Reflow soldering device in tire pressure sensor chip processing SMT patch

Abstract

The present application belongs to the technical field of electronic device packaging, in particular to a reflow soldering device in SMT patch processing of tire pressure sensor chip, which comprises four mutually symmetrical main support frames, a fixed support plate with an overall groove-shaped structure with an upward opening is fixed between the four main support frames, and a conveying mechanism is arranged in the middle of the upper surface of the fixed support plate, the conveying mechanism comprises conveying chains that synchronously advance and are of the same height on both sides of the device. When using the present application, when the long pin at a certain position needs to be repaired during welding, only need to set the position coordinates in advance, when the PCB body runs above the tin repair mechanism, the spout inner tube will be quickly brought to the position of each pin, and then liquid tin paste is sprayed to the pin position, so as to stick more tin paste to the pin to form effective welding, thereby ensuring one-time welding forming and improving welding efficiency.

Description

Reflow soldering equipment in SMT assembly of tire pressure sensor chip processing Technical Field

[0001] This invention relates to the field of electronic device packaging technology, and more particularly to a reflow soldering apparatus for SMT assembly of tire pressure sensor chips. Background Technology

[0002] Surface mount reflow soldering is a common soldering technique used in electronic packaging, especially in surface mount technology (SMT). It connects electronic components to a printed circuit board (PCB) by melting solder, and is widely used in the production of various electronic devices. First, solder paste (composed of solder powder and flux) is applied to the pads on the PCB. The solder paste can be evenly spread on the pads using screen printing or other methods. Then, an automated pick-and-place machine accurately places the electronic components (usually surface mount devices, SMD) onto the solder paste. Each component's pin makes contact with the solder paste, forming a temporary contact. The PCB is then placed in a reflow oven, where heating melts the solder paste, and then cooling it to form solder joints that secure the component pins to the pads.

[0003] According to our research, existing soldering methods involve first applying solder paste to the PCB board, and then directly attaching electronic components to the corresponding points. However, during the soldering process, some components may penetrate the solder holes, inevitably leading to excessively melted solder paste being guided directly from the holes until it leaks out, resulting in cold solder joints. This requires subsequent resoldering. Therefore, we propose a new type of reflow soldering device that can prevent cold solder joints. Summary of the Invention

[0004] To address the technical problem of cold solder joints easily occurring when reflow soldering points with long antennae in existing technologies, the present invention adopts the following technical solution:

[0005] The reflow soldering device for SMT chip fabrication of tire pressure sensor components includes four symmetrical main support frames. A fixed support plate with an upward-facing, groove-like structure is fixed between the four main support frames. A conveying mechanism is located in the middle of the upper surface of the fixed support plate. The conveying mechanism includes conveyor chains that advance synchronously and at the same height on both sides of the device. Symmetrical clamping mechanisms at the same height are reserved on opposite sides of two conveyor chains. Two clamping mechanisms at the same height form a group and clamp the same PCB board body. A rectangular hole is opened in the middle of the bottom of the fixed support plate, and a flat... The planar positioning mechanism has a support column on its upper surface that can quickly position it to any position on the horizontal plane; a support block is fixed to the top of the support column, and a solder replenishing mechanism is fixed to the top of the support block; the solder replenishing mechanism includes a molten solder barrel with an overall cylindrical cavity structure, a vertical tube communicating with the molten solder barrel is reserved at the top of the molten solder barrel, a piston barrel is inserted into the outer circumference of the molten solder barrel, and the bottom of the piston barrel faces the inside of the molten solder barrel, and two one-way valves in opposite directions are inserted into the bottom of the piston barrel, and the outlet of one of the one-way valves is connected to a jetting inner tube that extends out of the vertical tube near the lower pin of the PCB board body.

[0006] A further feature of this invention is that a top cover with a downward-facing, groove-shaped structure is fixed between the tops of the four main support frames. A heating mechanism and a cooling fan are arranged in the middle of the top cover. A combined air duct aligned with the direction of the PCB board body is fixed in the middle of the lower surface of the top cover. The air outlets of the heating mechanism and the cooling fan are connected to the air inlet of the combined air duct through connecting pipes. The combined air duct, heating mechanism, and cooling fan divide the device into a preheating section, a high-heat section, and a cooling section, which is beneficial for the efficient fusion of solder paste and electronic components.

[0007] A further feature of the present invention is that the solder replenishing mechanism further includes a supporting slide, the lower surface of the molten solder bucket is fixed to the upper surface of the supporting slide; a motor frame is fixed to the upper surface of the supporting slide near the opening of the piston bucket, and a reduction motor is fixed to the top of the motor frame; a rotating wheel is fixed to the top of the output shaft of the reduction motor, and a connecting rod is rotatably connected to the disc surface of the rotating wheel near its circumferential edge; a piston disc is slidably connected inside the piston bucket, and a hinge pin is fixed to the middle of the piston disc on the side away from the bottom of the bucket, and the end of the hinge pin is hinged to the other end of the connecting rod.

[0008] A further feature of this invention is that a hot-melting mechanism is provided at the bottom of the molten solder tub, and the hot-melting mechanism includes a heating ring with an annular structure that extends into the bottom of the molten solder tub and is close to the inner wall; the top of the support block has a T-shaped groove, and a boss slide member is slidably connected in the T-shaped groove; an electrically controlled positioning pin is embedded on the upper surface of the boss slide member, and the top end of the protruding shaft of the electrically controlled positioning pin is fixed to the bottom end of the support slide; by using the electrically controlled positioning pin in conjunction with a planar positioning mechanism capable of planar positioning, the top opening of the jetting inner tube can be quickly moved to the desired position, and the overflowing liquid solder paste can be applied to the pin. A repair weld is formed; and a threaded hole is opened in the middle of the front side of the boss slide. A T-shaped anti-detachment rod with a mushroom head structure is fixed on the side of the boss slide away from the threaded hole. A conical slip ring symmetrical to the mushroom head structure is slidably connected to the outer circumference of the T-shaped anti-detachment rod, and a return spring is fixed between the conical slip ring and the boss slide; a vertical anti-torsion sliding hole is fixed at the bottom of the T-shaped slide groove away from the threaded hole, and a backstop plate is slidably connected in the anti-torsion sliding hole. A clamping spring is fixed at the bottom end of the backstop plate, and a spring stop is fixed at the bottom end of the clamping spring. The spring stop is fixed on the vertical inner wall of the anti-torsion sliding hole.

[0009] A further feature of this invention is that the conveying mechanism includes fixed support plates that are fixed to the bottom of the fixed pallet groove near the center and are symmetrical to each other. A horizontal beam support plate is fixed to the top of the fixed support plate. Symmetrical strip-shaped side plates are fixed to the front and rear ends of the horizontal beam support plate. Two parallel drive shafts are provided at the ends of the two side plates, i.e., the loading and unloading ends of the device. Drive sprockets are fixed to the ends of the two drive shafts, and two conveying chains are respectively sleeved on four drive sprockets. A central section of the side plate near the front is embedded with… It has a sliding bearing, and a discharge rod is slidably inserted into the sliding bearing. The end of the discharge rod near the boss slide is fixed with a screw that matches the threaded hole. The upper cover has an inspection port diagonally above the support block, and a cover plate is provided at the inspection port. The upper surface of the solder molten barrel has a feeding port near the circumferential edge, and a plug is screwed into the feeding port. When the solder paste solution in the solder molten barrel is insufficient, simply insert the discharge rod and engage the screw with the threaded hole. Then, the solder replenishment mechanism can be dragged below the feeding port to add solder paste.

[0010] A further feature of the present invention is that a second rectangular hole, corresponding to the first rectangular hole, is opened in the middle of the crossbeam support plate directly above the first rectangular hole, and ball bearings are embedded in the lower surface of the support block near the four corners; this allows the support block to be positioned more smoothly and reduces frictional wear.

[0011] A further feature of this invention is that the clamping mechanism includes horizontal connecting strips fixed to two adjacent chain shafts of the conveyor chain, with the sides of the connecting strips sliding against side strips. A vertical grooved slide rail is fixed to the end of the connecting strip away from the conveyor chain, and spring baffles are fixed to the bottom of the groove near both ends. Compression springs are fixed to the opposite ends of the two spring baffles, and slider one and slider two are respectively fixed to the opposite ends of the two compression springs. Symmetrical cantilever rods are fixed to the sides of slider one and slider two away from the bottom of the groove. Symmetrical anti-derailment grooves are opened on the opposite sides of the two cantilever rods. Symmetrical L-shaped inner extension rods are slidably connected to the two anti-derailment grooves, and interlocking anti-slip pressure strips are fixed to the opposite ends of the two inner extension rods. With this configuration, the clamping mechanism can be adjusted arbitrarily within the width range of the PCB board body to clamp the target object.

[0012] A further feature of the present invention is that a positioning nut is embedded in the end of the groove bottom of each of the two cantilever rods away from the groove bottom, and a positioning bolt is screwed into the positioning nut, which can lock the position of the inner extension rod after positioning.

[0013] A further feature of this invention is that both slider one and slider two have roller grooves near the cantilever rod and near the four corners on the opposite side, and rollers are provided in the roller grooves; this can reduce frictional wear on the grooved slide rail.

[0014] A further feature of this invention is that heat-insulating plates are fixed to the lower surface of the upper cover near both ends, and a gap is left between the bottom end of the heat-insulating plate and the PCB board body and the upper surface of the cantilever rod. Soft curtains are provided on both sides of the heat-insulating plate, and the width and position of the soft curtains are adapted to the position of the grooved slide rail to reduce heat loss. Upward-curving shaft seats are provided at the four corners near the bottom of the front and rear sides of the fixed support plate, and the shaft seats are adapted to the shaft head of the transmission sprocket.

[0015] Compared with the prior art, the beneficial effects of this invention are as follows:

[0016] 1. By setting up a planar positioning mechanism and a solder replenishment mechanism that can quickly position the entire board, when a long pin needs to be re-soldered during soldering, the position coordinates are set in advance. When the PCB board moves above the solder replenishment mechanism, it will drive the inner tube to quickly reach each pin position and spray liquid solder paste onto the pin point to apply more solder paste to the pin and form an effective soldering machine. This can ensure one-time soldering and improve soldering efficiency.

[0017] 2. By using a geared motor and two one-way valves in opposite directions, liquid solder paste can be continuously sprayed from the top nozzle of the inner tube. This not only prevents the solder paste from solidifying in the inner tube, but also allows the protruding pins to be coated with liquid solder paste without touching the nozzle of the inner tube.

[0018] 3. With the help of the anti-reverse insert and T-shaped anti-detachment rod, when it is necessary to push the boss slide into the T-shaped slide groove and fix it, simply continue to push the boss slide until the mushroom head passes the anti-reverse insert and falls into the space between the mushroom head and the conical slip ring and gets stuck. If it is necessary to disassemble the boss slide for material addition or maintenance, simply continue to push it forward until the conical slip ring also passes the anti-reverse insert, and then pull the boss slide in the opposite direction. Attached Figure Description

[0019] Figure 1 is a schematic diagram of the overall structure of the present invention;

[0020] Figure 2 is a side view of the present invention;

[0021] Figure 3 is a schematic cross-sectional view of the structure along line AA in Figure 2 of this invention;

[0022] Figure 4 is an assembly diagram of the upper cover and heating mechanism in this invention;

[0023] Figure 5 is an assembly diagram of the conveyor bracket and conveyor chain in this invention;

[0024] Figure 6 is an exploded view of the clamping mechanism in this invention;

[0025] Figure 7 is a schematic diagram of the overall structure of the tin replenishment mechanism in this invention;

[0026] Figure 8 is a side view of the tin replenishment mechanism in this invention;

[0027] Figure 9 is a cross-sectional view along line BB in Figure 8 of this invention;

[0028] Figure 10 is a schematic diagram of the half-section three-dimensional structure of the molten solder bucket in this invention;

[0029] Figure 11 is a schematic diagram of the overall structure of the assembly position of the conical slip ring in this invention.

[0030] In the diagram: 1. Main support frame; 2. Shaft seat; 3. Transmission sprocket; 4. Fixed support plate; 401. Rectangular hole one; 5. Connecting strip; 6. Groove slide rail; 7. Clamping mechanism; 701. Slider one; 702. Slider two; 703. Compression spring; 704. Cantilever rod; 705. Anti-derailment groove; 706. Inner extension rod; 707. Anti-slip pressure strip; 8. Soft door curtain; 9. Heat shield; 10. Air cooler; 11. Cover plate; 12. Heating mechanism; 13. Top cover; 14. Conveyor chain; 15. Discharge rod; 16. Screw; 17. Support block; 171. Boss slide piece; 172. T-shaped slide groove; 173. T-shaped anti-detachment rod; 174. Anti-reverse insert plate; 175. Anti-torsion sliding hole; 176. Spring stop block; 177. Conical slip ring; 178. Return spring; 18. Fixed support plate; 19. Planar positioning mechanism; 191. Support column; 20. PCB board body; 21. Solder replenishment mechanism; 211. Support slide; 212. Gear motor; 213. Rotary wheel; 214. Piston barrel; 215. Melting solder barrel; 216. Inner jet tube; 217. Vertical tube; 218. Hot melt mechanism; 22. Side plate strip; 2201. Sliding bearing; 2202. Rectangular hole two; 23. Crossbeam support plate; 24. Air duct. Detailed Implementation

[0031] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0032] As shown in Figures 1 to 11, the reflow soldering device in SMT chip processing for tire pressure sensor includes four symmetrical main support frames 1. A fixed support plate 4 with an upward-facing, groove-like structure is fixed between the four main support frames 1. A conveying mechanism is located in the middle of the upper surface of the fixed support plate 4. The conveying mechanism includes conveyor chains 14 that advance synchronously and at the same height on both sides of the device. Symmetrical clamping mechanisms 7 at the same height are reserved on opposite sides of the two conveyor chains 14. The two clamping mechanisms 7 at the same height form a group and clamp the same PCB board body 20. A rectangular hole 401 is opened in the middle of the bottom of the fixed support plate 4. A planar positioning mechanism 19 is fixed below the rectangular hole 401 on the lower surface of the fixed support plate 4. A support column 191 capable of quickly positioning to any horizontal position is provided on the upper surface of the planar positioning mechanism 19. A support block 17 is fixed to the top of the support column 191, and a solder replenishing mechanism 21 is fixed to the top of the support block 17. The system includes a cylindrical hollow solder molten barrel 215. A vertical tube 217, connected to the top of the molten solder barrel 215, is pre-installed at the top. A piston barrel 214 is inserted into the outer circumference of the molten solder barrel 215, with its bottom facing inwards. Two one-way valves in opposite directions are inserted into the bottom of the piston barrel 214. One of the one-way valves has an outlet connected to a jetting inner tube 216 extending from the vertical tube 217 near the pins below the PCB board body 20. By setting a planar positioning mechanism 19 and a solder replenishment mechanism 21 for rapid overall positioning, when a long pin needs resoldering during soldering, the system only needs to pre-set the position coordinates. When the PCB board body 20 moves above the solder replenishment mechanism 21, it will drive the jetting inner tube 216 to quickly reach each pin position, then jet liquid solder paste onto the pin point to adhere more solder paste to the pin, forming an effective solder joint. This ensures one-time soldering and improves soldering efficiency.

[0033] As shown in Figures 1, 3, and 4, a top cover 13 with a downward-facing groove structure is fixed between the tops of the four main support frames 1. A heating mechanism 12 and a fan cooler 10 are arranged in the middle of the top cover 13. A combined air duct 24 with the same orientation as the PCB board body 20 is fixed in the middle of the lower surface of the top cover 13. The air outlets of the heating mechanism 12 and the fan cooler 10 are connected to the air inlet of the combined air duct 24 through connecting pipes. The combined air duct 24, the heating mechanism 12, and the fan cooler 10 divide the device into a preheating section, a high-heat section, and a cooling section, which is conducive to the efficient fusion of solder paste and electronic components.

[0034] As shown in Figures 7 to 11, the solder replenishment mechanism 21 also includes a support slide 211, and the lower surface of the molten solder bucket 215 is fixed to the upper surface of the support slide 211. A motor frame is fixed to the upper surface of the support slide 211 near the opening of the piston bucket 214, and a reduction motor 212 is fixed to the top of the motor frame. A rotating wheel 213 is fixed to the top of the output shaft of the reduction motor 212, and a connecting rod is rotatably connected to the disc surface of the rotating wheel 213 near the circumferential edge. A piston disc is slidably connected inside the piston bucket 214, and a hinge pin is fixed to the middle of the piston disc on the side away from the bottom of the bucket. The end of the hinge pin is hinged to the other end of the connecting rod. Through the reduction motor 212, in conjunction with two one-way valves in opposite directions, a continuous stream of liquid solder paste can be sprayed from the top opening of the inner tube 216. This not only prevents the solder paste from solidifying in the inner tube 216, but also allows the protruding pins to be coated with liquid solder paste without contacting the opening of the inner tube 216.

[0035] A hot-melting mechanism 218 is provided at the bottom of the molten solder tub 215, and the hot-melting mechanism 218 includes a heating ring with an annular structure that extends into the bottom of the molten solder tub 215 and is close to the inner wall; a T-shaped groove 172 is opened at the top of the support block 17, and a boss slide 171 is slidably connected in the T-shaped groove 172. An electrically controlled positioning pin is embedded on the upper surface of the boss slide 171, and the top end of the protruding shaft of the electrically controlled positioning pin is fixed to the bottom end of the support slide 211; the electrically controlled positioning pin can cooperate to enable The planar positioning mechanism 19, when combined, can quickly move the top opening of the inner tube 216 to the required position and apply the overflowing liquid solder paste to the pin to form a repair soldering. The boss slide 171 has a threaded hole in the center of its front side. A T-shaped anti-detachment rod 173 with a mushroom-head structure is fixed to the side of the boss slide 171 away from the threaded hole. A conical slip ring 177, symmetrical to the mushroom-head structure, is slidably connected to the outer circumference of the T-shaped anti-detachment rod 173. A return spring 178 is fixed between 177 and the boss slide 171; a vertical anti-torsion sliding hole 175 is fixed at the bottom of the T-shaped slide groove 172 away from the threaded hole, and a backstop plate 174 is slidably connected in the anti-torsion sliding hole 175. A clamping spring is fixed at the bottom of the backstop plate 174, and a spring stop 176 is fixed at the bottom of the clamping spring. The spring stop 176 is fixed on the vertical inner wall of the anti-torsion sliding hole 175; the backstop plate 174 and the T-shaped anti-detachment mechanism are used to achieve the desired effect. When it is necessary to push the boss slide 171 into the T-shaped slide groove 172 and fix it, simply push the boss slide 171 further until the mushroom head passes the anti-reverse plate 174 and falls into the space between the mushroom head and the conical slip ring 177 and gets stuck. If it is necessary to disassemble the boss slide 171 for material addition or maintenance, simply push it forward until the conical slip ring 177 also passes the anti-reverse plate 174, and then pull the boss slide 171 in the opposite direction.

[0036] As shown in Figures 2 to 6, the conveying mechanism also includes fixed support plates 18 that are fixed to the bottom of the fixed support plate 4 near the center and are symmetrical to each other. A horizontal beam support plate 23 is fixed to the top of the fixed support plate 18. Symmetrical strip-shaped side plates 22 are fixed to the front and rear ends of the beam support plate 23. Two parallel drive shafts are provided at the ends of the two side plates 22, i.e., the loading and unloading ends of the device. Drive sprockets 3 are fixed to the ends of the two drive shafts, and two conveying chains 14 are respectively sleeved on the four drive sprockets 3. A sliding bearing 2201 is embedded in the middle of the side plate 22 near the front. The 201 is equipped with a sliding ejector rod 15, and a screw 16 that matches the threaded hole is fixed at one end of the ejector rod 15 near the boss slide 171. The upper cover 13 has an inspection port at an angle above the support block 17, and a cover plate 11 is provided at the inspection port. The upper surface of the solder molten barrel 215 is provided with a feeding port near the circumferential edge, and a plug is screwed into the feeding port. With the ejector rod 15, when the solder paste solution in the solder molten barrel 215 is insufficient, simply insert the ejector rod 15 and engage the screw 16 with the threaded hole, and then drag the solder replenishment mechanism 21 below the feeding port to add solder paste.

[0037] As shown in Figures 3 and 5, the middle of the crossbeam support plate 23 is located directly above the rectangular hole 401, and a rectangular hole 2202 corresponding to the rectangular hole 401 is opened. Furthermore, the lower surface of the support block 17 is fitted with ball bearings near the four corners. This allows the support block 17 to be positioned more smoothly and reduces frictional wear.

[0038] As shown in Figures 4 and 6, the clamping mechanism 7 includes a horizontal connecting strip 5 fixed on two adjacent chain shafts of the conveyor chain 14. The side of the connecting strip 5 slides against the side strip 22. A vertical grooved slide rail 6 is fixed to the end of the connecting strip 5 away from the conveyor chain 14. Spring baffles are fixed to the bottom of the groove of the grooved slide rail 6 near both ends. Compression springs 703 are fixed to the opposite ends of the two spring baffles. Slider 701 and slider 702 are fixed to the opposite ends of the two compression springs 703, respectively. On the side of slider 1 and slider 2 away from the bottom of the groove, there are symmetrical cantilever rods 704. On the opposite side of the two cantilever rods 704, there are anti-derailment grooves 705 with opposite openings and symmetrical shapes. In the two anti-derailment grooves 705, there are slidably connected inner extension rods 706 with symmetrical L-shaped structures. At the opposite end of the two inner extension rods 706, there are interlocking anti-slip pressure strips 707. With this setting, the width of the PCB board body 20 can be adjusted arbitrarily to clamp the target object.

[0039] As shown in Figure 6, the bottom of the grooves of the two cantilever rods 704 are fitted with positioning nuts at the ends away from the bottom of the grooves, and positioning bolts are screwed into the positioning nuts, which can lock the position of the inner extension rod 706 after positioning.

[0040] Slider 1 701 and slider 2 702 have roller grooves near the cantilever rod 704 and near the four corners on the opposite side, and rollers are installed in the roller grooves; this can reduce the frictional wear on the grooved slide rail 6.

[0041] As shown in Figures 3 and 4, heat baffles 9 are fixed to the middle of the lower surface of the upper cover 13 near both ends, and there is a gap between the bottom of the heat baffles 9 and the upper surface of the PCB board body 20 and the cantilever rod 704. Soft curtains 8 are provided on both sides of the heat baffles 9; and the width and position of the soft curtains 8 are adapted to the position of the grooved slide rail 6 to reduce heat loss. Upward-curving shaft seats 2 are provided at the four corners near the bottom of the front and rear sides of the fixed support plate 4, and the shaft seats 2 are adapted to the shaft head of the transmission sprocket 3.

[0042] In use, the invention first adjusts the extension length of the inner extension rod 706 in each clamping mechanism 7 according to the width of the PCB board body 20 until it clamps the edge of the PCB board body 20. Then, the PCB board bodies 20, after being coated with solder paste and surface mount technology (SMT), can be fed in one by one from the loading end. When a long pin needs to be re-soldered during soldering, the position coordinates are set in advance. When the PCB board body 20 moves above the soldering mechanism 21, it will drive the inner jet tube 216 to quickly reach each pin position and then spray solder onto the pin. Liquid solder paste is used to adhere more solder paste to the pins to form an effective soldering machine, thereby ensuring one-time soldering. When it is necessary to push the boss slide 171 into the T-shaped slide groove 172 and fix it, simply continue to push the boss slide 171 until the mushroom head passes the stop plate 174 and falls into the space between the mushroom head and the conical slip ring 177. If it is necessary to disassemble the boss slide 171 for material addition or maintenance, simply continue to push it forward until the conical slip ring 177 also passes the stop plate 174, and then pull the boss slide 171 in the opposite direction.

[0043] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A reflow soldering device for SMT chip processing of tire pressure sensor chips, comprising four mutually symmetrical main support frames (1), a fixed support plate (4) with the same upward-facing opening and an overall groove-like structure fixed between the four main support frames (1), and a conveying mechanism provided in the middle of the upper surface of the fixed support plate (4), the conveying mechanism comprising conveyor chains (14) that advance synchronously on both sides of the device and are of equal height, characterized in that, The two conveyor chains (14) are respectively reserved with symmetrical and equal-height clamping mechanisms (7) on opposite sides. The two equal-height clamping mechanisms (7) are a group and clamp the same PCB board body (20). The bottom center of the fixed tray (4) has a rectangular hole (401), and the lower surface of the fixed tray (4) is fixed with a planar positioning mechanism (19) below the rectangular hole (401). The upper surface of the planar positioning mechanism (19) is provided with a support column (191) that can be quickly positioned to any position on the horizontal plane. The top of the support column (191) is fixed with a support block (17). The end is fixed with a solder replenishing mechanism (21); and the solder replenishing mechanism (21) includes a solder molten barrel (215) with an overall cylindrical cavity structure. The top of the solder molten barrel (215) is reserved with a vertical tube (217) communicating with the solder molten barrel (215). A piston barrel (214) is inserted into the outer circumference of the solder molten barrel (215), and the bottom of the piston barrel (214) faces the inside of the solder molten barrel (215). Two one-way valves in opposite directions are inserted into the bottom of the piston barrel (214). One of the one-way valves has an outlet with a jetting inner tube (216) extending out of the vertical tube (217) and close to the pin below the PCB board body (20).

2. The reflow soldering apparatus for SMT assembly of tire pressure sensor chip according to claim 1, characterized in that, The top of the four main support frames (1) is fixed with the same downward-facing groove-shaped cover (13), and a heating mechanism (12) and a fan cooler (10) are provided in the middle of the cover (13). A combined air duct (24) with the same direction as the PCB board body (20) is fixed in the middle of the lower surface of the cover (13), and the air outlets of the heating mechanism (12) and the fan cooler (10) are connected to the air inlet of the combined air duct (24) through connecting pipes.

3. The reflow soldering apparatus for SMT assembly of tire pressure sensor chip according to claim 1, characterized in that, The solder replenishing mechanism (21) also includes a support slide (211), the lower surface of the molten solder bucket (215) is fixed to the upper surface of the support slide (211); a motor frame is fixed to the upper surface of the support slide (211) near the opening of the piston bucket (214), and a reduction motor (212) is fixed to the top of the motor frame. A rotating wheel (213) is fixed to the top of the output shaft of the reduction motor (212), and a connecting rod is rotatably connected to the disc surface of the rotating wheel (213) near the circumferential edge; a piston disc is slidably connected inside the piston bucket (214), and a hinge column is fixed to the middle of the piston disc on the side away from the bottom of the bucket. The end of the hinge column is hinged to the other end of the connecting rod.

4. The reflow soldering apparatus for SMT assembly of tire pressure sensor chip according to claim 1, characterized in that, The bottom of the molten solder tub (215) is provided with a hot-melting mechanism (218), and the hot-melting mechanism (218) includes a heating ring that extends into the bottom of the molten solder tub (215) and is close to the inner wall in an annular structure; the top of the support block (17) is provided with a T-shaped groove (172), and a boss slide (171) is slidably connected in the T-shaped groove (172). The upper surface of the boss slide (171) is fitted with an electrically controlled positioning pin, and the top end of the protruding shaft of the electrically controlled positioning pin is fixed to the bottom end of the support slide (211); and a threaded hole is provided in the middle of the front of the boss slide (171). A T-shaped groove with a mushroom head structure is fixed on the side of the boss slide (171) away from the threaded hole. The T-shaped anti-detachment rod (173) has a conical slip ring (177) symmetrical to the mushroom head structure slidably connected to its outer circumference. A return spring (178) is fixed between the conical slip ring (177) and the boss slide (171). A vertical anti-torsion slip hole (175) is fixed at the bottom of the T-shaped slide groove (172) away from the threaded hole. A stop plate (174) is slidably connected in the anti-torsion slip hole (175). A clamping spring is fixed at the bottom of the stop plate (174). A spring stop block (176) is fixed at the bottom of the clamping spring. The spring stop block (176) is fixed on the vertical inner wall of the anti-torsion slip hole (175).

5. The reflow soldering apparatus for SMT assembly of tire pressure sensor chip according to claim 2, characterized in that, The conveying mechanism also includes fixed support plates (18) that are fixed to the bottom of the fixed support plate (4) near the middle and are symmetrical to each other. The top of the fixed support plate (18) is fixed with a horizontal beam support plate (23) of the same level. The front and rear ends of the beam support plate (23) are respectively fixed with side plates (22) that are symmetrical in a strip structure. The two ends of the two side plates (22), namely the loading end and the unloading end of the device, are provided with two parallel drive shafts. The two ends of the two drive shafts are respectively fixed with drive sprockets (3). The two conveying chains (14) are respectively sleeved on four drive chains. On the sprocket (3), a sliding bearing (2201) is embedded in the middle of the side plate strip (22) near the front, and a discharge rod (15) is slidably inserted in the sliding bearing (2201), and a screw (16) that matches the threaded hole is fixed at one end of the discharge rod (15) near the boss slide (171); an inspection port is opened on the upper part of the cover (13) near the support block (17), and a cover plate (11) is provided at the inspection port; a feeding port is provided on the upper surface of the molten solder bucket (215) near the circumferential edge, and a plug is screwed into the feeding port.

6. The reflow soldering apparatus for SMT assembly of tire pressure sensor chip according to claim 5, characterized in that, The middle of the crossbeam support plate (23) is located directly above the rectangular hole one (401) and has a rectangular hole two (2202) that corresponds to the rectangular hole one (401). The lower surface of the support block (17) is fitted with balls near the four corners.

7. The reflow soldering apparatus for SMT assembly of tire pressure sensor chip according to claim 5, characterized in that, The clamping mechanism (7) includes a horizontal connecting strip (5) fixed on two adjacent chain shafts of the conveyor chain (14), and the side of the connecting strip (5) slides against the side strip (22). A vertical grooved slide rail (6) is fixed to one end of the connecting strip (5) away from the conveyor chain (14), and spring baffles are fixed to the bottom of the groove of the grooved slide rail (6) near both ends. A compression spring (703) is fixed to one end of each of the two spring baffles facing each other, and a slider is fixed to one end of each of the two compression springs (703). (701) and slider two (702), slider one (701) and slider two (702) are respectively fixed with symmetrical cantilever rods (704) on the side away from the bottom of the groove, and anti-derailment grooves (705) with opposite openings and symmetrical openings are respectively opened on the opposite side of the two cantilever rods (704); symmetrical inner extension rods (706) with L-shaped structure are slidably connected in the two anti-derailment grooves (705), and anti-slip pressure strips (707) with interlocking are respectively fixed at the opposite end of the two inner extension rods (706).

8. The reflow soldering apparatus for SMT assembly of tire pressure sensor chip according to claim 7, characterized in that, The bottom of each of the two cantilever rods (704) is fitted with a positioning nut at the end away from the bottom of the groove, and a positioning bolt is screwed into the positioning nut.

9. The reflow soldering apparatus for SMT assembly of tire pressure sensor chip according to claim 7, characterized in that, Both slider one (701) and slider two (702) have roller grooves near the cantilever rod (704) and near the four corners on the opposite side, and rollers are provided in the roller grooves.

10. The reflow soldering apparatus for SMT assembly of tire pressure sensor chips according to any one of claims 7-9, characterized in that, The lower surface of the upper cover (13) is fixed with heat shields (9) near both ends, and there is a gap between the bottom end of the heat shield (9) and the PCB board body (20) and the upper surface of the cantilever rod (704). Soft curtains (8) are provided on both sides of the heat shield (9); and the width and position of the soft curtains (8) are adapted to the position of the grooved slide rail (6); the front and rear sides of the fixed support plate (4) are provided with upturned shaft seats (2) near the bottom four corners, and the shaft seats (2) are adapted to the shaft head of the transmission sprocket (3).

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