Optical module

Abstract

An optical module (200), comprising a circuit board (300); an optical transceiver component (900) fixed on the circuit board (300); the light receiving and transmitting component (900) comprises a lens assembly (901a), an optical fiber support (902a), a positioning column (903) and a light emitting chip (310), the optical fiber support (902a) is provided with a first positioning hole (921), one side, facing the optical fiber support (902a), of the lens assembly (901a) is provided with a second lens (9142) and a second positioning hole (9143), the second positioning hole (9143) is located on one side of the second lens (9142), the positioning column (903) is fixed in the second positioning hole (9143) and the first positioning hole (921), and the light emitting chip (310) is arranged on the optical fiber support (902a). The second lens (9142) is plated with an antireflection film, and the surface where the second lens (9142) is located is flush with or protrudes out of the surface, facing the optical fiber support (902a), of the lens assembly (901a). The light emitting chip (310) is electrically connected with the circuit board (300) and is configured to generate a light signal; and heating devices (350a, 350b) disposed at a side edge of the light emitting chip (310) or below the light emitting chip (310) and configured to generate heat. The second positioning hole (9143) is located in one side of the second lens (9142), and the surface where the second lens (9142) is located is not recessed inwards relative to the surface, facing the optical fiber support (902a), of the lens assembly (901a), so that the thickness of an antireflection film of the second lens (9142) is uniform.

Description

optical modules

[0001] This application claims the priority of application number 202311348327.3 filed with the China Patent Office on October 17, 2023; the priority of application number 202323508115.5 filed with the China Patent Office on December 21, 2023; and the priority of application number 202323468090.0 filed with the China Patent Office on December 19, 2023; all of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Art

[0003] With the development of new services and applications such as cloud computing, mobile internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for converting optical and electrical signals. They are key components in optical communication equipment and are at the core of optical communication.

[0004] Summary of the Invention

[0005] An embodiment of the present disclosure provides an optical module, including:

[0006] circuit boards;

[0007] An optical transceiver component is fixed to the circuit board; wherein the optical transceiver component includes a lens assembly, an optical fiber holder, a positioning post, and an optical transmitter chip, the optical fiber holder having a first positioning hole, a second lens and a second positioning hole being provided on a side of the lens assembly facing the optical fiber holder, the second positioning hole being located on one side of the second lens, the positioning post being fixed to the second positioning hole and the first positioning hole, the second lens being coated with an antireflection coating, and the surface on which the second lens is located being flush with or protruding from the side of the lens assembly facing the optical fiber holder; the optical transmitter chip is electrically connected to the circuit board and is configured to generate an optical signal;

[0008] The heating device is disposed at a side of the light emitting chip or below the light emitting chip and is configured to generate heat to maintain an operating temperature of the light emitting chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0010] FIG1 is a partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0011] FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0012] FIG3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0013] FIG4 is an exploded view of an optical module according to some embodiments of the present disclosure;

[0014] FIG5 is an exploded view of an optical transceiver component and a circuit board according to some embodiments of the present disclosure;

[0015] FIG6 is a cross-sectional view of an optical transceiver component and a circuit board according to some embodiments of the present disclosure;

[0016] FIG7 is a structural diagram of an optical transceiver component provided according to some embodiments of the present disclosure;

[0017] FIG8 is an exploded view of an optical transceiver component according to some embodiments of the present disclosure;

[0018] FIG9 is a cross-sectional view of an optical transceiver component according to some embodiments of the present disclosure;

[0019] FIG10 is a structural diagram of a conventional lens assembly according to some embodiments of the present disclosure;

[0020] FIG11 is a structural diagram of an optical fiber support provided according to some embodiments of the present disclosure;

[0021] FIG12 is a structural diagram of a first lens assembly provided at a first viewing angle according to some embodiments of the present disclosure;

[0022] FIG13 is a structural diagram of a first lens assembly provided at a second viewing angle according to some embodiments of the present disclosure;

[0023] FIG14 is a cross-sectional view of a first lens assembly and an optical fiber holder according to some embodiments of the present disclosure;

[0024] FIG15 is a structural diagram of a second lens assembly provided according to some embodiments of the present disclosure;

[0025] FIG16 is a structural diagram of another optical fiber support provided according to some embodiments of the present disclosure;

[0026] FIG17 is a structural diagram of a third lens assembly provided according to some embodiments of the present disclosure;

[0027] FIG18 is a cross-sectional view of a third lens assembly and another optical fiber holder according to some embodiments of the present disclosure;

[0028] FIG19 is a partial enlarged view of point A in FIG5 ;

[0029] FIG20 is a partial enlarged view of an optical transceiver component in another optical module according to some embodiments of the present disclosure;

[0030] FIG21 is a schematic structural diagram of a first heater according to some embodiments of the present disclosure;

[0031] FIG22 is a diagram illustrating a first support block in use according to some embodiments of the present disclosure;

[0032] FIG23 is a schematic structural diagram of a circuit board provided according to some embodiments of the present disclosure;

[0033] FIG24 is a partial enlarged view of point C in FIG23;

[0034] FIG25 is an internal cross-sectional view of an optical module according to some embodiments of the present disclosure;

[0035] FIG26 is a partial enlarged view of point D in FIG25;

[0036] FIG27 is a partial enlarged view of point E in FIG25 ;

[0037] FIG28 is a structural diagram of an upper housing according to some embodiments of the present disclosure;

[0038] FIG29 is a structural diagram of a lower housing according to some embodiments of the present disclosure;

[0039] FIG30 is a cross-sectional view of an upper housing, a circuit board, and a lower housing according to some embodiments of the present disclosure;

[0040] FIG31 is a structural diagram of an upper surface layer of a circuit board according to some embodiments of the present disclosure;

[0041] FIG32 is a schematic diagram of an upper surface layer shielding electromagnetic waves according to some embodiments of the present disclosure;

[0042] FIG33 is a reflection principle diagram of a seventh shielding member provided according to some embodiments of the present disclosure;

[0043] FIG34 is a structural diagram of a first lower surface layer of a circuit board provided according to some embodiments of the present disclosure;

[0044] FIG35 is a structural diagram of a second lower surface layer of a circuit board provided according to some embodiments of the present disclosure;

[0045] Figure 36 is a structural diagram of the third lower surface layer of the circuit board provided according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0046] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0047] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0048] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0049] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components are in direct physical or electrical contact with each other. For another example, when describing some embodiments, the term "coupled" may be used to indicate that two or more components are in direct physical or electrical contact. However, the term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0050] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0051] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0052] The use of "adapted to" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0053] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0054] In optical communication technology, to establish information transmission between information processing devices, it is necessary to load the information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When transmitting optical signals within information transmission equipment, they can reduce optical power loss, thereby enabling high-speed, long-distance, and low-cost information transmission. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment typically includes optical fibers and optical waveguides.

[0055] Optical modules can convert optical signals into electrical signals between information processing devices and information transmission devices. For example, at least one of the optical signal input or output ends of an optical module is connected to an optical fiber, and at least one of the electrical signal input or output ends of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber. Because multiple information processing devices can transmit information via electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is referred to as the optical module's host computer. Furthermore, the optical signal input or output end of the optical module can be referred to as an optical port, and the electrical signal input or output end of the optical module can be referred to as an electrical port.

[0056] Figure 1 is a partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure. As shown in Figure 1, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0057] One end of optical fiber 101 extends toward remote information processing device 1000, and the other end of optical fiber 101 is connected to optical module 200 through the optical port of optical module 200. Optical signals can be totally reflected in optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal undergoes multiple total reflections in optical fiber 101 to transmit the optical signal from remote information processing device 1000 to optical module 200, and vice versa, thereby achieving long-distance, low-power information transmission.

[0058] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 may be detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0059] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0060] The host computer 100 also includes an external electrical interface that can access an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to access a network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing device 2000 and the host computer 100 via the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is then transmitted to the remote information processing device 1000 via the optical fiber 101. For example, a first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that optical modules are tools for converting optical signals into electrical signals. During this conversion process, the information does not change, but the encoding and decoding methods of the information can change.

[0061] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0062] FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, FIG2 only shows the structure of the host computer 100 related to the optical module 200. As shown in FIG2, the host computer 100 also includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as fins that increase the heat dissipation area.

[0063] The optical module 200 is inserted into the cage 106 of the host computer 100. The cage 106 secures the optical module 200. Heat generated by the optical module 200 is transferred to the cage 106 and then dissipated through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 connects with the electrical connector inside the cage 106, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, thereby establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0064] Figure 3 is a structural diagram of an optical module according to some embodiments of the present disclosure, and Figure 4 is an exploded view of an optical module according to some embodiments of the present disclosure. As shown in Figures 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed within the housing, and an optical transceiver component 900.

[0065] The housing includes an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square.

[0066] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicular to the base plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0067] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to achieve the upper shell 201 covering the lower shell 202.

[0068] The direction of the line connecting the two openings 204 and 205 can be consistent with the length of the optical module 200, or it can be inconsistent with the length of the optical module 200. For example, opening 204 is located at the end of the optical module 200 (the right end in Figure 3), and opening 205 is also located at the end of the optical module 200 (the left end in Figure 3). Alternatively, opening 204 is located at the end of the optical module 200, while opening 205 is located on the side of the optical module 200. Opening 204 is an electrical port, from which the gold finger of the circuit board 300 extends and is inserted into the electrical connector of the host computer 100; opening 205 is an optical port, configured to receive an external optical fiber 101, so that the optical fiber 101 can connect to the optical transceiver component 900 in the optical module 200.

[0069] The combined assembly of the upper housing 201 and the lower housing 202 facilitates installation of the circuit board 300 and the optical transceiver 900 within the housing, which provides encapsulation and protection for these components. Furthermore, during assembly of the circuit board 300 and the optical transceiver 900, the positioning components, heat dissipation components, and electromagnetic shielding components of these components are easily positioned, facilitating automated production.

[0070] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0071] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0072] For example, the unlocking component 600 is located on the outside of the two lower side panels 2022 of the lower housing 202 and includes a snap-fit ​​component that mates with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 secures the optical module 200 in the cage 106. When the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection between the snap-fit ​​component and the host computer, thereby releasing the optical module 200 from the cage 106 and allowing the optical module 200 to be removed from the cage 106.

[0073] The circuit board 300 includes circuit traces, electronic components, and chips. The electronic components and chips are connected according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include, for example, microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers, clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0074] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0075] The circuit board 300 also includes a gold finger formed on the surface of its end, and the gold finger is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger is connected to the electrical connector in the cage 106. The gold finger can be set only on the surface of one side of the circuit board 300 (for example, the upper surface shown in Figure 4), or it can be set on the upper and lower surfaces of the circuit board 300 to provide a larger number of pins, thereby adapting to occasions where a large number of pins are required. The gold finger is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0076] Figure 5 is an exploded view of an optical transceiver component and a circuit board according to some embodiments of the present disclosure. Figure 6 is a cross-sectional view of an optical transceiver component and a circuit board according to some embodiments of the present disclosure. As shown in Figures 5 and 6, in some embodiments, an optical matching chip 30-2 and an optical chip 30-1 are provided on a circuit board 300. The optical matching chip 30-2 can be a bare chip such as a laser driver chip 330 (also known as a driver) and / or a TIA chip 340 (also known as a transimpedance amplifier). The bare chip is bonded to the circuit board 300 using silver glue for fixation and heat dissipation. The bare chip is then connected to the circuit board 300 using gold wire bonding. The optical chip 30-1 can be a light emitting chip 310 and / or a light receiving chip 320. The light emitting chip 310 and the light receiving chip 320 can be fixed side by side on the circuit board 300. The light emitting chip includes a laser, and the light receiving chip includes a photodetector. The area below the lens assembly is not limited to being provided with a light emitting chip and / or a light receiving chip; photoelectric monitoring components, driver chips, etc. can also be provided.

[0077] Since the optical chip 30-1 is attached to the circuit board 300, its light-emitting surface or light-incident surface is located on the top surface of the optical chip 30-1, so the light beam emitted by the optical emitting chip is perpendicular to the circuit board 300, and the light beam received by the optical receiving chip is perpendicular to the circuit board 300; and the optical fiber 101 connected to the optical module is parallel to the circuit board 300, and it is necessary to change the transmission direction of the light beam emitted by the optical emitting chip and the external light beam transmitted to the optical receiving chip. Therefore, the light beam emitted by the optical emitting chip is changed by the optical transceiver component 900, so that the light beam emitted by the optical emitting chip is reflected by the lens assembly, and the reflected light beam is parallel to the circuit board 300, so as to facilitate the coupling of the reflected light beam into the optical fiber; the receiving light beam transmitted by the external optical fiber is reflected by the lens assembly, and the reflected light beam is perpendicular to the circuit board 300, so as to facilitate the reception by the optical receiving chip.

[0078] As shown in Figure 5, the optical module may include a circuit board, an optical transceiver component and a heating device. The optical transceiver component includes a lens assembly, an optical fiber bracket, a positioning column and an optical emitting chip. The optical fiber bracket has a first positioning hole. The lens assembly is provided with a second lens and a second positioning hole on the side facing the optical fiber bracket. The second positioning hole is located on one side of the second lens. The positioning column is independently provided from the lens assembly and the optical fiber bracket, and the positioning column can be fixed between the second positioning hole and the first positioning hole to achieve assembly alignment of the lens assembly and the optical fiber bracket.

[0079] The light emitting chip is electrically connected to the circuit board and is used to generate an optical signal. The heating device can be arranged on the side or below the light emitting chip. In this example, the heating device is used to generate heat to maintain the operating temperature of the light emitting chip.

[0080] In addition, a shielding area is provided at the edge of the upper surface layer of the circuit board in this example, and the optical transceiver component can be arranged in the shielding area to shield external electromagnetic waves through the shielding area.

[0081] As shown in Figure 6, a first lens 9121 is provided on the side of the optical transceiver component 900 facing the circuit board 300, a reflective surface 9131 is provided on the side of the optical transceiver component 900 facing away from the circuit board 300, a second lens 9142 is provided on the side of the optical transceiver component 900 facing the optical port, and the first lens 9121 is located above the optical chip 30-1.

[0082] FIG7 is a structural diagram of an optical transceiver component provided according to some embodiments of the present disclosure. FIG8 is an exploded view of an optical transceiver component provided according to some embodiments of the present disclosure. FIG9 is a cross-sectional view of an optical transceiver component provided according to some embodiments of the present disclosure. As shown in FIG7, FIG8 and FIG9, in some embodiments, the optical transceiver component 900 includes a lens assembly 901 and an optical fiber bracket 902, the lens assembly 901 is connected to the optical fiber bracket 902, and the lens assembly 901 is covered on the optical matching chip 30-2 and the optical chip 30-1 on the circuit board 300 to place the optical matching chip 30-2 and the optical chip 30-1 in the covering cavity formed by the lens assembly 901 and the circuit board 300.

[0083] As shown in Figure 9, the side of the lens assembly 901 facing the circuit board 300 is recessed inward to form a cover groove 911, and the cover groove 911 is provided with a first lens 9121, and the first lens 9121 is located directly above the optical chip 30-1 to achieve collimation or convergence of the light beam; the side of the lens assembly 901 facing away from the circuit board 300 is recessed inward to form an optical port groove 913, and the side wall of the optical port groove 913 is a reflective surface 9131, and the reflective surface 9131 is located above the first lens 9121 to achieve reflection of the light beam; the side of the lens assembly 901 facing the optical fiber bracket 902 is provided with a second lens 9142 to achieve convergence or collimation of the light beam.

[0084] The optical transmitter chip 310 emits a divergent light beam, which is converted into a collimated light beam by the first lens 9121. The collimated light beam is then reflected by the reflective surface 9131. The reflected collimated light beam is then converted into a convergent light beam by the second lens 9142 and coupled to an optical fiber. The optical fiber then transmits the light beam outside the optical module, thereby transmitting the optical signal. The light beam outside the optical module is then transmitted through the optical fiber to the second lens 9142, where it is collimated into a collimated light beam. The collimated light beam is then reflected by the reflective surface 9131. The reflected collimated light beam is then transmitted vertically downward, coupled by the first lens 9121, and vertically incident on the optical receiver chip 320, thereby receiving the optical signal. In other words, the transmission direction of the transmitted and / or received optical signals is adjusted by the combination of the first lens 9121, the second lens 9142, and the reflective surface 9131, so that the transmitted light signal generated by the optical transmitter chip 310 can be output from the optical module, and the optical signal input to the optical module can be transmitted to the optical receiver chip 320.

[0085] As the transmission rate of optical modules continues to increase, the optical transmitter chips used in current single-wavelength 100G optical modules are particularly sensitive to reflected light. This reflected light can affect the performance of the optical transmitter chip itself, thereby disrupting its original characteristics and causing adverse effects such as bit errors. Currently, optical modules reduce reflected light by applying an anti-reflection coating to the first lens of the lens assembly and / or by providing an inclined surface on the fiber holder facing the lens assembly. However, the optical signal can also be reflected from the surface of the lens assembly where the second lens resides, further affecting the performance of the optical transmitter chip. Therefore, applying an anti-reflection coating to the second lens can be used to further reduce reflected light. However, due to optical path requirements, a certain distance must be maintained between the lens assembly and the fiber end face of the fiber holder to serve as the focal length of the second lens. Furthermore, the fiber holder and lens assembly must be tightly fitted to precisely secure the position of the fiber and lens assembly. Consequently, the second lens is typically recessed within the lens assembly, resulting in a shadowing effect during coating, affecting the coating quality.

[0086] Figure 10 is a structural diagram of a conventional lens assembly provided according to some embodiments of the present disclosure. As shown in Figure 10, the side of the lens assembly 901 facing the optical fiber holder is a fixing surface 9146. A second lens 9142 is disposed on fixing surface 9146. First limiting bosses 9144 are disposed on either side of the second lens 9142. Positioning posts 903 are mounted on the first limiting bosses 9144. The first limiting bosses 9144 are relatively close to the second lens 9142, creating a wall around the second lens 9142. Due to the limitations of the wall, the second lens 9142 is shielded during coating, making uniform coating impossible and resulting in uneven thickness of the antireflection coating on the second lens. To address this issue, the first limiting bosses 9144 are cut away from the second lens 9142. However, the space between the first limiting bosses 9144 and the second lens 9142 is limited, making it impossible to install positioning posts 903 there. The distance between the positioning post 903 and the second lens 9142 is fixed, so the positioning post 903 can only be installed on the side of the lens assembly 901 facing the optical fiber holder 902, namely, the fixing surface 9146. However, the positioning post 903 is relatively close to the second lens 9142, and the positioning post 903 and lens assembly 901 are integrally formed. When the second lens 9142 is coated, the positioning post 903 will act as an obstruction and affect the coating effect.

[0087] Therefore, to address the problems caused by the presence of the aforementioned positioning posts, in some embodiments, a second lens 9142 and a second positioning hole are provided on the side of the lens assembly 901 facing the optical fiber holder. The surface on which the second lens 9142 is located is not recessed inward relative to the side of the lens assembly 901 facing the optical fiber holder 902. In other words, the surface on which the second lens 9142 is located is flush with or protrudes from the side of the lens assembly 901 facing the optical fiber holder 902, and the second positioning hole is located on one side of the second lens 9142. It should be noted that the side of the lens assembly 901 facing the optical fiber holder 902 can be understood as any other surface except the side on which the second lens is located.

[0088] Positioning post 903 and lens assembly 901 are two independent structural components. When second lens 9142 is uncoated, positioning post 903 is not secured to the second positioning hole. After second lens 9142 is coated, positioning post 903 can be inserted and secured to the second positioning hole. Therefore, the surface of second lens 9142 is not recessed inward relative to the surface of lens assembly 901 facing fiber optic support 902. The second positioning hole is located on one side of second lens 9142 to reduce obstructions around second lens 9142, minimizing the obstruction effect and ensuring a consistent thickness of the antireflection coating on second lens 9142.

[0089] In some embodiments, the surface of the second lens 9142 is flush with the surface of the lens assembly 901 facing the optical fiber holder 902, reducing obstructions around the second lens 9142 and reducing the blocking effect, thereby making the thickness of the anti-reflection film of the second lens 9142 the same.

[0090] When coating the second lens 9142, a clamp is required to clamp the lens assembly 901. The clamp includes a clamp frame. When the clamp clamps the lens assembly, the second lens 9142 is located in the clamp frame. However, since the clamp frame also has a certain thickness, a partial shielding effect will still occur when coating the second lens 9142, resulting in different thicknesses of the antireflection coating on the second lens 9142. To solve this problem, in some embodiments, the surface where the second lens 9142 is located protrudes outward relative to the side of the lens assembly 901 facing the optical fiber holder 902, that is, the surface where the second lens 9142 is located protrudes toward the optical fiber holder 902 relative to the side of the lens assembly 901 facing the optical fiber holder 902.

[0091] In some embodiments, the surface where the second lens 9142 is located protrudes outward relative to the side of the lens assembly 901 facing the optical fiber holder 902, and the distance between the surface where the second lens 9142 is located and the side of the lens assembly 901 facing the optical fiber holder 902 is greater than zero. In other words, the surface where the second lens 9142 is located is closer to the optical fiber holder 902 than other surfaces in the same direction.

[0092] In some embodiments, the surface of the second lens 9142 protrudes outward relative to the surface of the lens assembly 901 facing the optical fiber holder 902, and the distance between the surface of the second lens 9142 and the surface of the lens assembly 901 facing the optical fiber holder 902 matches the thickness of the fixture frame. For example, the distance between the surface of the second lens 9142 and the surface of the lens assembly 901 facing the optical fiber holder 902 is equal to the thickness of the fixture frame, thereby reducing obstructions around the second lens 9142 caused by the thickness of the fixture frame, reducing the obstruction effect, and thereby ensuring that the thickness of the anti-reflection coating of the second lens 9142 is uniform.

[0093] In some embodiments, the optical fiber holder 902 has a first positioning hole, which is arranged corresponding to the second positioning hole of the lens assembly 901. The positioning column 903 and the lens assembly 901 are two independent structural components. The positioning column 903 is fixed to the first positioning hole and the second positioning hole to achieve alignment between the lens assembly 901 and the optical fiber holder 902, thereby achieving that the center axis height of the second lens 9142 of the lens assembly 901 is flush with the center axis height of the optical fiber carried by the optical fiber holder 902.

[0094] Because the positioning post 903 and the lens assembly 901 are two independent components, the positioning post 903 is not assembled to the lens assembly 901 before the second lens 9142 is coated. After the second lens 9142 is coated, the positioning post 903 is assembled to the lens assembly 901. Therefore, when the second lens 9142 is coated, there are no obstructions around the second lens 9142, reducing the obstruction effect of the coating on the second lens 9142.

[0095] Of course, the positioning column 903 and the optical fiber bracket 902 can also be two independent structural parts. This setting will not affect the coating process of the second lens 9142. During assembly, the positioning column 903 can be assembled on the optical fiber bracket 902 and then docked with the second positioning hole of the lens assembly 901 to achieve alignment between the lens assembly 901 and the optical fiber bracket 902.

[0096] To improve the positioning accuracy of the optical fiber holder 902 and the lens assembly 901, in some embodiments, the allowable error range of the positioning post 903 matches the assembly error range of the optical fiber holder 902 and the lens assembly 901. For example, the allowable error range of the positioning post 903 is the same as the assembly error range of the optical fiber holder 902 and the lens assembly 901; the allowable error range of the positioning post 903 is smaller than the assembly error range of the optical fiber holder 902 and the lens assembly 901. Preferably, the positioning post 903 is a high-precision metal needle.

[0097] In some embodiments, the optical transceiver component 900 is provided with a first limiting boss, and the lens assembly 901 and the optical fiber holder 902 are connected in a limiting manner via the first limiting boss. A gap is provided between the second lens 9142 and the end face of the optical fiber carried by the optical fiber holder 902, so that the optical signal converged by the second lens 9142 is coupled to the optical fiber carried by the optical fiber holder 902. That is, the lens assembly 901 or the optical fiber holder 902 is provided with a first limiting boss, and the lens assembly 901 and the optical fiber holder 902 are connected in a limiting manner via the first limiting boss. For example, the outer side of the second positioning hole is provided with a first limiting boss, and the end face of the optical fiber holder 902 is connected in a limiting manner to the first limiting boss of the lens assembly 901.

[0098] Of course, it is also possible that the end face of the optical fiber holder 902 has a first limiting boss, and the side of the lens assembly 901 facing the optical fiber holder 902 is limitedly connected to the first limiting boss of the optical fiber holder 902. Wherein, the lens assembly 901 and the optical fiber holder 902 are limitedly connected via the first limiting boss, which means that when the lens assembly 901 has the first limiting boss, the first limiting boss is located on the side of the second positioning hole away from the second lens, and the optical fiber holder 902 stops at the first limiting boss, that is, the optical fiber holder 902 contacts the first limiting boss, and the optical fiber holder 902 is fixedly connected to the first limiting boss by glue; or, when the optical fiber holder 902 has the first limiting boss, the lens assembly 901 stops at the first limiting boss, that is, the lens assembly 901 contacts the first limiting boss, and the lens assembly 901 is fixedly connected to the first limiting boss by glue.

[0099] Figure 11 is a structural diagram of a fiber optic holder provided according to some embodiments of the present disclosure. As shown in Figure 11, in some embodiments, a first positioning hole 921 is provided on the end face of the fiber optic holder 902a. The first positioning hole 921 is arranged opposite to the second positioning hole of the lens assembly 901. When the fiber optic holder 902a is docked with the lens assembly 901, the positioning post 903 passes through the second positioning hole and the first positioning hole 921 to position and install the fiber optic holder 902a.

[0100] The end face of the optical fiber holder 902a (the end face opposite to the lens assembly 901) is also provided with a fiber hole, and the front end face of the optical fiber holder 902a (the opposite face to the end face of the optical fiber holder 902a) is provided with a fiber optic jack, which is connected to the fiber optic jack, so that the optical fiber 923 is inserted into the fiber hole through the fiber optic jack, and the light incident surface of the optical fiber 923 can be located inside the optical fiber holder 902a, or it can protrude from the end face of the optical fiber holder 902a.

[0101] Insert the optical fiber 923 into the optical fiber holder 902a through the optical fiber jack, and use sealing glue to seal all the gaps between the optical fiber 923 and the optical fiber jack. The sealing glue is added to the periphery of the contact point between the optical fiber 923 and the optical fiber jack, and is accumulated on the front end face of the optical fiber 923 and the optical fiber holder 902a. After the sealing glue is cured, a sealing colloid is formed to prevent the cooling liquid from extending into the interior of the optical fiber holder 902a through the optical fiber jack.

[0102] As shown in FIG11 , the upper end of the optical fiber holder 902a is further provided with an observation hole 922. This observation hole 922 communicates with the optical fiber hole within the optical fiber holder 902a, allowing the insertion of the optical fiber 923 into the optical fiber holder 902a to be observed through the observation hole 922. After the optical fiber 923 is inserted into the optical fiber holder 902a through the optical fiber insertion hole, sealing glue can be added to the observation hole 922 to form a sealing colloid. This sealant seals the observation hole 922, preventing coolant from seeping into the interior of the optical fiber holder 902a through the observation hole 922.

[0103] Figure 12 is a structural diagram of the first lens assembly provided according to some embodiments of the present disclosure at a first viewing angle. Figure 13 is a structural diagram of the first lens assembly provided according to some embodiments of the present disclosure at a second viewing angle. Figure 14 is a cross-sectional view of the first lens assembly and an optical fiber bracket provided according to some embodiments of the present disclosure. As shown in Figures 12, 13 and 14, the side of the lens assembly 901a facing the circuit board 300 is recessed inward to form a cover groove 911, and a placement protrusion 912 is provided on the cover groove 911, and a first lens 9121 is provided on the placement protrusion 912, and the first lens 9121 is located directly above the optical chip to achieve collimation or convergence of the light beam; the side of the lens assembly 901a facing away from the circuit board 300 is recessed inward to form an optical port groove 913, and the side wall of the optical port groove 913 is a reflective surface 9131, and the reflective surface 9131 is located above the first lens 9121, To achieve reflection of the light beam; the side of the lens assembly 901a facing the optical fiber bracket 902a is a fixed surface 9146, and the fixed surface 9146 is provided with a second lens 9142 to achieve convergence or collimation of the light beam; the fixed surface 9146 is also provided with a second positioning hole 9143, and the surface where the second lens 9142 is located is not recessed relative to the fixed surface 9146, and the second positioning hole 9143 is located on one side of the second lens 9142 to reduce obstructions around the second lens 9142 and reduce the obstruction effect, thereby making the thickness of the anti-reflection film of the second lens 9142 the same.

[0104] In some embodiments, the second lens 9142 is fixed to the fixing surface 9146 via a support boss 9141, and the thickness of the support boss 9141 is zero. That is, the second lens 9142 is directly fixed to the fixing surface 9146, so that the surface of the lens assembly 901a where the second lens 9142 is located is flush with the fixing surface 9146.

[0105] As shown in FIG12 , in some embodiments, the second lens 9142 is fixed to the fixing surface 9146 via a supporting boss 9141 , and the thickness of the supporting boss 9141 is greater than zero. That is, the surface of the lens assembly 901 a where the second lens 9142 is located protrudes outward relative to the fixing surface 9146 .

[0106] In some embodiments, the second lens 9142 is fixed to the fixing surface 9146 via a support boss 9141, and the thickness of the support boss 9141 matches the preset thickness. For example, the thickness of the support boss 9141 is the same as the preset thickness, which is the thickness of the fixture frame.

[0107] As shown in Figure 12, the second positioning hole 9143 extends from the fixing surface 9146 to the end away from the optical fiber bracket 902a. After the second lens 9142 is coated, glue is injected into the second positioning hole 9143 and the first positioning hole 921 to fix the positioning column 903 in the second positioning hole 9143 and the first positioning hole 921.

[0108] Because the further the second positioning hole 9143 extends away from the end of the fiber optic support 902a, the greater the stability of the positioning post 903 and the second positioning hole 9143. Therefore, in some embodiments, the stability of the positioning post 903 and the second positioning hole 9143 can be improved by extending the length of the second positioning hole 9143. For example, the second positioning hole 9143 traverses the lens assembly 901a, that is, the second positioning hole 9143 extends from the side of the lens assembly 901a facing the fiber optic support 902a to the side of the lens assembly 901a facing away from the fiber optic support 902a.

[0109] However, since the size of the second positioning hole 9143 matches the size of the positioning column 903, the amount of glue that can be placed in the second positioning hole 9143 is limited. In order to further improve the stability of the positioning column 903 and the second positioning hole 9143, in some embodiments, a storage recess 915 is provided behind the optical port slot 913 of the lens assembly 901a, and the positioning column 903 and the sealing colloid are placed in the storage recess 915. The gap between the positioning column 903 and the storage recess 915 is filled with sealing colloid, and the second positioning hole 9143 is also filled with sealing colloid, so that the positioning column 903 and the second positioning hole 9143 are fixedly connected. That is, after the positioning post 903 is inserted into the second positioning hole 9143 and the first positioning hole 921, glue is injected into the storage recess 915, and there is glue in the gap between the positioning post 903 located in the storage recess 915 and the lens assembly 901a. Glue is injected into the second positioning hole 9143. After the glue solidifies, the positioning post 903 located at the storage recess 915 is fixed on the lens assembly 901a, and the positioning post 903 located in the second positioning hole 9143 is fixed to the second positioning hole 9143, so that the positioning post 903 is fixedly connected to the second positioning hole 9143.

[0110] In some embodiments, one end of the positioning post 903 is located in the placement recess 915 , and the other end of the positioning post 903 is located in the first positioning hole 921 .

[0111] In some embodiments, one end of the positioning post 903 passes over the storage recess 915 and reaches the second positioning hole 9143 located at the left end of the storage recess 915, and the other end of the positioning post 903 is located in the first positioning hole 921. The left end of the storage recess 915 refers to the end of the storage recess 915 away from the optical fiber bracket 902a.

[0112] In some embodiments, one end of the positioning post 903 passes over the storage recess 915 and the second positioning hole 9143 at the left end of the storage recess 915 and extends out of the lens assembly 901a, and the other end of the positioning post 903 is located in the first positioning hole 921.

[0113] In order to fix the positioning column 903 in the storage recess 915, as shown in Figure 12, in some embodiments, the storage recess 915 includes a storage groove 9152, which is connected to the second positioning hole 9143 so that the positioning column 903 can be placed in the storage groove 9152 and the second positioning hole 9143.

[0114] In some embodiments, the storage slot 9152 is an arc-shaped structure, the curvature of the arc-shaped structure is the same as the curvature of the second positioning hole 9143 in the storage recess 915, and the lowest point of the storage slot 9152 is at the same height as the lowest point of the second positioning hole 9143, so that the positioning column 903 fits better with the storage slot 9152 and the second positioning hole 9143.

[0115] In order to dispense glue to the positioning column 903 , in some embodiments, the storage recess 915 further includes a glue dispensing groove 9153 , which is located on one side of the storage groove 9152 . The height of the glue dispensing groove 9153 is higher than the height of the storage groove 9152 so that the glue can penetrate into the storage groove 9152 .

[0116] In order to improve the uniformity of glue dispensing, in some embodiments, glue dispensing grooves 9153 are provided on both sides of the storage groove 9152. The glue dispensing grooves 9153 on both sides of the storage groove 9152 can dispense glue to ensure that the glue on the positioning column 903 in the storage groove 9152 is uniform.

[0117] In some embodiments, the storage recess 915 also includes a glue partition boss 9151, which is located between the two storage grooves 9152. Glue dispensing grooves 9153 are provided on both sides of the glue partition boss 9151. The height of the glue partition boss 9151 is greater than the height of the glue dispensing grooves 9153 to prevent the glue on one side of the glue partition boss 9151 from flowing to the other side of the glue partition boss 9151.

[0118] In some embodiments, the height of the glue in the dispensing groove 9153 is lower than the height of the glue-isolating boss 9151 to prevent glue from flowing between the two sides of the glue-isolating boss 9151. That is, after the glue in the dispensing groove 9153 is cured, the height of the sealing glue in the dispensing groove 9153 is lower than the height of the glue-isolating boss 9151.

[0119] In addition, the first positioning hole 921 can also be set through the optical fiber holder 902a. Then, the positioning post 903 can be passed through and fixed at the first positioning hole 921, and one end of the positioning post 903 is exposed at the end face of the optical fiber holder 902a. When the optical fiber holder 902a and the lens assembly 901a are docked and assembled, the positioning post 903 can dock with the second positioning hole 9143, thereby achieving alignment between the lens assembly 901a and the optical fiber holder 902a. Of course, to improve the stability of the positioning post 903 and the first positioning hole 921, a placement recess can be set on one side of the observation port 922 of the optical fiber holder 902a. The placement recess is used to place the positioning post 903 and a sealing colloid. That is, the gap between the positioning post 903 and the placement recess is filled with a sealing colloid, so that the positioning post 903 is fixedly connected to the first positioning hole 921 and can effectively isolate it from the external cooling liquid.

[0120] As shown in Figure 12, in some embodiments, the fixing surface 9146 is further provided with a first limiting boss 9144, and the first limiting boss 9144 protrudes outward relative to the surface where the second lens 9142 is located. The first limiting boss 9144 is located on the side of the second positioning hole 9143 away from the second lens 9142. The distance between the first limiting boss 9144 and the second lens 9142 is greater than the distance between the second positioning hole 9143 and the second lens 9142. The side surface of the first limiting boss 9144 and the fixing surface 9146 form a support groove 9144, and the end face of the optical fiber bracket 902a is in contact with the first limiting boss 9144, and the limiting connection is achieved by glue.

[0121] In some embodiments, the first limiting boss 9144 is located at the edge of the fixing surface 9146, and the end face edge of the optical fiber bracket 902a contacts the first limiting boss 9144, and a limiting connection is achieved by glue.

[0122] In some embodiments, the first limiting boss 9144 in the lens assembly 901 a extends from a side of the lens assembly 901 a facing away from the circuit board 300 to a side of the lens assembly 901 a facing the circuit board 300 .

[0123] As shown in Figure 12, in some embodiments, the fixing surface 9146 is further provided with a second limiting boss 9145, and the second limiting boss 9145 is fixed to the side of the first limiting boss 9144 facing the optical fiber bracket 902a, so that the second limiting boss 9145 and the first limiting boss 9144 form a limiting gap, and the end edge of the optical fiber bracket 902a is clamped in the limiting gap to further realize the limiting connection between the optical fiber bracket 902a and the lens assembly 901a.

[0124] The second lens 9142, the lens assembly 901a, the supporting boss 9141, the first limiting boss 9144 and the second limiting boss 9145 can be independent structural components or components of an integrally formed structural component.

[0125] FIG15 is a structural diagram of a second lens assembly provided according to some embodiments of the present disclosure. As shown in FIG15 , in some embodiments, the first limiting boss 9144 in the lens assembly 901b includes a first limiting boss portion 9144a and a second limiting boss portion 9144b. The first limiting boss portion 9144a and the second limiting boss portion 9144b are not connected. The first limiting boss portion 9144a extends downward from the side of the lens assembly 901b facing away from the circuit board 300 and does not extend to the side of the lens assembly 901b facing the circuit board 300. The second limiting boss portion 9144b extends upward from the side of the lens assembly 901b facing the circuit board 300 and does not extend to the side of the lens assembly 901b facing away from the circuit board 300. That is, a gap is formed between the first limiting boss portion 9144a and the second limiting boss portion 9144b.

[0126] In some embodiments, the first limiting boss portion 9144a and the second limiting boss portion 9144b have the same thickness, and the first limiting boss portion 9144a and the second limiting boss portion 9144b are respectively in contact and connected with the end face of the optical fiber holder 902a to prevent the optical fiber carried by the optical fiber holder 902a from deviating from the preset position.

[0127] Except that the structure of the first limiting boss 9144 is different and the lens assembly 901b does not have the second limiting boss, the other structures are the same as those of the lens assembly 901a and will not be repeated here.

[0128] Figure 16 is a structural diagram of another optical fiber holder provided according to some embodiments of the present disclosure. Figure 17 is a structural diagram of a third lens assembly provided according to some embodiments of the present disclosure. Figure 18 is a cross-sectional view of the third lens assembly and another optical fiber holder provided according to some embodiments of the present disclosure. As shown in Figures 16, 17, and 18, lens assembly 901c lacks the first and second limiting bosses. The remaining structures are identical to those of lens assembly 901a and are not further described here.

[0129] As shown in Figures 16 and 18, in some embodiments, a first limiting boss 926 is provided on the edge of the end face of the optical fiber bracket 902b, and the first limiting boss 926 protrudes outward relative to the end face of the optical fiber bracket 902b. The edge of the side of the lens assembly 901c facing the optical fiber bracket 902b contacts the first limiting boss 926, and a limiting connection is achieved by glue.

[0130] In some embodiments, the first limiting boss 926 in the optical fiber holder 902 b extends from a side of the optical fiber holder 902 b facing away from the circuit board 300 to a side of the optical fiber holder 902 b facing the circuit board 300 .

[0131] In some embodiments, a second limiting boss 927 is further provided on the side of the optical fiber bracket 902b facing the lens assembly 901c, and the second limiting boss 927 is fixed on the side of the first limiting boss 926 facing the lens assembly 901c, so that the second limiting boss 927 and the first limiting boss 926 form a limiting gap, and the end edge of the lens assembly 901c is clamped in the limiting gap to further realize the limiting connection between the optical fiber bracket 902b and the lens assembly 901c.

[0132] In some embodiments, except for the first limiting boss 926 and the second limiting boss 927 , the other structures of the optical fiber bracket 902b are the same as those of the optical fiber bracket 902a and are not described again here.

[0133] As shown in Figure 16, in some embodiments, in addition to the first limiting boss 926 and the second limiting boss 927, the optical fiber bracket 902b is also provided with an optical fiber slot 924 and an optical fiber hole 925. The optical fiber slot 924 is located at the front end of the optical fiber bracket 902b, and the optical fiber hole 925 is located at the end of the optical fiber bracket 902b. The optical fiber slot 924 is connected to the optical fiber hole 925, and the optical fiber slot 924 has a notch facing right and upward to allow the optical fiber 923 to be inserted into the optical fiber slot 924 and inserted into the optical fiber hole 925 through the optical fiber slot 924.

[0134] In some embodiments, a glue dispensing groove 928 is provided at the edge of the optical fiber slot 924, and glue is dispensed in the glue dispensing groove 928 so that the glue can completely seal the gap between the optical fiber and the optical fiber jack. The sealing glue is added to the periphery of the contact point between the optical fiber and the optical fiber slot, and is accumulated on the front end face of the optical fiber and the optical fiber bracket 902b. After the sealing glue is cured, a sealing colloid is formed to prevent the cooling liquid from extending into the interior of the optical fiber bracket 902b from the optical fiber jack.

[0135] In some embodiments, the optical module includes a circuit board and an optical transceiver component, and the optical transceiver component is fixed on the circuit board. The optical transceiver component includes a lens assembly, an optical fiber holder and a positioning post, the optical fiber holder has a first positioning hole, the optical fiber holder has a second positioning hole, the first positioning hole and the second positioning hole are arranged correspondingly, and the fixing post is fixed to the second positioning hole and the first positioning hole to achieve alignment between the lens assembly and the optical fiber holder. A second lens is provided on the side of the lens assembly facing the optical fiber holder, and the second lens is coated with an anti-reflection film to reduce reflected light. The second positioning hole is located on one side of the second lens, and the distance between the second positioning hole and the second lens is small. If a positioning post integrated with the lens assembly is provided at the position of the second positioning hole, when the second lens is coated, the positioning post acts as a shield and affects the coating effect. Therefore, only the second positioning hole can be provided on one side of the second lens.

[0136] The second positioning hole is located on one side of the second lens. The surface of the second lens is not recessed inward relative to the side of the lens assembly facing the fiber optic holder. This reduces obstructions around the second lens assembly, thereby reducing the obstruction effect during coating and ensuring a uniform thickness of the antireflection coating on the second lens. The lens assembly or fiber optic holder is provided with a first limiting boss. The lens assembly and the fiber optic holder are connected via the first limiting boss. A gap is created between the second lens and the end face of the optical fiber carried by the fiber optic holder to enable the optical signal converged by the second lens to be coupled to the optical fiber carried by the fiber optic holder.

[0137] In some embodiments, the second positioning hole is located on one side of the second lens, and the surface where the second lens is located is not recessed inward relative to the side of the lens assembly facing the optical fiber holder, so as to reduce obstructions around the second lens assembly and make the thickness of the anti-reflection film of the second lens uniform; the lens assembly or the optical fiber holder is provided with a first limiting boss, and the lens assembly and the optical fiber holder are connected in a limiting manner through the first limiting boss, so that the optical signal converged by the second lens is coupled to the optical fiber carried by the optical fiber holder.

[0138] When the light emitting chip generates an optical signal, its performance is easily affected by the operating temperature. To ensure the stability of the performance of the light emitting chip, a heating device needs to be provided on the light emitting chip to maintain the operating temperature of the light emitting chip.

[0139] In this example, two optical transceiver components 900 may be included in an optical module, so the lens assembly corresponds to a first lens assembly and a second lens assembly, the optical emitting chip may correspond to a first optical emitting chip and a second optical emitting chip, and similarly, the heating device corresponds to a first heating device and a second heating device.

[0140] Figure 19 is a partial enlarged view of point A in Figure 5 . As shown in Figures 5 and 19 , a first light emitting chip 310 and a first light receiving chip 320 are disposed below the first lens assembly 400. The first light emitting chip 310 and the first light receiving chip 320 are each connected to the circuit board 300. Exemplarily, the first light emitting chip 310 is disposed on the circuit board 300, with the top surface of the first light emitting chip 310 higher than the top surface of the circuit board 300. Also disposed on the circuit board 300 are a first driver 330 (first driver chip) and a first trans-impedance amplifier (TIA) 340 (first TIA chip). The first driver 330 is disposed on the side of the first light emitting chip 310 and is electrically connected to the first light emitting chip 310. The first TIA 340 is disposed on the side of the first light receiving chip 320 and is electrically connected to the first light receiving chip 320. Both the first driver 330 and the first TIA 340 are located below the first lens assembly 400.

[0141] In some embodiments, the first light receiving chip 320 is located beside the first light emitting chip 310 . Exemplarily, the first light receiving chip 320 and the first light emitting chip 310 are arranged side by side along the width direction of the circuit board 300 .

[0142] In some embodiments, the first light emitting chip 310 is packaged with multiple lasers. For example, the first light emitting chip 310 is packaged with four lasers. Of course, in the embodiments of the present disclosure, the first light emitting chip 310 is not limited to being packaged with four lasers.

[0143] In some embodiments, the first light receiving chip 320 is packaged with a plurality of light detectors. For example, the first light receiving chip 320 is packaged with four light detectors. Of course, in the embodiment of the present disclosure, the first light receiving chip 320 is not limited to being packaged with four light detectors.

[0144] In some embodiments, a first heating device 350a is disposed on the side or below the first light emitting chip 310 and is electrically connected to the circuit board 300. When powered, the first heating device 350a generates heat, which increases the temperature of the first light emitting chip 310 and its surroundings, stabilizing the operating temperature of the first light emitting chip 310 within a certain range and thereby ensuring the stability of the performance of the first light emitting chip 310. For example, the first heating device 350a is disposed below the first light emitting chip 310, i.e., the top of the first heating device 350a supports and connects to the first light emitting chip 310.

[0145] In some embodiments, a gap is provided between the first light receiving chip 320 and the first heating device 350 a so as to reduce the influence of the heat generated by the first heating device 350 a on the first light receiving chip 320 .

[0146] Figure 20 is a partial enlarged view of the optical transceiver component in another optical module provided according to some embodiments of the present disclosure. As shown in Figure 20, the optical module 200 also includes a second lens assembly, the bottom of the second lens assembly is connected to the circuit board 300, and a light emitting chip and / or a light receiving chip are arranged below the second lens assembly. The second lens assembly has a transmission surface and a reflection surface, so that the transmission direction of the transmitted light signal and / or the received light signal can be adjusted by combining the transmission surface and the reflection surface, so that the transmitted light signal generated by the light emitting chip can be output from the optical module, and the light signal input to the optical module can be transmitted to the light receiving chip. The light emitting chip includes a laser, and the light receiving chip includes a photodetector. The area below the second lens assembly is not limited to being provided with a light emitting chip and / or a light receiving chip, and a photoelectric monitoring component, a driver chip, etc. can also be arranged.

[0147] In some embodiments, the first lens assembly 400 is connected to a first optical fiber ribbon, and the optical signal generated by the optical transmitter chip is transmitted to the first optical fiber ribbon through the first lens assembly 400, or the optical signal input through the first optical fiber ribbon is transmitted to the first lens assembly 400 and then transmitted to the optical receiver chip through the first lens assembly 400. The second lens assembly is connected to a second optical fiber ribbon, and the optical signal generated by the optical transmitter chip is transmitted to the second optical fiber ribbon through the second lens assembly, or the optical signal input through the second optical fiber ribbon is transmitted to the second lens assembly and then transmitted to the optical receiver chip through the second lens assembly.

[0148] As shown in FIG20 , in some embodiments, a second light emitting chip 360 and a second light receiving chip 370 are disposed below the second lens assembly, and each of the second light emitting chip 360 and the second light receiving chip 370 is connected to the circuit board 300. Exemplarily, the second light emitting chip 360 is disposed on the circuit board 300, with the top surface of the second light emitting chip 360 being higher than the top surface of the circuit board 300. A second driver 380 and a second TIA 390 are also disposed on the circuit board 300. The second driver 380 is disposed on the side of the second light emitting chip 360 and is electrically connected to the second light emitting chip 360. The second TIA 390 is disposed on the side of the second light receiving chip 370 and is electrically connected to the second light receiving chip 370. The second driver 380 and the second TIA 390 are each located below the second lens assembly.

[0149] In some embodiments, the second light receiving chip 370 is located at a side of the second light emitting chip 360 . Exemplarily, the second light receiving chip 370 and the second light emitting chip 360 are arranged side by side along the width direction of the circuit board 300 .

[0150] In some embodiments, the second light emitting chip 360 is packaged with multiple lasers. For example, the second light emitting chip 360 is packaged with four lasers. Of course, in the embodiments of the present disclosure, the second light emitting chip 360 is not limited to being packaged with four lasers.

[0151] In some embodiments, the second light receiving chip 370 is packaged with a plurality of light detectors. For example, the second light receiving chip 370 is packaged with four light detectors. Of course, in the embodiment of the present disclosure, the second light receiving chip 370 is not limited to being packaged with four light detectors.

[0152] In some embodiments, a second heating device 350b is disposed on the side or below the second light emitting chip 360 and is electrically connected to the circuit board 300. When the second heating device 350b is powered, it generates heat, which increases the temperature of the second light emitting chip 360 and its surroundings, stabilizing the operating temperature of the second light emitting chip 360 within a certain range and thereby ensuring the stability of the performance of the second light emitting chip 360. For example, the second heating device 350b is disposed on one side of the second light emitting chip 360 and the second driver is disposed on the other side.

[0153] In some embodiments, a gap is provided between the second light receiving chip 370 and the second heating device 350 b so as to reduce the influence of the heat generated by the second heating device 350 b on the second light receiving chip 370 .

[0154] FIG21 is a schematic diagram of the structure of a first heater provided according to some embodiments of the present disclosure. As shown in FIG21 , the first heating device 350a includes a substrate 351, a heating layer 352, a first soldering pad 353, and a second soldering pad 354; the heating layer 352, the first soldering pad 353, and the second soldering pad 354 are arranged on the substrate 351, and one end of the heating layer 352 is connected to the first soldering pad 353, and the other end of the heating layer 352 is connected to the second soldering pad 354. The substrate 351 can be a ceramic substrate, but is not limited to a ceramic substrate; the heating layer 352 can optionally use a resistance wire. The first soldering pad 353 and the second soldering pad 354 are used to electrically connect the circuit board 300 to enable power to be supplied to the heating layer 352.

[0155] In some embodiments, the heating layer 352 extends from one end of the first light emitting chip 310 to the other end of the first light emitting chip 310. That is, the length of the heating layer 352 is greater than or equal to the length of the first light emitting chip 310. This facilitates the relatively uniform transmission of heat generated by the heating layer 352 to the first light emitting chip 310. In other words, the extension of the heating layer 352 along the width of the circuit board 300 is greater than the length of the first light emitting chip 310 along the width of the circuit board 300.

[0156] In some embodiments, the first solder pad 353 and the second solder pad 354 are disposed on the top surface of the substrate 351 to facilitate electrical connection between the first heater 350a and the circuit board 300. The heating layer 352 can be disposed on the top surface of the substrate 351, such as the heating layer 352 being disposed near the edge of the top surface of the substrate 351. For example, the heating layer 352 is located on the side of the substrate 351 away from the first driver 330 to mitigate the effect of heat generated by the heating layer 352 on the first driver 330. In some embodiments, the heating layer 352 is located on the side of the substrate 351 and extends to the top surface of the substrate 351 to electrically connect to the first solder pad 353 and the second solder pad 354.

[0157] The structure of the second heating device 350b can refer to the first heating device 350a provided in the above embodiment, that is, the second heating device 350b can be the same as or similar to the first heating device 350a.

[0158] Figure 22 illustrates a first support block in use according to some embodiments of the present disclosure. As shown in Figure 22, in some embodiments, a first support block 301 is further provided on the circuit board 300. The top of the first support block 301 is used to support and connect the first heater 350a; alternatively, the top of the first support block 301 is used to support and connect the first heater 350a and the first light emitting chip 310. The first support block 301 has good thermal conductivity and is made of a metal material such as tungsten or copper. For example, the bottom of the first heater 350a is connected to the top of the first support block 301, and the top of the first heater 350a is connected to the first light emitting chip 310. The first support block 301 facilitates assembly of the first heater 350a and the first light emitting chip 310.

[0159] As shown in Figure 22, the first supporting block 301 includes a supporting portion 3011 and a connecting portion 3012. The top of the supporting portion 3011 supports and connects to the bottom of the first heating device 350a, and the bottom of the supporting portion 3011 is connected to the connecting portion 3012. The connecting portion 3012 is used to connect to the circuit board 300.

[0160] In some embodiments, the connecting portion 3012 is larger than the supporting portion 3011 to facilitate the first supporting block 301 to connect to the circuit board 300 and support the first heating device 350a. Exemplarily, the supporting portion 3011 and the connecting portion 3012 form a stepped surface 3013, which facilitates the connecting portion 3012 to connect to the circuit board 300.

[0161] Figure 23 is a schematic diagram of the structure of a circuit board provided according to some embodiments of the present disclosure, and Figure 24 is a partial enlarged view of point C in Figure 23 . As shown in Figures 23 and 24 , a first through-hole 302 is provided on the circuit board 300. The first through-hole 302 extends through two opposing surfaces of the circuit board 300. A first support block 301 is connected to the first through-hole 302. It can be understood that the first support block 301 is embedded within the first through-hole 302. Exemplarily, a support portion 3011 is located within the first through-hole 302, and a connection portion 3012 is connected to the first through-hole 302 via glue. The first through-hole 302 not only facilitates the connection between the first support block 301 and the circuit board 300, but also facilitates adjustment of the relative height of the first light emitting chip 310 and the surface of the circuit board 300, ensuring that the top surface height of the first light emitting chip 310 and the top surface height of the first driver 330 are within a predetermined range, thereby ensuring the bonding performance of the first light emitting chip 310 and the first driver 330.

[0162] As shown in FIG23 , in some embodiments, the circuit board 300 further includes a second through hole 304 extending through two opposing surfaces of the circuit board 300. A second support block 303 is disposed within the second through hole 304. The second support block 303 is used to support and connect the second heater 350b; alternatively, the second support block 303 is used to support and connect the second heater 350b and the second light emitting chip 360. The second support block 303 has good thermal conductivity and is made of a metal material, such as tungsten or copper. For example, the specific structure of the second support block 303 can be referenced to the structure of the first support block 301.

[0163] Figure 25 is an internal cross-sectional view of an optical module provided according to some embodiments of the present disclosure. Figure 26 is a partial enlarged view of point D in Figure 25 , and Figure 27 is a partial enlarged view of point E in Figure 25 . As shown in Figures 25 and 26 , the support portion 3011 of the first support block 301 is located within the first through-hole 302 . The top of the support portion 3011 is connected to the bottom of the first heating element 350a , on top of which the first light emitting chip 310 is mounted. The top surface of the support portion 3011 is lower than the top surface 300a of the circuit board 300 to facilitate controlling the height of the top of the first light emitting chip 310. The connecting portion 3012 is located on the other side of the circuit board 300 away from the top surface 300a. The connecting portion 3012 is connected to the circuit board 300 via thermally conductive gel. For example, the thermally conductive gel coats the sides of the connecting portion 3012 and the back of the circuit board 300. In this way, the first support block 301 can not only facilitate the installation of the first heating device 350a and the first light emitting chip 310, but also facilitate the connection of the circuit board 300, and can also facilitate the transfer of excess heat to the back of the circuit board 300, thereby reducing the concentration of heat transferred to the top surface 300a of the circuit board 300, thereby reducing the adverse effects of excessive heat on the devices set on the top surface 300a.

[0164] In some embodiments, the bottom of the connecting portion 3012 does not contact the housing of the optical module, such as the lower housing 202. That is, there is a gap between the bottom of the connecting portion 3012 and the lower housing 202. This reduces the amount of heat generated by the first heating device 350a being directly transferred from the first support block 301 to the housing of the optical module, thereby ensuring the utilization rate of the heat generated by the first heating device 350a. Furthermore, when the first heating device 350a is not operating, the first support block 301 can also help dissipate heat from the first light emitting chip 310 to a certain extent, effectively preventing the performance of the first light emitting chip 310 from being affected by high temperature.

[0165] In some existing technologies, a metal support block is placed beneath the chip, primarily for heat dissipation and chip height adjustment. For example, the top of the support block supports the chip, while the bottom of the support block contacts the housing of the optical module. This allows heat generated by the chip to be directly transferred to the housing through the support block, improving heat dissipation efficiency. Alternatively, the support block supports the chip so that the top surface of the chip is flush with the top surface of the circuit board, making it easier to control the bonding length between the chip and the circuit board.

[0166] In some embodiments, the stepped surface 3013 supports the back surface of the connected circuit board 300 , facilitating the connection of the connecting portion 3012 to the circuit board 300 .

[0167] As shown in Figures 25 and 27 , the supporting portion of the second support block 303 is located within the second through-hole 304. The top portion of the second support block 303 connects to the bottom of the second heater 350b and the bottom of the second light-emitting chip 360, which is located between the second heater 350b and the second driver 380. The top surface of the second support block 303 is flush with the top surface 300a of the circuit board 300 to control the height of the top of the second light-emitting chip 360. The connecting portion of the second support block 303 is located on the back side of the circuit board 300, with the connecting portion 3012 connected to the back side of the circuit board 300 via a stepped surface. In some embodiments, the connecting portion of the second support block 303 is connected to the back side of the circuit board 300 via thermally conductive gel.

[0168] In some embodiments, the bottom of the second support block 303 does not contact the housing of the optical module, such as the lower housing 202. That is, there is a gap between the bottom of the second support block 303 and the lower housing 202. This reduces the amount of heat generated by the second heating device 350b being directly transferred from the second support block 303 to the housing of the optical module, thereby ensuring the utilization rate of the heat generated by the second heating device 350b. Furthermore, when the second heating device 350b is not operating, the second support block 303 can also help dissipate heat from the second light emitting chip 360 to a certain extent, effectively preventing the performance of the second light emitting chip 360 from being affected by high temperature.

[0169] In addition, to ensure the performance and effective operation of the circuit board, the optical transmitting chip, and the optical receiving chip in the above example, a shielding area may be provided on the circuit board to achieve electromagnetic shielding.

[0170] Figure 28 is a structural diagram of an upper shell provided according to some embodiments of the present disclosure. Figure 29 is a structural diagram of a lower shell provided according to some embodiments of the present disclosure. Figure 30 is a cross-sectional view of an upper shell, a circuit board, and a lower shell provided according to some embodiments of the present disclosure. As shown in Figures 28, 29, and 30, in some embodiments, the inner top wall of the cover plate 2011 of the upper shell 201 is provided with a first boss 2012, and the first boss 2012 is connected to the upper surface of the circuit board 300, so that the upper shell 201 and the circuit board 300 form a relatively sealed cavity, thereby reducing the interference signals outside the cavity from affecting the electronic devices in the cavity, wherein the electronic devices include chips and electronic components.

[0171] In some embodiments, a second boss 2023 is provided on the inner top wall of the base plate 2021, and the second boss 2023 is connected to the lower surface of the circuit board 300 so that the lower shell 202 and the circuit board 300 form a relatively sealed cavity, thereby reducing the interference signals outside the cavity from affecting the electronic devices in the cavity.

[0172] In some embodiments, the first boss 2012 and the second boss 2023 are both made of metal material, which is conducive to electromagnetic shielding and heat dissipation.

[0173] In some embodiments, the first boss 2012 is made of the same material as the upper shell 201 . The first boss 2012 and the upper shell 201 can be an integrally formed structure or two independent structural parts that can be welded into a whole.

[0174] In some embodiments, the first boss 2012 and the upper housing 201 are made of different materials. The first boss 2012 and the upper housing 201 are two independent structural components that can only be welded together to form a whole. Similarly, the second boss 2023 and the lower housing can be an integrally formed structure or two independent structural components that are welded together to form a whole.

[0175] In some embodiments, a first shielding area for shielding electromagnetic waves is provided on the upper surface of the circuit board 300. The area enclosed by the first shielding area is a first storage area. A first electronic device is provided in the first storage area to protect the first electronic device through electromagnetic shielding.

[0176] In some embodiments, the first shielding area includes a shielding member made of a metal material to provide electromagnetic shielding. The shielding member and the gold finger are both located at the second end of the circuit board 300, with the second end of the circuit board 300 located at the electrical port, i.e., the shielding member is close to the electrical port. The shielding member is disposed corresponding to the first boss 2012 and is connected to the first boss 2012 to form an electromagnetic shielding plate, thereby forming a relatively closed electromagnetic shielding cavity with the circuit board 300 and the upper housing 201 to achieve electromagnetic shielding. The electromagnetic shielding cavity shields electromagnetic waves, i.e., reduces the radiation of electromagnetic waves from the right side of the gold finger to the outside of the gold finger and the optical module, and also reduces the radiation of interference signals from the gold finger and the left side of the gold finger to the right side of the gold finger.

[0177] In some embodiments, the outer wall of the first shielding area is provided with a reflective area, and the reflective surface of the reflective area is non-planar (concave and / or convex) to increase the reflection loss by increasing the area of ​​the reflective surface. For example, the upper surface of the circuit board 300 is provided with a first reflective area near the end of the shielding member of the electrical port facing the gold finger. The reflective surface of the first reflective area is non-planar to increase the area of ​​the reflective surface of the shielding member and increase the incident angle of the interference signal, thereby increasing the reflection loss of the interference signal and further achieving electromagnetic shielding. That is, the first reflective area is provided at the end of the first shielding member facing the gold finger.

[0178] In some embodiments, a second shielding area for shielding electromagnetic waves is provided on the lower surface of the circuit board 300. The area enclosed by the second shielding area is a second storage area. A second electronic device is provided in the second storage area to protect the second electronic device through electromagnetic shielding.

[0179] It should be noted that the first electronic device and the second electronic device in this example may refer to an optical transmitting chip, an optical receiving chip, a circuit board, and other components on the circuit board.

[0180] In some embodiments, the second shielding area includes a shielding member made of a metal material to provide electromagnetic shielding. The shielding member and the gold finger are located at the second end of the circuit board 300, and the second end of the circuit board 300 is located at the electrical port, that is, the shielding member is close to the electrical port. The shielding member is disposed corresponding to the second boss 2023 and is connected to the second boss 2023 so that the shielding member and the second boss 2023 form an electromagnetic shielding plate, thereby forming a relatively closed electromagnetic shielding cavity with the circuit board 300 and the lower housing 202 to achieve electromagnetic shielding. The electromagnetic shielding cavity shields electromagnetic waves, that is, reduces the radiation of electromagnetic waves from the right side of the gold finger to the outside of the gold finger and the optical module, and also reduces the radiation of interference signals from the gold finger and the left side of the gold finger to the right side of the gold finger.

[0181] Shielding parts close to the electrical port are provided on the upper and lower surfaces of the circuit board to further reduce the electromagnetic signal radiation from the right side of the gold finger to the gold finger and the optical module, and further reduce the interference signal radiation from the gold finger and the left side of the gold finger to the right side of the gold finger.

[0182] In some embodiments, the outer wall of the second shielding area is provided with a reflective region, and the reflective surface of the reflective region is non-planar, thereby increasing reflection loss by increasing the area of ​​the reflective surface. For example, the lower surface of the circuit board 300 is provided with a second reflective region near the end of the shielding member of the electrical port facing the gold finger. The reflective surface of the second reflective region is non-planar, thereby increasing the area of ​​the reflective surface of the shielding member and the incident angle of the interference signal, thereby increasing the reflection loss of the interference signal and further achieving electromagnetic shielding. In other words, the second reflective region is provided at the end of the second shielding member facing the gold finger.

[0183] The shielding member located at the same end as the gold finger is provided with a reflective region on one end facing the corresponding gold finger. The reflective surface of the reflective region is non-planar, thereby increasing the area of ​​the reflective surface to reduce reflection loss. For example, the shielding member located at the second end of the circuit board 300 and the gold finger is provided with a reflective region on one end facing the corresponding gold finger. The reflective surface of the reflective region is non-planar.

[0184] In some embodiments, the length of the shielding member on the upper surface of the circuit board 300 matches the length of the first boss 2012, and the width of the shielding member on the upper surface of the circuit board 300 matches the width of the first boss 2012. This allows the shielding member on the upper surface of the circuit board 300 to match the first boss 2012, thereby forming a relatively complete (i.e., without gaps) electromagnetic shielding plate. Similarly, the shielding member on the lower surface of the circuit board 300 matches the second boss 2023.

[0185] In some embodiments, the first boss 2012 and the second boss 2023 are both connected to the circuit board 300 via a rubber strip, that is, one end of the rubber strip is connected to the first boss 2012 or the second boss 2023, and the other end of the rubber strip is connected to the circuit board 300.

[0186] The rubber strip is an elastic conductive rubber strip, which can not only form the first boss 2012 and the second boss 2023 and the corresponding shielding member into an electromagnetic shielding plate, but also reduce the wear of the first boss 2012 and the second boss 2023 and the corresponding shielding member.

[0187] Even after being shielded by the shielding element at the electrical port, interference signals outside the optical module can still radiate into the optical module through the optical port of the optical module, affecting the electronic components within the optical module. To address this issue, in some embodiments, the first shielding area further includes another shielding element made of a metal material to provide electromagnetic shielding. The shielding element is located at the first end of the circuit board 300, which is located at the optical port. This means that the shielding element is close to the optical port and shields electromagnetic waves radiated along the length of the circuit board. This reduces the amount of electromagnetic waves within the optical module that are radiated outside the optical module through the optical port, and also reduces the amount of interference signals outside the optical module that are radiated into the optical module through the optical port, thereby achieving electromagnetic shielding.

[0188] In some embodiments, a shielding member is provided on the lower surface of the circuit board 300, and the shielding member is made of metal material so that the shielding member has an electromagnetic shielding function; the shielding member is located at the first end of the circuit board 300, and the first end of the circuit board 300 is at the optical port, that is, the shielding member is close to the optical port, shielding the electromagnetic waves radiated along the length direction of the circuit board, that is, reducing the electromagnetic waves in the optical module from being radiated through the optical port to the outside of the optical module, and also reducing the interference signals outside the optical module from being radiated through the optical port to the inside of the optical module, thereby achieving electromagnetic shielding.

[0189] Both the upper and lower surfaces are provided with shielding parts close to the optical port, which further reduces the electromagnetic waves in the optical module from being radiated outside the optical module through the optical port, and also further reduces the interference signals outside the optical module from being radiated into the optical module through the optical port.

[0190] After the interference signals outside the optical module are shielded by the shielding components at the optical port and the shielding components at the electrical port, only a very small amount of interference signals enter the optical module, so they can no longer be considered. However, electromagnetic waves inside the circuit board will also radiate to the surface of the circuit board, acting as interference signals and affecting the electronic devices on the surface of the circuit board. In order to reduce the impact of interference signals inside the circuit board on the electronic devices on the upper surface of the circuit board, in some embodiments, the first shielding area also includes a first shielding component group. The first shielding component group is located on the upper surface of the circuit board 300 between the shielding component near the electrical port and the shielding component near the optical port. The first shielding component group includes at least one shielding component. For example, the first shielding component group includes a second shielding component; the first shielding component group includes a second shielding component and a third shielding component.

[0191] The shielding member and the first shielding member group on the upper surface of the circuit board 300 near the optical port form a relatively closed first storage area. The first electronic device is arranged in the first storage area to reduce the impact of external interference signals on the first electronic device and also reduce the radiation of electromagnetic waves by the first electronic device.

[0192] To reduce the impact of interference signals within the circuit board on electronic devices on the lower surface of the circuit board, in some embodiments, the second shielding area further includes a second shielding member group. The second shielding member group is located between the shielding member near the electrical port and the shielding member near the optical port on the lower surface of the circuit board 300. The second shielding member group includes at least one shielding member. For example, the second shielding member group includes a fifth shielding member; the second shielding member group includes a sixth shielding member; and the second shielding member group includes both the fifth and sixth shielding members.

[0193] The shielding member on the lower surface of the circuit board 300 near the optical port, the shielding member on the lower surface of the circuit board 300 near the electrical port, and the second shielding member group form a relatively closed second storage area. A second electronic device is arranged in the second storage area to reduce the impact of external interference signals on the second electronic device and also reduce the radiation of electromagnetic waves by the second electronic device.

[0194] In some embodiments, the circuit board 300 includes an upper surface layer and a lower surface layer, with an intermediate layer disposed between the upper and lower surface layers. The intermediate layer may be one or more layers, such that the circuit board 300 is a multilayer board. One side of the upper surface layer is the upper surface of the circuit board 300, and one side of the lower surface layer is the lower surface of the circuit board 300.

[0195] Figure 31 is a structural diagram of the upper surface layer of a circuit board according to some embodiments of the present disclosure. Figure 32 is a schematic diagram of electromagnetic wave shielding by the upper surface layer according to some embodiments of the present disclosure. Figure 33 is a schematic diagram of the reflection principle of the seventh shielding member according to some embodiments of the present disclosure. As shown in Figures 31, 32, and 33, in some embodiments, the circuit board 300 includes an upper surface layer 801, on which a seventh shielding member 811 is disposed. The seventh shielding member 811 is disposed corresponding to the first boss 2012 and connected to the first boss 2012, so that the seventh shielding member 811 and the first boss 2012 form an electromagnetic shielding plate, thereby forming a relatively closed electromagnetic shielding cavity between the circuit board 300 and the upper housing 201. This electromagnetic shielding cavity shields electromagnetic waves, reducing the radiation of electromagnetic waves from the right side of the gold finger to the outside of the gold finger and the optical module, and also reducing the radiation of interference signals from the gold finger and the left side of the gold finger to the right side of the gold finger, thereby achieving electromagnetic shielding.

[0196] In some embodiments, the seventh shielding member 811 is located at the second end of the upper surface layer 801, that is, the seventh shielding member 811 is located at the electrical port of the optical module to reduce the interference signal of the electrical port of the circuit board 300 from radiating to the middle area of ​​the circuit board 300, thereby reducing the interference signal from affecting the electronic devices in the middle area of ​​the circuit board 300.

[0197] In some embodiments, the seventh shielding member 811 is in the shape of an elongated strip, that is, the end of the seventh shielding member 811 facing the gold finger is a flat plate.

[0198] Figure 33a shows a reflection diagram for a seventh shielding member in the shape of a long strip. As shown in Figure 33a, the end of the seventh shielding member 811 facing the gold finger is a flat plate. The interference signal's incident angle on the flat plate is 0°, and the interference signal's reflection angle from the flat plate is also 0°, meaning the interference signal incident on the flat plate returns along its original path.

[0199] In some embodiments, a first reflection area 8111 is provided at one end of the seventh shielding member 811 facing the gold finger, and the reflection surface of the first reflection area 8111 is non-planar, so as to increase the area of ​​the reflection surface of the seventh shielding member 811 and increase the incident angle of the interference signal, thereby increasing the reflection loss of the interference signal and further realizing electromagnetic shielding.

[0200] The first reflective area 8111 may be concave or convex.

[0201] The number of the first reflective regions 8111 can be one or more. For example, the number of the first reflective regions 8111 is two, and the two first reflective regions 8111 are located at two ends of the seventh shielding member 811 .

[0202] Figure 33(b) is a reflection diagram where the first reflection area 8111 is a protrusion. As shown in Figure 33(b), the incident angles of the interference signal on the protrusion include 0° and other angles, and the reflection angles of the interference signal on the protrusion are 0° and other angles. That is, part of the interference signal incident on the protrusion returns along the original path, and part is reflected elsewhere. The first reflection area 8111 is a protrusion, which increases the area of ​​the reflective surface of the seventh shielding member 811 and the incident angle on the first reflection area 8111, thereby increasing the reflection loss of the interference signal and further achieving electromagnetic shielding.

[0203] Figure 33 c is a reflection diagram of the first reflection area 8111 being a recess. As shown in Figure 33 c, the incident angles of the interference signal incident on the recess include 0° and other angles, and the reflection angles of the interference signal in the recess are 0° and other angles, that is, part of the interference signal incident on the recess returns along the original path, and part is reflected to other places. The first reflection area 8111 is a recess, which increases the area of ​​the reflection surface of the seventh shielding component 811 and the incident angle of the interference signal on the first reflection area 8111, thereby increasing the reflection loss of the interference signal and further achieving electromagnetic shielding. The first reflection area 8111 is a recess, which not only achieves electromagnetic shielding, but also avoids circuit traces and electronic components around the first reflection area 8111 on the circuit board 300. For example, the first reflection area 8111 is a sawtooth-shaped recess.

[0204] To further enhance electromagnetic shielding effectiveness, in some embodiments, a seventh reflective region is also provided on the end of the first boss 2012 connected to the seventh shielding member 811 that faces the gold finger. The seventh reflective region is provided corresponding to the first reflective region 8111 and can be either concave or convex. For example, the seventh reflective region is a sawtooth-shaped concave region.

[0205] As shown in Figures 31 and 32, in some embodiments, the upper surface layer 801 is further provided with a first shielding member 814. The first shielding member 814 is made of a metal material to provide electromagnetic shielding. For example, the material of the first shielding member 814 is copper.

[0206] In some embodiments, the first shielding member 814 is located at the first end of the upper surface layer 801, that is, the first shielding member 814 is located at the optical port of the optical module to reduce the electromagnetic waves in the optical module from being radiated through the optical port to the outside of the optical module, and also reduce the interference signals outside the optical module from being radiated through the optical port to the circuit board 300 in the optical module, thereby reducing the interference signals from affecting the electronic devices and circuit traces in the middle area of ​​the circuit board 300.

[0207] In some embodiments, the first shielding member 814 includes a first shielding plate 8141, which is arranged along the width direction of the upper surface layer 801 to shield electromagnetic waves radiated along the length direction of the upper surface layer, that is, to block the interference signal from radiating from right to left along the length direction of the circuit board 300 (from the optical port to the middle of the circuit board 300), and also to block the electromagnetic signal from radiating from left to right along the length direction of the circuit board 300 (from) from one direction (the middle of the circuit board 300 to the optical port).

[0208] In some embodiments, the first shielding member 814 includes a first shielding plate 8141, a second shielding plate 8142, and a third shielding plate 8143. The first shielding plate 8141 is arranged along the width direction of the upper surface layer 801 to block the interference signal at the optical port from radiating to the middle area of ​​the circuit board 300 from one direction; the second shielding plate 8142 is arranged at one edge of the upper surface layer 801 along the length direction of the upper surface layer 801, and the third shielding plate 8143 is arranged at the other edge of the upper surface layer 801 along the length direction of the upper surface layer 801. One end of the first shielding plate 8141 is connected to the second shielding plate 8142, and the other end of the first shielding plate 8141 is connected to the third shielding plate 8143 to shield the electromagnetic waves radiated along the length direction of the upper surface layer and the electromagnetic waves radiated along the width direction of the upper surface layer, that is, to block the interference signal at the optical port from radiating to the middle area of ​​the circuit board 300 from multiple directions, and also to block the electromagnetic waves of the circuit board 300 from radiating to the optical port from multiple directions, thereby achieving multi-directional electromagnetic shielding.

[0209] In some embodiments, one end of the first shielding plate 8141 is connected to the second shielding plate 8142, and the other end of the first shielding plate 8141 is connected to the third shielding plate 8143. The second shielding plate 8142 and the third shielding plate 8143 are located on the same side of the first shielding plate 8141, thereby forming a U-shaped first shielding member 814. Specifically, the first shielding member 814 has a relief defect on both the end facing the gold finger and the end facing away from the gold finger. The relief recess on the end of the first shielding member 814 facing the gold finger is used to avoid circuit traces and electronic components on the circuit board 300. The relief recess on the end of the first shielding member 814 facing away from the gold finger not only avoids other components in the optical module but also increases reflection loss to achieve electromagnetic shielding.

[0210] In some embodiments, one end of the first shielding plate 8141 is connected to the center of the second shielding plate 8142, and the other end of the first shielding plate 8141 is connected to the center of the third shielding plate 8143, forming an H-shape. Specifically, the first shielding member 814 is provided with a relief recess on both the end facing the gold finger and the end facing away from the gold finger. The relief recess on the end of the first shielding member 814 facing the gold finger is used to provide clearance for circuit traces and electronic components on the circuit board 300. The relief recess on the end of the first shielding member 814 facing away from the gold finger not only provides clearance for other components in the optical module but also increases reflection loss to achieve electromagnetic shielding.

[0211] In some embodiments, the outer wall of the first shielding member 814 is provided with a fifth reflection area, and the reflection surface of the fifth reflection area is non-planar, so as to increase the reflection loss of the interference signal by increasing the area of ​​the reflection surface of the first shielding member 814 and increasing the incident angle of the interference signal. For example, the outer wall of one of the first shielding plate 8141, the second shielding plate 8142 and the third shielding plate 8143 is provided with the fifth reflection area, or the outer walls of two of the first shielding plate 8141, the second shielding plate 8142 and the third shielding plate 8143 are provided with the fifth reflection area, or the outer walls of all three shielding plates of the first shielding plate 8141, the second shielding plate 8142 and the third shielding plate 8143 are provided with the fifth reflection area, and the fifth reflection area is a serrated depression.

[0212] As shown in Figures 31 and 32, in some embodiments, the upper surface layer 801 is further provided with a second shielding member 813. The second shielding member 813 is made of a metal material to provide electromagnetic shielding. For example, the second shielding member 813 is made of copper.

[0213] In some embodiments, the second shielding member 813 includes a fourth shielding plate 8131 and a fifth shielding plate 8132. The fourth shielding plate 8131 is arranged at an edge of the upper surface layer 801 along the length direction of the upper surface layer 801 to shield the electromagnetic waves radiated along the width direction of the upper surface layer, that is, to block the interference signal radiated from the inner layer of the circuit board from being radiated from top to bottom along the width direction of the upper surface layer (from an edge of the upper surface layer 801 to the area between the fourth shielding plate 8131 and the fifth shielding plate 8132), and also to block the electromagnetic waves in the area between the fourth shielding plate 8131 and the fifth shielding plate 8132 from being radiated from bottom to top along the width direction of the upper surface layer (from the area between the fourth shielding plate 8131 and the fifth shielding plate 8132). the fourth shielding plate 8131 and the fifth shielding plate 8132 are blocked from radiating from bottom to top along the width direction of the upper surface layer (from the other edge of the upper surface layer 801 to the area between the fourth shielding plate 8131 and the fifth shielding plate 8132), and the electromagnetic waves in the area between the fourth shielding plate 8131 and the fifth shielding plate 8132 are blocked from radiating from top to bottom along the width direction of the upper surface layer (from the area between the fourth shielding plate 8131 and the fifth shielding plate 8132 to the other edge of the upper surface layer 801).

[0214] Electronic devices can be placed in the middle area of ​​the second shielding member 813 (i.e., the area between the fourth shielding plate 8131 and the fifth shielding plate 8132) to shield electromagnetic waves radiated along the width direction of the upper surface layer, thereby blocking interference signals from being radiated into the area between the fourth shielding plate 8131 and the fifth shielding plate 8132.

[0215] In some embodiments, the outer wall of the second shielding member 813 is provided with a fourth reflective region, and the reflective surface of the fourth reflective region is non-planar, so as to increase the reflection loss of the interference signal by increasing the area of ​​the reflective surface of the second shielding member 813 and increasing the incident angle of the interference signal. For example, the outer wall of the fourth shielding plate 8131 facing away from the fifth shielding plate 8132 is provided with the fourth reflective region, or the outer wall of the fifth shielding plate 8132 facing away from the fourth shielding plate 8131 is provided with the fourth reflective region, or the outer wall of the fourth shielding plate 8131 facing away from the fifth shielding plate 8132 and the outer wall of the fifth shielding plate 8132 facing away from the fourth shielding plate 8131 are both provided with the fourth reflective region.

[0216] In some embodiments, the fourth reflective region is a sawtooth-shaped depression.

[0217] In some embodiments, the fourth reflective region is an arc-shaped recess, which is an avoidance recess. The avoidance recess can not only achieve electromagnetic shielding but also avoid other components in the optical module.

[0218] As shown in Figures 31 and 32, in some embodiments, the upper surface layer 801 is further provided with a third shielding member 812. The third shielding member 812 is made of a metal material to provide electromagnetic shielding. For example, the third shielding member 812 is made of copper.

[0219] In some embodiments, the third shielding member 812 has an escape opening that faces away from the gold finger to avoid electronic devices on the upper surface layer 801. The existence of the escape opening makes the third shielding member 812 a U-shaped shielding member, which encloses a U-shaped area on the upper surface layer 801 for accommodating electronic devices.

[0220] In some embodiments, the outer sidewall of the third shielding member 812 is a flat plate.

[0221] In some embodiments, the outer wall of the third shield 812 is provided with a third reflective region 8124. The reflective surface of the third reflective region 8124 is non-planar, so as to increase the incident angle of the interference signal incident on the third reflective region 8124 and increase the reflection loss, thereby achieving electromagnetic shielding. For example, the third reflective region 8124 is located at the bottom of the U-shaped shield; or the third reflective region 8124 is located on one arm of the U-shaped shield; or the third reflective region 8124 is located on both arms of the U-shaped shield; or the third reflective region 8124 is located at the bottom of the U-shaped shield and on one arm of the U-shaped shield; or the third reflective region 8124 is located at the bottom of the U-shaped shield and on both arms of the U-shaped shield.

[0222] The third reflective region 8124 can be concave or convex. The concave shape of the third reflective region 8124 not only achieves electromagnetic shielding but also avoids the circuit traces and electronic components around the third reflective region 8124 on the circuit board 300. For example, the third reflective region 8124 is a sawtooth-shaped concave shape.

[0223] In some embodiments, the third shielding member 812 includes a sixth shielding plate 8121, a seventh shielding plate 8122 and an eighth shielding plate 8123. The sixth shielding plate 8121 is arranged along the width direction of the upper surface layer 801 to shield the electromagnetic waves radiated along the length direction of the upper surface layer, that is, to block the interference signal radiated from the inner layer of the circuit board from radiating from left to right along the length direction of the upper surface layer, and also to block the electromagnetic waves in the area enclosed by the third shielding member 812 from radiating from right to left along the length direction of the upper surface layer; the seventh shielding plate 8122 is arranged at an edge of the upper surface layer 801 along the length direction of the upper surface layer to shield the electromagnetic waves radiated along the width direction of the upper surface layer, that is, to block the interference signal radiated from the inner layer of the circuit board from radiating from top to bottom along the width direction of the upper surface layer, and also to block the electromagnetic waves in the area enclosed by the third shielding member 812 from radiating from top to bottom along the length direction of the upper surface layer. direction radiates from bottom to top; the eighth shielding plate 8123 is arranged at the other edge of the upper surface layer 801 along the length direction of the upper surface layer to shield the electromagnetic waves radiated along the width direction of the upper surface layer, that is, to block the interference signal radiated from the inner layer of the circuit board from radiating from bottom to top along the width direction of the upper surface layer, and also to block the electromagnetic waves in the area enclosed by the third shielding member 812 from radiating from top to bottom along the length direction of the upper surface layer; the seventh shielding plate 8122, the sixth shielding plate 8121 and the eighth shielding plate 8123 are connected in sequence to make the third shielding member 812 a U-shaped shielding member, and an electronic device is arranged in the middle of the U-shaped shielding member to shield the electromagnetic waves radiated along the width direction of the upper surface layer and the electromagnetic waves radiated along the length direction of the upper surface layer, thereby multi-directionally blocking the interference signal outside the third shielding member 812 from radiating to the electronic devices inside the third shielding member 812.

[0224] The first shielding member 814 includes a first shielding plate 8141 disposed along the width of the upper surface, the second shielding member 813 includes a fourth shielding plate 8131 and a fifth shielding plate 8132 disposed along the length of the upper surface, and the third shielding member 812 includes a sixth shielding plate 8121 disposed along the width of the upper surface, and a seventh shielding plate 8122 and an eighth shielding plate 8123 disposed along the length of the upper surface. The first shielding member 814, the second shielding member 813, and the third shielding member 812 form a relatively enclosed first storage area. A first electronic device is disposed within the first storage area to reduce the impact of external interference signals on the first electronic device and to reduce electromagnetic radiation emitted by the first electronic device. The first electronic device includes electronic devices in the central area of ​​the second shielding member 813 and electronic devices in the central area of ​​the third shielding member 812.

[0225] In some embodiments, the first shielding member 814 , the second shielding member 813 , and the third shielding member 812 are not connected, and the first shielding member 814 , the second shielding member 813 , and the third shielding member 812 form a relatively closed first storage area.

[0226] In some embodiments, the first shielding member 814 , the second shielding member 813 , and the third shielding member 812 are connected in sequence, and the first shielding member 814 , the second shielding member 813 , and the third shielding member 812 enclose a completely enclosed first storage area.

[0227] Figure 34 illustrates the structure of a first lower surface layer of a circuit board according to some embodiments of the present disclosure. Figure 35 illustrates the structure of a second lower surface layer of a circuit board according to some embodiments of the present disclosure. Figure 36 illustrates the structure of a third lower surface layer of a circuit board according to some embodiments of the present disclosure. As shown in Figures 34, 35, and 36, in some embodiments, the circuit board 300 includes a lower surface layer 802, which includes an eighth shielding member 821. The eighth shielding member 821 is positioned corresponding to the second boss 2023 and connected to the second boss 2023, so that the eighth shielding member 821 and the second boss 2023 form an electromagnetic shielding plate. This further forms a relatively enclosed electromagnetic shielding cavity between the circuit board 300 and the lower housing 202. This electromagnetic shielding cavity shields electromagnetic waves, reducing the radiation of electromagnetic waves from the right side of the gold finger to the outside of the gold finger and the optical module, and also reducing the radiation of interference signals from the gold finger and the left side of the gold finger to the right side of the gold finger, thereby achieving electromagnetic shielding.

[0228] In some embodiments, the eighth shielding member 821 is located at the second end of the lower surface layer 802, that is, the eighth shielding member 821 is located at the electrical port of the optical module to reduce the interference signal of the electrical port of the circuit board 300 from radiating to the middle area of ​​the circuit board 300, thereby reducing the interference signal from affecting the electronic devices and circuit wiring in the middle area of ​​the circuit board 300.

[0229] In some embodiments, the eighth shielding member 821 is in the shape of a long strip, that is, the end of the seventh shielding member 811 facing the gold finger is a flat plate.

[0230] In some embodiments, a second reflection area 8211 is provided at one end of the eighth shielding member 821 facing the gold finger, and the reflection surface of the second reflection area 8211 is non-planar, so as to increase the area of ​​the reflection surface of the eighth shielding member 821 and increase the incident angle of the interference signal, thereby increasing the reflection loss of the interference signal and further realizing electromagnetic shielding.

[0231] The second reflective region 8211 can be concave or convex. The first reflective region 8111 being concave not only achieves electromagnetic shielding but also avoids circuit traces and electronic components around the first reflective region 8111 on the circuit board 300. For example, the second reflective region 8211 is a sawtooth-shaped concave.

[0232] The number of the second reflective regions 8211 may be one or more. For example, the number of the second reflective regions 8211 is two, and the two second reflective regions 8211 are located at both ends of the eighth shielding member 821 .

[0233] To further enhance electromagnetic shielding effectiveness, in some embodiments, an eighth reflective region is also provided on the end of the second boss 2023 connected to the eighth shielding member 822 that faces the gold finger. The eighth reflective region is provided corresponding to the second reflective region 8211 and can be either a depression or a protrusion. For example, the eighth reflective region is a sawtooth-shaped depression.

[0234] As shown in Figures 34, 35, and 36, in some embodiments, the lower surface layer 802 is further provided with a fourth shielding member 824. The fourth shielding member 824 is made of a metal material to provide electromagnetic shielding. For example, the material of the fourth shielding member 824 is copper.

[0235] In some embodiments, the fourth shielding member 824 is located at the first end of the circuit board 300, that is, the fourth shielding member 824 is located at the optical port of the optical module to reduce the electromagnetic waves in the optical module from being radiated through the optical port to the outside of the optical module, and also reduce the interference signals outside the optical module from being radiated through the optical port to the circuit board 300 in the optical module, thereby reducing the interference signals from affecting the electronic devices and circuit traces in the middle area of ​​the circuit board 300.

[0236] In some embodiments, the fourth shielding member 824 includes a ninth shielding plate 8241, which is arranged along the width direction of the lower surface layer 802 to shield the electromagnetic waves radiated along the length direction of the lower surface layer, that is, to block the interference signal from being radiated from right to left along the length direction of the circuit board 300 (from the optical port to the middle of the circuit board 300), and also to block the electromagnetic signal from being radiated from left to right along the length direction of the circuit board 300 (from) from one direction (the middle of the circuit board 300 to the optical port).

[0237] In some embodiments, the fourth shielding member 824 includes a ninth shielding plate 8241, a tenth shielding plate 8242, and an eleventh shielding plate 8243. The ninth shielding plate 8241 is arranged along the width direction of the lower surface layer 802 to block the interference signal at the optical port from radiating to the middle area of ​​the circuit board 300 from one direction; the tenth shielding plate 8242 and the eleventh shielding plate 8243 are arranged at the edge of the lower surface layer 802 along the length direction of the lower surface layer 802. The tenth shielding plate 8242, the ninth shielding plate 8241, and the eleventh shielding plate 8243 are connected in sequence to shield the electromagnetic waves radiated along the length direction of the lower surface layer and the electromagnetic waves radiated along the width direction of the lower surface layer, that is, to block the interference signal at the optical port from radiating to the middle area of ​​the circuit board 300 from multiple directions, and also to block the electromagnetic waves of the circuit board 300 from radiating to the optical port from multiple directions, thereby achieving electromagnetic shielding in multiple directions.

[0238] The tenth shielding plate 8242, the ninth shielding plate 8241, and the eleventh shielding plate 8243 are sequentially connected so that the end of the fourth shielding member 824 facing away from the gold finger is provided with a relief recess. The relief recess at the end of the fourth shielding member 824 facing away from the gold finger not only serves to avoid other components in the optical module but also serves to increase reflection loss, thereby reducing interference signals radiated into the central area of ​​the circuit board 300.

[0239] As shown in Figures 35 and 36 , in some embodiments, the left side of the fourth shielding member 824 does not require wiring or electronic components. A ninth shielding member 825 is further provided on the lower surface layer 802. The ninth shielding member 825 is located to the left of the fourth shielding member 824 and is made of a metal material to provide electromagnetic shielding. For example, the ninth shielding member 825 is made of copper.

[0240] The shape of the ninth shielding member 825 can be adjusted as needed.

[0241] As shown in FIG. 35 , there is a gap between the ninth shielding member 825 and the fourth shielding member 824 .

[0242] As shown in FIG. 36 , the ninth shielding member 825 is connected to the fourth shielding member 824 , so that the fourth shielding member 824 and the ninth shielding member 825 form an overall shielding member 826 .

[0243] As shown in Figures 34, 35, and 36, in some embodiments, the lower surface layer 802 is further provided with a fifth shielding member 823. The fifth shielding member 823 is made of a metal material to provide electromagnetic shielding. For example, the material of the fifth shielding member 823 is copper.

[0244] In some embodiments, the fifth shielding member 823 includes a twelfth shielding plate 8231, a thirteenth shielding plate 8232, a fourteenth shielding plate 8233 and a fifteenth shielding plate 8234. The twelfth shielding plate 8231 and the thirteenth shielding plate 8232 are arranged at an edge of the lower surface layer 802 along the length direction of the lower surface layer 802 to shield the electromagnetic waves radiated along the width direction of the lower surface layer, that is, to block the interference signal radiated from the inner layer of the circuit board from being radiated from top to bottom along the width direction of the lower surface layer (from one edge of the lower surface layer 802 to the middle area of ​​the fifth shielding member 823), and also to block the electromagnetic waves in the middle area of ​​the fifth shielding member 823 from being radiated from bottom to top along the width direction of the lower surface layer. (radiated from the middle area of ​​the fifth shielding component 823 to one edge of the lower surface layer 802); the fourteenth shielding plate 8233 and the fifteenth shielding plate 8234 are arranged at the other edge of the lower surface layer 802 along the length direction of the lower surface layer 802 to shield the electromagnetic waves radiated along the width direction of the lower surface layer, that is, to block the interference signal radiated from the inner layer of the circuit board from radiating from bottom to top along the width direction of the lower surface layer (from the other edge of the lower surface layer 802 to the middle area of ​​the fifth shielding component 823), and also to block the electromagnetic waves in the middle area of ​​the fifth shielding component 823 from radiating from top to bottom along the width direction of the lower surface layer (from the middle area of ​​the fifth shielding component 823 to the other edge of the lower surface layer 802).

[0245] In some embodiments, there is a gap between the twelfth shielding plate 8231 and the thirteenth shielding plate 8232 to avoid circuit traces and electronic devices in the gap.

[0246] In some embodiments, the twelfth shielding plate 8231 and the thirteenth shielding plate 8232 are connected to enhance the electromagnetic shielding effect.

[0247] In some embodiments, there is a gap between the fourteenth shielding plate 8233 and the fifteenth shielding plate 8234 to avoid circuit traces and electronic devices in the gap.

[0248] In some embodiments, the fourteenth shielding plate 8233 and the fifteenth shielding plate 8234 are connected to enhance the electromagnetic shielding effect.

[0249] In some embodiments, the shielding plates at different edges of the lower surface layer 802 are not connected, that is, there are gaps between the shielding plates at different edges of the lower surface layer 802 to avoid circuit traces and electronic devices in the gaps.

[0250] As shown in Figures 34, 35, and 36, in some embodiments, the lower surface layer 802 is further provided with a sixth shielding member 822. The sixth shielding member 822 is made of a metal material to provide electromagnetic shielding. For example, the sixth shielding member 822 is made of copper.

[0251] In some embodiments, the outer sidewall of the sixth shielding member 822 is a flat plate.

[0252] In some embodiments, a sixth reflection area is provided on the outer wall of the sixth shielding member 822, and the reflection surface of the sixth reflection area is non-planar, so that the incident angle of the interference signal incident to the sixth reflection area is increased, and the reflection loss is also increased, thereby achieving electromagnetic shielding.

[0253] The sixth reflective region can be concave or convex. The sixth reflective region being concave not only achieves electromagnetic shielding but also avoids circuit traces and electronic components around the sixth reflective region on the circuit board 300. For example, the sixth reflective region is a sawtooth-shaped concave.

[0254] In some embodiments, the sixth shielding member 822 includes a sixteenth shielding plate 8221 and a seventeenth shielding plate 8222. The sixteenth shielding plate 8221 is arranged at an edge of the lower surface layer 802 along the length direction of the lower surface layer 802 to shield the electromagnetic waves radiated along the width direction of the lower surface layer, that is, to block the interference signal radiated from the inner layer of the circuit board from being radiated from top to bottom along the width direction of the lower surface layer (from an edge of the lower surface layer 802 to the middle area of ​​the sixth shielding member 822), and also to block the electromagnetic waves in the middle area of ​​the sixth shielding member 822 from being radiated from bottom to top along the width direction of the lower surface layer (from the edge of the sixth shielding member 822). The middle area of ​​the sixth shielding component 822 radiates to one edge of the lower surface layer 802); the seventeenth shielding plate 8222 is arranged at the other edge of the lower surface layer 802 along the length direction of the lower surface layer 802 to shield the electromagnetic waves radiated along the width direction of the lower surface layer, that is, to block the interference signal radiated from the inner layer of the circuit board from being radiated from bottom to top along the width direction of the lower surface layer (from the other edge of the lower surface layer 802 to the middle area of ​​the sixth shielding component 822), and also to block the electromagnetic waves in the middle area of ​​the sixth shielding component 822 from being radiated from top to bottom along the width direction of the lower surface layer (from the middle area of ​​the sixth shielding component 822 to the other edge of the lower surface layer 802).

[0255] The area between the sixteenth shielding plate 8221 and the seventeenth shielding plate 8222 is provided with electronic components to shield electromagnetic waves radiated along the width direction of the lower surface layer, thereby preventing interference signals from radiating into the area between the sixteenth shielding plate 8221 and the seventeenth shielding plate 8222 .

[0256] In order to avoid electronic devices in the area between the sixteenth shielding plate 8221 and the seventeenth shielding plate 8222 , in some embodiments, the inner sidewalls of the sixteenth shielding plate 8221 and the seventeenth shielding plate 8222 are both provided with avoidance recesses.

[0257] The fourth shielding member 824 includes a ninth shielding plate 8241 disposed along the width of the lower surface layer. The fifth shielding member 823 includes a twelfth shielding plate 8231, a thirteenth shielding plate 8232, a fourteenth shielding plate 8233, and a fifteenth shielding plate 8234 disposed along the length of the lower surface layer. The sixth shielding member 822 includes a sixteenth shielding plate 8221 and a seventeenth shielding plate 8222 disposed along the width of the upper surface layer. Thus, the fourth, fifth, and sixth shielding members 824, 823, and 822 form a relatively enclosed second storage area. A second electronic device is disposed within the second storage area to reduce the impact of external interference signals on the second electronic device and to reduce electromagnetic radiation emitted by the second electronic device. The second electronic device includes electronic devices in the central area of ​​the fifth shielding member 823 and electronic devices in the central area of ​​the sixth shielding member 822.

[0258] In some embodiments, the fourth shield 824 , the fifth shield 823 , and the sixth shield 822 are not connected.

[0259] In some embodiments, the fourth shield 824 , the fifth shield 823 , and the sixth shield 822 are connected.

[0260] In some embodiments, an optical module includes a circuit board, the circuit board including an upper surface layer, the edge of the upper surface layer being provided with a first shielding area for shielding electromagnetic waves. The area enclosed by the first shielding area constitutes a first storage area, and a first electronic device is disposed within the first storage area to protect the first electronic device. An outer wall of the first shielding area is provided with a reflective area, wherein the reflective surface of the reflective area is non-planar, thereby increasing reflection loss by increasing the reflective area, thereby further protecting the first electronic device. The first shielding area includes a first shielding member, a second shielding member, and a third shielding member. The first shielding member is located at a first end of the upper surface layer, the third shielding member is closer to a second end of the upper surface layer relative to the first shielding member, and the second shielding member is located between the first and third shielding members. The first shielding member includes a shielding plate disposed along the width of the upper surface layer, the second shielding member includes a shielding plate disposed along the length of the upper surface layer, and the third shielding member includes a shielding plate disposed along the length of the upper surface layer and a shielding plate disposed along the width of the upper surface layer, so that the first shielding area formed by the first, second, and third shielding members forms a relatively closed shielding area, thereby surrounding the first electronic device.

[0261] In some embodiments, a first shielding area composed of a first shielding member, a second shielding member, and a third shielding member surrounds the first electronic device to achieve electromagnetic shielding to protect the first electronic device; the outer wall of the first shielding area is provided with a reflective area, and the reflective surface of the reflective area is non-planar to increase the reflection loss by increasing the reflection area, thereby further protecting the first electronic device.

[0262] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present disclosure.

Claims

1. An optical module, comprising: Circuit boards; An optical transceiver component is fixed on the circuit board; wherein the optical transceiver component comprises a lens assembly, an optical fiber bracket, a positioning column and an optical emission chip, the optical fiber bracket has a first positioning hole, a second lens and a second positioning hole are arranged on a side of the lens assembly facing the optical fiber bracket, the second positioning hole is located on one side of the second lens, the positioning column is fixed to the second positioning hole and the first positioning hole, the second lens is plated with an anti-reflection film, and the surface where the second lens is located is flush with or protrudes from a side of the lens assembly facing the optical fiber bracket; the optical emission chip is electrically connected to the circuit board and is configured to generate an optical signal; The heating device is disposed at the side of the light emitting chip or below the light emitting chip and is configured to generate heat to maintain the operating temperature of the light emitting chip.

2. The optical module according to claim 1, wherein: The lens assembly or the optical fiber holder is provided with a first limiting boss, the lens assembly and the optical fiber holder are connected in a limiting manner via the first limiting boss, and there is a gap between the second lens and the end face of the optical fiber holder carrying the optical fiber.

3. The optical module according to claim 2, wherein: The surface where the second lens is located protrudes outward relative to a surface of the lens assembly facing the optical fiber support.

4. The optical module according to claim 2, wherein: A first limiting boss is provided on the edge of a side of the lens assembly facing the optical fiber holder, the first limiting boss is located on the side of the second positioning hole away from the second lens, and the first limiting boss extends downward from the upper surface of the lens assembly to the lower surface of the lens assembly; a second limiting boss is provided on the side of the first limiting boss facing the optical fiber holder, the second limiting boss and the first limiting boss form a limiting notch; the optical fiber holder is clamped at the limiting notch.

5. The optical module according to claim 2, wherein: A first limiting boss is provided on the edge of a side of the lens assembly facing the optical fiber bracket, and the first limiting boss is located on the side of the second positioning hole away from the second lens. The first limiting boss includes a first limiting boss portion and a second limiting boss portion, the first limiting boss portion extends downward from the upper surface of the lens assembly, and the second limiting boss portion extends upward from the lower surface of the lens assembly, and the first limiting boss portion and the second limiting boss portion are arranged opposite to each other and have a preset spacing.

6. The optical module according to claim 2, wherein: A first limiting boss is arranged on the edge of a side of the optical fiber holder facing the lens assembly, and the first limiting boss extends downward from the upper surface of the optical fiber holder to the lower surface of the optical fiber holder; a second limiting boss is arranged on the side of the first limiting boss facing the lens assembly, and the second limiting boss and the first limiting boss form a limiting notch; the lens assembly is clamped at the limiting notch.

7. The optical module according to claim 2, wherein: A light port groove is provided on the side of the lens assembly facing away from the circuit board, a storage recess is provided behind the light port groove, a positioning column and a sealing colloid are placed in the storage recess, the gap between the positioning column and the storage recess is filled with sealing colloid, and the gap between the positioning column and the second positioning hole is also filled with sealing colloid.

8. The optical module according to claim 7, wherein: The storage recess includes a storage groove, a glue dispensing groove and a glue isolation boss. The storage groove is connected to the second positioning hole. The positioning column is fixed to the storage groove and the second positioning column. The glue dispensing groove is located on one side of the storage groove. The height of the glue dispensing groove is higher than the height of the storage groove. The glue isolation boss is located between the two storage grooves. The height of the glue isolation boss is higher than the height of the glue dispensing groove.

9. The optical module according to claim 7, wherein: The second lens is fixed to the lens assembly via a supporting boss.

10. The optical module according to claim 9, wherein: The thickness of the supporting boss is greater than or equal to zero.

11. The optical module according to claim 1, wherein: The heating device includes a substrate, on which a heating layer, a first solder pad and a second solder pad are arranged, one end of the heating layer is connected to the first solder pad, the other end of the heating layer is connected to the second solder pad, and the heating layer extends from one end of the light emitting chip to the other end of the light emitting chip; the first solder pad and the second solder pad are electrically connected to the circuit board.

12. The optical module according to claim 11, wherein: The optical transceiver component further includes a driver, which is electrically connected to the circuit board and located at the side of the optical emitting chip, and the driver is electrically connected to the optical emitting chip; The bottom of the lens assembly is connected to the circuit board and covers the light emitting chip. The lens assembly is configured to change the transmission direction of the optical signal generated by the light emitting chip.

13. The optical module according to claim 12, wherein: The light emitting chip includes a first light emitting chip and a second light emitting chip, and the driver includes a first driver and a second driver; The top surface of the first light emitting chip is higher than the top surface of the circuit board, and the first light emitting chip is connected to the first driver by wire bonding; A first through hole is provided on the circuit board, a first supporting block is provided in the first through hole, the top support of the first supporting block connects the heating device and the first light emitting chip; the first supporting block is connected to the circuit board by glue, and the bottom of the first supporting block has a preset distance from the housing of the optical module.

14. The optical module according to claim 13, wherein: The first driver is arranged on a side of the first through hole; A supporting area is arranged on the top of the substrate, and the heating layer is arranged on the edge of the top of the substrate, located on the side of the supporting area away from the first driver; the bottom of the light emitting chip is connected to the supporting area.

15. The optical module according to claim 13, wherein: The first driver is arranged on a side of the first through hole; The bottom of the first light emitting chip is connected to the top of the substrate, and the first pad and the second pad are arranged on the top of the substrate and located at a side of the first light emitting chip away from the first driver; The heat generating layer is arranged on a side of the substrate away from the first driver.

16. The optical module according to claim 14, wherein: The first support block comprises a support portion and a connection portion, the support portion is located in the first through hole, the top of the support portion supports and connects the heating device, the bottom of the support portion is connected to the top of the connection portion, and the connection portion supports the support portion; The connecting portion is connected to the circuit board so that the supporting portion is located in the first through hole.

17. The optical module according to claim 13, wherein: The lens assembly includes a first lens assembly and a second lens assembly; The heating device includes a first heating device and a second heating device. The second heating device is disposed below the second light emitting chip and is used to generate heat to increase the operating temperature of the second light emitting chip.

18. The optical module according to claim 17, wherein: A second through hole is arranged on the circuit board, a second supporting block is arranged below the second heating device, and the second supporting block is embedded and connected to the second through hole.

19. The optical module according to claim 18, wherein: The second supporting block comprises a supporting portion and a connecting portion, the bottom of the supporting portion is connected to the top of the connecting portion, and the connecting portion supports the supporting portion; The connecting portion is connected to the circuit board so that the supporting portion is embedded in the second through hole.

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