Inductor structure and applicable power module thereof

Abstract

The invention provides an inductor structure and an applicable power module thereof. The inductor structure comprises a magnetic core, M first metal bodies and N second metal bodies, the magnetic core comprises an upper surface and a lower surface which are oppositely arranged. The M first metal bodies penetrate through the magnetic core, each first metal body forms a first upper wire outlet end and a first lower wire outlet end on the upper surface and the lower surface, and a winding is formed through assembling. The N second metal bodies penetrate through the magnetic core, each second metal body forms a second upper wire outlet end and a second lower wire outlet end on the upper surface and the lower surface, and the second upper wire outlet ends and the second lower wire outlet ends are equipotential. Wherein the M first metal bodies and the N second metal bodies are alternately arranged in a matrix, the M first metal bodies and the N second metal bodies are arranged in an equidistant array, the distance between each of the M first metal bodies and an adjacent one is larger than the distance between each of the M first metal bodies and a corresponding adjacent second metal body, M and N are integers, M is greater than or equal to 2, and N is greater than or equal to 2.

Description

Technical Field

[0001] This case involves the field of power electronics technology, and in particular, an inductor structure and a power module applicable thereto. By alternately arranging a plurality of winding metal bodies and a plurality of grounded metal bodies embedded in a magnetic core in a matrix, the total loop length is reduced, thereby reducing line losses and improving efficiency, effectively solving the problems of magnetic core saturation, uneven windings, and large line losses. Background Art

[0002] With the rapid development and widespread application of microprocessors and communication equipment, the current of computing chips has increased rapidly, exceeding 1000 amperes, which poses a huge challenge to the voltage regulator (Voltage Regulator) that powers the chip.

[0003] Voltage regulators are generally required to offer low output voltage, high current, high load transient performance, and high efficiency. The inductor, as an essential component in voltage regulators, plays a crucial role in their performance, size, and cost.

[0004] Traditional inductors are often constructed with windings passing through a magnetic core. The coupling between the windings increases the maximum magnetic flux density and makes the core prone to saturation. Furthermore, the inductance output from each winding is difficult to balance, hindering the implementation of multiple parallel outputs in power modules. Furthermore, the uneven magnetic flux distribution within the core leads to significant core losses. Furthermore, the total loop path from the inductor winding to ground is long, resulting in high line losses, further hindering power module efficiency.

[0005] In view of this, how to develop an inductor structure and its applicable power module, by alternately arranging multiple winding metal bodies embedded in the magnetic core and multiple grounded metal bodies in a matrix, reducing the total loop length, thereby reducing line losses and improving efficiency, and effectively solving the problems of core saturation, uneven windings, and large line losses, is indeed a topic that needs to be addressed in this field. Summary of the Invention

[0006] The purpose of this case is to provide an inductor structure and a power module applicable thereto. By alternately arranging multiple winding metal bodies and multiple grounded metal bodies embedded in a magnetic core in a matrix, the total loop length is reduced, thereby reducing line losses and improving efficiency, effectively solving the problems of core saturation, uneven windings, and large line losses.

[0007] The purpose of this application is to provide an inductor structure and a power module suitable for use therein. Multiple metal bodies are disposed within a magnetic core and partially exposed on at least one surface of the inductor structure. The multiple metal bodies are divided into winding metal bodies and grounding metal bodies, arranged in an interlaced manner, with the nearest adjacent metal body to each winding metal body being a grounding metal body. All winding metal bodies have one end for connection to a switching device. The interlaced arrangement of the metal bodies effectively reduces coupling between windings, improves inductance consistency, and significantly shortens the loop path between the windings and the ground, thereby reducing losses and improving conversion efficiency.

[0008] To achieve the aforementioned objectives, the present invention provides an inductor structure comprising a magnetic core, M first metal bodies, and N second metal bodies. The magnetic core comprises an upper surface and a lower surface arranged opposite to each other. The M first metal bodies are arranged in the magnetic core, wherein the M first metal bodies pass through the magnetic core, and each first metal body forms a first upper outlet terminal and a first lower outlet terminal on the upper surface and the lower surface, and the winding is formed by assembling. The N second metal bodies are arranged in the magnetic core, wherein the N second metal bodies pass through the magnetic core, and each second metal body forms a second upper outlet terminal and a second lower outlet terminal on the upper surface and the lower surface, and the second upper outlet terminal and the second lower outlet terminal are of equal potential. The M first metal bodies and the N second metal bodies are arranged alternately in a matrix, and the M first metal bodies and the N second metal bodies are arranged in an equidistant array, and the distance between each of the M first metal bodies and the adjacent one is greater than the distance between each of the M first metal bodies and the corresponding adjacent second metal body, and M and N are integers, M≧2 and N≧2.

[0009] In one embodiment, the M first metal bodies and the N second metal bodies vertically penetrate the upper surface and the lower surface.

[0010] In one embodiment, the M first metal bodies and the N second metal bodies are all metal columns with the same structure.

[0011] In one embodiment, the N second metal bodies are directly electrically connected on the upper surface or the lower surface by short-circuiting.

[0012] In one embodiment, an upper circuit board is disposed above the inductor structure and electrically connected to the inductor structure, a lower circuit board is disposed below the inductor structure and electrically connected to the inductor structure, and N second metal bodies are electrically connected to each other through traces or plated copper holes on the upper circuit board and the lower circuit board.

[0013] In one embodiment, the magnetic core is disposed in a main circuit board, and the N second metal bodies are electrically connected to each other through traces or copper plated holes of the main circuit board.

[0014] In one embodiment, the main circuit board includes a top surface and a bottom surface, the top surface is spatially opposite to the upper surface, and the bottom surface is spatially opposite to the lower surface, M first metal bodies and N second metal bodies vertically penetrate the top surface and the lower surface, each first upper outlet terminal forms a first upper pad on the top surface through a copper electroplating hole, and each second upper outlet terminal forms a second upper pad on the top surface through a copper electroplating hole, and the first upper pad and the second upper pad are electrically connected to a switching device.

[0015] In one embodiment, each first lower outlet terminal forms a first lower pad on the bottom surface through a copper electroplating hole, and each second lower outlet terminal forms a second lower pad on the bottom surface through a copper electroplating hole. The first and second lower pads are assembled and directly soldered to the bottom circuit board.

[0016] In one embodiment, the main circuit board is a power board for transmitting power, and the bottom circuit board is an output circuit board electrically connected to an output capacitor, a load, a motherboard, or a signal circuit.

[0017] In one embodiment, each of the first lower outlet terminals is electrically connected to each other through traces or copper plated holes on the main circuit board.

[0018] In one embodiment, each first upper output terminal is electrically connected to at least two switching devices, and each first lower output terminal is electrically connected to at least one output terminal.

[0019] In one embodiment, the current directions of the M first metal bodies are opposite to the current directions of the N second metal bodies.

[0020] In one embodiment, the magnetic core is made of ferrite or soft magnetic material.

[0021] To achieve the aforementioned objectives, the present invention further provides a power module comprising an inductor structure, a plurality of switching devices, and a bottom circuit board. The inductor structure comprises a magnetic core, M first metal bodies, and N second metal bodies. The magnetic core comprises an upper surface and a lower surface disposed opposite each other. The M first metal bodies are disposed within the magnetic core, wherein the M first metal bodies pass through the magnetic core, and each first metal body forms a first upper terminal and a first lower terminal on the upper and lower surfaces, which are assembled to form a winding. The N second metal bodies are disposed within the magnetic core, wherein the N second metal bodies pass through the magnetic core, and each second metal body forms a second upper terminal and a second lower terminal on the upper and lower surfaces, with the second upper terminal and the second lower terminal being of equal potential. The M first metal bodies and the N second metal bodies are arranged alternately in a matrix, and the M first metal bodies and the N second metal bodies are arranged in an equidistant array, and the distance between each of the M first metal bodies and its adjacent adjacent second metal body is greater than the distance between each of the M first metal bodies and its corresponding adjacent second metal body, and M and N are integers, M ≧ 2 and N ≧ 2. A plurality of switch devices are disposed on the upper surface, wherein the plurality of switch devices are electrically connected to the first upper outlet terminal and the second upper outlet terminal. The bottom circuit board includes a ground terminal and an output terminal, wherein the first lower outlet terminal is electrically connected to the output terminal, and the second lower outlet terminal is electrically connected to the ground terminal.

[0022] In one embodiment, the M first metal bodies and the N second metal bodies vertically penetrate the upper surface and the lower surface, and the M first metal bodies and the N second metal bodies are metal columns with the same structure.

[0023] In one embodiment, the N second metal bodies are directly electrically connected on the upper surface or the lower surface by short-circuiting.

[0024] In one embodiment, the power module further includes an upper circuit board and a lower circuit board, the upper circuit board is arranged above the inductor structure and electrically connected to the inductor structure, the lower circuit board is arranged below the inductor structure and electrically connected to the inductor structure, and the N second metal bodies are electrically connected to each other through traces or plated copper holes on the upper circuit board and the lower circuit board.

[0025] In one embodiment, the power module further includes a main circuit board, the magnetic core is disposed in the main circuit board, and the N second metal bodies are electrically connected to each other through traces or plated copper holes on the main circuit board.

[0026] In one embodiment, the main circuit board includes a top surface and a bottom surface, the top surface is spatially opposite to the upper surface, and the bottom surface is spatially opposite to the lower surface, M first metal bodies and N second metal bodies vertically penetrate the upper surface and the lower surface, each first upper outlet terminal forms a first upper pad on the top surface through a copper electroplating hole, and each first lower outlet terminal forms a first lower pad on the bottom surface through a copper electroplating hole; each second upper outlet terminal forms a second upper pad on the top surface through a copper electroplating hole, and each second lower outlet terminal forms a second lower pad on the bottom surface through a copper electroplating hole, wherein the first upper pad and the second upper pad are electrically connected to a plurality of switching devices, and the first lower pad and the second lower pad are electrically connected to the bottom circuit board.

[0027] In one embodiment, the plurality of windings are connected in parallel.

[0028] In one embodiment, the power module further includes a plurality of input capacitors disposed on the upper surface and electrically connected to the plurality of switching devices.

[0029] In one embodiment, the power module further includes a plurality of output capacitors and / or a plurality of loads disposed between the lower surface and the bottom circuit board, and the plurality of output capacitors and / or the plurality of loads are electrically connected to the bottom circuit board.

[0030] In one embodiment, the current directions of the M first metal bodies are opposite to the current directions of the N second metal bodies.

[0031] In one embodiment, the power module further includes a plurality of solder balls disposed on a surface of the bottom circuit board away from the inductor structure.

[0032] In one embodiment, the bottom circuit board is electrically connected to a load, a motherboard or a signal circuit via a surface on which a plurality of solder balls are disposed.

[0033] The beneficial effect of this case is that the embodiments of this case provide an inductor structure and a power module applicable thereto to address the problems of core saturation, uneven windings, and high line losses. By dividing the multiple metal bodies inserted into the magnetic core into winding metal bodies and grounding metal bodies, the metal bodies are arranged in an interlaced manner, and the metal body closest to each winding metal body is also a grounding metal body. All winding metal bodies have one end for connection to a switching device. This inductor structure effectively reduces coupling between windings, improves inductance consistency, and significantly shortens the loop path between the windings and the ground, thereby reducing losses and improving conversion efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 A schematic diagram showing the overall appearance of the inductor structure of this case from a top perspective;

[0035] Figure 2 A schematic diagram showing the overall appearance of the inductor structure of this case from the bottom perspective;

[0036] Figure 3 Schematic diagram showing a matrix arrangement of multiple metal bodies in the inductor structure of this case;

[0037] Figure 4 The schematic diagram of the short-circuit structure of the output terminal in the inductor structure of this case is shown schematically;

[0038] Figure 5 A schematic diagram showing a circuit diagram of the inductor structure of the present invention applied to a power module;

[0039] Figure 6 The schematic diagram of magnetic flux distribution in the inductor structure of this case is shown schematically;

[0040] Figure 7 The schematic diagram shows the overall appearance of the power module of this case;

[0041] Figure 8 Schematically shown Figure 7 Exploded view of the power module from above;

[0042] Figure 9 Schematically shown Figure 7 Exploded view of the power module from the bottom.

[0043] Figure 10 Schematically shown Figure 7 Cross-sectional view of the power module;

[0044] Figure 11 A schematic diagram showing the overall appearance of a power module according to another embodiment of the present invention is shown;

[0045] Figure 12 Schematically shown Figure 11 Exploded view of the power module from above;

[0046] Figure 13 Schematically shown Figure 11 An exploded view of the power module from below; and

[0047] Figure 14 Schematically shown Figure 11 Cross-section of a power module. DETAILED DESCRIPTION

[0048] Some typical embodiments that embody the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can be modified in various ways without departing from the scope of the present invention, and the description and drawings therein are essentially for illustrative purposes and not for limiting the present invention. For example, if the following content of the present disclosure describes a first feature being arranged on or above a second feature, it means that it includes embodiments in which the first feature and the second feature are directly in contact, and also includes embodiments in which additional features can be arranged between the first feature and the second feature so that the first feature and the second feature may not be in direct contact. In addition, different embodiments in the present disclosure may use repeated reference symbols and / or marks. This repetition is for the purpose of simplicity and clarity and is not intended to limit the relationship between the various embodiments and / or the described appearance structures. Furthermore, to facilitate the description of the relationship between a component or feature and another component(s) or feature(s) in the drawings, spatially related terms such as "upper," "lower," "top," "bottom," and similar terms may be used. In addition to the orientations shown in the drawings, spatially relative terms are used to cover different orientations of the device in use or operation. The device may also be positioned differently (e.g., rotated 90 degrees or in other orientations), and the description of the spatially relative terms used should be interpreted accordingly. In addition, when a component is referred to as being "connected to" or "coupled to" another component, it may be directly connected to or coupled to the other component, or there may be intervening components. Although the numerical ranges and parameters of the broad scope of this disclosure are approximate, the numerical values are stated as accurately as possible in the specific examples. In addition, it is understood that although terms such as "first" and "second" may be used in the claims to describe different components, these components should not be limited by these terms. In the embodiments, these components described accordingly are represented by different component symbols. These terms are intended to distinguish different components. For example, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component without departing from the scope of the embodiments. The term "and / or" as used in this manner includes any or all combinations of one or more of the related listed items. Except in the operating / working examples, or unless explicitly stated, all numerical ranges, amounts, values and percentages disclosed herein (such as those percentages of angles, time durations, temperatures, operating conditions, amount ratios and the like) should be understood as being modified by the term "about" or "substantially" in all embodiments. Accordingly, unless otherwise indicated, the numerical parameters stated in this disclosure and the appended claims are approximate values that may vary as needed. For example, each numerical parameter should be interpreted at least according to the number of significant figures described and by applying ordinary rounding principles. Scopes can be expressed in this article as from one endpoint to the other or between two endpoints. All ranges disclosed herein include endpoints unless otherwise specified.

[0049] Figure 1 and Figure 2 The overall appearance of the inductor structure of this embodiment is schematically shown. Figure 3 The figure schematically shows a schematic diagram of a matrix arrangement of multiple metal bodies in the inductor structure of this embodiment. Figure 4 The schematic diagram of the short-circuit structure of the output terminal in the inductor structure of this case is shown. In order to solve the problems of core saturation, uneven winding and large line loss when the inductor structure is applied to the power module, this case provides an inductor structure 1 arranged in a matrix, including a magnetic core 10, M first metal bodies 20 and N second metal bodies 30. The magnetic core 10 includes an upper surface 11 and a lower surface 12 arranged opposite to each other. The M first metal bodies 20 are arranged in the magnetic core 10, wherein the M first metal bodies 20 pass through the magnetic core 10, and each first metal body 20 forms a first upper output terminal 21 on the upper surface 11 and a first lower output terminal 22 on the lower surface 12, and the combination forms a winding. In addition, N second metal bodies 30 are arranged in the magnetic core 10, wherein the N second metal bodies 30 pass through the magnetic core 10, and each second metal body 30 forms a second upper output terminal 31 on the upper surface 11 and a second lower output terminal 32 on the lower surface 12, and the second upper output terminal 31 and the second lower output terminal 32 are at the same potential. The M first metal bodies 20 and the N second metal bodies 30 are alternately arranged in a matrix, where M and N are integers, M≧2 and N≧2. M and N are not limited to being equal.

[0050] In this embodiment, the magnetic core 10 is made of ferrite or other low-loss soft magnetic materials with uniform material. In addition, the M first metal bodies 20 and the N second metal bodies 30 are all metal cylinders with the same structure, such as metal copper cylinders. The M first metal bodies 20 and the N second metal bodies 30 vertically penetrate the upper surface 11 and the lower surface 12 of the magnetic core 10. It is worth noting that, in addition to having the same structure, the M first metal bodies 20 and the N second metal bodies 30 are arranged in an equidistant array. In one embodiment, a plurality of metal cylinders with the same structure can be arranged in an equidistant square array, vertically penetrate the upper surface 11 and the lower surface 12 of the magnetic core 10, and then be divided into the first metal body 20 and the second metal body 30 for use. Among them, the N second metal bodies 30 that vertically penetrate the upper surface 11 and the lower surface 12 of the magnetic core 10 can be directly electrically connected, for example, on the upper surface 11 or the lower surface 12 of the magnetic core 10 by short-circuiting a common line 33, to form an equipotential, which is used as a ground.

[0051] In this embodiment, M first metal bodies 20 and N second metal bodies 30 are arranged alternately, and the distance D between each of the M first metal bodies 20 and its adjacent neighbor is greater than the distance d between each of the M first metal bodies 20 and its corresponding adjacent second metal body 30. In this way, all four sides of each first metal body 20 are arranged adjacent to a second metal body 30. In other words, when the M first metal bodies 20 are used as windings, the nearest neighboring metal body of each winding metal body is a grounded metal body. By designing a traffic arrangement of multiple metal bodies with the same structure, the coupling between the windings can be effectively reduced, the consistency of inductance can be improved, and the loop path between the winding and the ground can be significantly shortened, thereby reducing losses and improving conversion efficiency. This will be further explained later.

[0052] Figure 5 The schematic diagram shows the circuit diagram of the inductor structure of this case applied to the power module. Figures 1 to 5 When the inductor structure 1 of the present invention is applied to, for example, Figure 5 In the circuit of the power module shown, M first metal bodies 20 can constitute a plurality of windings Winding 1 to Winding x, which are connected in parallel to each other. The first upper output terminals 21 and the first lower output terminals 22 of the M first metal bodies 20 are respectively assembled into two connection terminals of the plurality of windings Winding 1 to Winding x. The second upper output terminals 31 and the second lower output terminals 32 of the N second metal bodies 30 are both of equal potential and are used to connect to the ground terminal GND. In this embodiment, a plurality of switching devices SW1 to SWx, such as DrMOS, can be arranged relative to the upper surface 11 of the magnetic core 10, and respectively assembled and connected to the first upper output terminals 21 of the M first metal bodies 20 constituting the plurality of windings Winding 1 to Winding x and the second upper output terminals 31 of the N second metal bodies 30, and then combined with the input voltage Vin and the input capacitor Cin, a structure such as Figure 5 On the other hand, the first lower outlet terminal 22 and the second lower outlet terminal 32 formed on the lower surface 12 of the magnetic core 10 can be electrically connected to the ground terminal GND, the output capacitor Co, and the load R load and output voltage Vo, etc., architecture such as Figure 5 Circuit design on the right.

[0053] It is worth noting that in this embodiment, the M first metal bodies 20 and the N second metal bodies 30 of the inductor structure 1 are multiple metal bodies of the same structure that vertically penetrate the upper surface 11 and the lower surface 12 of the magnetic core 10. Each first metal body 20 is respectively connected to the upper surface 11 and the lower surface 12 via the first upper outlet terminal 21 and the first lower outlet terminal 22 at the shortest distance, and each second metal body 30 is respectively connected to the upper surface 11 and the lower surface 12 via the second upper outlet terminal 31 and the second lower outlet terminal 32 at the shortest distance. In addition, in this embodiment, the multiple windings Winding1 to Winding x formed by the M first metal bodies 20 of the inductor structure 1 and the multiple ground terminals GND connected to the N second metal bodies 30 further form a loop Lp when used in conjunction with the multiple switching devices SW1 to SWx and the output capacitor Co. Figure 5 When designing an inductor, the shorter the loop Lp, the lower the line loss. This is especially true between the winding and the ground terminal GND, where high currents are generated during circuit operation. Therefore, a shorter path from the winding to ground reduces losses, significantly improving inductor quality.

[0054] Figure 6The following diagram schematically illustrates the magnetic flux distribution in the inductor structure of this embodiment. In the inductor structure 1 used in a power module, M first metal bodies 20 serving as windings and N second metal bodies 30 serving as grounding are arranged alternately, perpendicularly penetrating the magnetic core 10 and extending from the upper surface 11 and lower surface of the magnetic core 10 along the shortest path. Furthermore, the nearest neighboring metal body to any first metal body 20 is a grounded second metal body 30. In this embodiment, the current direction of the M first metal bodies 20 is opposite to the current direction of the N second metal bodies 30. When the M first metal bodies 20 serve as winding metal bodies and current flows along the anti-Z axis (i.e., inward perpendicular to the paper), each first metal body 20 generates a clockwise magnetic flux. When the N second metal bodies 30 serve as grounding metal bodies and current flows along the Z axis (i.e., outward perpendicular to the paper), each second metal body 30 generates a counterclockwise magnetic flux. In this way, the metal bodies with the nearest adjacent distance d on the four sides of each winding metal body (first metal body 20) are all grounded metal bodies (second metal body 30), and the directions of the magnetic fluxes coupled to each other help to stabilize the magnetic flux of the winding metal bodies. And each winding metal body (first metal body 20) and the winding metal body (first metal body 20) with the nearest adjacent distance D are blocked by the indirect metal body (second metal body 30) between the two, which further avoids coupling with each other and causing the magnetic core to saturate. In other words, the circuit design of the inductor structure 1 in this case can minimize the coupling between adjacent winding metal bodies (first metal body 20) and ensure the inductance balance between each winding metal body (first metal body 20), which is beneficial to the parallel output of the power module. Furthermore, the adjacent arrangement of M winding metal bodies (first metal body 20) and N grounded metal bodies (second metal body 30) can reduce the total loop length between them, thereby reducing line loss and improving efficiency. In other words, the application of the inductor structure 1 to the power module is more conducive to achieving the requirements of short loop and low line loss. Of course, the application of the inductor structure 1 of this embodiment is not limited thereto.

[0055] Figures 7 to 10 The power module of this embodiment is schematically shown. In this embodiment, the inductor structure 1a and Figures 1 to 4 The inductor structure 1 shown is similar, and like component numbers represent like components, structures, and functions, so a detailed description is omitted here. In this embodiment, an upper circuit board 40 and a lower circuit board 50 are disposed on the upper surface 11 and lower surface 12 of the inductor structure 1a, respectively. The upper circuit board 40 is disposed above the inductor structure 1a and electrically connected to the inductor structure 1a, while the lower circuit board 50 is disposed below the inductor structure 1a and electrically connected to the inductor structure 1a, thereby assembling a power module 2 compatible with the inductor structure 1a.

[0056] In this embodiment, M first metal bodies 20 and N second metal bodies 30 of identical structure are arranged alternately and vertically through the upper surface 11 and lower surface 12 of the magnetic core 10. In this embodiment, the M first metal bodies 20 are assembled to form a winding. Each first upper terminal 21 is electrically connected to a plated copper hole 41 of the upper circuit board 40, and each first lower terminal 22 is electrically connected to a plated copper hole 51 of the lower circuit board 50.

[0057] In this embodiment, N second metal bodies 30 are assembled and grounded to form an equipotential connection. Each second upper terminal 31 is electrically connected to a plated copper hole 42 of the upper circuit board 40, and each second lower terminal 32 is electrically connected to a plated copper hole 52 of the lower circuit board 50. Compared to the previous embodiment in which the N second metal bodies 30 were directly electrically connected on the upper surface 11 or lower surface 12 via short circuits, the N second metal bodies 30 in this embodiment are electrically connected to each other via traces or plated copper holes 42 and 52 on the upper and lower circuit boards 40 and 50. Of course, the equipotential grounding method of the N second metal bodies 30 can be adjusted according to actual application requirements and is not limited to this embodiment.

[0058] In this embodiment, the power module 2 is structured as follows: Figure 5 The circuit of the power module shown in FIG. The inductor module 1a provides a winding and grounding component between the output terminal and the switching device. The power module 2 also includes a plurality of switching devices 43 and a plurality of input capacitors 44 corresponding to Figure 5 In this embodiment, the plurality of switch devices 43 and the plurality of input capacitors 44 are disposed on a surface of the upper circuit board 40 away from the inductor structure 1a, and are electrically connected to the first upper outlet terminals 21 of the M first metal bodies 20 and the second upper outlet terminals 31 of the N second metal bodies 30 through traces or plated copper holes 41 and 42 of the upper circuit board 40. In other embodiments, the lower circuit board 50 may also include corresponding Figure 5 Output capacitor Co or load R load The components are electrically connected to the first lower outlet terminals 22 of the M first metal bodies 20 and the second lower outlet terminals 32 of the N second metal bodies 30. The present invention is not limited thereto.

[0059] In this embodiment, the lower circuit board 50 further includes a plurality of solder balls 53 disposed on a surface of the lower circuit board 50 facing away from the inductor structure 1a. The traces or plated copper holes 51 and 52 of the lower circuit board 50 are connected to the first lower terminal 22 of the M first metal bodies 20 and the second lower terminal 32 of the N second metal bodies 30, respectively. In other embodiments, the power module 2 can be electrically connected to other loads, a motherboard, or signal circuits via the surface of the lower circuit board 50 provided with the plurality of solder balls 53, thereby enabling the diverse applications of the power module 2. Of course, the number of electronic components added to the upper circuit board 40 and the lower circuit board 50 can be adjusted based on actual application requirements and is not limited to this embodiment.

[0060] Figures 11 to 14 The power module of another embodiment of the present invention is schematically shown. In this embodiment, the power module 2a and the inductor structure 1b are connected to each other. Figures 7 to 10 The power module 2 shown is similar to the inductor structure 1a, and the same component numbers represent the same components, structures and functions, which will not be repeated here. In this embodiment, the power module 2 includes a main circuit board 60 having an inductor structure 1b, a plurality of switching devices 43 and a bottom circuit board 70. The magnetic core 10 of the inductor structure 1b is arranged in the main circuit board 60. The main circuit board 60 includes a top surface 61 and a bottom surface 62. The top surface 61 of the main circuit board 60 is spatially opposite to the upper surface 11 of the magnetic core 10, and the bottom surface 62 of the main circuit board 60 is spatially opposite to the lower surface 12 of the magnetic core 10. M first metal bodies 20 and N second metal bodies 30 vertically penetrate the upper surface 11 and the lower surface 12 of the magnetic core 10. Each first upper terminal 21 of the M first metal bodies 20 forms a first upper solder pad 63 on the top surface 61 through a copper electroplating hole 63' of the main circuit board 60. Each first lower terminal 22 of the M first metal bodies 20 forms a first lower solder pad 64 on the bottom surface 62 through a copper electroplating hole 64' of the main circuit board 60. Furthermore, each second upper terminal 31 of the N second metal bodies 30 forms a second upper solder pad 65 on the top surface 61 through a copper electroplating hole 65' of the main circuit board 60. Each second lower terminal 32 of the N second metal bodies 30 forms a second lower solder pad 66 on the bottom surface 62 through a copper electroplating hole 66' of the main circuit board 60.

[0061] In this embodiment, the top surface 61 of the main circuit board 60 provides a first upper solder pad 63 and a second upper solder pad 65 for connecting to external electronic devices, and the bottom surface 62 of the main circuit board 60 provides a first lower solder pad 64 and a second lower solder pad 66 for connecting to external electronic devices and / or the bottom circuit board 70. Figure 5 Taking the circuit of the power module shown in FIG. 1 as an example, the inductor structure 1b in the main circuit board 60 is provided by M first metal bodies 20. Figure 5 The power module 2a includes a plurality of switching devices 43 and a plurality of input capacitors 44 corresponding to the plurality of windings Winding 1 to Winding x. Figure 5 Multiple switching devices SW1 to SWx and multiple input capacitors Cin. Multiple switching devices 43 and multiple input capacitors 44 are arranged on the top surface 61 of the main circuit board 60. The first upper pad 63 and the second upper pad 65 are electrically connected to the M first metal bodies 20 and the N second metal bodies 30 of the inductor structure 1b. In this embodiment, each first upper output terminal 21 of the M first metal bodies 20 is electrically connected to at least two switching devices 43. The multiple input capacitors 44 arranged on the top surface 61 are electrically connected to the two switching devices 43, forming Figure 5The connections of multiple switching devices SW1~SWx and multiple input capacitors Cin are shown.

[0062] In this embodiment, the first lower pad 64 and the second lower pad 66 of the bottom surface 62 of the main circuit board 60 can be used to connect the structure. Figure 5 The ground terminal GND, the output terminal of the output voltage Vo, the output capacitor Co and the load R load Etc. Wherein the output capacitor Co is, for example, arranged on the output capacitor 71 of the bottom circuit board 70. The main circuit board 60 and the bottom circuit board 70 can be connected via a connector 67. In other embodiments, the power module 2a includes a plurality of output capacitors 71 and / or a plurality of loads arranged between the bottom surface 62 of the main circuit board 60 and the bottom circuit board 70, and the plurality of output capacitors 71 and / or the plurality of loads are electrically connected to the bottom circuit board 70. In this embodiment, the power module 2a further includes a plurality of solder balls 72 arranged on the surface of the bottom circuit board 70 away from the inductor structure 1b. In one embodiment, the bottom circuit board 70 can also be electrically connected to the motherboard, signal circuit or Figure 5 The load R load In addition, in this embodiment, the bottom circuit board 70 may also include Figure 5 The ground terminal GND and the output terminal of the output voltage Vo are shown. In this embodiment, each first upper output terminal 21 of the M first metal bodies 20 serving as winding metal bodies can be electrically connected to the output terminal of the bottom circuit board 70 through the first lower solder pad 64 on the bottom surface 62 of the main circuit board 60. In one embodiment, each first lower output terminal 22 is electrically connected to at least one output terminal of the output voltage Vo. In another embodiment, each first lower output terminal 22 can also be electrically connected to each other through the traces or electroplated copper holes 64' on the main circuit board 60. Furthermore, each second lower output terminal 32 of the N second metal bodies 30 serving as grounding metal bodies is electrically connected to the ground terminal of the bottom circuit board 70. In one embodiment, the N second metal bodies 30 can also be electrically connected to each other through the traces or electroplated copper holes 65', 66' of the main circuit board 60 to achieve grounding.

[0063] In this embodiment, the main circuit board 60 is the power board for transmitting power, while the bottom circuit board 70 is the output circuit board, electrically connected to the output capacitor 71, the load, the motherboard, or the signal circuit. It should be noted that the alternating arrangement of multiple winding metal bodies and multiple grounding metal bodies in the inductor structure 1b of this embodiment helps to address issues such as core saturation, uneven windings, and high line losses. By embedding the inductor structure 1b within the main circuit board 60, the goal of improving power density and conversion efficiency is achieved in a compact structure. Of course, this embodiment is not limited to this, and will not be further described.

[0064] In summary, this case provides an inductor structure and a power module applicable thereto, which reduces the total loop length by alternately arranging a plurality of winding metal bodies and a plurality of grounded metal bodies embedded in the magnetic core in a matrix, thereby reducing line loss, improving efficiency, and effectively solving the problems of core saturation, uneven winding, and large line loss. A plurality of metal bodies are inserted into the magnetic core and partially exposed to at least one surface of the inductor structure. The plurality of metal bodies are divided into winding metal bodies and grounded metal bodies, which are arranged in an interlaced manner, and the nearest adjacent metal bodies of each winding metal body are grounded metal bodies. All winding metal bodies have one end for connecting to a switching device. The staggered arrangement design of the metal bodies can effectively reduce the coupling between the windings, improve the consistency of the inductance, and significantly shorten the loop path between the windings and the ground, thereby reducing losses and improving conversion efficiency.

[0065] The present invention may be modified in various ways by those skilled in the art, but all modifications are within the protection of the appended claims.

Claims

1. An inductor structure, characterized in that: include: A magnetic core comprising an upper surface and a lower surface disposed opposite to each other; M first metal bodies are disposed in the magnetic core, wherein the M first metal bodies pass through the magnetic core, and each of the first metal bodies forms a first upper outlet terminal and a first lower outlet terminal on the upper surface and the lower surface, and are assembled to form a winding; and N second metal bodies are disposed in the magnetic core, wherein the N second metal bodies pass through the magnetic core, and each of the second metal bodies forms a second upper outlet terminal and a second lower outlet terminal on the upper surface and the lower surface, and the second upper outlet terminal and the second lower outlet terminal have the same potential; The M first metal bodies and the N second metal bodies are arranged alternately in a matrix, and the M first metal bodies and the N second metal bodies are arranged in an equidistant array, the distance between each of the M first metal bodies and its adjacent one is greater than the distance between each of the M first metal bodies and its corresponding adjacent second metal body, M and N are integers, M≧2 and N≧2. 2 . The inductor structure according to claim 1 , wherein the M first metal bodies and the N second metal bodies vertically penetrate the upper surface and the lower surface. 3 . The inductor structure according to claim 2 , wherein the M first metal bodies and the N second metal bodies are metal pillars with the same structure. 4 . The inductor structure according to claim 1 , wherein the N second metal bodies are directly electrically connected on the upper surface or the lower surface by short-circuiting.

5. The inductor structure according to claim 1 , wherein an upper circuit board is disposed above the inductor structure and electrically connected to the inductor structure, a lower circuit board is disposed below the inductor structure and electrically connected to the inductor structure, and the N second metal bodies are electrically connected to each other through traces or plated copper holes on the upper circuit board and the lower circuit board. 6 . The inductor structure according to claim 1 , wherein the magnetic core is disposed in a main circuit board, and the N second metal bodies are electrically connected to each other through traces or copper plated holes of the main circuit board.

7. The inductor structure according to claim 6, wherein the main circuit board includes a top surface and a bottom surface, the top surface is spatially opposite to the upper surface, and the bottom surface is spatially opposite to the lower surface, the M first metal bodies and the N second metal bodies vertically penetrate the upper surface and the lower surface, each of the first upper outlet terminals forms a first upper pad on the top surface through a copper electroplating hole, and each of the second upper outlet terminals forms a second upper pad on the top surface through a copper electroplating hole, and the first upper pad and the second upper pad are electrically connected to a switching device.

8. The inductor structure according to claim 7 , wherein each of the first lower outlet terminals is formed on the bottom surface as a first lower pad through a copper electroplating hole, and each of the second lower outlet terminals is formed on the bottom surface as a second lower pad through a copper electroplating hole, and the first and second lower pads are assembled and directly soldered to a bottom circuit board.

9. The inductor structure according to claim 8, wherein the main circuit board is a power board for transmitting power, and the bottom circuit board is an output circuit board electrically connected to an output capacitor, a load, a motherboard or a signal circuit. 10 . The inductor structure according to claim 6 , wherein each of the first lower outlet terminals is electrically connected to each other through traces or copper plated holes on the main circuit board. 11 . The inductor structure according to claim 1 , wherein each of the first upper output terminals is electrically connected to at least two switching devices, and each of the first lower output terminals is electrically connected to at least one output terminal. 12 . The inductor structure according to claim 1 , wherein a direction of current flowing through the M first metal bodies is opposite to a direction of current flowing through the N second metal bodies. 13 . The inductor structure according to claim 1 , wherein the magnetic core is made of ferrite or soft magnetic material.

14. A power module, characterized in that: include: An inductor structure comprising: A magnetic core comprising an upper surface and a lower surface disposed opposite to each other; M first metal bodies are disposed in the magnetic core, wherein the M first metal bodies pass through the magnetic core, and each of the first metal bodies forms a first upper outlet terminal and a first lower outlet terminal on the upper surface and the lower surface, and are assembled to form a winding; and N second metal bodies are disposed in the magnetic core, wherein the N second metal bodies pass through the magnetic core, and each of the second metal bodies forms a second upper outlet terminal and a second lower outlet terminal on the upper surface and the lower surface, and the second upper outlet terminal and the second lower outlet terminal have the same potential; wherein the M first metal bodies and the N second metal bodies are alternately arranged in a matrix, and the M first metal bodies and the N second metal bodies are arranged in an equidistant array, and the distance between each of the M first metal bodies and an adjacent one is greater than the distance between each of the M first metal bodies and the corresponding adjacent second metal body, M and N are integers, M≧2 and N≧2; A plurality of switching devices are disposed on the upper surface, wherein the plurality of switching devices are electrically connected to the first upper output terminal and the second upper output terminal; and A bottom circuit board includes a ground terminal and an output terminal, wherein the first lower output terminal is electrically connected to the output terminal, and the second lower output terminal is electrically connected to the ground terminal. 15 . The power module according to claim 14 , wherein the M first metal bodies and the N second metal bodies vertically penetrate the upper surface and the lower surface, and the M first metal bodies and the N second metal bodies are metal columns with the same structure. 16 . The power module according to claim 14 , wherein the N second metal bodies are directly electrically connected on the upper surface or the lower surface by short-circuiting.

17. The power module according to claim 14, wherein the power module further comprises an upper circuit board and a lower circuit board, the upper circuit board is arranged above the inductor structure and electrically connected to the inductor structure, the lower circuit board is arranged below the inductor structure and electrically connected to the inductor structure, and the N second metal bodies are electrically connected to each other through traces or plated copper holes on the upper circuit board and the lower circuit board.

18. The power module according to claim 14, further comprising a main circuit board, the magnetic core being disposed in the main circuit board, and the N second metal bodies being electrically connected to each other through traces or copper plating holes of the main circuit board.

19. The power module according to claim 18, wherein the main circuit board includes a top surface and a bottom surface, the top surface is spatially opposite to the upper surface, and the bottom surface is spatially opposite to the lower surface, the M first metal bodies and the N second metal bodies vertically penetrate the upper surface and the lower surface, each of the first upper output terminals forms a first upper soldering pad on the top surface through a copper electroplating hole, and each of the first lower output terminals forms a first lower soldering pad on the bottom surface through a copper electroplating hole; each of the second upper output terminals forms a second upper soldering pad on the top surface through a copper electroplating hole, and each of the second lower output terminals forms a second lower soldering pad on the bottom surface through a copper electroplating hole, wherein the first upper soldering pad and the second upper soldering pad are electrically connected to the multiple switching devices, and the first lower soldering pad and the second lower soldering pad are electrically connected to the bottom circuit board.

20. The power module according to claim 14, wherein a plurality of the windings are connected in parallel with each other. 21 . The power module according to claim 14 , further comprising a plurality of input capacitors disposed on the upper surface and electrically connected to the plurality of switching devices.

22. The power module according to claim 14, wherein the power module further comprises a plurality of output capacitors and / or a plurality of loads disposed between the lower surface and the bottom circuit board, and the plurality of output capacitors and / or the plurality of loads are electrically connected to the bottom circuit board. 23 . The power module according to claim 14 , wherein a direction of current flowing through the M first metal bodies is opposite to a direction of current flowing through the N second metal bodies. 24 . The power module according to claim 14 , further comprising a plurality of solder balls disposed on a surface of the bottom circuit board away from the inductor structure. 25 . The power module according to claim 24 , wherein the bottom circuit board is electrically connected to a load, a motherboard or a signal circuit through a surface where the plurality of solder balls are disposed.

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