Anti-vibration electronic component

Abstract

The invention relates to the technical field of electronic components, in particular to an anti-vibration electronic component which comprises an electronic component body provided with a leading-out part, and the outer surface of the leading-out part is covered with an external electrode. The lead frame is connected with the external electrode of the leading-out part and is provided with a vibration-resistant assembly, the electronic component is connected with the lead frame through the external electrode, the vibration-resistant assembly improves the overall vibration resistance of the electronic component, and the electronic component meeting the requirement for the specific ratio can effectively absorb deformation generated by the mold pressing part and improve the vibration resistance; the vibration resistance of the electronic component reaches more than 60 g from 30 g, the problem of substrate vibration sound caused by an integrally-formed inductor is solved, and a more efficient mute effect is achieved.

Description

Technical Field

[0001] The invention belongs to the technical field of electronic components, and in particular relates to a vibration-resistant electronic component. Background Art

[0002] With the rapid development of the low-altitude economy, the application scenarios of drones and low-altitude aircraft are constantly expanding. As a key component in electronic circuits, inductors play an indispensable role in the electronic systems of these devices.

[0003] Traditional inductors are unable to meet the increasingly stringent requirements of low-altitude economic-related equipment in terms of size and shock resistance. For example, drones need to maintain stable operation in complex flight environments, and have high requirements for the shock resistance and miniaturization of electronic components. Therefore, the inductor industry needs to carry out research and development innovations to meet these needs.

[0004] To meet the increasingly stringent requirements of low-altitude economy-related equipment, the inductor industry urgently needs to carry out research and development innovations, especially the vibration resistance of inductors needs to be further improved. Therefore, a vibration-resistant electronic component is needed to solve the above problems. Summary of the Invention

[0005] In order to solve the above technical problems, the present invention provides a vibration-resistant electronic component to solve the problems in the existing market raised in the above background technology.

[0006] To achieve the above object, the technical solution of the present invention is as follows:

[0007] A vibration-resistant electronic component, comprising:

[0008] An electronic component, wherein the electronic component is provided with a lead portion, and an outer surface of the lead portion is covered with an external electrode;

[0009] A lead frame is connected to the external electrode of the lead-out portion and is provided with an anti-vibration component.

[0010] Through the above technical solution, the electronic components are connected to the lead frame through external electrodes, and the anti-vibration components improve the overall vibration resistance of the electronic components. Electronic components that meet specific ratios can effectively absorb the deformation caused by the molded parts, increase vibration resistance, and increase the vibration resistance of the electronic components from 30g to more than 60g, solving the problem of substrate vibration noise caused by one-piece molded inductors and achieving a more efficient silent effect.

[0011] As a preferred embodiment of the present invention, the lead frame has at least one side connected to the external electrode of the electronic component, and there is a gap between the lead frame and the electronic component. The anti-vibration component is an anti-vibration block, and the anti-vibration block is arranged in the gap.

[0012] Through the above technical solution, one side of the lead frame is connected to the external electrode, and the other side of the lead frame is connected to the electronic component through the anti-vibration block. The anti-vibration block is beneficial to further increase the vibration resistance of the electronic component and improve the overall performance of the electronic component.

[0013] As a preferred solution of the present invention, the anti-vibration block is made of elastic material, is rectangular, and is provided with a plurality of through holes 1 in the anti-vibration block, and is honeycomb-shaped.

[0014] Through the above technical solution, the preferred material of the anti-vibration block is rubber, and the honeycomb through-holes have strong stability, are not easy to deform, and are also easy to absorb the force generated by vibration.

[0015] As a preferred embodiment of the present invention, the height of the gap is less than 1 / 2 of the height of the electronic component.

[0016] Through the above technical solution, if the gap height is too high, the volume of the electronic component may become larger, and if the gap is too high, the structure of the electronic component may be unstable, resulting in greater shaking when receiving vibration.

[0017] As a preferred solution of the present invention, the lead frame has at least one side connected to the external electrode of the electronic component, there is a gap between the lead frame and the electronic component, and the lead frame away from the electronic component is made of vibration-resistant metal material.

[0018] Through the above technical solution, preferably, the vibration-resistant metal material is one or more materials selected from steel, aluminum alloy, copper and alloys thereof, and has certain gaps so as to leave a certain space to buffer the pressure.

[0019] As a preferred solution of the present invention, the lead frame has at least one side that is in contact with the external electrode of the electronic component, the anti-vibration component is connected to the lead frame and is arranged on the lower end surface of the electronic component, the anti-vibration component is an anti-vibration plate, and the anti-vibration plate is wavy.

[0020] Through the above technical solution, the anti-vibration plate is wavy in shape, which is convenient for buffering the pressure received, and makes the electronic components smaller in size, thereby increasing the anti-vibration performance on the basis of the original volume.

[0021] As a preferred embodiment of the present invention, the lead frame is provided with at least one side connected to the external electrode of the electronic component, the anti-vibration component is connected to the lead frame and is provided on the lower end surface of the electronic component, the anti-vibration component is a connecting plate, the second through hole in the connecting plate is honeycomb-shaped, and the thickness of the connecting plate is greater than the thickness of the lead frame.

[0022] Through the above technical solution, the honeycomb shape of the connecting plate is convenient for absorbing and buffering the pressure and the stress generated, thereby improving the vibration resistance of the electronic components.

[0023] As a preferred solution of the present invention, the lead frame is made of metal material, and the lead frame is connected to the external electrodes of the electronic component by laser penetration welding.

[0024] As a preferred solution of the present invention, a conductor is provided in the electronic component, and both ends of the conductor are lead-out portions, which are exposed to the outside of the electronic component.

[0025] As a preferred solution of the present invention, the conductor is made of metal.

[0026] Compared with the prior art, the present invention has the following beneficial effects:

[0027] The electronic components are connected to the lead frame via external electrodes. The anti-vibration assembly improves the overall vibration resistance of the electronic components. Electronic components that meet specific ratios can effectively absorb deformation caused by the molded part, increasing vibration resistance from 30g to over 60g. This solves the problem of substrate vibration noise caused by integrated molded inductors and achieves a more effective quiet effect.

[0028] Enhance the mechanical stability of the inductor in a vibration environment and reduce the impact of vibration on the inductor's internal structure. By studying the design changes of the lead frame shape and further improving the welding and tinning processes between the lead frame and the lead terminal, the required vibration resistance effect can be achieved.

[0029] Improve the fixing method of the inductor and design a special anti-vibration fixing bracket or structure to ensure that the inductor can still be firmly installed on the circuit board when the aircraft vibrates violently. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0031] Figure 1 This is a structural diagram of embodiment 2 of the present invention;

[0032] Figure 2 For the present invention Figure 1 Schematic diagram of the anti-vibration block structure;

[0033] Figure 3 This is a structural diagram of Example 3 of the present invention;

[0034] Figure 4 This is a structural diagram of Example 4 of the present invention;

[0035] Figure 5 This is a structural diagram of Example 5 of the present invention;

[0036] Figure 6 For the present invention Figure 5 Schematic diagram of the connecting plate structure.

[0037] 4. Electronic component; 11. Lead-out portion; 13. Magnetic core; 12. External electrode; 2. Lead frame; 3. Anti-vibration assembly; 21. Gap; 31. Anti-vibration block; 311. Through hole 1; 32. Anti-vibration plate; 33. Connecting plate; 331. Through hole 2; 1. Conductor. DETAILED DESCRIPTION

[0038] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.

[0039] The present invention provides the following embodiments:

[0040] Example 1:

[0041] A vibration-resistant electronic component 4, comprising:

[0042] An electronic component 4 is provided with a lead portion 11, the outer surface of which is covered with an external electrode 12; a lead frame 2 is connected to the external electrode 12 of the lead portion 11, and is provided with an anti-vibration assembly 3. The lead frame 2 is made of metal and is connected to the external electrode 12 of the electronic component 4 by laser penetration welding. The electronic component 4 is provided with a conductor 1, with lead portions 11 at both ends. The lead portions 11 are exposed outside the electronic component 4. The lead frame 2 is made of metal, and the lead portion 11 and the outer surface of the lead end of the lead frame 2 are electroplated.

[0043] The outer periphery of the lead frame 2 is covered with an insulating layer, and the insulating layer on the outer surface of the lead portion 11 and the lead end is stripped before electroplating;

[0044] The electronic component 4 is provided with a conductor 1, which is one or more of a wound type, a curved type, and a straight type. The conductor 1 has lead portions at both ends, and the two ends of the lead portion are lead ends. Preferably, the cross section of the lead end is exposed outside the electronic component 4. Preferably, part of the lead portion and the lead end are exposed outside the electronic part.

[0045] The outer periphery of the conductor 1 is coated with soft magnetic powder, and the soft magnetic powder is formed into a magnetic core 13 by molding.

[0046] Example 2:

[0047] Depend on Figure 1-2As shown, the lead frame 2 is provided with at least one side connected to the external electrode 12 of the electronic component 4, and a gap 21 is provided between the lead frame 2 and the electronic component 4. The anti-vibration component 3 is an anti-vibration block 31, and the anti-vibration block 31 is provided in the gap 21. One side of the lead frame 2 is connected to the external electrode 12, and the other side of the lead frame 2 is connected to the electronic component 4 through the anti-vibration block 31. The anti-vibration block 31 is beneficial to further increase the vibration resistance of the electronic component 4 and increase the overall performance of the electronic component 4.

[0048] Preferably, the anti-vibration block 31 is made of elastic material, and is rectangular. A plurality of through holes 311 are provided in the anti-vibration block 31, and the through holes 311 are honeycomb-shaped. Preferably, the anti-vibration block 31 is made of rubber material, and the honeycomb-shaped through holes 311 have strong stability, are not easy to deform, and are also convenient for absorbing the force generated by vibration.

[0049] As a further improvement of the present invention, the height of the gap 21 is less than 1 / 2 of the height of the electronic component 4. If the gap 21 is too high, the electronic component 4 may become larger, and the structure of the electronic component 4 may be unstable, causing significant shaking when subjected to vibration.

[0050] Example 3:

[0051] Depend on Figure 3 As shown, the lead frame 2 has at least one side connected to the external electrode 12 of the electronic component 4 , and a gap 21 is formed between the lead frame 2 and the electronic component 4 . The lead frame 2 is far away from the electronic component 4 and is made of vibration-resistant metal material.

[0052] Preferably, the vibration-resistant metal material is one or more materials selected from steel, aluminum alloy, copper and alloys thereof, and has a certain gap 21 to leave a certain space for buffering the pressure.

[0053] Example 4:

[0054] Depend on Figure 4 As shown, the lead frame 2 has at least one side that is in contact with the external electrode 12 of the electronic component 4. The anti-vibration component 3 is connected to the lead frame 2 and is provided on the lower end surface of the electronic component 4. The anti-vibration component 3 is an anti-vibration plate 32. The anti-vibration plate 32 is wavy. The wavy shape of the anti-vibration plate 32 facilitates buffering the pressure received and makes the electronic component 4 smaller in size, thereby increasing the anti-vibration performance on the basis of the original volume.

[0055] Example 5:

[0056] Among them, Figure 5-6As shown, the lead frame 2 has at least one side connected to the external electrode 12 of the electronic component 4. The anti-vibration component 3 is connected to the lead frame 2 and is provided on the lower end surface of the electronic component 4. The anti-vibration component 3 is a connecting plate 33. The cross section of the connecting plate 33 is provided with a plurality of equally spaced honeycomb-shaped through holes 331. The thickness of the connecting plate 33 is greater than that of the lead frame 2. The through holes 331 in the connecting plate 33 are in a hexagonal honeycomb shape to facilitate absorption and buffering of pressure and the resulting stress, thereby improving the vibration resistance of the electronic component 4. The honeycomb shape has structural stability and is not easily deformed, thereby extending the service life of the electronic component 4.

[0057] When the electronic component 4 is installed with the circuit board, etc., it is necessary to connect the lead frame 2 with the external terminal part of the circuit board by electroplating. During the electroplating process, since the electronic component 4 is usually relatively small and the distance between the adjacent electronic components 4 is relatively close, the electroplating process requires high precision and precise control of the amount. If the plating layer is large and thick, it may overflow onto the adjacent electronic components. If the plating layer is thin, it is easy to break the connection with the circuit board and cause a short circuit, affecting the use effect. The connecting plate 33 in the present application can solve this problem. The honeycomb through hole 2 331 provided in the connecting plate 33 can, on the one hand, increase the vibration resistance, and on the other hand, the plating solution can be set in the honeycomb through hole 2 331. There are several honeycomb through holes 2 331, which can make the plating layer thicker and avoid the plating overflow affecting the adjacent electronic components. It is only necessary to adjust the plating solution and the range of electroplating, thereby improving production efficiency.

[0058] Preferably, the aperture size of the second honeycomb through hole 331 becomes smaller from bottom to top, so that the connection between the connecting plate 33 and the electronic component 4 is more tightly connected, the contact surface is increased, and the vibration resistance is maintained without affecting the area range of electroplating.

[0059] The electronic component 4 is connected to the lead frame 2 through the external electrode 12. The anti-vibration component 3 improves the overall vibration resistance of the electronic component 4. The electronic component 4 that meets the specific ratio can effectively absorb the deformation caused by the molded part, increase the vibration resistance, and increase the vibration resistance of the electronic component 4 from 30g to more than 60g, solving the problem of substrate vibration sound caused by the one-piece molded inductor, achieving a more efficient silent effect, reducing complex production processes and processes, and being able to better serve and develop the market.

[0060] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A vibration-resistant electronic component, characterized in that ,include: An electronic component (4), wherein the electronic component (4) is provided with a lead portion (11), and an outer surface of the lead portion (11) is covered with an external electrode (12); A lead frame (2) is connected to an external electrode (12) of the lead-out portion (11), and the lead frame (2) is provided with an anti-vibration component (3).

2. The vibration-resistant electronic component according to claim 1, wherein: The lead frame (2) is provided with at least one side connected to an external electrode (12) of an electronic component (4), and a gap (21) is provided between the lead frame (2) and the electronic component (4). The anti-vibration component (3) is an anti-vibration block (31), and the anti-vibration block (31) is provided in the gap (21).

3. The vibration-resistant electronic component according to claim 1, wherein: The anti-vibration block (31) is made of elastic material and is rectangular. A plurality of through holes (311) are provided in the anti-vibration block (31), and the through holes (311) are honeycomb-shaped.

4. The vibration-resistant electronic component according to claim 3, wherein: The height of the gap (21) is less than 1 / 2 of the height of the electronic component (4).

5. The vibration-resistant electronic component according to claim 1, wherein The lead frame (2) is provided with at least one side connected to the external electrode (12) of the electronic component (4), and a gap (21) is provided between the lead frame (2) and the electronic component (4). The lead frame (2) is away from the electronic component (4) and is made of a vibration-resistant metal material.

6. The vibration-resistant electronic component according to claim 1, wherein: The lead frame (2) is provided with at least one side that is in contact with the external electrode (12) of the electronic component (4); the anti-vibration component (3) is connected to the lead frame (2) and is provided on the lower end surface of the electronic component (4); the anti-vibration component (3) is an anti-vibration plate (32), and the anti-vibration plate (32) is wavy.

7. The vibration-resistant electronic component according to claim 1, wherein: The lead frame (2) is provided with at least one side connected to the external electrode (12) of the electronic component (4); the anti-vibration component (3) is connected to the lead frame (2) and is provided on the lower end surface of the electronic component (4); the anti-vibration component (3) is a connecting plate (33); the thickness of the connecting plate (33) is greater than the thickness of the lead frame (2); a second through hole (331) is provided in the connecting plate (33); the second through hole (331) is in the shape of a hexagonal honeycomb.

8. The vibration-resistant electronic component according to claim 1, wherein: The lead frame (2) is made of metal material, and the lead frame (2) is connected to the external electrode (12) of the electronic component (4) by laser penetration welding.

9. The vibration-resistant electronic component according to claim 1, wherein: A conductor (1) is provided inside the electronic component (4), and both ends of the conductor (1) are lead-out portions (11), and the lead-out portions (11) are exposed outside the electronic component (4).

10. The vibration-resistant electronic component according to claim 1, wherein The conductor (1) is made of metal.

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