Wafer detection equipment and detection method

Abstract

The wafer detection equipment comprises a material box storing and taking device, a tray carrying device, a detection device and a mechanical arm device, the material box storing and taking device is provided with a containing cavity and a gradually-shrinking groove, so that a mechanical arm is more stable and accurate when loading and unloading wafers; the manipulator is connected with the manipulator body by adopting a stepped structure, so that collision with the air cylinder in the process of storing and taking the wafer can be avoided; and a conical structure is formed at the bottom of the tray, so that light beams irradiated by the detection device can cover the surface of the wafer more uniformly, light spots and shadows can be effectively avoided, and the detection precision is ensured. The detection equipment realizes a high-efficiency wafer detection process through parallel operation of front-end loading, middle-section detection and rear-end storage in combination with multi-tray circulating movement driven by a chain.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing, and in particular to a wafer detection device and a detection method. Background Art

[0002] During the wafer production process, inspection equipment must accurately identify defects such as surface scratches, edge chips, and internal impurities. Traditionally, wafer cassettes often utilize fixed-size grooves, which can easily cause different-sized wafers to rub against the groove openings during storage and retrieval, creating a risk of scratches. Existing inspection equipment also relies on a single light source angle, making it difficult to simultaneously image defects on the wafer surface, edges, and internal surfaces, leading to high rates of missed or false detections. Summary of the Invention

[0003] The technical problem to be solved by the embodiments of the present invention is to provide a wafer detection device and a detection method to solve the problems of wafer damage, low efficiency and insufficient detection accuracy in traditional technologies.

[0004] In order to solve the above technical problems, the embodiment of the present invention proposes a wafer detection device, comprising The material box storage and retrieval device includes a base, a mounting plate, and a material bin. The material bin is provided with symmetrical tapered grooves, the opening distance of the grooves being less than the wafer diameter and the bottom distance being greater than the wafer diameter (to avoid collision and friction during the wafer advance and retreat, ensuring smooth entry and exit; and can be adapted to store wafers of various specifications and sizes). An open accommodating cavity is provided at the rear of the material bin, and the horizontal distance of the opening is greater than the width of the external robot (to avoid collision and friction during the robot advance and retreat, ensuring smooth entry and exit); The carrying tray device includes a main body and a support portion, wherein the main body is provided with a circular hollow hole, and the support portion surrounds the edge of the hollow hole to form an avoidance channel, wherein the width of the avoidance channel is greater than or equal to the width of the manipulator body, and the height difference between the bottom of the groove and the step surface is greater than the height value of the manipulator bearing portion; The detection device includes a frame, a light source assembly and a controller. The light source assembly includes a fan-shaped plate and a multi-angle light bar. The hollow hole is a circular hole with a diameter gradually increasing from the bottom to the top. The corresponding position of the support part is made of transparent material. A robotic arm device, comprising a three-axis robotic arm and a robotic arm, wherein the robotic arm is provided with two sets of carrying steps of different heights, respectively adapted to wafers of different sizes; The equipment fixes the tray with a cylinder, the first robot takes and places the wafer from the material box to the tray, the second robot takes and places the wafer from the tray to the material box, the middle section detection device performs multi-angle time-sharing fill light and photography on the wafer, and the tray is driven by chains and guide rails to move to the next workstation for cyclic operation.

[0005] Furthermore, the slope angle of the tapered groove is 2° to 30°, the bottom arc radius is 0.5-10 mm, and the difference in distance between the two groove openings and the bottom at the same horizontal position is greater than the difference in diameter of the first wafer and the second wafer.

[0006] Furthermore, the inner step of the support portion of the transport tray device forms a concentric arc that matches the periphery of the wafer, and the inner wall of the hollow hole extends to form a guide surface, and the same height line of the guide surface is a concentric arc.

[0007] Furthermore, the first light bar of the light source assembly is at an angle of 10° to 30° to the horizontal plane, the second light bar is at an angle of 40° to 70° to the horizontal plane, and the third light bar illuminates the wafer vertically. The controller lights up the light bars in sequence and synchronously triggers the camera to shoot.

[0008] Furthermore, a fourth supporting step is provided at the base of the first pedal of the manipulator, and a third supporting step is provided in the middle. A telescopic structure is formed between the third supporting step and the fourth supporting step to accommodate wafers of different sizes.

[0009] Furthermore, the first light bar and the second light bar are symmetrically fixed to the outer edge of the fan-shaped plate of the detection device, and the angle of the light bar is adjusted by the third connecting plate, and the curvature of the horizontal plate of the third connecting plate matches the fan-shaped plate.

[0010] The present application also provides a wafer inspection method, comprising the following steps: Synchronous operation steps: The first robot sequentially removes wafers from the first cassette and places them in rows on the first tray in descending order. The second camera of the re-inspection device moves in three dimensions to inspect the wafers on the second tray. The second robot sequentially removes wafers from the third tray in descending order and places them in the second cassette. Initial inspection step: The light source component of the initial inspection device lights up the corresponding light bar according to the predetermined timing, and the camera takes pictures of the wafer from multiple angles and in different time periods; Loop steps: Repeat the above steps until all wafers are inspected and sorted.

[0011] Furthermore, in the initial inspection step, the first light bar illuminates the wafer surface at 10° to 30°, the second light bar illuminates the edge at 40° to 70°, and the third light bar penetrates the wafer vertically. The camera takes images under the three light sources in turn and cross-covers to analyze defects.

[0012] Furthermore, when the manipulator (including the first manipulator and / or the second manipulator) takes and places the wafer, the spacing between the supporting steps is adjusted through the telescopic structure so that the periphery of the wafer fits with the tread and the kick plate to avoid scratches.

[0013] Furthermore, during the movement of the pallet (including the first pallet and / or the second pallet), the avoidance channel is clearance-matched with the robot body, and a transparent support surface is provided to reduce interference from light source shadows.

[0014] The embodiment of the present invention proposes a wafer detection device and a detection method, which include a material box storage and retrieval device, a carrying tray device, a detection device and a robot device.

[0015] Beneficial effects of this application: 1. The tapered groove opening spacing is smaller than the wafer diameter, and the bottom spacing is larger than the wafer diameter. Combined with the inclined angle and curved bottom surface, the wafer will not touch the groove during access, and the wafer only contacts the groove through the edge, greatly reducing friction damage during access.

[0016] 2. The width of the avoidance channel is adapted to the robot body. The height difference between the bottom of the groove and the step surface is greater than the height of the robot's bearing part, ensuring interference-free operation of the robot. The transparent support surface reduces the interference of light source shadows and improves image acquisition quality.

[0017] 3. The bottom of the tray adopts a tapered structure with a gradually increasing diameter, so that the light source emitted by the detection device can not only distribute the light evenly, but also effectively avoid light spots and shadows. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a front structural schematic diagram of an embodiment of the present invention.

[0019] Figure 2 It is a schematic cross-sectional view of the overall structure of an embodiment of the present invention.

[0020] Figure 3 It is a schematic structural diagram of a material storage and access box device according to an embodiment of the present invention.

[0021] Figure 4 It is a structural schematic diagram of a carrying tray device according to an embodiment of the present invention.

[0022] Figure 5 It is a structural diagram of a detection device according to an embodiment of the present invention.

[0023] Figure 6 yes Figure 5 Schematic diagram of the structure of the light source component in the detection device.

[0024] Figure 7 yes Figure 6 Schematic diagram of the structure of the third light bar in the light source assembly.

[0025] Figure 8 It is a structural schematic diagram of a manipulator device according to an embodiment of the present invention.

[0026] Figure 9 yes Figure 8Schematic diagram of the structure of the manipulator body in the manipulator device.

[0027] Explanation of Figure Numbers Material storage and access device 1 Base 11 Mounting plate 12 Silo 13 Carrying tray device 2 Main body 21 Support portion 22 Detection device 3 Rack 31 Light source assembly 32 Sector plate 321 First Light Bar 322 Second light bar 323 Third light bar 324 Connecting plate 325 Robotic device 4 Three-axis robotic arm 41 Robot 42 First bearing step 421 Second bearing step 422 The third bearing step 423 Fourth bearing step 424 Transmission 5 DETAILED DESCRIPTION

[0028] It should be noted that, unless there is a conflict, the embodiments in this application and the features in the embodiments can be combined with each other. The present invention is further described in detail below with reference to the drawings and specific embodiments.

[0029] In the embodiments of the present invention, if there are directional indications (such as up, down, left, right, front, back, etc.), they are only used to explain the relative position relationship and movement status of the various components under a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0030] In addition, the terms "first," "second," and so on, used in this disclosure are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features being referred to. Therefore, features specified as "first" or "second" may explicitly or implicitly include at least one of these features.

[0031] Please refer to Figures 1 to 9 , the present invention provides the following embodiments. Example 1

[0032] The present invention provides a wafer detection device, including a cabinet, in which a material storage and access box device 1 is arranged. The material storage and access box device 1 includes a base 11, a mounting plate 12 and a material bin 13. The base 11 is square, and waist-shaped holes are opened at the four corners. The long axis direction of the waist-shaped holes is parallel to the preset adjustment direction of the detection device. Bolts are passed through the waist-shaped holes. When the bolts are pre-tightened, the mounting plate 12 is allowed to slide and adjust along the long axis direction of the waist-shaped holes. When the bolts are pre-tightened, the mounting plate 12 is fixed to the detection device. A mounting plate 12 is fixedly provided on the top surface of the base 11, and a silo 13 for placing wafers is fixed on the mounting plate 12. A plurality of pairs of tapered grooves are relatively opened in the silo 13. The tapered groove is a horizontally symmetrical structure in which the opening gradually narrows inward from the inner wall. The opening height of the tapered groove is greater than the thickness of the wafer, so that the wafer avoids contact with the opening during the access process, reduces friction damage, and facilitates smooth access of the wafer. For wafers of a single model size, the spacing between the openings of the two tapered grooves on the same horizontal plane is less than the diameter of the wafer, and the spacing at the bottom is greater than the diameter of the wafer, so that the wafer can be stably placed in the groove, ensuring that it is firmly placed in the tapered groove to avoid sliding. Preferably, the tapered groove of the present invention can adapt to wafers of two models and sizes, and the difference in the spacing between the openings and the bottoms of the two grooves at the same horizontal position is greater than the difference in the diameters of the first wafer and the second wafer, which has a strong versatility. A accommodating cavity is further provided at the rear of the silo 13. The accommodating cavity is a gradually narrowing cavity structure formed by the silo 13 extending inward. An opening having a width for accommodating the robot 42 is provided on the side away from the wafer access, forming a cavity structure that is transparent on both sides, so that the robot 42 will not touch the wafer when accessing the wafer, thereby ensuring the safety and stability of the operation.

[0033] The wafer inspection equipment also includes a carrier tray device 2, including a main body 21 and a support portion 22. The main body 21 is a rectangular structure, preferably a square. A number of regularly arranged hollow holes are provided on the main body 21 for placing wafers to be stored. All hollow holes have the same size and shape. The support portions 22 are arranged at the four corners of the main body 21 and surround the edges of the hollow holes. Avoidance channels are formed between adjacent support portions 22 to facilitate the manipulator 42 to flexibly grasp and place wafers. In the main body 21 with multiple hollow holes, polygonal support portions 22 with arc-shaped edges are formed between the regularly arranged hollow holes. In the avoidance channels that are continuous on the same axis, the width of the avoidance channel is greater than the width of the manipulator 42 body, so that the manipulator 42 and the avoidance channel can achieve clearance fit, thereby improving access efficiency. The inner edge of the support part 22 is also provided with steps. The arcs formed by the risers corresponding to these steps are concentric arcs, which can closely match the circular side edges of the wafer to be placed, ensuring that the wafer is stably placed on the pallet. The step surface height is higher than the bottom of the groove, so that the height difference from the bottom of the groove to the step surface is also greater than the height value of the supporting part of the robot 42. This ensures that the robot 42 can flexibly put down the wafer and return it after it is transported into place.

[0034] The wafer inspection equipment also includes an inspection device 3, which also includes a frame 31, a light source assembly 32, and a controller. The light source assembly 32 includes two symmetrical fan-shaped plates 321 and a multi-angle light bar located on the fan-shaped plates 321. The multi-angle light bar is a combination of multiple light bars with different inclinations. The multi-angle light bars are a first light bar 322 and a second light bar 323 located on the frame 31, and a third light bar 324 in the transmission device 5 at the bottom of the frame 31. The ends of the first light bar 322 and the second light bar 323 are distributed in a fan shape on the fan-shaped plates 321. The first light bar 322 and the second light bar 323 are two light bars symmetrically arranged on the fan-shaped plates 321. In the carrier tray device 2, the diameter of the hollow hole gradually increases from top to bottom, forming a tapered structure. This structure helps to reduce the shadow effect caused by the light source from below, thereby improving the accuracy of subsequent processing. The first and second light bars 322, 323 above the carrier tray assembly 2 are tilted at a preset angle to evenly illuminate the wafer surface. Simultaneously, the light source of the third light bar 324 below illuminates the bottom of the wafer vertically through a hollow hole. The tapered structure of the hollow hole not only evenly distributes the light but also effectively avoids light spots and shadows, ensuring detection accuracy. In another embodiment, the support surface (i.e., the step tread) of the support portion 22 is made of a transparent material to prevent light source shadows from interfering with the detection process while facilitating unimpeded light penetration, thereby improving detection effectiveness.

[0035] The wafer inspection equipment also includes a manipulator device 4, which includes a three-axis robotic arm 41 and a manipulator 42. The manipulator 42 has a stepped structure and is provided with two sets of load-bearing steps of different heights. Specifically, first and second load-bearing steps 422 of different heights are provided at the ends of the manipulator, and gradually decrease in height toward the root. A third load-bearing step 423 corresponding to the height of the second load-bearing step 422 is provided in the middle of the manipulator, and a fourth load-bearing step 424 corresponding to the height of the first load-bearing step 421 is provided at the root of the manipulator. These steps form two sets of load-bearing steps with corresponding heights and curvatures that match the circumference of the wafer, thereby enabling the loading and transport of two different sizes of glass wafers. The manipulator 42 can adapt to glass wafers of various sizes and can complete the handling task of glass wafers of different sizes without replacement, greatly improving work efficiency.

[0036] In the present invention, the tray for loading wafers is fixed on the transmission device 5. When the tray moves to the detection position, the transmission device 5 stops moving and is locked by the cylinder to ensure that the wafer remains stable during the detection process. At this time, there are three trays on the conveyor belt on the upper surface of the transmission device 5 at the same time. The first tray at the front section takes out the wafers in the rear material box through the first manipulator and places them on the first tray. The second tray at the middle section is inspected at the corresponding re-inspection camera and the inspection is completed through the integrated light source and camera. The third tray at the rear section takes out the wafers that have been inspected from the tray through the second manipulator and stores them in the material box. It is worth noting that during the operation of the transmission device 5, after the first tray is loaded with wafers, the first tray will move with the wafers along the conveyor belt to the detection device 3. The detection device 3 will detect the wafers in a dynamic state according to the preset transmission speed and controller. The detection scheme combining dynamic and static is adopted, which has the technical effect of ingenious design of detection process and high detection efficiency. Example 2

[0037] like Figure 3 As shown, based on the first embodiment, the tapered groove is a structure that is wide on the outside and narrow on the inside. The height of the opening is greater than the height of the inside, and the inclination angle of the bevel is 2° to 30°. The bottom of the corresponding opening forms an arc surface through the upper and lower bevels. The radius of the arc surface is 0.5MM-10MM, so that the wafer avoids direct contact when entering the groove, so that only the circumferential edge of the wafer is in contact with the groove, reducing the contact surface between the wafer and the tapered groove, and effectively reducing the risk of wear of the wafer during storage and transportation. The first wafer and the second wafer are wafers of different diameters, such as 10-inch and 6-inch wafers. The difference between the spacing between the two groove openings and the spacing between the two bottoms at the same horizontal position is greater than the diameter difference between the 10-inch and 6-inch wafers, thereby ensuring that wafers of different sizes can be placed firmly, avoiding the problem of unstable placement due to size differences, and further improving the safety of storage and retrieval. Example 3

[0038] like Figure 4 As shown, based on the first embodiment, the inner side of the step on the support portion 22 is an arc. The inner sides of the steps on the multiple support portions 22 form a circle with a diameter greater than the hollow hole. This circle is concentric with the hollow hole and has a diameter greater than the wafer diameter and matches the wafer circumference. The riser of the step is greater than the thickness of the wafer. It extends from the top of the riser toward the top surface of the support portion 22, gradually tilting outward to form a guide surface. The same height lines of all guide surfaces lie in the same plane and are distributed in concentric arcs. This not only prevents friction and collisions caused by the wafer during placement, but also ensures that the guide surface can slide smoothly into the predetermined position in the event of inaccurate positioning. Example 4

[0039] like Figure 5-7 As shown, based on the first embodiment, the first light bar 322 of the light source assembly 32 is tilted at an angle of 10° to 30° with the horizontal plane. By adjusting the installation angle of the first light bar 322, its light is illuminated at a smaller angle on the surface of the glass plate, giving priority to detecting defects such as scratches and shallow bubbles. Preferably, the tilt angle of the first light bar 322 is set to 20°, and the angle is locked by the arc-shaped connection structure at the edge of the fan-shaped plate 321. The second light bar 323 is tilted at an angle of 40° to 70° with the horizontal plane. The second light bar 323 is installed at a larger tilt angle to enhance the imaging contrast of pits and cracks on the edge of the glass plate. Preferably, the tilt angle of the second light bar 323 is set to 55°, and the angle is adjusted by a rotatable connector to meet the detection needs of glass with different surface roughness. Furthermore, the third light bar 324 of the light source assembly 32 illuminates the wafer perpendicularly. The controller illuminates the corresponding light bars in a timed sequence, triggering the camera to capture images simultaneously. Depending on the angle of illumination, the camera captures more detailed images, effectively improving the accuracy and efficiency of defect detection. The first light bar uses a 10° to 30° tilt to detect surface scratches, the second light bar uses a 40° to 70° tilt to enhance the contrast of edge defects, and the third light bar penetrates vertically to identify internal defects. Combined with a cross-coverage analysis algorithm, this significantly improves detection accuracy. Example 5

[0040] like Figure 8-9 As shown, based on the first embodiment, a manipulator 42 is rotatably connected to the rotating axis of a three-axis manipulator 41. The manipulator 42 has a step-shaped structure with a bearing step, which is used for direct contact with wafers for operation. The upper tread and kicker surfaces of the manipulator 42 form an inverted "L" shape. During the specific operation of the manipulator 42, the rear claw of the cylinder fixed transmission device 5 will be closer to the tray. The step-shaped structure of the manipulator 42 reserves space above the cylinder, avoiding interference with the cylinder and ensuring flexible operation. Preferably, the manipulator has a fourth bearing step 424 at the base of the first tread and a third bearing step 423 in the middle. The third and fourth bearing steps 423 and 424 are connected by a telescopic structure to accommodate wafers of different sizes. Preferably, the telescopic structure is achieved by providing a slide rail at the bottom of the manipulator between the third and fourth bearing steps 423 and 424. The manipulator body of the first and second bearing steps 422 overlaps with the slide rail, achieving flexible adjustment of the bearing area to meet the bearing requirements of wafers of different sizes. Example 6

[0041] like Figure 6As shown, on the basis of Example 1, the connecting plate 325 includes a vertical plate and a horizontal plate, and the vertical plate is provided with two pairs of symmetrical screw holes, which are fixed to the two ends of the first light bar 322 and the second light bar 323 by screws. The first light bar 322 and the second light bar 323 are paired and symmetrically arranged, and the horizontal plate is perpendicular to the vertical plate and extends the side edge of the fan-shaped plate 321 from the center position of the vertical plate. The horizontal plate is curved and matches the curvature of the side edge of the fan-shaped plate 321. The horizontal plate is provided with a waist-shaped hole along the curvature direction of the fan-shaped plate 321, and the fan-shaped plate 321 is provided with a number of connecting holes along the curvature direction. The horizontal plate and the fan-shaped plate 321 are connected by screws, and different connecting holes are connected in the waist-shaped holes by screws to realize step-by-step adjustment of the illumination angle, thereby adjusting the angle and spacing of the first light bar 322 and the second light bar 323 to meet different detection requirements.

[0042] The present application does not limit the size of the tray hollow holes and the corresponding wafers. When wafers of different sizes enter the detection device 3, the light source assembly adjusts the illumination angle of the first light bar 322 or the second light bar 323 through the connecting plate, so as to achieve the corresponding angle of light source illumination for wafers of different sizes, and avoid the fixed light source angle causing missed detection of wafers of different specifications. In particular, in dynamic detection, the fixed angle of the light source has a more serious impact at the same transmission speed. Therefore, placing wafers of any specifications on a tray of a certain size places more stringent requirements on the light source assembly 32. Example 7

[0043] Based on the first embodiment, a wafer detection solution is provided, including the following steps: Synchronous operation steps: The first robot sequentially removes wafers from the first cassette and places them in rows on the first tray in descending order. The second camera of the re-inspection device moves in three dimensions to inspect the wafers on the second tray. The second robot sequentially removes wafers from the third tray in descending order and places them in the second cassette. This synchronized operation allows multiple processes to be completed simultaneously, significantly improving overall work efficiency. Initial inspection step: The light source component of the initial inspection device lights up the corresponding light bar according to the predetermined timing, and the camera takes pictures of the wafer from multiple angles and in different time periods; Loop steps: Repeat the above steps until all wafers are inspected and sorted.

[0044] In the above detection scheme, a preparation step is also included before the synchronization operation step; In the preparation step, the cylinder on the wafer inspection equipment locks the transmission device 5, the first manipulator takes out the wafer from the material box and places it on the third tray in front of it, and starts the conveyor belt to drive the third tray to move. During the movement, the third tray passes through the initial inspection device to complete the initial inspection and stops at the re-inspection device. The cylinder on the wafer inspection equipment locks the transmission device 5, and the third tray starts re-inspection at this time. The second tray starts loading wafers synchronously. The second and third trays complete the operation at the same time. The cylinder unlocks the conveyor belt and starts running. The first tray appears and stops at the first manipulator. The cylinder is locked. The first tray loads the wafers, the second tray undergoes re-inspection, and the third tray takes out the inspected wafers through the second manipulator and stores them in the material box, ensuring that the three trays are completed at the same time. Throughout the process, the working efficiency of the wafer inspection equipment has been significantly improved, ensuring the consistency and efficiency of the inspection process.

[0045] In the synchronous operation step, the working order of the wafer inspection equipment is: Figure 1 As shown, the process from left to right is the first robot placing the wafer, initial inspection, re-inspection, and the second robot removing the wafer. The wafer inspection equipment can simultaneously inspect multiple trays loaded with wafers, and the conveyor belt length is adjusted according to the process position. The wafer inspection equipment can cycle through three trays simultaneously. The first robot places the wafer on the corresponding tray, while the re-inspection device also inspects the wafer. The second robot removes the wafer from the corresponding tray, and the conveyor belt moves forward one station. The fourth tray appears and begins loading wafers until the first tray reappears and begins loading wafers, and the cycle continues. Specifically, the first manipulator places wafers from the side close to the second tray to the side away from the second tray, and from the side away from the first manipulator to the side close to the first manipulator. The second tray is located at the re-inspection device in the middle section of the transmission device 5. The re-inspection device integrates a camera and a light source to move in three dimensions to detect the wafers on the second tray. At the same time, at the end opposite to the first tray and the first manipulator, the second manipulator takes out the wafers on the second tray in the order of taking them out from the side close to the second tray to the side away from the second tray, and from the side close to the second manipulator to the side away from the second manipulator, and finally puts them into the second material box in sequence. This enables the wafer inspection equipment to perform comprehensive inspections on the wafers on the three trays at the same time, achieving a highly efficient and accurate inspection process.

[0046] In the initial inspection step, the cylinder first releases the transmission device 5, so that the tray will carry the wafer along the conveyor belt to the detection device 3. The detection device 3 will be adjusted according to the preset transmission speed and controller to detect the wafer in a dynamic state. When the first row of wafers close to the detection device 3 enters the light source assembly 32, the light source assembly 32 illuminates the wafer according to the preset timing. When the first row of wafers is exposed in the gap of the light source assembly 32, the camera will take pictures. Within a certain period of time, the three groups of light sources will illuminate in turn and match the transmission speed. The camera will continue to take pictures of the wafers through the gap. When the last row of wafers passes, the preliminary inspection is completed. This allows the wafer to be tested dynamically even when it is in motion, thereby improving the detection efficiency.

[0047] During the cycle, each time a predetermined station is completed, the cylinder is unlocked and the conveyor belt on the transmission device 5 is driven by the chain along the guide rail to the next station. When a tray completes the entire inspection process, the tray continues to move forward with the transmission device 5, ready to receive a new wafer for the next round of inspection, until all wafers in the magazine or target are inspected. Example 8

[0048] On the basis of Example 7, in the initial inspection step, when the first row of wafers enters the light source assembly 32, the first light bar 322 obliquely illuminates the wafer surface at a low angle of 10° to 30° to highlight surface scratches or particle defects, and the camera takes pictures simultaneously. After the shooting is completed, according to the transmission speed, the second row of wafers enters the light source assembly 32, and the second light bar 323 illuminates the edge area of the wafer at a medium to high angle of 40° to 70° to detect edge chipping or uneven coating defects. The third light bar 324 uses vertical penetrating lighting to identify cracks or impurities inside the wafer. The camera takes images under three light sources in sequence and transmits them to the controller in real time for cross-coverage analysis. The defect type and location are comprehensively determined by combining the illumination characteristics of different angles to improve the detection accuracy. It is worth noting that the above-mentioned cross-fusion analysis is a detection method that uses one or more multi-angle light source imaging and image fusion algorithms. The present application takes wafer images in a time sequence at different illumination angles, and then uses algorithm cross-comparison and superposition analysis to comprehensively determine the defect type and location.

[0049] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A wafer inspection device, characterized in that: include: The material box storage and retrieval device includes a base, a mounting plate and a material bin. The material bin is provided with a symmetrical tapered groove, the opening distance of the groove is less than the diameter of the wafer, and the bottom distance is greater than the diameter of the wafer. An open accommodating cavity is provided at the rear of the material bin, and the horizontal distance of the opening is greater than the width of the external manipulator; The carrying tray device includes a main body and a support portion, wherein the main body has a circular hollow hole, and the support portion surrounds the edge of the hollow hole to form an avoidance channel, wherein the width of the avoidance channel is greater than or equal to the width of the manipulator body, and the height difference between the bottom of the groove and the step surface is greater than the height value of the manipulator bearing portion; The detection device includes a frame, a light source assembly and a controller. The light source assembly includes a fan-shaped plate and a multi-angle light bar. The hollow hole is a circular hole with a diameter gradually increasing from the bottom to the top. The corresponding position of the support part is made of transparent material. A robotic arm device, comprising a three-axis robotic arm and a robotic arm, wherein the robotic arm is provided with two sets of carrying steps of different heights, respectively adapted to wafers of different sizes; The equipment fixes the tray with a cylinder, the first robot takes and places the wafer from the material box to the tray, the second robot takes and places the wafer from the tray to the material box, the middle section detection device performs multi-angle time-sharing fill light and photography on the wafer, and the tray is driven by chains and guide rails to move to the next workstation for cyclic operation.

2. The wafer inspection device according to claim 1, characterized in that: The slope angle of the tapered groove is 2° to 30°, the bottom arc radius is 0.5-10mm, and the difference in distance between the two groove openings and the bottom at the same horizontal position is greater than the difference in diameter between the first wafer and the second wafer.

3. The wafer inspection device according to claim 1, wherein: The inner step of the support portion of the transport tray device forms a concentric arc, matching the periphery of the wafer, and the inner wall of the hollow hole extends to form a guide surface, and the same height line of the guide surface is a concentric arc.

4. The wafer inspection device according to claim 1, wherein: The first light bar of the light source assembly is at an angle of 10° to 30° to the horizontal plane, the second light bar is at an angle of 40° to 70° to the horizontal plane, and the third light bar illuminates the wafer vertically. The controller lights up the light bars in sequence and synchronously triggers the camera to shoot.

5. The wafer inspection equipment according to claim 1, characterized in that: A fourth supporting step is provided at the root of the first pedal of the manipulator, and a third supporting step is provided in the middle. A telescopic structure is formed between the third supporting step and the fourth supporting step to accommodate wafers of different sizes.

6. The wafer inspection device according to claim 1, characterized in that: The first light bar and the second light bar are symmetrically fixed on the outer edge of the fan-shaped plate of the detection device, and the angle of the light bar is adjusted by the connecting plate, and the curvature of the horizontal plate of the connecting plate matches the fan-shaped plate.

7. A wafer inspection method, based on the device according to any one of claims 1 to 6, characterized in that: The method comprises the following steps: Synchronous operation steps: The cylinder extends the claw to fix the tray, the first robot sequentially removes wafers from the first cassette and places them on the first tray in order from far to near. The second camera of the re-inspection device moves in three dimensions to inspect the wafers on the second tray. The second robot sequentially removes wafers from the third tray in order from far to near and places them in the second cassette. Initial inspection step: The claws retract and the tray is driven by a chain along the guide rail to the next station. During the movement, the light source component of the initial inspection device lights up the corresponding light bars according to a predetermined timing, and the camera takes multi-angle and time-sharing photos of the wafer; Loop steps: Repeat the above steps until all wafers are inspected and sorted.

8. The method according to claim 7, characterized in that During the initial inspection step, the first light bar illuminates the wafer surface at 10° to 30°, the second light bar illuminates the edge at 40° to 70°, and the third light bar penetrates the wafer vertically. The camera takes images under the three light sources in turn and cross-covers them to analyze defects.

9. The method according to claim 7, characterized in that When the robot takes or places a wafer, the spacing between the bearing steps is adjusted by the telescopic structure so that the periphery of the wafer fits with the tread and the kick plate to avoid scratches.

10. The method according to claim 7, characterized in that When the robot takes and places wafers, the avoidance channel is coordinated with the gap between the robot body and a transparent support surface is provided to reduce the interference of light source shadows.

Images