Inductor structure and preparation method thereof

Abstract

The invention belongs to the technical field of inductor preparation, and discloses an inductor structure and a preparation method thereof. The inductor structure comprises an insulation bottom layer, an inductor body, a coil, a wrapping body and an insulation wrapping layer. The size of the insulating bottom layer is matched with the size of the bottom surface of the inductor main body; the coil is wound on the inductor main body, and two terminals of the coil are folded to the bottom surface of the insulating bottom layer; the wrapping body wraps the peripheries and the tops of the inductor main body and the coil through a hot pressing process; the insulating coating layer wraps the periphery and the top of the coating body. The inductor structure has good transverse and longitudinal insulation performance, the electric leakage risk is reduced, and the inductor structure has high use safety and stability. According to the preparation method of the inductor structure, the production period can be shortened, the problem that impurities are introduced due to the adoption of a coating process is avoided, and the performance and the yield of the inductor structure are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of inductor preparation, and in particular to an inductor structure and a preparation method thereof. Background Art

[0002] As electronic devices continue to evolve toward miniaturization, lightweighting, and higher performance, higher requirements are being placed on the performance and integration of electronic components. Power inductors are critical energy storage and filtering components in various electronic products, such as smartphones, tablets, battery management systems for new energy vehicles, and 5G communication base stations. Their performance directly impacts the operational stability and efficiency of the entire device or system. For example, in 5G communication base stations, to meet the demands of high-speed, high-capacity data transmission, base station equipment must process higher power and more complex electromagnetic signals. This requires power inductors to possess excellent insulation and shielding properties to reduce electromagnetic interference and ensure stable signal transmission.

[0003] Related technologies usually use magnetic powder pressing to form the inductor body, and then use coating to prepare an insulating varnish coating layer to achieve insulation and shielding. The thickness of the insulating varnish coating layer obtained by this preparation method is difficult to accurately control, and it is easy to have uneven thickness, resulting in differences in insulation performance in different parts. Especially in high-voltage and high-frequency working environments, leakage is very likely to occur, affecting the safe operation of electronic equipment; the insulating varnish coating layer needs to be processed and manufactured as an additional preparation process, and requires special coating equipment and drying equipment, which not only increases the cost of production equipment, but also extends the production cycle and reduces production efficiency. In addition, during the coating process, if the environment is not properly controlled, impurities such as dust are easily introduced, affecting the performance of the inductor and resulting in a decrease in product yield.

[0004] Therefore, there is an urgent need for an inductor structure and a manufacturing method thereof to solve the above technical problems. Summary of the Invention

[0005] The object of the present invention is to provide an inductor structure having good lateral and longitudinal insulation performance, reduced leakage risk, and high safety and stability in use.

[0006] To achieve this object, the present invention adopts the following technical solutions:

[0007] An inductor structure, comprising:

[0008] Insulation base layer;

[0009] An inductor body is provided on the insulating bottom layer, and the size of the insulating bottom layer matches the size of the bottom surface of the inductor body;

[0010] A coil, wound around the inductor body, with two terminals of the coil folded to the bottom surface of the insulating bottom layer;

[0011] A covering body, wrapped around the four sides and top of the inductor body and the coil by a hot pressing process;

[0012] The insulating coating layer is wrapped around the four sides and the top of the coating body.

[0013] In some possible implementations, the inductor body includes a base plate and a center column disposed on the base plate, the base plate is disposed on the insulating bottom layer, the coil is wound around the center column, and two terminals of the coil are folded to the bottom surface of the insulating bottom layer.

[0014] In some possible implementations, two openings are provided on a side surface of the bottom plate, and the two openings are respectively located at two ends of the side surface, and the two terminals are folded one by one through the two openings to the bottom surface of the insulating bottom layer.

[0015] In some possible implementations, the insulating bottom layer is made of aluminum oxide or boron nitride.

[0016] In some possible implementations, the insulating coating layer is made of insulating oxide or resin.

[0017] In some possible implementations, when the material of the insulating coating layer is an insulating oxide, the insulating oxide is titanium dioxide or magnesium oxide; when the material of the insulating coating layer is a resin, the resin is an epoxy resin or a phenolic resin.

[0018] In some possible implementations, the thickness of the insulating bottom layer is greater than 0.1 mm.

[0019] The present invention also provides a method for preparing an inductor structure, which can shorten the production cycle, avoid the problem of introducing impurities due to the use of a coating process, and improve the performance and yield of the inductor structure.

[0020] To achieve this object, the present invention adopts the following technical solutions:

[0021] The method for preparing the inductor structure as described in any of the above solutions comprises the following steps:

[0022] Providing a mold and a hot press;

[0023] Filling the mold with a layer of powder material used to prepare the insulating base layer;

[0024] Filling the powder material with first magnetic powder and pressing and forming the powder material to obtain a first finished product structure of the insulating bottom layer and the inductor body;

[0025] Winding the coil on the first finished structure to obtain a second finished structure;

[0026] placing the second finished product structure into the hot press, filling the hot press with second magnetic powder, and pressing to form the coating to form a third finished product structure;

[0027] The insulating coating layer is formed by pressing on the four sides and the top of the third finished product structure to complete the overall forming of the inductor structure.

[0028] In some possible embodiments, the material of the insulating coating layer is an insulating oxide, which is filled on the four sides and top of the third finished product structure by injection molding and is pressed into shape by the hot press; the material of the insulating coating layer is a resin, which is formed on the four sides and top of the third finished product structure by injection molding and is pressed into shape by the hot press.

[0029] In some possible implementations, the first magnetic powder is ferrite magnetic powder or metal magnetic powder; and / or the second magnetic powder is ferrite magnetic powder or metal magnetic powder.

[0030] Beneficial effects of the present invention: In the inductor structure provided by the present invention, an insulating bottom layer is provided at the bottom of the inductor body, and after the encapsulation body is wrapped around the four sides and top of the inductor body and the coil, an insulating coating layer is provided on the four sides and top of the encapsulation body. The provision of the insulating bottom layer and the insulating coating layer improves the lateral and longitudinal insulation performance of the inductor structure, reduces the risk of leakage, reduces the electromagnetic interference between the inductor structure and the surrounding environment, and improves the safety and stability of use.

[0031] The present invention also provides a method for preparing the above-mentioned inductor structure. The insulating base layer is pressed and formed by a mold, and the insulating coating layer is pressed and formed by a hot press. Compared with the existing coating method, this method shortens the production cycle, avoids the problem of impurities introduced by the coating process, and improves the performance and yield of the inductor structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 1 is a schematic diagram of the assembly of the insulating base layer and the inductor body provided by an embodiment of the present invention;

[0033] Figure 2 This is a schematic diagram of a structure in which a coil is wound around an inductor body according to an embodiment of the present invention;

[0034] Figure 3 is a three-dimensional view of an inductor structure at one viewing angle provided by an embodiment of the present invention;

[0035] Figure 4 is a three-dimensional view of an inductor structure from another perspective provided by an embodiment of the present invention;

[0036] Figure 5 is a perspective view of an inductor structure provided by an embodiment of the present invention;

[0037] Figure 6 It is a flow chart of a method for preparing an inductor structure provided by an embodiment of the present invention.

[0038] In the picture:

[0039] 100, insulating bottom layer; 200, inductor body; 210, bottom plate; 211, opening; 220, center column; 300, coil; 400, covering body; 500, insulating covering layer. DETAILED DESCRIPTION

[0040] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It will be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all structures.

[0041] In the description of the present invention, unless otherwise expressly specified or limited, the terms "connected," "connected," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention in specific circumstances.

[0042] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Furthermore, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0043] In the description of this embodiment, the terms "upper," "lower," "right," and other orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely for ease of description and simplified operation. They do not indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meanings.

[0044] like Figures 1 to 5As shown, this embodiment provides an inductor structure comprising an insulating base layer 100, an inductor body 200, a coil 300, an encapsulating body 400, and an insulating coating 500. The inductor body 200 is disposed on the insulating base layer 100. The size of the insulating base layer 100 matches the size of the bottom surface of the inductor body 200, so that the insulating base layer 100 covers the bottom surface of the inductor body 200. Optionally, the thickness of the insulating base layer 100 is greater than 0.1 mm to provide sufficient insulation. The coil 300 is wound around the inductor body 200, with its two terminals folded over to the bottom surface of the insulating base layer 100. The specific number of turns of the coil 300 can be determined based on actual product requirements. The encapsulating body 400 is wrapped around the sides and top of the inductor body 200 and coil 300 using a hot pressing process; the insulating coating 500 is wrapped around the sides and top of the encapsulating body 400. In this embodiment, the top refers to the side of the inductor body 200 away from the insulating base layer 100.

[0045] In the inductor structure of this embodiment, an insulating base layer 100 is provided at the bottom of the inductor body 200. After the encapsulation body 400 is wrapped around the sides and top of the inductor body 200 and the coil 300, an insulating coating layer 500 is provided on the sides and top of the encapsulation body 400. The provision of the insulating base layer 100 and the insulating coating layer 500 improves the lateral and longitudinal insulation performance of the inductor structure, reduces the risk of leakage, reduces electromagnetic interference between the inductor structure and the surrounding environment, and improves safety and stability in use.

[0046] Optionally, the inductor body 200 includes a base plate 210 and a central post 220 disposed on the base plate 210. The base plate 210 is disposed on the insulating base layer 100. The coil 300 is wound around the central post 220, with the two terminals of the coil 300 folded over the bottom surface of the insulating base layer 100. The base plate 210 and the central post 220 form a T-shaped magnetic core. The provision of the central post 220 facilitates the winding of the coil 300. In this embodiment, the two terminals of the coil 300 are located on the upper surface of the base plate 210 and are fixed to one side of the base plate 210.

[0047] In one embodiment, two openings 211 are provided on one side of the bottom plate 210, one at each end of the side. The two terminals are folded over to the bottom surface of the insulating base layer 100 through the two openings 211, forming a wound magnetic core. The provision of openings 211 facilitates the routing of the terminals and ensures that the folded terminals are securely and stably secured.

[0048] Optionally, the material of the insulating base layer 100 includes aluminum oxide or boron nitride. In other embodiments, the material of the insulating base layer 100 may also include other powdered inorganic non-metals with high insulation properties, as long as good filling and insulation performance are ensured. Optionally, the material of the insulating coating layer 500 is an insulating oxide or resin. When the insulating coating layer 500 is made of an insulating oxide, the insulating oxide is titanium dioxide or magnesium oxide; when the insulating coating layer 500 is made of a resin, the resin is epoxy resin or phenolic resin. Titanium dioxide, magnesium oxide, epoxy resin, and phenolic resin all have good insulation performance.

[0049] This embodiment also provides a method for preparing the above-mentioned inductor structure, see Figure 6 , the preparation method comprises the steps of:

[0050] S1. Provide a mold and a hot press;

[0051] S2. Filling the mold with a layer of powder material for preparing the insulating bottom layer 100;

[0052] S3, filling the powder material with first magnetic powder and pressing and forming the powder material to obtain a first finished product structure of the insulating bottom layer 100 and the inductor body 200;

[0053] S4, winding the coil 300 on the first finished structure to obtain a second finished structure;

[0054] S5. Place the second finished product structure into a hot press, fill the hot press with second magnetic powder, and press to form a coating 400 to form a third finished product structure;

[0055] S6. An insulating coating layer 500 is formed by pressing on the four sides and the top of the third finished product structure to complete the overall formation of the inductor structure.

[0056] In the method for preparing an inductor structure provided in this embodiment, the insulating base layer 100 is formed by pressing with a mold, and the insulating covering layer 500 is formed by pressing with a hot press. Compared with existing coating methods, this method shortens the production cycle, avoids the problem of impurities introduced by the coating process, and improves the performance and yield of the inductor structure.

[0057] Optionally, the insulating coating layer 500 is made of an insulating oxide, which is injected onto the sides and top of the third finished structure and then pressed into shape using a hot press. Alternatively, the insulating coating layer 500 is made of a resin, which is injected onto the sides and top of the third finished structure and then pressed into shape using a hot press. After press-forming, the insulating coating layer 500 is evenly and tightly wrapped around the sides and top of the third finished structure, effectively ensuring that the inductor structure has a good shielding effect.

[0058] Optionally, the first magnetic powder is ferrite magnetic powder or metal magnetic powder; and / or the second magnetic powder is ferrite magnetic powder or metal magnetic powder. In actual implementation, the particle size and specific composition of the first magnetic powder and the second magnetic powder can be set according to the specific inductance performance requirements.

[0059] Exemplarily, when the material of the insulating bottom layer 100 is aluminum oxide, the method for preparing the inductor structure includes:

[0060] S1. Provide a mold and a hot press;

[0061] S2. Fill the mold with a layer of alumina powder, the filling thickness of the alumina powder being greater than 0.1 mm;

[0062] S3, filling the alumina powder with first magnetic powder and pressing and molding, thereby obtaining a first finished product structure of the insulating bottom layer 100 and the inductor body 200;

[0063] S4, winding the coil 300 on the first finished structure to obtain a second finished structure;

[0064] S5. Place the second finished product structure into a hot press, fill the hot press with second magnetic powder, and press to form a coating 400 to form a third finished product structure;

[0065] S6. Fill the third finished product structure with epoxy resin on all sides and the top by injection molding, and press it into shape by a hot press.

[0066] Exemplarily, when the material of the insulating bottom layer 100 is boron nitride, the method for preparing the inductor structure includes:

[0067] S1. Provide a mold and a hot press;

[0068] S2. Filling the mold with a layer of boron nitride powder, wherein the filling thickness of the boron nitride powder is greater than 0.1 mm;

[0069] S3, filling the boron nitride powder with a first magnetic powder, and pressing and molding, to obtain a first finished product structure of the insulating bottom layer 100 and the inductor body 200;

[0070] S4, winding the coil 300 on the first finished structure to obtain a second finished structure;

[0071] S5. Place the second finished product structure into a hot press, fill the hot press with second magnetic powder, and press to form a coating 400 to form a third finished product structure;

[0072] S6. Fill the titanium dioxide slurry on the four sides and the top of the third finished product structure by injection molding, and press it into shape by a hot press.

[0073] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention and are not intended to limit the embodiments of the present invention. A person skilled in the art would be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is not necessary and impossible to enumerate all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the claims of the present invention.

Claims

1. An inductor structure, characterized in that: include: Insulating bottom layer (100); An inductor body (200) is arranged on the insulating bottom layer (100), and the size of the insulating bottom layer (100) matches the size of the bottom surface of the inductor body (200); A coil (300) is wound around the inductor body (200), and two terminals of the coil (300) are folded to the bottom surface of the insulating bottom layer (100); A covering body (400) is wrapped around the four sides and the top of the inductor body (200) and the coil (300) through a hot pressing process; The insulating coating layer (500) is wrapped around the four sides and the top of the coating body (400).

2. The inductor structure according to claim 1, characterized in that The inductor body (200) comprises a base plate (210) and a central column (220) arranged on the base plate (210); the base plate (210) is arranged on the insulating bottom layer (100); the coil (300) is wound around the central column (220), and two terminals of the coil (300) are folded to the bottom surface of the insulating bottom layer (100).

3. The inductor structure according to claim 2, characterized in that: One side of the bottom plate (210) is provided with two openings (211), the two openings (211) are respectively located at two ends of the side, and the two terminals are folded one by one through the two openings (211) to the bottom surface of the insulating bottom layer (100).

4. The inductor structure according to claim 1, wherein: The material of the insulating bottom layer (100) includes aluminum oxide or boron nitride.

5. The inductor structure according to claim 1, wherein: The material of the insulating coating layer (500) is insulating oxide or resin.

6. The inductor structure according to claim 5, characterized in that: When the material of the insulating coating layer (500) is an insulating oxide, the insulating oxide is titanium dioxide or magnesium oxide; when the material of the insulating coating layer (500) is a resin, the resin is an epoxy resin or a phenolic resin.

7. The inductor structure according to claim 1, characterized in that: The thickness of the insulating bottom layer (100) is greater than 0.1 mm.

8. The method for preparing an inductor structure according to any one of claims 1 to 7, wherein the steps include: Providing a mold and a hot press; Filling the mold with a layer of powder material used to prepare the insulating bottom layer (100); Filling the powder material with first magnetic powder and pressing and molding the powder material to obtain a first finished product structure of the insulating bottom layer (100) and the inductor body (200); Winding the coil (300) around the first finished structure to obtain a second finished structure; placing the second finished product structure into the hot press, filling the hot press with second magnetic powder, and pressing to form the coating (400), thereby forming a third finished product structure; The insulating coating layer (500) is formed by pressing on the four sides and the top of the third finished product structure, thereby completing the overall forming of the inductor structure.

9. The method for preparing an inductor structure according to claim 8, wherein: The material of the insulating coating layer (500) is an insulating oxide, which is filled on the four sides and the top of the third finished product structure by injection molding and is pressed into shape by the hot press; the material of the insulating coating layer (500) is a resin, which is formed on the four sides and the top of the third finished product structure by injection molding and is pressed into shape by the hot press.

10. The method for preparing an inductor structure according to claim 8, wherein: The first magnetic powder is ferrite magnetic powder or metal magnetic powder; and / or the second magnetic powder is ferrite magnetic powder or metal magnetic powder.

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