Heat dissipation module and electronic equipment

Abstract

The invention provides a heat dissipation module and electronic equipment. The heat dissipation module is applied to the electronic equipment and comprises a liquid cooling plate, a heat dissipation plate and a heat pipe. The heat pipe comprises an evaporation section and a condensation section. The evaporation section is connected with the condensation section in the extending direction of the heat pipe. The evaporation section and the liquid cooling plate are arranged in a stacked mode and connected. The heat dissipation plate comprises a heat dissipation part and a heat transfer part, and the heat dissipation part is connected with the heat transfer part. The heat dissipation part is stacked with the evaporation section and connected with the evaporation section, and the heat transfer part is located on the side away from the heat pipe. The liquid cooling plate is used for being connected with a first heating element of the electronic equipment, and heat of the first heating element can be transmitted to the liquid cooling plate. The heat transfer part is used for being connected with a second heating element of the electronic equipment, and heat of the second heating element can be transmitted to the heat transfer part. The heat dissipation module provided by the invention can solve the technical problem of low heat dissipation efficiency of the existing electronic equipment.

Description

Technical Field

[0001] The present application relates to the technical field of electronic products, and in particular to a heat dissipation module and an electronic device. Background Art

[0002] Electronic devices such as laptops and tablets are gaining popularity due to their portability. Existing electronic devices often use copper plates for heat dissipation. However, copper plates have low heat dissipation efficiency and are unable to effectively dissipate heat from the heating elements within the electronic devices. This can cause the electronic devices to overheat, impacting the user experience. Summary of the Invention

[0003] The present application provides a heat dissipation module and an electronic device to solve the technical problem of low heat dissipation efficiency of existing electronic devices.

[0004] To address the above issues, the present application provides a heat dissipation module. The heat dissipation module includes a liquid cooling plate, a heat sink, and a heat pipe. The heat pipe includes an evaporation section and a condensation section, and the evaporation section is connected to the condensation section along the extension direction of the heat pipe. The evaporation section is stacked with the liquid cooling plate and connected to the liquid cooling plate. The heat sink includes a heat dissipation portion and a heat transfer portion, and the heat dissipation portion is connected to the heat transfer portion. The heat dissipation portion is stacked with the evaporation section and connected to the evaporation section, and the heat transfer portion is located on the side away from the heat pipe.

[0005] The liquid cooling plate is used to connect to a first heating element of the electronic device, and the heat of the first heating element can be transferred to the liquid cooling plate. The heat transfer portion is used to connect to a second heating element of the electronic device, and the heat of the second heating element can be transferred to the heat transfer portion.

[0006] The heat dissipation module is applied to an electronic device. The electronic device includes a motherboard, a first heating element, a second heating element, and a heat dissipation module. The heat dissipation module, the first heating element, and the second heating element are arranged on the same side of the motherboard, and the first heating element and the second heating element are fixed to the surface of the motherboard and spaced apart from each other.

[0007] Along the thickness direction of the electronic device, the liquid cooling plate and the first heating element are stacked and connected to each other, the heat transfer portion and the second heating element are stacked and connected to each other, and the evaporation section and the heat dissipation portion are located on the side of the liquid cooling plate facing away from the first heating element.

[0008] Part of the heat generated by the first heating element is transferred to the liquid cooling plate and discharged to the outside through the circulation of the coolant within the liquid cooling plate. Part of the heat is transferred to the evaporation section of the heat pipe, from which it is transferred to the condensation section and discharged to the outside, thus dissipating heat for the first heating element. The heat generated by the second heating element is transferred to the heat dissipation section through the heat transfer section of the heat sink, then to the evaporation section of the heat pipe, from which it is transferred to the condensation section and discharged to the outside, thus dissipating heat for the second heating element.

[0009] In this embodiment, the provision of a liquid cooling plate enables heat dissipation of the first heating element, while the provision of a heat sink enables heat dissipation of the second heating element, thereby improving the heat dissipation efficiency of the electronic device. In this embodiment, by stacking the heat dissipation portion of the heat sink with the heat pipe and the liquid cooling plate, the electronic device can not only dissipate heat through the heat distribution and heat transfer of the heat sink, but also free up space for the liquid cooling plate, allowing the electronic device to dissipate heat through the liquid cooling plate's efficient heat exchange, resulting in higher heat dissipation efficiency, effectively reducing the temperature of the electronic device, improving the user experience, and also saving space.

[0010] In a possible implementation manner, the liquid cooling plate and the heat dissipation portion are respectively stacked on opposite sides of the evaporation section in a thickness direction, and are both connected to the evaporation section.

[0011] In this embodiment, by stacking the liquid cooling plate and the heat dissipation part on opposite sides of the thickness direction of the evaporation section, the distance between the liquid cooling plate and the heat pipe, as well as the distance between the heat dissipation plate and the heat pipe can be reduced, thereby improving the heat transfer efficiency between the liquid cooling plate and the heat pipe, as well as the heat transfer efficiency between the heat dissipation plate and the heat pipe, thereby improving the heat dissipation efficiency of the heat dissipation module.

[0012] In one possible embodiment, the heat sink is a metal plate such as a copper plate, an aluminum plate, a copper alloy plate, an aluminum alloy plate, or a stainless steel plate. Metal plates have high thermal conductivity and good heat transfer, which helps improve the heat dissipation efficiency of the heat dissipation module. Furthermore, metal plates can be easily processed into different shapes to accommodate second heating elements of different shapes, thereby increasing the contact area between the heat sink and the second heating element, improving the heat dissipation effect on the second heating element, and improving the heat dissipation efficiency of the heat dissipation module.

[0013] In one possible embodiment, the liquid cooling plate is provided with a flow channel, the flow channel including a liquid inlet and a liquid outlet, the liquid inlet and the liquid outlet are respectively provided at opposite ends of the liquid cooling plate, the liquid inlet is used to input the cooling liquid into the flow channel, and the liquid outlet is used to discharge the cooling liquid out of the flow channel.

[0014] The electronic device also includes a circulating cooling system, the water outlet of which is connected to the liquid inlet of the liquid cooling plate. When the circulating cooling system is in operation, coolant flows out through the water outlet and enters the flow channel of the liquid cooling plate through the liquid inlet, exchanging heat with the liquid cooling plate and absorbing heat from the liquid cooling plate. The coolant then flows out of the liquid cooling plate through the outlet and back into the circulating cooling system through the water inlet.

[0015] In this embodiment, by providing a flow channel on the liquid cooling plate, the heat transferred from the first heating element to the liquid cooling plate can be transferred to the outside through the liquid circulation between the liquid cooling plate and the circulating heat dissipation system, thereby further achieving heat dissipation of the first heating element and improving the heat dissipation efficiency of the electronic equipment.

[0016] In one possible embodiment, the liquid inlet and the liquid outlet are staggered to increase the distance between the liquid inlet and the liquid outlet, thereby increasing the flow time of the coolant in the flow channel, that is, increasing the contact time between the coolant and the liquid cooling plate, thereby improving the heat dissipation effect of the liquid cooling plate.

[0017] In a possible embodiment, the heat pipe is provided with a heat dissipation channel, the heat dissipation channel connects the evaporation section and the condensation section, and an extension direction of the heat dissipation channel provided in the evaporation section intersects with an extension direction of the flow channel.

[0018] In this embodiment, by setting the extension direction of the heat dissipation channel of the evaporation section to intersect with the extension direction of the flow channel, the heat dissipation direction of the liquid cooling plate is different from the heat dissipation direction of the heat pipe, so that the heating elements in the electronic device can be cooled in different directions, making the heat dissipation of the heating elements more uniform, and forming air convection, which can further improve the heat dissipation efficiency of the electronic device.

[0019] In one possible embodiment, the heat dissipation module includes a fan, with an air outlet facing the condensing section. When the fan is operating, it blows low-temperature gas toward the condensing section, rapidly lowering the temperature there. This accelerates heat transfer from the heat pipe to the outside world, further improving the heat dissipation efficiency of the heat dissipation module.

[0020] In one possible embodiment, the heat dissipation module further includes heat dissipation fins, which are positioned opposite the air outlet of the fan and connected to the condensing section. Heat transferred from the evaporation section to the condensing section is then transferred to the heat dissipation fins via the condensing section. When the fan is operating, it draws low-temperature air from the outside into the fan and blows it toward the heat dissipation fins, thereby dissipating heat from the heat dissipation fins to the outside world. In this embodiment, the provision of heat dissipation fins increases the heat dissipation area, thereby further improving the heat dissipation efficiency of the heat dissipation module.

[0021] In one possible embodiment, the heat sink fins include first and second heat sink fins. The condensing section includes a first and second condensing section. Along the extension direction of the heat pipe, the first and second condensing sections are respectively connected to opposite ends of the evaporating section. The first condensing section is connected to the first heat sink fins, and the second condensing section is connected to the second heat sink fins. The fan includes a first fan and a second fan. The air outlet of the first fan is directed toward the first heat sink fins, and the air outlet of the second fan is directed toward the second heat sink fins.

[0022] In this embodiment, by providing a first condensing section and a second condensing section on the heat pipe, and connecting the first condensing section and the second condensing section to the first heat sink fin and the second heat sink fin, respectively, the heat in the evaporation section can be transferred to the outside world through the first condensing section and the second condensing section located at opposite ends, thereby accelerating the heat dissipation speed of the evaporation section and further improving the heat dissipation efficiency of the heat dissipation module. In addition, by arranging the air outlet end of the first fan toward the first heat sink fin, the heat dissipation speed of the first heat sink fin can be accelerated, and by arranging the air outlet end of the second fan toward the second heat sink fin, the heat dissipation speed of the second heat sink fin can be accelerated, thereby further improving the heat dissipation efficiency of the heat dissipation module.

[0023] In one possible embodiment, the heat dissipation module further includes an auxiliary heat dissipation plate, which is stacked and connected to the heat pipe. The auxiliary heat dissipation plate is configured to connect to a third heating element of the electronic device, and heat from the third heating element can be transferred to the auxiliary heat dissipation plate.

[0024] In this embodiment, by providing an auxiliary heat sink, the heat generated by the third heating element can be transferred to the heat pipe through the auxiliary heat sink, and then transferred to the outside by the heat pipe, thereby further improving the heat dissipation performance of the heat dissipation module.

[0025] The present application also provides an electronic device, comprising a mainboard, a first heating element, a second heating element and the above-mentioned heat dissipation module. The heat dissipation module, the first heating element and the second heating element are arranged on the same side of the mainboard, and the first heating element and the second heating element are both fixed to the surface of the mainboard and spaced apart from each other. Along the thickness direction of the electronic device, the liquid cooling plate and the first heating element are stacked and connected to each other. The heat transfer part and the second heating element are stacked and connected to each other. The evaporation section and the heat dissipation part are located on the side of the liquid cooling plate facing away from the first heating element.

[0026] In this embodiment, the heat generated by the first heating element can be discharged through the liquid cooling plate and the heat pipe, and the heat generated by the second heating element can be discharged through the heat dissipation plate and the heat pipe. On the one hand, the heat dissipation and heat transfer functions of the heat dissipation plate can be fully utilized to achieve heat dissipation. On the other hand, heat dissipation can also be achieved through the efficient heat exchange of the liquid cooling plate, thereby improving the heat dissipation efficiency, effectively reducing the temperature of the electronic equipment, and improving the user experience.

[0027] In one possible embodiment, the second heating element includes a first heat source and a second heat source, with the top surface of the first heat source located on the side of the top surface of the second heat source facing away from the mainboard. The heat transfer portion includes a first step and a second step, with the first step located on the side of the second step facing away from the mainboard. Along the thickness direction of the electronic device, the first step is stacked with the first heat source and connected to the top surface of the first heat source, and the second step is stacked with the second heat source and connected to the top surface of the second heat source.

[0028] It should be noted that due to processing technology limitations, the liquid cooling plate cannot be set with a step difference. Since the heights of the first heat source and the second heat source in the second heating element are inconsistent, if the second heating element is cooled through the liquid cooling plate, the liquid cooling plate and the second heating element cannot be fully in contact, and the heat dissipation efficiency is poor.

[0029] In this embodiment, by providing a first step and a second step with a step difference on the heat sink to accommodate the first heat source and the second heat source with inconsistent heights in the second heating element, the contact area between the heat sink and the second heating element can be increased, thereby improving the heat dissipation effect on the second heating element and improving the heat dissipation efficiency of the electronic device.

[0030] In a possible implementation, the electronic device includes a fastener, which is provided on a surface of the heat sink facing away from the mainboard and is fixedly connected to the heat sink and the mainboard.

[0031] In this embodiment, fasteners are provided to compress and secure the heat sink toward the mainboard, and to compress the heat pipe and liquid cooling plate toward the mainboard. This, on the one hand, improves the stability of the connections between the heat sink, heat pipe, liquid cooling plate, and mainboard, thereby enhancing the structural stability of the electronic device. On the other hand, this improves the contact stability between the heat sink and heat pipe, as well as the contact stability between the heat pipe and the liquid cooling plate, thereby improving the heat transfer efficiency between the heat sink and heat pipe, as well as between the heat pipe and the liquid cooling plate, thereby improving the heat dissipation efficiency of the electronic device. Furthermore, in this embodiment, the fasteners compress and secure the heat sink from one side, concentrating most of the fastener pressure on the heat sink, thereby reducing the pressure on the liquid cooling plate and preventing damage to the structure of the liquid cooling plate.

[0032] Moreover, in this embodiment, the heat sink and the liquid cooling plate are fixed by additionally providing fasteners, and there is no need to provide locking ears or spring clips on the liquid cooling plate or the heat sink, which can save space for the heat sink and the liquid cooling plate, that is, there is no need to occupy the effective heat dissipation area of the heat sink and the liquid cooling plate, thereby enabling the heat sink and the liquid cooling plate to have a better heat dissipation effect within a limited space.

[0033] In one possible embodiment, the electronic device further includes a thermally conductive layer disposed between the first heating element and the liquid cooling plate and in contact with the first heating element and the liquid cooling plate. The thermally conductive layer is made of a thermally conductive interface material. In this embodiment, the provision of the thermally conductive layer can reduce interfacial thermal resistance, thereby improving heat transfer efficiency and, consequently, the heat dissipation efficiency of the electronic device.

[0034] In one possible embodiment, the electronic device includes a third heating element, which is spaced apart from the first and second heating elements. Along the thickness direction of the electronic device, the auxiliary heat sink of the heat dissipation module is stacked with the third heating element and connected to the third heating element.

[0035] In this embodiment, by providing an auxiliary heat sink, the heat generated by the third heating element can be transferred to the heat pipe through the auxiliary heat sink, and then transferred to the outside by the heat pipe, thereby further improving the heat dissipation performance of the heat dissipation module.

[0036] In summary, the heat dissipation module provided by the present application can dissipate heat from the first heating element by providing a liquid cooling plate, and dissipate heat from the second heating element by providing a heat sink, thereby improving the heat dissipation efficiency of the electronic device. In this embodiment, by stacking the heat dissipation portion of the heat sink with the heat pipe and the liquid cooling plate, the electronic device can not only dissipate heat through the heat distribution and heat transfer of the heat sink, but also make room for the liquid cooling plate, allowing the electronic device to dissipate heat through the efficient heat exchange of the liquid cooling plate, resulting in higher heat dissipation efficiency, thereby effectively reducing the temperature of the electronic device, improving the user experience, and also saving space. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background technology, the drawings required for use in the embodiments of the present application or the background technology will be described below.

[0038] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0039] Figure 2 yes Figure 1 A schematic diagram of the structure of a host in the electronic device shown;

[0040] Figure 3 yes Figure 2 The schematic diagram of the structure of the host shown in another angle;

[0041] Figure 4 yes Figure 2 A schematic diagram of a portion of the structure of the host shown;

[0042] Figure 5 yes Figure 4 A schematic diagram of a portion of the structure of the host shown;

[0043] Figure 6 yes Figure 4 A schematic diagram of the structure of the heat dissipation module in the host shown;

[0044] Figure 7 yes Figure 6 The schematic diagram of the exploded structure of the heat dissipation module shown;

[0045] Figure 8 yes Figure 4 A schematic diagram of a portion of the structure of the host shown;

[0046] Figure 9 yes Figure 4 A schematic diagram of a portion of the structure of the host shown;

[0047] Figure 10 yes Figure 6 An enlarged structural diagram of the liquid cooling plate in the heat dissipation module;

[0048] Figure 11 yes Figure 4 A schematic diagram of a portion of the structure of the host shown;

[0049] Figure 12 yes Figure 7 An enlarged structural diagram of the heat dissipation plate in the heat dissipation module shown;

[0050] Figure 13 yes Figure 4 A schematic diagram of a portion of the structure of the host shown;

[0051] Figure 14 yes Figure 6 A schematic diagram of a portion of the structure of the heat dissipation module shown;

[0052] Figure 15 yes Figure 13 Schematic diagram of the partial exploded structure of the host shown. DETAILED DESCRIPTION

[0053] The embodiments of the present application are described below in conjunction with the drawings in the embodiments of the present application.

[0054] See also Figure 1 , Figure 11 is a schematic structural diagram of an electronic device 100 provided in an embodiment of the present application.

[0055] An embodiment of the present application provides an electronic device 100. The electronic device 100 includes, but is not limited to, electronic products such as a notebook computer, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), or a wearable device. The following description assumes that the electronic device 100 is a notebook computer.

[0056] For ease of description, in this application, the length direction of the electronic device 100 is defined as the X direction, the width direction of the electronic device 100 is defined as the Y direction, and the thickness direction of the electronic device 100 is defined as the Z direction. The X direction, the Y direction, and the Z direction are perpendicular to each other.

[0057] Electronic device 100 includes a host 2, a display 3, and a hinge 4. Host 2 is used to process information, and display 3 is used to display the results of information processing performed by host 2. Hinge 4 connects host 2 and display 3, allowing display 3 to flip relative to host 2, allowing display 3 to open or close relative to host 2, thereby achieving the opening or closing of electronic device 100. Exemplarily, the edge of display 3 is connected to hinge 4, and the edge of host 2 is provided with a rotation groove that cooperates with hinge 4. Hinge 4 is mounted in the rotation groove and can rotate within the rotation groove to open or close the display 3 relative to host 2.

[0058] See also Figure 2 and Figure 3 , Figure 2 yes Figure 1 The schematic diagram of the structure of the host 2 in the electronic device 100 is shown. Figure 3 yes Figure 2 The schematic diagram of the structure of the host 2 is shown at another angle.

[0059] The host 2 includes a housing 201, a touch panel 202, and a keyboard 203. The touch panel 202 and the keyboard 203 are both mounted on the housing 201. The housing 201 includes an upper cover 209 and a bottom cover 204. The bottom cover 204 and the upper cover 209 are fixedly connected to each other and enclose a receiving space 205 (such as Figure 4 Specifically, the upper cover 209 includes a top plate 206 and an extension plate 207. The extension plate 207 is connected to the periphery of the top plate 206 and is arranged around the top plate 206. Exemplarily, the angle between the extension plate 207 and the top plate 206 is 90 degrees (slight deviation is allowed). The touchpad 202 and keyboard 203 are both mounted on the top plate 206 and arranged side by side along the Y direction.

[0060] The housing 201 is provided with an air inlet 2011 and an air outlet 2012. The air inlet 2011 includes a plurality of through holes. In this embodiment, the through holes are strip-shaped holes. In other embodiments, the through holes may be circular holes, rectangular holes, or other special-shaped holes. The plurality of through holes are provided on the bottom cover 204 and are spaced apart in sequence along the length direction (X direction) of the housing 201. Each through hole penetrates the bottom cover 204 along the thickness direction of the bottom cover 204 and connects the interior of the housing 201 with the exterior of the housing 201, that is, connects the receiving space 205 with the outside world.

[0061] The air outlet 2012 includes a first air outlet 2013 and a second air outlet 2014. Both the first air outlet 2013 and the second air outlet 2014 are located on the extension plate 207 and spaced apart along the X-direction. Along the thickness of the extension plate 207, the first air outlet 2013 and the second air outlet 2014 penetrate the extension plate 207 and connect the interior of the housing 201 with the outside world. Low-temperature air from the outside can enter the containment space 205 through the air inlet 2011, exchange heat with the heat generating element within the containment space 205, and then be discharged to the outside world through the first air outlet 2013 and the second air outlet 2014.

[0062] See also Figure 4 , Figure 4 yes Figure 2 A partial structural diagram of the host 2 is shown.

[0063] The host 2 also includes a battery 208, a mainboard 10, a heating element 20 (such as Figure 5 ) and heat dissipation module 1. Battery 208 is generally rectangular. Battery 208 is located within housing space 205 and is fixedly connected to housing 201. Battery 208 is used to provide power to electronic device 100. Motherboard 10, heating element 20, and heat dissipation module 1 are all installed within housing space 205.

[0064] See also Figure 5 , Figure 5 yes Figure 4 A partial structural diagram of the host 2 is shown.

[0065] The motherboard 10 is a printed circuit board (PCB). The motherboard 10 includes a first surface 101, a second surface 102, a first side surface 103, a second side surface 104, a third side surface 105, and a fourth side surface 106. The first surface 101 and the second surface 102 are disposed opposite each other along the thickness direction (Z direction) of the motherboard 10. The first side surface 103, the third side surface 105, the second side surface 104, and the fourth side surface 106 are connected end to end and are all connected between the first surface 101 and the second surface 102. The first side surface 103 and the second side surface 104 are disposed opposite each other along the Y direction, and the third side surface 105 and the fourth side surface 106 are disposed opposite each other along the X direction.

[0066] The motherboard 10 includes a main body 11, a first portion 12, and a second portion 13. The first portion 12 and the second portion 13 are respectively connected to opposite sides of the main body 11 in the X-direction. That is, the first portion 12, the main body 11, and the second portion 13 are sequentially connected along the X-direction. The mainboard 10 is provided with a mounting slot 14. In this embodiment, the mounting slot 14 includes a first mounting slot 141 and a second mounting slot 142. The first mounting slot 141 is provided in the first portion 12 and extends through the first surface 101, the second surface 102, and the first side surface 103. The second mounting slot 142 is provided in the second portion 13 and extends through the first surface 101, the second surface 102, and the first side surface 103. It will be understood that the first mounting slot 141 and the second mounting slot 142 are arranged side by side and spaced apart in the X-direction, and are respectively located on opposite sides of the main body 11 in the X-direction. The first mounting slot 141 and the second mounting slot 142 are both used to mount the fan 30 in the heat dissipation module 1.

[0067] Combine Figure 4 The motherboard 10 is located in the receiving space 205 and is fixedly connected to the housing 201. The second surface 102 faces the top plate 206, that is, toward the positive direction of the Z axis. In this embodiment, the motherboard 10 and the battery 208 are arranged side by side along the Y direction.

[0068] Please continue reading Figure 5, the heating element 20 includes a first heating element 21 and a second heating element 22. In the present embodiment, the first heating element 21 is a central processing unit (CPU). In other embodiments, the first heating element 21 may also be a graphics processing unit (GPU) or other heating device. In the present embodiment, there is one first heating element 21. The first heating element 21 is fixed to the first surface 101 of the main board 10 and is located in the middle area of the main body 11. The top surface of the first heating element 21 (the surface facing away from the main board 10) is roughly flat. In other embodiments, there may also be multiple first heating elements 21. Multiple first heating elements 21 include a CPU, a GPU and heat sources near them. When there are multiple first heating elements 21, the distance from the top surface of each first heating element 21 to the first surface 101 is roughly equal. In other words, the height of each first heating element 21 is roughly the same.

[0069] The second heating element 22 includes a first heat source 221, a second heat source 222, and a third heat source 223. The first heat source 221, the second heat source 222, and the third heat source 223 are all fixed to the first surface 101 of the main board 10 and are located on the main body 11. The first heat source 221 and the second heat source 222 are spaced apart along the Y direction, and the second heat source 222 is located on the side of the first heat source 221 close to the second side 104. That is, the second heat source 222 is located between the first heat source 221 and the second side 104. The third heat source 223 is located in the negative direction of the X-axis of the first heat source 221 and the second heat source 222, that is, between the second heat source 222 and the second portion 13 of the main board 10. The second heating element 22 is spaced apart from the first heating element 21 along the Y direction, and the second heating element 22 is located between the first heating element 21 and the second side 104.

[0070] There is a height difference between the top surfaces of at least two of the first heat source 221, the second heat source 222, and the third heat source 223. That is, the distances from the top surfaces of at least two of the first heat source 221, the second heat source 222, and the third heat source 223 to the first surface 101 are different, that is, the heights of at least two of the first heat source 221, the second heat source 222, and the third heat source 223 are inconsistent. The "height" here refers to the dimension along the Z direction.

[0071] In this embodiment, the first heat source 221 and the second heat source 222 are both CPU modules. The CPU module includes a plurality of CPUs arranged in sequence along the X direction. Among them, the top surface of the second heat source 222 is located on the positive direction side of the Z axis of the top surface of the first heat source 221. That is, the distance from the top surface of the second heat source 222 to the first surface 101 of the mainboard 10 is smaller than the distance from the top surface of the first heat source 221 to the first surface 101 of the mainboard 10. In other words, the height of the second heat source 222 is smaller than the height of the first heat source 221. The "top surface" mentioned here refers to the surface away from the mainboard 10.

[0072] The third heat source 223 is a charging module. The charging module includes a charging base and a charging metal-oxide-semiconductor field-effect transistor (MOSFET). The charging module is located on the negative X-axis side of the first and second heat sources 221 and 222. The charging base and the charging MOSFET are arranged along the Y-axis, and their heights are not the same.

[0073] The heating element 20 also includes a third heating element 23. The third heating element 23 includes a fourth heat source 231, a fifth heat source 232, a sixth heat source 233, and a seventh heat source 234. The fourth heat source 231, the fifth heat source 232, the sixth heat source 233, and the seventh heat source 234 are all fixed to the first surface 101 of the mainboard 10, and are located on the main body 11, and are spaced apart in sequence along the Y direction. The third heating element 23 is spaced apart from the first heating element 21 and the second heating element 22 along the X direction, and the third heating element 23 is located on the positive side of the X-axis of the first heating element 21 and the second heating element 22. That is, the third heating element 23 is located between the first heating element 21 and the first mounting groove 141.

[0074] Among them, there is a height difference between the top surfaces of at least two heat sources among the fourth heat source 231, the fifth heat source 232, the sixth heat source 233 and the seventh heat source 234. That is, the distances from the top surfaces of at least two heat sources among the fourth heat source 231, the fifth heat source 232, the sixth heat source 233 and the seventh heat source 234 to the first surface 101 are different, that is, the heights of at least two heat sources among the fourth heat source 231, the fifth heat source 232, the sixth heat source 233 and the seventh heat source 234 are inconsistent. In this embodiment, the height of the fifth heat source 232 is greater than the height of the fourth heat source 231, the height of the sixth heat source 233 is greater than the height of the fifth heat source 232, and the height of the seventh heat source 234 is less than the height of the sixth heat source 233.

[0075] The fourth heat source 231, the fifth heat source 232, the sixth heat source 233, and the seventh heat source 234 can each be one or more. In this embodiment, there are two fourth heat sources 231. Both fourth heat sources 231 are graphics cards. The two fourth heat sources 231 are arranged side by side and spaced apart along the X-direction and are located on the side close to the first side 103. There is one fifth heat source 232. The fifth heat source 232 is a GPU. The fifth heat source 232 is located on the side of the fourth heat source 231 close to the second side 104 and is spaced apart from the fourth heat source 231. The sixth heat source 233 and the seventh heat source 234 are both GPU modules. The GPU module includes multiple GPUs arranged in sequence along the X-direction. The sixth heat source 233 is located on the side of the fifth heat source 232 close to the second side 104 and is spaced apart from the fifth heat source 232. The seventh heat source 234 is located on the side of the sixth heat source 233 close to the second side 104 and is spaced apart from the sixth heat source 233. The top surface of the sixth heat source 233 is located on the negative Z-axis side of the top surface of the seventh heat source 234. That is, the height of the sixth heat source 233 is greater than the height of the seventh heat source 234.

[0076] It should be noted that the first heating element 21 is a primary heat source, that is, the primary heating element 20 , and the second heating element 22 and the third heating element 23 are secondary heat sources.

[0077] See also Figure 6 and Figure 7 , Figure 6 yes Figure 4 The schematic diagram of the structure of the heat dissipation module 1 in the host 2 is shown. Figure 7 yes Figure 6 The schematic diagram of the exploded structure of the heat dissipation module 1 is shown.

[0078] The heat dissipation module 1 includes a fan 30, heat dissipation fins 40, a heat pipe 50, a heat sink 70 and a liquid cooling plate 60. The heat dissipation module 1 is installed inside the housing 201 and is used to dissipate heat for the heating element 20 on the mainboard 10. The heat sink 70 and the liquid cooling plate 60 are both arranged opposite to and in contact with the heating element 20, and the heat pipe 50 is connected between the heat sink 70 and the heat dissipation fins 40, and between the liquid cooling plate 60 and the heat dissipation fins 40. The heat dissipation fins 40 are arranged adjacent to the fan 30 and are located on the air outlet side of the fan 30. The heat generated by the heating element 20 is transferred to the heat pipe 50 through the liquid cooling plate 60 and the heat sink 70, and then transferred to the heat dissipation fins 40 by the heat pipe 50, so that the temperature around the heat dissipation fins 40 increases. At the same time, the fan 30 works to blow the low-temperature gas from the outside to the heat dissipation fins 40, and discharge the heat of the heat dissipation fins 40 to the outside through the air outlet 2012.

[0079] Combine Figure 8 , Figure 8 yes Figure 4 A partial structural diagram of the host 2 is shown.

[0080] The fan 30 includes a first fan 31 and a second fan 32. The first fan 31 includes a first air inlet end 311 and a first air outlet end 312. The first air inlet end 311 is located in the Z direction of the first fan 31. That is, the first fan 31 takes in air from the Z direction. The first air outlet end 312 is located on one side of the first fan 31 in the Y direction. That is, the first fan 31 discharges air from the Y direction. The first fan 31 is installed in the first mounting slot 141 and is fixedly connected to the mainboard 10. The first air inlet end 311 faces the bottom cover 204 and is arranged opposite to the air inlet 2011. The first air outlet end 312 faces the extension plate 207 and is arranged opposite to the first air outlet 2013.

[0081] The second fan 32 and the first fan 31 may have the same structure or a similar structure. In this embodiment, the second fan 32 and the first fan 31 are mirror-symmetrical structures. The second fan 32 includes a second air inlet end 321 and a second air outlet end 322. The second air inlet end 321 is located in the Z direction of the second fan 32, and the second air outlet end 322 is located on one side of the second fan 32 in the Y direction. The second fan 32 is installed in the second mounting slot 142 and is fixedly connected to the mainboard 10. The second air inlet end 321 faces the bottom cover 204 and is arranged opposite to the second air inlet 2011. The second air outlet end 322 faces the extension plate 207 and is arranged opposite to the second air outlet 2014.

[0082] The heat dissipation fins 40 include a first heat dissipation fin 41 and a second heat dissipation fin 42. The first heat dissipation fin 41 includes a plurality of heat dissipation teeth 411. The plurality of heat dissipation teeth 411 are arranged in sequence along the length direction (X direction) of the heat dissipation fin 40, and a heat dissipation gap 412 is provided between each two adjacent heat dissipation teeth 411. The heat dissipation gap 412 passes through the first heat dissipation fin 41 in the Y direction. The first heat dissipation fin 41 is arranged in the first mounting groove 141 and is arranged side by side with the first fan 31 along the Y direction. The first heat dissipation fin 41 is fixedly connected to the housing 201. In addition, one end of the heat dissipation gap 412 is arranged opposite to the first air outlet end 312 of the first fan 31, and the other end is arranged opposite to the first air outlet 2013.

[0083] The structure of the second heat sink fins 42 is identical or similar to that of the first heat sink fins 41. The second heat sink fins 42 are disposed within the second mounting slots 142 and are arranged side by side with the second fan 32 along the Y direction. The second heat sink fins 42 are fixedly connected to the housing 201. Furthermore, one end of the heat sink 412 of the second heat sink fins 42 is disposed opposite the second air outlet end 322 of the second fan 32, and the other end is disposed opposite the second air outlet 2014.

[0084] Combine Figure 7 and Figure 9 , Figure 9 yes Figure 4A partial structural diagram of the host 2 is shown.

[0085] The heat pipe 50 is a hollow, flat tubular structure with a curved outer contour. It is roughly shaped like a Chinese character "J." The heat pipe 50 includes an evaporation section 51, a first connecting section 52, a second connecting section 53, a first condensation section 54, and a second condensation section 55. The evaporation section 51 is roughly linear and extends in the X direction. The first connecting section 52 and the second connecting section 53 are both curved. The first connecting section 52 and the second connecting section 53 are respectively connected to opposite ends of the evaporation section 51 in the longitudinal direction. The first condensation section 54 and the second condensation section 55 are roughly linear and extend in the X direction. The first condensation section 54 is connected to the end of the first connecting section 52 away from the evaporation section 51, and the second condensation section 55 is connected to the end of the second connecting section 53 away from the evaporation section 51. It is understood that the first condensation section 54, the first connecting section 52, the evaporation section 51, the second connecting section 53, and the second condensation section 55 are connected in sequence.

[0086] The heat pipe 50 is provided with a heat dissipation channel (not shown). The heat dissipation channel is arranged along the extension direction of the heat pipe 50 and is closed at both ends. In other words, the end of the first condensation section 54 away from the first connecting section 52 is closed, and the end of the second condensation section 55 away from the second connecting section 53 is closed. The inner wall of the heat pipe 50 is provided with a capillary structure (not shown). The capillary structure can be formed by sintering a powder, or it can be fibrous, mesh-like, or groove-like.

[0087] The heat pipe 50 is installed in the housing 201. The evaporation section 51 is arranged opposite to the main body 11 of the mainboard 10, the first condensation section 54 is connected to the first heat sink fin 41, and the second condensation section 55 is connected to the second heat sink fin 42. In this embodiment, the first condensation section 54 and the first heat sink fin 41 are stacked in the Z direction, and the first condensation section 54 is welded to the surface of the first heat sink fin 41. The second condensation section 55 and the second heat sink fin 42 are stacked in the Z direction, and the second condensation section 55 is welded to the surface of the second heat sink fin 42. In other embodiments, a heat conductive layer is provided between the first condensation section 54 and the first heat sink fin 41, and a heat conductive layer is provided between the second condensation section 55 and the second heat sink fin 42.

[0088] In this embodiment, the thermally conductive layer is a thermal interface material (TIM). TIM has low thermal resistance and can reduce interface thermal resistance, thereby improving heat transfer between the first condensing section 54 and the first heat sink fins 41, and between the second condensing section 55 and the second heat sink fins 42.

[0089] The heat dissipation module 1 also includes a coolant (not shown). The coolant is filled in the heat pipe 50. The heat generated by the heating element 20 provided in the main body 11 can be transferred to the evaporation section 51, so that the temperature of the evaporation section 51 increases, and the liquid coolant located in the evaporation section 51 is heated and vaporized to be converted into a gas-phase coolant. The gas-phase coolant is transmitted in the heat dissipation channel, passes through the first connecting section 52 and the second connecting section 53, and is respectively transmitted to the first condensation section 54 and the second condensation section 55, and liquefies and is converted into a liquid-phase coolant, while releasing heat, so that the temperature of the first condensation section 54 and the second condensation section 55 increases. After the heat is transmitted to the first condensation section 54 and the second condensation section 55, it is transmitted to the heat dissipation fins 40 and transmitted to the outside world through the heat dissipation fins 40, thereby realizing the heat dissipation of the heating element 20.

[0090] Furthermore, the liquefied coolant in the first condensation section 54 and the second condensation section 55 flows along the capillary structure toward the evaporation section 51 under the action of capillary force, where it reabsorbs heat and vaporizes. During this vaporization-liquefaction cycle of the coolant, heat from the evaporation section 51 is continuously transferred to the first condensation section 54 and the second condensation section 55, thereby continuously dissipating heat from the heating element 20 to the outside world.

[0091] In this embodiment, there are two heat pipes 50. The two heat pipes 50 are arranged side by side along the Y direction. The heat generated by the heating element 20 can be discharged through the two heat pipes 50 at the same time, thereby improving the heat dissipation efficiency. In other embodiments, there can also be one, three, or more than four heat pipes 50.

[0092] See also Figure 10 and Figure 11 , Figure 10 yes Figure 6 An enlarged structural diagram of the liquid cooling plate 60 in the heat dissipation module 1, Figure 11 yes Figure 4 A partial structural diagram of the host 2 is shown.

[0093] In this embodiment, the liquid cooling plate 60 is a roughly rectangular planar plate-like structure. In other embodiments, the liquid cooling plate may also be circular, elliptical, or other shapes. The liquid cooling plate 60 includes a first side 61, a second side 62, a third side 63, and a fourth side 64. The first side 61 and the second side 62 are arranged opposite to each other along the width direction (Y direction) of the liquid cooling plate 60, and the third side 63 and the fourth side 64 are arranged opposite to each other along the length direction (X direction) of the liquid cooling plate 60. A flow channel is provided in the liquid cooling plate 60. The flow channel can be serpentine, "circular" shaped, or leaf vein-shaped. The flow channel includes a liquid inlet 65 and a liquid outlet 66. In this embodiment, the liquid inlet 65 and the liquid outlet 66 are arranged on opposite sides of the liquid cooling plate 60. Exemplarily, the liquid inlet 65 is arranged on the first side 61, the liquid outlet 66 is arranged on the second side 62, and the liquid inlet 65 and the liquid outlet 66 are staggered along the Y direction. In other embodiments, the liquid inlet 65 may be located on the third side 63, and the liquid outlet 66 may be located on the fourth side 64. Alternatively, the liquid inlet 65 and the liquid outlet 66 may be located on the same side of the liquid cooling plate 60, that is, the liquid inlet 65 and the liquid outlet 66 may both be located on the first side 61, or both on the second side 62, or both on the third side 63, or both on the fourth side 64.

[0094] Exemplarily, the liquid cooling plate 60 includes a first plate and a second plate (not shown). The flow channel is provided on the first plate. Specifically, the flow channel can be formed by stamping or etching. The second plate is stacked on the surface of the first plate having the flow channel and is fixedly connected to the first plate by welding or other means.

[0095] The liquid cooling plate 60 is located within the receiving space 205 and is disposed on a side of the motherboard 10 near the first surface 101. The liquid cooling plate 60 is connected to the first heating element 21 and the heat pipe 50. In this embodiment, the first heating element 21, the liquid cooling plate 60, and the heat pipe 50 are stacked along the Z direction, with the liquid cooling plate 60 located between the first heating element 21 and the heat pipe 50.

[0096] In this embodiment, the liquid cooling plate 60 completely covers the first heating element 21. That is, the orthographic projection of the liquid cooling plate 60 along the Z direction completely covers the first heating element 21. This can increase the heat transfer area between the liquid cooling plate 60 and the first heating element 21, thereby improving the heat dissipation efficiency. In this embodiment, a heat-conducting layer is provided between the liquid cooling plate 60 and the first heating element 21. One side of the heat-conducting layer is in contact with the first heating element 21, and the other side is in contact with the liquid cooling plate 60. The heat generated by the first heating element 21 is transferred to the liquid cooling plate 60 through the heat-conducting layer. The heat-conducting layer can reduce the interfacial thermal resistance, thereby improving the efficiency of heat transfer, and further improving the heat dissipation efficiency of the heat dissipation module 1. In other embodiments, the liquid cooling plate 60 may also be in direct contact with the first heating element 21.

[0097] In this embodiment, the surface of the liquid cooling plate 60 facing away from the first heating element 21 is welded between the evaporation sections 51 of the heat pipe 50. In other embodiments, a heat conductive layer may be provided between the surface of the liquid cooling plate 60 facing away from the first heating element 21 and the evaporation sections 51 of the heat pipe 50 to improve the heat transfer efficiency between the liquid cooling plate 60 and the heat pipe 50.

[0098] The electronic device 100 also includes a circulating heat dissipation system (not shown). The water outlet of the circulating heat dissipation system is connected to the liquid inlet 65 of the liquid cooling plate 60, and the water inlet of the circulating heat dissipation system is connected to the liquid outlet 66 of the liquid cooling plate 60. The circulating heat dissipation system can be arranged in the housing 201, that is, in the receiving space 205, or it can be arranged outside the housing 201. When the circulating heat dissipation system is working, the coolant flows out through the water outlet and enters the flow channel of the liquid cooling plate 60 through the liquid inlet 65, exchanges heat with the liquid cooling plate 60, and absorbs the heat of the liquid cooling plate 60, then flows out of the liquid cooling plate 60 from the liquid outlet 66 and flows back to the circulating heat dissipation system through the water inlet. Among them, the temperature of the coolant at the liquid outlet 66 is higher than that of the coolant at the liquid inlet 65. After the coolant enters the liquid cooling plate 60 from the liquid inlet 65, it can absorb the heat of the liquid cooling plate 60 and discharge the heat through the liquid outlet 66.

[0099] In this embodiment, a liquid cooling plate 60 is provided and connected to the first heating element 21 and the heat pipe 50, so that the heat generated by the first heating element 21 can be transferred to the liquid cooling plate 60, then transferred to the heat pipe 50 through the liquid cooling plate 60, and then transferred to the heat sink 40 through the heat pipe 50, and then transferred to the outside world, thereby achieving heat dissipation of the first heating element 21. In addition, the heat transferred from the first heating element 21 to the liquid cooling plate 60 can also be transferred to the outside world through the liquid circulation between the liquid cooling plate 60 and the circulating heat dissipation system, thereby further achieving heat dissipation of the first heating element 21 and improving the heat dissipation efficiency of the electronic device 100.

[0100] Moreover, in this embodiment, the liquid inlet 65 and the liquid outlet 66 of the liquid cooling plate 60 are respectively arranged on opposite sides of the Y direction, and the flow channel in the liquid cooling plate 60 extends at least partially along the Y direction, that is, the coolant in the liquid cooling plate 60 flows at least partially along the Y direction on its flow path. The coolant in the evaporation section 51 of the heat pipe 50 flows along the X direction. In other words, the flow direction of the coolant in the liquid cooling plate 60 is at least partially perpendicular to the flow direction of the coolant in the evaporation section 51 of the heat pipe 50. The liquid cooling plate 60 and the heat pipe 50 can dissipate heat to the heating element 20 in different directions, so that the heat dissipation of the heating element 20 is more uniform, and air convection can be formed, thereby improving the heat dissipation efficiency of the electronic device 100.

[0101] At the same time, in this embodiment, by staggering the liquid inlet 65 and the liquid outlet 66 of the liquid cooling plate 60 along the Y direction, the distance between the liquid inlet 65 and the liquid outlet 66 can be increased, thereby increasing the flow time of the coolant in the flow channel, that is, the contact time between the coolant and the liquid cooling plate 60 can be increased, thereby improving the heat dissipation effect of the liquid cooling plate 60.

[0102] See also Figure 12 , Figure 12 yes Figure 7 An enlarged structural diagram of the heat dissipation plate 70 in the heat dissipation module 1 is shown.

[0103] The heat sink 70 is a stepped plate structure. In this embodiment, the heat sink 70 is a copper plate. In other embodiments, the heat sink 70 can also be an aluminum plate, a copper alloy plate, an aluminum alloy plate, a stainless steel plate, or other metal plates.

[0104] The heat sink 70 includes a heat dissipation portion 71 and a heat transfer portion 72. The heat transfer portion 72 includes a first step 721, a second step 722, and a third step 723. The heat dissipation portion 71, the first step 721, and the second step 722 are connected in sequence along the Y direction. The first step 721 and the heat dissipation portion 71 are approximately coplanar, i.e., have approximately the same height. The second step 722 is located on the positive Z-axis side of the first step 721, with a height difference therebetween. The height difference between the second step 722 and the first step 721 is approximately the same as the height difference between the first heat source 221 and the second heat source 222. The third step 723 is connected to the negative X-axis side of the first step 721 and the second step 722. The third step 723 is located on the negative X-axis side of the first step 721 and the second step 722. The third step 723 has a height difference from both the first step 721 and the second step 722. The third step 723 has multiple sub-steps, which are connected in sequence along the Y direction and have different heights. The shape of the third step 723 matches the shape of the third heat source 223. "Matched" here means that the height difference between the multiple sub-steps in the third step 723 is consistent with the height difference between the multiple sub-heat sources in the third heat source 223, and when the third step 723 is provided on the surface of the third heat source 223, the multiple sub-steps are provided in a one-to-one correspondence with the multiple sub-heat sources.

[0105] The heat sink 70 is further provided with bolt holes, in which bolts are arranged to securely connect the heat sink 70 to the mainboard 10 .

[0106] Combine Figure 6 and Figure 13 , Figure 13 yes Figure 4 A partial structural diagram of the host 2 is shown.

[0107] The heat sink 70 is located within the receiving space 205 and is disposed on a side of the mainboard 10 near the first surface 101. The heat dissipation portion 71 of the heat sink 70 is stacked with the liquid cooling plate 60 and the heat pipe 50 along the Z direction, and the heat dissipation portion 71 is connected to the heat pipe 50. In this embodiment, the heat dissipation portion 71 is located on the side of the heat pipe 50 facing away from the liquid cooling plate 60, that is, the heat pipe 50 is located between the liquid cooling plate 60 and the heat dissipation portion 71. The heat dissipation portion 71 contacts the surface of the heat pipe 50. Exemplarily, the heat dissipation portion 71 is welded to the surface of the heat pipe 50. The heat from the heat dissipation portion 71 can be directly transferred to the heat pipe 50, and then transferred to the outside by the heat pipe 50. Alternatively, a heat conductive layer can be provided between the heat dissipation portion 71 and the heat pipe 50, and the heat from the heat dissipation portion 71 can be transferred to the heat pipe 50 through the heat conductive layer, and then transferred to the outside by the heat pipe 50, thereby improving the heat conduction efficiency between the heat sink 70 and the heat pipe 50.

[0108] The first step 721 is connected to the first heat source 221 of the second heating element 22. In this embodiment, a heat conducting layer is provided between the first step 721 and the first heat source 221 to improve the heat transfer efficiency between the first heat source 221 and the first step 721. In other embodiments, the surface of the first step 721 may be in direct contact with the surface of the first heat source 221.

[0109] The second step 722 is connected to the second heat source 222. In this embodiment, a heat conductive layer is provided between the second step 722 and the second heat source 222 to improve the heat transfer efficiency between the second heat source 222 and the second step 722. In other embodiments, the surface of the second step 722 may be in direct contact with the surface of the second heat source 222.

[0110] The third step 723 is connected to the third heat source 223. In this embodiment, a heat conductive layer is provided between the third step 723 and the third heat source 223 to improve the heat transfer efficiency between the third heat source 223 and the third step 723. In other embodiments, the surface of the third step 723 may be in direct contact with the surface of the third heat source 223.

[0111] The heat generated by the first heat source 221 is transferred to the heat dissipation part 71 through the first step 721; the heat generated by the second heat source 222 is transferred to the first step 721 through the second step 722, and then transferred to the heat dissipation part 71; the heat generated by the third heat source 223 is transferred to the first step 721 and the second step 722 through the third step 723, and then transferred to the heat dissipation part 71; the heat located in the heat dissipation part 71 is then transferred to the heat pipe 50, and is transferred to the heat dissipation fins 40 through the coolant in the heat pipe 50, and then transferred to the outside world, so that the heat dissipation of the heat sink 70 can be achieved, that is, the heat dissipation of the second heating element 22 can be achieved, and the heat dissipation performance of the electronic device 100 can be further improved.

[0112] Please also refer to Figure 6 and Figure 13 When the electronic device 100 is operating, both the first heating element 21 and the second heating element 22 generate heat. Part of the heat generated by the first heating element 21 is transferred to the liquid cooling plate 60 and then to the coolant within the liquid cooling plate 60. The coolant circulates within the liquid cooling plate 60 and is then discharged to the outside world. Part of the heat generated by the first heating element 21 is transferred to the liquid cooling plate 60 and then to the evaporation section 51 of the heat pipe 50. The heat is then transferred to the outside world through the heat pipe 50.

[0113] The heat transferred from the liquid cooling plate 60 to the heat pipe 50, as well as the heat transferred from the heat sink 70 to the heat pipe 50, causes the coolant in the evaporation section 51 of the heat pipe 50 to absorb the heat and vaporize. The heat is then transferred from the first connecting section 52 to the first condensation section 54 and from the second connecting section 53 to the second condensation section 55. The vaporized coolant liquefies and releases heat in the first condensation section 54, thereby transferring the heat to the first condensation section 54 and then from the first condensation section 54 to the first heat sink fins 41. Simultaneously, the first fan 31 operates, drawing low-temperature air from the outside into the first fan 31 and blowing it toward the first heat sink fins 41, thereby discharging the heat from the first heat sink fins 41 out of the electronic device 100 through the air outlet 2012.

[0114] The vaporized coolant liquefies in the second condensing section 55 and releases heat, thereby transferring the heat to the second condensing section 55 and then from the second condensing section 55 to the second heat sink fins 42. Simultaneously, the second fan 32 operates, drawing low-temperature air from the outside into the second fan 32 and blowing it toward the second heat sink fins 42. The heat from the second heat sink fins 42 is discharged to the outside of the electronic device 100 through the air outlet 2012, thereby dissipating heat from the first heating element 21 and the second heating element 22.

[0115] In this embodiment, by providing a liquid cooling plate 60, heat can be dissipated from the main heat source, that is, the first heating element 21, and by providing a heat dissipation plate 70, heat can be dissipated from the secondary heat source, that is, the second heating element 22, thereby improving the heat dissipation efficiency of the electronic device 100.

[0116] It should be noted that due to processing technology limitations, the liquid cooling plate 60 cannot be set with a step difference. Since the heights of the multiple heat sources in the second heating element 22 are inconsistent, if the second heating element 22 is cooled by the liquid cooling plate 60, the liquid cooling plate 60 and the second heating element 22 cannot be fully in contact, and the heat dissipation efficiency is poor.

[0117] In this embodiment, heat is dissipated from the second heating element 22 by the heat dissipation plate 70, and steps are provided on the heat dissipation plate 70 to accommodate multiple heat sources of inconsistent heights in the second heating element 22. This can increase the contact area between the heat dissipation plate 70 and the second heating element 22, thereby improving the heat dissipation effect on the second heating element 22 and improving the heat dissipation efficiency of the electronic device 100. In addition, in this embodiment, a metal plate is used as the heat dissipation plate 70, which makes it easy to form steps on the heat dissipation plate 70, thereby simplifying the processing and reducing production costs.

[0118] Moreover, in this embodiment, by connecting the heat dissipation portion 71 of the heat dissipation plate 70 to the heat pipe 50 and connecting the heat transfer portion 72 to the second heating element 22, the heat generated by the second heating element 22 can be transferred to the heat dissipation portion 71 through the heat transfer portion 72, and then transferred to the heat pipe 50, thereby achieving heat dissipation.

[0119] In this embodiment, by stacking the heat dissipation portion 71 of the heat dissipation plate 70 with the heat pipe 50 and the liquid cooling plate 60, the electronic device 100 can not only dissipate heat through the heat distribution and heat transfer effects of the heat dissipation plate 70, but also make room for the liquid cooling plate 60, so that the electronic device 100 can dissipate heat through the efficient heat exchange of the liquid cooling plate 60, with higher heat dissipation efficiency, thereby effectively reducing the temperature of the electronic device 100, improving the user experience, and also saving space.

[0120] In this embodiment, by providing the heat dissipation fins 40 , the heat of the heat pipe 50 is transferred to the heat dissipation fins 40 and then to the outside, which can increase the heat dissipation area and further improve the heat dissipation efficiency of the heat dissipation module 1 .

[0121] Furthermore, in this embodiment, by providing a first condensing section 54 and a second condensing section 55 on the heat pipe 50, and connecting the first condensing section 54 and the second condensing section 55 to the first heat sink 41 and the second heat sink 42, respectively, the heat in the evaporation section 51 can be transferred to the outside through the first condensing section 54 and the second condensing section 55 located at opposite ends, respectively, thereby accelerating the heat dissipation speed of the evaporation section 51, and further improving the heat dissipation efficiency of the electronic device 100. Furthermore, by arranging the air outlet end of the first fan 31 toward the first heat sink 41, the heat dissipation speed of the first heat sink 41 can be accelerated, and by arranging the air outlet end of the second fan 32 toward the second heat sink 42, the heat dissipation speed of the second heat sink 42 can be accelerated, thereby further improving the heat dissipation efficiency of the electronic device 100.

[0122] Please also refer to Figure 13 and Figure 14 , Figure 14 yes Figure 6 A partial structural diagram of the heat dissipation module 1 is shown.

[0123] The electronic device 100 further includes a fastener 80. The fastener 80 is fixedly connected to the heat sink 70 and the mainboard 10, thereby fixing the heat sink 70. In this embodiment, the fastener 80 includes a first fastener 81 and a second fastener 82.

[0124] The first fastener 81 is a T-shaped sheet structure. The first fastener 81 includes a first fixing portion 811 and a second fixing portion 812. The first fixing portion 811 and the second fixing portion 812 are vertically connected. The first fixing portion 811 is provided with a first bolt hole 813. The first bolt hole 813 passes through the first fixing portion 811 along the thickness direction of the first fastener 81. The second fixing portion 812 is provided with a second bolt hole 814. The second bolt hole 814 can be one or more. In this embodiment, there are three second bolt holes 814. The three second bolt holes 814 are arranged in sequence along the length direction of the second fixing portion 812.

[0125] The first fastener 81 is provided on the heat dissipation portion 71 of the heat sink 70 and is located in an edge area away from the first step 721. The second fixing portion 812 is provided on the surface of the heat sink 70 facing away from the mainboard 10, and the first fixing portion 811 is provided on the second surface 102 of the mainboard 10. Bolts are provided in both the first bolt hole 813 and the second bolt hole 814. The bolts in the first bolt hole 813 are fixedly connected to the first fixing portion 811 and the mainboard 10, thereby achieving a fixed connection between the first fastener 81 and the mainboard 10. The bolts in the second bolt hole 814 are fixedly connected to the second fixing portion 812 and the heat sink 70, thereby achieving a fixed connection between the first fastener 81 and the heat sink 70, thereby achieving fixation of the heat sink 70 and pressing the heat sink 70 toward the mainboard 10.

[0126] The second fastener 82 is a long, sheet-like structure. The second fastener 82 is provided with a third bolt hole 821 and a fourth bolt hole 822. The third bolt hole 821 is provided in the middle portion of the second fastener 82 and penetrates the second fastener 82 in the thickness direction of the second fastener 82. There can be one or more third bolt holes 821. In this embodiment, there are three third bolt holes 821. The three third bolt holes 821 are arranged in sequence and spaced apart along the length direction of the second fastener 82. The fourth bolt hole 822 is provided at the end of the second fastener 82 and penetrates the second fastener 82 in the thickness direction of the second fastener 82. In this embodiment, there are two fourth bolt holes 822. The two fourth bolt holes 822 are located at opposite ends of the second fastener 82 in the length direction.

[0127] The second fastener 82 is provided on the surface facing away from the heat sink 70 and is spaced apart from the first fastener 81 along the Y direction. In this embodiment, the second fastener 82 is provided between the heat dissipation portion 71 of the heat sink 70 and the first step 721, and the length direction of the second fastener 82 is consistent with the X direction. The opposite ends of the second fastener 82 are exposed from the main board 10. That is, the opposite ends of the second fastener 82 protrude from the edge of the heat sink 70. In addition, the projection of the third bolt hole 821 is located inside the heat sink 70, and the projection of the fourth bolt hole 822 is located inside the main board 10. The "projection" mentioned here refers to the orthographic projection along the Z direction.

[0128] Bolts are installed in both the third bolt hole 821 and the fourth bolt hole 822. The bolt in the third bolt hole 821 securely connects the second fastener 82 to the heat sink 70, thereby securing the second fastener 82 to the heat sink 70. The bolt in the fourth bolt hole 822 securely connects the second fastener 82 to the mainboard 10, thereby securing the second fastener 82 to the mainboard 10, further securing the heat sink 70 and pressing the heat sink 70 further toward the mainboard 10.

[0129] In this embodiment, by providing fasteners 80, the heat sink 70 can be pressed and fixed toward the mainboard 10, and the heat pipe 50 and the liquid cooling plate 60 can be pressed toward the mainboard 10. This can, on the one hand, improve the stability of the connection between the heat sink 70, the heat pipe 50, the liquid cooling plate 60, and the mainboard 10, thereby improving the structural stability of the electronic device 100. On the other hand, it can improve the contact stability between the heat sink 70 and the heat pipe 50, as well as the contact stability between the heat pipe 50 and the liquid cooling plate 60, thereby improving the heat transfer efficiency between the heat sink 70 and the heat pipe 50, as well as the heat transfer efficiency between the heat sink 70 and the heat pipe 50 and the liquid cooling plate 60, thereby improving the heat dissipation efficiency of the electronic device 100. At the same time, in this embodiment, the fasteners 80 are pressed and fixed from one side of the heat sink 70, and most of the pressure of the fasteners 80 is concentrated on the heat sink 70, thereby reducing the pressure on the liquid cooling plate 60 and avoiding damage to the structure of the liquid cooling plate 60.

[0130] Moreover, in the present embodiment, the heat sink 70 and the liquid cooling plate 60 are fixed by additionally providing fasteners 80, and there is no need to provide locking ears or spring clips on the liquid cooling plate 60 or the heat sink 70, which can save space between the heat sink 70 and the liquid cooling plate 60, that is, there is no need to occupy the effective heat dissipation area of the heat sink 70 and the liquid cooling plate 60, thereby enabling the heat sink 70 and the liquid cooling plate 60 to have a better heat dissipation effect within a limited space.

[0131] See also Figure 13 and Figure 15 , Figure 15 yes Figure 13 The diagram shows a partial exploded structure of the host 2.

[0132] The electronic device 100 further includes an auxiliary heat sink 90. In this embodiment, the auxiliary heat sink 90 is a copper plate. In other embodiments, the auxiliary heat sink 90 may also be an aluminum plate or other metal plates.

[0133] The auxiliary heat sink 90 is a stepped plate structure. The auxiliary heat sink 90 includes a plurality of steps. The plurality of steps include a first step 91, a second step 92, a third step 93 and a fourth step 94. The first step 91, the second step 92, the third step 93 and the fourth step 94 are connected in sequence along the Y direction, and there is a height difference between two adjacent steps. The structure of the auxiliary heat sink 90 matches the structure of the third heating element 23. In other words, the height difference of the plurality of steps in the auxiliary heat sink 90 is consistent with the height difference of the plurality of heat sources in the third heating element 23, and when the auxiliary heat sink 90 is arranged on the surface of the third heating element 23, the plurality of steps are arranged in a one-to-one correspondence with the plurality of heat sources in the third heating element 23.

[0134] The auxiliary heat sink 90 is disposed between the third heating element 23 and the heat pipe 50 and is connected to the third heating element 23 and the heat pipe 50. The auxiliary heat sink 90 is arranged side by side with the liquid cooling plate 60 along the X direction and is stacked with the first connecting section 52 of the heat pipe 50 along the Z direction. In this embodiment, the auxiliary heat sink 90 and the heat pipe 50 are connected and fixed by welding. In other embodiments, a thermally conductive layer may be provided between the heat pipe 50 and the auxiliary heat sink 90 to improve the heat transfer efficiency between the auxiliary heat sink 90 and the heat pipe 50.

[0135] The auxiliary heat sink 90 and the third heating element 23 are stacked along the Z direction. The first step 91 is connected to the fourth heat source 231. In this embodiment, the surface of the first step 91 facing the mainboard 10 contacts the surface of the fourth heat source 231. In other embodiments, a thermally conductive layer may be provided between the first step 91 and the fourth heat source 231 to improve the heat transfer efficiency between the fourth heat source 231 and the second step 92. The second step 92 is connected to the fifth heat source 232. In this embodiment, a thermally conductive layer is provided between the second step 92 and the fifth heat source 232. One side of the conductive interface material contacts the surface of the fifth heat source 232, and the other side contacts the surface of the second step 92. The third step 93 is connected to the sixth heat source 233. The surface of the third step 93 facing the mainboard 10 contacts the surface of the sixth heat source 233. The fourth step 94 is connected to the seventh heat source 234. The surface of the fourth step 94 facing the mainboard 10 contacts the surface of the seventh heat source 234.

[0136] The heat generated by the fourth heat source 231 is transferred to the auxiliary heat sink 90 via the first step 91. The heat generated by the fifth heat source 232 is transferred to the auxiliary heat sink 90 via the second step 92. The heat generated by the sixth heat source 233 is transferred to the auxiliary heat sink 90 via the third step 93. The heat generated by the seventh heat source 234 is transferred to the auxiliary heat sink 90 via the fourth step 94. The heat from the auxiliary heat sink 90 is then transferred to the heat pipe 50, and then to the heat fins 40. The heat is then transferred to the outside of the electronic device 100 by the heat fins 40.

[0137] In this embodiment, the auxiliary heat sink 90 can be provided to dissipate heat for the third heating element 23 , thereby further improving the heat dissipation performance of the electronic device 100 .

[0138] Combine Figure 13 and Figure 15 The electronic device 100 further includes an auxiliary fastener 95. The auxiliary fastener 95 is a sheet-like structure. One end of the auxiliary fastener 95 is fixedly connected to the auxiliary heat sink 90, and the other end is fixedly connected to the mainboard 10. This secures the auxiliary fastener 95 to the mainboard 10 and improves the contact stability between the auxiliary heat sink 90 and the third heating element 23, thereby improving the heat transfer efficiency between the third heating element 23 and the auxiliary heat sink 90, further improving the heat dissipation efficiency of the electronic device 100.

[0139] The above are only some of the embodiments and implementations of this application. The scope of protection of this application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A heat dissipation module, applied to electronic equipment, characterized in that: The heat dissipation module includes: a liquid cooling plate, a heat dissipation plate and a heat pipe; The heat pipe includes an evaporation section and a condensation section. Along the extension direction of the heat pipe, the evaporation section is connected to the condensation section. The evaporation section is stacked with the liquid cooling plate and connected to the liquid cooling plate. The heat dissipation plate includes a heat dissipation portion and a heat transfer portion, wherein the heat dissipation portion is connected to the heat transfer portion; the heat dissipation portion is stacked with the evaporation section and connected to the evaporation section, and the heat transfer portion is located on a side away from the heat pipe; The liquid cooling plate is used to connect with the first heating element of the electronic device, and the heat of the first heating element can be transferred to the liquid cooling plate; the heat transfer part is used to connect with the second heating element of the electronic device, and the heat of the second heating element can be transferred to the heat transfer part.

2. The heat dissipation module according to claim 1, characterized in that: The liquid cooling plate and the heat dissipation portion are respectively stacked on two opposite sides of the evaporation section in a thickness direction, and are both connected to the evaporation section.

3. The heat dissipation module according to claim 1, characterized in that: The heat dissipation plate is a copper plate, an aluminum plate, a copper alloy plate, an aluminum alloy plate, or a stainless steel plate.

4. The heat dissipation module according to claim 1, wherein: The liquid cooling plate is provided with a flow channel, which includes a liquid inlet and a liquid outlet. The liquid inlet and the liquid outlet are respectively provided at opposite ends of the liquid cooling plate. The liquid inlet is used to input the cooling liquid into the flow channel, and the liquid outlet is used to discharge the cooling liquid out of the flow channel.

5. The heat dissipation module according to claim 4, characterized in that: The heat pipe is provided with a heat dissipation channel, which connects the evaporation section and the condensation section. The extension direction of the heat dissipation channel provided in the evaporation section intersects with the extension direction of the flow channel.

6. The heat dissipation module according to claim 1, characterized in that: The heat dissipation module includes a fan, and the air outlet end of the fan faces the condensation section.

7. The heat dissipation module according to claim 6, characterized in that: The heat dissipation module further includes heat dissipation fins, which are arranged opposite to the air outlet end of the fan and connected to the condensing section.

8. The heat dissipation module according to claim 7, characterized in that: The heat dissipation fins include a first heat dissipation fin and a second heat dissipation fin; the condensation section includes a first condensation section and a second condensation section, and along the extension direction of the heat pipe, the first condensation section and the second condensation section are respectively connected to the opposite ends of the evaporation section; the first condensation section is connected to the first heat dissipation fin, and the second condensation section is connected to the second heat dissipation fin; The fan includes a first fan and a second fan, wherein an air outlet end of the first fan faces the first heat dissipation fins, and an air outlet end of the second fan faces the second heat dissipation fins.

9. The heat dissipation module according to claim 1, characterized in that: The heat dissipation module also includes an auxiliary heat dissipation plate, which is stacked with the heat pipe and connected to each other. The auxiliary heat dissipation plate is used to connect to the third heating element of the electronic device, and the heat of the third heating element can be transferred to the auxiliary heat dissipation plate.

10. An electronic device, characterized in that: A heat dissipation module comprising a mainboard, a first heating element, a second heating element, and the heat dissipation module according to any one of claims 1 to 9; the heat dissipation module, the first heating element, and the second heating element are arranged on the same side of the mainboard, and the first heating element and the second heating element are both fixed to the surface of the mainboard and spaced apart from each other; Along the thickness direction of the electronic device, the liquid cooling plate and the first heating element are stacked and connected to each other, the heat transfer portion and the second heating element are stacked and connected to each other, and the evaporation section and the heat dissipation portion are located on the side of the liquid cooling plate facing away from the first heating element.

11. The electronic device according to claim 10, wherein: The second heating element includes a first heat source and a second heat source, wherein the top surface of the first heat source is located on a side of the top surface of the second heat source facing away from the mainboard; The heat transfer portion includes a first step and a second step, wherein the first step is located on a side of the second step facing away from the main board; Along the thickness direction of the electronic device, the first step is stacked with the first heat source and connected to the top surface of the first heat source, and the second step is stacked with the second heat source and connected to the top surface of the second heat source.

12. The electronic device according to claim 11, wherein: The electronic device includes a fastener, which is arranged on a surface of the heat dissipation plate facing away from the mainboard and is fixedly connected to the heat dissipation plate and the mainboard.

13. The electronic device according to claim 10, wherein: The electronic device further includes a heat-conducting layer, which is disposed between the first heating element and the liquid cooling plate and is in contact with the first heating element and the liquid cooling plate.

14. The electronic device according to claim 10, wherein: The electronic device includes a third heating element, and the third heating element is spaced apart from the first heating element and the second heating element; Along the thickness direction of the electronic device, the auxiliary heat dissipation plate of the heat dissipation module is stacked with the third heat-generating element and is connected to the third heat-generating element.

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