Optical module heat dissipation system based on TEC and liquid cooling heat dissipation and control method thereof

Abstract

The invention discloses an optical module heat dissipation system based on TEC and liquid cooling heat dissipation and a control method thereof, the optical module heat dissipation system based on TEC and liquid cooling heat dissipation comprises a thermoelectric refrigeration module, a liquid cooling heat dissipation module, a temperature sensor and a main control circuit, and the main control circuit is connected with the thermoelectric refrigeration module, the liquid cooling heat dissipation module and the temperature sensor. The thermoelectric cooling module and the liquid cooling heat dissipation module are combined to form a composite heat dissipation structure, the cold end of the thermoelectric cooling module is directly contacted with the high-power optical module for efficient absorption, and then the liquid cooling heat dissipation module is used for rapidly guiding out heat of the hot end of the thermoelectric cooling module, so that the shell temperature of the high-power optical module is accurately controlled, the heat dissipation efficiency is improved, and the service life of the high-power optical module is prolonged. And the overall size, the power consumption and the noise are reduced, so that the high-power optical module can stably operate in an extreme environment.

Description

Technical Field

[0001] The present invention relates to the field of optical communication technology, and in particular to an optical module heat dissipation system based on TEC and liquid cooling and a control method thereof. Background Art

[0002] With the continuous development of 5G, data centers, and cloud computing technologies, the power density of high-speed optical modules continues to increase. This high-power operation causes localized heating, which impacts system stability. Traditional heat dissipation devices can be implemented using air cooling or water chillers, but air cooling is inefficient, and water chillers are bulky and have insufficient cooling rates, making it difficult to meet the temperature control requirements in extreme environments ranging from -40°C to 85°C. While existing thermoelectric coolers can achieve precise temperature control, a single thermoelectric cooler suffers from insufficient heat dissipation efficiency at the hot end in high-power scenarios. Liquid cooling systems, while offering high thermal conductivity, are complex and consume high power, making it difficult to achieve both efficient heat dissipation and precise temperature control. Summary of the Invention

[0003] The main purpose of the present invention is to provide an optical module heat dissipation system based on TEC and liquid cooling, aiming to solve the problem that existing heat dissipation devices are difficult to achieve both efficient heat dissipation and precise temperature control requirements.

[0004] To achieve the above objectives, the present invention proposes an optical module heat dissipation system based on TEC and liquid cooling, the optical module heat dissipation system based on TEC and liquid cooling comprising: Thermoelectric cooling module and liquid cooling module; A temperature sensor is provided on the housing of the high-power optical module, and is used to collect the housing temperature of the high-power optical module and output a corresponding temperature collection signal; A main control circuit, wherein the input end of the main control circuit is connected to the temperature sensor, and the control end of the main control circuit is connected to the thermoelectric cooling module and the liquid cooling heat dissipation module. The main control circuit is used to control the operation of the thermoelectric cooling module and the liquid cooling heat dissipation module according to the temperature acquisition signal to regulate the shell temperature of the high-power optical module.

[0005] In one embodiment, the cold end of the thermoelectric cooling module is attached to the surface of the high-power optical module via a heat conductor, the hot end of the thermoelectric cooling module is connected to a cold plate, and the liquid cooling heat dissipation module includes a centrifugal pump, which is used to drive the coolant to circulate in the cold plate; The main control circuit is used to control the thermoelectric refrigeration module to switch the working current direction to the heating mode and control the speed of the centrifugal pump to the first speed when the shell temperature value corresponding to the temperature acquisition signal is lower than the first preset temperature value; when the shell temperature value corresponding to the temperature acquisition signal is higher than the second preset temperature value, control the working current of the thermoelectric refrigeration module and switch the working current direction to the strong cooling mode, and control the speed of the centrifugal pump to the second speed.

[0006] In one embodiment, the heat conducting member is thermal grease.

[0007] In one embodiment, fins are provided on the cold plate, and the height of the fins is 3 mm.

[0008] In one embodiment, the cold plate comprises a parallel bidirectional microchannel cold plate.

[0009] In one embodiment, the cold plate comprises a serpentine dual-inlet cold plate.

[0010] The present invention also proposes a control method for an optical module heat dissipation system based on TEC and liquid cooling, which is applied to the above-mentioned optical module heat dissipation system based on TEC and liquid cooling. The control method for the optical module heat dissipation system based on TEC and liquid cooling includes the following steps: Collect the shell temperature of high-power optical modules; The operation of the thermoelectric refrigeration module and the liquid cooling heat dissipation module is controlled according to the shell temperature value to regulate the shell temperature of the high-power optical module.

[0011] Furthermore, the step of controlling the operation of the thermoelectric cooling module and the liquid cooling heat dissipation module according to the shell temperature value to regulate the shell temperature of the high-power optical module is specifically as follows: When the shell temperature is lower than a first preset temperature, the thermoelectric cooling module is controlled to switch the working current direction to a heating mode, and the speed of the centrifugal pump is controlled to be a first speed; When the shell temperature is higher than a second preset temperature, the operating current of the thermoelectric cooling module is controlled and the direction of the operating current is switched to a strong cooling mode, and the rotation speed of the centrifugal pump is controlled to be a second rotation speed.

[0012] The technical solution of the present invention combines a thermoelectric cooling module and a liquid cooling heat dissipation module to form a composite heat dissipation structure. The cold end of the thermoelectric cooling module first directly contacts the high-power optical module for efficient absorption, and then the heat from the hot end of the thermoelectric cooling module is quickly conducted away through the liquid cooling heat dissipation module, thereby achieving precise control of the shell temperature of the high-power optical module, improving heat dissipation efficiency, and reducing overall volume, power consumption and noise, to ensure that the high-power optical module can operate stably in extreme environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1This is an overall block diagram of the optical module heat dissipation system based on TEC and liquid cooling of the present invention; Figure 2 A three-dimensional thermal simulation top view of an optical module of the optical module heat dissipation system based on TEC and liquid cooling according to the present invention; Figure 3 A three-dimensional thermal simulation side view of an optical module of the optical module heat dissipation system based on TEC and liquid cooling according to the present invention; Figure 4 A three-dimensional thermal simulation bottom view of an optical module of the optical module heat dissipation system based on TEC and liquid cooling according to the present invention; Figure 5 Schematic diagram of the process of the optical module heat dissipation system method based on TEC and liquid cooling of the present invention; In the figure: 10-temperature sensor, 20-main control circuit, 30-thermoelectric cooling module, 40-liquid cooling module. DETAILED DESCRIPTION

[0014] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings of the embodiments of the present invention. It should be understood that the described embodiments are only a portion of the embodiments of the present invention, not all of them. Generally, the components of the embodiments of the present invention described and illustrated in the drawings herein may be arranged and designed in a variety of different configurations.

[0015] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort shall fall within the scope of protection of the present invention.

[0016] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0017] In the description of the present invention, it should be understood that the terms "upper", "lower", "inside", "outside", "left", "right", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the inventive product is conventionally placed when in use, or are the orientations or positional relationships conventionally understood by those skilled in the art. These are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0018] Furthermore, the terms “first”, “second”, etc. are merely used for distinguishing descriptions and should not be understood as indicating or implying relative importance.

[0019] In the description of the present invention, it should also be noted that, unless otherwise expressly specified or limited, terms such as "disposed" and "connected" should be understood in a broad sense. For example, "connected" can mean a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can also mean internal communication between two components. Those skilled in the art will be able to understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0020] Traditional heat dissipation devices use air cooling or water cooling machines, but air cooling has low efficiency, and water cooling machines are bulky and have insufficient cooling rate, making it difficult to meet temperature control requirements in extreme environments of -40℃~85℃; although existing thermoelectric coolers can achieve precise temperature control, a single thermoelectric cooler has the problem of insufficient heat dissipation efficiency at the hot end in high-power scenarios; although liquid cooling systems have high thermal conductivity, their structure is complex and power consumption is high, making it difficult to take into account the needs of efficient heat dissipation and precise temperature control.

[0021] In order to solve the above problems, the present invention proposes an optical module heat dissipation system based on TEC and liquid cooling. The specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0022] like Figure 1-5 As shown in the figure, the optical module heat dissipation system based on TEC and liquid cooling includes: Thermoelectric cooling module 30 and liquid cooling heat dissipation module 40; The temperature sensor 10 is provided on the housing of the high-power optical module. The temperature sensor 10 is used to collect the housing temperature of the high-power optical module and output a corresponding temperature collection signal. The main control circuit 20 has an input end connected to the temperature sensor 10, and a control end connected to the thermoelectric cooling module 30 and the liquid cooling heat dissipation module 40. The main control circuit 20 is used to control the operation of the thermoelectric cooling module 30 and the liquid cooling heat dissipation module 40 according to the temperature acquisition signal to regulate the shell temperature of the high-power optical module.

[0023] In one embodiment, the cold end of the thermoelectric cooling module 30 is attached to the surface of the high-power optical module through a heat conductor, and the hot end of the thermoelectric cooling module 30 is connected to a cold plate. The liquid cooling heat dissipation module 40 includes a centrifugal pump, which is used to drive the coolant to circulate in the cold plate. The main control circuit 20 is used to control the thermoelectric cooling module 30 to switch the working current direction to the heating mode and control the speed of the centrifugal pump to the first speed when the shell temperature value corresponding to the temperature acquisition signal is lower than the first preset temperature value; when the shell temperature value corresponding to the temperature acquisition signal is higher than the second preset temperature value, control the working current size of the thermoelectric cooling module 30 and switch the working current direction to the strong cooling mode, and control the speed of the centrifugal pump to the second speed.

[0024] In one embodiment, the heat conducting member is thermal grease.

[0025] In one embodiment, fins are provided on the cold plate, and the height of the fins is 3 mm.

[0026] In one embodiment, the cold plate comprises a parallel bidirectional microchannel cold plate.

[0027] In one embodiment, the cold plate comprises a serpentine dual-inlet cold plate.

[0028] In this embodiment, the optical module heat dissipation system based on TEC and liquid cooling is provided with a magnetic module interface. The optical module can be quickly positioned through the magnetic structure, which improves replacement efficiency and enhances compatibility. The temperature sensor 10 can be implemented using any temperature sensor 10 that can collect the shell temperature of the optical module, such as a thermistor or a thermocouple. The main control circuit 20 can use an MCU, a DSP (Digital Signal Process), an FPGA (Field Programmable Gate Array), a SOC (System On Chip), etc.

[0029] In this embodiment, the thermoelectric cooling module 30 can be implemented by using four groups of semiconductor cooling plates. The cold end is in direct contact with the surface of the high-power optical module through a heat conductor, with a contact resistance of ≤0.1K·cm² / W. The cold end size is 15×15mm, and the hot end is tightly fitted with the cold plate. It uses the Seebeck effect to absorb the heat generated by the operation of the optical module, that is, the temperature difference between the hot end and the cold end is achieved by applying an external current. When the current flows through the semiconductor cooling plate, the cold end absorbs heat and the hot end releases heat, thereby achieving temperature control. In this embodiment, a special clamp is used to fix the high-power optical module and the thermoelectric cooling module 30, and the contact area is customized according to the actual package. For example, the contact area of the QSFP-DD package is 4~6cm², and the contact area of the QSFP-28 package is 2~3cm². The heat conductor can be implemented by thermal grease or thermal gasket to reduce thermal contact impedance and improve heat transfer efficiency.

[0030] In this embodiment, the liquid cooling heat dissipation module 40 drives the coolant to circulate in the cold plate through a centrifugal pump for cooling; wherein, the cold plate can be implemented by a parallel bidirectional microchannel or a serpentine double inlet structure to reduce the pressure drop by 40%, the cold plate width is 0.5~1mm, and the centrifugal pump flow rate is 1150L / h; fins are provided on the cold plate, and the height of the fin structure is 3mm. Compared with the fin structure with a height of 2mm, the heat dissipation efficiency is increased by 15% when the fin with a height of 3mm is used in this application, and the surface temperature uniformity of the optical module is reduced to ±1°C; the coolant can be deionized water or fluorinated liquid FC-40; the coolant is placed in a liquid cooling pipe, and the liquid cooling pipe can adopt a bionic fractal flow channel to increase the heat transfer coefficient by more than 20%.

[0031] In this embodiment, a composite heat dissipation structure is formed by combining a thermoelectric cooling module 30 and a liquid cooling heat dissipation module 40. The main control circuit 20 controls the thermoelectric cooling module 30 and the liquid cooling heat dissipation module 40 according to the temperature acquisition signal. Specifically, when the shell temperature value corresponding to the temperature acquisition signal is lower than the first preset temperature value, the thermoelectric cooling module 30 is controlled to switch the working current direction to the heating mode, and the speed of the centrifugal pump is controlled to the first speed; when the shell temperature value corresponding to the temperature acquisition signal is higher than the second preset temperature value, the working current of the thermoelectric cooling module 30 is controlled and the working current direction is switched to the strong cooling mode, and the speed of the centrifugal pump is controlled to the second speed. Mode switching and precise temperature control are achieved through the composite heat dissipation structure. Among them, the first preset temperature value, the second preset temperature value, the first speed and the second speed can be set according to actual conditions, and the number of thermoelectric cooling modules 30, the cold plate contact area, the coolant flow rate, etc. need to be considered; it can be understood that in this embodiment, the optimal parameter combination is determined by orthogonal test optimization. If the optical module adopts QSFP-DD packaging and the thermoelectric cooling module 30 adopts two sets of semiconductor cooling chips, the first preset temperature value can be determined to be 0°C and the second preset temperature value can be determined to be 65°C; when the shell temperature is between 0 and 65°C, the flow rate of the centrifugal pump is 0.6L / m in; when the shell temperature is 90°C, which is higher than 65°C, the working current direction is switched, the strong cooling mode is started, the working current of the thermoelectric cooling module 30 is increased to 120%* the current rating, and the speed of the centrifugal pump is controlled to increase to 0.8L / min; when the shell temperature is -15°C, which is lower than 0°C, the thermoelectric cooling module 30 is controlled to switch the working current direction, the heating mode is started, and the speed of the centrifugal pump is controlled to decrease to 0.3L / min; This embodiment constructs a three-dimensional thermal simulation model including a thermoelectric cooling module 30, a cold plate flow channel, and a 400G QSFP-DD optical module based on Flotherm software. Through finite element analysis, the layout spacing of the thermoelectric cooling module 30 is optimized to be ≤2mm, the cold plate fin structure height is 2~3mm, and the coolant flow rate is 0.3~0.8L / min. The uniformity of the temperature field distribution is improved by 30%. The top view, side view, and bottom view of the three-dimensional thermal simulation are shown as follows: Figure 2 、 Figure 3 、 Figure 4 As shown, the surface temperature distribution and heat flow path of the optical module are displayed.

[0032] It should be noted that the calculation formula for the cooling capacity of the thermoelectric cooling module 30 is: , where N is the number of thermocouple pairs, α is the Seebeck coefficient, in V / °C, I is the operating current, in A, Tc is the cooling end temperature of the thermoelectric cooling module 30, in °C, ρ is the resistivity of the thermoelectric cooling module 30, in Ω·cm, G is the geometric coefficient of the thermoelectric cooling module, i.e., the ratio of the cross-sectional area to the height of the thermoelectric cooling module 30, in cm, k is the thermal conductivity of the thermocouple pair, in W.cm-¹·K-1, △T is the temperature difference between the hot and cold ends of the thermoelectric cooling module 30, in °C; the heat dissipation calculation formula of the liquid cooling module 40 is: Wherein, Q is the heat dissipation in W, c is the specific heat capacity of the coolant in J / kg·K, m is the coolant flow rate in kg / s, and ΔT is the temperature change of the coolant in K. This embodiment achieves mode switching and precise temperature control through a composite heat dissipation structure. That is, the cold end of the thermoelectric cooling module 30 absorbs heat, while the hot end releases heat. Then, the liquid-cooled heat dissipation module 40 absorbs heat from the hot end of the thermoelectric cooling module 30 by circulating coolant within the cold plate. Heat is then dissipated through an exhaust and fan. The exhaust can be implemented using 12 sets of heat dissipation pipes, and the fan can be implemented using a fan with a noise level of 56 dB or less, thereby achieving precise temperature control. The temperature control accuracy is improved by 50% compared to traditional heat dissipation devices. Compared with traditional water-cooled machines, the volume is 8920 mL, which is 66% smaller. The rated power is 16.5 W, the power consumption is reduced by 20%, and the noise level is ≤65 dB. This meets the requirements of high-density integration and can be applied to high-performance communication scenarios such as 5G networks or data centers that have high requirements for heat dissipation of high-power optical modules.

[0033] The optical module heat dissipation system based on TEC and liquid cooling of the present invention forms a composite heat dissipation structure by combining a thermoelectric cooling module 30 and a liquid cooling heat dissipation module 40. The cold end of the thermoelectric cooling module 30 first directly contacts the high-power optical module for efficient absorption, and then the heat from the hot end of the thermoelectric cooling module 30 is quickly conducted away through the liquid cooling heat dissipation module 40, thereby achieving precise control of the shell temperature of the high-power optical module, improving heat dissipation efficiency, and reducing overall volume, power consumption and noise, to ensure that the high-power optical module can operate stably in extreme environments.

[0034] The present invention also proposes a control method for an optical module heat dissipation system based on TEC and liquid cooling. The control method for an optical module heat dissipation system based on TEC and liquid cooling is applied to the above-mentioned optical module heat dissipation system based on TEC and liquid cooling. The control method for an optical module heat dissipation system based on TEC and liquid cooling includes the following steps: Collect the shell temperature of high-power optical modules; The thermoelectric cooling module 30 and the liquid cooling module 40 are controlled to operate according to the shell temperature value to regulate the shell temperature of the high-power optical module.

[0035] Furthermore, the step of controlling the operation of the thermoelectric cooling module 30 and the liquid cooling heat dissipation module 40 according to the shell temperature value to regulate the shell temperature of the high-power optical module is specifically as follows: When the shell temperature is lower than a first preset temperature, the thermoelectric cooling module 30 is controlled to switch the working current direction to a heating mode, and the speed of the centrifugal pump is controlled to be a first speed; When the shell temperature is higher than a second preset temperature, the operating current of the thermoelectric cooling module 30 is controlled and the direction of the operating current is switched to a strong cooling mode, and the rotation speed of the centrifugal pump is controlled to be a second rotation speed.

[0036] In this embodiment, first, the shell temperature value of the high-power optical module is collected by the temperature sensor 10, and then the main control circuit 20 controls the operation of the thermoelectric cooling module 30 and the liquid cooling heat dissipation module 40 according to the collected shell temperature value, so as to accurately regulate the shell temperature of the high-power optical module; specifically, when the high-efficiency optical module adopts QSFP-DD packaging and the thermoelectric cooling module 30 adopts two sets of semiconductor cooling chips, the first preset temperature value can be set to 0°C and the second preset temperature value can be set to 65°C, that is, when the shell temperature is between 0 and 65°C, the flow rate of the centrifugal pump is 0.6L / min; when When the shell temperature is 90°C, which is higher than 65°C, the working current direction is switched, the strong cooling mode is started, the working current of the thermoelectric cooling module 30 is increased to 120%* the current rating, and the speed of the centrifugal pump is controlled to rise to 0.8L / min; when the shell temperature is -15°C, which is lower than 0°C, the working current direction of the thermoelectric cooling module 30 is switched, the heating mode is started, and the speed of the centrifugal pump is controlled to drop to 0.3L / min, thereby accurately and efficiently controlling the shell temperature of the high-power optical module through composite heat dissipation to ensure the stable operation of high-speed optical communication equipment.

[0037] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. An optical module heat dissipation system based on TEC and liquid cooling, characterized in that: The optical module heat dissipation system based on TEC and liquid cooling includes: Thermoelectric cooling module and liquid cooling module; A temperature sensor is provided on the housing of the high-power optical module, and is used to collect the housing temperature of the high-power optical module and output a corresponding temperature collection signal; A main control circuit, wherein the input end of the main control circuit is connected to the temperature sensor, and the control end of the main control circuit is connected to the thermoelectric cooling module and the liquid cooling heat dissipation module. The main control circuit is used to control the operation of the thermoelectric cooling module and the liquid cooling heat dissipation module according to the temperature acquisition signal to regulate the shell temperature of the high-power optical module.

2. The optical module heat dissipation system based on TEC and liquid cooling according to claim 1 is characterized in that: The cold end of the thermoelectric cooling module is attached to the surface of the high-power optical module through a heat conductor, and the hot end of the thermoelectric cooling module is connected to the cold plate. The liquid cooling heat dissipation module includes a centrifugal pump, which is used to drive the coolant to circulate in the cold plate; The main control circuit is used to control the thermoelectric refrigeration module to switch the working current direction to the heating mode and control the speed of the centrifugal pump to the first speed when the shell temperature value corresponding to the temperature acquisition signal is lower than the first preset temperature value; when the shell temperature value corresponding to the temperature acquisition signal is higher than the second preset temperature value, control the working current of the thermoelectric refrigeration module and switch the working current direction to the strong cooling mode, and control the speed of the centrifugal pump to the second speed.

3. The optical module heat dissipation system based on TEC and liquid cooling according to claim 2, characterized in that: The heat conducting member is thermally conductive silicone grease.

4. The optical module heat dissipation system based on TEC and liquid cooling according to claim 2, characterized in that: The cold plate is provided with fins, and the height of the fins is 3 mm.

5. The optical module heat dissipation system based on TEC and liquid cooling according to claim 4 is characterized in that: The cold plate comprises a parallel bidirectional microchannel cold plate.

6. The optical module heat dissipation system based on TEC and liquid cooling according to claim 4, characterized in that: The cold plate comprises a serpentine dual-inlet cold plate.

7. A control method for an optical module heat dissipation system based on TEC and liquid cooling, applied to the optical module heat dissipation system based on TEC and liquid cooling according to any one of claims 1 to 6, characterized in that: The control method of the optical module heat dissipation system based on TEC and liquid cooling comprises the following steps: Collect the shell temperature of high-power optical modules; The operation of the thermoelectric refrigeration module and the liquid cooling heat dissipation module is controlled according to the shell temperature value to regulate the shell temperature of the high-power optical module.

8. The control method of the optical module heat dissipation system based on TEC and liquid cooling according to claim 7, characterized in that: The step of controlling the operation of the thermoelectric cooling module and the liquid cooling heat dissipation module according to the shell temperature value to regulate the shell temperature of the high-power optical module is specifically as follows: When the shell temperature is lower than a first preset temperature, the thermoelectric cooling module is controlled to switch the working current direction to a heating mode, and the speed of the centrifugal pump is controlled to be a first speed; When the shell temperature is higher than a second preset temperature, the operating current of the thermoelectric cooling module is controlled and the direction of the operating current is switched to a strong cooling mode, and the rotation speed of the centrifugal pump is controlled to be a second rotation speed.

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