Wafer carrier and wafer processing equipment

Abstract

The present invention discloses a wafer carrier and wafer processing equipment, which relate to the field of semiconductor processing technology. A wafer carrier comprises a platform body, on which a placement groove for positioning and placing a wafer is provided; and further comprises: a suction and pressure clamping assembly, which is arranged on the platform body and is used for suction and pressure clamping the wafer placed inside the placement groove. The present invention realizes suction and pressure clamping of the bottom of the wafer and extrusion clamping of the outside of the wafer through the mutual cooperation of the suction and pressure clamping assembly and the extrusion clamping assembly, thereby ensuring the effect of clamping and fixing the wafer on the wafer carrier. In the clamping process, the distance between the suction and pressure clamping assembly and the bottom edge of the wafer is reasonably controlled by the linkage assembly, so that the suction and pressure clamping assembly does not generate a gap with the position of the wafer inner groove during the suction and pressure clamping process, thereby avoiding the adsorption force fluctuation and the mixing of external dust and other impurities during the suction and pressure clamping process, thereby ensuring the clamping effect of the wafer carrier on the wafer.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing technology, and in particular to a wafer carrier and wafer processing equipment. Background Art

[0002] During the semiconductor processing process, wafer slices are made through cutting, grinding, polishing and other processes. In the subsequent processing of the wafer slices, a wafer carrier is needed to assist in clamping the wafer slices and perform different processing steps.

[0003] When the wafer carrier uses suction and pressure adsorption to adsorb and clamp the placed wafer, the ends of each group of suction and pressure heads are against the edge of the bottom of the wafer. The bottom edge adsorption can use the rigid structure of the edge to provide a more stable support for the wafer. The bottom edge is relatively thick and has high strength, which can better withstand the adsorption force and various external forces during the processing, reduce the possibility of wafer deformation or shaking, and ensure the accuracy of processing. However, during the processing of some wafers, such as high temperature, ion implantation, etching, etc., these processes will generate stress inside the wafer. In order to avoid the influence of stress, an inner groove is set at the bottom edge of the wafer to provide a stress relief. The areas of concentration and release reduce the overall stress accumulation of the wafer. For wafers with sunken grooves at the bottom edge, a gap will occur between the adsorption position and the sunken groove at the bottom edge during the adsorption and clamping process. During the vacuum adsorption process, the gap may cause air leakage, affecting the vacuum degree of the adsorption area. The unstable vacuum degree will cause the adsorption force to fluctuate, further reducing the fixing effect of the wafer. At the same time, the leaked air may carry dust or other impurities, contaminating the wafer surface and having an adverse effect on the chip manufacturing process, such as causing electrical performance defects such as short circuit and open circuit. For this reason, we propose a wafer carrier and wafer processing equipment. Summary of the Invention

[0004] The object of the present invention is to provide a wafer carrier and wafer processing equipment to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned object, the present invention provides the following technical solution: a wafer stage, comprising:

[0006] A table body, wherein a placement groove for positioning and placing the wafer is provided on the table body;

[0007] Also includes:

[0008] A suction, pressing and clamping assembly is provided on the table body and is used for suction, pressing and clamping the wafer placed in the placement slot;

[0009] The extrusion and clamping assembly is arranged on the table body and is used to squeeze and clamp the wafer after it is placed in the placement groove. The said suction and pressure clamping assembly and the extrusion clamping assembly are provided in multiple groups, and each group of the suction and pressure clamping assembly corresponds to the extrusion clamping assembly one by one. The said groups of the suction and pressure clamping assembly and the extrusion clamping assembly are arranged in a circular array on the table body;

[0010] The linkage assembly is provided between the suction and pressure clamping assembly and the extrusion clamping assembly, and is used to control the suction and pressure clamping position according to the bottom state of the wafer during the clamping process;

[0011] In addition, an installation cavity is opened on the table body, and multiple groups of L-shaped grooves arranged in a circular array are opened between the installation cavity and the placement groove. The suction and pressure clamping assembly and the extrusion clamping assembly are located inside the L-shaped groove, and a suction and pressure assembly for suctioning and pressing the suction and pressure clamping assembly is provided on the table body.

[0012] Preferably, the suction and pressure clamping assembly includes a suction and pressure pipe arranged inside the mounting cavity, an air pipe for contacting the bottom of the wafer is arranged above the suction and pressure pipe, the air pipe passes through the L-shaped groove and is located inside the placement groove, an elastic component for assisting elastic connection is arranged between the suction and pressure pipe and the air pipe, and the suction and pressure pipe are retractably connected to the air pipe through an organ pipe;

[0013] By adopting the above technical solution, the bottom of the wafer is adsorbed and clamped, so that the wafer is fixed on the table after being placed.

[0014] Preferably, the extrusion clamping assembly includes a mounting plate arranged inside the mounting cavity, a telescopic assembly for telescopically connecting the mounting plate is provided inside the mounting cavity, a squeezing plate is fixed to one side of the mounting plate, the front end of the squeezing plate passes through the L-shaped groove and is located inside the placement groove, and an inclined surface for abutting against the bottom of the wafer is provided on the upper end of the squeezing plate;

[0015] By adopting the above technical solution, the wafer is squeezed and clamped after being pushed in, and the wafer is clamped and fixed on the wafer carrier by the suction and pressure clamping of the bottom of the wafer and the squeezing and clamping of the outside.

[0016] Preferably, the linkage assembly includes a linkage plate arranged inside the mounting cavity, the linkage plate and the mounting plate are connected and fixed by multiple groups of connecting rods, the linkage plate is provided with a mounting hole, and the linkage plate is fixed to the outer side of the pumping and pressure tube through the mounting hole;

[0017] By adopting the above technical solution, the dispersed contraction movement of each group of mounting plates 301 after being stressed and the connection transmission effect of the linkage plate 401, the connecting rod 403 and the mounting hole 402 drive each group of pumping and pressure tubes 201 to undergo a synchronous lateral dispersed contraction movement under stress.

[0018] Preferably, the telescopic assembly includes a plurality of first sleeves fixed inside the mounting cavity, a first slide rod is slidably connected to the first sleeve, one end of the first slide rod is fixed to the mounting plate, a first spring is sleeved on the outer side of the first sleeve, and both ends of the first spring are respectively connected to the inner wall of the mounting cavity and the mounting plate;

[0019] By adopting the above technical solution, it is convenient to assist the telescopic guidance of the mounting plate, and the first spring is used to facilitate the reset movement of the mounting plate after the contraction movement.

[0020] Preferably, the elastic component includes a plurality of groups of second sleeves fixed to the upper end of the suction and pressure pipe, each group of the second sleeves is arranged in a ring array, a second slide rod is slidably connected to the second sleeve, one end of the second slide rod is fixed to the lower end of the trachea, and a second spring is sleeved on the outer side of the second sleeve, and the two ends of the second spring are respectively connected to the ends of the suction and pressure pipe and the trachea;

[0021] By adopting the above technical solution, the upper end of the air pipe is pushed to better contact the bottom of the wafer, further facilitating subsequent pumping, pressing and clamping operations.

[0022] Preferably, the pumping and pressure-extraction assembly includes a pumping and pressure-extraction chamber opened inside the platform body, the pumping and pressure-extraction chamber is located below the mounting chamber, one end of the pumping and pressure-extraction tube is located inside the pumping and pressure-extraction chamber, and a connecting assembly for assisting in the flexible and sealed connection of the pumping and pressure-extraction tube is provided between the mounting chamber and the pumping and pressure-extraction chamber, and a pumping and pressure-extraction pump for pumping pressure inside the pumping and pressure-extraction chamber is installed at the bottom of the platform body;

[0023] By adopting the above technical solution, the interior of the pressure-reducing pipe is pumped out and pressurized.

[0024] Preferably, the connecting assembly includes a through groove communicating with the installation cavity and the pumping and pressure-extraction cavity, a sealing tape is fixed to the outside of the pumping and pressure-extraction tube, the sealing tape is fixed to the inside of the through groove, and the installation cavity and the pumping and pressure-extraction cavity are separated by the sealing tape;

[0025] By adopting the above technical solution, it is easy to ensure the partition seal between the pumping and pressure chamber and the installation chamber, and the flexible connection of the pumping and pressure pipe is achieved through the sealing belt, which is convenient for assisting the movement of the pumping and pressure pipe after being subjected to force.

[0026] Preferably, a wafer processing device comprises a body, a cover plate is hinged on the body, a feeding component for feeding material during film lamination and an extrusion component for squeezing the film material to prevent wrinkles during film lamination are provided on the body, a cutting component for cutting off excess film material after film lamination is provided on the cover plate, and a mounting assembly for assisting the installation of a table is provided on the body;

[0027] By adopting the above technical solution, the film-laminating operation on the wafer is completed.

[0028] Preferably, the mounting assembly includes a mounting groove provided on the machine body for placing and installing the platform, the mounting groove is provided with a plurality of positioning grooves, and a positioning block is fixed on the outer side of the platform body and matched with the positioning groove, and the positioning block is positioned and placed on the positioning groove and fixed by bolts;

[0029] By adopting the above technical solution, the wafer carrier can be assisted in the rapid installation on the wafer processing equipment.

[0030] Compared with the prior art, the present invention has the following beneficial effects:

[0031] The present invention realizes the suction and pressure clamping of the bottom of the wafer and the extrusion clamping of the outside of the wafer through the mutual cooperation of the suction and pressure clamping component and the extrusion clamping component, thereby ensuring the effect of clamping and fixing the wafer on the wafer carrier. In the clamping process, the distance between the suction and pressure clamping component and the bottom edge of the wafer is reasonably controlled through the linkage component, so that the suction and pressure clamping component does not produce a gap with the position of the wafer inner groove during the suction and pressure clamping process, thereby avoiding adsorption force fluctuations and mixing of external dust and other impurities during the suction and pressure clamping process, thereby ensuring the clamping effect of the wafer carrier on the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic diagram of the overall appearance structure of the present invention;

[0033] Figure 2 Schematic diagram of the bottom structure of the wafer carrier of the present invention;

[0034] Figure 3 Schematic diagram of the wafer carrier structure from top view of the present invention;

[0035] Figure 4 Schematic diagram of the internal structure of the wafer carrier of the present invention;

[0036] Figure 5 It is a schematic structural diagram of the pumping and pressing assembly of the present invention;

[0037] Figure 6 It is a schematic structural diagram of the pumping and clamping assembly, the extrusion and clamping assembly, the linkage assembly and the telescopic assembly of the present invention;

[0038] Figure 7 It is a schematic structural diagram of the elastic component of the present invention;

[0039] Figure 8 This is a schematic diagram of the wafer of the present invention before being clamped on the stage;

[0040] Figure 9 This is a schematic diagram of the wafer of the present invention after being clamped on the carrier;

[0041] Figure 10This is a schematic diagram of the present invention in the state of pumping, pressing and clamping when there is a sunken groove at the bottom edge of the wafer;

[0042] Figure 11 It is a schematic diagram of the overall appearance of the processing equipment of the present invention;

[0043] Figure 12 This is a schematic diagram of the installation assembly structure of the present invention;

[0044] Figure 13 It is a schematic structural diagram of the cover plate and the cut-out component of the present invention.

[0045] In the figure: 101-body; 102-placement groove; 201-suction and pressure pipe; 202-air pipe; 203-organ pipe; 301-mounting plate; 302-extrusion plate; 303-inclined surface; 401-linkage plate; 402-mounting hole; 403-connecting rod; 5-mounting cavity; 6-L-shaped groove; 701-first sleeve; 702-first slide bar; 703-first spring; 801-second sleeve; 802-second slide bar; 803-second spring; 901-suction and pressure cavity; 902-suction and pressure pump; 1001-through groove; 1002-sealing belt; 1101-machine body; 1102-cover plate; 1103-feeding component; 1104-extrusion component; 1105-cutting component; 1201-mounting groove; 1202-positioning groove; 1203-positioning block. DETAILED DESCRIPTION

[0046] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention. Example 1

[0047] See also Figures 1-10 , a wafer stage shown in the figure includes:

[0048] A platform 101 is provided with a placement slot 102 for positioning and placing a wafer;

[0049] Also includes:

[0050] A suction, pressure and clamping assembly is provided on the platform 101 and is used for suction, pressure and clamping the wafer placed in the placement groove 102;

[0051] The extrusion clamping assembly is provided on the platform 101 and is used to squeeze and clamp the wafer after it is placed in the placement groove 102. There are multiple groups of suction and pressure clamping assemblies and extrusion clamping assemblies, and each group of suction and pressure clamping assemblies corresponds to the extrusion clamping assembly one by one. Each group of suction and pressure clamping assemblies and extrusion clamping assemblies are arranged in a ring array on the platform 101;

[0052] The linkage assembly is provided between the suction and pressure clamping assembly and the extrusion clamping assembly, and is used to control the suction and pressure clamping position according to the bottom state of the wafer during the clamping process;

[0053] In addition, an installation cavity 5 is provided on the table 101, and a plurality of L-shaped grooves 6 arranged in a circular array are provided between the installation cavity 5 and the placement groove 102. The suction and pressure clamping assembly and the extrusion clamping assembly are located inside the L-shaped groove 6, and a suction and pressure assembly for suctioning and pressing the suction and pressure clamping assembly is provided on the table 101; it should be noted here that: through the mutual cooperation of the suction and pressure clamping assembly and the extrusion clamping assembly, the suction and pressure clamping of the bottom of the wafer and the extrusion clamping of the outside of the wafer are realized, thereby ensuring the effect of clamping and fixing the wafer on the wafer carrier, and in the clamping process, through the linkage assembly, the distance between the suction and pressure clamping assembly and the bottom edge of the wafer is reasonably controlled, so that the suction and pressure clamping assembly does not generate a gap with the position of the wafer inner groove during the suction and pressure clamping process, thereby avoiding the adsorption force fluctuation and the mixing of external dust and other impurities during the suction and pressure clamping process, thereby ensuring the clamping effect of the wafer carrier on the wafer.

[0054] Preferably, the pressure clamping assembly includes a pressure tube 201 arranged inside the mounting cavity 5, an air pipe 202 for contacting the bottom of the wafer is arranged above the pressure tube 201, the air pipe 202 passes through the inside of the placement groove 102 from the L-shaped groove 6, an elastic component for assisting elastic connection is arranged between the pressure tube 201 and the air pipe 202, and the pressure tube 201 and the air pipe 202 are retractably connected through the organ pipe 203; it should be noted here that: The wafer is pushed toward the inside of the placement groove 102 of the table 101 and eventually the wafer is pressed against the bottom of the placement groove 102. During the pushing process, the bottom of the wafer is pressed against the upper end of the air pipe 202 on each group of suction and pressure clamping components. After the wafer is pushed in and placed, the suction and pressure component applies suction and pressure to the suction and pressure pipe 201, the organ pipe 203 and the inside of the air pipe 202 on the suction and pressure clamping component to adsorb and clamp the bottom of the wafer, so that the wafer is fixed on the table 101 after placement.

[0055] Preferably, the extrusion clamping assembly includes a mounting plate 301 arranged inside the mounting cavity 5, and a telescopic assembly for telescopically connecting the mounting plate 301 is provided inside the mounting cavity 5. A squeezing plate 302 is fixed to one side of the mounting plate 301, and the front end of the squeezing plate 302 passes through the L-shaped groove 6 and is located inside the placement groove 102. The upper end of the squeezing plate 302 is provided with an inclined surface 303 for abutting against the bottom of the wafer. It should be noted here that: in the process of pushing the wafer into the placement groove 102, the edge of the bottom of the wafer and the squeezing plates on each group of squeezing clamping assemblies are in contact with each other. The inclined surfaces 303 of 302 are offset against each other. During the offsetting process, each group of extrusion plates 302 and the mounting plate 301 are pushed to move away from each other under force. After the wafer is pushed in and placed, the elastic squeezing effect of the second spring 803 on the telescopic assembly causes the front end of the extrusion plate 302 on the mounting plate 301 to offset against the outer side of the wafer after being pushed in. Through the offsetting squeezing effect between the front end of each group of extrusion plates 302 and the outer side of the wafer, the wafer after being pushed in is squeezed and clamped. By suction and clamping the bottom of the wafer and squeezing and clamping the outside, the wafer is ensured to be clamped and fixed on the wafer carrier.

[0056] Preferably, the linkage assembly includes a linkage plate 401 arranged inside the mounting cavity 5, and the linkage plate 401 is connected and fixed to the mounting plate 301 by multiple groups of connecting rods 403. The linkage plate 401 is provided with a mounting hole 402, and the linkage plate 401 is fixed to the outer side of the pumping and pressure pipe 201 through the mounting hole 402. It should be noted here that: during the clamping process, the dispersed contraction movement after each group of mounting plates 301 is subjected to force and the connection transmission effect of the linkage plate 401, the connecting rod 403 and the mounting hole 402 drive each group of pumping and pressure pipes 201 to be subjected to force synchronously and horizontally. The dispersed contraction movement of the air tube 202 drives the synchronous movement of the air tube 202 through the connection of the elastic component during the movement of the suction and pressure tube 201. The dispersed contraction movement of each group of air tubes 202 makes each group of air tubes 202 lean against the edge position of the bottom of the wafer and keep against each other. By adjusting the position of each group of air tubes 202, the head end of each group of air tubes 202 is against the edge position of the bottom of the wafer during the suction and pressure clamping process. It should be noted here that the air tube 202 is closer to the center position of the placement groove 102 than the extrusion plate 302 in the lateral direction of the wafer carrier.

[0057] Preferably, the telescopic assembly includes multiple groups of first sleeves 701 fixed inside the mounting cavity 5, and the first slide rod 702 is slidably connected to the first sleeve 701. One end of the first slide rod 702 is fixed to the mounting plate 301, and a first spring 703 is sleeved on the outer side of the first sleeve 701. The two ends of the first spring 703 are respectively connected to the inner wall of the mounting cavity 5 and the mounting plate 301; it should be noted here that: the first sleeve 701 and the first slide rod 702 are used to assist in the telescopic guidance of the mounting plate 301, and the first spring 703 is used to facilitate the reset movement of the mounting plate 301 after the contraction movement.

[0058] Preferably, the elastic component includes a plurality of groups of second sleeves 801 fixed to the upper end of the suction and pressure tube 201, and each group of second sleeves 801 is arranged in a state of an annular array, and a second slide bar 802 is slidably connected to the second sleeve 801, and one end of the second slide bar 802 is fixed to the lower end of the air pipe 202, and a second spring 803 is sleeved on the outer side of the second sleeve 801, and the two ends of the second spring 803 are respectively connected to the end of the suction and pressure tube 201 and the air pipe 202; It should be noted here that: the wafer is pushed toward the inside of the placement groove 102 of the table 101 and finally the wafer is aligned with the The bottom of the placement groove 102 is abutted against each other. During the pushing process, the bottom of the wafer is abutted against the upper end of the air pipe 202 on each group of suction and pressure clamping components. After the abutment, as the wafer continues to be pushed, the air pipe 202 is forced to contract toward the suction and pressure tube 201. During the contraction movement, each group of second sliding rods 802 is pushed to slide on each group of second sleeves 801 respectively, and the second spring 803 is deformed under force to generate elastic force. Through the elastic force of the second spring 803, the upper end of the air pipe 202 is pushed to better abut against the bottom of the wafer, further facilitating subsequent suction and pressure clamping operations.

[0059] Preferably, the pumping and pressure reduction assembly includes a pumping and pressure reduction chamber 901 opened inside the platform 101, the pumping and pressure reduction chamber 901 is located below the mounting chamber 5, one end of the pumping and pressure reduction tube 201 is located inside the pumping and pressure reduction chamber 901, and a connecting assembly for assisting in the flexible and sealed connection of the pumping and pressure reduction tube 201 is provided between the mounting chamber 5 and the pumping and pressure reduction chamber 901, and a pumping and pressure reduction pump 902 for pumping and pressure reduction inside the pumping and pressure reduction chamber 901 is installed at the bottom of the platform 101; it should be noted here that: the inside of the pumping and pressure reduction chamber 901 is driven by the pumping and pressure reduction pump 902 to pump and pressure reduction the inside of the pumping and pressure reduction tube 201; it is worth noting here that: the pumping and pressure reduction pump 902 is a conventional technical means in pumping and pressure reduction operations, and its working principle and operation method are regarded as prior art in this application, and will not be elaborated on here.

[0060] Preferably, the connecting component includes a through groove 1001 which is connected to and opened between the installation cavity 5 and the pressure extraction cavity 901, and a sealing belt 1002 is fixed to the outside of the pressure extraction tube 201, and the sealing belt 1002 is fixed to the inside of the through groove 1001, and the installation cavity 5 and the pressure extraction cavity 901 are separated by the sealing belt 1002; it should be noted here that: the sealing belt 1002 inside the through groove 1001 is convenient for ensuring the partition seal between the pressure extraction cavity 901 and the installation cavity 5, and the sealing belt 1002 is used to realize a flexible connection of the pressure extraction tube 201, so as to facilitate the movement of the pressure extraction tube 201 after being subjected to force; it is worth noting here that: the sealing belt 1002 is made of silicone material, which has both sealing and flexibility.

[0061] In this solution: a wafer carrier comprises the following steps:

[0062] In the process of using the wafer carrier to clamp and fix the wafer, the wafer is pushed toward the inside of the placement groove 102 of the table 101 and finally the wafer is against the bottom of the placement groove 102. In the process of pushing, the bottom of the wafer is against the upper end of the air pipe 202 on each group of the suction and pressure clamping components. After the wafer is pushed in and placed, the suction and pressure components apply the suction and pressure action on the suction and pressure pipe 201, the organ pipe 203 and the air pipe 202 on the suction and pressure clamping components to adsorb and clamp the bottom of the wafer, so that the wafer is fixed on the table 101 after placement, and in the process of pushing the wafer into the placement groove 102, the edge of the bottom of the wafer is The inclined surfaces 303 of the extrusion plates 302 on each group of extrusion and clamping assemblies are abutted against each other. During the abutment process, the extrusion plates 302 and the mounting plate 301 are pushed to move away from each other under force. After the wafer is pushed in and placed, the elastic force of the second spring 803 on the telescopic assembly causes the front end of the extrusion plate 302 on the mounting plate 301 to abut against the outer side of the pushed-in wafer. The abutment and abutment between the front end of each group of extrusion plates 302 and the outer side of the wafer squeeze and clamp the pushed-in wafer. The bottom of the wafer is squeezed and clamped and the external extrusion and clamping are used to ensure that the wafer is clamped and fixed on the wafer carrier.

[0063] During the clamping process, the dispersed contraction movement of each group of mounting plates 301 after being stressed and the connection and transmission function of the linkage plate 401, the connecting rod 403 and the mounting hole 402 drive each group of pumping and pressure tubes 201 to synchronously perform a lateral dispersed contraction movement. During the movement of the pumping and pressure tubes 201, the connection function of the elastic component drives the air tubes 202 to move synchronously. Through the dispersed contraction movement of each group of air tubes 202, each group of air tubes 202 is brought close to the edge position of the bottom of the wafer and keeps against each other (see FIG. Figure 9), by adjusting the position of each group of air pipes 202, the end of each group of air pipes 202 is made to abut against the edge of the bottom of the wafer during the suction, pressure and clamping process. The bottom edge adsorption can utilize the rigid structure of the edge to provide a more stable support for the wafer, better withstand the adsorption force and various external forces during the processing, reduce the possibility of wafer deformation or shaking, and further ensure the effect of wafer clamping;

[0064] When there is a recessed groove at the bottom edge of the wafer to be placed, due to the presence of the recessed groove, the recessed groove position has a poor effect of pressing against the inclined surface 303 of the pressing plate 302 as the wafer is pushed in, or even no pressing occurs, so that the pressing plate 302 and the mounting plate 301 at this position move a small distance or do not move at all during the pressing and clamping process (see FIG. Figure 10 ), by controlling the moving distance, the air tube 202 is kept in contact with the bottom of the wafer and no gap is generated between the air tube 202 and the inner recessed groove during the process of linkage adjustment of the position of the air tube 202, thereby avoiding fluctuations in adsorption force and mixing of external dust and other impurities during the vacuum and pressure clamping process, thereby ensuring the clamping effect of the wafer carrier on the wafer. Example 2

[0065] See also Figure 11-13 This embodiment further illustrates the first embodiment. The wafer processing equipment shown in the figure includes a body 1101, a cover plate 1102 is hinged on the body 1101, a feeding component 1103 for feeding the material during the film lamination process and an extrusion component 1104 for squeezing the film material to prevent wrinkles during the film lamination process are provided on the body 1101, a cutting component 1105 for cutting off excess film material after film lamination is provided on the cover plate 1102, and a mounting assembly for assisting the installation of the platform 101 is provided on the body 1101;

[0066] It should be noted here that: after the installation is completed, the wafer is clamped and fixed by the wafer carrier. After clamping and fixing, the film material is laid on the upper surface of the wafer on the wafer carrier through the feeding action of the feeding component 1103. After laying, the film material laid on the wafer is squeezed by the squeezing component 1104 to avoid wrinkles on the upper surface of the wafer after the film is laid. After the squeezing is completed, the cover plate 1102 is closed toward the machine body 1101. After the closing, the excess film material laid on the wafer is cut off by the cutting component 1105, completing the film lamination process on the wafer.

[0067] It is worth noting here that the body 1101, cover 1102, feeding component 1103, extrusion component 1104 and cutting component 1105 are conventional operating components on the film-sticking equipment. Their working principles and operating methods are regarded as prior art in this application and will not be elaborated on here.

[0068] Preferably, the mounting assembly includes a mounting groove 1201 provided on the body 1101 for mounting the platform 101, the mounting groove 1201 having multiple groups of positioning grooves 1202, and a positioning block 1203 that matches the positioning groove 1202 fixed to the outside of the platform 101, and the positioning block 1203 is positioned and placed on the positioning groove 1202 and fixed by bolts;

[0069] It should be noted here that: in the process of using wafer processing equipment to perform film lamination processing on wafers, the table body 101 of the wafer carrier is placed inside the mounting groove 1201. During the placement process, it is positioned through each group of positioning grooves 1202 and positioning blocks 1203. After positioning, the positioning blocks 1203 and the inside of the positioning grooves 1202 are locked and fixed by means of threads to complete the installation of the wafer carrier on the equipment body 1101.

[0070] In this solution: a wafer processing device includes the following steps:

[0071] During the process of film lamination on wafers using the wafer processing equipment, the wafer stage body 101 is placed inside the mounting groove 1201. During the placement process, the wafer stage body 101 is positioned by the groups of positioning grooves 1202 and positioning blocks 1203. After positioning, the positioning blocks 1203 are screwed and fixed to the inside of the positioning grooves 1202 to complete the installation of the wafer stage on the equipment body 1101.

[0072] After the installation is completed, the wafer is clamped and fixed by the wafer carrier. After clamping and fixing, the film material is laid on the upper surface of the wafer on the wafer carrier through the feeding action of the feeding component 1103. After laying, the film material laid on the wafer is squeezed by the squeezing component 1104 to avoid wrinkles on the upper surface of the wafer after laying;

[0073] After the extrusion is completed, the cover plate 1102 is closed toward the machine body 1101. After closing, the excess film material laid on the wafer is cut off by the cutting component 1105 to complete the film lamination operation on the wafer.

[0074] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0075] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A wafer carrier, comprising: A platform (101), wherein a placement groove (102) for positioning and placing a wafer is provided on the platform (101); It is characterized by further comprising: A suction, pressure and clamping assembly is provided on the platform (101) and is used for suction, pressure and clamping the wafer placed in the placement groove (102); An extrusion clamping assembly is provided on the platform (101) and is used to extrude and clamp the wafer after it is placed inside the placement groove (102). The said suction and pressure clamping assembly and the extrusion clamping assembly are provided in multiple groups, and each group of the suction and pressure clamping assembly corresponds to the extrusion clamping assembly one by one. Each group of the said suction and pressure clamping assembly and the extrusion clamping assembly are provided in a state of an annular array on the platform (101); The linkage assembly is provided between the suction and pressure clamping assembly and the extrusion clamping assembly, and is used to control the suction and pressure clamping position according to the bottom state of the wafer during the clamping process; and, a mounting cavity (5) provided on the platform (101), a plurality of L-shaped grooves (6) arranged in a circular array state provided between the mounting cavity (5) and the placement groove (102), the pumping and pressing clamping assembly and the extrusion clamping assembly being located inside the L-shaped grooves (6), and a pumping and pressing assembly for pumping and pressing the pumping and pressing clamping assembly being provided on the platform (101); The suction and pressure clamping assembly comprises a suction and pressure pipe (201) arranged inside the installation cavity (5), an air pipe (202) for contacting the bottom of the wafer is arranged above the suction and pressure pipe (201), and the air pipe (202) passes through the interior of the placement groove (102) from the L-shaped groove (6); The extrusion clamping assembly comprises a mounting plate (301) arranged inside the mounting cavity (5), a telescopic assembly for telescopically connecting the mounting plate (301) is arranged inside the mounting cavity (5), an extrusion plate (302) is fixed to one side of the mounting plate (301), the front end of the extrusion plate (302) passes through the L-shaped groove (6) and is located inside the placement groove (102), and an inclined surface (303) for abutting against the bottom of the wafer is provided on the upper end of the extrusion plate (302).

2. The wafer stage according to claim 1, wherein: An elastic component for assisting elastic connection is provided between the suction and pressure pipe (201) and the trachea (202), and the suction and pressure pipe (201) and the trachea (202) are telescopically connected via an organ pipe (203).

3. The wafer stage according to claim 2, wherein: The linkage assembly comprises a linkage plate (401) arranged inside the mounting cavity (5); the linkage plate (401) and the mounting plate (301) are connected and fixed via a plurality of connecting rods (403); a mounting hole (402) is provided on the linkage plate (401), and the linkage plate (401) is sleeved and fixed to the outer side of the pumping and pressure tube (201) via the mounting hole (402).

4. The wafer stage according to claim 3, wherein: The telescopic assembly includes a plurality of first sleeves (701) fixed inside the mounting cavity (5), a first slide bar (702) being slidably connected to the first sleeve (701), one end of the first slide bar (702) being fixed to the mounting plate (301), a first spring (703) being sleeved on the outer side of the first sleeve (701), and two ends of the first spring (703) being respectively connected to the inner wall of the mounting cavity (5) and the mounting plate (301).

5. The wafer stage according to claim 2, wherein: The elastic component includes multiple groups of second sleeves (801) fixed to the upper end of the suction and pressure tube (201), and each group of the second sleeves (801) is arranged in a ring array. A second slide bar (802) is slidably connected to the second sleeve (801), and one end of the second slide bar (802) is fixed to the lower end of the air pipe (202). A second spring (803) is sleeved on the outer side of the second sleeve (801), and the two ends of the second spring (803) are respectively connected to the end of the suction and pressure tube (201) and the air pipe (202).

6. The wafer stage according to claim 2, wherein: The pumping assembly comprises a pumping chamber (901) opened inside the platform (101), the pumping chamber (901) is located below the mounting chamber (5), one end of the pumping tube (201) is located inside the pumping chamber (901), and a connecting assembly for assisting in the flexible and sealed connection of the pumping tube (201) is provided between the mounting chamber (5) and the pumping chamber (901), and a pumping pump (902) for pumping pressure inside the pumping chamber (901) is installed at the bottom of the platform (101).

7. The wafer stage according to claim 6, wherein: The connecting assembly comprises a through groove (1001) which is connected between the installation cavity (5) and the pressure extraction cavity (901); a sealing belt (1002) is fixed to the outside of the pressure extraction tube (201); the sealing belt (1002) is fixed to the inside of the through groove (1001); and the installation cavity (5) and the pressure extraction cavity (901) are separated by the sealing belt (1002).

8. A wafer processing device, used for film lamination processing of a wafer on a wafer stage according to any one of claims 1 to 7, characterized in that: The invention comprises a machine body (1101), a cover plate (1102) is hinged on the machine body (1101), a feeding component (1103) for feeding material during the film laminating process and an extrusion component (1104) for squeezing the film material to prevent wrinkles during the film laminating process are provided on the machine body (1101), a cutting component (1105) for cutting off excess film material after film laminating is provided on the cover plate (1102), and a mounting assembly for mounting the auxiliary table body (101) is provided on the machine body (1101).

9. The wafer processing equipment according to claim 8, characterized in that: The mounting assembly comprises a mounting groove (1201) provided on the machine body (1101) for placing and mounting the platform (101), a plurality of positioning grooves (1202) provided on the mounting groove (1201), a positioning block (1203) matched with the positioning groove (1202) being fixed on the outer side of the platform (101), and the positioning block (1203) being positioned and placed on the positioning groove (1202) and fixed by bolts.

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