall 414, that is, the first high-frequency pin 4301 is closer to the bottom plate 411. A first ground pin 4304 is also provided on the third sidewall 414. The first ground pin 4304 is located to the side of the first high-frequency pin 4301 and is electrically connected to the third sidewall 414.

[0128] In some embodiments, a first adapter board 481 is further provided in the second shell 410, and a circuit pattern is provided on the first adapter board 481 to realize electrical connection between the first high-frequency pin 4301 and the first laser assembly 440 through the first adapter board 481. The first adapter board 481 can also be used for impedance matching of the first laser chip 442 to ensure the impedance continuity of the high-frequency transmission link.

[0129] In some embodiments, a first high-frequency transmission line 4811 is disposed on the front of the first adapter plate 481. A first ground layer 4812 is disposed on one side of the first high-frequency transmission line 4811, and a second ground layer 4813 is disposed on the other side of the first high-frequency transmission line 4811. One end of the first high-frequency transmission line 4811 is electrically connected to the first high-frequency pad 4411, and the other end of the first high-frequency transmission line 4811 is electrically connected to the first high-frequency pin 4301. Exemplarily, one end of the first high-frequency transmission line 4811 is wire-bonded to the first high-frequency pad 4411, and the other end of the first high-frequency transmission line 4811 is soldered to the first high-frequency pin 4301; the ground layer 4110 is wire-bonded to the first ground layer 4812 and the second ground layer 4813.

[0130] In some embodiments, a ground layer is set on the back of the first adapter board 481, and via holes are respectively set on the first ground layer 4812 and the second ground layer 4813. The first ground layer 4812 and the second ground layer 4813 are respectively connected to the ground layer on the back of the first adapter board 481 through the via holes.

[0131] In some embodiments, the second laser assembly 450 includes a second substrate 451 and a second laser chip 452. The second laser chip 452 is mounted on the second substrate 451 and integrates an electro-absorption modulated laser and a semiconductor optical amplifier. A ground layer, a second high-frequency pad 4511, a second LD pad 4512, and a second SOA pad 4513 are disposed on the second substrate 451. The second high-frequency pad 4511, the second LD pad 4512, and the second SOA pad 4513 are located on the sides of the second laser chip 452. The second laser chip 452 is mounted on the ground layer, and the second high-frequency pad 4511, the second LD pad 4512, and the second SOA pad 4513 are respectively wire-bonded to the second laser chip 452.

[0132] Pins 430 further include a second high-frequency pin 4305, a second SOA pin 4306, and a second LD pin 4307. Second high-frequency pin 4305 is located in the bottom row of pins on third sidewall 414. Second high-frequency pin 4305 is electrically connected to second high-frequency pad 4511, second SOA pin 4306 is electrically connected to second SOA pad 4513, and second LD pin 4307 is electrically connected to second LD pad 4512.

[0133] In some embodiments, a second adapter plate 482 is further disposed within the second housing 410, with a circuit board pattern disposed thereon. The second adapter plate 482 is used to electrically connect the second high-frequency pin 4305 to the second laser assembly 450. The second adapter plate 482 can also be used to impedance match the second laser chip 452 to ensure impedance continuity of the high-frequency transmission link.

[0134] In some embodiments, a second high-frequency pin 4305 is embedded in and connected to the third sidewall 414, insulated from the third sidewall 414 by an insulating layer. A second adapter plate 482 is disposed on a side of the third sidewall 414. A second SOA pin 4306 and a second LD pin 4307 are embedded in and connected to the fourth sidewall 415 and insulated from the fourth sidewall 415 by an insulating layer. The second SOA pin 4306 is wired to the second SOA pad 4513, and the second LD pin 4307 is wired to the second LD pad 4512. A second ground pin 4308 is also disposed on the third sidewall 414, located on a side of the second high-frequency pin 4305 and electrically connected to the third sidewall 414. Exemplarily, the second ground pin 4308 is located on a side of the second high-frequency pin 4305 that is proximal to the first high-frequency pin 4301. The second adapter plate 482 and the first adapter plate 481 are located on the same side of the second shell 410 , which facilitates the assembly of the second adapter plate 482 and improves the assembly density of components in the second shell 410 , thereby helping to reduce the size of the second shell 410 .

[0135] In some embodiments, a second high-frequency transmission line 4821 is disposed on the front surface of the second adapter plate 482, a third ground layer 4822 is disposed on one side of the second high-frequency transmission line 4821, and a fourth ground layer 4823 is disposed on the other side of the second high-frequency transmission line 4821. One end of the second high-frequency transmission line 4821 is electrically connected to the second high-frequency pad 4511, and the other end of the second high-frequency transmission line 4821 is electrically connected to the second high-frequency pin 4305. Exemplarily, one end of the second high-frequency transmission line 4821 is bonded to the second high-frequency pad 4511, and the other end of the second high-frequency transmission line 4821 is soldered to the second high-frequency pin 4305; the ground layer 4510 electrically connects the third ground layer 4822 and the fourth ground layer 4823.

[0136] In some embodiments, a ground layer is provided on the back of the second adapter plate 482, and vias are provided in the third and fourth ground layers 4822 and 4823, respectively. The third and fourth ground layers 4822 and 4823 are connected to the ground layer on the back of the second adapter plate 482 through the vias. In some embodiments, a third adapter plate 483 is further provided within the second housing 410, with a circuit pattern provided thereon. The third adapter plate 483 is positioned between the second laser assembly 450 and the second adapter plate 482, with the side edges of the third adapter plate 483 adjacent to the first laser assembly 440. The third adapter plate 483 is used to achieve an electrical connection between the second laser assembly 450 and the second adapter plate 482. The third adapter plate 483 also provides impedance matching for the second laser chip 452 to ensure impedance continuity in the high-frequency transmission link. The third adapter plate 483 helps reduce the length of the wire bonds between the second laser assembly 450 and the second adapter plate 482, thereby reducing parasitic inductance and ensuring high-frequency signal transmission quality.

[0137] In some embodiments, a third high-frequency transmission line 4831 is disposed on the front surface of the third adapter plate 483, a fifth ground layer 4832 is disposed on one side of the third high-frequency transmission line 4831, and a sixth ground layer 4833 is disposed on the other side of the third high-frequency transmission line 4831. One end of the third high-frequency transmission line 4831 is electrically connected to the second high-frequency pad 4511, and the other end of the third high-frequency transmission line 4831 is electrically connected to the second high-frequency transmission line 4821. Exemplarily, one end of the second high-frequency transmission line 4821 is wired to the second high-frequency pad 4511, and the other end of the third high-frequency transmission line 4831 is wired to one end of the second high-frequency transmission line 4821; the fifth ground layer 4832 is wired to the third ground layer 4822, the sixth ground layer 4833 is wired to the fourth ground layer 4823, and the fifth and sixth ground layers 4832 and 4833 are each wired to the ground layer 4510.

[0138] In some embodiments, a third LD pad 4834 and a third SOA pad 4835 are further provided on the front surface of the third adapter board 483. The third LD pad 4834 and the third SOA pad 4835 are located near the first laser assembly 440. The first LD pad 4412 and the first LD pin 4303 are electrically connected to the third LD pad 4834, respectively. The first SOA pad 4413 and the first SOA pin 4302 are electrically connected to the third SOA pad 4835, respectively. This allows the first laser assembly 440, the first LD pin 4303, and the first SOA pin 4302 to be electrically connected via the third adapter board 483, thereby facilitating control of the bonding arc height and thus facilitating bonding.

[0139] In some embodiments, capacitors are mounted on third LD pad 4834 and third SOA pad 4835, respectively. First LD pad 4412 and first LD pin 4303 are connected to the capacitors mounted on third LD pad 4834, respectively. First SOA pad 4413 and first SOA pin 4302 are wired to connect the capacitors mounted on third SOA pad 4835. A third adapter plate 483 is disposed at the junction of third sidewall 414 and fourth sidewall 415, enabling third adapter plate 483 to serve both first laser assembly 440 and second laser assembly 450, thereby facilitating coordinated use of space within second housing 410.

[0140] In some embodiments, the third laser assembly 460 includes a third substrate 461 and a third laser chip 462. A negative electrode pad 4611 and a positive electrode pad 4612 are provided on the third substrate. The third laser chip 462 is mounted on the negative electrode pad 4611 and is wire-bonded to the positive electrode pad 4612. The pins 430 also include a third LD pin 4309 and a fourth LD pin 4310. The third LD pin 4309 is wire-bonded to the positive electrode pad 4612, and the fourth LD pin 4310 is wire-bonded to the negative electrode pad 4611. Exemplarily, the third LD pin 4309 and the fourth LD pin 4310 are embedded in the fourth side wall 415, with their ends respectively extending into the inner cavity of the second housing 410 and insulated from the fourth side wall 415 by an insulating layer.

[0141] In some embodiments, the third laser assembly 460 further includes a backlight detector 463, which is disposed on the third substrate 461 and located on the backlight side of the third laser chip 462. The backlight detector 463 is configured to receive backlight from the third laser chip 462 to monitor optical signals at a third wavelength. Pins 430 further include an MPD pin 4311, which is wired to the backlight detector 463. Exemplarily, the MPD pin 4311 is embedded in the fourth sidewall 415, with the end of the MPD pin 4311 extending into the inner cavity of the second housing 410. The MPD pin 4311 is insulated from the fourth sidewall 415 by an insulating layer.

[0142] In some embodiments, a thermoelectric cooler (TEC) 490 is further disposed within the second housing 410. The bottom of the TEC 490 is connected to the base plate 411, and the top of the TEC 490 supports the first laser assembly 440, the second laser assembly 450, and the third laser assembly 460. The sides of the TEC 490 include a first TEC pad 491 and a second TEC pad 492, which are located on the sides of the second sidewall 413. The pins 430 also include a first TEC pin 4312 and a second TEC pin 4313. The first TEC pin 4312 is electrically connected to the first TEC pad 491, and the second TEC pin 4313 is electrically connected to the second TEC pad 492. Exemplarily, the first TEC pin 4312 and the second TEC pin 4313 are embedded in the third sidewall 414, with their ends extending into the inner cavity of the second housing 410 and insulated from the third sidewall 414 by an insulating layer.

[0143] In some embodiments, a support plate 419 is further disposed within second housing 410 and is positioned atop TEC 490. The bottom of support plate 419 is connected to the top of TEC 490, while the top of support plate 419 supports and connects first laser assembly 440, second laser assembly 450, and third laser assembly 460. In some embodiments, support plate 419 is electrically connected to the ground layer on the front surface of third adapter plate 483.

[0144] In some embodiments, a fourth adapter plate 484 is further disposed within the second housing 410. The fourth adapter plate 484 is disposed on the support plate 419 and has a circuit pattern disposed thereon. The fourth adapter plate 484 is used to connect the TEC pads and TEC pins. Exemplarily, the fourth adapter plate 484 includes a fourth substrate 4841 on which a first metal layer 4842 and a second metal layer 4843 are disposed. The first metal layer 4842 and the second metal layer 4843 extend along the length of the fourth substrate 4841. The fourth adapter plate 484 is disposed adjacent to the second sidewall 413 and adjacent to the first laser assembly 440. One end of the first metal layer 4842 is wire-bonded to the first TEC pad 491, and the other end of the first metal layer 4842 is wire-bonded to the first TEC pin 4312. One end of the second metal layer 4843 is wire-bonded to the second TEC pad 492, and the other end of the second metal layer 4843 is wire-bonded to the second TEC pin 4313.

[0145] In some embodiments, a temperature sensor 4836 is further provided on the third adapter board 483; illustratively, the temperature sensor 4836 is a thermistor. Pins 430 also include an RTH pin 4314, which is embedded in the third sidewall 414. One end of the RTH pin 4314 extends into the inner cavity of the second housing 410 and is insulated from the third sidewall 414 by an insulating layer. One end of the RTH pin 4314 is electrically connected to the temperature sensor 4836.

[0146] In some embodiments, a transfer pad 4837 is further provided on the third adapter board 483. The transfer pad 4837 is disposed on the side of the temperature sensor 4836 and is connected to the temperature sensor 4836 and the RTH pin 4314 by wire bonding. The transfer pad 4837 facilitates the connection between the temperature sensor 4836 and the RTH pin 4314, thereby reducing the risk of heat being transferred to the RTH pin 4314 through the wire bonding when the temperature sensor 4836 is directly connected to the RTH pin 4314, which could cause the temperature sensor 4836 to detect inaccurate temperature in the second cavity.

[0147] In some embodiments, the inner side of the third sidewall 414 includes a first side surface 4141, a second side surface 4142, a first stepped surface 4143, and a second stepped surface 4144. The first side surface 4141 is connected to the first stepped surface 4143, one end of the second stepped surface 4144 is connected to the first side surface 4141, and the other end of the second stepped surface 4144 is connected to the second side surface 4142. The first stepped surface 4143 is closer to the bottom plate 411 than the second stepped surface 4144. That is, the height of the first stepped surface 4143 in the second housing 410 is lower than the height of the second stepped surface 4144 in the second housing 410.

[0148] The first stepped surface 4143 supports and connects the first adapter plate 481 and the second adapter plate 482. One end of the first high-frequency pin 4301 and one end of the second high-frequency pin 4305 each pass through the first side surface 4141. One end of the first high-frequency pin 4301 extends above the first adapter plate 481, while one end of the second high-frequency pin 4305 extends to the second adapter plate 482. One end of the RTH pin 4314 passes through the first side surface 4141, while one end of the first SOA pin 4302, one end of the first LD pin 4303, one end of the first TEC pin 4312, and one end of the second TEC pin 4313 each pass through the second side surface 4142. The second ground pin 4308 is located between the first high-frequency pin 4301 and the second high-frequency pin 4305. The first ground pin 4304 is located on the side of the first high-frequency pin 4301 away from the second high-frequency pin 4305.

[0149] In some embodiments, the pins extending through the first side surface 4141 form a first row of pins 430a, and the pins extending through the second side surface 4142 form a second row of pins 430b. That is, the pins disposed on the third side wall 414 are arranged in two rows. The pins in the first row of pins 430a are staggered with the pins in the second row of pins 430b to facilitate pin bonding and adaption to flexible printed circuit boards, while also reducing the risk of air leakage caused by deformation of the insulating layer used to secure the pins.

[0150] In some embodiments, the MPD pin 4311 and the second SOA pin 4306 are located in a row, and the second LD pin 4307 , the third LD pin 4309 , and the fourth LD pin 4310 are located in a row.

[0151] In some embodiments, the sixth connection hole 4121 is a stepped through hole that gradually becomes smaller from one side of the boss 4122 to the inside of the second housing 410. A sealing window 4123 is provided in the sixth connection hole 4121 at the boss 4122 to seal the sixth connection hole 4121.

[0152] FIG26 is a transmission optical path diagram of an optical transmission signal provided according to some embodiments of the present disclosure. FIG26 shows the transmission optical path of the optical transmission signal. As shown in FIG26 , the first wavelength optical signal generated by the first laser assembly 440 is transmitted to the first lens 4181, collimated by the first lens 4181, and then transmitted to the third filter 417. The optical signal is transmitted through the third filter 417 to the second filter 416, and then transmitted to the sixth connection hole 4121 through the second filter 416. The second wavelength optical signal generated by the second laser assembly 450 is transmitted to the second lens 4182, collimated by the second lens 4182, and then transmitted to the third filter 417. The optical signal is reflected by the third filter 417 and then transmitted to the second filter 416. The optical signal is transmitted through the second filter 416 to the sixth connection hole 4121. The third wavelength optical signal generated by the third laser assembly 460 is transmitted to the third lens 4183, collimated by the third lens 4183, and then transmitted to the second filter 416. The optical signal is reflected by the second filter 416 and then transmitted to the sixth connection hole 4121. The second filter 416 and the third filter 417 allow the first wavelength optical signal, the second wavelength optical signal, and the third wavelength optical signal to have a common optical path when outputting from the second housing 410 .

[0153] Figure 27 is a schematic diagram (I) of the structure of a mounting bracket according to some embodiments of the present disclosure. Figure 8 is a schematic diagram (II) of the structure of a mounting bracket according to some embodiments of the present disclosure. Figure 29 shows a diagram of a mounting bracket in use according to some embodiments of the present disclosure. As shown in Figures 27-29, mounting bracket 470 includes a bracket body 471, with first and second supports 472 and 473 disposed on its sides. The bottom of bracket body 471 is connected to support plate 419. One end of first support 472 is connected to bracket body 471, and the other end of first support 472 extends away from bracket body 471. One end of second support 473 is connected to bracket body 471, and the other end of second support 473 extends away from bracket body 471. A gap 474 is formed between first support 472 and second support 473. Gap 474 allows transmission of the first and third wavelength optical signals.

[0154] In some embodiments, a first support surface 4721 is provided on one side of the first support body 472, a second support surface 4722 is provided on the other side of the first support body 472, a third support surface 4731 is provided on one side of the second support body 473, and a fourth support surface 4732 is provided on the other side of the second support body 473. The first support surface 4721 and the third support surface 4731 are inclined at a first preset angle, while the second support surface 4722 and the fourth support surface 4732 are inclined at a second preset angle. The first support surface 4721 and the third support surface 4731 support and connect the second optical filter 416, while the second support surface 4722 and the fourth support surface 4732 support and connect the third optical filter 417, thereby facilitating the fixing of the second filter 416 and the third filter 417.

[0155] In some embodiments, the bracket body 471 is further provided with a first limiting surface 4711 and a second limiting surface 4712, respectively located on the side edges of the bracket body 471. The first limiting surface 4711 is located at one end of the first support surface 4721, and the second limiting surface 4712 is located at one end of the second support surface 4722. For example, one end of the first limiting surface 4711 and one end of the second limiting surface 4712 extend to the top of the bracket body 471, respectively, while the other ends of the first limiting surface 4711 and the other ends of the second limiting surface 4712 extend to the bottom of the bracket body 471. The first limiting surface 4711 is provided for retaining the second filter 416, while the second limiting surface 4712 is provided for retaining the third filter 417. The first limiting surface 4711 and the second limiting surface 4712 facilitate precise assembly of the second filter 416 and the third filter 417.

[0156] In some embodiments, a first driver chip 320, a second driver chip 330, a third driver chip 340, and an MCU 350 are provided on the circuit board 300. The first driver chip 320 is electrically connected to the first laser assembly 440 and the second light receiving component 540. The first driver chip 320 is used to drive the first laser assembly 440 to generate a first wavelength optical signal and receive and process the electrical signal output by the second light receiving component 540 when receiving the fifth wavelength optical signal; the second driver chip 330 is electrically connected to the second laser assembly 450 and the first light receiving component 530. The second driver chip 330 is used to drive the second laser assembly 450 to generate a second wavelength optical signal and receive and process the electrical signal output by the first light receiving component 530 when receiving the fourth wavelength optical signal; the third driver chip 340 is electrically connected to the third laser assembly 460 and the third light receiving component 550. The third driver chip 340 is used to drive the second laser assembly 450 to generate a third wavelength optical signal and receive and process the electrical signal output by the third light receiving component 550 when receiving the sixth wavelength optical signal. The MCU 350 is connected to the gold finger 310 and controls the connection between the first driver chip 320 , the second driver chip 330 and the third driver chip 340 .

[0157] The optical module provided in the embodiments of the present disclosure also includes another optical emitting component structure, which includes a first laser assembly, a second laser assembly, and a third laser assembly. The first laser assembly emits a first wavelength optical signal, the second laser assembly emits a second wavelength optical signal, and the third laser assembly emits a third wavelength optical signal. These components are identical to the optical emitting components in the aforementioned embodiments. The difference is that this example uses a polarization assembly and a polarization combining assembly to combine the first, second, and third wavelength optical signals. The combined optical signals are then transmitted to the fiber optic adapter through the aforementioned optical receiving assembly.

[0158] Figure 30 is an exploded view of an optical transmitter assembly according to some embodiments. Figure 31 is an exploded view of a second optical assembly and a transmitter housing according to some embodiments. Figure 32 is a structural diagram of a transmitter housing according to some embodiments. As shown in Figures 30, 31, and 32, an optical transmitter assembly 400 includes a transmitter cover 401 and a transmitter housing 402. The transmitter cover 401 covers the transmitter housing 402 to form a transmitter cavity. A first optical assembly 403 is disposed within the transmitter cavity and is used to transmit optical signals.

[0159] In some embodiments, a third through-hole 4211 is provided at the first end of the transmitting housing 402. A light window is positioned within the third through-hole 4211, configured to transmit the transmitted light signal and seal the light hole. The light window is embedded within the third through-hole 4211 to seal the third through-hole 4211; the light window can be made of transparent glass. The light window seals the third through-hole 4211, allowing the transmitted light signal to pass through while also sealing the third through-hole 4211, thereby ensuring the sealing performance of the transmitting housing 402.

[0160] In some embodiments, the light window may also be embedded and connected to the fourth through hole 51321 .

[0161] In some embodiments, a notch is provided at the second end of the launch housing 402, and the notch passes through the second end of the launch housing 402. One end of the first circuit board 301 is embedded in the notch, that is, one end of the first circuit board 301 passes through the notch and extends into the inner cavity of the launch housing 402.

[0162] In some embodiments, a first optical assembly 403 is disposed within the inner cavity of the transmitting housing 402. The first optical assembly 403 includes a laser assembly 431. The laser assembly 431 is positioned near one end of the first circuit board 301 to facilitate electrical connection of the laser assembly 431 to the first circuit board 301. The laser assembly 431 is configured to transmit multiple optical signals of different wavelengths. Exemplarily, the laser assembly 431 is connected to the first circuit board 301 by wire bonding.

[0163] In some embodiments, a socket 4234 is provided at the second end of the launch shell 402, and the socket 4234 passes through the second end of the launch shell 402. The first end of the launch pin 405 is connected to the second circuit board 302, and the second end of the launch pin 405 passes through the socket 4234 and extends into the inner cavity of the launch shell 402.

[0164] In some embodiments, a first optical assembly 403 is disposed within the inner cavity of the transmitting housing 402. The first optical assembly 403 includes a laser assembly 431. Laser assembly 431 is positioned near one end of the transmitting pin 405 to facilitate electrical connection of laser assembly 431 to the transmitting pin 405. Laser assembly 431 is configured to transmit multiple optical signals of different wavelengths. Exemplarily, laser assembly 431 is connected to transmitting pin 405 via wire bonding.

[0165] In some embodiments, the first optical component 403 further includes a lens component 432 , which is disposed on the optical path from the laser component 431 to the combiner component for collimating the optical signal generated by the laser component 431 and transmitting it to the combiner component.

[0166] In some embodiments, the first optical component 403 further includes a combining component, which is used to combine multiple optical signals of different wavelengths emitted by the laser component 431 into one transmitted optical signal.

[0167] As shown in Figures 30, 31, and 32, in some embodiments, the second end of the transmitting housing 402 is provided with multiple jacks 4234. The multiple jacks 4234 include a first jack and a second jack. The first jack is closer to the bottom of the transceiver housing 402. The first jack is used to insert a first transmitting pin, and the second jack is used to insert a second transmitting pin, thereby reducing signal crosstalk between the first transmitting pin and the second transmitting pin. The first transmitting pin is a rate-related transmitting pin 405, and the second transmitting pin is a rate-independent transmitting pin 405.

[0168] As shown in Figures 30 and 31, in some embodiments, a first soldering pad 406 is further provided at the second end of the launch shell 402, one end of the first soldering pad 406 is welded to the first launch pin located on the first socket, and the other end of the first soldering pad 406 is wired to the soldering pad where the laser component 431 is located.

[0169] In some embodiments, the first optical component 403 is fixed in the emission cavity through the substrate 404, and the soldering pad where the laser component 431 is located is connected to the first soldering pad 406 by wire bonding, so that the soldering pad where the laser component 431 is located is flush with the height of the first soldering pad 406, thereby shortening the wire bonding length between the soldering pad where the laser component 431 is located and the first soldering pad 406.

[0170] In some embodiments, the launch housing 402 has an opening. For example, the launch housing 402 includes a first launch side panel 421, a second launch side panel 422, a third launch side panel 423, a fourth launch side panel 424, and a launch bottom panel 425. The first launch side panel 421, the second launch side panel 422, the third launch side panel 423, and the fourth launch side panel 424 are connected end to end, and the first launch side panel 421, the second launch side panel 422, the third launch side panel 423, and the fourth launch side panel 424 are all connected to the launch bottom panel 425 to form a launch cavity having an opening.

[0171] The first emitting side plate 421 has a third through hole 4211 .

[0172] The third launching side panel 423 includes a first sub-launching side panel 4231, a second sub-launching side panel 4232 and a third sub-launching side panel 4233. The first sub-launching side panel 4231 is connected to the launching base panel 425. The distances between the first sub-launching side panel 4231, the second sub-launching side panel 4232 and the third sub-launching side panel 4233 and the launching base panel 425 increase successively. The first sub-launching side panel 4231, the second sub-launching side panel 4232 and the third sub-launching side panel 4233 are connected successively so that the third launching side panel 423 is stepped.

[0173] A first solder pad 406 is provided on the surface of the first sub-emitting side panel 4231 facing the opening of the emission housing 402. A first socket is provided on the surface of the second sub-emitting side panel 4232 facing the laser assembly 431. The first socket passes through the second sub-emitting side panel 4232 to facilitate insertion of the first emission pin from the emission housing 402 into the emission housing 402. A second socket is provided on the surface of the third sub-emitting side panel 4233 facing the laser assembly 431. The second socket passes through the third sub-emitting side panel 4233 to facilitate insertion of the second emission pin from the emission housing 402 into the emission housing 402.

[0174] The first jack passes through the second sub-transmitting side panel 4232, and the second jack passes through the third sub-transmitting side panel 4233. The second sub-transmitting side panel 4232 and the third sub-transmitting side panel 4233 are stepped, so as to extend the distance between the first jack and the second jack in the length direction of the transmitting shell 402, reduce the distance between the first jack and the second jack in the height direction of the transmitting shell 402, and thereby reduce the signal crosstalk between the first transmitting pin inserted into the first jack and the second transmitting pin inserted into the second jack.

[0175] The fourth emitting side panel 424 includes a fourth sub-emitting side panel 4241 and a fifth sub-emitting side panel 4242. One side surface of the fourth sub-emitting side panel 4241 is connected to the emitting bottom panel 425, and the other side surface of the fourth sub-emitting side panel 4241 is connected to the fifth sub-emitting side panel 4242, so that the fourth emitting side panel 424 is stepped; one end of the fourth sub-emitting side panel 4241 is connected to the first emitting side panel 421, and the other end of the fourth sub-emitting side panel 4241 is connected to the first sub-emitting side panel 4231; one end of the fifth sub-emitting side panel 4242 is connected to the first emitting side panel 421, and the other end of the fifth sub-emitting side panel 4242 is connected to the second sub-emitting side panel 4232 and the third sub-emitting side panel 4233.

[0176] One end of the fourth sub-emitting side plate 4241 is connected to the first emitting side plate 421 , and the fourth sub-emitting side plate 4241 is connected to the first sub-emitting side plate 4231 to reduce the storage space of the emitting cavity and further limit the substrate 404 .

[0177] Figure 33 is an optical path diagram of a first optical component according to some embodiments. Figure 34 is another optical path diagram of a first optical component according to some embodiments. Figure 35 is a combined optical path diagram of a first optical component and a second optical component according to some embodiments. As shown in Figures 33, 34, and 35, laser assembly 431 includes a first laser assembly 4311, a second laser assembly 4312, and a third laser assembly 4313; second laser assembly 4312 is located between first laser assembly 4311 and third laser assembly 4313, and the light output directions of first laser assembly 4311, second laser assembly 4312, and third laser assembly 4313 are toward the combiner assembly.

[0178] In some embodiments, the first laser assembly 4311 emits a first wavelength optical signal, the second laser assembly 4312 emits a second wavelength optical signal, and the third laser assembly 4313 emits a third wavelength optical signal. The optical axes of the first, second, and third wavelength optical signals are parallel to the longitudinal extension direction of the emitting housing. For example, the wavelength of the first wavelength optical signal is in the range of 1340-1344 nm, such as 1342 nm; the wavelength of the second wavelength optical signal is in the range of 1480-1500 nm, such as 1490 nm; and the wavelength of the third wavelength optical signal is in the range of 1575-1580 nm, such as 1577 nm.

[0179] In some embodiments, the transmission rate of the first laser assembly 4311 is greater than the transmission rate of the third laser assembly 4313, and the transmission rate of the third laser assembly 4313 is greater than the transmission rate of the second laser assembly 4312. For example, the transmission rate of the first laser assembly 4311 is 50G, the transmission rate of the second laser assembly 4312 is 2.5G, and the transmission rate of the third laser assembly 4313 is 10G.

[0180] In some embodiments, the light-emitting end faces of the first laser assembly 4311, the second laser assembly 4312 and the third laser assembly 4313 are not flush, that is, the light-emitting end faces of the first laser assembly 4311, the second laser assembly 4312 and the third laser assembly 4313 are located on different length surfaces of the emitting shell.

[0181] In some embodiments, first laser assembly 4311, second laser assembly 4312, and third laser assembly 4313 utilize a chip-on-carrier (COC) package, which can also be referred to as chip-on-ceramic substrate (CPC). Therefore, the side profiles of first laser assembly 4311, second laser assembly 4312, and third laser assembly 4313 are relatively regular, such as rectangular.

[0182] In some embodiments, the lens assembly 432 includes a first lens 4321, a second lens 4322 and a third lens 4323. The first lens 4321 is arranged on the transmission optical path from the first laser assembly 4311 to the combining assembly, the second lens 4322 is arranged on the transmission optical path from the second laser assembly 4312 to the combining assembly, and the third lens 4323 is arranged on the transmission optical path from the third laser assembly 4313 to the combining assembly.

[0183] In some embodiments, the first lens 4321 , the second lens 4322 , and the third lens 4323 are disposed on the substrate 404 . Of course, the embodiments of the present disclosure are not limited to the first lens 4321 , the second lens 4322 , and the third lens 4323 being disposed on the substrate 404 .

[0184] In some embodiments, the combining component includes a wavelength division multiplexer, the input side of the wavelength division multiplexer faces the laser component, and the output side of the wavelength division multiplexer faces the third through hole 4211. The wavelength division multiplexer combines the optical signal of the first wavelength, the optical signal of the second wavelength, and the optical signal of the third wavelength emitted by the laser component 431 into one optical signal.

[0185] In some embodiments, the wavelength combining component includes a plurality of optical filters, which cooperate with each other to combine the optical signal of the first wavelength, the optical signal of the second wavelength, and the optical signal of the third wavelength into one optical signal.

[0186] In some embodiments, the combining assembly includes a polarization assembly 433 and a polarization combining assembly 434. Polarization assembly 433 is used to adjust the polarization direction of the optical signal, and polarization combining assembly 434 combines multiple polarized beams into a single beam. The polarization assembly adjusts the polarization direction of the optical signal, and then combines the multiple polarized beams into a single beam by the polarization combining assembly, thereby achieving wave combining in the optical emitting component.

[0187] As shown in FIG33 , in some embodiments, the polarization component 433 includes a first polarization component 4331, a second polarization component 4332, and a third polarization component 4333. The first polarization component 4331 is located in the light-emitting direction of the first laser assembly 4311 and is used to adjust the deflection direction of the first wavelength optical signal emitted by the first laser assembly 4311 so that the polarization direction of the first wavelength optical signal is horizontal, i.e., horizontally polarized light. The second polarization component 4332 is located in the light-emitting direction of the second laser assembly 4312 and is used to adjust the deflection direction of the second wavelength optical signal emitted by the second laser assembly 4312 so that the polarization direction of the second wavelength optical signal is vertical, i.e., second vertically polarized light. The third polarization component 4333 is located in the light-emitting direction of the third laser assembly 4313 and is used to adjust the deflection direction of the third wavelength optical signal emitted by the third laser assembly 4313 so that the polarization direction of the third wavelength optical signal is vertical, i.e., first vertically polarized light.

[0188] As shown in Figure 33, in some embodiments, the polarization combining component 434 includes a first polarization combining component 4341, a second polarization combining component 4342 and a third polarization combining component 4343. The first polarization combining component 4341 is located on the left side of the first polarization component 4331, and the first polarization combining component 4341 is located between the third through hole 4211 and the first polarization component 4331. The first polarization combining component 4341 is used to transmit the horizontal polarized light (horizontally polarized light) of the first wavelength optical signal, and is also used to reflect the vertical polarized light (second vertical polarized light) of the second wavelength optical signal and the vertical polarized light (first vertical polarized light) of the third wavelength optical signal, and then combine the three into one optical signal. The second polarization combiner 4342 is located to the left of the second polarization component 4332. The second polarization combiner 4342 is configured to reflect the vertically polarized light (second vertically polarized light) of the second wavelength optical signal to the first polarization combiner 4341, and to transmit the vertically polarized light (first vertically polarized light) of the third wavelength optical signal to the first polarization combiner 4341. The third polarization combiner 4343 is located to the left of the third polarization component 4333. The third polarization combiner 4343 is configured to reflect the vertically polarized light (first vertically polarized light) of the third wavelength optical signal to the second polarization combiner 4342.

[0189] In some embodiments, the first polarization combining element 4341 is a polarization beam splitter, which can transmit horizontally polarized light and reflect vertically polarized light to achieve beam combining. For example, the first vertically polarized light and the second vertically polarized light are reflected by the polarization beam splitter, while the horizontally polarized light is transmitted by the polarization beam splitter to achieve beam combining.

[0190] In some embodiments, the second polarization combiner 4342 is a filter that can reflect the second wavelength optical signal and transmit the third wavelength optical signal to achieve beam combining. The second polarization combiner 4342 is arranged at an angle relative to the central axis of the second polarization component 4332. For example, the angle between the second polarization combiner 4342 and the central axis of the second polarization component 4332 is 45°.

[0191] In some embodiments, the third polarization combiner 4343 is a reflector that reflects the third wavelength optical signal. The third polarization combiner 4343 is tilted relative to the central axis of the third polarization component 4333. For example, the angle between the third polarization combiner 4343 and the central axis of the third polarization component 4333 is 45°.

[0192] The polarization component 433 and the polarization combining component 434 shown in Figure 33 are placed in the transmitting shell 402. The third through hole 4211 of the transmitting shell 402 is coaxial with the third polarization combining component 4343. The opening of the transmitting shell 402 is facing downward in the opposite direction to the opening of the transceiver shell.

[0193] As shown in FIG34 , in some embodiments, a first polarization component 4331 is used to adjust the deflection direction of a first wavelength optical signal emitted by the first laser assembly 4311 so that the polarization direction of the first wavelength optical signal is vertical, i.e., first vertically polarized light. A second polarization component 4332 is used to adjust the deflection direction of a second wavelength optical signal emitted by the second laser assembly 4312 so that the polarization direction of the second wavelength optical signal is vertical, i.e., second vertically polarized light. A third polarization component 4333 is used to adjust the deflection direction of a third wavelength optical signal emitted by the third laser assembly 4313 so that the polarization direction of the third wavelength optical signal is horizontal, i.e., horizontally polarized light.

[0194] As shown in FIG34 , in some embodiments, a third polarization combiner 4343 is located between the third through-hole 4211 and the third polarization component 4333. The first polarization combiner 4341 is configured to reflect the vertically polarized light (first polarized light) of the first wavelength optical signal to the second polarization combiner 4342. The second polarization combiner 4342 is configured to reflect the vertically polarized light (second vertical polarized light) of the second wavelength optical signal to the third polarization combiner 4343, and further configured to transmit the vertically polarized light (first polarized light) of the first wavelength optical signal to the third polarization combiner 4343. The third polarization combiner 4343 is configured to transmit the horizontally polarized light (horizontally polarized light) of the third wavelength optical signal and reflect the vertically polarized light (first polarized light) of the first wavelength optical signal and the vertically polarized light (second vertical polarized light) of the second wavelength optical signal to achieve beam combining.

[0195] In some embodiments, the first polarization combiner 4341 is a reflector that reflects the first wavelength optical signal. The first polarization combiner 4341 is tilted relative to the central axis of the first polarization component 4331. For example, the angle between the first polarization combiner 4341 and the central axis of the first polarization component 4331 is 45°.

[0196] In some embodiments, the second polarization combiner 4342 is a filter that can reflect the second wavelength optical signal and transmit the first wavelength optical signal to achieve beam combining. The second polarization combiner 4342 is arranged at an angle relative to the central axis of the second polarization component 4332. For example, the angle between the second polarization combiner 4342 and the central axis of the second polarization component 4332 is 45°.

[0197] In some embodiments, the third polarization combiner 4343 is a polarization beam splitter that can transmit horizontally polarized light and reflect vertically polarized light to achieve beam combining. For example, the first vertically polarized light and the second vertically polarized light are reflected by the polarization beam splitter, while the horizontally polarized light is transmitted by the polarization beam splitter to achieve beam combining.

[0198] The polarization component 433 and the polarization combining component 434 shown in Figure 34 are placed in the transmitting shell 402. The third through hole 4211 of the transmitting shell 402 is coaxial with the third polarization combining component 4343. The opening direction of the transmitting shell 402 is the same as the downward direction of the opening of the transceiver shell.

[0199] As shown in FIG33 , the first wavelength optical signal emitted by the first laser assembly 4311 is transmitted to the first lens 4321, collimated by the first lens 4321, and transmitted to the first polarization component 4331. The polarization direction of the first wavelength optical signal is adjusted by the first polarization component 4331 before being transmitted to the first polarization combiner 4341. The second wavelength optical signal emitted by the second laser assembly 4312 is transmitted to the second lens 4322, collimated by the second lens 4322, and transmitted to the second polarization component 4332. The polarization direction of the second wavelength optical signal is adjusted by the second polarization component 4332 before being transmitted to the second polarization combiner 4342. The third wavelength optical signal emitted by the third laser assembly 4313 is transmitted to the third lens 4323, collimated by the third lens 4323, and transmitted to the third polarization component 4333. The polarization direction of the third wavelength optical signal is adjusted by the third polarization component 4333 before being transmitted to the third polarization combiner 4343. The third polarization combiner 4343 reflects the vertically polarized light of the third wavelength optical signal to the second polarization combiner 4342. The second polarization combiner 4342 reflects the vertically polarized light of the second wavelength optical signal to the first polarization combiner 4341 and transmits the vertically polarized light of the third wavelength optical signal to the first polarization combiner 4341. The first polarization combiner 4341 transmits the horizontally polarized light of the first wavelength optical signal and reflects the vertically polarized light of the second wavelength optical signal and the third wavelength optical signal, so that the horizontally polarized light of the first wavelength optical signal, the vertically polarized light of the second wavelength optical signal, and the vertically polarized light of the third wavelength optical signal are combined into one optical signal.

[0200] As shown in FIG35 , after the horizontally polarized light of the first wavelength optical signal, the vertically polarized light of the second wavelength optical signal, and the third wavelength optical signal are combined into a beam of optical signals, the optical signal is first adjusted in the Y direction by the fourth displacement prism 567 and then incident on the first filter 563. Then, the optical signal is incident on the first displacement prism 561 through the first filter 563. Then, the optical signal is adjusted in the Y direction by the first displacement prism 561 and incident on the first lens 516, and finally converged by the first lens 516.

[0201] Figure 36 is a schematic diagram illustrating the optical axis of a wave plate, the polarization direction of an incident light signal, and the polarization direction of an outgoing light signal according to some embodiments. As shown in Figure 36, a is the polarization direction of the incident light signal, b is the optical axis of the first wave plate, and c is the polarization direction of the outgoing light signal. Figure A illustrates the polarization direction of an outgoing light signal obtained after the wave plate passes through an incident light signal with a polarization direction of 45°, which is horizontal. Figure B illustrates the polarization direction of an outgoing light signal obtained after the wave plate passes through an incident light signal with a polarization direction of 135°, which is horizontal. Figure C illustrates the polarization direction of an outgoing light signal obtained after the wave plate passes through an incident light signal with a polarization direction of 45°, which is vertical. Figure C illustrates the polarization direction of an outgoing light signal obtained after the wave plate passes through an incident light signal with a polarization direction of 135°, which is vertical.

[0202] As shown in FIG36 , in some embodiments, the wave plate is a half-wave plate, and incident linearly polarized light passes through the half-wave plate as linearly polarized light. A characteristic of a half-wave plate is that the polarization directions of the incident light and the outgoing light are symmetrical with respect to the optical axis of the half-wave plate.

[0203] The following only uses the polarization component 433 and the polarization combining component 434 shown in Figure 33 as an example to introduce the beam combining principle of the optical emitting component. Since the optical signal after the polarization combining component combines includes a vertical polarization state and a horizontal polarization state, if a structural component for reverse isolation is provided after the polarization combining component, then at least two isolators need to be provided after the polarization combining component to achieve reverse isolation. Therefore, an isolator can be provided before the polarization combining component. Since the isolator includes a first polarizer, a Faraday plate, and a second polarizer, an isolator is provided before the polarization combining component, and the optical signal emits non-horizontally polarized light and non-vertically polarized light after passing through the isolator. In order to make the optical signal emit horizontally polarized light or vertically polarized light after passing through the polarization component, it is necessary to add a wave plate after the second polarizer. Non-horizontally polarized light emits horizontally polarized light after passing through the wave plate, and non-vertically polarized light emits horizontally polarized light or vertically polarized light after passing through the wave plate. The reverse isolation principle of the isolator is as follows: the Faraday plate rotates in the same direction, and the polarized light passing through the first polarizer cannot return to the first polarizer after the Faraday rotation, so that the isolator composed of the first polarizer, the Faraday plate and the second polarizer has a reverse isolation effect.

[0204] In some embodiments, the first polarization component 4331, the second polarization component 4332 and the third polarization component 4333 all include a first polarizer, a Faraday plate, a second polarizer and a wave plate. The first polarizer, the Faraday plate, the second polarizer and the wave plate are sequentially away from the first laser component. The first wavelength light signal emitted by the first laser component passes through the first polarizer, the Faraday plate, the second polarizer and the wave plate in sequence and is emitted. The angle between the optical axis of the wave plate and the horizontal plane is a preset angle, so that the light signal with the same polarization direction as the second polarizer is adjusted to horizontal polarized light or vertical polarized light after passing through the wave plate. For example, the angle between the optical axis of the wave plate of the first polarization component 4331 and the horizontal plane is a first preset angle, so that the light signal with the same polarization direction as the second polarizer is adjusted to horizontal polarized light after passing through the wave plate; the angle between the optical axis of the wave plate of the second polarization component 4332 and the horizontal plane is a second preset angle, so that the light signal with the same polarization direction as the second polarizer is adjusted to vertical polarized light after passing through the wave plate; the angle between the optical axis of the wave plate of the third polarization component 4333 and the horizontal plane is a third preset angle, so that the light signal with the same polarization direction as the second polarizer is adjusted to vertical polarized light after passing through the wave plate.

[0205] The first preset angle is different from the second preset angle.

[0206] The polarization direction of the second polarizer of the second polarization assembly is the same as the polarization direction of the second polarizer of the third polarization assembly, so that the second preset angle is the same as the third preset angle.

[0207] In some embodiments, the first polarizer is a horizontal polarizer, and the second polarizer is a 45° polarizer. For example, the first polarization component 4331 includes a horizontal polarizer, a Faraday plate, and a 45° polarizer, the second polarization component 4332 includes a horizontal polarizer, a Faraday plate, and a 45° polarizer, and the third polarization component 4333 includes a horizontal polarizer, a Faraday plate, and a 45° polarizer.

[0208] In some embodiments, the first polarizer is a vertical polarizer, and the second polarizer is a 135° polarizer. For example, the first polarization component 4331 includes a vertical polarizer, a Faraday plate, and a 135° polarizer, the second polarization component 4332 includes a vertical polarizer, a Faraday plate, and a 135° polarizer, and the third polarization component 4333 includes a vertical polarizer, a Faraday plate, and a 135° polarizer.

[0209] In some embodiments, a first polarizer, a Faraday plate, and a second polarizer are sequentially connected to form an isolator. A wave plate is located outside the isolator and is mounted on substrate 404. For example, a horizontal polarizer, a Faraday plate, and a 45° polarizer are sequentially connected to form an isolator; a vertical polarizer, a Faraday plate, and a 135° polarizer are sequentially connected to form an isolator. In some embodiments, the first polarizer, the Faraday plate, and the second polarizer are sequentially bonded using glue.

[0210] In some embodiments, a first polarizer, a Faraday plate, a second polarizer, and a wave plate are sequentially connected to form an isolator. This not only facilitates the mounting of the wave plate but also reduces the space required for the transmitter housing. For example, a horizontal polarizer, a Faraday plate, a 45° polarizer, and a wave plate are sequentially connected to form an isolator; a vertical polarizer, a Faraday plate, a 135° polarizer, and a wave plate are sequentially connected to form an isolator. In some embodiments, the first polarizer, Faraday plate, second polarizer, and wave plate are sequentially bonded using glue.

[0211] Since the structures of the first polarization component 4331, the second polarization component 4332 and the third polarization component 4333 are the same, only the optical axis angles of the wave plates are slightly different. Instead of introducing each polarization component in detail, only the first polarization component 4331 and the second polarization component 4332 are used as examples to introduce the polarization components.

[0212] Taking the first polarization assembly 4331 as an example, the first polarization assembly 4331 includes a horizontal polarizer, a Faraday plate, a 45° polarizer, and a first wave plate. The horizontal polarizer, Faraday plate, 45° polarizer, and first wave plate are sequentially positioned away from the first laser assembly 4311. After passing through the horizontal polarizer, Faraday plate, and 45° polarizer, the optical signal emits 45° polarized light. As shown in A of FIG36 , 45° polarized light (i.e., an incident light signal with a 45° polarization direction) is polarized by the first wave plate to obtain horizontal polarized light (i.e., an outgoing light signal with a horizontal polarization direction). The optical axis of the first wave plate is obtained by rotating the polarization direction of the incident light signal clockwise by 22.5°. That is, the angle between the optical axis of the first wave plate and the horizontal plane is a first preset angle, and the first preset angle is 22.5°.

[0213] In some embodiments, the horizontal polarizer, the Faraday plate, and the 45° polarizer are sequentially connected to form a fourth isolator, and the first wave plate is located outside the fourth isolator.

[0214] In some embodiments, a horizontal polarizer, a Faraday plate, a 45° polarizer, and a first wave plate are sequentially connected to form a first isolator.

[0215] In some embodiments, the first polarization assembly 4331 includes a vertical polarizer, a Faraday plate, a 135° polarizer, and a first wave plate. The vertical polarizer, Faraday plate, 135° polarizer, and first wave plate are sequentially positioned away from the first laser assembly 4311. After the optical signal passes through the vertical polarizer, Faraday plate, and 135° polarizer, it emits 135° polarized light. As shown in FIG36B , the 135° polarized light (i.e., the incident light signal with a 135° polarization direction) is polarized by the first wave plate to produce horizontally polarized light (i.e., the outgoing light signal with a horizontal polarization direction). The optical axis of the first wave plate is obtained by rotating the polarization direction of the incident light signal counterclockwise by 22.5°. That is, the angle between the optical axis of the first wave plate and the horizontal plane is a first predetermined angle, which is 157.5°.

[0216] In some embodiments, the vertical polarizer, the Faraday plate, and the 135° polarizer are sequentially connected to form a fourth isolator, and the first wave plate is located outside the fourth isolator.

[0217] In some embodiments, a vertical polarizer, a Faraday plate, a 135° polarizer, and a first wave plate are sequentially connected to form a first isolator.

[0218] The above configuration does not consider adjusting the magnetic poles of the first or fourth isolators. If the magnetic poles of the fourth isolator are adjusted, the fourth isolator includes a vertical polarizer, a Faraday plate, and a 45° polarizer. If the magnetic poles of the first isolator are adjusted, the first isolator includes a vertical polarizer, a Faraday plate, a 45° polarizer, and a first wave plate. The first wave plate's optical axis forms an angle of 22.5° with the horizontal plane.

[0219] Taking the second polarization assembly 4332 as an example, the second polarization assembly 4332 includes a horizontal polarizer, a Faraday plate, a 45° polarizer, and a second wave plate. The horizontal polarizer, Faraday plate, 45° polarizer, and second wave plate are sequentially spaced away from the second laser assembly 4312. After passing through the horizontal polarizer, Faraday plate, and 45° polarizer, the optical signal emits 45° polarized light. As shown in C of FIG36 , the 45° polarized light (i.e., the incident light signal with a 45° polarization direction) is polarized by the second wave plate to obtain vertically polarized light (i.e., the outgoing light signal with a vertical polarization direction). The optical axis of the second wave plate is obtained by rotating the polarization direction of the incident light signal counterclockwise by 22.5°. That is, the angle between the optical axis of the second wave plate and the horizontal plane is a second preset angle of 67.5°.

[0220] In some embodiments, the horizontal polarizer, the Faraday plate, and the 45° polarizer are sequentially connected to form a fifth isolator, and the second wave plate is located outside the fifth isolator.

[0221] In some embodiments, a horizontal polarizer, a Faraday plate, a 45° polarizer, and a second wave plate are sequentially connected to form a second isolator.

[0222] In some embodiments, the second polarization assembly 4332 includes a vertical polarizer, a Faraday plate, a 135° polarizer, and a second wave plate. The vertical polarizer, Faraday plate, 135° polarizer, and second wave plate are sequentially positioned away from the second laser assembly 4312. After the optical signal passes through the vertical polarizer, Faraday plate, and 135° polarizer, it emits 135° polarized light. As shown in D of FIG36 , the 135° polarized light (i.e., the incident light signal with a 135° polarization direction) is polarized by the second wave plate to obtain vertically polarized light (i.e., the outgoing light signal with a vertical polarization direction). The optical axis of the second wave plate is obtained by rotating the polarization direction of the incident light signal clockwise by 22.5°. That is, the angle between the optical axis of the second wave plate and the horizontal plane is a second predetermined angle, which is 112.5°.

[0223] In some embodiments, the vertical polarizer, the Faraday plate, and the 135° polarizer are sequentially connected to form a fifth isolator, and the second wave plate is located outside the fifth isolator.

[0224] In some embodiments, a vertical polarizer, a Faraday plate, a 135° polarizer, and a second wave plate are sequentially connected to form a second isolator.

[0225] The above configuration does not consider adjusting the magnetic poles of the second or fifth isolators. If the magnetic poles of the fifth isolator are adjusted, the fifth isolator will include a vertical polarizer, a Faraday plate, and a 45° polarizer. If the magnetic poles of the second isolator are adjusted, the second isolator will include a vertical polarizer, a Faraday plate, a 45° polarizer, and a second wave plate. The angle between the optical axis of the second wave plate and the horizontal plane is 67.5°.

[0226] The third polarization component 4333 may include a sixth isolator and a third wave plate, or may include a third isolator, wherein the third isolator includes a third wave plate, and the third wave plate is positioned at a third predetermined angle with the horizontal plane. Both the third polarization component 4333 and the second polarization component 4332 function to adjust the deflection direction of the optical signal so that the polarization direction of the optical signal is vertical. Therefore, the sixth isolator is identical to the fifth isolator, and the third isolator is identical to the second isolator, and their details are not further described here.

[0227] The sixth isolator is the same as the fifth isolator, which means that the sixth isolator can be any embodiment of the fifth isolator; the third isolator is the same as the second isolator, which means that the third isolator can be any embodiment of the second isolator.

[0228] FIG37 is an exploded view of a supporting member, a second polarization combining member, and a third polarization combining member provided according to some embodiments. As shown in FIG37 , a supporting member 407 is further provided on the substrate 404. One side of the supporting member 407 supports the third polarization combiner 4343, and the other side of the supporting member 407 supports the second polarization combiner 4342. The third polarization combiner 4343 is arranged parallel to the second polarization combiner 4342. The supporting member 407 is provided with a first through hole, one end of which is connected to the third polarization combiner 4343, and the other end of the first through hole is directed toward the third polarization component 4333, so that the vertically polarized light of the third wavelength optical signal emitted by the third polarization component 4333 is incident on the third polarization combiner 4343 through the first through hole. The supporting member 407 is also provided with a second through hole, one end of which is connected to the second polarization combiner 4342, and the other end of the second through hole is connected to the third polarization combiner 4343, so that the third wavelength optical signal reflected by the third polarization combiner 4343 is reflected to the second polarization combiner 4342 through the second through hole.

[0229] Figure 38 is a structural diagram of a supporting member provided according to some embodiments. Figure 39 is a structural diagram of a supporting member provided according to some embodiments from another perspective. Figure 40 is a cross-sectional view of a supporting member provided according to some embodiments. As shown in Figures 38, 39 and 40, in some embodiments, the side surface of the supporting member 407 includes a first limiting surface 471, a first supporting surface 472, a second limiting surface 473, a first connecting surface 474, a second connecting surface 475, a third limiting surface 476, a second supporting surface 477, a third connecting surface and a fourth connecting surface, and the first limiting surface 471, the first supporting surface 472, the second limiting surface 473, the first connecting surface 474, the second connecting surface 475, the third limiting surface 476, the second supporting surface 477, the third connecting surface and the fourth connecting surface are connected in sequence. The first supporting surface 472 supports the third polarization combining component 4343, and the first limiting surface 471, the first supporting surface 472 and the second limiting surface 473 are connected in sequence to form a recessed limiting groove to limit the third polarization combining component 4343; the first connecting surface 474 is in contact and connected with the fourth sub-emitting side plate 4241 of the fourth emitting side plate 424, and the second connecting surface 475 faces the third polarization component 4333; the second supporting surface 477 supports the second polarization combining component 4342, and the third limiting surface 476 is connected to the second supporting surface 477 to form a recessed limiting groove to limit the second polarization combining component 4342.

[0230] In some embodiments, the first supporting surface 472 and the second supporting surface 477 are arranged in parallel to ensure that the vertically polarized light of the third wavelength optical signal reflected by the third polarization combiner 4343 is reflected to the second polarization combiner 4342 as much as possible.

[0231] As shown in Figures 38, 39 and 40, one end of the first through hole 478 is located at the second connecting surface 475, the other end of the first through hole 478 is located at the first supporting surface 472, one end of the second through hole 479 is located at the first supporting surface 472, and the other end of the second through hole 479 is located at the second supporting surface 477. The first through hole 478 is connected to the second through hole 479, so that the third polarization combiner 4343 receives the vertical polarized light of the third wavelength optical signal through the first through hole 478, and reflects the vertical polarized light of the third wavelength optical signal to the second polarization combiner 4342 through the second through hole 479.

[0232] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present disclosure.

Claims

1. An optical module, comprising: Fiber optic adapter, one end of which is used to connect to an external optical fiber; An optical receiving component, comprising a first housing; wherein one end of the first housing is connected to the other end of the optical fiber adapter; one side of the first housing is connected to a first light receiving component, a second light receiving component and a third light receiving component, wherein the first light receiving component, the second light receiving component and the third light receiving component are configured to respectively receive a fourth wavelength optical signal, a fifth wavelength optical signal and a sixth wavelength optical signal input through the optical fiber adapter; A light emitting component, one end of which is connected to the other end of the optical containing component, wherein the light emitting component comprises a second cavity and a first laser component, a second laser component, a third laser component and a wave combining component arranged in the second cavity, the first laser component generates a first wavelength optical signal, the second laser component generates a second wavelength optical signal, and the third laser component generates a third wavelength optical signal; A plurality of rows of pins are arranged on the side wall of the second cavity, the pins in the bottom row include high-frequency pins, the ends of the high-frequency pins extend into the second cavity, and the first laser assembly, the second laser assembly and the third laser assembly are electrically connected to the corresponding high-frequency pins respectively; a light outlet is arranged at one end of the second cavity, the light outlet is optically connected to the optical accommodation component, the combining component is arranged on the side of the light outlet, and the combining component is configured to combine the first wavelength optical signal, the second wavelength optical signal and the third wavelength optical signal, and transmit them to the optical fiber adapter through the optical accommodation component.

2. The optical module according to claim 1, wherein: The wave combining component includes a second filter and a third filter; The second cavity includes two connected side walls, and the first laser assembly, the second laser assembly and the third laser assembly are distributed on the sides of the two connected side walls; Multiple rows of pins are respectively arranged on the two connected side walls, and the pins in the bottom row on the two connected side walls include the high-frequency pins; The second filter and the third filter are arranged side by side on the side of the light outlet, the first optical surface of the second filter faces the third laser assembly, the second optical surface of the second filter faces the third optical surface of the third filter, the third optical surface faces the second laser assembly, and the fourth optical surface of the third filter faces the first laser assembly.

3. The optical module according to claim 2, wherein: The second cavity comprises a second shell and a second upper cover, the second shell comprises a bottom plate, a first side wall, a second side wall, a third side wall and a fourth side wall, the first side wall, the second side wall, the third side wall and the fourth side wall are sequentially connected and the bottom is connected to the bottom plate, and the tops of the first side wall, the second side wall, the third side wall and the fourth side wall are supported and connected to the second upper cover; The first side wall is connected to the optical receiving component, the first laser assembly is arranged on the side of the third side wall, the second laser assembly and the third laser assembly are arranged on the side of the fourth side wall, and the third side wall and the fourth side wall are respectively provided with multiple rows of pins; The second filter and the third filter are arranged on the side where the first side wall is connected to the second side wall.

4. The optical module according to claim 3, wherein: A sixth connection hole is formed on the first side wall, and the second shell is connected to the first shell through the sixth connection hole. The sixth connection hole is configured to transmit the optical signal to the first shell.

5. The optical module according to claim 3, wherein: The second upper cover is close to the bottom of the optical module; the first upper cover is close to the top of the optical module; The first upper cover is close to the top of the optical module. The bottom of the first shell is provided with an inclined surface. One end of the inclined surface is connected to the bottom surface of the first shell, and the other end of the inclined surface is connected to the side surface of the first shell.

6. The optical module according to any one of claims 2 to 5, wherein: A first lens is disposed between the first laser assembly and the fourth optical surface, a second lens is disposed between the second laser assembly and the third optical surface, and a third lens is disposed between the third laser assembly and the first optical surface.

7. The optical module according to claim 3, wherein: A mounting bracket is also provided in the second cavity, and the mounting bracket is provided on the side of the sixth connecting hole. The second optical filter and the third optical filter are provided on the mounting bracket, and the second optical filter and the third optical filter are located on the central axis of the sixth connecting hole.

8. The optical module according to claim 7, wherein: The mounting bracket comprises a bracket body, a first support body and a second support body; one end of the first support body is connected to the side of the bracket body, and the other end of the first support body extends away from the bracket body; one end of the second support body is connected to the side of the bracket body, and the other end of the second support body extends away from the bracket body; A gap is set between the first support body and the second support body, one side of the first support body and one side of the second support body support and connect the second filter, the other side of the first support body and the other side of the second support body support and connect the third filter; the first wavelength optical signal and the third wavelength optical signal pass through the gap, and the gap is located on the central axis of the sixth connecting hole.

9. The optical module according to claim 8, wherein: A first supporting surface is provided on one side of the first supporting body, and a second supporting surface is provided on the other side of the first supporting body; a third supporting surface is provided on one side of the second supporting body, and a fourth supporting surface is provided on the other side of the second supporting body; a first limiting surface and a second limiting surface are provided on the side edge of the bracket body; The first supporting surface and the third supporting surface support and connect the second optical filter, the second supporting surface and the fourth supporting surface support and connect the third optical filter, the first limiting surface limit-connects the second optical filter, and the second limiting surface limit-connects the third optical filter.

10. The optical module according to claim 9, wherein: The side of the bracket body is formed with a first limiting surface and a second limiting surface, the first limiting surface is located on one side of the first supporting body, and the second limiting surface is located on the other side of the second supporting body, the first limiting surface is located at one end of the first supporting surface, and the second limiting surface is located at one end of the second supporting surface; the first limiting surface is limitatively connected to the second filter, and the second limiting surface is limitatively connected to the third filter.

11. The optical module according to claim 3, wherein: The other end of the first shell is formed with a notch and a fifth connecting hole is formed on the side wall of the other end of the first shell, one side of the first shell is connected to the first light receiving component, the second light receiving component and the third light receiving component, and one side of the first shell extends from the side edge of one end of the first shell to the side edge of the notch; One end of the second cavity is located in the missing corner and connected to the other end of the first shell, and one side of the first shell extends to one side of the second cavity.

12. The optical module according to claim 11, wherein: The optical receiving component further comprises a first upper cover, and the first upper cover is connected to cover the first shell; A first displacement prism, a fourth displacement prism and a first filter are arranged in the first housing, the first displacement prism is arranged at the light through port of the first housing, and the fourth displacement prism is located at the front end of the light outlet of the second cavity; A second baffle is formed in the first housing, one side of the second baffle supports and connects the first filter, the other side of the second baffle is provided with the fourth displacement prism, one end of the fourth displacement prism is located on the side of the fifth connecting hole, and the other end of the fourth displacement prism is located on the side of the first filter; The light emission signal input by the light emitting component to the first housing is transmitted to the optical fiber adapter through the fourth displacement prism, the first filter and the first displacement prism in sequence, and the first displacement prism, the fourth displacement prism and the first filter adjust the transmission direction of the emission light signal.

13. The optical module according to claim 12, wherein: The first housing has an accommodating cavity formed inside, and the accommodating cavity includes a first accommodating cavity, a second accommodating cavity and a third accommodating cavity; The second accommodating cavity extends along one side of the first shell, a first baffle is provided between the first accommodating cavity and the second accommodating cavity, a first through cavity is provided on the first baffle, and the first accommodating cavity is connected to the second accommodating cavity through the first through cavity; The third accommodating cavity is located on the side of the other end of the first shell, the second baffle is arranged between the first accommodating cavity and the third accommodating cavity, the second baffle is provided with a second through cavity, the first accommodating cavity is connected to the third accommodating cavity through the second through cavity, and the fourth displacement prism is arranged in the third accommodating cavity; the top support of the first baffle is connected to the first upper cover.

14. The optical module according to claim 13, wherein: An opening is arranged on the other side of the first shell, a sealing plate is arranged in the opening, and the sealing plate is sealed and connected to the opening; A mounting seat is provided on the side of the sealing plate, the first reflector is provided on the mounting seat, a wavelength division multiplexer is provided on the reflection light path of the first reflector, the light output end of the wavelength division multiplexer is located in the first through cavity, and the side of the wavelength division multiplexer contacts and is connected to the side of the second baffle.

15. The optical module according to claim 13, wherein: A fourth connecting hole is provided on a side wall at one end of the first shell, and the fourth connecting hole is connected to the first accommodating cavity; the first displacement prism is provided in the first accommodating cavity, one end of the first displacement prism is located on the side of the fourth connecting hole, and the other end of the first displacement prism is close to the other side of the first shell.

16. The optical module according to claim 15, wherein: The fourth connecting hole comprises a lens mounting hole, in which a first lens is arranged; A lens mounting seat is provided on the first lens, and the first lens is connected to the lens mounting hole through the lens mounting seat.

17. The optical module according to claim 15, wherein: A first connection hole, a second connection hole and a third connection hole are provided on the side of the first housing, the first connection hole is connected to the first light receiving component, the second connection hole is connected to the second light receiving component, and the third connection hole is connected to the third light receiving component; A first reflector, a wavelength division multiplexer, a second displacement prism and a third displacement prism are also arranged in the first housing. The optical receiving signal inputted through the optical fiber adapter is sequentially transmitted to the wavelength division multiplexer through the first displacement prism, the first filter and the first reflector; the fourth wavelength optical signal is transmitted to the second displacement prism through the wavelength division multiplexer, and is transmitted to the first light receiving component through the second displacement prism; The fifth wavelength optical signal is transmitted to the second optical receiving component through the wavelength division multiplexer; The sixth wavelength optical signal is transmitted to the third displacement prism through the wavelength division multiplexer, and is transmitted to the third light receiving component through the third displacement prism; Among them, the second displacement prism and the third displacement prism are arranged in the second accommodating cavity, one end of the second displacement prism is located at the side of the first connecting hole, and the other end of the second displacement prism is located at the light output end of the wavelength division multiplexer; one end of the third displacement prism is located at the light output end of the wavelength division multiplexer, and the other end of the third displacement prism is located at the side of the third connecting hole.

18. The optical module according to claim 11, wherein: A connecting seat is arranged in the notch, and an end of the connecting seat is connected to the second cavity; the fifth connecting hole is arranged on the connecting seat, and the fifth connecting hole is connected to the inner cavity of the first shell, and an isolator is arranged in the fifth connecting hole.

19. The optical module according to claim 3, wherein: The receiving rate of the photodetector in the second light receiving component is greater than the receiving rate of the photodetector in the first light receiving component, and the receiving rate of the photodetector in the second light receiving component is greater than the receiving rate of the photodetector in the third light receiving component.

20. The optical module according to claim 11, characterized in that: The transmission rate of the first laser assembly is greater than the transmission rate of the second laser assembly, and the transmission rate of the first laser assembly is greater than the transmission rate of the third laser assembly; The light emitting direction of the first laser assembly is parallel to the optical axis of the fifth connecting hole, and the light emitting direction of the second laser assembly and the light emitting direction of the second laser assembly are respectively perpendicular to the optical axis of the fifth connecting hole.

21. The optical module according to claim 3, wherein: A sixth connecting hole is provided at one end of the second cavity and is connected to the optical accommodating component, and the sixth connecting hole is in communication with the optical accommodating component; The optical axis of the first wavelength optical signal generated by the first laser assembly is parallel to the central axis of the sixth connecting hole; The second laser assembly is arranged on the side of the central axis of the sixth connecting hole; the optical axis of the second wavelength optical signal generated by the second laser assembly is not parallel to the central axis of the sixth connecting hole; The third laser assembly and the second laser assembly are located on the same side of the central axis of the sixth connecting hole; the optical axis of the third wavelength optical signal generated by the third laser assembly is not parallel to the central axis of the sixth connecting hole; The second filter is located at the intersection of the optical path of the first laser assembly and the optical path of the third laser assembly; The third filter is located at the junction of the optical path of the first laser assembly and the optical path of the second laser assembly.

22. The optical module according to claim 3, wherein: The light emitting component includes a TEC disposed in the second housing; the first side wall is connected to the other end of the first housing, a sixth connection hole is formed on the first side wall, the second housing is connected to the first housing through the sixth connection hole, and the sixth connection hole is configured to transmit an optical signal to the first housing; The TEC is arranged on the bottom plate, and the TEC supports and connects the first laser component, the second laser component and the third laser component; the TEC includes a first TEC pad and a second TEC pad, and the first TEC pad and the second TEC pad are located on the side of the second side wall; The multiple rows of pins on the third side wall include a first TEC pin and a second TEC pin, the first TEC pin is electrically connected to the first TEC pad, and the second TEC pin is electrically connected to the second TEC pad.

23. The optical module according to claim 22, wherein: A support plate and a fourth adapter plate are also disposed in the second housing; the support plate is disposed on the top of the TEC, and the support plate supports and connects the first laser assembly, the second laser assembly and the third laser assembly; the fourth adapter plate is disposed on a side of the first laser assembly close to the sixth connection hole; The fourth adapter board includes a fourth substrate, the bottom of the fourth substrate is connected to the support plate, one end of the fourth substrate is close to the mounting bracket, the other end of the fourth substrate is close to the first laser component, and a first metal layer and a second metal layer are arranged on the top surface of the fourth substrate, the first metal layer and the second metal layer extend from one end of the fourth substrate to the other end of the fourth substrate; the first metal layer is respectively connected by wires to the first TEC pad and the first TEC pin, and the second metal layer is respectively connected by wires to the second TEC pad and the second TEC pin.

24. The optical module according to claim 23, characterized in that: The inner side of the third side wall is formed with a first side surface and a second side surface, and a second step surface is formed between the first side surface and the second side surface; a row of pins is arranged on the first side surface, and the row of pins on the first side surface includes high-frequency pins; A row of pins is disposed on the second side surface, and the row of pins on the second side surface includes a first TEC pin and a second TEC pin.

25. The optical module according to claim 24, wherein: The light emitting component includes a first adapter plate and a second adapter plate arranged in the second housing; the first adapter plate and the second adapter plate are arranged on the side of the third side wall, the first laser assembly is located on the side of the first adapter plate, the second laser assembly is located on the side of the second adapter plate, and the third laser assembly is located on the side of the second laser assembly; A first high-frequency transmission line is arranged on the first adapter board, and a second high-frequency transmission line is arranged on the second adapter board; the first laser component and the first high-frequency pin are electrically connected to the first high-frequency transmission line respectively, and the second laser component and the second high-frequency pin are electrically connected to the second high-frequency transmission line respectively.

26. The optical module according to claim 25, wherein: A first step surface is formed on the inner side of the third side wall, one end of the step surface is close to the backlight side of the first laser assembly, and the other end of the step surface is connected to the first side surface; The first step surface supports the first adapter plate and the second adapter plate.

27. The optical module according to claim 26, wherein: A first high-frequency transmission line, a first ground layer, and a second ground layer are arranged on the front side of the first adapter board, the first ground layer is located on one side of the first high-frequency transmission line, and the second ground layer is located on the other side of the first high-frequency transmission line; a ground layer is arranged on the back side of the first adapter board, and the ground layer is respectively connected to the first ground layer and the second ground layer through vias; The first laser component includes a first high-frequency pad, and the first high-frequency transmission line is respectively connected to the first high-frequency pin and the first high-frequency pad.

28. The optical module according to claim 27, wherein: A third adapter plate is also disposed on the top of the TEC, and the third adapter plate is located between the second adapter plate and the second laser assembly; A second high-frequency transmission line, a third ground layer and a fourth ground layer are arranged on the front side of the second adapter board, the third ground layer is located on one side of the second high-frequency transmission line, and the fourth ground layer is located on the other side of the second high-frequency transmission line; a ground layer is arranged on the back side of the second adapter board, and the ground layer is respectively connected to the third ground layer and the fourth ground layer through vias; A third high-frequency transmission line, a fifth ground layer and a sixth ground layer are arranged on the front side of the third adapter plate, the fifth ground layer is located on one side of the third high-frequency transmission line, and the sixth ground layer is located on the other side of the third high-frequency transmission line; The multiple rows of pins on the third side wall include a second high-frequency pin, and the second laser component includes a second high-frequency pad and a ground layer. The second high-frequency pad, the third high-frequency transmission line, the second high-frequency transmission line and the second high-frequency pin are electrically connected in sequence; the ground layer bonding wire connects the fifth ground layer and the sixth ground layer, the fifth ground layer bonding wire connects the third ground layer, and the sixth ground layer bonding wire connects the fourth ground layer.

29. The optical module according to claim 3, wherein: The first laser assembly includes a first substrate and a first laser chip, and the first laser chip is mounted on the first substrate; a first high-frequency pad, a first LD pad, and a first SOA pad are also provided on the first substrate; the first high-frequency pad, the first LD pad, and the first SOA pad are respectively connected to the first laser chip by wire bonding, and the first high-frequency pad is also connected to the first high-frequency transmission line by wire bonding; A first LD pin and a first SOA pin are also disposed on the third side wall. The first LD pin is electrically connected to the first LD pad, and the first SOA pin is electrically connected to the first SOA pad.

30. The optical module according to claim 3, wherein: The second laser assembly includes a second substrate and a second laser chip, and the second laser chip is mounted on the second substrate; a second high-frequency pad, a second LD pad, and a second SOA pad are provided on the second substrate; the second high-frequency pad, the second LD pad, and the second SOA pad are respectively connected to the second laser chip by wire bonding, and the second high-frequency pad is also connected to the third high-frequency transmission line by wire bonding; The fourth side wall is provided with a second SOA pin and a second LD pin, the second LD pin is wired to the second LD pad, and the second SOA pin is wired to the second SOA pad.

31. The optical module according to claim 3, wherein: The third laser assembly includes a third substrate and a third laser chip, the third substrate is provided with a negative electrode pad and a positive electrode pad, and the third laser chip is mounted on the negative electrode pad; The fourth side wall is also provided with a third LD pin and a fourth LD pin. The third LD pin is connected to the positive electrode pad by wire bonding, and the fourth LD pin is connected to the negative electrode pad by wire bonding.

32. The optical module according to claim 1, wherein: The wave combining component comprises: A polarization component is configured to adjust the polarization direction of an optical signal; the polarization component comprises a first polarization component, a second polarization component and a third polarization component, wherein the first polarization component, the second polarization component and the third polarization component each comprise a first polarizer, a Faraday plate, a second polarizer and a wave plate, wherein the first polarizer, the Faraday plate, the second polarizer and the wave plate are sequentially away from the laser component, and a first wavelength optical signal sequentially passes through the first polarizer, the Faraday plate, the second polarizer and the wave plate of the first polarization component to emit horizontally polarized light, a third wavelength optical signal sequentially passes through the first polarizer, the Faraday plate, the second polarizer and the wave plate of the third polarization component to emit a first vertically polarized light, and a second wavelength optical signal sequentially passes through the first polarizer, the Faraday plate, the second polarizer and the wave plate of the second polarization component to emit a second vertically polarized light; A polarization combining component is configured to combine multiple polarized light beams into one beam; the polarization combining component includes a first polarization combining component, a second polarization combining component and a third polarization combining component, the third polarization combining component is configured to reflect the first vertical polarized light to the second polarization combining component, the second polarization combining component is configured to transmit the first vertical polarized light to the first polarization combining component, and also reflect the second vertical polarized light to the first polarization combining component, the first polarization combining component is configured to reflect the second vertical polarized light and the first vertical polarized light, and also transmit the horizontal polarized light to achieve beam combining.

33. The optical module according to claim 32, wherein: The first polarizer, the Faraday plate, the second polarizer and the wave plate are sequentially connected to form an isolator; The angle between the optical axis of the wave plate of the first polarization component and the horizontal plane is a first preset angle, so that the first polarization component emits horizontal polarized light; the angle between the optical axis of the wave plate of the second polarization component and the horizontal plane is a second preset angle, so that the second polarization component emits vertical polarized light; the angle between the optical axis of the wave plate of the third polarization component and the horizontal plane is a third preset angle, so that the third polarization component emits vertical polarized light; The first preset angle is different from the second preset angle; The polarization direction of the second polarizer of the second polarization component is the same as the polarization direction of the second polarizer of the third polarization component, so that the second preset angle is the same as the third preset angle.

34. The optical module according to claim 32, wherein: The first polarizer, the Faraday plate and the second polarizer are sequentially connected to form an isolator, and the wave plate is located outside the isolator; The angle between the optical axis of the wave plate of the first polarization component and the horizontal plane is a first preset angle, so that the first polarization component emits horizontal polarized light; the angle between the optical axis of the wave plate of the second polarization component and the horizontal plane is a second preset angle, so that the second polarization component emits vertical polarized light; the angle between the optical axis of the wave plate of the third polarization component and the horizontal plane is a third preset angle, so that the third polarization component emits vertical polarized light; The first preset angle is different from the second preset angle; The polarization direction of the second polarizer of the second polarization component is the same as the polarization direction of the second polarizer of the third polarization component, so that the second preset angle is the same as the third preset angle.

35. The optical module according to claim 32, wherein: The first polarizer is a horizontal polarizer, and the second polarizer is a 45° polarizer; the first polarizer is a vertical polarizer, and the second polarizer is a 135° polarizer.

36. The optical module according to claim 32, wherein: The light emitting component further comprises a supporting member, the supporting member comprises a first supporting surface and a second supporting surface, the first supporting surface is configured to support the third polarization wave combining component, the second supporting surface is configured to support the second polarization wave combining component, and the first supporting surface is arranged in parallel with the second supporting surface; The supporting member has a first through hole and a second through hole, one end of the first through hole and one end of the second through hole are both located on the first supporting surface, the other end of the first through hole is located on a side of the supporting member facing the third polarization combining element, the other end of the second through hole is located on the second supporting surface, and the first through hole and the second through hole are connected.

37. The optical module according to claim 36, wherein: The optical emitting component further comprises an emitting housing, a third through hole is provided at the first end of the emitting device, and the central axis of the third through hole coincides with the central axis of the first polarization combiner, so that the optical signal combined by the first polarization combiner is emitted through the first through hole; The second end of the transmitting shell is provided with a transmitting pin, one end of which is connected to the circuit board, and the other end of which extends into the transmitting shell. The laser assembly in the transmitting shell is connected with the laser assembly in the transmitting shell by wire bonding.

38. The optical module according to claim 37, wherein: The launching shell includes a first launching side plate, a second launching side plate, a third launching side plate and a fourth launching side plate, the first launching side plate, the second launching side plate, the third launching side plate and the fourth launching side plate are connected end to end, the first launching side plate is provided with a third through hole, the third launching side plate includes a first sub-launching side plate, a second sub-launching side plate and a third sub-reflection plate, the first sub-launching side plate, the second sub-launching side plate and the third sub-reflection plate are stepped, the fourth launching side plate includes a fourth sub-launching side plate and a fifth sub-launching side plate, the fourth sub-launching side plate and the fifth sub-launching side plate are stepped, the first sub-launching side plate is connected to the fourth sub-launching side plate to limit the substrate, wherein the substrate supports the laser assembly.

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