A method for manufacturing a flexible circuit board with large current carrying capacity and thick copper for vertical and horizontal circuits

Abstract

The present invention discloses a method for manufacturing a flexible circuit board with large current carrying capacity and thick copper for vertical and horizontal lines. The method comprises the following steps: taking a double-sided copper-clad plate with the copper thickness on both sides being ≥50 microns, and then making through holes to form a through-hole plate; the through holes include exhaust holes located at the edge of the plate of the panel structure and drainage holes between adjacent unit plates; making a dry film pattern on the through-hole plate, etching part of the copper thickness, turning the plate over and rotating it horizontally by 90 degrees, etching the remaining copper thickness, and then stripping the film to form an etched plate; taking a covering film, opening windows corresponding to the through holes to form a windowed covering film; attaching at least one side of the windowed covering film to the etched plate, and then filling the exhaust holes with glue, and forming a circuit board through post-processing; by providing the exhaust holes, the gas between the covering film and the plate body during the lamination process of the covering film can be effectively discharged, and the problem of the plate bursting caused by loose lamination can be effectively avoided; by providing drainage holes between adjacent unit plates, the occurrence of the "pool effect" can be effectively avoided, thereby improving the etching quality.

Description

Technical Field

[0001] The present invention relates to the field of flexible board processing, and in particular to a method for manufacturing a flexible circuit board with large current carrying capacity and thick copper for vertical and horizontal lines. Background Art

[0002] Flexible circuit boards have been widely used in many fields due to their unique flexibility and ability to adapt to various complex spatial shapes.

[0003] Flexible circuit boards used in new energy vehicles or low-altitude aircraft need to withstand large currents, so they are generally designed with thick copper lines (generally copper thickness ≥ 50μm), and the line patterns need to meet the requirements of the flexible board installation space and the line connection direction. Therefore, there are many cases where horizontal line patterns and vertical line patterns are arranged vertically and horizontally to form an overall line pattern. When the horizontal installation space is small, the line gap of the horizontal line pattern is smaller than the line gap of the vertical line pattern.

[0004] This special circuit layout also brings the following challenges to the manufacturing process:

[0005] (1) Due to the thick copper thickness and the fact that the lines are arranged vertically and horizontally, and the line gaps between the vertical and horizontal line patterns are different, the traditional direct etching method will cause uneven etching of the vertical and horizontal lines;

[0006] (2) Due to the thick copper layer and dense distribution of circuit patterns, problems such as loose pressing, hidden bubbles, and even delamination or board explosion may occur during the lamination process of the cover film. In addition, the copper-free area is prone to slippage, affecting the reliability and service life of the final product.

[0007] Therefore, in order to solve the above-mentioned problems, it is necessary to provide a method for manufacturing a flexible circuit board with thick copper and large current carrying capacity in vertical and horizontal lines. Summary of the Invention

[0008] The present invention aims to solve the comprehensive problems of uneven etching and weak lamination of the cover film in the processing of the existing vertical and horizontal line high current thick copper flexible circuit board. A method for manufacturing a vertical and horizontal line high current thick copper flexible circuit board is proposed. The flexible circuit board is processed by splicing a plurality of unit boards to form a panel structure. The panel structure includes a forming line. The area within the forming line is an effective area, and the area outside the forming line is an ineffective area. The manufacturing method includes the following steps:

[0009] S10: Take a double-sided copper clad laminate and make through holes to form a through-hole board; the copper thickness on both sides of the double-sided copper clad laminate is ≥50 μm; the through holes include exhaust holes located at the edges of the panel structure and drainage holes between adjacent unit boards;

[0010] S20: forming a dry film pattern on the through-hole board, etching a portion of the copper thickness, then turning the board over and rotating it horizontally by 90 degrees, etching the remaining copper thickness to form a circuit pattern, stripping the film, and forming an etched board on the entire board; the circuit pattern includes a transverse circuit pattern and a longitudinal circuit pattern perpendicular to each other, and the circuit gap of the longitudinal circuit pattern is larger than the circuit gap of the transverse circuit pattern;

[0011] S30: Take a cover film and press it onto both sides of the etching plate, wherein the cover film on one side is provided with a window pattern, the window pattern corresponding to the through hole; the exhaust hole forms a hole to be filled; and an attached plate is formed;

[0012] S40: Filling the holes to be filled with glue, performing post-processing, and performing molding processing to form the flexible circuit board.

[0013] Furthermore, the circuit pattern also includes a plurality of copper dot patterns distributed in the ineffective area.

[0014] Furthermore, the manufacturing of the dry film pattern includes performing circuit compensation on the circuit pattern before etching a portion of the copper thickness, and the circuit compensation of the vertical circuit pattern is greater than the circuit compensation of the horizontal circuit pattern.

[0015] Furthermore, etching part of the copper thickness includes etching away 1 / 3 to 2 / 3 of the copper thickness.

[0016] Furthermore, the manufacturing of the circuit pattern further includes manufacturing an exhaust groove pattern corresponding to the exhaust hole, and the width of the exhaust groove pattern is greater than the diameter of the exhaust hole.

[0017] Furthermore, the diameter of the window pattern is greater than the width of the exhaust slot.

[0018] Furthermore, a plurality of the exhaust holes or the drainage holes are distributed in the ineffective area at the end of the transverse circuit pattern.

[0019] Furthermore, a plurality of the exhaust holes or the drainage holes are distributed in the ineffective area at the end of the longitudinal line pattern.

[0020] Furthermore, the glue filling is to lay a glue layer on the hole to be filled and perform rapid pressing, or to fill liquid glue into the hole to be filled and perform baking and curing.

[0021] Furthermore, after etching the remaining copper thickness, micro-etching is performed.

[0022] The main beneficial effects of the technical solution of the present invention are as follows.

[0023] (1) By setting exhaust holes and etching exhaust groove patterns at corresponding positions in the subsequent process, the gas between the cover film and the board during the lamination process can be effectively discharged, avoiding problems such as loose lamination, hidden bubbles, and even delamination or board explosion;

[0024] (2) By setting drainage holes between adjacent unit boards, it can ensure that the waste liquid and old etching liquid generated during the etching process can be discharged in time, preventing the occurrence of the "pool effect", improving the consistency and uniformity of circuit etching, and improving the etching quality;

[0025] (3) By first etching part of the copper thickness, then turning it over and rotating it horizontally 90°, and then continuing to etch the remaining copper thickness, a processing method combining step-by-step etching and flipping is formed, which reduces the occurrence of side etching and the risk of short circuit. At the same time, it optimizes the flow and exchange efficiency of the etching solution, improves the etching uniformity and product reliability;

[0026] (4) By designing the exhaust hole at the top of the line, it helps to more efficiently discharge the gas distributed along the line during the pressing process, avoiding problems such as loose pressing or bubbles caused by gas blockage;

[0027] (5) By designing the drainage hole at the top of the circuit, the etching liquid exchange efficiency during etching and the pressing effect of the cover film are further optimized to ensure the etching and pressing quality of the product;

[0028] (6) By adding copper dot patterns in the ineffective area, the surface roughness is increased, the friction force when the cover film is attached is enhanced, which helps to maintain the stability of the position, reduces the problems of slippage and misalignment, and improves the quality of the cover film lamination;

[0029] (7) Overall, this embodiment uses a process that combines "staged etching with flip-over rotary etching" and provides drainage holes, which is beneficial to the discharge of etching liquid and more conducive to improving etching uniformity, ensuring the consistency of etching conditions on the entire panel and solving the problem of uneven etching of vertical and horizontal lines. At the same time, "exhaust holes for exhaust + directional glue filling" solves the problem of loose pressing of the covering film, forming a "design-etching-pressing" full process optimization and a processing flow in which the front and back processes cooperate with each other, thereby improving the reliability and service life of the final flexible circuit board product. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0031] Figure 1 Schematic diagram of the process of an embodiment of the present invention;

[0032] Figure 2 A schematic plan view of a through-hole plate according to an embodiment of the present invention;

[0033] Figure 3 for Figure 2 The actual image corresponding to the local enlarged area FD;

[0034] Figure 4 Schematic diagram of the process of turning over and rotating the plate during etching processing according to an embodiment of the present invention;

[0035] Figure 5 A schematic plan view of an etching plate according to an embodiment of the present invention;

[0036] Figure 6 Schematic diagram of design data of a copper dot pattern according to an embodiment of the present invention;

[0037] Figure 7 A schematic plan view of an attachment plate according to an embodiment of the present invention;

[0038] Figure 8 for Figure 7 AA cross-sectional structural diagram;

[0039] Figure 9 A schematic plan view of a glue-filled sheet according to an embodiment of the present invention;

[0040] Figure 10 for Figure 9 BB cross-sectional structure diagram;

[0041] Figure 11 Schematic diagram of a plan view of a flexible circuit board according to an embodiment of the present invention.

[0042] Explanation of the accompanying reference numerals: 10, through-hole plate; 100, molding line; 100a, effective area; 100b, ineffective area; 1010, vent; 1020, drainage hole; FD, local enlarged area; 20, etched plate; 2010, horizontal circuit pattern; 2020, vertical circuit pattern; 2030, vent groove pattern; 2040, copper dot pattern; 30, window cover film; 3010, window pattern; 40, attached plate; 4010, hole to be filled; 50, glue-filled plate; 5010, glue layer; 60, flexible circuit board.

[0043] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0044] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0045] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, inside, outside, etc.) are only used to explain the relative position relationship and movement status of the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0046] In addition, the terms "first," "second," and so on, used in this disclosure are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referenced. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this disclosure, "plurality" means at least two, such as two or three, unless otherwise specifically defined.

[0047] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in this field can implement it. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0048] The flexible circuit board 60 in this embodiment is processed by splicing several unit boards to form a panel structure, which includes a molding line 100. The area within the molding line 100 is an effective area 100a, and the area outside the molding line 100 is an ineffective area 100b.

[0049] See also Figure 1 , Figure 1 Schematic diagram of the process of an embodiment of the present invention.

[0050] The manufacturing process of the embodiment of the present invention includes using Figure 1 The following will implement the various steps in the process Figure 1 Detailed description of each step in the process.

[0051] See also Figure 2 and Figure 3 , Figure 2 A schematic plan view of a through-hole plate according to an embodiment of the present invention; Figure 3 for Figure 2 The actual image corresponding to the local enlarged area FD.

[0052] Step S10:

[0053] A double-sided copper clad laminate is used to make through holes to form a through-hole plate 10; the copper thickness on both sides of the double-sided copper clad laminate is ≥50 microns; the through holes include exhaust holes 1010 located at the edge of the panel structure and drainage holes 1020 between adjacent unit boards.

[0054] The double-sided copper clad laminates selected in this embodiment have a thickness of ≥50 microns, which meets the current carrying capacity requirements.

[0055] By first making the exhaust hole 1010, a processing basis is provided for the subsequent process of pressing the covering film and exhausting the air between the covering film and the board body, and in the etching of the subsequent process, the exhaust groove pattern 2030 is made corresponding to the position of the exhaust hole 1010, forming a combination of the exhaust groove pattern 2030 and the exhaust hole 1010, so that the gas inside the board surface forms an effective exhaust path during pressing, thereby being smoothly discharged, effectively avoiding quality problems caused by residual gas.

[0056] Since the "pool effect" is easily generated during the etching process of the later process, the etching liquid cannot be discharged in time, resulting in uneven etching in local areas. By setting drainage holes 1020 between adjacent unit boards, the etching liquid in the center area of ​​the board body can be discharged in time, thereby improving the uniformity and consistency of the etching process and improving the etching quality.

[0057] See also Figure 4 and Figure 5 , Figure 4 Schematic diagram of the process of turning over and rotating the plate during etching processing according to an embodiment of the present invention; Figure 5 Schematic plan view of an etching plate according to an embodiment of the present invention.

[0058] Step S20:

[0059] A dry film pattern is formed on the through-hole board 10, and a portion of the copper thickness is etched. The through-hole board 10 is then turned over and rotated horizontally 90 degrees to etch the remaining copper thickness to form a circuit pattern. The film is then stripped, and the entire board is formed into an etched board 20; the circuit pattern includes a horizontal circuit pattern 2010 and a vertical circuit pattern 2020 that are perpendicular to each other, and the circuit gap of the vertical circuit pattern 220 is larger than the circuit gap of the horizontal circuit pattern 2010.

[0060] Furthermore, etching a portion of the copper thickness includes etching away 1 / 3 to 2 / 3 of the copper thickness.

[0061] Due to the large copper thickness (≥50 microns), if a one-time etching method is used, it is easy to produce large side etching at the etching edge, which not only affects the etching effect of the circuit, but in severe cases may also cause short circuit problems during application.

[0062] During the etching process, a "pool effect" is easily generated on the upper surface. The old reacted solution is difficult to be discharged, and the new solution is difficult to form an effective exchange, resulting in insufficient etching in local areas and reduced etching uniformity.

[0063] There are also horizontal line patterns 2010 and vertical line patterns 2020 (and the gaps between the vertical and horizontal lines are inconsistent). If etching is performed in a single direction, it is easy to cause the etching solution to over-etch the line patterns in one direction and under-etch the lines in the other direction.

[0064] Therefore, the use of a step-by-step etching method (i.e., etching part of the copper thickness first, and then etching the remaining copper thickness) can effectively reduce the occurrence of side etching, reduce the risk of short circuits, and improve product reliability.

[0065] Etching the circuit board over again ensures that the etching conditions on both sides are consistent, resulting in the same etching effect on the first and second sides, reducing quality problems caused by differences in etching conditions.

[0066] By rotating horizontally by 90°, the etching directions of the longitudinal circuit pattern 2020 and the transverse circuit pattern 2010 are interchanged, so that the etching conditions of the longitudinal and transverse circuits are consistent, thereby preventing problems such as uneven circuit etching caused by etching in a single direction.

[0067] Furthermore, the distributed etching method is related to flip etching and horizontal 90° rotation etching. Because part of the copper thickness is etched first, it is possible to ensure that there is remaining copper thickness for etching after flipping and horizontally rotating 90°, thereby improving the etching uniformity and etching quality. If etching is not performed in steps, the meaning of flip etching and horizontal rotation 90° etching is lost.

[0068] Furthermore, the manufacturing of the dry film pattern includes performing line compensation on the line pattern before etching a portion of the copper thickness, and the line compensation of the vertical line pattern 2020 is greater than the line compensation of the horizontal line pattern 2010.

[0069] Due to side etching during the etching process, the actual circuit width may be narrower than designed, affecting circuit performance and reliability. Therefore, when making dry film patterns, the dry film patterns in the design data are pre-sized to form circuit compensation, so that the circuit after etching meets the circuit standards of the design data.

[0070] Furthermore, the line gap of the vertical line pattern 2020 is larger than the line gap of the horizontal line pattern 2010. Even if the above-mentioned step-by-step etching, flip etching, and horizontal 90° rotation etching methods are used to form consistent etching conditions, the problem of inconsistent reaction efficiency still exists during the etching reaction process.

[0071] Therefore, in this embodiment, differential compensation is performed on the vertical circuit pattern 2020 and the horizontal circuit pattern 2010 to improve the consistency of the etching reaction process of the circuits on the entire panel.

[0072] Specifically, since the same surface is affected by the "pool effect", but the line gaps between the vertical line patterns 2020 are larger than the line gaps between the horizontal line patterns 2010, the vertical line patterns 2020 have a larger and more complete space for etching liquid exchange during etching, and thus the etching reaction process is more intense. Therefore, the compensation value of the vertical line pattern 2020 is set to be relatively large to balance the etching efficiency when etching synchronously with the horizontal line pattern 2010. In contrast, the horizontal line pattern 2010 has a narrower line gap, poor etching liquid fluidity, and relatively poor etching conditions, so its compensation value is set to be relatively small.

[0073] Optionally, the compensation for a line gap of 100 μm in the longitudinal line pattern 2020 is 15 μm, and the compensation for a line gap of 75 μm in the transverse line pattern 2010 is 10 μm.

[0074] Furthermore, a plurality of vent holes 1010 or drainage holes 1020 are distributed in the inactive area 100 b at the end of the transverse circuit pattern 2010 .

[0075] Furthermore, a plurality of vent holes 1010 or drainage holes 1020 are distributed in the inactive area 100 b at the end of the longitudinal line pattern 2020 .

[0076] By providing the drainage holes 1020, the etching liquid can flow out more smoothly along the direction of the circuit, reducing the aggregation of the etching liquid between the line gaps, thereby avoiding the etching liquid being blocked by the circuit pattern, especially in the dense circuit area, where the etching liquid is more difficult to flow and discharge freely, affecting the consistency and uniformity of the etching.

[0077] Similarly, since the gas along the line distribution direction in the board body is easily blocked by the line pattern when the covering film is pressed, the gas is difficult to discharge, which affects the pressing effect of the covering film. Therefore, by setting the exhaust hole 1010, the gas can be smoothly discharged from the exhaust hole 1010, thereby improving the exhaust efficiency of the gas in the board body, effectively avoiding the problems of loose pressing, hidden bubbles, and further leading to delamination or board explosion.

[0078] Furthermore, the circuit pattern is produced, and further includes producing an exhaust groove pattern 2030 corresponding to the exhaust hole 1010 , wherein the width of the exhaust groove pattern 2030 is greater than the diameter of the exhaust hole 1010 .

[0079] When making a circuit pattern on the through-hole board 10, the exhaust groove pattern 2030 is etched corresponding to the position of the exhaust hole 1010 on the edge of the board, so that the exhaust hole 1010 is connected to the exhaust groove pattern 2030 on both sides of the board, providing an effective exhaust path for the gas generated inside the circuit board, ensuring that the gas can be smoothly discharged from the exhaust hole 1010 or the exhaust groove pattern 2030.

[0080] It is worth mentioning that the exhaust hole 1010 mainly plays the role of auxiliary exhaust. By setting the exhaust hole 1010, the exhaust groove graphics 2030 on both sides can be connected; the covering film pressing is easy to cause deviations in the pasting process, resulting in the formation of two-sided covering film lamination around the edge of the panel structure, causing the exhaust groove graphics 2030 to be blocked. Therefore, the setting of the exhaust hole 1010 can ensure that the gas can be discharged smoothly, effectively avoiding the occurrence of problems affecting product quality due to poor exhaust.

[0081] The width of the exhaust groove pattern 2030 is greater than the diameter of the exhaust hole 1010, which helps to improve the gas exhaust efficiency on the one hand, and on the other hand, reduces the risk of poor exhaust caused by blockage due to the adhesion of the covering films on both sides.

[0082] See also Figure 6 , Figure 6 Schematic diagram of design data of a copper dot pattern according to an embodiment of the present invention.

[0083] Furthermore, the circuit pattern also includes a plurality of copper dot patterns 2040 distributed in the inactive area 100b.

[0084] By adding a copper dot pattern 2040 to the ineffective area 100b, the surface roughness can be significantly increased, thereby enhancing the friction between the window covering film 30 and the window covering film 30, helping to maintain position stability during the attachment process of the window covering film 30, reducing problems such as position offset or misalignment caused by sliding, and effectively avoiding the window covering film 30 from being easily pressed together, causing loose pressing and slipping, which in turn leads to problems such as delamination or board explosion.

[0085] Furthermore, after etching the remaining copper thickness, micro-etching is performed to remove burrs.

[0086] Because the copper is thicker, the concentration of the first and second etching solutions is higher, and the etching process is faster. After the second etching, there may be some burrs at the bottom of the circuit. The micro-etching method can effectively remove the burrs, reduce the side corrosion of the circuit, and ensure that the circuit has clear and smooth edges.

[0087] See also Figure 7 and Figure 8 , Figure 7 A schematic plan view of an attachment plate according to an embodiment of the present invention; Figure 8Schematic diagram of the AA cross-section structure.

[0088] Step S30:

[0089] A covering film is taken and pressed onto both sides of the etching plate 20 , wherein the covering film on one side is made with a window pattern 3010 corresponding to the through hole; the exhaust hole 1010 forms a hole to be filled 4010; and an attached plate 40 is formed.

[0090] The hole to be filled 4010 is composed of the exhaust hole 1010 , the exhaust groove pattern 2030 and the window pattern 3010 .

[0091] By attaching a window covering film 30 to one side of the etched board 20, the gas generated when the covering film is pressed can be effectively discharged from the position of the window pattern 3010, while attaching a complete covering film to the other side provides support for the entire board, providing a reliable basis for subsequent processing such as filling with glue, and ensuring the overall stability of the circuit board.

[0092] Optionally, a window cover film 30 may be attached to both sides of the etching plate 20 to further improve the exhaust effect when the cover film is pressed.

[0093] Furthermore, the diameter of the window pattern 3010 is greater than the width of the exhaust slot.

[0094] On the one hand, an additional error margin of the window pattern 3010 corresponding to the exhaust groove can be provided during the lamination process of the covering film to prevent the window covering film 30 from blocking the exhaust groove or even the exhaust hole 1010, thereby hindering the normal discharge of gas.

[0095] On the other hand, it can optimize the glue flow path of subsequent glue filling, create smoother conditions for the subsequent filling process of the hole to be filled 4010, ensure that during the glue filling process, the glue can flow into and fill the exhaust hole 1010 more smoothly, and reduce the risk of blockage caused by narrow channels.

[0096] See also Figures 9 to 11 , Figure 9 A schematic plan view of a glue-filled sheet according to an embodiment of the present invention; Figure 10 for Figure 9 BB cross-sectional structure diagram; Figure 11 Schematic diagram of a plan view of a flexible circuit board according to an embodiment of the present invention.

[0097] Step S40:

[0098] The holes to be filled 4010 are filled with glue to form a glue-filled plate 50 , which is then processed in a subsequent step and molded to form the flexible circuit board 60 .

[0099] Since the copper thickness is relatively large and a hole 4010 to be filled is set at the edge of the board, after the covering film is pressed, the hole 4010 to be filled may not be fully filled. During subsequent processing, it is easy for etching liquid and medicine to seep into the interior of the board through the hole 4010 to be filled. Therefore, it is necessary to fill the glue layer 5010 in this step to seal the hole 4010 to be filled.

[0100] Furthermore, the glue filling is to lay a glue layer 5010 on the hole to be filled 4010 and perform rapid pressing; or, to fill liquid glue into the hole to be filled 4010 and perform baking and curing.

[0101] Specifically, an adhesive layer 5010 is prepared corresponding to the hole 4010 to be filled, and the adhesive layer 5010 is injected into the exhaust path position of the hole 4010 to be filled by using a rapid pressing technology.

[0102] Optionally, the adhesive layer 5010 is an acrylic adhesive layer or an epoxy resin adhesive layer.

[0103] Optionally, the liquid glue is filled by dispensing or silk-screening, which can provide higher processing accuracy and ensure that the colloid is accurately filled into the specified position. After baking and curing, the colloid reaches the ideal hardness and stability.

[0104] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made by using the contents of the present invention description and drawings under the inventive concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A method for manufacturing a high-current-carrying thick copper flexible circuit board with vertical and horizontal circuits, wherein the flexible circuit board is processed by splicing a plurality of unit boards to form a panel structure, wherein the panel structure includes a forming line, the area within the forming line is an effective area, and the area outside the forming line is an ineffective area, characterized in that: The production method comprises the following steps: S10: Take a double-sided copper clad laminate and make through holes to form a through-hole board; The copper thickness on both sides of the double-sided copper clad laminate is ≥50 microns; The through holes include exhaust holes located at the edges of the panel structure and drainage holes between adjacent unit panels; S20: forming a dry film pattern on the through-hole board, etching a portion of the copper thickness, then turning it over and rotating it horizontally by 90 degrees, etching the remaining copper thickness to form a circuit pattern, and stripping the film to form an etched board on the entire board; The circuit pattern includes a transverse circuit pattern and a longitudinal circuit pattern that are perpendicular to each other, and the circuit gap of the longitudinal circuit pattern is larger than the circuit gap of the transverse circuit pattern; The circuit pattern also includes a plurality of copper dot patterns distributed in the invalid area; Forming the circuit pattern further includes forming an exhaust groove pattern corresponding to the exhaust hole, wherein the width of the exhaust groove pattern is greater than the diameter of the exhaust hole; S30: Take a cover film and press it onto both sides of the etching plate, wherein the cover film on one side is provided with a window pattern, the window pattern corresponding to the through hole; the exhaust hole forms a hole to be filled; and an attached plate is formed; The diameter of the window pattern is greater than the width of the exhaust slot; S40: Filling the holes to be filled with glue, performing post-processing, and performing molding processing to form the flexible circuit board.

2. The method for manufacturing a high current carrying thick copper flexible circuit board with vertical and horizontal lines according to claim 1, characterized in that: The manufacturing of the dry film pattern includes performing line compensation on the line pattern before etching a portion of the copper thickness, wherein the line compensation of the vertical line pattern is greater than the line compensation of the horizontal line pattern.

3. The method for manufacturing a high current carrying thick copper flexible circuit board with vertical and horizontal lines as claimed in claim 1, characterized in that: Etching a portion of the copper thickness includes etching away 1 / 3 to 2 / 3 of the copper thickness.

4. The method for manufacturing a high current carrying thick copper flexible circuit board with vertical and horizontal lines as claimed in claim 1, characterized in that: A plurality of the exhaust holes or the drainage holes are distributed in the ineffective area at the end of the transverse circuit pattern.

5. The method for manufacturing a high current carrying thick copper flexible circuit board with vertical and horizontal lines as claimed in claim 1, characterized in that: A plurality of the exhaust holes or the drainage holes are distributed in the ineffective area at the end of the longitudinal line pattern.

6. The method for manufacturing a high current carrying thick copper flexible circuit board with vertical and horizontal lines as claimed in claim 1, characterized in that: The glue filling is to lay a glue layer on the hole to be filled and perform rapid pressing, or to fill the hole to be filled with liquid glue and perform baking and curing.

7. The method for manufacturing a high current carrying thick copper flexible circuit board with vertical and horizontal lines as claimed in claim 1, characterized in that: After etching the remaining copper thickness, a micro-etching process is performed.

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