Multilayer ceramic LED packaging structure

Abstract

The invention relates to the technical field of LED packaging, in particular to a multilayer ceramic LED packaging structure which comprises a circuit board, a plurality of sets of ceramic substrates arranged on the lower layer of the circuit board and used for installing LED chips, a plurality of sets of heat conduction plates, a ceramic heat dissipation plate and a ceramic cover plate, the adjacent ceramic substrates, the adjacent heat conduction plates and the adjacent ceramic cover plates are formed through splicing, telescopic grooves are formed between the adjacent ceramic heat dissipation plates, and groove channels corresponding to the telescopic grooves are formed in the heat conduction plates and the ceramic cover plates. Through a heat dissipation system composed of a ceramic substrate, a circuit board, a heat conduction plate, a ceramic heat dissipation plate, a heat conduction channel, a capillary structure and a heat dissipation shell, efficient heat dissipation is achieved through vaporization and condensation circulation of liquid, heat generated by an LED chip can be taken away in time, it is ensured that the chip is in a proper working temperature range, the light emitting efficiency is maintained, and the service life is prolonged; and the stability of the LED packaging structure in long-time work is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of LED packaging, and in particular to a multi-layer ceramic LED packaging structure. Background Art

[0002] Currently, most large-scale multi-layer ceramic LED packaging structures on the market are constructed using a splicing molding method. Although this splicing molding process can meet the diverse requirements of product size and shape to a certain extent, it also brings a series of problems that cannot be ignored.

[0003] Since LEDs generate a lot of heat when working, if it cannot be dissipated promptly and effectively, the temperature of the LED chip will rise, which will in turn affect its luminous efficiency and service life. Although some improved LED packaging structures have emerged, most of them use complex electronic components to solve the problem, which has disadvantages such as high cost, complex structure, and difficult maintenance. Therefore, a multi-layer ceramic LED packaging structure is proposed, which can effectively ensure the stability of the LED during operation, maintain the luminous efficiency and improve the service life. Summary of the Invention

[0004] In response to the problems in the prior art, the present invention provides a multi-layer ceramic LED packaging structure, which can effectively ensure the stability of the LED during operation, maintain the luminous efficiency and increase the service life.

[0005] The technical solution adopted by the present invention to solve its technical problems is a multi-layer ceramic LED packaging structure, including a circuit board, and several groups of ceramic substrates arranged on the lower layer of the circuit board for mounting LED chips, and several groups of heat conducting plates, ceramic heat dissipation plates and ceramic cover plates arranged in sequence above the circuit board. Adjacent ceramic substrates, adjacent heat conducting plates and adjacent ceramic cover plates are formed by splicing, and expansion grooves are formed between adjacent ceramic heat dissipation plates. The heat conducting plates and ceramic cover plates are both provided with grooves corresponding to the expansion grooves. The expansion grooves and the grooves are spliced into a heat conducting groove. Capillary structures are provided in the heat conducting grooves, and heat dissipation shells are provided at both ends of the heat conducting grooves.

[0006] Specifically, the cross section of the heat conducting channel is circular or elliptical.

[0007] Specifically, a first arc-shaped heat dissipation groove is provided on the upper surface of the ceramic heat dissipation plate, and a second arc-shaped heat dissipation groove corresponding to the first arc-shaped heat dissipation groove is provided on the lower surface of the ceramic cover plate. Capillary structures are provided on the inner sides of the first arc-shaped heat dissipation groove and the second arc-shaped heat dissipation groove. The first arc-shaped heat dissipation groove and the second arc-shaped heat dissipation groove are spliced into a heat dissipation groove with a circular cross-section; slots are provided on both sides of the ceramic heat dissipation plate and the ceramic cover plate.

[0008] Specifically, a positioning groove is provided on the upper surface of the circuit board, and a positioning block corresponding to the positioning groove is provided on the lower surface of the heat conducting plate. The positioning block is located in the positioning groove, and the positioning block and the positioning groove are pressed into shape.

[0009] Specifically, a slot is provided on opposite sides of the two sets of heat dissipation shells, and the ceramic substrate, circuit board, heat conduction plate, ceramic heat dissipation plate and ceramic cover are located in the slot, and the heat dissipation shell is pressed and formed with the outer sides of the ceramic substrate and ceramic cover.

[0010] Specifically, a connecting joint corresponding to the heat conduction groove is provided on the inner side of the heat dissipation shell, a sealing rubber ring is provided on the connecting joint, a heat dissipation cavity connected to the connecting joint is provided on the inner side of the heat dissipation shell, and heat dissipation fins are provided on the outer side of the heat dissipation shell.

[0011] Specifically, a heat conducting block corresponding to the slot is provided on the inner side of the heat dissipation shell.

[0012] Specifically, an elastic buffer layer is provided on the inner surface of the slot of the heat dissipation shell.

[0013] Specifically, one end of the connecting joint close to the heat conducting groove and one side of the heat dissipation cavity close to the heat conducting groove are both arranged to be inclined downward.

[0014] Beneficial effects of the present invention:

[0015] (1) The multi-layer ceramic LED packaging structure described in the present invention has a heat dissipation system composed of a ceramic substrate, a circuit board, a heat conducting plate, a ceramic heat dissipation plate, a heat conducting groove, a capillary structure and a heat dissipation shell. It uses the vaporization and condensation cycle of the liquid to efficiently dissipate heat, can promptly remove the heat generated by the LED chip, ensure that the chip is in a suitable operating temperature range, maintain the luminous efficiency, extend the service life, and ensure the stability of the LED packaging structure during long-term operation.

[0016] (2) The multi-layer ceramic LED packaging structure described in the present invention has adjacent ceramic substrates, heat conducting plates and ceramic cover plates formed by splicing. It can be flexibly expanded according to the size requirements of large LED boards, making it convenient to construct LED boards of different sizes and meeting large-scale production requirements. At the same time, compared with the existing heat dissipation technology that uses a large number of electronic components and the method that relies only on simple heat sinks, this solution has lower costs. The efficient heat dissipation structure formed by the heat conducting grooves and capillary structures has a large heat dissipation area and high heat conduction efficiency, ensuring that the temperature of large LED boards is uniform and avoiding local overheating.

[0017] (3) In the multi-layer ceramic LED packaging structure described in the present invention, the first arc-shaped heat dissipation groove, the second arc-shaped heat dissipation groove and the heat conduction groove cooperate with each other in structure, thereby expanding the overall heat dissipation area. Expanding the heat dissipation area helps to distribute and dissipate heat more evenly, thereby avoiding local overheating of the LED chip. In a large spliced LED board, the heat generation of LED chips in different areas may be different. By expanding the heat dissipation area, the heat can be transferred and dissipated more evenly, making the temperature of the entire LED board more uniform, improving the consistency of LED light emission, and improving the display effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present invention will be further described below with reference to the accompanying drawings and examples.

[0019] Figure 1 is an axonometric drawing of the present invention;

[0020] Figure 2 for Figure 1 A magnified view of area A;

[0021] Figure 3 for Figure 1 A magnified view of area B;

[0022] Figure 4 for Figure 1 Magnified view of area C;

[0023] Figure 5 It is a side view schematic diagram of the present invention;

[0024] Figure 6 This is a schematic diagram of the ceramic cover structure of the present invention;

[0025] Figure 7 This is a schematic diagram of the structure of the heat dissipation shell, the ceramic substrate and the ceramic cover plate after being pressed together;

[0026] Figure 8 This is an axonometric view of the heat dissipation housing of the present invention;

[0027] Figure 9 This is a schematic cross-sectional view of the heat dissipation housing of the present invention;

[0028] In the figure: 1. Circuit board; 2. Ceramic substrate; 3. Heat conducting plate; 4. Ceramic heat sink; 5. Ceramic cover; 6. Expansion slot; 7. Channel; 8. Heat conducting channel; 9. Capillary structure; 10. First arc-shaped heat dissipation slot; 11. Second arc-shaped heat dissipation slot; 12. Slot; 13. Positioning slot; 14. Positioning block; 15. Heat dissipation shell; 16. Card slot; 17. Connecting joint; 18. Sealing rubber ring; 19. Heat dissipation cavity; 20. Heat dissipation fin; 21. Heat conducting block; 22. Elastic buffer layer. DETAILED DESCRIPTION

[0029] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific implementation methods.

[0030] In order to effectively ensure the stability of LED during operation, maintain the luminous efficiency and increase the service life, as an embodiment of the present invention, Figure 1 、 Figure 3 、 Figure 4 、 Figure 5As shown, a multi-layer ceramic LED packaging structure described in the present invention includes a circuit board 1, and several groups of ceramic substrates 2 for mounting LED chips arranged on the lower layer of the circuit board 1, and several groups of heat conducting plates 3, ceramic heat dissipation plates 4 and ceramic cover plates 5 arranged in sequence above the circuit board 1. Adjacent ceramic substrates 2, adjacent heat conducting plates 3 and adjacent ceramic cover plates 5 are formed by splicing, and expansion grooves 6 are formed between adjacent ceramic heat dissipation plates 4. Grooves 7 corresponding to the expansion grooves 6 are provided on the heat conducting plates 3 and the ceramic cover plates 5. The expansion grooves 6 and the grooves 7 are spliced into a heat conducting groove 8. Capillary structures 9 are provided in the heat conducting grooves 8, and heat dissipation shells 15 are provided at both ends of the heat conducting grooves 8.

[0031] During use, the adjacent ceramic substrates 2 are spliced together and installed on the lower layer of the circuit board 1. The LED chip is placed on the ceramic substrate 2 to complete the basic positioning and electrical connection preparation of the LED chip. The adjacent heat conducting plates 3 and adjacent ceramic cover plates 5 are respectively assembled on the top of the circuit board 1. When splicing, ensure that the grooves 7 on the heat conducting plates 3 and ceramic cover plates 5 corresponding to the expansion grooves 6 are accurately aligned so that the expansion grooves 6 and the grooves 7 can be smoothly assembled into the heat conducting grooves 8.

[0032] When the LED chip is working, heat is first transferred to the ceramic substrate 2 and then to the circuit board 1. Since the ceramic heat sink 4 is connected to the circuit board 1, the heat conducting plate 3, etc., the heat will be quickly transferred to the ceramic heat sink 4 and the heat conducting groove 8. The liquid in the capillary structure 9 is heated and vaporized. The vaporization process absorbs a large amount of heat, rapidly reducing the temperature of the surrounding area and rapidly transferring the heat in the form of steam. The steam diffuses in the heat conducting groove 8 and is conducted to the heat dissipation shells 15 at both ends. After the heat-carrying steam enters the heat dissipation shell 15, the heat dissipation shell 15 continuously dissipates heat to the outside, and the internal temperature drops. The steam quickly liquefies after being cooled. The liquefied liquid flows back to the capillary structure 9 in the heat conducting groove 8 under the action of gravity and the characteristics of the capillary structure 9 itself, preparing for the next vaporization and heat dissipation cycle, thereby realizing continuous circulation of the liquid, continuously removing the heat generated by the LED chip, ensuring that the LED chip is always in a suitable operating temperature range, extending the service life, and ensuring the stability of the LED packaging structure during long-term operation.

[0033] In this packaging structure, the adjacent ceramic substrate 2, heat conducting plate 3, and ceramic cover plate 5 are all formed by splicing. The modular design allows for flexible expansion according to the size requirements of large LED boards. By adding corresponding splicing units to meet large-scale requirements, LED boards of different sizes can be constructed quickly and conveniently, providing great convenience for the production of large-scale spliced LED boards.

[0034] The expansion slot 6 and the channel 7 are combined to form a heat-conducting channel 8, in which a capillary structure 9 is provided. Combined with the heat dissipation shells 15 at both ends, a set of efficient heat dissipation structure is formed, which effectively copes with the situation of large-sized LED boards, ensures heat dissipation efficiency, ensures uniform temperature of the entire large LED board, avoids local overheating, and ensures stable operation of the LED board;

[0035] It should be pointed out that after the expansion slot 6 and the channel 7 are assembled, liquid is injected into the heat-conducting channel 8 formed by the assembly to ensure that heat is subsequently dissipated by means of a vaporization and condensation cycle of the liquid.

[0036] In order to enhance the stability and reliability of the entire multilayer ceramic LED package structure, for example, Figure 1 、 Figure 2 、 Figure 3 、 Figure 5 As shown, the present invention also includes that the cross section of the heat conducting channel 8 is circular or elliptical.

[0037] When in use, the circular or elliptical heat-conducting channel 8 can provide a smoother channel for heat transfer. When the heat generated by the LED chip is transferred to the heat-conducting channel 8, the heat can be more evenly distributed and conducted in the channel 7, reducing heat accumulation points and ensuring that the heat can be quickly and efficiently transferred from the heat source to the heat dissipation housing 15.

[0038] A capillary structure 9 is provided in the heat-conducting channel 8. A circular or elliptical cross-section can better adapt to the operation of the capillary structure 9. Compared with other shapes, a circular or elliptical cross-section can make the liquid in the capillary structure 9 flow and distribute more stably in the channel 7, promote the vaporization and reflux circulation of the liquid, and thus more effectively remove heat.

[0039] At the same time, the circle and the ellipse are axially symmetrical figures, and their structural characteristics make the heat conduction groove 8 more evenly stressed when subjected to temperature changes and mechanical stress. Compared with the irregularly shaped groove 7, the circular or elliptical heat conduction groove 8 can better resist the influence of thermal expansion and contraction, reduce the risk of structural damage caused by stress concentration, and enhance the stability and reliability of the entire multi-layer ceramic LED packaging structure.

[0040] In order to expand the overall heat dissipation area, for example, Figure 1 、 Figure 3 、 Figure 4 、 Figure 6As shown, the present invention also includes a first arc-shaped heat dissipation groove 10 provided on the upper surface of the ceramic heat dissipation plate 4, a second arc-shaped heat dissipation groove 11 corresponding to the first arc-shaped heat dissipation groove 10 provided on the lower surface of the ceramic cover plate 5, a capillary structure 9 is provided on the inner side of the first arc-shaped heat dissipation groove 10 and the second arc-shaped heat dissipation groove 11, and the first arc-shaped heat dissipation groove 10 and the second arc-shaped heat dissipation groove 11 are spliced into a heat dissipation groove with a circular cross-section; grooves 12 are provided on both sides of the ceramic heat dissipation plate 4 and the ceramic cover plate 5.

[0041] When in use, when assembling the multi-layer ceramic LED packaging structure, the ceramic heat sink 4 and the ceramic cover plate 5 are spliced. When splicing, the first arc-shaped heat sink 10 and the second arc-shaped heat sink 11 are aligned to ensure that the two are spliced into a heat sink with a circular cross-section; when the LED chip generates heat during operation, the heat is transferred to the circuit board 1, the heat conducting plate 3 and then to the ceramic heat sink 4 through the ceramic substrate 2. The liquid in the capillary structure 9 in the first arc-shaped heat sink 10 and the second arc-shaped heat sink 11 is heated and vaporized, absorbing a large amount of heat and diffusing in the spliced circular heat sink in the form of steam. The steam diffuses to one side of the slot 12. Since one side of the slot 12 is connected to the heat dissipation shell 15, the heat carried by the steam is quickly dissipated to the surrounding environment by relying on the heat dissipation shell 15, so that the steam is cooled and liquefied. The liquefied liquid flows back to the first arc-shaped heat sink 10 and the second arc-shaped heat sink 11 to prepare for the next vaporization and heat dissipation cycle, thereby ensuring the heat dissipation effect;

[0042] The circular heat dissipation groove and the heat conduction groove 8 cooperate with each other in structure. The expansion of the overall heat dissipation area helps to distribute and dissipate heat more evenly, avoiding local overheating of the LED chip. In view of the problem that there may be differences in heat generation of LED chips in different areas of large spliced LED boards, by expanding the heat dissipation area, heat can be transferred and dissipated more evenly, making the temperature of the entire LED board more uniform, improving the consistency of LED light emission, and improving the display effect.

[0043] In order to enhance the bonding strength between the circuit board 1 and the heat conducting plate 3, for example, Figure 1 、 Figure 2 As shown, the present invention also includes a positioning groove 13 provided on the upper surface of the circuit board 1, and a positioning block 14 corresponding to the positioning groove 13 provided on the lower surface of the heat conducting plate 3. The positioning block 14 is located in the positioning groove 13, and the positioning block 14 and the positioning groove 13 are pressed into shape.

[0044] When in use, align the positioning block 14 with the positioning groove 13 to ensure that the positions of the positioning block 14 and the positioning groove 13 correspond accurately. Then, a certain pressure is applied to press the positioning block 14 and the positioning groove 13 into shape. After the positioning block 14 and the positioning groove 13 are pressed into shape, the bonding strength between the circuit board 1 and the heat conducting plate 3 is enhanced to avoid relative displacement, ensure that heat is smoothly transferred from the circuit board 1 to the heat conducting plate 3, and avoid increase in thermal resistance due to loose connection, which affects the heat dissipation effect.

[0045] In order to improve the heat dissipation efficiency and maintain the appropriate operating temperature of the LED chip, for example, Figure 7 、 Figure 8 、 Figure 9 As shown, the present invention also includes that a slot 16 is provided on the opposite side of the two sets of heat dissipation shells 15, and the ceramic substrate 2, circuit board 1, heat conducting plate 3, ceramic heat dissipation plate 4 and ceramic cover plate 5 are located in the slot 16, and the heat dissipation shell 15 is pressed and formed with the outer sides of the ceramic substrate 2 and ceramic cover plate 5.

[0046] When in use, the two sets of heat dissipation shells 15 are placed opposite each other so that the ceramic substrate 2, circuit board 1, heat conducting plate 3, ceramic heat dissipation plate 4 and ceramic cover plate 5 are located in the two sets of slots 16. Then, pressure is applied to the outer side of the heat dissipation shell 15 to combine the heat dissipation shell 15 with the ceramic substrate 2 and ceramic cover plate 5 to form a stable overall structure, thereby ensuring the stability of the internal structure and preventing the normal operation of the LED from being affected by loose components.

[0047] The heat dissipation shell 15 fits tightly with other components to improve the heat transfer efficiency. When the LED chip generates heat during operation, the heat is transferred in sequence through the ceramic substrate 2, the circuit board 1, the heat conducting plate 3, and the ceramic heat dissipation plate 4, and finally conducted to the heat dissipation shell 15. The heat dissipation shell 15 dissipates the heat to complete the heat dissipation process. The tight connection optimizes the heat dissipation path, reduces the thermal resistance during heat transfer, improves the heat dissipation efficiency, and helps maintain the appropriate operating temperature of the LED chip.

[0048] For example, Figure 7 、 Figure 8 、 Figure 9 As shown, the present invention also includes a connecting joint 17 corresponding to the heat conducting groove 8 provided on the inner side of the heat dissipation shell 15, a sealing rubber ring 18 is provided on the connecting joint 17, a heat dissipation cavity 19 connected to the connecting joint 17 is provided on the inner side of the heat dissipation shell 15, and a heat dissipation fin 20 is provided on the outer side of the heat dissipation shell 15.

[0049] When using, when installing the heat dissipation shell 15, first align the connecting joint 17 with the heat conduction channel 8 to ensure that the sealing rubber ring 18 can fit tightly at the connection between the connecting joint 17 and the heat conduction channel 8 to complete the connection between the connecting joint 17 and the heat conduction channel 8;

[0050] The heat generated by the LED chip during operation is transferred to the heat conducting channel 8 through the ceramic substrate 2, the circuit board 1, etc. In the heat conducting channel 8, the heat is absorbed by the liquid in the capillary structure 9, and the liquid vaporizes to form steam. The steam flows along the heat conducting channel 8 to the connecting joint 17, and enters the heat dissipation cavity 19 inside the heat dissipation shell 15 through the connecting joint 17. The heat dissipation cavity 19 disperses the heat carried by the steam. The heat is then transferred to the heat dissipation fins 20 outside the heat dissipation shell 15. The heat dissipation fins 20 are in full contact with the outside air and use the air flow to dissipate the heat to the surrounding environment. As the heat dissipation shell 15 continuously dissipates heat to the outside, the steam quickly liquefies when it is cooled. The liquefied liquid, under the action of gravity and the characteristics of the capillary structure 9 itself, flows back to the capillary structure 9 in the heat conducting channel 8, preparing for the next vaporization and heat dissipation cycle.

[0051] During the heat dissipation process, the sealing rubber ring 18 can prevent steam leakage and ensure that all steam enters the heat dissipation cavity 19 for heat dissipation.

[0052] In order to further improve the heat dissipation efficiency and ensure that the LED chip works at a suitable temperature, for example, Figure 1 、 Figure 4 、 Figure 5 、 Figure 7 、 Figure 8 As shown, the present invention further includes that a heat conducting block 21 corresponding to the slot 12 is provided on the inner side of the heat dissipation shell 15 .

[0053] During use, the heat generated by the ED chip is conducted to the ceramic heat sink 4 through the ceramic substrate 2, the circuit board 1 and the heat conducting plate 3. The liquid in the capillary structure 9 in the circular heat dissipation groove is vaporized by the heat, and the vapor diffuses to the groove 12. The heat conducting block 21 directly contacts the groove 12 and quickly conducts the heat carried by the vapor to the heat dissipation shell 15. The heat conducting block 21 serves as a heat conducting bridge connecting the circular heat dissipation groove and the heat dissipation shell 15, allowing heat to be quickly conducted from the circular heat dissipation groove to the heat dissipation shell 15, accelerating the speed of vapor cooling and liquefaction. The liquefied liquid flows back to the capillary structure 9 in the circular heat dissipation groove under the action of gravity and the capillary structure 9, completing the heat dissipation cycle, ensuring that heat is continuously and stably brought out, reducing obstacles in the heat transfer process, effectively improving the heat dissipation efficiency, ensuring that the LED chip operates at an appropriate temperature, maintaining its luminous efficiency, and extending its service life.

[0054] For example, Figure 8 As shown, the present invention further includes that an elastic buffer layer 22 is provided on the inner surface of the slot 16 of the heat dissipation shell 15 .

[0055] During use, the elastic buffer layer 22 can effectively absorb and disperse the vibration or external force impact on the LED packaging structure, thereby preventing the components from being displaced or collided due to the vibration or external force.

[0056] In order to ensure the continuity of the heat dissipation cycle, illustratively, the present invention further includes that one end of the connecting joint 17 close to the heat conduction groove 8 and one side of the heat dissipation cavity 19 close to the heat conduction groove 8 are both arranged to be inclined downward.

[0057] During use, when the heat generated by the operation of the LED chip causes the liquid in the capillary structure 9 in the heat-conducting groove 8 to vaporize and form steam, the steam will follow the heat-conducting groove 8 and the connecting joint 17 into the heat dissipation cavity 19 on the inner side of the heat dissipation shell 15. After entering the heat dissipation cavity 19, the steam is in full contact with the wall of the heat dissipation cavity 19, and then liquefied by being cooled. Under the action of gravity, the liquid flows back to the capillary structure 9 in the heat-conducting groove 8 along the inclined heat dissipation cavity 19 and the connecting joint 17, completing the heat dissipation cycle; in the liquid reflux stage, the inclined design enables the liquefied liquid to flow back smoothly, ensuring the continuity of the heat dissipation cycle and avoiding local accumulation of liquid that affects the heat dissipation efficiency.

[0058] When the present invention is used, adjacent ceramic substrates 2 are spliced together and installed on the lower layer of the circuit board 1 to build a supporting platform for the LED chip. The LED chip is placed on the ceramic substrate 2, and the chip positioning and preliminary electrical connection are completed to realize the LED lighting function.

[0059] After installing the LED chip, assemble the adjacent heat conducting plate 3, ceramic heat sink 4, and ceramic cover plate 5 above the circuit board 1. During the splicing process, the expansion slot 6 and the groove 7 are combined to form the heat conducting groove 8. Align the positioning block 14 with the positioning groove 13 and make it correspond accurately. Then, apply a certain amount of pressure to press the positioning block 14 and the positioning groove 13 into shape, thereby enhancing the bonding strength between the circuit board 1 and the heat conducting plate 3, ensuring that heat can be smoothly transferred from the circuit board 1 to the heat conducting plate 3, and avoiding the increase of thermal resistance due to loose connection, which affects the heat dissipation effect.

[0060] The two sets of heat dissipation shells 15 are placed relative to each other, so that the ceramic substrate 2, circuit board 1, heat conducting plate 3, ceramic heat dissipation plate 4 and ceramic cover plate 5 are located in the two sets of slots 16. When installing the heat dissipation shell 15, first align the sealing rubber ring 18 on the connecting joint 17 with the heat conducting groove 8 to ensure that the sealing rubber ring 18 is tightly fitted at the connection between the connecting joint 17 and the heat conducting groove 8, completing the connection between the connecting joint 17 and the heat conducting groove 8. The sealing rubber ring 18 can prevent steam leakage and ensure that all steam enters the heat dissipation cavity 19 for heat dissipation; then, pressure is applied to the outside of the heat dissipation shell 15 to combine the heat dissipation shell 15 with the ceramic substrate 2 and the ceramic cover plate 5, ensuring the stability of the overall structure, preventing loose components from affecting the normal operation of the LED, and optimizing the heat dissipation path and improving the heat transfer efficiency;

[0061] When the LED chip starts working, the heat generated will be transferred to the ceramic substrate 2 and the circuit board 1 in sequence. Since the ceramic heat sink 4 is connected to the circuit board 1 and the heat conducting plate 3, the heat will be quickly transferred to the ceramic heat sink 4 and the heat conducting channel 8. At this time, the liquid in the capillary structure 9 in the heat conducting channel 8 is heated and vaporized. This process will absorb a large amount of heat, quickly reduce the temperature of the surrounding area, and quickly transfer the heat in the form of steam.

[0062] The vaporized steam diffuses in the heat-conducting channel 8 and is conducted to the heat dissipation shells 15 at both ends. In the heat dissipation shells 15, the steam enters the heat dissipation cavity 19, which disperses the heat carried by the steam. The heat is then transferred to the heat dissipation fins 20 on the outside through the heat dissipation shell 15. The heat dissipation fins 20 are in full contact with the outside air and use air flow to dissipate the heat to the surrounding environment. In this process, the steam is quickly liquefied when it encounters cooling.

[0063] The liquefied liquid flows back to the capillary structure 9 in the heat conduction channel 8 under the action of gravity and the characteristics of the capillary structure 9 itself, preparing for the next vaporization and heat dissipation cycle. This cycle is repeated, continuously removing the heat generated by the LED chip, ensuring that the LED chip is always in the appropriate operating temperature range, extending its service life, and ensuring the stability of the LED package structure during long-term operation.

[0064] The liquid in the capillary structure 9 in the first arc-shaped heat dissipation groove 10 on the ceramic heat dissipation plate 4 and the second arc-shaped heat dissipation groove 11 on the ceramic cover plate 5 will also be heated and vaporized. The steam diffuses in the circular heat dissipation groove formed by the splicing, and is transferred to the heat dissipation shell 15 through the slot 12. The heat conduction is accelerated by the heat conductive block 21 on the heat dissipation shell 15, thereby accelerating the cooling and liquefaction of the steam. The liquefied liquid flows back to the capillary structure 9 in the circular heat dissipation groove, further improving the heat dissipation efficiency. At the same time, expanding the overall heat dissipation area helps to distribute and dissipate heat more evenly, avoiding local overheating of the LED chip. In view of the problem that the heat generation of LED chips in different areas of a large spliced LED board may be different, by expanding the heat dissipation area, the heat can be transferred and dissipated more evenly, making the temperature of the entire LED board more uniform, improving the consistency of LED light emission, and improving the display effect.

[0065] The end of the connecting joint 17 close to the heat-conducting groove 8 and the side of the heat-dissipating cavity 19 close to the heat-conducting groove 8 are both tilted downward, so that the liquefied liquid can smoothly flow back to the capillary structure 9 in the heat-conducting groove 8 under the action of gravity, ensuring the continuity of the heat dissipation cycle and avoiding local accumulation of liquid to affect the heat dissipation efficiency.

[0066] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the above-described embodiments. The above-described embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A multilayer ceramic LED package structure, characterized in that: The invention comprises a circuit board (1), a plurality of ceramic substrates (2) arranged on the lower layer of the circuit board (1) for mounting LED chips, and a plurality of heat conducting plates (3), ceramic heat dissipation plates (4) and ceramic cover plates (5) arranged in sequence above the circuit board (1), wherein adjacent ceramic substrates (2), adjacent heat conducting plates (3) and adjacent ceramic cover plates (5) are formed by splicing, and expansion grooves (6) are formed between adjacent ceramic heat dissipation plates (4), and grooves (7) corresponding to the expansion grooves (6) are provided on the heat conducting plates (3) and the ceramic cover plates (5), and the expansion grooves (6) and the grooves (7) are spliced together to form a heat conducting groove (8), a capillary structure (9) is provided in the heat conducting groove (8), and heat dissipation shells (15) are provided at both ends of the heat conducting groove (8).

2. The multilayer ceramic LED package structure according to claim 1, characterized in that: The cross section of the heat conduction channel (8) is circular or elliptical.

3. The multilayer ceramic LED package structure according to claim 2, characterized in that: A first arc-shaped heat dissipation groove (10) is provided on the upper surface of the ceramic heat dissipation plate (4), and a second arc-shaped heat dissipation groove (11) corresponding to the first arc-shaped heat dissipation groove (10) is provided on the lower surface of the ceramic cover plate (5). Capillary structures (9) are provided on the inner sides of the first arc-shaped heat dissipation groove (10) and the second arc-shaped heat dissipation groove (11). The first arc-shaped heat dissipation groove (10) and the second arc-shaped heat dissipation groove (11) are spliced together to form a heat dissipation groove with a circular cross-section. Slots (12) are provided on both sides of the ceramic heat dissipation plate (4) and the ceramic cover plate (5).

4. The multilayer ceramic LED package structure according to claim 3, characterized in that: A positioning groove (13) is provided on the upper surface of the circuit board (1), and a positioning block (14) corresponding to the positioning groove (13) is provided on the lower surface of the heat conducting plate (3). The positioning block (14) is located in the positioning groove (13), and the positioning block (14) and the positioning groove (13) are pressed together.

5. The multi-layer ceramic LED package structure according to claim 4, characterized in that: A slot (16) is provided on opposite sides of the two groups of heat dissipation shells (15); the ceramic substrate (2), the circuit board (1), the heat conducting plate (3), the ceramic heat dissipation plate (4) and the ceramic cover plate (5) are located in the slot (16); and the heat dissipation shell (15) is pressed together with the outer sides of the ceramic substrate (2) and the ceramic cover plate (5).

6. The multilayer ceramic LED package structure according to claim 5, characterized in that: A connecting joint (17) corresponding to the heat-conducting groove (8) is provided on the inner side of the heat dissipation shell (15), a sealing rubber ring (18) is provided on the connecting joint (17), a heat dissipation cavity (19) communicating with the connecting joint (17) is provided on the inner side of the heat dissipation shell (15), and heat dissipation fins (20) are provided on the outer side of the heat dissipation shell (15).

7. The multilayer ceramic LED package structure according to claim 6, characterized in that: A heat conducting block (21) corresponding to the slot (12) is provided on the inner side of the heat dissipation shell (15).

8. The multi-layer ceramic LED package structure according to claim 7, characterized in that: An elastic buffer layer (22) is provided on the inner surface of the clamping groove (16) of the heat dissipation shell (15).

9. The multi-layer ceramic LED package structure according to claim 8, characterized in that: One end of the connecting joint (17) close to the heat-conducting groove (8) and one side of the heat-dissipating cavity (19) close to the heat-conducting groove (8) are both arranged to be tilted downward.

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