Substrate processing method

Abstract

The present invention provides a substrate processing method comprising: a disintegration process of dividing substrates into a first group and a second group so that two opposing substrates among the substrates constituting a temporary batch are grouped into different groups, and moving the first group and the second group relatively in a direction orthogonal to an arrangement direction of the substrates, thus the temporary batch is disintegrated; a half-cycle rotation process in which the second group is rotated by a half cycle so that the substrates constituting the second group are oriented in a direction opposite to the one direction; and a rearrangement process of combining the first group and the second group and alternately arranging the substrates facing the one direction and the substrates facing the opposite direction to generate batches.

Description

Technical Field

[0001] The present invention relates to a substrate processing method for semiconductor substrates, FPD (Flat Panel Display) substrates such as those for liquid crystal displays or organic EL (Electroluminescence) display devices, glass substrates for photomasks, and substrates for optical disks. Background Art

[0002] Patent document 1 describes the following substrate processing device: the same number of substrates are taken out from two carriers respectively to form a first substrate group and a second substrate group, and the second substrate group is inserted into the gaps between the substrates of the first substrate group, thereby converting the spacing to 1 / 2, forming a substrate group with twice the number of sheets, and processing them together.

[0003] In recent years, there has been a demand for further efficiency improvement of substrate processing devices. In order to increase the number of substrates processed at one time in batch processing, it is necessary to make the arrangement pitch (pitch) of the substrates narrower. What becomes a problem at this time is the orientation of the substrates. That is, in batch processing, from the viewpoint of preventing contamination of the device surface, it is preferred to arrange the substrates face to face to generate a batch lot. In order to arrange the substrates face to face with their device surfaces facing each other, the arrangement of the substrates obtained from the first carrier can only be combined with the arrangement of the substrates obtained from the second carrier after rotating the arrangement of the substrates half a circle. Therefore, according to the existing structure, even if the arrangement pitch of the substrates can be halved, the arrangement pitch of the substrates cannot be further narrowed. When the substrates obtained from the second carrier are inserted into the gap between the arrangement of the substrates obtained from the first carrier to generate a batch, the arrangement pitch of the substrates in the batch is naturally determined to be half of the original.

[0004] List of prior art documents: Japanese Patent Application Laid-Open No. 5-175179 Summary of the Invention

[0005] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate processing method for narrowing the arrangement pitch of substrates to efficiently process the substrates.

[0006] The present invention adopts the following configuration in order to solve the above-mentioned problems.

[0007] That is, the present invention provides a substrate processing method for processing a plurality of substrates having orientations defined by a front surface and a back surface at a time, the substrate processing method comprising: a substrate group obtaining process, obtaining a substrate group formed by arranging substrates facing in one direction at predetermined intervals; a first assembling process, combining a first arrangement formed by arranging first substrates facing in the one direction at predetermined intervals with the substrate group, so that the first substrate is located in a first position or a first position of a second position in the substrate group that divides the predetermined interval into three parts; a second assembling process, combining a second arrangement formed by arranging second substrates facing in the one direction at predetermined intervals with the substrate group, so that the first substrate is located in a first position or a second position in the substrate group that divides the predetermined interval into three parts; The second substrate is located at the second position to form a temporary batch; a disassembly process divides the substrates into a first group and a second group in such a manner that two opposing substrates among the substrates constituting the temporary batch become different groups, and disassembles the temporary batch by moving the first group and the second group relative to each other in a direction orthogonal to the arrangement direction of the substrates; a half-turn rotation process rotates the second group half a turn to direct the substrates constituting the second group in a direction opposite to the one direction; a rearrangement process combines the first group and the second group to alternately arrange substrates facing the one direction and substrates facing the opposite direction to generate a batch; and a treatment process immerses the batch in a treatment liquid.

[0008] [Function and Effect] The above structure forms a temporary batch with substrates facing the same direction. The substrates are then divided into a first group and a second group, with two opposing substrates forming different groups. The second group is rotated half a revolution. The first and second groups are then combined to create a batch by alternating substrates facing one direction and those facing the opposite direction. This configuration allows for a narrower pitch between substrates than with conventional methods, and enables the substrates to be arranged face-to-face.

[0009] Furthermore, in the above configuration, preferably, in the disassembling process, the temporary lot is disassembled so that substrates located at one end of the temporary lot and substrates located at the other end of the temporary lot are divided into different groups.

[0010] [Function and Effect] According to the above structure, during the disassembly process, the batch is disassembled so that the substrates at one end of the temporary batch and the substrates at the other end of the temporary batch are divided into different groups. This configuration allows the substrates constituting the batch to be oriented in a desired direction. In other words, according to the above structure, the orientation of the substrates at one end of the batch can be different from that of the substrates at the other end, thereby more reliably arranging the substrates in a face-to-face manner.

[0011] Furthermore, in the above-described configuration, it is preferable that the number of substrates constituting the batch is three times the number of substrates in the substrate group during acquisition.

[0012] [Function and Effect] With the above configuration, the number of substrates constituting a batch is three times the number of substrate groups in the process of obtaining a substrate group. This configuration prevents redundant substrates from being generated in the substrate group during batch formation. Because the substrate group is not divided into two batches, the substrate processing history of the substrates constituting the substrate group can be reliably consistent.

[0013] In addition, in the above-mentioned structure, it is preferred that there is: a first process of obtaining each substrate from a carrier, and the carrier accommodates the substrates in a horizontal posture after arranging the substrates at predetermined intervals in the vertical direction; and a second process of changing the posture of each substrate from a horizontal posture to a vertical posture, and the first process and the second process are performed before each assembly process.

[0014] [Function and Effect] The above-described structure includes: a first step for collectively receiving substrates from a carrier that stores horizontally positioned substrates arranged vertically at predetermined intervals; and a second step for collectively changing the positions of the substrates from a horizontal position to a vertical position. The first and second steps are performed before each assembly step. This configuration provides a substrate processing method that receives a first set of substrates or a second set of substrates arranged in one direction from a carrier.

[0015] Furthermore, in the above-mentioned structure, it is preferable that the predetermined interval is equal to an arrangement pitch of substrates accommodated in the carrier.

[0016] [Function and Effect] According to the above structure, the predetermined interval is equal to the arrangement pitch of the substrates accommodated in the carrier. With this structure, the pitch of the substrates can be easily changed.

[0017] Furthermore, in the above-described structure, preferably, the distance from the first position to the second position is 1 / 3 of the arrangement pitch of the substrates accommodated in the carrier.

[0018] [Action and Effect] According to the above structure, the distance from the first position to the second position is 1 / 3 of the arrangement pitch of the substrates accommodated in the carrier. If so configured, the pitch of the generated substrate arrangement can be made less than 1 / 2 of the arrangement pitch of the substrates accommodated in the carrier.

[0019] Furthermore, in the above configuration, preferably, the first position and the second position divide the predetermined interval into three equal parts.

[0020] [Function and Effect] According to the above structure, the first position and the second position divide the predetermined interval into three equal parts. If it is constructed in this way, the substrates can be arranged more neatly.

[0021] According to the present invention, it is possible to provide a substrate processing method that can narrow the arrangement pitch of substrates and efficiently process substrates. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a plan view illustrating the overall structure of the substrate processing apparatus according to the embodiment.

[0023] Figure 2 It is a schematic diagram illustrating the structure of the carrier of the example.

[0024] Figure 3 It is a perspective view for explaining each part constituting the transfer block of the embodiment.

[0025] Figure 4 It is a comparison diagram between the structure of the carrier of the embodiment and the structure of the transfer robot.

[0026] Figure 5 It is a perspective view illustrating the structure of the HVC posture changing unit according to the embodiment.

[0027] Figure 6 It is a schematic diagram illustrating the structure of the placement rod and the clamping rod in the embodiment.

[0028] Figure 7 It is a plan view illustrating the structure of each lever in the embodiment.

[0029] Figure 8 This is a cross-sectional view illustrating the groove included in the clamping rod of the embodiment.

[0030] Figure 9 Schematic diagram illustrating a pusher according to an embodiment.

[0031] Figure 10 Schematic diagram illustrating a pusher according to an embodiment.

[0032] Figure 11A This is a schematic diagram for explaining the batch combination of the embodiment.

[0033] Figure 11B This is a schematic diagram for explaining the batch combination of the embodiment.

[0034] Figure 11C This is a schematic diagram for explaining the batch combination of the embodiment.

[0035] Figure 11D This is a schematic diagram for explaining the batch combination of the embodiment.

[0036] Figure 11EThis is a schematic diagram for explaining the batch combination of the embodiment.

[0037] Figure 11F This is a schematic diagram for explaining the batch combination of the embodiment.

[0038] Figure 11G This is a schematic diagram for explaining the batch combination of the embodiment.

[0039] Figure 11H This is a schematic diagram for explaining the batch combination of the embodiment.

[0040] Figure 11I This is a schematic diagram for explaining the batch combination of the embodiment.

[0041] Figure 11J This is a schematic diagram for explaining the batch combination of the embodiment.

[0042] Figure 12 This is a schematic diagram for explaining the batch combination of the embodiment.

[0043] Figure 13 This is a schematic diagram for explaining the batch combination of the embodiment.

[0044] Figure 14 This is a schematic diagram for explaining the batch combination of the embodiment.

[0045] Figure 15 This is a schematic diagram for explaining the batch combination of the embodiment.

[0046] Figure 16 This is a schematic diagram for explaining the batch combination of the embodiment.

[0047] Figure 17A This is a schematic diagram for explaining the batch combination of the embodiment.

[0048] Figure 17B This is a schematic diagram for explaining the batch combination of the embodiment.

[0049] Figure 17C This is a schematic diagram for explaining the batch combination of the embodiment.

[0050] Figure 17D This is a schematic diagram for explaining the batch combination of the embodiment.

[0051] Figure 17E This is a schematic diagram for explaining the batch combination of the embodiment.

[0052] Figure 17F This is a schematic diagram for explaining the batch combination of the embodiment.

[0053] Figure 18This is a schematic diagram for explaining the batch combination of the embodiment.

[0054] Figure 19 This is a flowchart illustrating the flow of substrate processing in the embodiment. DETAILED DESCRIPTION

[0055] An embodiment of the present invention is described below with reference to the accompanying drawings. The substrate processing apparatus of this embodiment takes in substrates arranged at a 10mm pitch and converts the pitch to 10 / 3mm to form a batch. Various substrate treatments, including chemical treatment, are then performed on this batch. By performing substrate processing with a narrowed pitch in this manner, the amount of chemical solution required is reduced, enabling substrate processing that reduces running costs and is environmentally friendly.

[0056] The present invention relates to a substrate processing method for collectively processing multiple substrates having front and back surfaces oriented in a predetermined manner. The front surface of a substrate is the device surface on which film formation and exposure processing are performed. The back surface is the surface opposite the device surface. When the substrates are held in a horizontal position, the front surfaces of the substrates face upward.

[0057] Example

[0058] 1. Overall structure

[0059] The substrate processing apparatus 1 of the present invention is configured to perform batch processing and includes a housing 1A that houses the various blocks comprising the substrate processing apparatus 1. Housing 1A has a loading port 9 protruding from a first wall surface, which is perpendicular to the Y direction extending from the processing block 6 toward the transfer block 5. Loading port 9 can be loaded with a carrier C, which accommodates a substrate array in which horizontally positioned substrates W are arranged vertically at a specific pitch.

[0060] In this specification, for convenience, the direction in which the storage block 3, the transfer block 5 and the processing block 6 in the substrate processing device 1 are arranged is referred to as the "front-back direction X". The front-back direction X extends horizontally. The direction in the front-back direction X from the transfer block 5 in the substrate processing device 1 toward the storage block 3 is referred to as the "front". The direction opposite to the front is referred to as the "rear". The horizontally extending direction perpendicular to the front-back direction X is referred to as the "width direction Y". For convenience, one direction of the "width direction Y" is referred to as the "right", and for convenience, the other direction is referred to as the "left". For convenience, the direction (height direction) perpendicular to the front-back direction X and the width direction Y is referred to as the "vertical direction Z". In each figure, for reference, front, back, right, left, top and bottom are appropriately shown.

[0061] 2. Storage block

[0062] like Figure 1As shown, the storage block 3 has a loading port 9, which serves as an entrance for loading a carrier C containing a plurality of substrates W in a horizontal position at predetermined intervals in a vertical direction into the block. The loading port 9 is a structure that protrudes from the outer wall of the storage block 3 extending in the width direction (Y direction).

[0063] A plurality of (eg, 25) substrates W are stacked in a horizontal position at predetermined intervals within one carrier C. The carrier C containing the unprocessed substrates W to be carried into the substrate processing apparatus 1 is first placed on the load port 9 .

[0064] Figure 2 The structure of the carrier C of the present invention is described below. The carrier C is formed with a plurality of slots S extending in the horizontal direction while maintaining the surfaces of the substrates W separated from each other. The slots S are arranged in the vertical direction at a specific interval (for example, 10 mm), and each slot S accommodates a substrate W. 25 slots S are provided on one carrier C. Therefore, on the carrier C, 25 substrates W are arranged in the vertical direction at a specific interval. The loading plate 7 is located at a position dividing each slot S, and supports both ends of the substrate W together with the paired loading plates 7. Therefore, the loading plates 7 are arranged one on each side of the carrier C and on a surface parallel to the side. As a carrier C, for example, there is a closed FOUP (Front Opening Unify Pod). In the present invention, an open container can also be used as a carrier C.

[0065] The internal structure of the storage block 3 will be described. The storage block 3 includes a transport and storage unit ACB for storing and managing carriers C. The transport and storage unit ACB includes a carrier transport mechanism 11 for transporting carriers C and a shelf 13 for placing carriers C. The storage block 3 can store at least one carrier C.

[0066] The storage block 3 has a plurality of shelves 13 for mounting carriers C. The shelves 13 are provided on a partition wall separating the storage block 3 from the transfer block 5. The shelves 13 include a storage shelf 13b for temporarily mounting carriers C and a carrier mounting shelf 13a for removing substrates, which is accessed by the first transfer robot HTR of the transfer block 5.

[0067] The carrier loading shelf 13a is a structure capable of loading a carrier C. The carrier loading shelf 13a is a structure for loading a carrier C for removing a substrate W. In this embodiment, one carrier loading shelf 13a is provided, but a plurality of carrier loading shelves 13a may be provided. The carrier transport mechanism 11 takes in a carrier C containing an unprocessed substrate W from the loading port 9 and loads it onto the carrier loading shelf 13a for substrate removal. At this time, the carrier transport mechanism 11 can also temporarily load the carrier C onto the storage shelf 13b before loading the carrier C onto the carrier loading shelf 13a. The number of carrier loading shelves 13a included in the storage block 3 is one or more.

[0068] The carrier loading shelf 13a also houses empty carriers C for storing processed substrates W. Processed substrates W are stored on the carriers C waiting on the carrier loading shelf 13a. The carrier transport mechanism 11 retrieves a carrier C containing processed substrates W from the carrier loading shelf 13a and transports it to the load port 9. When transporting a carrier C to the load port 9, the carrier transport mechanism 11 may temporarily place the carrier C on the storage shelf 13b.

[0069] 3. Transfer block

[0070] The transfer block 5 is adjacent to the carrier loading shelf 13a. The transfer block 5 is arranged adjacent to the rear of the storage block 3. The transfer block 5 includes: a transport robot HTR capable of accessing the carrier C placed on the carrier loading shelf 13a for substrate removal; an HVC posture changer 23 for collectively changing the posture of multiple substrates W from a horizontal position to a vertical position; and a pushing mechanism 25. The HVC posture changer 23 collectively changes the posture of multiple substrates W from a horizontal position to a vertical position. Furthermore, a substrate transfer position PP is provided in the transfer block 5 for transferring multiple substrates W to the forward and backward transfer mechanism WTR provided in the collective transfer area R2.

[0071] like Figure 3 As shown, the transport robot HTR, the HVC posture changing unit 23, and the pushing mechanism 25 are arranged in sequence along the Y direction. The transport robot HTR has a hand 211 that can hold a substrate W in a horizontal position. The hand 211 can hold one substrate W. The hand 211 of the transport robot HTR is arranged in the vertical direction. The transport robot HTR can transport multiple substrates W at a time by holding a substrate with each hand 211. The moving support mechanism 213 is a mechanism that constitutes the transport robot HTR. It is a structure that rotates the hand 211 around the vertical axis, raises and lowers the hand 211, moves the hand 211 forward and backward in the front-to-back direction X, and moves horizontally in the left-to-right direction Y.

[0072] Figure 4 FIG. 2 shows a situation in which the transport robot HTR receives the substrate W in the carrier C using the hand 211. Figure 4As shown, the hands 211 are arranged in the vertical direction at an arrangement pitch of the slots S provided on the carrier C. That is, the hands 211 are arranged at a pitch of 10 mm. 10 mm corresponds to the predetermined interval of the present invention, and is represented by the arrangement pitch Da in the respective drawings. The transport robot HTR transports all substrates W arranged at intervals of 10 mm on the carrier C at one time. The surfaces of the substrates W stored in the carrier C are all facing upward, so the substrates W pulled out by the transport robot HTR are all facing upward. In addition, each hand 211 is provided with a guide 214 for abutting the peripheral edge of the substrate. The guide is provided at the front end and the base end of a pair of blades constituting the hand 211. Therefore, four guides 214 are provided on the hand 211.

[0073] The transport robot HTR has 25 hands 211. The transport robot HTR transports 25 substrates stored in the carrier C collectively using these hands.

[0074] Figure 3 The HVC posture changer 23 shown is a structure that changes the substrate W removed from the carrier C by the transport robot HTR from a horizontal posture to a vertical posture. The HVC posture changer 23 includes a pair of loading rods 231 and a pair of clamping rods 232 extending in the longitudinal direction (Z direction). The support table 237 has a support surface extending in the XY plane for supporting the loading rods 231 and clamping rods 232. The rotation drive mechanism 238 is a structure that rotates the loading rods 231 and clamping rods 232 together with the support table 237 by 90 degrees. This rotation causes the loading rods 231 and clamping rods 232 to extend in the left-right direction (Y direction).

[0075] The loading rods 231 are equipped with rod drive mechanisms 235 that rotate about rotation axes extending along their extension directions. The pair of rod drive mechanisms 235 allow the pair of loading rods 231 to rotate synchronously. Furthermore, the rod drive mechanisms 235 can extend and retract the loading rods 231. A specific example of how the loading rods 231 are driven by the rod drive mechanisms 235 will be described later.

[0076] The clamping rod 232 includes a rod rotating mechanism 236 that rotates around a rotation axis along the extending direction of the clamping rod 232. The pair of rod rotating mechanisms 236 allow the pair of clamping rods 232 to rotate synchronously.

[0077] Figure 5The flat plate 233 and the flat plate 239 of the loading rod 231 are described. The flat plates 233 are arranged on the loading rod 231 at intervals of 10 mm along the extension direction of the loading rod 231. Each flat plate 233 is a plate extending in a plane perpendicular to the arrangement direction of the flat plates 233, and the substrate W is supported by the loading rod 231 by placing the end of the substrate W on the upper surface of the flat plate 233. In addition, it is not possible to hold the entire substrate W by holding only one end of the substrate W, so two loading rods 231 are provided in the HVC posture changing section 23. One end of the substrate W is held by the flat plate 233 of one loading rod 231, and the other end of the substrate W is held by the flat plate 233 of the other loading rod 231. One end and the other end are separated by a distance equal to the diameter of the substrate W. Therefore, as Figure 7 As shown in (a), the pair of loading rods 231 are spaced apart by the diameter of the substrate W. This prevents the substrate W held by the plate 233 from floating off the plate 233. Because the weight of the substrate W is applied symmetrically to the plate 233, the weight of the substrate W on the plate 233 is balanced. Furthermore, the pair of loading rods 231 are parallel to each other.

[0078] The flat plates 239 are arranged on the supporting rods 231 at a pitch of 20 / 3 mm along the extending direction of the supporting rods 231. The 20 / 3 mm pitch is referred to as the arrangement pitch Db. The flat plates 239 are plates extending on a plane perpendicular to the arrangement direction of the flat plates 233. Like the flat plates 233, the flat plates 239 are supported by the supporting rods 231 by placing the end of the substrate W on the upper surface of the flat plates 233. Two supporting rods 231 are provided in the HVC posture changing section 23. One end of the substrate W is held by the flat plate 239 of one supporting rod 231, and the other end of the substrate W is held by the flat plate 239 of the other supporting rod 231.

[0079] Thus, the loading rod 231 has one side on which the flat plates 233 are arranged and the other side on which the flat plates 239 are arranged. The loading rod 231 can rotate about a rotation axis along the extension direction, and can switch the side facing the substrate W between the one side on which the flat plates 233 are arranged and the other side on which the flat plates 239 are arranged. In the initial state of the loading rod 231, as shown in FIG. Figure 5 As shown, one surface of the flat plate 233 faces the substrate W. Therefore, in the initial state, the HVC posture changing unit 23 holds the substrate W using the flat plate 233 .

[0080] Figure 5The clamping plate 234 and the clamping plate 230 of the clamping rod 232 are described. The clamping plate 234 has an arc edge 234a along the curve of the substrate W, and a V-groove 234b for clamping the substrate W is provided on the arc edge 234a. The substrate W is in a shape along the curve of the arc edge 234a, so the substrate W is clamped by the V-groove 234b of the arc edge 234a. The clamping plates 234 are arranged on the clamping rod 232 at a pitch of 10 mm along the extension direction of the clamping rod 232. Each clamping plate 234 is a plate extending on a plane orthogonal to the arrangement direction of the clamping plates 234, and a portion of the substrate W is clamped in the V-groove 234b of the arc edge 234a, whereby the substrate W is clamped by the clamping rod 232.

[0081] In addition, since clamping only a part of the substrate W cannot achieve clamping of the entire substrate W, two clamping rods 232 are provided in the HVC posture changing section 23. It is a structure in which a part of the substrate W is clamped by the clamping plate 234 of one clamping rod 232, and a part of the substrate W is clamped by the clamping plate 234 of the other clamping rod 232. A pair of clamping rods 232 are separated by a distance shorter than the diameter of the substrate W. The pair of clamping rods 232 is a structure for clamping the substrate W in a vertical posture, so it is sufficient as long as it is a structure for clamping the lower side of the substrate W, and there is no need to separate the diameter of the substrate W like the loading rod 231. However, as Figure 10 As shown, the clamping rods 232 are arranged at positions offset from the bottom of the vertically positioned substrate W, so two rods are required: one for clamping the right side of the substrate W when viewed from the bottom, and one for clamping the left side of the substrate W when viewed from the bottom. Figure 5 As shown in (c), the two clamping rods 232 clamp the substrate W from both sides through the V-groove 234b of the clamping plate 234. In addition, the pair of clamping rods 232 are parallel to each other. Figure 8 As shown, the two clamping bars 232 clamp the substrate W from both sides via the V-grooves 234b of the clamping plate 234. The pair of clamping bars 232 are parallel to each other.

[0082] The clamping plates 230 are arranged on the clamping rods 232 at 20 / 3 mm intervals along the extending direction of the clamping rods 232. The clamping plates 230 extend in a plane perpendicular to the arrangement direction of the clamping plates 230. Like the clamping plates 234, the clamping plates 230 have arcuate edges 230 a that follow the curve of the substrate W. V-grooves 230 b for clamping the substrate W are provided on the arcuate edges 230 a.

[0083] Thus, the clamping rod 232 has one side on which the clamping plates 234 are arranged and the other side on which the clamping plates 230 are arranged. The clamping plates 234 can rotate about a rotation axis along the extension direction, and the side facing the substrate W can be switched between one side of the clamping plates 234 and the other side of the clamping plates 230. In the initial state of the clamping rod 232, as shown in FIG. Figure 5As shown, one surface of the clamping plate 234 faces the substrate W. Therefore, in the initial state, the HVC posture changing unit 23 holds the substrate W using the clamping plate 234 .

[0084] Figure 6 The arrangement pitch of the flat plates 233 and 239 on the support rod 231 is described below. The arrangement pitch Da of the flat plates 233 is 10 mm, and the arrangement pitch Db of the flat plates 239 is 20 / 3 mm. Therefore, one flat plate 233 is located between a pair of flat plates 233 separated by a width of 20 mm in the direction in which the support rod 231 extends. On the other hand, two flat plates 239 are located between a pair of flat plates 239 separated by a width of 20 mm in the direction in which the support rod 231 extends.

[0085] Figure 6 The arrangement pitch of the clamping plates 234 and 230 of the clamping rod 232 is also described. The arrangement pitch Da of the clamping plates 234 is 10 mm, and the arrangement pitch Db of the clamping plates 230 is 20 / 3 mm. Therefore, one clamping plate 234 is located between a pair of clamping plates 234 separated by a width of 20 mm in the direction in which the clamping rod 232 extends. On the other hand, two clamping plates 230 are located between a pair of clamping plates 230 separated by a width of 20 mm in the direction in which the clamping rod 232 extends.

[0086] Figure 3 The pushing mechanism 25 includes a pusher 251 that can align substrates W in a vertical position horizontally. The pusher 251 is a semi-tube-shaped structure that follows the curve of the bottom of the substrate W. In the initial state, the U-shaped groove 251a of the pusher 251, which forms the semi-tube, extends in the left-right direction Y. In this state, the pusher 251 can receive the substrate W from the HVC position changing unit 23.

[0087] Figure 9 2 is a cross-sectional view illustrating the structure of the pusher 251. The pusher 251 has a plurality of V-shaped clamping grooves 252. The clamping grooves 252 are arranged in a V-shaped manner. Figure 3 The arrangement pitch of the clamping groove 252 is 10 / 3 mm. Figure 9 As shown, the substrates W are clamped one by one in each clamping groove 252 .

[0088] Figure 10 The relationship between the pair of clamping rods 232 and the pushing member 251 will be described. Figure 10 A pair of clamping rods 232 and Figure 3 The state is different, and the support platform 237 is tilted 90 degrees together with the rotation drive mechanism 238. Therefore, Figure 10 The clamping rod 232 extends in the horizontal direction. Figure 10As can be seen, the pusher 251 is located at a position clamped by the pair of clamping bars 232 in the front-rear direction X. Therefore, the pair of clamping bars 232 and the pusher 251 can cooperate to clamp the substrate W in a vertical posture without interfering with each other.

[0089] Figure 3 The pusher rotating mechanism 253 can rotate the pusher 251 at least 180 degrees. The pusher rotating mechanism 253 can rotate the pusher 251 in the initial state to make the pusher 251 face the opposite direction, and can also rotate the pusher 251 facing the opposite direction to return the pusher 251 to the initial state.

[0090] The pusher shifting mechanism 254 can reciprocate the pusher 251 in the initial state in the left-right direction Y. The pusher shifting mechanism 254 can move the pusher 251 closer to the HVC posture changing unit 23 or closer to the forward and backward transport mechanism WTR.

[0091] The pusher lifting mechanism 255 can make the pusher 251 of the initial position rise to the upper empty position. In addition, the pusher lifting mechanism 255 can also make the pusher 251 of the upper empty position return to the initial position.

[0092] 4. Change of spacing in transfer blocks

[0093] The substrate processing apparatus of this embodiment can change the arrangement pitch of substrates W in the transfer block 5, so this aspect will be described below. Substrates W arranged at a 10 mm pitch on the carrier C are first rearranged at a 10 / 3 mm pitch in the transfer block 5. The temporary batch thus formed is transformed into a batch in which substrates are arranged face-to-face by the operation of the pushing mechanism 25. This configuration will be described in detail below.

[0094] Figure 11A The arrangement pitch of the substrates in each configuration is compared. The carrier C is provided with mounting plates 7, forming each slot S, arranged at 10 mm intervals. These mounting plates 7 have the same structure as the flat plate 233 in the mounting rod 231. Therefore, the mounting plates 7 are arranged vertically not only on one side of the carrier C but also on the other side. By placing both ends of the substrate W on a pair of facing mounting plates 7, the substrate W is retained within the carrier C.

[0095] Flat plates 233 are arranged at 10 mm pitch on the placement bars 231 of the HVC posture changing unit 23. Therefore, the 25 substrates W held by the carrier C are collectively transported to the HVC posture changing unit 23. This transport is achieved by the transport robot HTR.

[0096] Figure 11BThe diagram briefly shows a situation where 25 substrates W are arranged on a carrier C. In the following description, three different carriers C appear, so Figure 11B The carrier C in FIG. 1 is referred to as a first carrier C1 . 25 substrates W are arranged at a pitch of 10 mm on the first carrier C1 .

[0097] Figure 11C 1 and 2. The state in which the substrate W accommodated in the first carrier C1 is delivered to the HVC posture changing unit 23 by the transport robot HTR is shown. Figure 7 (a) shows a state where both ends of the substrate W are supported by the pair of placement rods 231 at this time.

[0098] At this point, the periphery of the substrate W contacts the clamping plates 234 of the pair of clamping bars 232. Specifically, the periphery of the substrate W is clamped in the V-grooves of the clamping plates 234. Therefore, even if the support table 237 is rotated 90° in this state, the substrate W is clamped by the V-grooves 234b of the clamping plates 234, preventing it from slipping off the HVC posture changing unit 23.

[0099] In addition, Figure 11C FIG also shows a case where the loading rod 231 supports the substrate W via the flat plate 233. Figure 11C FIG. 2 shows a state where the clamping rods 232 clamp the substrate W via the clamping plates 234 .

[0100] Figure 11D The figure shows the state of the rotation drive mechanism 238 in the HVC posture changing unit 23 during operation. This operation rotates the support table 237 90 degrees, and the placement rods 231 and clamping rods 232 are horizontally extended. As a result, the load of the substrate W is transferred from the placement rods 231 to the clamping rods 232, and the flat plate 233 of the placement rods 231 is in contact only with the substrate W. Figure 11D The figure shows the situation when the placement rod 231 is retracted by the rod driving mechanism 235. When the placement rod 231 is retracted, the plate 233 moves away from the substrate W. Even with this movement, the substrate W does not move with the movement of the plate 233 because it is supported by the clamping rods 232.

[0101] If the flat plate 233 is kept away from the substrate W, the flat plate 233 will not damage the back surface of the substrate W even if the substrate W clamped by the clamping rods 232 is lifted by the pusher 251 .

[0102] Figure 11EThe figure shows the situation when the loading rod 231 is rotated 90 degrees by the rod driving mechanism 235. The flat plate 233 in the loading rod 231 is directed upward by the rotation of the loading rod 231. The movement of the flat plate 233 is performed above the pusher 251. The loading rod 231 and the substrate W clamped by the clamping rod 232 approach the pusher 251, but at this time, the flat plate 233 does not collide with the substrate W held by the pusher 251. In addition, Figure 11E The pusher 251 does not clamp the substrate W, so the rotation of the plate 233 can be omitted.

[0103] Figure 11F The following figure shows the situation when the pusher 251 is subsequently raised. As a result, the bottom of the substrate W, clamped by the clamping rods 232, fits into the clamping grooves 252 of the pusher 251. If the pusher 251 is further raised in this state, the substrate W is removed from the clamping plates 234 of the clamping rods 232. In this manner, the substrate W is transferred from the HVC posture changing unit 23 to the pushing mechanism 25.

[0104] Thereafter, the pusher 251 rises to an upper position UR set above the placement rod 231. The pusher 251 at the upper position UR does not collide with the placement rod 231 that has returned to its upright state. Figure 11F The case where the loading rod 231 and the clamping rod 232 are moved to the imaginary position IR shown by the dotted line by the rotation drive mechanism 238 is also described. At this time, the retracted loading rod 231 returns to its original extended state. In addition, the loading rod 231 rotates in the reverse direction and returns to its original position. Figure 11C The original state described in .

[0105] In this way, the substrates W arranged at a pitch of 10 mm are handed over from the HVC posture changing part 23 to the pushing mechanism 25. At this time, the clamping grooves 252 in the pushing member 251 have grooves for clamping the substrates W and empty grooves that do not clamp the substrates W. The grooves for clamping the substrates W are spaced three times the arrangement pitch of the clamping grooves 252. This is because the arrangement pitch of the clamping grooves 252 is 10 / 3 mm. The arrangement pitch of the substrates W of 10 mm is equivalent to exactly three times the arrangement pitch of the clamping grooves 252. For ease of explanation, the substrates W arranged on the pushing member 251 at this time are referred to as the initial substrate group. The initial substrate group is equivalent to the substrate group of the present invention. The initial substrate group is composed of substrates facing one direction arranged at intervals of 10 mm. 10 mm is equivalent to the predetermined interval of the present invention.

[0106] Figure 11GThe dotted line illustrates the transfer of substrates W (first substrates) from the second carrier C2 to the HVC position changer 23. The second carrier C2 is a new carrier that is transferred by the carrier transfer mechanism 11 to the carrier placement shelf 13a, replacing the empty first carrier C1. This substrate transfer process corresponds to the first process of the present invention. In the first process, each substrate is collectively removed from the second carrier C2, which holds the first substrates. These first substrates are arranged in a horizontal position, spaced 10 mm apart in the vertical direction Z.

[0107] Figure 11H The following figure shows the situation when the substrate W held by the HVC posture changer 23 is subsequently transferred to the pusher 251. The gripping grooves 252 of the pusher 251, which already hold a substrate W from the first carrier C1, are unable to grip any further substrates W. Therefore, the substrate W held by the HVC posture changer 23 is transferred to a position offset from the substrate W on the first carrier C1 by one pitch in the arrangement of the gripping grooves 252 and is then positioned in the existing gripping grooves 252. This alignment of the substrate W and the pusher 251 is achieved by the pusher shifting mechanism 254.

[0108] At this time, execute Figure 11D The tilting of the loading rod 231 and the clamping rod 232 and the contraction of the loading rod 231 are described in detail. By tilting the clamping rod 232, the posture of each substrate W is transformed from a horizontal posture to a vertical posture. This action is equivalent to the second process of the present invention. Similarly, in Figure 11H Also omitted Figure 11E The rotation of the loading rod 231 described in Figure 11F The insertion of the substrate W into the pusher 251, the ascent and descent of the pusher 251, the rising action of the placement rod 231 and the clamping rod 232, the extension action of the placement rod 231, and the reverse action of the placement rod 231 are described in detail.

[0109] In this way, the substrate W of the second carrier C2 is transferred from the HVC posture conversion unit 23 to the pushing mechanism 25. At this time, the pushing member 251 is alternately provided with two consecutive areas of clamping grooves 252 for clamping the substrate W and areas where empty grooves are located without clamping the substrate W. That is, by combining the first arrangement in which the first substrates facing one direction are arranged at intervals of 10 mm and the initial substrate group, the first substrate is positioned at a predetermined position (first position P1) in the pushing member 251. For the first position P1, reference can be made to Figure 12 .

[0110] Figure 11IThe dotted line illustrates the transfer of substrates W (second substrates) from the third carrier C3 to the HVC position changer 23. The third carrier C3 is a new carrier that is transferred by the carrier transfer mechanism 11 to the carrier placement shelf 13a, replacing the empty second carrier C2. This substrate transfer process corresponds to the first process of the present invention. In the first process, each substrate is collectively removed from the third carrier C3, which holds the second substrates. These second substrates are horizontally positioned substrates W arranged at intervals of 10 mm in the vertical direction Z.

[0111] Figure 11J The following figure shows the situation when the substrate W held by the HVC posture changer 23 is subsequently transferred to the pusher 251. The gripping grooves 252 of the pusher 251, which already hold substrates W from the first carrier C1 and the second carrier C2, are unable to hold any further substrates W. Therefore, the substrate W held by the HVC posture changer 23 is transferred to a position offset from the substrate W on the second carrier C2 by one pitch in the arrangement of the gripping grooves 252 and is then positioned in the existing gripping grooves 252. This alignment of the substrate W and the pusher 251 is achieved by the pusher shifting mechanism 254.

[0112] At this time, execute Figure 11D The tilting of the loading rod 231 and the clamping rod 232 and the contraction of the loading rod 231 are described in detail. By tilting the clamping rod 232, the posture of each substrate W is transformed from a horizontal posture to a vertical posture. This action is equivalent to the second process of the present invention. Similarly, in Figure 11H Also omitted Figure 11E The rotation of the loading rod 231 described in Figure 11F The insertion of the substrate W into the pusher 251, the ascent and descent of the pusher 251, the rising action of the placement rod 231 and the clamping rod 232, the extension action of the placement rod 231, and the reverse action of the placement rod 231 are described in detail.

[0113] Thus, the substrate W on the third carrier C3 is transferred from the HVC posture changing unit 23 to the pushing mechanism 25. At this time, the gripping grooves 252 of the pushing member 251 all grip the substrates W. Thus, 75 substrates W are arranged on the pushing member 251 at a pitch of 10 / 3 mm.

[0114] The substrate array thus generated is referred to as a temporary batch TL. If the substrates W held on the carrier C are arranged at a pitch of 10 mm, the arrangement pitch of the substrates W on the carrier C is changed from 10 mm to 10 / 3 mm in the transfer block 5. That is, by combining the second arrangement in which the second substrates facing one direction are arranged at a pitch of 10 mm with the initial substrate group, the second substrate is positioned at a predetermined position (second position P2) in the pusher 251. The second position P2 can be referred to as Figure 12 .

[0115] Figure 12 Let's explain the temporary batch TL. In the temporary batch TL, substrates W from the third carrier C3, substrates W from the second carrier C2, and substrates W from the first carrier C1 are arranged in this order, with a 10 / 3 mm pitch. These substrates W are all oriented in the same direction. Therefore, the temporary batch TL is formed by arranging the substrates W in a face-to-back arrangement.

[0116] Next, the relationship between the clamping groove 252 of the pusher 251 and the substrate W will be described. The clamping groove 252 is located at three positions: the reference position P for the substrate W on the first carrier C1, the first position P1 for the substrate W on the second carrier C2, and the second position P2 for the substrate W on the third carrier C3. The reference positions P are arranged at 10 mm intervals in the pusher 251, with the first position P1 and the second position P2 dividing the 10 mm distance between the reference positions P into three equal parts. Specifically, the first position P1 and the second position P2 divide the 10 mm distance between the reference positions P into three equal parts. Therefore, the distance from the first position P1 to the second position P2 is 1 / 3 the arrangement pitch of the substrates W stored in the carrier C.

[0117] 5. Rearrangement of temporary batches

[0118] In this configuration of the temporary lot TL, the orientation of the arranged substrates W remains constant. This arrangement is not optimal for batch chemical processing. The transfer block 5 of this embodiment can change the arrangement of the substrates W from face-to-back to face-to-face by disassembling and rearranging the temporary lot TL.

[0119] Figure 13 express Figure 11J The pusher 251 in the state of being raised to the upper position UR set above the placement rod 231. In this way, when the arrangement of the substrates W held by the pusher 251 is changed, the pusher 251 is accompanied by an upward movement. This is because when the arrangement is changed, a part of the substrates W held by the pusher 251 needs to be handed over to the HVC posture changing unit 23.

[0120] Figure 13 The figure also shows the clamping rod 232 in the upright position having rotated half a turn about a rotation axis parallel to its extending direction. Before the half-turn, the clamping rod 232 clamps the substrate W via the clamping plate 234. However, after the half-turn, the clamping rod 232 clamps the substrate W via the clamping plate 230. Figure 14The following describes how the arrangement pitch of the clamping plates can be changed by rotating the clamping rods 232. Before a half-turn, the clamping rods 232 can collectively clamp substrates W arranged at a 10 mm pitch. After a half-turn, the clamping rods 232 can collectively clamp substrates W arranged at a 20 / 3 mm pitch.

[0121] However, the clamping rod 232 cooperates with the paired clamping rods 232 to clamp the substrate W, so the pair of clamping rods 232 performs a half-turn motion. Before the half-turn, the pair of clamping rods 232 have their clamping plates 234 facing each other, but after the half-turn, the pair of clamping rods 232 have their clamping plates 230 facing each other.

[0122] Figure 15 Next, the HVC posture changing unit 23 is operated, and the upright placement rod 231 and the clamping rod 232 are rotated 90 degrees.

[0123] Figure 16 (a) shows the pusher 251 in the overhead position beginning to descend in order to transfer the substrate W to the HVC posture changer 23. As can be seen from this figure, the arrangement pitch of the clamping plates 230 is longer than the arrangement pitch of the substrates W in the temporary lot TL. Therefore, the number of clamping plates 230 is less than the number of substrates W in the temporary lot TL.

[0124] Figure 16 (b) shows the situation when the temporary batch TL held by the pusher 251 is handed over to the clamping rod 232. The clamping rod 232 is unable to clamp all the substrates W in the temporary batch TL. This is because the number of clamping plates 230 is less than the number of substrates W in the temporary batch TL. As a result, half of the substrates W constituting the temporary batch TL are clamped by the corresponding clamping plates 230, while the remaining half remain unclamped by the clamping plates 230 and remain held by the pusher 251. Figure 16 (b) illustrates a case where the substrates W clamped by the clamping plates 230 and the substrates W held by the pushers 251 are alternately arranged.

[0125] The pusher 251 continues to descend even after the substrate W is delivered to the clamping rods 232 .

[0126] Figure 17A The figure shows the situation after the pusher 251 passes through the clamping rod 232. Thus, the temporary batch TL is divided into a first group of substrates W1 arranged at a 20 / 3 mm pitch and a second group of substrates W2 also arranged at a 20 / 3 mm pitch. If the first group of substrates W1 is designated the first group and the second group of substrates W2 is designated the second group, the temporary batch TL is divided into the first and second groups. The first group of substrates is clamped by the clamping rod 232, while the second group of substrates is held by the pusher 251.

[0127] Figure 17A The rotation of the loading rod 231 around the left and right axis is described. When the flat plate is inserted into the gap of the first group of substrates W1, the arrangement pitch of the first group of substrates W1 must be consistent with the arrangement pitch of the flat plate. The arrangement pitch of the first group of substrates W1 is 20 / 3mm. Figure 5 The arrangement pitch of the flat plates 233 described in FIG is 10 mm. Therefore, when the flat plates 233 are positioned between the first set of substrates W1 , the arrangement pitches do not match, and the first set of substrates W1 collides with the flat plates 233 .

[0128] Consider a situation where the mounting rod 231 in this example has flat plates 239 arranged at a 20 / 3 mm pitch. When the mounting rod 231 is rotated so that the flat plates 239 are positioned between the first group of substrates W1, the first group of substrates W1 and the flat plates 239 do not collide because the pitches are aligned.

[0129] Furthermore, this rotational movement is performed with the loading rod 231 in the retracted position. When the same movement is attempted with the loading rod 231 in the extended position, the flat plate 239 collides with the first group of substrates W1. This is because the position of the flat plate 239 in the left-right direction Y of the loading rod 231 in the extended position coincides with the position of the first group of substrates W1 clamped by the clamping rods 232 in the left-right direction Y. Therefore, when inserting the flat plate 239 into the gap between the first group of substrates W1, it is necessary to displace the flat plate 239 in the left-right direction Y relative to the first group of substrates W1.

[0130] When the loading rods 231 rotate and the flat plate 239 is inserted into the gap between the first group of substrates W1, the loading rods 231 are extended. As a result, the flat plate 239 contacts the back surface of the first group of substrates W1, allowing the substrates W to be securely held on the loading rods 231 even when the loading rods 231 are raised.

[0131] Figure 17B The following figure shows the situation when the HVC posture changing unit 23 is activated and the placement rods 231 are in the upright position. At this time, the clamping rods 232 merely clamp the ends of the first group of substrates W1, and therefore cannot maintain the first group of substrates W1 in a horizontal position. In this regard, the flat plates 239 on the placement rods 231 can hold the center of the first group of substrates W1. Therefore, even when the clamping rods 232 are in the upright position, the first group of substrates W1 in a horizontal position are reliably held by the pair of placement rods 231.

[0132] Figure 17BThe pusher 251 is shown rising. The placement rod 231 and the clamping rod 232 in the HVC posture changing unit 23 have already rotated 90 degrees and retracted from the pusher 251. Therefore, even if the pusher 251 rises, it will not collide with the clamping rod 232 and the placement rod 231.

[0133] Figure 17C The pusher 251 is shown rotating half a circle above the HVC posture changing unit 23. The pusher 251 rotates about the vertical axis by the operation of the pusher rotating mechanism 253. By performing this operation, all the second group of substrates W2 facing in one direction face in the opposite direction.

[0134] Figure 17D The figure shows the situation where the pusher 251 descends after rotating half a circle. The pusher 251 passes through the arrangement of the first group of substrates W1 and stops at a lower position relative to the first group of substrates W1.

[0135] Figure 17E After the description, the HVC posture changing unit 23 works, and the upright loading rod 231 and the clamping rod 232 rotate 90 degrees. Through this action, the HVC posture changing unit 23 is ready to hand over the first group of substrates W1 to the pushing member 251. Figure 17E Before the state of Figure 11D 、 Figure 11E The retracting and rotating actions described in the above are used to withdraw the clamping plate 230 from the gap between the first group of substrates W1. If such an action is performed in advance, the clamping plate 230 will not collide with the pusher 251 exposed from below and the second group of substrates W2 supported by it.

[0136] Figure 17E It also shows the situation when the pusher 251 starts to rise after the placement rod 231 and the clamping rod 232 have fallen down.

[0137] Figure 17F (a) shows the situation when the pusher 251 receives the first group of substrates W1 from the clamping rods 232. At this time, the pusher 251 generates a batch BL in which the first group of substrates W1 facing one direction and the second group of substrates W2 facing the opposite direction are alternately arranged.

[0138] The pusher 251 continues to rise after receiving the first group of substrates W1 from the clamping rods 232 .

[0139] Figure 17F (b) shows the situation after the pusher 251 pulls the first group of substrates W1 out of the clamping rods 232. In this way, the batch BL of this example is produced.

[0140] The generation of the batch BL is carried out according to the following steps. First, the substrates W constituting the temporary batch TL are divided into the first group and the second group in such a manner that two opposing substrates W become different groups. Then, the temporary batch TL is disassembled by moving the first group and the second group relative to each other in a direction (vertical direction Z) orthogonal to the arrangement direction of the substrates (left-right direction Y). Then, the second group of substrates W2 rotates half a circle. As a result, the second group of substrates W2 faces a direction opposite to the initial direction. Finally, the first group of substrates W1 and the second group of substrates W2 are combined, and the first group of substrates W1 facing one direction and the second group of substrates W2 facing the opposite direction are alternately arranged. The batch BL is formed by arranging the substrates W in such a face-to-face manner.

[0141] The number of substrates W constituting the lot BL is 75, which is the same as the number of substrates W in the temporary lot TL. Therefore, the number of substrates constituting the lot BL is three times that of the initial substrate group.

[0142] Figure 18 The batch BL is described below. In the batch BL, a first group of substrates W1 facing one direction and a second group of substrates W2 facing the opposite direction are repeatedly arranged at a 10 / 3 mm pitch. Therefore, the batch BL is formed by arranging the substrates W in a face-to-face manner.

[0143] 6. Maintaining batches in transfer blocks

[0144] The transfer block 5 has two locations capable of holding a batch BL. One of these locations is a pusher 251. The pusher 251 is capable of reciprocating between an initial position, where it can transfer substrates W to the HVC posture changer 23, and a transfer position PP, where it can transfer the batch BL to the forward / retractable transport mechanism WTR. This reciprocating movement is achieved by a pusher shifting mechanism 254.

[0145] The transfer block 5 includes a batch support portion 33 as a portion capable of holding the batch BL separately from the pusher 251. The batch support portion 33 serves as a batch holding portion for temporarily evacuating the batch BL when congestion of the batch BL occurs between the transfer block 5 and the processing block 6.

[0146] 7. Processing Blocks

[0147] The following, Figure 1 The structure of the processing block 6 described in [ 1 ] will now be described. The processing block 6 is adjacent to the transfer block 5. The processing block 6 performs batch processing on the aforementioned batch BL. The processing block 6 is divided into a batch processing area R1 and a collective transfer area R2, which are arranged along the width direction (Y direction). Each area extends along the front-to-back direction (X direction). Specifically, the batch processing area R1 is located within the processing block 6. The collective transfer area R2 is adjacent to the batch processing area R1 and is located at the leftmost side of the processing block 6.

[0148] The batch processing area R1 in the processing block 6 is a rectangular area extending in the front-to-back direction (X direction). One end (front side) of the batch processing area R1 is adjacent to the transfer block 5. The other end (rear side) of the batch processing area R1 extends away from the transfer block 5. When the batch BL is transferred from the transfer block 5 to the processing block 6, the forward and backward transfer mechanism WTR of the processing block 6 is used.

[0149] The forward and backward transport mechanism WTR collectively transports a plurality of substrates W in a vertical position between the transfer block 5, the batch processing units BPU1 to BPU6, and the batch drying chamber DC. The forward and backward transport mechanism WTR can hold a batch BL consisting of substrates W arranged at a 10 / 3 mm pitch.

[0150] Batch processing region R1 includes a batch processing section for performing batch processing. Specifically, batch processing region R1 includes a batch drying chamber DC for drying multiple substrates W collectively, and a plurality of batch processing units BPU1 to BPU6 for performing immersion processing on multiple substrates W collectively, arranged in the direction in which batch processing region R1 extends. Batch processing units BPU1 to BPU6 collectively perform immersion processing on multiple substrates in a vertical position. The configuration of batch drying chamber DC and batch processing units BPU1 to BPU6 will be described in detail. Batch drying chamber DC is adjacent to transfer block 5 from the rear. First batch processing unit BPU1 is adjacent to batch drying chamber DC from the rear. Second batch processing unit BPU2 is adjacent to first batch processing unit BPU1 from the rear. Third batch processing unit BPU3 is adjacent to second batch processing unit BPU2 from the rear. Fourth batch processing unit BPU4 is adjacent to third batch processing unit BPU3 from the rear. Fifth batch processing unit BPU5 is adjacent to fourth batch processing unit BPU4 from the rear. The sixth batch processing unit BPU6 is adjacent to the rear of the fifth batch processing unit BPU5. Therefore, the batch drying chamber DC, the first batch processing unit BPU1, the second batch processing unit BPU2, the third batch processing unit BPU3, the fourth batch processing unit BPU4, the fifth batch processing unit BPU5, and the sixth batch processing unit BPU6 are arranged in a manner that they are sequentially away from the transfer block 5.

[0151] Batch processing units BPU1-BPU6 have batch processing tanks capable of holding liquids. These batch processing tanks hold chemical solutions or pure water. The chemical solution can be an acidic aqueous solution, such as a phosphoric acid solution. In this manual, chemical solutions and pure water are collectively referred to as processing liquids. The batch processing tanks holding chemical solutions are referred to as batch chemical processing tanks CHB2-CHB6, and the batch processing tank holding pure water is referred to as batch rinse processing tank ONB.

[0152] Specifically, the second batch processing unit BPU2 includes: a batch chemical liquid processing tank CHB2, which performs chemical liquid processing on the batch BL at a time; and a lifter LF2, which lifts the batch BL between the substrate transfer position and the chemical liquid processing position (see Figure 2 The substrate transfer position is set above the batch chemical liquid treatment tank CHB2 accessible to the forward and backward transport mechanism WTR, and the chemical liquid treatment position is set within the tank of the batch chemical liquid treatment tank CHB2 capable of immersing the batch BL in the chemical liquid. The batch chemical liquid treatment tank CHB2 performs an acid treatment on the batch BL. The acid treatment may be a phosphoric acid treatment or a treatment using another acid. The phosphoric acid treatment performs an etching treatment on the plurality of substrates W constituting the batch BL. The etching treatment, for example, chemically etches the nitride film on the surface of the substrate W.

[0153] The lifter LF2 can hold a batch BL consisting of substrates W arranged at a 10 / 3 mm pitch. Like the lifter LF2, lifters installed in other processing tanks can also hold the batch BL. The batch drying chamber DC can accommodate the batch BL.

[0154] The batch chemical liquid treatment tank CHB2 contains an acid solution such as a phosphoric acid solution. The batch chemical liquid treatment tank CHB2 is provided with a lifter LF2 for moving the batch BL up and down. The lifter LF2 is raised and lowered in the vertical direction (Z direction). Specifically, the lifter LF2 is raised and lowered between a processing position corresponding to the interior of the batch chemical liquid treatment tank CHB2 and a transfer position corresponding to the top of the batch chemical liquid treatment tank CHB2. The lifter LF2 holds the batch BL consisting of substrates W in a vertical posture. The lifter LF2 transfers the batch BL between the transfer position and the forward and backward transport mechanism WTR. When the lifter LF2 descends from the transfer position to the processing position while holding the batch BL, the entire area of the substrate W is located below the liquid surface of the chemical liquid. When the lifter LF2 ascends from the processing position to the transfer position while holding the batch BL, the entire area of the substrate W is located above the liquid surface of the chemical liquid. The lifter LF2 can immerse the batch BL in the batch treatment tank at once. At this time, the lifter LF2 descends from the transfer position to the processing position.

[0155] Specifically, the third batch processing unit BPU3 includes a batch chemical liquid treatment tank CHB3 and a lifter LF3 that lifts the batch BL between the substrate handover position and the chemical liquid treatment position. The batch chemical liquid treatment tank CHB3 has the same structure as the above-mentioned batch chemical liquid treatment tank CHB2. That is, the batch chemical liquid treatment tank CHB3 contains the above-mentioned chemical liquid and is provided with a lifter LF3. The batch chemical liquid treatment tank CHB3 performs the same treatment on the batch BL as the batch chemical liquid treatment tank CHB2. The substrate processing device 1 of this example includes a plurality of treatment tanks that can perform the same chemical liquid treatment. This is because phosphoric acid treatment takes time compared to other treatments. Phosphoric acid treatment takes a long time (for example, 60 minutes). Therefore, the device of this example can perform acid treatment in parallel through a plurality of batch chemical liquid treatment tanks.

[0156] The structures of the fourth through sixth batch processing units BPU4 to BPU6 are identical to those of the second and third batch processing units BPU2 and BPU3. Specifically, the fourth batch processing unit BPU4 includes a batch chemical liquid treatment tank CHB4 and a lifter LF4 for raising and lowering the batch BL between the substrate transfer position and the chemical liquid treatment position. Similarly, the fifth batch processing unit BPU5 includes a batch chemical liquid treatment tank CHB5 and a lifter LF5 for raising and lowering the batch BL between the substrate transfer position and the chemical liquid treatment position. Furthermore, the sixth batch processing unit BPU6 includes a batch chemical liquid treatment tank CHB6 and a lifter LF6 for raising and lowering the batch BL between the substrate transfer position and the chemical liquid treatment position. Therefore, the batch BL undergoes acid treatment in any of the batch chemical liquid treatment tanks CHB2 to CHB6. By performing chemical liquid treatment in parallel across five processing units in this manner, the productivity of the apparatus is improved.

[0157] Specifically, the first batch processing unit BPU1 includes a batch rinse processing tank ONB for containing a rinse liquid and a lifter LF1 for raising and lowering the batch BL between a substrate transfer position and a rinse position. The substrate transfer position is set above the batch rinse processing tank ONB, which is accessible by the forward and backward transport mechanism WTR, and the rinse position is set inside the tank of the batch rinse processing tank ONB, which can immerse the batch BL in the rinse liquid. The batch rinse processing tank ONB has the same structure as the above-mentioned batch chemical liquid processing tank CHB2. That is, the batch rinse processing tank ONB is equipped with a lifter LF1 for containing a rinse liquid. Unlike other processing tanks, the batch rinse processing tank ONB contains pure water and is provided for the purpose of cleaning chemical liquid attached to multiple substrates W. In the batch rinse processing tank ONB, when the resistivity of the pure water in the tank rises to a predetermined value, the cleaning process is completed.

[0158] Thus, the batch rinsing tank ONB in this embodiment is located closer to the transfer block 5 than the batch chemical liquid treatment tanks CHB2 through CHB6. This configuration minimizes the separation of the various mechanisms comprising the transfer block 5 from the batch chemical liquid treatment tanks CHB2 through CHB6, preventing the pusher mechanism 25 and other components from being adversely affected by acids such as phosphoric acid. Furthermore, the proximity of the transfer block 5 to the batch drying chamber DC allows the batch BL, after completing the rinsing process, to be transported a short distance and promptly returned to the transfer block 5.

[0159] 8. Collective transport area in the processing block

[0160] The batch transfer area R2 in the processing block 6 is a rectangular area extending in the front-to-back direction (X direction). The batch transfer area R2 is provided along the outer edge of the batch processing area R1, with one end extending to the transfer block 5 and the other end extending away from the transfer block 5.

[0161] The collective transfer area R2 is equipped with a forward / backward transfer mechanism WTR for collectively transporting multiple substrates W. The forward / backward transfer mechanism WTR collectively transports multiple substrates W (specifically, batches BL) between the substrate transfer position PP, the batch support 33, the batch drying chamber DC, and each batch processing unit BPU1 to BPU6, defined within the transfer block 5. The forward / backward transfer mechanism WTR is configured to move back and forth in the front-to-back direction (X direction) across the transfer block 5 and the processing block 6. In addition to being able to enter the collective transfer area R2 within the processing block 6, the forward / backward transfer mechanism WTR can also enter the substrate transfer position PP and the batch support 33 within the transfer block 5.

[0162] The forward and backward transport mechanism WTR is equipped with a pair of chucks 29 for transporting the batch BL. The pair of chucks 29 can be changed into a closed state approaching each other and an open state moving away from each other. The chuck 29 is a component extending in the Y direction with grooves for holding the substrate W arranged at a pitch of 10 / 3 mm. The pair of chucks 29 is in a closed state to receive the multiple substrates W constituting the batch BL. Then, the pair of chucks 29 is in an open state to hand over the multiple substrates W constituting the batch BL to other components (elevator LF1, etc.). The forward and backward transport mechanism WTR hands over the batch BL between the substrate handover position PP in the transfer block 5 and the batch support part 33. In addition, the forward and backward transport mechanism WTR hands over the batch BL between the lifters LF1 to LF6 of the batch processing units BPU1 to BPU6 in the processing block 6 and the batch drying chamber DC.

[0163] The collective transport region R2 is equipped with a guide rail 31 extending in the X direction to guide the forward / retractable transport mechanism WTR. The forward / retractable transport mechanism WTR can move forward and backward in the X direction along this guide rail 31. Therefore, the guide rail 31 extends from the processing block 6 to the transfer block 5. More specifically, the guide rail 31 faces the substrate transfer position PP in the transfer block 5 from the Y direction and the sixth batch processing unit BPU6 in the processing block 6 from the Y direction. Furthermore, the guide rail 31 faces the batch support 33 of the transfer block 5, the batch drying chamber DC of the processing block 6, and the first to sixth batch processing units BPU1 to BPU6 from the Y direction.

[0164] 9. Other structures in the processing block

[0165] The batch drying chamber DC is arranged at a position sandwiched between the first batch processing unit BPU1 and the transfer block 5. The batch drying chamber DC has a drying chamber for accommodating a batch BL in which substrates W are arranged in a vertical posture. The drying chamber has an inert gas supply nozzle for supplying an inert gas into the chamber and a vapor supply nozzle for supplying vapor of an organic solvent into the tank. The batch drying chamber DC first supplies an inert gas to the batch BL supported in the chamber, replacing the atmosphere in the chamber with the inert gas. Then, the decompression in the chamber is started. In the state where the chamber is decompressed, vapor of an organic solvent is supplied into the chamber. The organic solvent is discharged to the outside of the chamber along with the moisture attached to the substrate W. In this way, the batch drying chamber DC performs drying of the batch BL. At this time, the inert gas may be, for example, nitrogen, and the organic solvent may be, for example, IPA (isopropyl alcohol).

[0166] The carrier loading shelf 13a, batch drying chamber DC, and batch processing units BPU1-BPU6 in the substrate processing apparatus 1 are arranged in a front-to-back direction. Specifically, the carrier loading shelf 13a is located in the front, with the batch drying chamber DC located behind it. Batch processing units BPU1-BPU6 are located further behind it. The substrate processing apparatus 1 of this embodiment optimizes the internal layout of the apparatus to minimize the travel distance of the forward / reverse transport mechanism WTR.

[0167] 10. Control Department

[0168] The control unit 131 of the substrate processing apparatus 1 can be referred to Figure 1 In addition, although Figure 1 Although not shown in the figure, a corresponding storage unit is provided in the control unit 131. The control unit 131 is composed of, for example, a CPU (Central Processing Unit). The specific structure of the control unit is not limited. For example, each control unit can be composed of a single processor or each control unit can be composed of separate processors.

[0169] Examples of controls performed by the control unit 131 include controls related to the carrier transport mechanism 11 , the transport robot HTR, the HVC posture changing unit 23 , the pushing mechanism 25 , the forward and backward transport mechanism WTR, the batch processing units BPU1 to BPU6 , and the batch drying chamber DC.

[0170] 11. Substrate processing process

[0171] Below, refer to Figure 19 The flowchart of the substrate processing in this example is described.

[0172] Step S11: The substrates W arranged at a pitch of 10 mm and transferred from the first carrier C1 by the transfer robot HTR are taken over by the pusher 251 after their postures are changed. Step S11 corresponds to the substrate group taking process of the present invention.

[0173] Step S12: The transport robot HTR takes the substrate W from the second carrier C2 and hands it over to the HVC posture changing unit 23. Step S12 corresponds to the first process of the present invention.

[0174] Step S13: After the substrates W are transferred from the second carrier C2 and arranged at 10 mm intervals, they are transferred to the pusher 251. Since the substrates W from the first carrier C1 are already arranged on the pusher 251, the pusher 251 batches the substrates W from the first carrier C1 with the substrates W from the second carrier C2. Step S13 corresponds to the first assembly process of the present invention. The second process described above is performed between steps S12 and S13.

[0175] Step S14: The transport robot HTR takes the substrate W from the third carrier C3 and hands it over to the HVC posture changing unit 23. Step S14 corresponds to the first process of the present invention.

[0176] Step S15: After the position change, the substrates W, arrayed at 10 mm intervals, are transferred from the third carrier C3 to the pusher 251. Substrates W from the first carrier C1 and substrates W from the second carrier C2 are already arrayed on the pusher 251. Therefore, the pusher 251 batches the array of substrates from the first and second carriers C1 and C2 with the substrates W from the third carrier C3. This creates a temporary batch TL. Step S15 corresponds to the second assembly process of the present invention. The second process described above is performed between steps S14 and S15.

[0177] Step S16: The substrates W comprising the temporary batch TL are divided into a first group and a second group. The pusher 251 holding the temporary batch TL transfers the first group of substrates W1 to the clamping rods 232, separating them from the second group of substrates W2. Step S16 corresponds to the disassembly process of the present invention.

[0178] Step S17: Perform a half-rotation of the second group of substrates W2. Thus, the second group of substrates W2 facing one direction face the opposite direction. Step S17 is equivalent to the half-rotation process of the present invention.

[0179] Step S18: The pusher 251 moves up and down, removing the first group of substrates W1 from the clamping rods 232. The pusher 251 alternates between clamping slots 252 for clamping the second group of substrates W2 and empty clamping slots 252. Once the first group of substrates W1 are inserted into the corresponding empty clamping slots 252, the batch BL is generated. Step S18 corresponds to the rearrangement process of the present invention.

[0180] Step S19 : The generated lot BL is transported from the transfer block 5 to the processing block 6 by the forward and backward transport mechanism WTR.

[0181] Step S20: Perform chemical liquid treatment on the batch BL. Step S20 corresponds to the treatment process of the present invention.

[0182] Step S21: Perform a flushing process on the batch BL.

[0183] Step S22: Drying the batch BL.

[0184] In this way, substrate processing is achieved in batch units.

[0185] Step S23 : The lot BL on which the substrates have been processed is transported from the processing block 6 to the transfer block 5 by the forward and backward transport mechanism WTR.

[0186] Step S24 : The pusher 251 holds the second group of substrates W2 while transferring the first group of substrates W1 to the clamping rods 232 .

[0187] Step S25: performing a half-rotation of the second group of substrates W2, thereby causing the second group of substrates W2, which were facing in opposite directions, to face one direction.

[0188] Step S26: The pusher 251 retrieves the first group of substrates W1 from the clamping rods 232. The pusher 251 alternately has clamping slots 252 for clamping the second group of substrates W2 and empty clamping slots 252. Once the first group of substrates W1 are inserted into the corresponding empty clamping slots 252, the temporary batch TL is generated.

[0189] Step S27: The substrates W on the third carrier C3 are arranged on the pusher 251 at a pitch of 10 mm. The pusher 251 moves up and down, transferring the substrates W on the third carrier C3 to the clamping rods 232. In this way, the temporary lot TL is disassembled.

[0190] Step S28 : After the posture of the substrate W transferred to the gripping bars 232 is changed, the substrate W is returned to the third carrier C3 by the transfer robot HTR.

[0191] Step S29: The substrates W on the second carrier C2 are arranged on the pusher 251 at a pitch of 10 mm. The pusher 251 moves up and down, transferring the substrates W on the second carrier C2 to the clamping rods 232. In this way, the temporary lot TL is disassembled.

[0192] Step S30 : After the posture of the substrate W transferred to the gripping bars 232 is changed, the substrate W is returned to the second carrier C2 by the transfer robot HTR.

[0193] Step S31: Substrates W on the first carrier C1 are arranged on the pusher 251 at a pitch of 10 mm. The pusher 251 moves up and down, transferring the substrates W from the first carrier C1 to the clamping rods 232. After the transferred substrates W have changed their positions, they are returned to the first carrier C1 by the transport robot HTR.

[0194] 12. Effect of this example

[0195] According to this example, a temporary batch TL is formed with substrates W oriented in the same direction. The substrates W are then divided into a first group and a second group, with two opposing substrates W forming separate groups. The second group rotates half a revolution. The first and second groups are then combined to create a batch BL, alternating between substrates W oriented in one direction and those oriented in the opposite direction. This configuration allows for a narrower pitch between substrates W than with conventional methods, allowing for face-to-face arrangement of substrates W.

[0196] In this example, the number of substrates W constituting the batch BL is three times the number of substrates W in the substrate group in step S11. This configuration prevents redundant substrates W from being generated in the substrate group when the batch BL is formed. Since the substrate group is not divided into two batches BL, the substrate processing histories of the substrates constituting the substrate group can be reliably aligned.

[0197] This example includes a first step of collectively receiving substrates W from a carrier C that accommodates horizontally positioned substrates W arranged at predetermined intervals in the vertical direction; and a second step of collectively changing the positions of the substrates W from the horizontal position to the vertical position. The first and second steps are performed before steps S13 and S15. This configuration provides a substrate processing method that receives a first group of first substrates W or a second group of second substrates W2 arranged in one direction from a carrier C.

[0198] According to this embodiment, the predetermined interval is equal to the arrangement pitch of the substrates W accommodated in the carrier C. With this configuration, the pitch of the substrates W can be easily changed.

[0199] According to this example, the distance from the first position P1 to the second position P2 is 1 / 3 of the arrangement pitch of the substrates W stored in the carrier C. With this configuration, the pitch of the generated substrate array can be made less than 1 / 2 of the arrangement pitch of the substrates W stored in the carrier.

[0200] According to this example, the first position P1 and the second position P2 divide the predetermined interval into three equal parts. With this configuration, the substrates W can be arranged more neatly.

[0201] 13. Modification

[0202] The present invention is not limited to the configuration of the embodiment, and can be implemented in the following modified forms.

[0203] <Variation 1>

[0204] In the substrate processing method of the embodiment, the substrate W is obtained from the carrier C that accommodates an odd number of substrates W, but the present invention is not limited to this structure. The substrate can also be obtained from the carrier C that accommodates an even number of substrates W. By setting it as such a structure, the number of substrates W constituting the temporary batch TL is an even number. Thus, the first group of substrates W1 and the second group of substrates W2 become the same number. If it is configured in this way, the temporary batch TL is disassembled in such a way that the substrates W located at one end of the temporary batch TL and the substrates W located at the other end of the temporary batch TL are divided into different groups. By configuring in this way, the orientation of the substrates W constituting the batch BL can be made into the desired orientation. That is, according to this modification, the orientation of the substrates W at one end of the batch BL can be made different from the orientation of the substrates W at the other end, so that the substrates W can be arranged face to face more reliably.

[0205] <Variation 2>

[0206] The temporary lot TL in the substrate processing method of the embodiment consists of an odd number of substrates W. However, by adding dummy wafers to the temporary lot TL, the number of substrates W1 in the first group and W2 in the second group can be made equal. This configuration allows the orientation of substrates W at one end of the lot BL to differ from that of substrates W at the other end, thereby more reliably arranging the substrates W so that they face each other.

Claims

1. A substrate processing method for processing a plurality of substrates having orientations defined by their front and back surfaces at once, characterized in that: The substrate processing method comprises: A substrate group obtaining process is to obtain a substrate group in which substrates facing one direction are arranged at predetermined intervals; In a first assembly process, a first arrangement of first substrates facing the one direction and spaced apart by the predetermined interval is combined with the substrate group, so that the first substrate is located at a first position of the substrate group that divides the predetermined interval into three parts and at the first position of the second position; In a second assembly process, a temporary batch is formed by assembling a second arrangement of second substrates facing the one direction at predetermined intervals with the substrate group so that the second substrates are located at the second position; a disassembly process of dividing the substrates into a first group and a second group so that two opposing substrates among the substrates constituting the temporary batch become different groups, and disassembling the temporary batch by relatively moving the first group and the second group in a direction orthogonal to an arrangement direction of the substrates; a half-turn rotation process, rotating the second group by half a turn so that the substrates constituting the second group face a direction opposite to the one direction; a rearrangement process of combining the first group and the second group so that substrates facing the one direction and substrates facing the opposite direction are alternately arranged to generate a batch; as well as During the treatment process, the batch is immersed in a treatment liquid.

2. The substrate processing method according to claim 1, wherein: In the disassembling process, the temporary lot is disassembled in such a manner that substrates located at one end of the temporary lot and substrates located at the other end of the temporary lot are divided into mutually different groups.

3. The substrate processing method according to claim 1, wherein: The number of substrates constituting the batch is three times the number of substrates in the substrate group during acquisition.

4. The substrate processing method according to claim 1, wherein: The substrate processing method comprises: In a first step, the substrates are collectively obtained from a carrier that stores the substrates arranged in a horizontal position at predetermined intervals in a vertical direction. as well as In the second step, the postures of the substrates are collectively changed from a horizontal posture to a vertical posture. The first step and the second step are performed before each assembly step.

5. The substrate processing method according to claim 4, wherein: The predetermined interval is equal to an arrangement pitch of substrates received in the carrier.

6. The substrate processing method according to claim 4, wherein: The distance from the first position to the second position is 1 / 3 of the arrangement pitch of the substrates accommodated in the carrier.

7. The substrate processing method according to claim 1, wherein: The first position and the second position divide the predetermined interval into three equal parts.

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