Magnetic carrier design method and device and storage medium

Abstract

The embodiment of the invention provides a magnetic carrier design method and device and a storage medium, and the method comprises the steps: building a chip three-dimensional model based on a chip drawing, and determining the warping behavior of a chip according to a reflow soldering temperature curve; determining a plurality of carrier design parameters, and determining values of the plurality of carrier design parameters based on the warping behavior of the chip; generating a plurality of carrier design schemes based on the plurality of carrier design parameters; aiming at each carrier design scheme, determining the warping behavior of the substrate corresponding to the carrier design scheme, and matching the warping behavior with the warping behavior of the chip; and determining a carrier design scheme meeting a preset demand condition as a target carrier design scheme based on a matching result. The blindness of the traditional experience design is solved, the accuracy of deformation control is improved through systematic verification, the development period of the magnetic carrier is shortened, and the development cost is reduced.

Description

Technical Field

[0001] The present disclosure relates to the field of electronic packaging technology, and in particular to a magnetic carrier design method, device and storage medium. Background Art

[0002] In the field of electronic component packaging, advanced processes have put forward micron-level requirements for the welding accuracy of chips and substrates. During reflow soldering, the chip and substrate will warp due to the difference in thermal expansion. The mismatch in deformation between the two will lead to solder joint defects, which has become a bottleneck for packaging yield. Magnetic carriers control the deformation of the substrate through magnetic attraction, which is the core means to solve this problem, but traditional design methods have significant shortcomings. Traditional design relies on trial and error to adjust the magnet layout, structure and suction parameters. Its defects include: warping is affected by the coupling of multiple parameters such as material, structure, and temperature, and experience is difficult to cover complex working conditions; there is a lack of quantitative model for the nonlinear relationship between magnetic attraction and deformation, resulting in long design cycles and high costs; the impact of high temperature environment on magnetic materials and carrier structures is difficult to predict, which often leads to control failure.

[0003] At the same time, technological advancements present new challenges for carrier design: achieving submillimeter magnetic force distribution accuracy at the micro-nanoscale to offset local warping stress; significant thermal-magnetic-mechanical multi-physics coupling, requiring consideration of the impact of temperature gradients on material permeability and substrate stiffness; and advanced equipment interfaces requiring carrier dimensional tolerances of ±0.05mm, a precision that traditional methods struggle to meet. Against this backdrop, magnetic carrier design technology has become a pressing challenge. This technology is not only crucial for achieving welding accuracy but also central to driving precision in electronics manufacturing, directly impacting the yield and cost of high-end chip packaging. Summary of the Invention

[0004] The embodiments of the present disclosure provide a magnetic carrier design method to solve the related problems existing in the existing technical solutions.

[0005] Based on the above problems, in a first aspect, a magnetic carrier design method is provided, comprising:

[0006] Building a three-dimensional chip model based on the chip drawing, and determining the warping behavior of the chip according to the reflow temperature curve;

[0007] Determining a plurality of carrier design parameters, and determining values of the plurality of carrier design parameters based on the warpage behavior of the chip;

[0008] Generating a plurality of vehicle design schemes based on the plurality of vehicle design parameters; wherein each vehicle design scheme includes at least one vehicle design parameter and its value;

[0009] For each carrier design, determining a warping behavior of a substrate corresponding to the carrier design and matching the warping behavior with the warping behavior of the chip;

[0010] Based on the matching results, the vehicle design scheme that meets the preset requirements is determined as the target vehicle design scheme.

[0011] In combination with the first aspect, in one possible implementation, the warping behavior of the chip includes: a warping direction and a warping amplitude of the chip;

[0012] Determining the warping behavior of the chip according to the reflow soldering temperature curve includes:

[0013] Determining the temperature load of the chip based on the reflow temperature curve, and setting first simulation environment parameters based on the temperature load; the first simulation environment parameters include: a starting temperature and boundary conditions;

[0014] Generate a warpage cloud map of the chip at a reflow peak temperature using the chip three-dimensional model;

[0015] The warping direction and warping amplitude of the chip are determined based on the warping cloud map.

[0016] In combination with the first aspect, in one possible implementation, the warping behavior of the substrate includes: a warping direction and a warping amplitude of the substrate;

[0017] The determining, for each carrier design solution, a warping behavior of the substrate corresponding to the carrier design solution includes:

[0018] For each vehicle design solution, construct a three-dimensional vehicle model based on the vehicle design parameters and vehicle drawings in the vehicle design solution;

[0019] Setting second simulation environment parameters, determining a corresponding magnetic field intensity cloud map using the three-dimensional vehicle model, and determining the magnetic force distribution and magnetic force magnitude based on the magnetic field intensity cloud map; the second simulation environment parameters include: workspace size and boundary conditions;

[0020] Constructing a geometric model of the substrate and carrier assembly structure, and setting third simulation environment parameters based on the magnetic force distribution and magnetic force magnitude; the third simulation environment parameters include: chip temperature load, carrier magnetic load and boundary conditions;

[0021] The warping behavior of the substrate in the geometric model of the substrate and carrier assembly structure under the third simulation environment parameters is determined.

[0022] In combination with the first aspect, in a possible implementation, the preset requirement condition includes: a warping behavior of the substrate is consistent with a warping behavior of the chip;

[0023] The determining, based on the matching result, that the vehicle design scheme that meets the preset requirement conditions is the target vehicle design scheme includes:

[0024] If there is at least one corresponding matching result in the plurality of vehicle design solutions that meets the preset requirement, generating a target vehicle design solution by using the plurality of vehicle design parameters and their values;

[0025] In the case that there is no corresponding matching result that meets the preset requirement conditions among the multiple carrier design schemes, the method is looped multiple times to determine the key parameters among the multiple carrier design parameters based on the matching results, and to generate a new carrier design scheme after adjusting the values of the key parameters among the multiple carrier design parameters. The steps of determining the warping behavior of the substrate corresponding to the carrier design scheme and matching it with the warping behavior of the chip are executed until the matching result corresponding to the new carrier design scheme meets the preset requirement conditions, and the new carrier design scheme is determined to be the target carrier design scheme.

[0026] In conjunction with the first aspect, in one possible implementation, determining the key parameters among the multiple vehicle design parameters based on the matching results includes:

[0027] A key vehicle design scheme having a matching degree represented by a corresponding matching result higher than a preset matching degree is determined among the multiple vehicle design schemes, and the at least one vehicle design parameter included in the key vehicle design scheme is determined as a key parameter.

[0028] In combination with the first aspect, in a possible implementation, the vehicle design parameters include: geometric shape and size, magnon material type, magnon number, and magnon distribution.

[0029] In conjunction with the first aspect, in one possible implementation, constructing a three-dimensional chip model based on the chip drawing includes:

[0030] Based on the symmetry of the chip drawing, construct a three-dimensional chip model corresponding to the chip or one-half of the chip or one-quarter of the chip;

[0031] For each vehicle design solution, constructing a three-dimensional vehicle model based on the vehicle design parameters and vehicle drawings in the vehicle design solution includes:

[0032] Based on the symmetry of the vehicle drawing, construct a three-dimensional vehicle model corresponding to the vehicle or one-half of the vehicle or one-quarter of the vehicle;

[0033] The proportion of the chip three-dimensional model to the chip is the same as the proportion of the carrier three-dimensional model to the carrier.

[0034] In combination with the first aspect, in a possible implementation manner, the method further includes:

[0035] When the target vehicle design is actually manufactured to obtain the target vehicle, a performance test is performed on the target vehicle in an actual working environment;

[0036] Comparing and analyzing the performance test results with the matching results;

[0037] If there is a large deviation between the performance test result and the matching result, the target vehicle design solution is modified.

[0038] In a second aspect, a magnetic carrier design device is provided, comprising:

[0039] A model building module is used to build a three-dimensional chip model based on the chip drawing and determine the warping behavior of the chip according to the reflow temperature curve;

[0040] an initial value module, configured to determine a plurality of carrier design parameters and determine values of the plurality of carrier design parameters based on the warping behavior of the chip;

[0041] A scheme generating module, configured to generate a plurality of vehicle design schemes based on the plurality of vehicle design parameters; wherein each vehicle design scheme includes at least one vehicle design parameter and its value;

[0042] a warpage matching module, configured to determine, for each carrier design, the warpage behavior of the substrate corresponding to the carrier design, and match the warpage behavior of the substrate with the warpage behavior of the chip;

[0043] A scheme determination module is used to determine, based on the matching results, the vehicle design scheme that meets the preset requirements as the target vehicle design scheme.

[0044] In a third aspect, an electronic device is provided, comprising: a processor, a memory and a bus, wherein the memory stores machine-readable instructions executable by the processor, and when the computer device is running, the processor and the memory communicate through the bus, and when the machine-readable instructions are executed by the processor, the steps of a magnetic carrier design method as described in the first aspect, or in combination with any possible implementation of the first aspect are performed.

[0045] In a fourth aspect, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the steps of a magnetic carrier design method as described in the first aspect or in combination with any possible embodiment of the first aspect are executed.

[0046] The beneficial effects of the embodiments of the present disclosure include:

[0047] The disclosed embodiments provide a magnetic carrier design method, device, and storage medium that can be applied to the development and optimization of magnetic carriers in semiconductor packaging production lines or other industrial automation production lines. During the reflow soldering process, the chip and substrate warp due to differences in their material thermal expansion coefficients. The mismatch in direction and magnitude between the two can lead to solder joint defects. The present invention provides a solution for this high-precision soldering requirement through a systematic process. First, a three-dimensional chip model is constructed, and the chip deformation characteristics are simulated and analyzed based on the reflow soldering temperature curve to establish control targets for carrier design that are consistent with the actual process. This step eliminates the ambiguity of traditional empirical estimation, allowing carrier design to directly target the actual chip warpage direction and magnitude, ensuring that subsequent parameter settings are clearly targeted. Second, based on chip warpage, various carrier parameter combinations and corresponding values are determined, converting the deformation characteristics into quantitative engineering parameters such as magnetic attraction force distribution and structural dimensions. By establishing a mapping relationship between the two, the blind adjustments of the traditional trial-and-error method are avoided, and the design is transformed from experience-driven to data-driven, selecting key parameters that are highly consistent with the requirements. Finally, the chip and substrate warpage behaviors are matched, and target solutions containing key parameters are screened. Simulations verify the deformation effects of the substrate under the influence of different carriers, and the degree of matching with the chip warpage is quantitatively evaluated. Using simulation technology to pre-verify soldering accuracy, invalid solutions can be eliminated without physical proofing, reducing trial and error costs and ensuring that accuracy standards are met.

[0048] In summary, the solution provided by the present disclosure is closely integrated with the requirements of the reflow soldering process, and a design system based on physical simulation and data-driven is established. This not only solves the blindness of traditional empirical design, but also improves the accuracy of deformation control through systematic verification, providing reliable guarantees for precise welding during product packaging, while shortening the development cycle of magnetic carriers and reducing development costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1 One of the flow charts of a magnetic carrier design method provided in an embodiment of the present disclosure;

[0050] Figure 2 The second flowchart of a magnetic carrier design method provided in an embodiment of the present disclosure;

[0051] Figure 3 This is one of the structural diagrams of a magnetic carrier design device provided in an embodiment of the present disclosure;

[0052] Figure 4 This is the second structural diagram of a magnetic carrier design device provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0053] The present disclosure provides a magnetic carrier design method, device, and storage medium. Preferred embodiments of the present disclosure are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are intended only to illustrate and explain the present disclosure and are not intended to limit the present disclosure. Furthermore, the embodiments and features of the embodiments may be combined with one another unless there is a conflict.

[0054] The present disclosure provides a method for designing a magnetic carrier. Figure 1 As shown, including:

[0055] S101, constructing a three-dimensional chip model based on the chip drawing, and determining the chip warping behavior according to the reflow temperature curve;

[0056] S102, determining multiple carrier design parameters, and determining values of the multiple carrier design parameters based on the warping behavior of the chip;

[0057] S103, generating multiple vehicle design schemes based on multiple vehicle design parameters; wherein each vehicle design scheme includes at least one vehicle design parameter and its value;

[0058] S104: For each carrier design solution, determine the warpage behavior of the substrate corresponding to the carrier design solution, and match it with the warpage behavior of the chip;

[0059] S105 . Determine, based on the matching results, a vehicle design scheme that meets preset requirements as a target vehicle design scheme.

[0060] In the field of electronic component packaging, traditional magnetic carrier design relies on empirical estimation of chip reflow warping deformation, and does not combine quantitative analysis of material thermal expansion coefficient, structural dimensions and temperature curve, resulting in vague design goals. At the same time, carrier parameters (such as magnetic attraction force distribution and geometric structure) have no correlation with chip warping, and are mostly adjusted by trial and error, which makes it difficult to cope with complex working conditions such as material differences and micro-scale structures. In addition, it relies on physical mold testing and verification solutions, with a single trial and error cycle of up to several weeks, costing up to hundreds of thousands of yuan and unable to pre-screen invalid designs. Ultimately, due to the lack of a "chip-substrate" warping quantitative matching mechanism, it is difficult to control the deformation consistency of the two, resulting in frequent solder joint defects.

[0061] In response to the above problems, the present invention systematically quantifies the thermal-structural coupling deformation of the chip by constructing a three-dimensional model and combining it with the reflow soldering temperature curve, converting traditional empirical judgments into quantifiable control targets, providing an accurate basis for carrier design. Then, based on the chip warping characteristics, the key carrier parameters and their values are determined, and a direct mapping between deformation characteristics and parameter settings is established. Through parametric modeling, multiple groups of solutions containing different design parameters and values are generated to replace the traditional blind trial and error mode. Further, through simulation of the warping behavior of the substrate under each solution, the matching degree with the chip deformation is quantitatively evaluated, and the optimal solution is selected according to the preset accuracy standard. Invalid designs can be eliminated without physical proofing, which greatly shortens the cycle and reduces costs.

[0062] Overall, the present invention upgrades carrier design from experience-driven to data-driven, systematically resolving the core contradictions of experience-based design, high trial-and-error costs, and low matching accuracy, and providing a reliable solution for precise welding of advanced packaging.

[0063] In this disclosed embodiment, a three-dimensional model is first constructed based on chip drawings. The chip's thermal-structural coupled deformation is simulated using a reflow soldering temperature profile. This accurately simulates the warpage direction and magnitude data for each region of the chip, providing quantitative control targets for subsequent design and effectively addressing the uncertainty inherent in traditional empirical estimation. The carrier design parameters, including magnet layout density, suction strength, and support structure stiffness, are then specifically determined based on the quantified chip warpage results. In practical implementation, either centralized magnetic control or distributed gradient suction adjustment strategies can be selected, establishing a direct mapping between chip warpage behavior and carrier parameters, avoiding the blindness of traditional trial-and-error methods. By combining these parameters, differentiated carrier design solutions are generated, systematically exploring the potential space for carrier design. For each design solution, the substrate warpage response under the action of the corresponding carrier is simulated and quantitatively matched to the chip's warpage behavior. By comparing the control effects of different solutions, the critical role of accurate chip-substrate deformation matching is highlighted. Finally, the solutions are screened based on pre-set requirements, eliminating designs that do not meet the standards and ultimately identifying a target carrier design that meets process requirements.

[0064] In another embodiment provided by the present disclosure, the warping behavior of the chip includes: a warping direction and a warping amplitude of the chip;

[0065] In the above step S101, the warping behavior of the chip is determined according to the reflow temperature curve, which can be implemented as follows:

[0066] 1. Determine the temperature load of the chip based on the reflow temperature curve, and set the first simulation environment parameters based on the temperature load; the first simulation environment parameters include: starting temperature and boundary conditions;

[0067] 2. Using the chip 3D model, generate a chip warpage cloud map at the reflow peak temperature;

[0068] 3. Determine the warping direction and warping amplitude of the chip based on the warping cloud map.

[0069] In the disclosed embodiment, during the electronic component packaging process, the chip will warp during the reflow process. Determining its warping behavior is crucial for magnetic carrier design. This embodiment determines the chip warping behavior mainly through the following three key steps:

[0070] First, the temperature load of the chip must be determined based on the reflow temperature curve, and the first simulation environment parameters must be set. The reflow temperature curve typically includes stages such as preheating, insulation, reflow, and cooling, and the temperature the chip is subjected to is different in each stage. For example, the chip temperature during the reflow stage may reach 240°C, which is a large temperature difference from room temperature. This temperature difference is an important temperature load. The starting temperature in the first simulation environment parameter can be set to room temperature, such as 25°C; the boundary conditions need to simulate the actual connection between the chip and the substrate. For example, solder ball fixation can be used as a boundary condition to limit the displacement of the chip in certain directions. This step converts the actual temperature conditions of the reflow process into parameters that can be processed by the simulation, providing an accurate environmental basis for subsequent analysis.

[0071] Next, using the chip's 3D model, a warpage contour map of the chip at the peak reflow soldering temperature is generated within the aforementioned simulation environment. Using common finite element software as an example, the chip's 3D model is imported into the simulation environment. When the temperature reaches its peak, the software calculates the chip's deformation based on the thermal stress distribution and presents it as a warpage contour map. The contour map uses different colors to indicate the degree of warpage in different areas of the chip; for example, darker areas may indicate greater warpage.

[0072] Finally, the warping direction and warping amplitude of the chip are determined based on the warping cloud map. From the cloud map, you can intuitively see which areas of the chip are warped upward and which areas are warped downward. This is the warping direction. The warping amplitude can be obtained through the numerical annotations on the cloud map. For example, if the value of an area is marked as 0.08mm, it means that the warping amplitude of the area is 0.08mm. These data can provide a key basis for the design of magnetic carriers. For example, if the warping amplitude of the chip edge is large and the direction is downward, then the carrier needs to provide a stronger suction force at the corresponding position to offset the warping. In summary, the warping behavior of the chip is obtained through simulation, which facilitates the matching of the warping behavior corresponding to the subsequent magnetic carrier design scheme with the chip warping behavior, and then screens out the appropriate target carrier design scheme.

[0073] In another embodiment provided by the present disclosure, the warping behavior of the substrate includes: a warping direction and a warping amplitude of the substrate;

[0074] The above step S104, determining the warping behavior of the substrate corresponding to each carrier design solution, can be implemented as follows:

[0075] 1. For each vehicle design scheme, build a 3D vehicle model based on the vehicle design parameters and vehicle drawings in the vehicle design scheme;

[0076] 2. Set the second simulation environment parameters, use the vehicle's three-dimensional model to determine the corresponding magnetic field intensity cloud map, and determine the magnetic force distribution and magnitude based on the magnetic field intensity cloud map; the second simulation environment parameters include: workspace size and boundary conditions;

[0077] 3. Construct a geometric model of the substrate and carrier assembly structure, and set the third simulation environment parameters based on the magnetic force distribution and magnitude. The third simulation environment parameters include: chip temperature load, carrier magnetic load, and boundary conditions.

[0078] 4. Determine the warping behavior of the substrate in the geometric model of the substrate and carrier assembly structure under the third simulation environment parameters.

[0079] In the disclosed embodiments, determining the substrate's warpage behavior under a specific carrier design is a key step in achieving deformation matching between the chip and the substrate. This process ensures precise coupling between the magnetic attraction distribution and substrate deformation through multi-step simulation analysis. Taking an FR-4 substrate (50mm×50mm, thermal expansion coefficient 18ppm / °C) with an edge-enhanced magnet layout as an example, the specific implementation process is as follows:

[0080] First, for each vehicle design proposal, a 3D model must be constructed based on the proposed vehicle design parameters (such as magnet type, layout density, and structural dimensions) and the vehicle drawings. For example, if the proposal uses 5mm-per-side NdFeB magnets evenly spaced at 2mm intervals around the vehicle edge, the magnet array and vehicle frame structure are accurately modeled using CAD software to provide a geometric foundation for subsequent simulations.

[0081] The parameters for the second simulation environment were then set (for example, the workspace size was a 5mm air domain around the substrate, and the boundary condition was defined as a vertically downward magnetization direction). Electromagnetic simulation software such as ANSYS Maxwell was then used to calculate a magnetic field intensity cloud map of the carrier's three-dimensional model. The cloud map shows that the magnetic field intensity directly above the magnets can reach 0.3T. The densely distributed magnets in the edge regions form a gradient magnetic field, while the magnetic field intensity in the center decays to 0.1T. This confirms that the magnetic force distribution exhibits a "strong edge, weak center" characteristic. The attractive force of each magnet on the substrate can be calculated using the Biot-Savart law: a single magnet at the edge exerts approximately 5N of attraction, while a single magnet in the center exerts approximately 2N of attraction.

[0082] A geometric model of the substrate and carrier assembly was then constructed, using the aforementioned magnetic force distribution and magnitude as load input. The third simulation environment parameters were then set, combining the chip temperature load (e.g., a reflow peak of 240°C corresponds to a temperature differential load of 215°C) and boundary conditions (fixed constraints between the four corners of the substrate and the carrier). At this point, the substrate was subjected to both the temperature load transmitted by the chip (causing thermal expansion of the material) and the constraints of the carrier's magnetic attraction (restraining warpage), creating a thermal-magnetic-mechanical multi-field coupled analysis scenario.

[0083] The assembly model was solved using finite element software (such as ABAQUS), and the warping behavior of the substrate was ultimately determined: under the action of strong magnetic attraction at the edge (a total of 20N), the edge of the substrate produced a 0.06mm convex deformation, while the center area convexed by 0.02mm due to weaker attraction (a total of 8N). The overall deformation trend was complementary to the 0.08mm concave at the edge of the chip and the 0.03mm concave at the center. The amplitude difference was controlled within an accuracy range of ±5μm, improving product yield.

[0084] In another embodiment provided by the present disclosure, the preset requirement conditions include: the warping behavior of the substrate is consistent with the warping behavior of the chip;

[0085] The above step S105, determining the vehicle design scheme that meets the preset requirements based on the matching results as the target vehicle design scheme, can be implemented as follows:

[0086] When at least one corresponding matching result among the multiple vehicle design solutions meets the preset requirement, a target vehicle design solution is generated using multiple vehicle design parameters and their values;

[0087] When there is no corresponding matching result that meets the preset requirements among multiple carrier design schemes, the process is repeated multiple times to determine the key parameters among the multiple carrier design parameters based on the matching results, and to generate a new carrier design scheme after adjusting the values of the key parameters among the multiple carrier design parameters. The steps of determining the warping behavior of the substrate corresponding to the carrier design scheme and matching it with the warping behavior of the chip are executed until the matching result corresponding to the new carrier design scheme meets the preset requirements, and the new carrier design scheme is determined to be the target carrier design scheme.

[0088] In the disclosed embodiment, in the design of a magnetic carrier for electronic component packaging, the key to step S105 is to select or iterate a target solution from multiple design solutions based on the preset requirement of "consistent warping behavior of the substrate and the chip", with rigorous two-way decision-making logic to ensure the accuracy of the carrier design.

[0089] If there are matching results among multiple carrier design solutions, for example, the substrate edge of solution A is 0.08mm convex, which is the same as the concave amplitude of the chip and in the opposite direction, the system will directly extract the carrier parameters of the solution, such as the edge magnet density of 10 / cm and the suction force of 3N / mm. 2 , and then generate the target carrier design solution, avoiding unnecessary calculations. This situation is more common when a symmetrical chip is combined with a regular substrate, and the uniform layout of the magnets can achieve complementary deformation.

[0090] If none of the initial solutions meet the requirements, such as in Solution B, where the substrate edge is only 0.06mm convex, which differs from the chip's 0.08mm concave, the system enters an iterative optimization process. During implementation, intelligent optimization algorithms can be introduced to improve iteration efficiency. For example, a genetic algorithm can be used to perform a global search for parameters such as magnet layout and material stiffness, selecting high-quality parameter combinations using a fitness function based on warpage matching. Simultaneously, a machine learning model can be combined with historical design data to train a warpage prediction model to quickly determine the optimal value ranges for key parameters.

[0091] First, key parameters such as the magnet attraction and the number of edge magnets are determined through sensitivity analysis. Assuming that the simulation shows that the magnet attraction has an influence coefficient of 0.01mm / N on the substrate warpage, the edge magnet attraction is reduced from 3N / mm 2 Adjust to 4N / mm 2 , generate a new solution C. Recalculate the substrate warping behavior of solution C. If the edge convexity is increased to 0.085mm, close to the chip concave amplitude, further fine-tune the suction force to 3.8N / mm. 2 For multi-objective optimization scenarios, weighted coefficients can be set to adjust the direction of parameter iteration, prioritizing warpage matching accuracy and then optimizing the number of magnets to reduce costs. For asymmetric chip deformation, such as unilateral warpage caused by local heat sources, the suction force of the unilateral magnet can be dynamically adjusted, for example, by increasing it by 15%, to compensate for the substrate's targeted deformation. Ultimately, the substrate deformation amplitude and chip error are less than ±5μm, and the direction is completely opposite, meeting the requirement of "consistent warpage behavior."

[0092] This step leverages a two-tiered decision-making mechanism of "direct screening and iterative optimization" to quickly address design requirements for simple scenarios while also solving complex deformation matching problems through parameter sensitivity analysis and intelligent algorithms. This transforms "qualitative matching" into "quantitative optimization," effectively addressing the inefficiencies of traditional design practices that rely on empirical trial and error through a data-driven iterative process. This provides a reliable closed-loop control path for micron-level precision soldering in high-density packaging.

[0093] In another embodiment provided by the present disclosure, the above-mentioned “determining key parameters among the multiple vehicle design parameters based on the matching results” can be implemented as follows:

[0094] A key vehicle design scheme having a matching degree represented by a corresponding matching result higher than a preset matching degree is determined among multiple vehicle design schemes, and at least one vehicle design parameter included in the key vehicle design scheme is determined as a key parameter.

[0095] In the disclosed embodiments, determining a key parameter among multiple vehicle design parameters based on the matching results is a critical step in optimizing the design. Specifically, a key vehicle design solution must first be identified from multiple vehicle design solutions, where the matching result indicates a degree of matching greater than a predetermined degree of matching. At least one vehicle design parameter contained in that solution is then identified as a key parameter.

[0096] Taking the electronic chip packaging scenario as an example, three carrier design schemes were designed: Scheme A, Scheme B, and Scheme C. Scheme A uses a conventional magnet layout and specifications, Scheme B increases the magnet size, and Scheme C adjusts the magnet spacing, with a preset matching degree of 85%. Simulations of the matching degree between the substrate and chip warping behavior under each scheme showed a matching degree of 80% for Scheme A, 90% for Scheme B, and 82% for Scheme C. As a result, Scheme B became the key carrier design scheme due to its higher matching degree than the preset value, with the carrier design parameter of increasing the magnet size initially identified as the key parameter.

[0097] To accurately determine the key parameters, after selecting Option B as the key carrier design, the magnet size in Option B can be further adjusted slightly. For example, the magnet size can be slightly increased from the original increase and the matching degree recalculated. If the matching degree significantly improves, the magnet size is more clearly the key parameter and can be used to explore a more optimal magnet size value. If the matching degree does not change significantly, the magnet size can be slightly reduced and the matching degree can be recalculated. In addition, if other key carrier design options also involve magnet-related parameters, the impact of the magnet parameters on matching degree can be compared in each option. For example, if another key option adjusts the magnet material, the effect of the magnet-related parameters on matching degree in Option B can be compared. If the matching degree improvement caused by the magnet size change in Option B is more significant, it further confirms that the magnet size is the key parameter. By closely integrating these design steps, the key parameters that truly affect matching degree can be more effectively identified from multiple carrier design options, providing a strong basis for optimizing the design of the magnetic carrier and ensuring the optimal matching of the chip and substrate warpage behavior.

[0098] In another embodiment provided by the present disclosure, the vehicle design parameters include: geometric shape and size, magnon material type, magnon number, and magnon distribution.

[0099] In the disclosed embodiment, the carrier design parameters include geometric shape and size, magnon material type, magnon number and magnon distribution. These parameters are interrelated and work together, and have a crucial impact on the performance of the carrier and the matching effect of the warping behavior of the chip and substrate.

[0100] Geometric shape and dimensions are fundamental parameters in carrier design. The overall shape and specific dimensions of the carrier need to match the specifications of the chip and substrate. For example, for rectangular chips and substrates, the carrier should also be designed to be a corresponding rectangular shape, with its length and width dimensions being just enough to accommodate the chip and substrate, while also leaving a certain amount of space for components such as magnets. If the carrier's geometric shape and dimensions are unreasonable, the chip and substrate may not be properly placed in the carrier, or additional stress may be generated during the reflow process due to space limitations, affecting the matching of warpage behavior.

[0101] The type of magnon material determines the magnetic properties of the magnon. Different magnon materials have different properties such as magnetic permeability, remanence, and coercivity. For example, neodymium iron boron magnets have high remanence and coercivity and can generate strong magnetic fields; ferrite magnets have relatively weak magnetism but are lower in cost. When designing a carrier, it is necessary to select the appropriate magnon material based on specific needs. If the magnetic field strength requirement is high, neodymium iron boron magnets can be selected; if the cost is more sensitive and the magnetic field strength requirement is not particularly high, ferrite magnets may be a more appropriate choice. Different types of magnon materials will directly affect the size and distribution of the magnetic force generated by the carrier, and thus affect the warping behavior of the substrate.

[0102] The number and distribution of magnetons further refine the magnetic force control of the carrier. The number of magnetons will affect the overall magnetic strength of the carrier. Generally speaking, the more magnetons there are, the stronger the magnetic force generated, but it will also increase the cost and design complexity. Therefore, the number of magnetons needs to be reasonably determined based on the degree of warping of the chip and substrate and the required magnetic force. The distribution of magnetons is equally important. A reasonable distribution of magnetons can make the magnetic force uniform on the carrier or distributed according to specific needs. For example, for chips with more severe edge warping, the distribution density of magnetons can be increased at the edge of the carrier to enhance the magnetic force at the edge, thereby better offsetting the warping of the chip edge.

[0103] In summary, the geometric shape and size, magnon material type, magnon number and magnon distribution of these carrier design parameters all play a key role in the design of magnetic carriers. It is necessary to comprehensively consider the relationship between them and make reasonable designs based on the specific chip and substrate characteristics and packaging requirements to achieve a good match between the substrate and chip warping behavior and improve the quality and reliability of electronic component packaging.

[0104] In another embodiment provided by the present disclosure, the above-mentioned “building a chip three-dimensional model based on the chip drawing” can be implemented as follows:

[0105] Based on the symmetry of the chip drawings, a three-dimensional chip model corresponding to the chip or one-half of the chip or one-quarter of the chip is constructed;

[0106] The above step S104, for each vehicle design solution, constructing a vehicle three-dimensional model based on the vehicle design parameters and vehicle drawings in the vehicle design solution, can be implemented as follows:

[0107] Based on the symmetry of the vehicle drawing, construct a three-dimensional model of the vehicle corresponding to the vehicle or one-half of the vehicle or one-quarter of the vehicle;

[0108] The proportion of the chip three-dimensional model to the chip is the same as the proportion of the vehicle three-dimensional model to the vehicle.

[0109] In the embodiment of the present disclosure, constructing a three-dimensional model based on the symmetry of the chip and carrier drawings is a key technical means to improve simulation efficiency and accuracy. Specifically, when the chip drawings show geometric symmetry (such as square or rectangular chips that are symmetrical left and right or up and down along the central axis), you can choose to build a full-size model, a half model, or a quarter model according to its degree of symmetry. For example, for a square silicon-based chip with a side length of 50mm, it is symmetrical along the X-axis and the Y-axis, and only a quarter model (i.e., 1 / 4 chip area) can be constructed. At the same time, if the corresponding carrier is a symmetrical structure, its quarter model is also constructed to ensure that the modeling ratios of the two are the same (such as both are 1 / 4).

[0110] This symmetric modeling method can significantly reduce computing resource consumption by being applied simultaneously when constructing the chip 3D model in S101 and the carrier 3D model in S103: in chip warpage analysis, symmetric boundary conditions (such as node displacement constraints on the symmetry axis) are imposed on the quarter model, and its simulation calculation amount is only 1 / 4 of the full model, while the warpage cloud map, stress distribution and other results can restore the deformation characteristics of the complete chip through mirror symmetry; similarly, in the calculation of the carrier's magnetic field intensity cloud map, after setting the magnet distribution and boundary conditions, the magnetic force distribution results of the symmetrical quarter carrier model can be extended along the symmetry axis to the full-size carrier to ensure proportional consistency with the chip model.

[0111] During implementation, if the chip is rectangular and symmetrical only along the X-axis, a 1 / 2 model is constructed, and the carrier is also modeled in 1 / 2, maintaining a 1:2 ratio. This modeling strategy is not only applicable to regularly shaped chips and carriers, but also to circular chips and ring-shaped carriers with axisymmetry. By constructing a 1 / 2 or 1 / 4 model and applying rotationally symmetric boundary conditions, the number of mesh divisions and solution time can be reduced to 1 / 2 to 1 / 4 of the original while maintaining computational accuracy.

[0112] In subsequent steps, the warpage cloud map and magnetic field intensity cloud map generated based on the symmetric model can be directly used for the S104 substrate warpage behavior analysis: when the chip quarter model shows an edge concave of 0.08mm, the symmetrical edge areas of the complete chip all show the same deformation. If the magnetic force distribution is calculated at the corresponding position of the quarter model of the carrier, the magnetic force of the symmetrical area of the full-size carrier can be automatically mirrored to ensure that the "chip-substrate-carrier" assembly structure maintains consistency in geometry and physical properties during simulation. This modeling method simplifies the problem scale by utilizing symmetry, avoiding both computational redundancy of the full-size model and deviations in boundary condition settings that may be caused by asymmetric modeling. It provides an efficient and reliable geometric and data foundation for subsequent warpage matching analysis and parameter optimization, and is particularly suitable for high-frequency, multi-scheme simulation verification requirements in large-scale integrated circuit packaging.

[0113] In another embodiment provided by the present disclosure, Figure 2 As shown, the above method also includes:

[0114] S106. When the target vehicle design is actually manufactured to obtain the target vehicle, a performance test is performed on the target vehicle in an actual working environment;

[0115] S107, comparing and analyzing the performance test results and the matching results;

[0116] S108. If there is a large deviation between the performance test result and the matching result, the target vehicle design solution is modified.

[0117] In the embodiment of the present disclosure, in combination with the aforementioned steps S101 to S105, the present invention further includes steps S106 to S108 to construct a closed loop connecting virtual design and engineering practice, and ensures that the carrier performance meets expectations through actual measurement verification and feedback correction. For example, after the target carrier is made according to the simulation matching results (the substrate edge is 0.08mm convex), it is necessary to carry out performance testing in an actual reflow soldering environment (peak 240°C, nitrogen atmosphere). In addition to using a three-dimensional coordinate measuring machine to detect the substrate warpage amplitude (the edge is measured to be 0.09mm), the MEMS displacement sensor integrated in the carrier can also be used to collect deformation data of each area in real time to accurately capture the dynamic warping characteristics under high temperature.

[0118] The S107 comparative analysis involves comparing measured data (e.g., a 12.5% deviation in the edge convexity) with the simulation results point by point. Data tracing revealed that the simulation model failed to account for the high-temperature demagnetization effect of the magnon material (NdFeB's magnetic force decays by approximately 8% at 240°C), resulting in the measured magnetic force being lower than the design value. This allows the material property correction model, trained using historical test data, to automatically calculate the temperature effect on magnon performance, providing a quantitative basis for deviation analysis.

[0119] Entering the S108 correction phase, the temperature-permeability curve of the magnetic sub-material is first supplemented in the simulation environment to recalculate the magnetic force distribution under high-temperature conditions. The number of edge magnets is then increased from 12 to 13 to compensate for magnetic force attenuation. The corrected parameters are synchronized to the 3D modeling tool through an automated interface to generate a new vehicle design. If multiple batches of tests show that the uneven magnetic force distribution caused by the error in the assembly position of the sub-magnets (such as a ±0.5mm offset) is a common problem, the compensation coordinates of the sub-magnet layout can be pre-set in the design plan (such as an offset of 0.3mm in the direction of the chip for the edge magnets). The compensation parameters are then optimized through a machine learning algorithm, so that the corrected plan significantly reduces the deviation between the measured and matched results when re-simulated.

[0120] This process integrates real-time sensor monitoring into performance testing, embeds material property models into comparative analysis, and integrates automated parameter correction with machine learning algorithms, ensuring that the extended implementation method is closely aligned with each step: sensor data provides multi-dimensional support for field measurements, correction models enhance the scientific nature of comparative analysis, and compensation parameter setting and algorithm optimization directly serve the iteration of design solutions. Ultimately, a closed loop of "measured data-driven - deviation traceability analysis - intelligent parameter correction" is formed. This not only compensates for the simulation's inadequate simplification of complex working conditions, but also feeds back into virtual design through engineering practice, ensuring that the actual warpage control effect of the target vehicle in high-density packaging is highly consistent with the preliminary matching results, achieving a precise transformation from theoretical design to engineering application.

[0121] Based on the same disclosed concept, the embodiments of the present disclosure also provide a magnetic carrier design device, electronic device and storage medium. Since the principles of the problems solved by these devices, electronic devices and storage media are similar to those of the aforementioned magnetic carrier design method, the implementation of the device, electronic device and storage medium can refer to the implementation of the aforementioned method, and the repeated parts will not be repeated.

[0122] With the above Figure 1 Corresponding to the method shown, the embodiment of the present disclosure also provides a magnetic carrier design device, such as Figure 3 As shown, including:

[0123] The model building module 301 is used to build a three-dimensional chip model based on the chip drawing and determine the chip warping behavior according to the reflow temperature curve;

[0124] An initial value module 302 is used to determine various carrier design parameters and determine the values of the various carrier design parameters based on the warpage behavior of the chip;

[0125] A solution generation module 303 is configured to generate multiple vehicle design solutions based on multiple vehicle design parameters; wherein each vehicle design solution includes at least one vehicle design parameter and its value;

[0126] The warpage matching module 304 is used to determine the warpage behavior of the substrate corresponding to each carrier design solution and match it with the warpage behavior of the chip;

[0127] The solution determination module 305 is used to determine, based on the matching results, a vehicle design solution that meets the preset requirements as a target vehicle design solution.

[0128] In another embodiment provided by the present disclosure, the warping behavior of the chip includes: a warping direction and a warping amplitude of the chip;

[0129] The above-mentioned model construction module is used to determine the temperature load of the chip based on the reflow soldering temperature curve and set the first simulation environment parameters based on the temperature load; the first simulation environment parameters include: starting temperature and boundary conditions; using the chip three-dimensional model, generate a warping cloud map of the chip at the reflow soldering peak temperature; based on the warping cloud map, determine the warping direction and warping amplitude of the chip.

[0130] In another embodiment provided by the present disclosure, the warping behavior of the substrate includes: a warping direction and a warping amplitude of the substrate;

[0131] The above-mentioned warpage matching module is used to construct a three-dimensional model of the carrier for each carrier design scheme based on the carrier design parameters and carrier drawings in the carrier design scheme; set the second simulation environment parameters, use the three-dimensional model of the carrier to determine the corresponding magnetic field strength cloud map, and determine the magnetic force distribution and magnetic force magnitude based on the magnetic field strength cloud map; the second simulation environment parameters include: workspace size and boundary conditions; construct a geometric model of the substrate and carrier assembly structure, and set the third simulation environment parameters based on the magnetic force distribution and magnetic force magnitude; the third simulation environment parameters include: chip temperature load, carrier magnetic load and boundary conditions; determine the warpage behavior of the substrate in the geometric model of the substrate and carrier assembly structure under the third simulation environment parameters.

[0132] In another embodiment provided by the present disclosure, the preset requirement conditions include: the warping behavior of the substrate is consistent with the warping behavior of the chip;

[0133] The above-mentioned scheme determination module is used to generate a target carrier design scheme by using multiple carrier design parameters and their values when there is at least one corresponding matching result that meets the preset requirements among multiple carrier design schemes; when there is no corresponding matching result that meets the preset requirements among multiple carrier design schemes, it is used to loop multiple times, determine the key parameters among the multiple carrier design parameters based on the matching results, and generate a new carrier design scheme after adjusting the values of the key parameters among the multiple carrier design parameters, execute the steps of determining the warping behavior of the substrate corresponding to the carrier design scheme, and matching it with the warping behavior of the chip, until the matching result corresponding to the new carrier design scheme meets the preset requirements, and determine the new carrier design scheme as the target carrier design scheme.

[0134] In another embodiment provided by the present disclosure, the above-mentioned scheme determination module is used to determine a key vehicle design scheme among multiple vehicle design schemes, whose matching degree represented by the corresponding matching result is higher than a preset matching degree, and determine at least one vehicle design parameter included in the key vehicle design scheme as a key parameter.

[0135] In another embodiment provided by the present disclosure, the vehicle design parameters include: geometric shape and size, magnon material type, magnon number, and magnon distribution.

[0136] In another embodiment provided by the present disclosure, the above-mentioned warp matching module is used to construct a chip three-dimensional model corresponding to the chip or half of the chip or one quarter of the chip based on the symmetry of the chip drawing; and to construct a carrier three-dimensional model corresponding to the carrier or half of the carrier or one quarter of the carrier based on the symmetry of the carrier drawing; wherein the proportion of the chip three-dimensional model to the chip is the same as the proportion of the carrier three-dimensional model to the carrier.

[0137] In another embodiment provided by the present disclosure, Figure 4 As shown, the above device also includes:

[0138] The actual measurement correction module 306 is used to perform performance testing on the target vehicle in an actual working environment when the target vehicle design scheme is actually manufactured to obtain the target vehicle; compare and analyze the performance test results with the matching results; if there is a large deviation between the performance test results and the matching results, the target vehicle design scheme is corrected.

[0139] An embodiment of the present disclosure provides a computer device, comprising: a processor, a memory and a bus, wherein the memory stores machine-readable instructions executable by the processor. When the computer device is running, the processor and the memory communicate through the bus, and when the machine-readable instructions are executed by the processor, the steps of a magnetic carrier design method provided in any embodiment of the present disclosure are performed.

[0140] The computer device provided in the embodiments of the present disclosure includes a processor, a memory, and a bus. The memory is used to store and execute instructions, and includes internal memory and external memory. The internal memory is also called internal memory, which is used to temporarily store the calculation data in the processor and the data exchanged with external memory such as a hard disk. The processor exchanges data with the external memory through the internal memory. When the electronic device is running, the processor and the memory communicate through the bus, so that the processor executes the following instructions:

[0141] S101, constructing a three-dimensional chip model based on the chip drawing, and determining the chip warping behavior according to the reflow temperature curve;

[0142] S102, determining multiple carrier design parameters, and determining values of the multiple carrier design parameters based on the warping behavior of the chip;

[0143] S103, generating multiple vehicle design schemes based on multiple vehicle design parameters; wherein each vehicle design scheme includes at least one vehicle design parameter and its value;

[0144] S104: For each carrier design solution, determine the warpage behavior of the substrate corresponding to the carrier design solution, and match it with the warpage behavior of the chip;

[0145] S105 . Determine, based on the matching results, a vehicle design scheme that meets preset requirements as a target vehicle design scheme.

[0146] An embodiment of the present disclosure provides a computer-readable storage medium having a computer program stored thereon. When the computer program is executed by a processor, the computer program executes the steps of a magnetic carrier design method provided in any embodiment of the present disclosure. The storage medium can be a volatile or non-volatile computer-readable storage medium.

[0147] Through the description of the above embodiments, those skilled in the art can clearly understand that the embodiments of the present disclosure can be implemented through hardware or by means of software plus a necessary general hardware platform. Based on this understanding, the technical solutions of the embodiments of the present disclosure can be embodied in the form of a software product, which can be stored in a non-volatile storage medium (which can be a CD-ROM, a USB flash drive, a mobile hard disk, etc.), including a number of instructions for enabling a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in the various embodiments of the present disclosure.

[0148] Those skilled in the art will understand that the accompanying drawings are merely schematic diagrams of a preferred embodiment, and the modules or processes in the accompanying drawings are not necessarily required for implementing the present disclosure.

[0149] Those skilled in the art will appreciate that the modules in the devices of the embodiments may be distributed in the devices of the embodiments as described in the embodiments, or may be located in one or more devices different from the embodiments with corresponding changes. The modules of the above embodiments may be combined into one module or further split into multiple submodules.

[0150] The serial numbers of the above-mentioned embodiments of the present disclosure are for description only and do not represent the advantages or disadvantages of the embodiments.

[0151] Obviously, those skilled in the art may make various changes and modifications to the present disclosure without departing from the spirit and scope of the present disclosure. Thus, if these modifications and variations of the present disclosure fall within the scope of the claims of the present disclosure and their equivalents, the present disclosure is intended to include these modifications and variations.

Claims

1. A magnetic carrier design method, characterized in that: include: Building a three-dimensional chip model based on the chip drawing, and determining the warping behavior of the chip according to the reflow temperature curve; Determining a plurality of carrier design parameters, and determining values of the plurality of carrier design parameters based on the warpage behavior of the chip; Generating a plurality of vehicle design schemes based on the plurality of vehicle design parameters; wherein each vehicle design scheme includes at least one vehicle design parameter and its value; For each carrier design, determining a warping behavior of a substrate corresponding to the carrier design and matching the warping behavior with the warping behavior of the chip; Based on the matching results, the vehicle design scheme that meets the preset requirements is determined as the target vehicle design scheme.

2. The method according to claim 1, wherein The warping behavior of the chip includes: the warping direction and warping amplitude of the chip; Determining the warping behavior of the chip according to the reflow soldering temperature curve includes: Determining the temperature load of the chip based on the reflow temperature curve, and setting first simulation environment parameters based on the temperature load; the first simulation environment parameters include: a starting temperature and boundary conditions; Generate a warpage cloud map of the chip at a reflow peak temperature using the chip three-dimensional model; The warping direction and warping amplitude of the chip are determined based on the warping cloud map.

3. The method according to claim 1, wherein The warping behavior of the substrate includes: a warping direction and a warping amplitude of the substrate; The determining, for each carrier design solution, a warping behavior of the substrate corresponding to the carrier design solution includes: For each vehicle design solution, construct a three-dimensional vehicle model based on the vehicle design parameters and vehicle drawings in the vehicle design solution; Setting second simulation environment parameters, determining a corresponding magnetic field intensity cloud map using the three-dimensional vehicle model, and determining the magnetic force distribution and magnetic force magnitude based on the magnetic field intensity cloud map; the second simulation environment parameters include: workspace size and boundary conditions; Constructing a geometric model of the substrate and carrier assembly structure, and setting third simulation environment parameters based on the magnetic force distribution and magnetic force magnitude; the third simulation environment parameters include: chip temperature load, carrier magnetic load and boundary conditions; The warping behavior of the substrate in the geometric model of the substrate and carrier assembly structure under the third simulation environment parameters is determined.

4. The method according to claim 1, wherein The preset requirement conditions include: the warping behavior of the substrate is consistent with the warping behavior of the chip; The determining, based on the matching result, that the vehicle design scheme that meets the preset requirement conditions is the target vehicle design scheme includes: If there is at least one corresponding matching result in the plurality of vehicle design solutions that meets the preset requirement, generating a target vehicle design solution by using the plurality of vehicle design parameters and their values; In the case that there is no corresponding matching result that meets the preset requirement conditions among the multiple carrier design schemes, the method is looped multiple times to determine the key parameters among the multiple carrier design parameters based on the matching results, and to generate a new carrier design scheme after adjusting the values of the key parameters among the multiple carrier design parameters. The steps of determining the warping behavior of the substrate corresponding to the carrier design scheme and matching it with the warping behavior of the chip are executed until the matching result corresponding to the new carrier design scheme meets the preset requirement conditions, and the new carrier design scheme is determined to be the target carrier design scheme.

5. The method according to claim 4, wherein Determining key parameters among the plurality of vehicle design parameters based on the matching results includes: A key vehicle design scheme having a matching degree represented by a corresponding matching result higher than a preset matching degree is determined among the multiple vehicle design schemes, and the at least one vehicle design parameter included in the key vehicle design scheme is determined as a key parameter.

6. The method according to claim 1, wherein The vehicle design parameters include: geometric shape and size, magnon material type, magnon quantity and magnon distribution.

7. The method according to claim 3, wherein The step of constructing a chip three-dimensional model based on the chip drawing includes: Based on the symmetry of the chip drawing, construct a three-dimensional chip model corresponding to the chip or one-half of the chip or one-quarter of the chip; For each vehicle design solution, constructing a three-dimensional vehicle model based on the vehicle design parameters and vehicle drawings in the vehicle design solution includes: Based on the symmetry of the vehicle drawing, construct a three-dimensional vehicle model corresponding to the vehicle or one-half of the vehicle or one-quarter of the vehicle; The proportion of the chip three-dimensional model to the chip is the same as the proportion of the carrier three-dimensional model to the carrier.

8. The method according to claim 1, wherein Also includes: When the target vehicle design is actually manufactured to obtain the target vehicle, a performance test is performed on the target vehicle in an actual working environment; Comparing and analyzing the performance test results with the matching results; If there is a large deviation between the performance test result and the matching result, the target vehicle design solution is modified.

9. A magnetic carrier design device, characterized in that: include: A model building module is used to build a three-dimensional chip model based on the chip drawing and determine the warping behavior of the chip according to the reflow temperature curve; an initial value module, configured to determine a plurality of carrier design parameters and determine values of the plurality of carrier design parameters based on the warping behavior of the chip; A scheme generating module, configured to generate a plurality of vehicle design schemes based on the plurality of vehicle design parameters; wherein each vehicle design scheme includes at least one vehicle design parameter and its value; a warpage matching module, configured to determine, for each carrier design, the warpage behavior of the substrate corresponding to the carrier design, and match the warpage behavior of the substrate with the warpage behavior of the chip; A scheme determination module is used to determine, based on the matching results, the vehicle design scheme that meets the preset requirements as the target vehicle design scheme.

10. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a computer program, which, when executed by a processor, executes the steps of a magnetic carrier design method as claimed in any one of claims 1 to 8.

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