An external radiator for notebook computer

Abstract

The application relates to the field of notebook external heat radiators, and discloses an external heat radiator suitable for a notebook computer, which comprises a base and a mounting box mounted on the upper end of the base, the mounting box is connected with the base through an angle-adjustable support, an air duct assembly is arranged in the mounting box, the air duct assembly is used for sucking air from below, entering a cooling component in the air duct assembly, and then entering a computer upwards, the cooling and heating air in the air duct assembly can also be discharged to the front or the back and blown to the external keyboard of the notebook computer, and a cleaning assembly is further arranged in the mounting box and on the upper end of the mounting box; the external heat radiator suitable for the notebook computer has the air duct assembly, can reduce the required fan assembly, makes the device small and light, and is low in cost; secondly, the heat radiating demands of the computer and the external heat radiator can be simultaneously met; and thirdly, the air outlet direction of the cooling and heating air can be changed according to the environment temperature, the user's hand comfort is improved, and the external heat radiator is suitable for the notebook computer.

Description

TECHNICAL FIELD

[0001] The application relates to a notebook external radiator. BACKGROUND

[0002] In the patent application with the application publication number CN206892720U, a base and an air suction pump are included, the base is provided with a sealing rubber strip on the upper surface, the sealing rubber strip is arranged in a mouth-shaped manner, the sealing rubber strip and the base form a refrigeration groove, the refrigeration groove is provided with a mounting hole, the mounting hole is provided with a semiconductor refrigeration sheet for refrigerating the refrigeration groove, the exhaust port of the air suction pump is connected with a gas conveying pipe in communication with the refrigeration groove, and the gas conveying pipe penetrates through the sealing rubber strip. Advantages: the sealing rubber strip is arranged on the upper surface of the base to form a refrigeration groove, a semiconductor refrigeration sheet is used for refrigeration, the notebook computer is placed on the sealing rubber strip, the notebook computer covers the groove opening of the refrigeration groove to form a refrigeration space, air is conveyed into the refrigeration space through the air suction pump, the air pressure in the refrigeration space is increased, the cold air in the refrigeration space can be pressed into the notebook computer, excellent heat dissipation effect can be achieved, the phenomenon of notebook computer shutdown or burning due to high temperature can be effectively prevented, in addition, the sealing rubber strip and the base are connected in a mortise and tenon joint mode, the base is provided with a tenon on the upper surface, the sealing rubber strip is provided with a mortise matched with the tenon on the bottom surface, the sealing rubber strip and the base are connected through the mortise and the tenon, the structure is stable and the connection is reliable. The air suction pump is located on one side of the base, the base and the air suction pump are fixedly connected, the base and the air suction pump are reliably connected, and the air suction pump is not easy to fall off. The semiconductor refrigeration sheet comprises a hot end surface and a cold end surface, the cold end surface is located in the refrigeration groove, the hot end surface is located below the base, and the hot end surface is provided with an aluminum extrusion radiator, the heat on the hot end surface can be rapidly transmitted away through the aluminum extrusion radiator arranged on the hot end surface. The semiconductor refrigeration sheet is bonded to the base, the semiconductor refrigeration sheet and the base are reliably connected, and the structure is stable. The upper surface and the lower surface of the base are attached with heat insulation films, the base has good heat insulation effect, and heat transmission into the refrigeration groove is hindered.

[0003] In the prior art including the above-mentioned patent, the common external heat sink is divided into a common active heat sink and a pressure air type heat sink. For the existing equipment, the common heat sink has low efficiency, and the air pressure type heat sink has large air noise although it has good effect. For the prior art, most heat sinks cool the entering air by increasing air volume and liquid cooling. Some heat sinks cool the air by using semiconductor sheets and reducing humidity. However, in the prior art, if the liquid cooling is used to cool the air, the following problems will be encountered. First, the installation space is limited, which causes the liquid cooling system to have a small size, so that the effect of the liquid cooling system is limited, and there is a risk of liquid leakage. If the semiconductor sheet is used for heat dissipation, multiple fans are needed to cool the semiconductor and provide cold air for the computer. In this way, the overall size of the device is large, not lightweight, and the air blown out by the existing heat sink is directly blown out, which causes the heat sink to have only one function and may affect the desktop near the heat dissipation port. SUMMARY

[0004] The problem to be solved by the present application is that the existing device has a large size and a single function.

[0005] To solve the above technical problems, the technical scheme of the present application is as follows: an external heat sink suitable for a notebook computer, comprising a base and a mounting box mounted on the upper end of the base, the mounting box is connected with the base through an angle-adjustable support, the inside of the mounting box is provided with an air duct assembly, the air duct assembly is used to draw air from below, pass through the cooling components in the air duct assembly, and then enter the computer upwards, the cold and hot air in the air duct assembly can also be discharged forwardly or rearwardly and blown to the external keyboard of the notebook computer, the inside and the upper end of the mounting box are also provided with a cleaning assembly, and the cleaning assembly is used to reduce the moisture and dust in the cold air.

[0006] As a preferred, the air duct assembly comprises an air suction fan, the air suction fan is arranged at the lower end of the mounting box, two air suction fans are arranged, a semiconductor cooling sheet is arranged above the air suction fan, the semiconductor cooling sheet is fixedly connected with the mounting box through a mounting frame, and the cold end of the semiconductor cooling sheet is located below.

[0007] As a preferred, the lower end of the semiconductor cooling sheet is provided with a fin one, the fin one is fixedly connected with the mounting frame of the semiconductor cooling sheet, the fin one is parallel to the edge of the mounting box, the upper end of the semiconductor cooling sheet is slidably provided with a fin two, the fin two is arranged in an inclined manner, the fin two and the fin one are both provided with two groups, and the fin two and the fin one are both arranged in a symmetrical manner.

[0008] As preferred, the upper end of the fin two is fixedly provided with a shunt plate, the fin two is fixedly connected with the shunt plate, one side of the shunt plate is fixedly provided with a cover plate, the cover plate is located at one side of the mounting box, the cover plate is slidably connected with the mounting box, the cover plate is arranged as a "Fang" character, and the side close to the shunt plate of the cover plate is provided with a guide fan.

[0009] As preferred, the upper side of the front and back of the semiconductor cooling sheet is provided with an air outlet two through the mounting box, the air outlet two is used for the passage of the shunt plate and the fin two, the upper end of the cover plate can be inserted into the air outlet one, and the lower side of the air outlet two is provided with an air outlet one through the mounting box, and the air outlet one is located at the front side of the mounting box.

[0010] As preferred, the lower end of the inside of the air outlet one is slidably provided with a baffle, the lower end of the baffle is slidably provided with an elastic sheet, the lower end of the elastic sheet is fixedly connected with the mounting box, the area of the air outlet one is smaller than that of the air outlet two, the lower end of the cover plate can be inserted into the air outlet one, and the cover plate located in the air outlet one is provided with a ventilation opening.

[0011] As preferred, the cleaning assembly comprises a guide block, the guide block is arranged at the two sides of the semiconductor cooling sheet, the guide block is arranged in a semicircular shape, the guide block is fixedly connected with the mounting box, the center of the guide block coincides with the midpoint of the semiconductor cooling sheet, and the shunt plate is located at the center point of the upper half of the guide block.

[0012] As preferred, the center of the guide block is provided with a mounting shaft, the outer surface of the mounting shaft is fixedly provided with a filter element, the filter element is arranged within the range of the guide block, the guide block is provided with seven, the inside of the mounting shaft is provided with a fixing piece, and the fixing piece is composed of a bolt and a dustproof plug.

[0013] As preferred, the mounting shaft is connected with the mounting frame of the semiconductor cooling sheet through the bolt in the fixing piece, the dustproof plug in the fixing piece is used for plugging the outlet for extraction on the mounting box, the upper end of the mounting box is fixedly provided with a wind collecting pipe, and the wind collecting pipe is arranged in a "Fang" character.

[0014] As preferred, the wind collecting pipe is located at one side of the notebook computer heat dissipation port, the inner periphery of the wind collecting pipe is fixedly provided with windproof cloth, the windproof cloth is provided with three, the upper end of the windproof cloth is fixedly provided with a fixed frame, the fixed frame is consistent with the shape of the wind collecting pipe, the fixed frame is fixed with the wind collecting pipe through a magnet, the rear end of the wind collecting pipe is fixedly provided with a guide pipe, and the other end of the guide pipe is connected to the rear side of the filter element.

[0015] Compared with the prior art, the technical scheme of the present application has the following advantages:

[0016] (1) Through the setting of the air duct assembly, firstly, the required fan assembly of the device can be reduced by changing the direction of gas flow and the order of cooling, only one set of suction fan can meet the operation of the whole device, so that the device is small and light, and the cost is not high, secondly, by controlling the flow of air, the semiconductor in the device can be cooled while meeting the notebook cooling, so that the volume and cost of the device can be further controlled, the air duct assembly can also control the exhaust direction of hot and cold air, which can cool the hands and keyboard in summer to ensure the cool touch of the keyboard, reduce the secretion of hand sweat, and also can increase the temperature of the hands in winter to avoid the stiffness caused by the low environmental temperature, so as to improve the user experience, and without increasing too many components, so as to reduce the increase range of cost and device volume on the premise of meeting the above benefits;

[0017] (2) Through the setting of the cleaning assembly, firstly, the moisture and dust in the air can be filtered, the amount of dust entering the notebook is reduced, and when the computer is in normal work without using an external cooler, the hot air blown by the computer itself can blow away the dust on the surface of the filter element and keep it dry, so that the service life of the filter element can be prolonged, the maintenance steps can be simplified, and no additional driving source is needed, so that the cost can be well controlled. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the present application;

[0019] Figure 2 It is a schematic diagram of the rear view of the installation box of the present application;

[0020] Figure 3 It is a schematic diagram of the partial cross-sectional structure of the installation box of the present application;

[0021] Figure 4 It is a schematic diagram of the partial cross-sectional structure of the installation box of the present application; Figure 3

[0022] Figure 5 It is a schematic diagram of the partial cross-sectional structure of the installation box of the present application;

[0023] Figure 6 It is a schematic diagram of the partial cross-sectional structure of the installation box of the present application; Figure 5

[0024] Figure 7 It is a schematic diagram of the partial cross-sectional structure of the installation box of the present application;

[0025] Figure 8 It is a schematic diagram of the partial cross-sectional structure of the installation box of the present application;

[0026] Figure 9 It is a schematic diagram of the partial cross-sectional structure of the installation box of the present application;​​

[0027] Figure 10 Fig. 1 is a schematic view of a fin one of the present application;

[0028] Figure 11 Fig. 2 is a schematic view of the internal structure of the installation box of the present application.

[0029] In the figure: 1, base; 2, installation box; 3, air duct assembly; 301, air suction fan; 302, semiconductor cooling sheet; 303, fin one; 304, flow distribution plate; 305, fin two; 306, cover plate; 307, flow guide fan; 308, air outlet one; 309, air outlet two; 310, baffle; 311, spring; 4, cleaning assembly; 401, flow guide block; 402, mounting shaft; 403, filter element; 404, fixing member; 405, air collecting pipe; 406, windproof cloth; 407, fixed frame; 408, flow guide pipe. DETAILED DESCRIPTION

[0030] So that the purposes, technical solutions and advantages of the embodiments of the present disclosure are more apparent, the technical solutions of the embodiments of the present disclosure will be described clearly and completely below with reference to the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are some of the embodiments of the present disclosure, rather than all the embodiments of the present disclosure. Based on the described embodiments of the present disclosure, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present disclosure.

[0031] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure shall be understood as the usual meanings understood by those of ordinary skill in the art to which the present disclosure belongs. The “includes” or “contains” and similar words used in the present disclosure mean that the elements or objects appearing before the words cover the elements or objects listed after the words and their equivalents, without excluding other elements or objects. The “connection” or “connection” and similar words are not limited to physical or mechanical connection, but can also include electrical connection, whether direct or indirect. “Up”, “down”, “left”, “right” and the like are only used to represent relative positional relationships, and when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0032] As Figures 1 to 11As shown, the application provides an external radiator for notebook computer, which comprises a base 1 and a mounting box 2 installed on the upper end of the base 1, the mounting box 2 is connected with the base 1 through an angle-adjustable support, the inside of the mounting box 2 is provided with an air duct assembly 3, the air duct assembly 3 is used for sucking air from below, entering the computer after passing through the cooling components in the air duct assembly 3, and the cold and hot air in the air duct assembly 3 can also be discharged forwardly or rearwardly and blown to the external keyboard of the notebook computer, the inside and the upper end of the mounting box 2 are also provided with a cleaning assembly 4, which is used for reducing the moisture and dust in the cold air.

[0033] The air duct assembly 3 comprises two air suction fans 301 arranged at the lower end of the mounting box 2, the upper side of the air suction fan 301 is provided with a semiconductor cooling fin 302, the semiconductor cooling fin 302 is fixedly connected with the mounting box 2 through a mounting bracket, and the cold end of the semiconductor cooling fin 302 is located below.

[0034] The lower end of the semiconductor cooling fin 302 is provided with a fin 303, the fin 303 is fixedly connected with the mounting bracket of the semiconductor cooling fin 302, the fin 303 is parallel to the side of the mounting box 2, the upper end of the semiconductor cooling fin 302 is slidably provided with a fin 305, the fin 305 is arranged in an inclined manner, the fin 305 and the fin 303 are both provided with two groups, and the fin 305 and the fin 303 are both symmetrically arranged.

[0035] The upper end of the fin 305 is fixedly provided with a flow distribution plate 304, the fin 305 is fixedly connected with the flow distribution plate 304, one side of the flow distribution plate 304 is fixedly provided with a cover plate 306, the cover plate 306 is located on one side of the mounting box 2, the cover plate 306 is slidably connected with the mounting box 2, the cover plate 306 is arranged in a "Fang" shape, and one side of the cover plate 306 close to the flow distribution plate 304 is provided with a guide fan 307.

[0036] The upper side of the front and rear sides of the semiconductor cooling fin 302 is provided with an air outlet 309 through the mounting box 2, the air outlet 309 is used for the flow distribution plate 304 and the fin 305 to pass through, the upper end of the cover plate 306 can be inserted into the air outlet 308, the lower side of the air outlet 309 is provided with an air outlet 308 through the mounting box 2, and the air outlet 308 is located on the front side of the mounting box 2.

[0037] The inside lower end of the air outlet 308 is slidably provided with a baffle 310, the lower end of the baffle 310 is slidably provided with an elastic sheet 311, the lower end of the elastic sheet 311 is fixedly connected with the mounting box 2, the area of the air outlet 308 is smaller than that of the air outlet 309, the lower end of the cover plate 306 can be inserted into the air outlet 308, and the cover plate 306 located in the air outlet 308 is provided with a ventilation hole.

[0038] The cleaning assembly 4 comprises a flow guide block 401 arranged on both sides of the semiconductor cooling sheet 302, the flow guide block 401 is semicircular, the flow guide block 401 is fixedly connected with the mounting box 2, the center of the flow guide block 401 coincides with the midpoint of the semiconductor cooling sheet 302, and the flow guide plate 304 is located at the center point of the upper half of the flow guide block 401.

[0039] The center of the flow guide block 401 is provided with a mounting shaft 402, the outer surface of the mounting shaft 402 is fixedly provided with a filter element 403, the filter element 403 is arranged in the range of the flow guide block 401, the flow guide block 401 is provided with seven, the inside of the mounting shaft 402 is provided with a fixing piece 404, the fixing piece 404 is composed of a bolt and a dustproof plug.

[0040] The mounting shaft 402 is connected with the mounting frame of the semiconductor cooling sheet 302 through the bolt in the fixing piece 404, the dustproof plug in the fixing piece 404 is used for plugging the outlet for extraction on the mounting box 2, the upper end of the mounting box 2 is fixedly provided with a wind collecting pipe 405, and the wind collecting pipe 405 is arranged in the shape of a Chinese character.

[0041] The wind collecting pipe 405 is located on one side of the notebook computer heat dissipation port, the inner side of the wind collecting pipe 405 is fixedly provided with a windproof cloth 406, the windproof cloth 406 is provided with three, the upper end of the windproof cloth 406 is fixedly provided with a fixed frame 407, the fixed frame 407 is consistent with the shape of the wind collecting pipe 405, the fixed frame 407 is fixed with the wind collecting pipe 405 through a magnet, the rear end of the wind collecting pipe 405 is fixedly provided with a flow guide pipe 408, and the other end of the flow guide pipe 408 is connected to the rear side of the filter element 403.

[0042] The working principle and use process of the present application are as follows: after the device starts, the air suction fan 301 sucks the air below and directly blows to the cold end of the semiconductor cooling sheet 302 and the fin one 303, under the action of the two, the temperature of the air can be reduced first, and the cold air can be guided to both sides of the mounting box 2 and turned over to the upper side through the flow guide block 401.

[0043] The turned-over cold air is divided into upper and lower parts under the action of the flow guide plate 304, the cold air in the upper half directly enters the notebook computer, and the cold air in the lower half can cool the hot end of the semiconductor cooling sheet 302 through the fin two 305, and then is discharged outward under the flow guiding action of the fin two 305.

[0044] The discharged air can be discharged through the air outlet two 309, at this time the user can change the direction of the hot air according to the ambient temperature and use habits, if the hot air needs to blow to the keyboard, the cover plate 306 is located at the rear of the mounting box 2, at this time the hot air can be discharged from the front through the air outlet two 309, if the cold air needs to blow to the keyboard, the cover plate 306 located at the rear side is pulled out together with the shunt plate 304 and the fin two 305 and is reinserted from the front, at this time the upper hot air will be guided from the rear by the fin two 305, and the lower end of the cover plate 306 can push the baffle 310 downward to make the space at the lower end of the semiconductor cooling fin 302 communicate with the front end of the mounting box 2, so that a small part of the cold air can be blown to the keyboard to cool the hands;

[0045] It is worth mentioning that the flow guide fan 307 can be started when the amount of hot air is too much to be passively discharged, and the hot air is guided to the air outlet two 309;

[0046] When the air passes through the flow guide block 401, the moisture and dust in the air can be reduced by the filter element 403, and when the filter element 403 is cleaned and maintained, the hot air blown by the notebook can be collected and blown to the filter element 403 through the flow guide pipe 408 by lifting the windproof cloth 406 upward, at this time the sealing plug of the fixing piece 404 is removed, the dust on the filter element 403 can be blown out, and the hot air can also blow out the moisture contained in the filter element 403;

[0047] It is worth mentioning that in summer, the environment and humidity are high, if the user blows the cold air from the front at this time, the cold air can blow out the condensed water on the surface of the semiconductor cooling fin 302.

[0048] The above embodiments are only exemplary embodiments of the present application and are not used to limit the present application, the protection scope of the present application is defined by the claims. Those skilled in the art can make various modifications or equivalent replacements to the present application within the spirit and protection scope of the present application, and such modifications or equivalent replacements should also be considered to fall within the protection scope of the present application.

Claims

1. A notebook computer suitable for external heat sink, comprising a base (1) and a mounting box (2) mounted on the upper end, characterized in that: The installation box (2) is connected with the base (1) through an angle-adjustable support, the inside of the installation box (2) is provided with an air duct assembly (3), the air duct assembly (3) is used for sucking air from below, entering the cooling component in the air duct assembly (3), and then entering the computer upwards, the cold and hot air in the air duct assembly (3) can also be discharged to the front or the rear and blown to the external keyboard of the notebook computer, and the inside and the upper end of the installation box (2) are also provided with a cleaning assembly (4), the cleaning assembly (4) is used for reducing the moisture and dust in the cold air. The upper end of the fin two (305) is fixedly provided with a flow distribution plate (304), the fin two (305) is fixedly connected with the flow distribution plate (304), one side of the flow distribution plate (304) is fixedly provided with a cover plate (306), the cover plate (306) is located on one side of the installation box (2), the cover plate (306) is slidably connected with the installation box (2), the cover plate (306) is arranged in a "Fang" shape, and one side of the cover plate (306) close to the flow distribution plate (304) is provided with a guide fan (307). The upper part of the front and rear sides of the semiconductor cooling fin (302) is provided with an air outlet two (309) through the installation box (2), the air outlet two (309) is used for the flow distribution plate (304) and the fin two (305) to pass through, the upper end of the cover plate (306) can be inserted into the air outlet one (308), and the lower part of the air outlet two (309) is provided with an air outlet one (308) through the installation box (2), the air outlet one (308) is located on the front side of the installation box (2). The lower end of the air outlet one (308) is slidably provided with a baffle (310), the lower end of the baffle (310) is slidably provided with an elastic sheet (311), the lower end of the elastic sheet (311) is fixedly connected with the installation box (2), the area of the air outlet one (308) is smaller than that of the air outlet two (309), the lower end of the cover plate (306) can be inserted into the air outlet one (308), and the cover plate (306) located in the air outlet one (308) is provided with a ventilation opening.

2. The external heat sink for a notebook computer according to claim 1, wherein: The air duct assembly (3) comprises suction fans (301), the suction fans (301) are arranged at the lower end of the installation box (2), the suction fans (301) are provided in two, the upper part of the suction fan (301) is provided with a semiconductor cooling fin (302), the semiconductor cooling fin (302) is fixedly connected with the installation box (2) through a mounting bracket, and the cold end of the semiconductor cooling fin (302) is located below.

3. The external heat sink for a notebook computer according to claim 2, wherein: The lower end of the semiconductor cooling fin (302) is provided with a fin one (303), the fin one (303) is fixedly connected with the mounting bracket of the semiconductor cooling fin (302), the fin one (303) is parallel to the edge of the installation box (2), the upper end of the semiconductor cooling fin (302) is slidably provided with a fin two (305), the fin two (305) is arranged in an inclined manner, the fin two (305) and the fin one (303) are both provided with two groups, and the fin two (305) and the fin one (303) are both symmetrically arranged.

4. The external heat sink for a notebook computer of claim 1, wherein: The cleaning assembly (4) comprises a flow guide block (401), which is arranged on both sides of the semiconductor cooling sheet (302), the flow guide block (401) is arranged in a semicircle, the flow guide block (401) is fixedly connected with the mounting box (2), the center of the flow guide block (401) coincides with the midpoint of the semiconductor cooling sheet (302), and the flow distribution plate (304) is located at the center point of the upper half of the flow guide block (401).

5. The external heat sink for a notebook computer of claim 4, wherein: A mounting shaft (402) is arranged at the center of the flow guide block (401), an outer surface of the mounting shaft (402) is fixedly provided with a filter element (403), the filter element (403) is arranged in the range of the flow guide block (401), there are seven filter elements (403), an inner portion of the mounting shaft (402) is provided with a fixing member (404), and the fixing member (404) is composed of a bolt and a dustproof plug.

6. The external heat sink for a notebook computer of claim 5, wherein: The mounting shaft (402) is connected with the mounting frame of the semiconductor cooling sheet (302) through the bolt in the fixing member (404), the dustproof plug in the fixing member (404) is used for plugging the outlet for extraction on the mounting box (2), an upper end of the mounting box (2) is fixedly provided with a wind collecting pipe (405), and the wind collecting pipe (405) is arranged in a "Fang" shape.

7. The external heat sink for a notebook computer of claim 6, wherein: The wind collecting pipe (405) is located on one side of the notebook computer heat dissipation port, an inner portion of the wind collecting pipe (405) is fixedly provided with wind blocking cloth (406), there are three wind blocking cloths (406), an upper end of the wind blocking cloth (406) is fixedly provided with a fixing frame (407), the fixing frame (407) is consistent with the shape of the wind collecting pipe (405), the fixing frame (407) is fixed with the wind collecting pipe (405) through a magnet, a rear end of the wind collecting pipe (405) is fixedly provided with a flow guide pipe (408), and the other end of the flow guide pipe (408) is connected to the rear side of the filter element (403).

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