Production process of crystal resonator

Abstract

The invention relates to the technical field of crystal resonators, in particular to a production process of a crystal resonator, which comprises a conveying table and a connecting frame fixedly connected to the conveying table, an electric push rod and an air pump are arranged at the upper end of the connecting frame, the air pump is communicated with a guide pipe, and a conveying belt is rotatably arranged in the conveying table. According to the production process of the crystal resonator provided by the invention, the wafer can be adsorbed through air exhaust of the air pump before adhesion, bubbles of liquid and solid adhesive materials can be effectively removed through air exhaust by arranging the turntable, the bubbles can be broken more quickly by directly blowing air to the solid adhesive materials, and the production efficiency is improved. The pressure intensity is intermittently adjusted, so that the liquid adhesive material can be rapidly broken, after adhesion, the heated adhesive can be rapidly cooled and solidified through air suction of the air pump, the temperature is reduced while moving, and the production efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of crystal resonators, and in particular to a production process of crystal resonators. Background Art

[0002] A quartz crystal resonator is an electronic component that uses the piezoelectric effect of quartz crystals to generate high-precision oscillation frequencies. It is widely used in military and civilian products. During production, the wafer needs to be mounted on a base placed on a base tray. To ensure efficient mounting, a dedicated mounting device is required.

[0003] In the prior art, during the bonding process, many bubbles may be generated in the adhesive material and between the adhesive material and the carrier or chip interface, which will directly affect the reliability and quality of subsequent products. In addition, an additional air-drying device is often required to accelerate the adhesion of the chip, and an additional adsorption device is also required to adsorb the chip, which increases production costs. Summary of the Invention

[0004] In order to solve the above problems, the present invention provides a production process of a crystal resonator.

[0005] The present invention adopts the following technical solution, a production process of a crystal resonator, which uses a production device for a crystal resonator, including a conveyor platform and a connecting frame fixed to the conveyor platform, an electric push rod and an air pump are provided at the upper end of the connecting frame, a conduit is connected to the air pump, and a conveyor belt is rotatably provided in the conveyor platform. The specific steps of processing using the above-mentioned crystal resonator production device are as follows:

[0006] S1. Start the air pump, pump air so that the suction cup can absorb the wafer, then place the carrier plate at the bottom of the placement box cavity, and then transfer the adhesive material to the carrier plate;

[0007] S2. When the adhesive material is solid, the air pump uses a smaller wind force, and when the adhesive material is liquid, the air pump uses a larger wind force to remove bubbles;

[0008] S3. The electric push rod moves upward, and the air pump's suction can quickly cool down and solidify the heated glue, cooling it while moving upward, which improves production efficiency.

[0009] A defoaming mechanism can effectively remove bubbles in the adhesive material. The defoaming mechanism is arranged at the upper end of the conveyor belt;

[0010] A trigger mechanism capable of adjusting the method of removing bubbles by changing the wind force, wherein the trigger mechanism is arranged in the debubbling mechanism;

[0011] And a switching mechanism is used to automatically change the effect of air extraction, and the switching mechanism is arranged on the upper side of the defoaming mechanism.

[0012] As a further description of the above technical solution: the defoaming mechanism includes a placement box arranged at the upper end of the conveyor belt, a connecting groove is opened on one side of the placement box, a turntable is rotatably arranged on the inner wall of the placement box, and the turntable is arranged away from the connecting groove, an air inlet 1 is opened on the outer wall of the placement box, and the air inlet 1 is opened away from the connecting groove, a branch groove is opened on the outer wall of the turntable on the side close to the air inlet 1, and an air inlet 2 is opened on the outer wall of the turntable on the side away from the air inlet 1, and the air inlet 2 is connected to the branch groove.

[0013] As a further description of the above technical solution: the trigger mechanism includes a rotating shaft fixedly connected to the center of the turntable, and the rotating shaft is rotatably arranged in the placement box, a lifting sleeve is provided in the placement box for sliding up and down, a spring 2 is fixedly connected to the bottom end of the lifting sleeve and the placement box, a plug plate is provided in the lifting sleeve for horizontal sliding, a spring 1 is fixedly connected between the plug plate and the lifting sleeve, a slide groove is provided in the placement box, and a magnetic plate is provided in the slide groove, the upper end of the magnetic plate extends to the upper side of the placement box, the magnetic plate is fixed to the plug plate, an insertion block is provided on the upper side of the placement box, an insertion rack is movably inserted into the outer wall of the insertion block, and a spring 3 is fixedly connected between one end of the insertion rack located in the insertion block and the insertion block.

[0014] As a further description of the above technical solution: the switching mechanism includes an insert block, and the upper end of the insert block is fixedly connected to the electric push rod, a cavity is provided in the insert block, and the cavity is connected to the conduit, and a sliding rod is horizontally inserted into the outer wall of the insert block away from the insert rack, and a spring four is fixedly connected between one end of the sliding rod located in the insert block and the insert block, a connecting groove one is provided on the upper side of the sliding rod and the insert block, and the connecting groove one is connected to the cavity, and the bottom end of the connecting groove one is connected to a suction cup, a connecting groove two is provided on the upper side of the sliding rod, a connecting groove three and an air release groove are provided on the sliding rod, and an air outlet is provided at the bottom end of the insert block, a block is provided on the placement box at the lower side of the connecting groove, and the block is horizontally slidably arranged in the placement box, and a spring five is fixedly connected between the lower end of the block and the placement box.

[0015] As a further description of the above technical solution: a plurality of branch grooves are provided in a ring shape with equal intervals.

[0016] As a further description of the above technical solution: the second air inlet is located on the upper side of the carrier plate.

[0017] As a further description of the above technical solution: a friction pad is bonded to the outer wall of the magnetic plate.

[0018] As a further description of the above technical solution: the air release groove is connected to the air outlet, the connecting groove three is connected to the cavity, and the stop block and the outer wall of the sliding rod are both bonded with a rubber layer.

[0019] The present invention provides a production process for a crystal resonator by improvement, which has the following improvements and advantages compared with the prior art:

[0020] First, start the air pump, which draws air so that the suction cup can absorb the wafer. Then place the carrier at the bottom of the placement box. Then transfer the adhesive material to the carrier. The air pump draws air to achieve the absorption effect.

[0021] Second: When the adhesive material is solid, the air pump uses a smaller wind force, and when the adhesive material is liquid, the air pump uses a larger wind force to remove bubbles, and the intermittent change of pressure can accelerate the bursting speed of bubbles;

[0022] Third: the electric push rod moves upward, and the air pump's suction can quickly cool down and solidify the heated glue, cooling it while moving upward, thereby improving production efficiency;

[0023] To sum up, before adhesion, the air pump's suction can adsorb the wafer, and through the setting of the turntable, air can be pumped to effectively remove bubbles from both liquid and solid adhesive materials. Using gas to blow directly onto the solid adhesive material can make the bubbles burst faster, and intermittently adjusting the pressure can make the liquid adhesive material burst quickly. After adhesion, the air pump's suction can quickly cool down and solidify the heated glue, and cool down while moving, thereby improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The present invention will be further explained below in conjunction with the accompanying drawings and examples:

[0025] Figure 1 A schematic structural diagram of a production process for a crystal resonator provided by an embodiment of the present invention;

[0026] Figure 2 A three-dimensional cross-sectional view of a placement box provided in an embodiment of the present invention;

[0027] Figure 3 A schematic structural diagram of an insert block provided in an embodiment of the present invention;

[0028] Figure 4 A transverse cross-sectional view of an insert provided in an embodiment of the present invention;

[0029] Figure 5 for Figure 2 Enlarged view of point A in the middle;

[0030] Figure 6 for Figure 2 Enlarged view of point B in the middle;

[0031] Figure 7 for Figure 2 Enlarged view of point C in the middle;

[0032] Figure 8for Figure 3 Enlarged view of point D in the middle.

[0033] In the figure: 1. Conveyor platform; 2. Connecting frame; 3. Electric push rod; 4. Air pump; 5. Conveyor belt; 6. Defoaming mechanism; 61. Placement box; 62. Connecting slot; 63. Turntable; 64. Air inlet 1; 65. Branch slot; 66. Air inlet 2; 7. Trigger mechanism; 71. Rotating shaft; 72. Magnetic plate; 73. Friction pad; 74. Lifting sleeve; 75. Insert plate; 76. Slide slot; 77. Spring 1; 78. Spring 2; 79. Insert rack; 710. Spring 3; 8. Switching mechanism; 81. Insert block; 82. Stop block; 83. Cavity; 84. Slide rod; 85. Suction cup; 86. Spring 4; 87. Connecting slot 1; 88. Air release slot; 89. Connecting slot 2; 810. Spring 5; 811. Air outlet; 812. Connecting slot 3; 9. Catheter. DETAILED DESCRIPTION

[0034] In order to make the technical means, creative features, objectives and effects of the present invention easier to understand, the present invention is further described below with reference to specific diagrams. It should be noted that the embodiments and features in the embodiments of this application can be combined with each other unless they conflict.

[0035] See also Figure 1 - Figure 8 The embodiment of the present invention provides a technical solution: including a production process of a crystal resonator, which uses a production device for the crystal resonator, including a conveyor platform 1 and a connecting frame 2 fixed to the conveyor platform 1, an electric push rod 3 and an air pump 4 are provided on the upper end of the connecting frame 2, and a conduit 9 is connected to the air pump 4. A conveyor belt 5 is rotatably provided in the conveyor platform 1. The specific steps of processing using the above-mentioned crystal resonator production device are as follows:

[0036] S1. Start the air pump 4 to pump air so that the suction cup 85 can absorb the wafer, then place the carrier plate at the bottom of the inner cavity of the placement box 61, and then transfer the adhesive material to the carrier plate;

[0037] S2. When the adhesive material is solid, the air pump 4 uses a smaller wind force. When the adhesive material is liquid, the air pump 4 uses a larger wind force to remove bubbles.

[0038] S3, the electric push rod 3 moves upward, and the air pump 4 sucks air to quickly cool down and solidify the heated glue, cooling it while moving upward, thereby improving production efficiency;

[0039] The defoaming mechanism 6 can effectively remove bubbles in the adhesive material. The defoaming mechanism 6 is arranged at the upper end of the conveyor belt 5;

[0040] The trigger mechanism 7 can adjust the method of removing bubbles by changing the wind force, and the trigger mechanism 7 is arranged in the debubble mechanism 6;

[0041] And a switching mechanism 8 is used to automatically change the effect of the air extraction, and the switching mechanism 8 is arranged on the upper side of the defoaming mechanism 6.

[0042] As a further description of the above technical solution: the defoaming mechanism 6 includes a placement box 61 arranged at the upper end of the conveyor belt 5, a connecting groove 62 is opened on one side of the placement box 61, a turntable 63 is rotatably set on the inner wall of the placement box 61, and the turntable 63 is set away from the connecting groove 62, an air inlet 1 64 is opened on the outer wall of the placement box 61, and the air inlet 1 64 is opened away from the connecting groove 62, a branch groove 65 is opened on the outer wall of the turntable 63 on the side close to the air inlet 1 64, and an air inlet 2 66 is opened on the outer wall of the turntable 63 on the side away from the air inlet 1 64, and the air inlet 2 66 is connected to the branch groove 65.

[0043] Specifically, before adhesion, the air pump 4 exhausts air to adsorb the wafer, and through the setting of the turntable 63, the air can be exhausted to effectively remove bubbles from both liquid and solid adhesive materials. Using gas to blow directly to the solid adhesive material can make the bubbles burst faster, and intermittently adjusting the pressure can make the liquid adhesive material burst quickly. After adhesion, the air pump 4 suctions air to make the heated glue quickly cool down and solidify, and cool down while moving upward, thereby improving production efficiency.

[0044] In another embodiment provided by the present invention, the defoaming mechanism 6 includes a placement box 61 arranged at the upper end of the conveyor belt 5, a connecting groove 62 is opened on one side of the placement box 61, a turntable 63 is rotatably set on the inner wall of the placement box 61, and the turntable 63 is set away from the connecting groove 62, an air inlet 1 64 is opened on the outer wall of the placement box 61, and the air inlet 1 64 is opened away from the connecting groove 62, a branch groove 65 is opened on the outer wall of the turntable 63 on the side close to the air inlet 1 64, and an air inlet 2 66 is opened on the outer wall of the turntable 63 on the side away from the air inlet 1 64, and the air inlet 2 66 is connected to the branch groove 65.

[0045] The trigger mechanism 7 includes a rotating shaft 71 fixed to the center of the turntable 63, and the rotating shaft 71 is rotatably set in the placement box 61. A lifting sleeve 74 is provided in the placement box 61 for sliding up and down. The bottom end of the lifting sleeve 74 is fixedly connected to a spring 2 78 in the placement box 61. An insert plate 75 is provided for horizontal sliding in the lifting sleeve 74. A spring 1 77 is fixed between the insert plate 75 and the lifting sleeve 74. A sliding groove 76 is provided in the placement box 61, and a magnetic plate 72 is provided in the sliding groove 76. The upper end of the magnetic plate 72 extends to the upper side of the placement box 61. The magnetic plate 72 is fixed on the insert plate 75. An insert block 81 is provided on the upper side of the placement box 61. A plug rack 79 is movably inserted into the outer wall of the plug block 81. A spring 3 710 is fixedly connected between one end of the plug rack 79 located in the plug block 81 and the plug block 81.

[0046] A plurality of branch grooves 65 are provided in a ring shape at equal intervals.

[0047] The second air inlet 66 is located on the upper side of the carrier plate.

[0048] A friction pad 73 is bonded to the outer wall of the magnetic plate 72 .

[0049] Specifically, before adhesion, the air pump 4 can pump air to adsorb the wafer, and through the setting of the turntable 63, air can be pumped to effectively remove bubbles from both liquid and solid adhesive materials. Using gas to blow directly to the solid adhesive material can make the bubbles burst faster, and intermittently adjusting the pressure can make the liquid adhesive material burst quickly.

[0050] In another embodiment provided by the present invention, the switching mechanism 8 includes an insert block 81, and the upper end of the insert block 81 is fixedly connected to the electric push rod 3, a cavity 83 is opened in the insert block 81, and the cavity 83 is connected to the guide tube 9. A slide bar 84 is inserted horizontally into the outer wall of the insert block 81 away from the insert frame 79, and a spring 86 is fixedly connected between one end of the slide bar 84 located in the insert block 81 and the insert block 81, and a connecting groove 87 is opened on the upper side of the slide bar 84 and the insert block 81, and the connecting groove One 87 is connected to the cavity 83, the bottom end of the connecting groove 1 87 is connected to the suction cup 85, the upper side of the slide rod 84 is provided with a connecting groove 2 89, the slide rod 84 is provided with a connecting groove 3 812 and a venting groove 88, the bottom end of the insert block 81 is provided with an air outlet 811, and the placement box 61 is provided with a stopper 82 at the lower side of the connecting groove 62, and the stopper 82 is horizontally slidably set in the placement box 61, and a spring 5 810 is fixed between the lower end of the stopper 82 and the placement box 61.

[0051] The air release groove 88 is connected to the air outlet 811, the connecting groove 812 is connected to the cavity 83, and the outer walls of the stopper 82 and the sliding rod 84 are both bonded with a rubber layer.

[0052] Specifically, after adhesion, the suction of the air pump 4 can quickly cool down and solidify the heated glue, and the glue is cooled while being moved upward, thereby improving production efficiency.

[0053] Working principle: When using this device, first start the air pump 4, which pumps air so that the suction cup 85 can absorb the wafer, then place the carrier plate on the bottom of the inner cavity of the placement box 61, then transfer the adhesive material to the carrier plate, and then transport the placement box 61 and the carrier plate to the bottom of the electric push rod 3 via the conveyor belt 5. Then, start the electric push rod 3 and the air pump 4, and the electric push rod 3 drives the plug block 81 to move downward, and the bottom end of the insertion rack 79 will move downward. When the insertion rack 79 moves near the magnetic plate 72, the magnetic plate 72 and the insertion rack 79 will be adsorbed together. When the plug block 81 continues to move downward, the magnetic plate 72 will move downward with the insertion rack 79.

[0054] When the adhesive material is solid, the air pump 4 uses a smaller wind force. At this time, the length of the plug frame 79 extending out of the plug block 81 is greater, so that the magnetic plate 72 can be located on the side of the rotating shaft 71 away from the stop block 82. When the magnetic plate 72 moves down, the rotating shaft 71 can rotate counterclockwise, thereby causing the second air inlet 66 on the turntable 63 to rotate upward. At this time, the notch connected to the upper side of the connecting groove 89 is connected to the upper side of the connecting groove 62, the sliding rod 84 will be compressed inward, and the connecting groove 1 87 is no longer connected to the suction cup 85, preventing the wafer adsorbed on the lower side of the suction cup 85 from loosening. At this time, the air inlet 1 64 and the branch groove 65 will be connected, and the outside air will enter the inner cavity of the placement box 61 from the second air inlet 66, so that the second air inlet 66 can blow towards the solid adhesive material, so that the bubbles in the solid adhesive material are pressed out;

[0055] When the adhesive material is in liquid form, the air pump 4 uses a larger wind force. At this time, the length of the plug frame 79 extending from the plug block 81 is smaller, and the air inlet 2 66 on the turntable 63 rotates downward, so that the wind will not blow directly towards the liquid adhesive material, preventing the liquid adhesive material from being blown away. At this time, due to the setting of the branch groove 65, the inner cavity of the placement box 61 is intermittently connected to the outside through the air inlet 1 64. The air pump 4 continuously pumps the gas in the placement box 61, which makes the pressure in the placement box 61 intermittently reduced, so that the bubbles in the liquid adhesive material can be broken, and the intermittent pressure change can accelerate the bursting speed of the bubbles.

[0056] When the insert block 81 continues to move down, the insert rack 79 and the magnetic plate 72 will move relative to each other, and the insert rack 79 can continue to move down. When the insert block 81 moves to the bottom, the stopper 82 will continue to squeeze the slide bar 84 inward, so that the air release groove 88 is connected to the air outlet 811, and the stopper 82 will also open, so that the outside is connected to the inner cavity of the placement box 61. After that, the suction cup 85 is no longer in a negative pressure state and no longer adsorbs the wafer. After that, the insert block 81 is moved up, the slide bar 84 slowly moves outward, and the stopper 82 is also in an open state. The gas in the placement box 61 will be successively extracted by the air pump 4 from the connecting groove 89 and the suction cup 85, so that when the electric push rod 3 moves up, the suction of the air pump 4 can quickly cool down and solidify the heated glue, and cool down while moving up, thereby improving production efficiency.

[0057] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the above-described embodiments. The above-described embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A production process for a crystal resonator, comprising a conveyor platform (1) and a connecting frame (2) fixed to the conveyor platform (1), wherein an electric push rod (3) and an air pump (4) are provided at the upper end of the connecting frame (2), a conduit (9) is connected to the air pump (4), and a conveyor belt (5) is rotatably provided in the conveyor platform (1), characterized in that: The specific steps of processing using the above-mentioned crystal resonator production device are as follows: S1, start the air pump (4), the air pump (4) draws air so that the suction cup (85) can absorb the wafer, and then place the carrier plate at the bottom of the inner cavity of the placement box (61), and then transfer the adhesive material to the carrier plate; S2. When the adhesive material is in a solid state, the air pump (4) uses a smaller wind force, and when the adhesive material is in a liquid state, the air pump (4) uses a larger wind force to remove bubbles; S3, the electric push rod (3) moves upward, and the air pump (4) sucks air to quickly cool down and solidify the heated glue, and the temperature is lowered while moving upward, thereby improving production efficiency; A defoaming mechanism (6) is capable of efficiently removing bubbles in the adhesive material, and the defoaming mechanism (6) is arranged at the upper end of the conveyor belt (5); A trigger mechanism (7) is capable of adjusting the method of removing bubbles by changing the wind force, and the trigger mechanism (7) is arranged in the debubbling mechanism (6); And a switching mechanism (8) for automatically changing the effect of air extraction, wherein the switching mechanism (8) is arranged on the upper side of the defoaming mechanism (6).

2. The process for producing a crystal resonator according to claim 1, wherein: The defoaming mechanism (6) comprises a placement box (61) arranged at the upper end of the conveyor belt (5), a connecting groove (62) is provided on one side of the placement box (61), a turntable (63) is rotatably provided on the inner wall of the placement box (61), and the turntable (63) is arranged away from the connecting groove (62), an air inlet 1 (64) is provided on the outer wall of the placement box (61), and the air inlet 1 (64) is provided away from the connecting groove (62), a branch groove (65) is provided on the outer wall of the turntable (63) on the side close to the air inlet 1 (64), and an air inlet 2 (66) is provided on the outer wall of the turntable (63) on the side away from the air inlet 1 (64), and the air inlet 2 (66) is communicated with the branch groove (65).

3. The process for producing a crystal resonator according to claim 2, wherein: The trigger mechanism (7) includes a rotating shaft (71) fixed to the center of the turntable (63), and the rotating shaft (71) is rotatably arranged in the placement box (61), a lifting sleeve (74) is provided in the placement box (61) to slide up and down, a spring 2 (78) is fixed at the bottom end of the lifting sleeve (74) and the placement box (61), an inserting plate (75) is provided in the lifting sleeve (74) to slide horizontally, and a spring 1 (77) is fixed between the inserting plate (75) and the lifting sleeve (74), A slide groove (76) is provided in the placement box (61), and a magnetic plate (72) is provided in the slide groove (76). The upper end of the magnetic plate (72) extends to the upper side of the placement box (61). The magnetic plate (72) is fixed on the plug plate (75). An insert block (81) is provided on the upper side of the placement box (61). An insert rack (79) is movably inserted into the outer wall of the insert block (81). A spring three (710) is fixed between one end of the insert rack (79) located in the insert block (81) and the insert block (81).

4. The process for producing a crystal resonator according to claim 3, wherein: The switching mechanism (8) includes an insert block (81), and the upper end of the insert block (81) is fixedly connected to the electric push rod (3), a cavity (83) is provided in the insert block (81), and the cavity (83) is communicated with the guide tube (9), and a sliding rod (84) is inserted horizontally on the outer wall of the insert block (81) away from the insert rack (79), and a spring four (86) is fixedly connected between one end of the sliding rod (84) located in the insert block (81) and the insert block (81), and a connecting groove one (87) is provided on the upper side of the sliding rod (84) and the insert block (81), and the connecting groove one (87) is connected to the cavity (83) are connected, the bottom end of the connecting groove (87) is connected to a suction cup (85), the upper side of the slide bar (84) is provided with a connecting groove (89), the slide bar (84) is provided with a connecting groove (812) and a venting groove (88), the bottom end of the plug (81) is provided with an air outlet (811), the placement box (61) is provided with a stopper (82) located on the lower side of the connecting groove (62), and the stopper (82) is horizontally slidably arranged in the placement box (61), and a spring (810) is fixed between the lower end of the stopper (82) and the placement box (61).

5. The process for producing a crystal resonator according to claim 2, wherein: The branch grooves (65) are provided in a ring-shaped manner with a plurality of equal intervals.

6. The process for producing a crystal resonator according to claim 2, wherein: The second air inlet (66) is located on the upper side of the carrier plate.

7. The process for producing a crystal resonator according to claim 3, wherein: A friction pad (73) is bonded to the outer wall of the magnetic plate (72).

8. The process for producing a crystal resonator according to claim 4, wherein: The air release groove (88) is connected to the air outlet (811), the connecting groove (812) is connected to the cavity (83), and the outer walls of the stopper (82) and the sliding rod (84) are both bonded with a rubber layer.

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