Heat dissipation control method and device of vehicle, computer equipment and storage medium

Abstract

The invention relates to a heat dissipation control method and device for a vehicle, computer equipment and a storage medium, and the method comprises the steps: determining a target heat dissipation strategy of a to-be-cooled chip according to the environment temperature in the vehicle and the chip operation data of the to-be-cooled chip of the vehicle, or determining a target heat dissipation strategy of the to-be-cooled chip according to the target heat dissipation strategy; according to the method, the target heat dissipation strategy of the to-be-cooled chip is determined according to the chip operation data of the to-be-cooled chip of the vehicle, heat dissipation control is carried out by combining the environment temperature in the vehicle and the chip operation data or directly according to the chip operation data, the delay problem caused by heat dissipation control based on the temperature is solved, and the heat dissipation efficiency is improved. And the chip operation data has relatively high accuracy, so that the accuracy and timeliness of heat dissipation control of the vehicle are improved, and the heat dissipation effect of the vehicle is further improved.

Description

Technical Field

[0001] The present application relates to the field of intelligent driving technology, and in particular to a vehicle heat dissipation control method, device, computer equipment, and storage medium. Background Art

[0002] With the rapid development of new energy vehicles, the application scenarios of automobiles are becoming more and more complex, and the demand for smart cockpits and smart driving is getting higher and higher, which leads to a corresponding increase in the heat dissipation problems faced by smart cockpits. Reliable heat dissipation solutions are particularly important in smart cars.

[0003] In related technologies, the existing cockpit host or intelligent driving host generally uses the system chip (SOC) temperature as the basis for heat dissipation. However, the temperature of the system chip requires time to accumulate and has a certain delay, which affects the heat dissipation effect and makes it difficult to ensure that the cockpit host can operate in the appropriate temperature range. Summary of the Invention

[0004] The embodiments of the present application provide a vehicle heat dissipation control method, device, computer equipment and storage medium, which can improve the accuracy and timeliness of vehicle heat dissipation control and enhance the vehicle's heat dissipation effect, so as to at least partially solve the above-mentioned technical problems.

[0005] To achieve the above objectives, according to a first aspect of the present application, a method for controlling heat dissipation of a vehicle is provided, the method comprising:

[0006] A target heat dissipation strategy for the chip to be cooled is determined based on the ambient temperature inside the vehicle and the chip operation data of the chip to be cooled in the vehicle, or a target heat dissipation strategy for the chip to be cooled is determined based on the chip operation data of the chip to be cooled in the vehicle.

[0007] According to a second aspect of the present application, a heat dissipation control device for a vehicle is provided, the device comprising:

[0008] A determination module is used to determine a target heat dissipation strategy for the chip to be cooled based on the ambient temperature inside the vehicle and the chip operating data of the chip to be cooled in the vehicle, or to determine the target heat dissipation strategy for the chip to be cooled based on the chip operating data of the chip to be cooled in the vehicle.

[0009] According to a third aspect of the present application, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the heat dissipation control method of the vehicle described above is implemented.

[0010] According to a fourth aspect of the present application, a computer program product is provided, comprising a computer program, which implements the above-mentioned vehicle heat dissipation control method when executed by a processor.

[0011] According to a fifth aspect of the present application, a computer device is provided, comprising: a memory on which a computer program is stored; and a processor for executing the computer program in the memory to implement the above-mentioned vehicle heat dissipation control method.

[0012] According to a sixth aspect of the present application, a vehicle is provided, comprising the above-mentioned computer device.

[0013] The vehicle heat dissipation control method, device, computer equipment and storage medium of the embodiments of the present application determine the target heat dissipation strategy of the chip to be dissipated according to the ambient temperature inside the vehicle and the chip operating data of the chip to be dissipated in the vehicle, or determine the target heat dissipation strategy of the chip to be dissipated according to the chip operating data of the chip to be dissipated in the vehicle. By combining the ambient temperature inside the vehicle and the chip operating data, or directly performing heat dissipation control based on the chip operating data, the delay problem caused by temperature-based heat dissipation control is overcome, and the chip operating data has high accuracy. Therefore, the accuracy and timeliness of the vehicle's heat dissipation control are improved, thereby improving the heat dissipation effect of the vehicle.

[0014] Other features and advantages of the present application will be described in detail in the subsequent detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] To more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present application. Those skilled in the art can also derive other drawings based on these drawings without inventive effort.

[0016] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings, wherein the same drawing numbers represent the same parts in the following description.

[0017] Figure 1 is a flow chart of a vehicle heat dissipation control method provided in some embodiments of the present application;

[0018] Figure 2 is a flow chart of a vehicle heat dissipation control method provided in other embodiments of the present application;

[0019] Figure 3 is a schematic diagram of a flow chart of heat dissipation control based on chip current data provided in some embodiments of the present application;

[0020] Figure 4 is a schematic diagram of a flow chart for heat dissipation control based on chip computing power data provided in some embodiments of the present application;

[0021] Figure 5 This is a schematic diagram of a process for determining a second target gear position by combining chip current data, chip computing power data, accumulated heat, and accumulated computing power, provided in some embodiments of the present application;

[0022] Figure 6 This is a flowchart of determining heat dissipation measures based on user vehicle usage data provided in some embodiments of the present application;

[0023] Figure 7 is a schematic diagram of a vehicle provided in some embodiments of the present application. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0025] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0026] In the description of this application, the word "for example" is used to mean "used as an example, illustration or illustration". Any embodiment described in this application as "for example" is not necessarily to be construed as being more preferred or advantageous than other embodiments. The following description is given to enable any person skilled in the art to implement and use the present invention. In the following description, details are listed for the purpose of explanation. It should be understood that a person of ordinary skill in the art can recognize that the present invention can be implemented without using these specific details. In other examples, well-known structures and processes are not elaborated in detail to avoid obscuring the description of the present invention with unnecessary details. Therefore, the present invention is not intended to be limited to the embodiments shown, but is consistent with the widest scope consistent with the principles and features disclosed in this application.

[0027] With the rapid development of new energy vehicles, the application scenarios of automobiles are becoming more and more complex, and the demand for smart cockpits and smart driving is getting higher and higher. The inventors found that this will also increase the computing power requirements for vehicle integration, and the power consumption of the system chip will also increase accordingly, so the heat dissipation problems faced by the smart cockpit will also increase accordingly, and reliable heat dissipation solutions are particularly important in smart cars. In related technologies, the opening and closing of heat dissipation measures and the related gear levels are usually controlled according to data such as the product's printed circuit board (PCB) temperature, ambient temperature, and SOC temperature. The temperature rise will have a certain delay, and the measures are all executed according to the results, which has a certain delay.

[0028] In order to solve the above problems, an embodiment of the present application provides a vehicle heat dissipation control method, which determines the target heat dissipation strategy of the chip to be dissipated according to the ambient temperature inside the vehicle and the chip operating data of the chip to be dissipated in the vehicle, or determines the target heat dissipation strategy of the chip to be dissipated according to the chip operating data of the chip to be dissipated in the vehicle. By combining the ambient temperature inside the vehicle and the chip operating data, or directly performing heat dissipation control based on the chip operating data, the delay problem caused by temperature-based heat dissipation control is overcome, and the chip operating data has high accuracy. Therefore, the accuracy and timeliness of the vehicle's heat dissipation control are improved, thereby improving the vehicle's heat dissipation effect.

[0029] According to a first aspect of the present application, an embodiment of the present application provides a method for controlling heat dissipation of a vehicle.

[0030] See also Figure 1 , Figure 1 Flowchart of a vehicle control method provided by an embodiment of the present application. The vehicle control method may include the following steps S100:

[0031] Step S100 , determining a target heat dissipation strategy for the chip to be cooled according to the ambient temperature inside the vehicle and the chip operation data of the chip to be cooled in the vehicle, or determining a target heat dissipation strategy for the chip to be cooled according to the chip operation data of the chip to be cooled in the vehicle.

[0032] The ambient temperature inside the vehicle can be collected by a temperature sensor provided by the vehicle's host.

[0033] The target heat dissipation strategy may be a heat dissipation strategy selected from natural heat dissipation and heat dissipation by fans, thermoelectric coolers (TECs), and other related heat dissipation devices.

[0034] The chip to be cooled can be a vehicle host chip, such as a system-on-chip (SOC). Chip operating data refers to operating data that accurately reflects the temperature of the chip to be cooled during operation, such as the SOC current and computing power. For example, higher SOC current and computing power indicate higher chip temperature.

[0035] Specifically, a preliminary determination can be made based on the ambient temperature inside the vehicle whether cooling measures need to be activated. After determining that cooling measures need to be activated, the target cooling strategy for the chip to be cooled can be determined in combination with the chip operating data of the chip to be cooled in the vehicle, and the cooling control of the vehicle can be achieved using the target cooling strategy finally determined. Alternatively, the target cooling strategy for the chip to be cooled can be determined directly based on the chip operating data of the chip to be cooled in the vehicle. It can be understood that by combining the ambient temperature inside the vehicle with the chip operating data for cooling control, or by directly controlling cooling based on the chip operating data, the delay problem caused by temperature-based cooling control is overcome, and the chip operating data has a higher accuracy, thereby improving the accuracy and timeliness of the vehicle's cooling control, thereby improving the cooling effect of the vehicle.

[0036] In some embodiments, in step S100, determining a target heat dissipation strategy for the chip to be cooled based on the ambient temperature inside the vehicle and the chip operating data of the chip to be cooled may include the following steps:

[0037] S110: When it is detected that the ambient temperature inside the vehicle meets a preset temperature condition, obtaining chip operation data of the chip to be cooled;

[0038] S120: Determine a target heat dissipation strategy for the chip to be cooled according to the chip operation data.

[0039] The preset temperature condition is used to predict temperature rises in advance. The preset temperature condition can be satisfied when the ambient temperature inside the vehicle is greater than or equal to a preset temperature, where the preset temperature is less than a temperature threshold requiring heat dissipation control. For example, the temperature threshold requiring heat dissipation control is 28°C. That is, when the ambient temperature reaches 28°C, heat dissipation control needs to be activated. The corresponding preset temperature may be 25°C. This allows temperature rises to be predicted in advance.

[0040] Specifically, if the ambient temperature inside the vehicle is detected to meet a preset temperature condition, the chip operating data of the chip to be cooled is obtained, enabling early prediction of temperature rises. Because the chip operating data of the chip to be cooled changes faster than the temperature, the risk of overtemperature can be predicted in advance based on this chip operating data. Next, a target cooling strategy is determined based on the chip operating data, and cooling control is performed on the chip to be cooled according to the target cooling strategy. This achieves timely and accurate cooling control, ensuring that the vehicle's cabin main engine operates within the appropriate temperature range.

[0041] Understandably, in this embodiment, heat dissipation control based on SOC temperature may result in certain deviations and delays, and the activation of related heat dissipation measures may cause a short-term risk of chip overheating due to a gap in temperature before the temperature rises. When the ambient temperature inside the vehicle is detected to meet the preset temperature conditions, the chip operating data of the chip to be cooled is obtained; the target heat dissipation strategy for the chip to be cooled is determined based on the chip operating data, achieving rapid temperature control adaptive response, early prediction of temperature overheating risks, and precise heat dissipation control, thereby avoiding overheating risks. Furthermore, compared to the existing solution that requires a temperature sensor to test the product PCB temperature, the chip operating data eliminates the need to install a temperature sensor, reducing the use of temperature sensors and achieving cost reduction and efficiency improvement.

[0042] Furthermore, to address the issue of wasted resources by enabling cooling measures in advance to avoid the risk of overheating delays, a cooling control solution, such as one that enables cooling measures 30 minutes in advance based on empirical values, can be used. This embodiment, due to its precise cooling control, reduces the time and frequency of cooling device usage, extending the life cycle of the entire product, avoiding energy waste, improving energy efficiency, and ultimately, to a certain extent, enhancing the vehicle's range.

[0043] In some embodiments, the method further includes: determining that the target heat dissipation strategy is a level 0 heat dissipation strategy when it is detected that the ambient temperature inside the vehicle does not meet a preset temperature condition.

[0044] The 0-level cooling strategy refers to a cooling strategy with level 0, that is, the cooling strategy is not enabled.

[0045] Specifically, when the ambient temperature inside the vehicle does not meet the preset temperature condition, it indicates that the ambient temperature inside the vehicle is not high and no heat dissipation is required. Therefore, there is no need to activate the control. It can be understood that in this embodiment, when it is detected that the ambient temperature inside the vehicle does not meet the preset temperature condition, the heat dissipation strategy is not activated. Therefore, there is no need to execute the action of obtaining chip heat dissipation data, and the control does not need to be activated during the heat dissipation period, which can improve vehicle performance.

[0046] like Figure 2 The figure shows a flow chart of a heat dissipation control method for a vehicle, wherein the preset temperature condition is greater than or equal to 25°C. When the ambient temperature is greater than or equal to 25°C, the heat dissipation strategy is turned on, and the gear of the heat dissipation strategy can be determined according to the chip operation data; when the ambient temperature is less than 25°C, the heat dissipation strategy is turned off to reduce costs.

[0047] In some embodiments, in step S100, determining a target heat dissipation strategy for the chip to be cooled based on the chip operating data of the vehicle's chip to be cooled may include the following steps:

[0048] S130: Obtain chip operation data of the chip to be cooled;

[0049] S140: Determine a target heat dissipation strategy for the chip to be cooled according to the chip operation data.

[0050] Specifically, the chip operation data of the chip to be cooled can be obtained through the vehicle's own sensors, and the target cooling strategy of the chip to be cooled can be determined directly based on the chip operation data. The difference between this embodiment and the above-mentioned steps S110-S120 is that the target cooling strategy of the chip to be cooled is determined directly based on the chip operation data without requiring the ambient temperature inside the vehicle. It can be understood that since both this embodiment and the above-mentioned embodiment determine the target cooling strategy of the chip to be cooled based on the chip operation data, based on the same reasons as the above-mentioned embodiment, this embodiment can also achieve the technical effects of rapid temperature control adaptive response, early prediction of temperature over-temperature risks, and precise heat dissipation control to avoid over-temperature risks.

[0051] In some embodiments, the chip operation data includes chip current data and / or chip computing power data; the above step S110 may include the following steps:

[0052] S111: Acquire multiple current data of the chip to be cooled within a first preset time period, and obtain chip current data based on the current data; and / or,

[0053] S112: Acquire multiple computing power data of the chip to be cooled within a second preset time period, and obtain chip computing power data based on the computing power data.

[0054] Among them, the computing power data is a characterization of the computing power required by the chip of the vehicle during operation, that is, the greater the computing power, as the computing power data increases, its power consumption will also increase. This is because high-performance computing requires more electrical energy to drive more computing tasks, and when electrical energy is converted into computing work, part of the energy will be dissipated in the form of heat energy. Therefore, the higher the computing power data of the chip to be cooled, the more heat will be generated, the greater the possibility of temperature rise, and the higher its temperature will be. In this way, the computing power data can be used as the basis for heat dissipation control. The computing power data can be determined by the software installed and running on the vehicle, that is, the memory consumed by the application (APP). The more memory consumed, the greater the computing power data.

[0055] The first preset time period and the second preset time period may be the same or different. They may be determined according to actual needs and are not limited here. For example, the first preset time period and the second preset time period may be 3S (seconds), 5S, 10 seconds, etc. For example, the current data of the corresponding moment is captured every second, captured three times continuously, and three current data of the first preset time period of 3S are obtained. Statistical analysis is performed on the multiple current data, such as calculating the average value, selecting the maximum value, median or minimum value, as the chip current data; and / or, the computing power data of the corresponding moment is captured every second, captured three times continuously, and three computing power data of the second preset time period of 3S are obtained. Statistical analysis is performed on the multiple computing power data, such as calculating the average value, selecting the maximum value, median or minimum value, as the chip computing power data.

[0056] In some embodiments, the minimum current data in the current data is determined as the chip current data; and / or, the minimum computing power data in the computing power data is determined as the chip computing power data.

[0057] Specifically, the minimum current data in the first preset time period is used as the chip current data, and / or the minimum computing power data in the second preset time period is determined as the chip computing power data. It can be understood that the smaller the current data and / or computing power data, the lower the temperature of the chip to be cooled in the corresponding time period. Using the minimum current data and / or the minimum computing power data as a reference for determining the target cooling strategy, that is, determining the target cooling strategy based on the lowest temperature, can improve the fault tolerance of the target cooling strategy.

[0058] In some embodiments, the target heat dissipation strategy is one of N-level heat dissipation strategies; the N-level heat dissipation strategies correspond to heat dissipation strategies 1 to N, respectively, where N is a natural number greater than 1.

[0059] There are multiple cooling strategies, and each cooling strategy corresponds to a gear that represents the corresponding cooling intensity. The higher the gear, the greater the cooling intensity. For example, N = 3, the cooling strategy of gear 1 can be natural cooling, the cooling strategy of gear 2 can be turning on the TEC, and the cooling strategy of gear 3 can be turning on the TEC and fan at the same time. The gear of the cooling strategy can also be defined by setting the operating frequency of the TEC and the speed of the fan. In this embodiment, by setting N cooling strategies, the flexibility of the cooling control can be improved, the cooling control in different scenarios can be adapted, and the wide applicability of the cooling control can be improved.

[0060] In some embodiments, in some embodiments, the above step S120 or step S140 may include the following steps:

[0061] S121: When the chip current data is greater than or equal to the i-level current value and less than the i+1-level current value, determine that the target heat dissipation strategy is the i-level heat dissipation strategy, where i∈[1,N]; or

[0062] S122: When the chip computing power data is greater than or equal to the computing power value of level i and less than the computing power value of level i+1, the target cooling strategy is determined to be the cooling strategy of level i.

[0063] The current value of level i+1 is greater than the current value of level i. The computing power value of level i+1 is greater than the computing power value of level i. The current value of level i can be predetermined based on empirical values.

[0064] Specifically, when the chip operation data is chip current data, the target heat dissipation strategy and the corresponding gear position within the first preset time period can be determined based on the chip current data, the i+1 level current value, and the i level current value. When the chip operation data is chip computing power data, the target heat dissipation strategy and the corresponding gear position within the second preset time period can be determined based on the chip computing power data, the i+1 level computing power value, and the i level computing power value. In this embodiment, the target heat dissipation strategy and the corresponding gear position are determined based on the chip current data or the chip computing power data, utilizing the characteristics that the chip current data or the chip computing power data can accurately and in real time reflect the temperature of the chip to be cooled, thereby realizing adaptive heat dissipation control and improving the accuracy of the target heat dissipation strategy and the corresponding gear position.

[0065] In some embodiments, after the above step S121, the following steps may also be included:

[0066] S121A: While cooling the chip to be cooled using the i-level cooling strategy, continue to obtain chip current data after cooling and obtain current cooling capacity data of the chip to be cooled.

[0067] S121B: Update the i-level cooling strategy based on the chip current data after cooling and the current cooling capacity data.

[0068] Among them, the chip current data after heat dissipation refers to the current data during the heat dissipation process after the i-level heat dissipation strategy is implemented for the heat dissipation chip for heat dissipation control. It is used as a reference for real-time adaptive heat dissipation control to achieve real-time adaptive heat dissipation and improve the heat dissipation effect.

[0069] The current heat dissipation capacity data is used to indicate the effectiveness of the i-level heat dissipation strategy on the heat dissipation of the chip being dissipated. In some embodiments, the current heat dissipation capacity data includes the current temperature of the chip being dissipated. The current temperature of the chip being dissipated can be measured by a temperature sensor on the vehicle.

[0070] Specifically, the i-speed heat dissipation strategy is updated according to the chip current data after heat dissipation and the current heat dissipation capacity data. It can be determined whether the i-speed in the i-speed heat dissipation strategy needs to be shifted up or down according to the current heat dissipation capacity data. When it is determined that an upshift or downshift is required, the specific upshift or downshift value is determined according to the chip current data after heat dissipation, such as upshifting one gear (i+1) or upshifting two gears (i+12), downshifting one gear (i-1) or downshifting two gears (i-2), thereby realizing precise and adaptive heat dissipation control of the heat dissipation chip and ensuring the heat dissipation control effect.

[0071] In some embodiments, the above step S121A may include the following steps:

[0072] S121A1: Acquire a plurality of first heat dissipation current data of the chip to be cooled during heat dissipation in a third preset time period;

[0073] S121A2: Based on the first heat dissipation current data, obtain chip current data after heat dissipation.

[0074] The third preset time period refers to the cooling time during which the heat dissipation strategy i is implemented for the heat dissipation chip. For example, the third preset time period can be the same as the first preset time period and can be determined according to actual needs, without limitation herein. For example, the third preset time period can be 3 seconds, 5 seconds, 10 seconds, etc. For example, the first heat dissipation current data at the corresponding moment in the heat dissipation process is captured every second, and captured three times continuously to obtain three first heat dissipation current data of the third time period of 3 seconds. The three first heat dissipation current data are statistically analyzed, such as calculating the average value, selecting the maximum value, median value, or minimum value, as the chip current data after heat dissipation.

[0075] In some embodiments, the above step S121A2 may include the following steps:

[0076] S121A21: Determine the minimum current data in the first heat dissipation current data as the chip current data after heat dissipation.

[0077] The minimum current data in the first heat dissipation current data is used as the chip current data after heat dissipation. It can be understood that the smaller the current data, the lower the temperature of the chip to be cooled during the corresponding time period. Using the minimum current data as a reference for updating the target heat dissipation strategy, that is, updating the target heat dissipation strategy in real time based on the minimum temperature, can improve the fault tolerance of the updated target heat dissipation strategy.

[0078] In some embodiments, the above step S121B may include the following steps:

[0079] S121B1: If the current heat dissipation capability data satisfies the preset downshift condition, the gear corresponding to the i-th gear heat dissipation strategy is updated according to the chip current data after heat dissipation, and the updated gear is less than or equal to the i-th gear;

[0080] S121B2: If the current heat dissipation capacity data meets the preset gear-up condition, the gear corresponding to the i-gear heat dissipation strategy is updated according to the chip current data after heat dissipation, and the updated gear is greater than or equal to i-gear and less than or equal to N-gear.

[0081] Among them, if the current heat dissipation capacity data is the current temperature, the preset downshift condition can be that the current temperature is within the first preset temperature range, and the preset upshift condition can be that the current temperature is within the second preset temperature range, such as the first temperature preset range is [24°C, 26°C], and the second preset temperature range is greater than 26°C.

[0082] In one specific embodiment, if the current temperature satisfies a preset upshift condition, such as being greater than 26°C, this indicates that the current heat dissipation effect is poor, meaning that the heat dissipation intensity of the current i-speed heat dissipation strategy is relatively low relative to the heat dissipation intensity required by the chip to be cooled. In this case, the heat dissipation intensity of the i-speed heat dissipation strategy needs to be increased, meaning the current i-speed level is increased, i.e., an upshift is applied. If the current temperature satisfies a preset downshift condition, such as being less than or equal to 26°C, this indicates that the current heat dissipation effect is good, meaning that the heat dissipation intensity of the current i-speed heat dissipation strategy is relatively high relative to the heat dissipation intensity required by the chip to be cooled. In this case, to save costs and achieve precise temperature control and heat dissipation, the heat dissipation intensity of the i-speed heat dissipation strategy is reduced, meaning the current i-speed level is lowered, i.e., a downshift is applied. This achieves real-time, adaptive, and precise heat dissipation control.

[0083] It's worth noting that if the current heat dissipation capability data doesn't meet the preset upshift or downshift conditions, gear i remains unchanged. Understandably, if the current heat dissipation capability data doesn't meet the preset upshift or downshift conditions, indicating that the current gear position matches the current heat dissipation performance, there's no need to update the gear position; instead, gear i is directly used for heat dissipation. This ensures precise heat dissipation control while reducing the need to obtain chip current data after cooling, improving heat dissipation control efficiency.

[0084] In one embodiment, Figure 3 As shown in FIG, a flow chart of heat dissipation control based on chip current data is shown, wherein the gear determination process of the target heat dissipation strategy is as follows: the chip current data (SOC current) is obtained in real time as a judgment basis, and the data is captured once per second for 3 consecutive times. When the minimum value of the 3 data is ≥A1, the first gear heat dissipation is turned on; similarly, when the minimum value of the 3 data is ≥A2, the second gear heat dissipation is turned on; similarly, when the minimum value of the 3 data is ≥A3, the third gear heat dissipation is turned on. When the current heat dissipation capacity can meet the preset downshifting conditions and the chip current data after heat dissipation changes, the downshifting measures are implemented. Similarly, the data is captured once per second for 3 consecutive times. When the minimum value of the 3 data is ≤A3, the second gear heat dissipation is turned on; when the minimum value of the 3 data is ≤A2, the first gear heat dissipation is turned on; and when the minimum value of the 3 data is ≤A1, the heat dissipation measures are turned off.

[0085] In some embodiments, after the above step S122, the following steps may also be included:

[0086] S122A: While cooling the chip to be cooled using the i-level cooling strategy, continue to obtain chip computing power data after cooling, and obtain current cooling capacity data of the chip to be cooled.

[0087] S122B: Update the i-level cooling strategy based on the chip computing power data after cooling and the current cooling capacity data.

[0088] Among them, the chip computing power data after heat dissipation refers to the computing power data during the heat dissipation process after the i-level heat dissipation strategy is implemented for the heat dissipation chip for heat dissipation control. It is used as a reference for real-time adaptive heat dissipation control to achieve real-time adaptive heat dissipation and improve the heat dissipation effect.

[0089] The method for updating the i-level cooling strategy based on the chip computing power data after cooling and the current cooling capacity data in this embodiment differs from the steps S121A-S121B of the above embodiment in that the chip operating data in steps S121A-S121B is the chip current data after cooling, while the chip operating data in this embodiment is the chip computing power data after cooling. The other embodiments are consistent. For detailed description, please refer to the specific content above and will not be repeated here.

[0090] The current heat dissipation capacity data in this embodiment is consistent with that in step S121A-step S121B in the above embodiment. For detailed description, please refer to the specific content above and will not be repeated here. In some embodiments, the current heat dissipation capacity data includes the current temperature of the chip to be cooled.

[0091] In some embodiments, the above step S122A may include the following steps:

[0092] S122A1: Acquire a plurality of first heat dissipation computing power data of the chip to be cooled during heat dissipation in a fourth preset time period;

[0093] S122A2: Based on the first heat dissipation computing power data, obtain chip computing power data after heat dissipation.

[0094] The fourth preset time period may be the same as the third preset time period.

[0095] The method for determining chip computing power data after heat dissipation in this embodiment differs from steps S121A1 and S121A2 in the above embodiment in that the chip operating data in steps S121A1 and S121A2 is a plurality of first heat dissipation current data, while the chip operating data in this embodiment is the first heat dissipation computing power data. The other embodiments are consistent. For a detailed description, please refer to the specific content above and will not be repeated here.

[0096] In some embodiments, the above step S122A2 may include the following steps:

[0097] S122A21: Determine the minimum computing power data in the first heat dissipation computing power data as the chip computing power data after heat dissipation.

[0098] The method for determining the chip computing power data after heat dissipation in this embodiment is consistent with the method for determining the chip current data after heat dissipation in step S121A21 of the above embodiment. For detailed description, please refer to the specific content above and will not be repeated here.

[0099] In some embodiments, step S122B may include the following steps:

[0100] S122B1: If the current heat dissipation capability data meets the preset downshift condition, the gear corresponding to the i-th gear heat dissipation strategy is updated according to the chip computing power data after heat dissipation, and the updated gear is less than or equal to the i-th gear;

[0101] S122B2: If the current heat dissipation capacity data meets the preset gear-up condition, the gear corresponding to the i-gear heat dissipation strategy is updated according to the computing power current data after heat dissipation. The updated gear is greater than or equal to gear i and less than or equal to gear N.

[0102] The implementation method for updating the gear corresponding to the i-gear cooling strategy in this embodiment differs from steps S121B1 and S121B2 in the above embodiment in that the chip operating data in steps S121B1 and S121B2 is the chip current data after cooling, while the chip operating data in this embodiment is the chip computing power data after cooling. Other implementations are consistent. For detailed descriptions, please refer to the specific content above and will not be repeated here.

[0103] In one embodiment, Figure 4 As shown, it is a flow chart of heat dissipation control based on chip computing power data, wherein the gear determination process of the target heat dissipation strategy is as follows: the chip computing power data (APP computing power) is obtained in real time through the AI big model as the judgment basis, and data is captured once per second for 3 consecutive times. When the minimum value of the 3 data is ≥X1, the first gear heat dissipation is turned on; in the same way, when the minimum value of the 3 data is ≥X2, the second gear heat dissipation is turned on; in the same way, when the minimum value of the 3 data is ≥X3, the third gear heat dissipation is turned on. When the current heat dissipation capacity can meet the preset downshift conditions and the chip computing power data after heat dissipation changes, the downshift measures are implemented. Similarly, data is captured once per second for 3 consecutive times. When the minimum value of the 3 data is ≤X3, it is downgraded to the second gear heat dissipation; when the minimum value of the 3 data is ≤X2, it is downgraded to the first gear heat dissipation; when the minimum value of the 3 data is ≤X1, the heat dissipation measures are turned off.

[0104] In some embodiments, the method may further include the following steps:

[0105] S200: Obtaining a first gear corresponding to a target heat dissipation strategy determined according to chip current data, and obtaining a second gear corresponding to a target heat dissipation strategy determined according to chip computing power data;

[0106] S300: Determine a first target gear corresponding to a target heat dissipation strategy according to the first gear and the second gear.

[0107] Among them, the first gear is the gear corresponding to the target heat dissipation strategy determined according to the chip current data, and the second gear is the gear corresponding to the target heat dissipation strategy determined according to the chip computing power data.

[0108] Specifically, when the chip operation data is chip current data and chip computing power data, the corresponding first gear and second gear can be determined according to the chip current data and chip computing power data respectively, and the first target gear corresponding to the target heat dissipation strategy is determined according to the first gear and the second gear. It can be understood that in this embodiment, the first target gear is determined by performing a comprehensive analysis of the first gear and the second gear.

[0109] In some embodiments, the above step S300 may include the following steps:

[0110] S310: The highest gear between the first gear and the second gear is set as the first target gear.

[0111] Specifically, the highest gear between the first and second gears is selected as the first target gear, the heat dissipation strategy for the first target gear is used as the target heat dissipation strategy, and the target heat dissipation strategy is implemented to perform heat dissipation control. It can be understood that in this embodiment, the heat dissipation strategy for the highest gear, i.e., the heat dissipation strategy with higher heat dissipation intensity, is selected to improve the fault tolerance of the heat dissipation control and ensure the heat dissipation control effect.

[0112] It is worth noting that when the first gear and the second gear are the same, the first target gear is the first gear or the second gear, and precise heat dissipation control can be achieved by implementing the heat dissipation strategy of the first target gear.

[0113] In some embodiments, after step S310, the following steps may also be included:

[0114] S320: When the first target gear is the first gear, continue to obtain the accumulated heat during the fifth preset time period of the heat dissipation process of the heat dissipation chip using the heat dissipation strategy under the first gear, and a plurality of second heat dissipation computing power data;

[0115] S330: updating the first gear according to the accumulated heat to obtain an updated first gear, and updating the second gear according to the plurality of second heat dissipation computing power data to obtain an updated second gear;

[0116] S340: When the updated first gear and the updated second gear are inconsistent, repeat the steps of continuing to obtain the accumulated heat during the fifth preset time period of the heat dissipation process of the heat dissipation chip using the heat dissipation strategy under the first gear, and multiple second heat dissipation computing power data, until the updated first gear and the updated second gear are consistent, and the second target gear is obtained.

[0117] The fifth time period is the time for the heat dissipation chip to be controlled by the heat dissipation strategy with the gear determined by the chip current data being the first target gear, for example, 1 minute, 10 minutes, 30 minutes, 60 minutes, etc. The accumulated heat is the total heat generated during the heat dissipation process in the fifth preset time period. The accumulated heat can be determined by integrating the power of the heat dissipation chip, and the accumulated heat can be calculated using the following formula 1:

[0118] Formula 1:

[0119] In formula 1, Q T is the accumulated heat, T is the fifth time period, I is the chip current data, R is the resistance of the chip to be cooled, I 2 R is the power of the chip to be cooled.

[0120] Specifically, the computer device is pre-configured with N levels of cumulative heat thresholds corresponding to the cumulative heat. When the cumulative heat QT Greater than or equal to i T The cumulative heat value of the level is less than i T When the cumulative heat value reaches level +1, the target heat dissipation strategy gear is determined to be gear i. Therefore, the first gear is updated according to the cumulative heat, and the updated first gear can be determined according to the cumulative heat and the cumulative heat threshold of N gears to obtain the updated first gear. At the same time, based on the multiple second heat dissipation computing power data obtained during the fifth preset time period of the heat dissipation chip using the heat dissipation strategy under the first gear, the second gear is updated to obtain the updated second gear. The first target gear is updated according to the cumulative heat and the chip computing power data during the heat dissipation process, which is conducive to achieving real-time adaptive heat dissipation control.

[0121] When the updated first gear and the updated second gear are inconsistent, the above steps S320-S330 are repeatedly executed until the updated first gear and the updated second gear are consistent, and the second target gear is obtained, and the target heat dissipation strategy of the second target gear is adopted to implement heat dissipation control. It can be understood that in this embodiment, the cumulative heat during the fifth preset time period of the heat dissipation process of the heat dissipation chip using the heat dissipation strategy under the first gear is combined with the multiple second heat dissipation computing power data, and the first target gear is updated respectively until the updated gears are consistent, and the second target gear is obtained. Since the second target gear is a consistent gear determined by two different updating methods, the accuracy of the second target gear is ensured. Using the second target gear as the gear of the target heat dissipation strategy improves the accuracy of the gear of the target heat dissipation strategy, thereby improving the accuracy of the heat dissipation control.

[0122] In some embodiments, after step S310, the following steps may also be included:

[0123] S350: When the first target gear is the second gear, continue to obtain the cumulative computing power and multiple second heat dissipation current data during the sixth preset time period of heat dissipation of the heat dissipation chip using the heat dissipation strategy under the second gear;

[0124] S360: updating the second gear according to the accumulated power to obtain an updated second gear, and updating the first gear according to the plurality of second heat dissipation current data to obtain an updated first gear;

[0125] S370: When the updated first gear and the updated second gear are inconsistent, repeat the steps of continuing to obtain the cumulative computing power and multiple second heat dissipation current data during the sixth preset time period of the heat dissipation chip using the heat dissipation strategy under the second gear, until the updated first gear and the updated second gear are consistent, and obtain the second target gear.

[0126] The sixth time period is the time during which the heat dissipation chip is controlled by the heat dissipation strategy with the gear determined by the chip computing power data being the first target gear. It can be the same as the fifth time period. For example, 1 minute, 10 minutes, 30 minutes, 60 minutes, etc. The cumulative computing power is the total computing power during the heat dissipation process in the sixth preset time period. The power of the heat dissipation chip can be integrated to determine the cumulative heat, which can be calculated using the following formula 2:

[0127] Formula 2:

[0128] In formula 2, W t is the cumulative computing power, t is the sixth time period, F is the number of cores of the chip to be cooled, X is the frequency reduction percentage of the core of the chip to be cooled, and Y is the computing power of a single core, that is, the single-core computing power, which can be determined by the memory consumed by the application.

[0129] Specifically, the computer device is pre-configured with N gears of cumulative computing power thresholds corresponding to the cumulative computing power. t Greater than or equal to i T The cumulative power value of the level is less than i T When the cumulative power value reaches level +1, the target cooling strategy gear is determined to be gear i. Therefore, updating the second gear based on the cumulative power to obtain the updated second gear can be done by determining the gear based on the cumulative power and the cumulative power thresholds of the N gears to obtain the updated second gear. At the same time, based on the multiple second cooling current data obtained during the sixth preset time period of cooling the cooling chip using the cooling strategy under the second gear, the first gear is updated to obtain the updated first gear. This achieves the updating of the first target gear based on the cumulative power and the chip current data during the cooling process, thereby facilitating real-time adaptive cooling control.

[0130] When the updated first gear position and the updated second gear position are inconsistent, the above steps S350-S360 are repeatedly executed until the updated first gear position and the updated second gear position are consistent, thereby obtaining a second target gear position, and implementing heat dissipation control using the target heat dissipation strategy of the second target gear position. It can be understood that in this embodiment, the first target gear position is updated separately based on the accumulated power during the sixth preset time period of heat dissipation of the heat dissipation chip using the heat dissipation strategy under the second gear position and the plurality of second heat dissipation current data until the updated gear positions are consistent, thereby obtaining the second target gear position. Because the second target gear position is a consistent gear position determined using two different updating methods, the accuracy of the second target gear position is ensured. Using the second target gear position as the gear position of the target heat dissipation strategy improves the accuracy of the gear position of the target heat dissipation strategy, thereby improving the accuracy of the heat dissipation control.

[0131] like Figure 5 As shown, it is a schematic diagram of the process of determining the second target gear by combining chip current data, chip computing power data, accumulated heat and accumulated computing power. The corresponding process is step S320-step S370. In a specific embodiment, the final gear determination process is: when the SOC current judgment and APP computing power judgment are applied comprehensively, when the SOC current judgment and the APP computing power judgment conflict, a new unit time computing power and heat judgment mechanism is introduced. The total computing power and heat accumulation requires a process. At this time, in order to achieve precise temperature control, the final gear is directly output when the SOC current judgment is consistent with the APP computing power output gear. When the two strategies conflict, the high-end strategy is selected, and a new judgment mechanism is entered at this time; when the SOC current mechanism takes effect, the heat is obtained 1min, 10min, 30min, and 60min after the start. When the heat Q ≥ Q1 / Q2 / Q3 / Q4 The corresponding gear can be executed at the value moment. When the heat Q is less than Q1 / Q2 / Q3 / Q4, the downshift is judged again with the APP computing power strategy. If the downshift is consistent, the consistent strategy is executed. If it is inconsistent, it is executed according to the high gear until the gear output is consistent. Similarly, when the APP computing power gear is high, the computing power is calculated for 1min, 10min, 30min, and 60min after it is turned on. When the computing power value W≥W1 / W2 / W3 / W4, the corresponding gear can be executed. When the computing power W is less than W1 / W2 / W3 / W4, the downshift is judged again with the SOC current computing power. If the downshift is consistent, the consistent strategy is executed. If it is inconsistent, it is executed according to the high gear until the gear output is consistent.

[0132] In some embodiments, the method may further include the following steps:

[0133] S400: collecting historical vehicle usage environment periods of the vehicle user when the ambient temperature inside the vehicle does not meet the preset temperature condition, the historical vehicle usage environment periods including multiple historical periods;

[0134] S500: When the user's current vehicle usage environment period is consistent with the historical period, determining the target heat dissipation strategy to be the level 0 heat dissipation strategy.

[0135] The historical vehicle usage period refers to the period of time when the vehicle's internal ambient temperature does not meet the preset temperature conditions, including multiple historical periods, such as winter mornings and evenings, and summer noontime. This refers to the period of time when the vehicle's internal ambient temperature is not high and heat dissipation control is not required.

[0136] Specifically, an artificial intelligence large model (AI large model) can be installed on the vehicle controller. After the user logs into the vehicle controller software, the AI large model starts and collects the user's vehicle usage habits in the background. In this embodiment, the collected vehicle usage habits can be the user's vehicle usage environment time period when cooling is not required, that is, the historical vehicle usage environment time period when the ambient temperature inside the vehicle does not meet the preset temperature conditions is collected, thereby obtaining the historical vehicle usage time period when cooling is not required. In this way, the time period when cooling control is not required can be determined based on the user's current vehicle usage environment time period and the historical time period. That is, when the user's current vehicle usage environment time period matches the historical time period, the target cooling strategy is determined to be the zero-level cooling strategy. It can be understood that in this embodiment, by obtaining the historical vehicle usage environment time period when cooling control is not required, it is possible to determine whether the user's current vehicle usage environment time period does not require cooling control. Without collecting the vehicle's internal ambient temperature, it is possible to determine whether the target cooling strategy at the current vehicle usage moment is the zero-level cooling strategy. This achieves precise adjustment of the corresponding cooling strategy based on the user's usage habits, achieving precise transient response temperature control.

[0137] It is worth noting that if there are many historical periods when the temperature is not high, for example, the user's vehicle usage environment period is all historical period, the heat dissipation devices can be reduced to reduce costs.

[0138] In some embodiments, the method may further include the following steps:

[0139] S600: Establishing a correspondence between historical vehicle usage data of a vehicle user and a corresponding historical cooling gear when the ambient temperature inside the vehicle meets a preset temperature condition, where the historical cooling gear is one of a first gear, a second gear, a first target gear, or a second target gear;

[0140] S700: Determine the target cooling gear of the vehicle at the current moment based on the user's current vehicle usage data and the corresponding relationship.

[0141] Among them, car usage data refers to data related to the user's car usage, such as the time period of the user's car usage, the user's car usage habits, the frequency of using different APPs, etc. The heat dissipation gear is the gear of the user's target heat dissipation strategy in the usage scenario corresponding to the car usage data. The user's historical car usage data can be collected through the AI big model, and the corresponding historical heat dissipation gear can be obtained. The historical heat dissipation gear can be one of the first gear, the second gear, the first target gear or the second target gear, that is, the historical heat dissipation gear can be determined based on the chip current data, the chip computing power data, the chip current data and the chip computing power data, as well as the chip current data after heat dissipation and the chip computing power data after heat dissipation.

[0142] The corresponding relationship refers to the mapping relationship between the vehicle user's historical vehicle usage data and the corresponding historical cooling gear when the ambient temperature inside the vehicle meets the preset temperature conditions, that is, the mapping relationship between the historical vehicle usage data and the corresponding historical cooling gear when cooling control needs to be turned on.

[0143] Specifically, based on the user's current vehicle usage data, a historical cooling gear level that is mapped to the current vehicle usage data can be obtained from the corresponding relationship and determined as the vehicle's target cooling gear level at the current moment. It can be understood that in this embodiment, by establishing a corresponding relationship between the vehicle user's historical vehicle usage data and the corresponding historical cooling gear levels, the target cooling gear level of the current target cooling strategy can be determined simply based on the corresponding relationship and the user's current vehicle usage data. This eliminates the need to collect the vehicle's internal ambient temperature or obtain chip operating data, allowing the target cooling strategy to be quickly determined, thus achieving transient cooling control.

[0144] In some embodiments, the historical vehicle usage data includes the user's historical vehicle usage scenarios. Step S600 may include the following steps:

[0145] S610: Obtaining historical current data and / or historical computing power data of each of the heat dissipation chips under different historical vehicle usage scenarios of the user when the ambient temperature inside the vehicle meets a preset temperature condition;

[0146] S620: Determine a historical cooling gear corresponding to a historical vehicle usage scenario based on historical current data and / or historical computing power data;

[0147] S630: Construct a mapping relationship between historical vehicle usage scenarios and historical cooling gears to obtain a corresponding relationship.

[0148] Among them, the car usage scenario refers to the scenario in which the user uses the car, such as the user's car usage habits or the frequency and time period of the user's use of different APPs.

[0149] Specifically, a large AI model can be used to collect the user's historical vehicle usage scenarios and obtain the historical current data and / or historical computing power data of each chip to be cooled under different historical vehicle usage scenarios. Based on the historical current data and / or historical computing power data, the historical cooling gear is determined using the above-mentioned determination method of the first gear, the second gear, the first target gear, or the second target gear. A mapping relationship between the historical vehicle usage scenarios and the historical cooling gears is then constructed to obtain a corresponding relationship. In this embodiment, by constructing a mapping relationship between the historical vehicle usage scenarios and the historical cooling gears to obtain a corresponding relationship, the target cooling strategy can be quickly determined without subsequently collecting the vehicle's internal ambient temperature or obtaining chip operating data, thereby achieving transient cooling control.

[0150] In some embodiments, the historical vehicle usage data includes the user's historical vehicle usage scenarios. Step S700 may include the following steps:

[0151] S710: Determine the target cooling gear of the vehicle at the current moment based on the user's current vehicle usage scenario and the corresponding relationship.

[0152] Specifically, by searching the corresponding relationship for historical cooling gears that are mapped to the current vehicle usage scenario, the target cooling gear for the vehicle at the current moment can be obtained. It can be understood that this embodiment can quickly determine the target cooling strategy and achieve transient cooling control without collecting the vehicle's internal ambient temperature or obtaining chip operating data.

[0153] In one embodiment, Figure 6 Figure 1 shows a flow chart for determining cooling measures based on user vehicle usage data. This process collects user vehicle usage data, cooling levels for different seasons and time periods, and data on different chip currents and computing power. Subsequent identification of the vehicle's internal ambient temperature is unnecessary. Based on chip current and computing power data, as well as the frequency and time of user app usage, a large AI model is used to output the cooling level corresponding to the user's vehicle usage data. For example, if a user frequently opens a large app that requires significant chip computing power, the AI model records the user's usage scenarios and, upon subsequent use, activates the corresponding cooling level for customized processing. This simulates user usage scenarios and predicts user habits in advance. Customized cooling measures are then activated based on the user's behavior as soon as the vehicle enters the vehicle. Dynamic adjustments to the cooling level are also made during driving. Once the database covers all user scenarios, customized cooling levels can be activated based on the collected user vehicle usage data for different apps and behaviors. This eliminates the need for hardware control strategies; instead, the AI model leverages the collected big data to analyze and adjust the strategy, activating the appropriate cooling level accordingly. Ultimately, the entire cooling system will form corresponding cooling measures based on user habits, forming a customized and humanized cooling solution.

[0154] It should be noted that the above specific implementation is a customized cooling measure for a single user. This can be extended to the global market. When there are sufficient global data samples, for example, in countries with lower temperatures, where cooling requirements are less demanding, differentiated cooling configurations can be used during the design and development phase to achieve cost reduction and efficiency improvement.

[0155] The above-mentioned vehicle heat dissipation control method performs heat dissipation control by combining the ambient temperature inside the vehicle and the chip operation data, or directly performs heat dissipation control based on the chip operation data, thereby overcoming the delay problem caused by temperature-based heat dissipation control. In addition, the chip operation data has high accuracy, which improves the accuracy and timeliness of the vehicle's heat dissipation control, thereby improving the vehicle's heat dissipation effect.

[0156] It should be understood that, although the steps in the flowcharts of the above embodiments are shown in sequence as indicated by the arrows, these steps are not necessarily performed in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order restriction on the execution of these steps, and these steps can be performed in other orders. Moreover, at least a portion of the steps in the flowcharts of the above embodiments may include multiple steps or multiple stages, and these steps or stages are not necessarily performed at the same time, but can be performed at different times. The execution order of these steps or stages is not necessarily to be performed in sequence, but can be performed in turn or alternately with other steps or at least a portion of steps or stages in other steps.

[0157] According to a second aspect of the present application, based on the same inventive concept, the present application further provides a vehicle heat dissipation control device for implementing the vehicle heat dissipation control method involved in the aforementioned embodiment where a computer device is the execution subject. The implementation solution provided by this device is similar to the implementation solution described in the aforementioned method. Therefore, the specific limitations of one or more vehicle heat dissipation control device embodiments provided below can be found in the above-mentioned limitations of the vehicle heat dissipation control method involved in the embodiment where a computer device is the execution subject, and will not be repeated here.

[0158] According to a third aspect of the present application, embodiments of the present application further provide a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps of the above-described vehicle control method. This non-transitory computer-readable storage medium has all the beneficial effects of the above-described vehicle control method, and this application will not further elaborate on them.

[0159] According to a third aspect of the present application, embodiments of the present application further provide a computer device comprising: a memory and a processor, wherein the memory stores a computer program; the processor is configured to execute the computer program in the memory to implement the steps of the aforementioned vehicle control method. This computer device has all the beneficial effects of the aforementioned vehicle control method, and this application will not further elaborate on them.

[0160] The computer-readable storage medium may be, for example, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, device, or any combination thereof, and this application does not specifically limit this. More specific examples of computer-readable storage media may include, but are not limited to, an electrical connection having one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination thereof.

[0161] In some embodiments of the present application, a computer-readable storage medium may be any tangible medium that can contain or store a program for use by or in connection with an instruction execution system, apparatus, or device.

[0162] The computer-readable storage medium may be included in the computer device or may exist independently without being incorporated into the computer device. The computer-readable storage medium carries one or more programs. When the one or more programs are executed by the computer device, the computer device:

[0163] A target heat dissipation strategy for the chip to be cooled is determined based on the ambient temperature inside the vehicle and the chip operation data of the chip to be cooled in the vehicle, or a target heat dissipation strategy for the chip to be cooled is determined based on the chip operation data of the chip to be cooled in the vehicle.

[0164] Computer program code for performing the operations of some embodiments of the present application can be written in one or more programming languages or a combination thereof, including object-oriented programming languages such as Java, Smalltalk, C++, and conventional procedural programming languages such as "C" or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a separate software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving a remote computer, the remote computer can be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or can be connected to an external computer (for example, through the Internet using an Internet service provider).

[0165] The flowcharts and block diagrams in the accompanying drawings illustrate the possible architectures, functions, and operations of the apparatus, methods, and computer program products according to various embodiments of the present application. In this regard, each box in the flowchart or block diagram may represent a module, program segment, or portion of code, which contains one or more executable instructions for implementing a specified logical function.

[0166] It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures.

[0167] For example, two blocks shown in succession may actually be executed substantially in parallel, or they may sometimes be executed in the reverse order, depending on the functionality involved. It should also be noted that each block in the block diagrams and / or flow charts, and combinations of blocks in the block diagrams and / or flow charts, may be implemented using a dedicated hardware-based system that performs the specified functions or operations, or may be implemented using a combination of dedicated hardware and computer instructions.

[0168] The units described in some embodiments of the present application may be implemented in software or in hardware. The described units may also be provided in a processor, for example, may be described as: a processor including a control module. The names of these units do not, in some cases, constitute a limitation on the units themselves, for example, the control module may also be described as "used to determine the target heat dissipation strategy of the chip to be dissipated based on the ambient temperature inside the vehicle and the chip operating data of the chip to be dissipated in the vehicle, or, to determine the target heat dissipation strategy of the chip to be dissipated based on the chip operating data of the chip to be dissipated in the vehicle."

[0169] The functions described above herein may be performed, at least in part, by one or more hardware logic components. For example, and without limitation, exemplary types of hardware logic components that may be used include: field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), system chips, complex programmable logic devices (CPLDs), and the like.

[0170] According to the fifth aspect of this application, Figure 7 As shown, the embodiment of the present application further provides a vehicle 10, which includes the above-mentioned computer device. The vehicle has all the beneficial effects of the above-mentioned computer device, etc., which will not be repeated in this application.

[0171] The vehicle may be a fuel vehicle, a plug-in hybrid vehicle or a new energy vehicle, etc., and this application does not make any specific restrictions on this.

[0172] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0173] The embodiments, implementation methods and related technical features of the present application can be combined and replaced with each other without conflict.

[0174] The above are merely preferred embodiments of the present application and do not constitute any form of limitation to the present application. Although the descriptions of each embodiment in the embodiments of the present application have different focuses, for parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments. However, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application are still within the scope of the technical solution of the present application.

Claims

1. A method for controlling heat dissipation of a vehicle, characterized in that: The method comprises: A target heat dissipation strategy for the chip to be cooled is determined based on the ambient temperature inside the vehicle and the chip operation data of the chip to be cooled in the vehicle, or a target heat dissipation strategy for the chip to be cooled is determined based on the chip operation data of the chip to be cooled in the vehicle.

2. The method according to claim 1, characterized in that The determining a target heat dissipation strategy for the chip to be cooled according to the ambient temperature inside the vehicle and chip operation data of the chip to be cooled in the vehicle includes: When it is detected that the ambient temperature inside the vehicle meets a preset temperature condition, obtaining chip operation data of the chip to be cooled; A target heat dissipation strategy for the chip to be cooled is determined according to the chip operation data.

3. The method according to claim 1, characterized in that The determining a target heat dissipation strategy for the chip to be cooled according to the chip operation data of the chip to be cooled of the vehicle includes: Obtaining chip operation data of the chip to be cooled; A target heat dissipation strategy for the chip to be cooled is determined according to the chip operation data.

4. The method according to claim 2 or 3, characterized in that The chip operation data includes chip current data and / or chip computing power data; and obtaining the chip operation data of the chip to be cooled includes: Acquire a plurality of current data of the chip to be cooled within a first preset time period, and obtain the chip current data based on the current data; and / or, A plurality of computing power data of the chip to be cooled within a second preset time period is acquired, and the chip computing power data is obtained based on the computing power data.

5. The method according to claim 4, characterized in that include: determining minimum current data among the current data as chip current data; and / or, The minimum computing power data among the computing power data is determined as the chip computing power data.

6. The method according to claim 2 or 3, characterized in that The target heat dissipation strategy is one of N gear heat dissipation strategies; the N gear heat dissipation strategies correspond to the 1st gear heat dissipation strategy to the Nth gear heat dissipation strategy, where N is a natural number greater than 1.

7. The method according to claim 6, characterized in that The determining of the target heat dissipation strategy for the chip to be cooled according to the chip operation data includes: When the chip current data is greater than or equal to the i-level current value and less than the i+1-level current value, the target heat dissipation strategy is determined to be the i-level heat dissipation strategy, where i∈[1,N]; or When the chip computing power data is greater than or equal to the i-level computing power value and less than the i+1-level computing power value, the target heat dissipation strategy is determined to be the i-level heat dissipation strategy.

8. The method according to claim 6, characterized in that Also includes: Obtaining a first gear corresponding to a target heat dissipation strategy determined according to the chip current data, and obtaining a second gear corresponding to a target heat dissipation strategy determined according to the chip computing power data; A first target gear position corresponding to a target heat dissipation strategy is determined according to the first gear position and the second gear position.

9. The method according to claim 8, characterized in that The determining a first target gear position corresponding to the target heat dissipation strategy according to the first gear position and the second gear position includes: The highest gear position among the first gear position and the second gear position is determined as a first target gear position.

10. The method according to claim 7, characterized in that When the chip current data is greater than or equal to the i-level current value and less than the i+1-level current value, after determining that the target heat dissipation strategy is the i-level heat dissipation strategy, the method further includes: In the process of cooling the chip to be cooled using the i-level cooling strategy, continuously acquiring chip current data after cooling, and acquiring current cooling capacity data of the chip to be cooled; The i-level heat dissipation strategy is updated according to the chip current data after heat dissipation and the current heat dissipation capacity data.

11. The method according to claim 10, characterized in that The obtaining of chip current data after heat dissipation includes: Acquire a plurality of first heat dissipation current data of the chip to be cooled during heat dissipation in a third preset time period; The chip current data after heat dissipation is obtained based on the first heat dissipation current data.

12. The method according to claim 11, characterized in that The obtaining the chip current data after heat dissipation based on the first heat dissipation current data includes: The minimum current data in the first heat dissipation current data is determined as the chip current data after heat dissipation.

13. The method according to claim 10, characterized in that The current heat dissipation capability data includes the current temperature of the chip to be cooled.

14. The method according to claim 10, characterized in that Updating the i-level heat dissipation strategy according to the chip current data after heat dissipation and the current heat dissipation capability data includes: If the current heat dissipation capacity data satisfies the preset downshift condition, the gear corresponding to the i-gear heat dissipation strategy is updated according to the chip current data after heat dissipation, and the updated gear is less than or equal to gear i; If the current heat dissipation capacity data meets the preset gear-up condition, the gear corresponding to the i-gear heat dissipation strategy is updated according to the chip current data after heat dissipation, and the updated gear is greater than or equal to i-gear and less than or equal to N-gear.

15. The method according to claim 7, characterized in that When the chip computing power data is greater than or equal to the i-level computing power value and less than the i+1-level computing power value, after determining that the target heat dissipation strategy is the i-level heat dissipation strategy, the method further includes: In the process of cooling the chip to be cooled using the i-level cooling strategy, continue to obtain chip computing power data after cooling, and obtain current cooling capacity data of the chip to be cooled; The i-level heat dissipation strategy is updated according to the chip computing power data after heat dissipation and the current heat dissipation capacity data.

16. The method according to claim 15, characterized in that The obtaining of chip computing power data after heat dissipation includes: Acquire a plurality of first heat dissipation computing power data of the chip to be cooled during the heat dissipation process of the chip to be cooled in a fourth preset time period; Based on the first heat dissipation computing power data, the chip computing power data after heat dissipation is obtained.

17. The method according to claim 16, characterized in that The obtaining the chip computing power data after heat dissipation based on the first heat dissipation computing power data includes: The minimum computing power data among the first heat dissipation computing power data is determined as the chip computing power data after heat dissipation.

18. The method according to claim 15, characterized in that The current heat dissipation capability data includes the current temperature of the chip to be cooled.

19. The method according to claim 10, characterized in that Updating the i-level heat dissipation strategy according to the chip computing power data after heat dissipation and the current heat dissipation capacity data includes: If the current heat dissipation capacity data meets the preset downshift condition, the gear corresponding to the i-gear heat dissipation strategy is updated according to the chip computing power data after heat dissipation, and the updated gear is less than or equal to gear i; If the current heat dissipation capacity data meets the preset gear-up condition, the gear corresponding to the i-gear heat dissipation strategy is updated according to the computing power current data after heat dissipation, and the updated gear is greater than or equal to gear i and less than or equal to gear N.

20. The method according to claim 9, wherein After determining the highest gear of the first gear and the second gear as the first target gear, the method further includes: When the first target gear is the first gear, continue to obtain the cumulative heat and multiple second heat dissipation computing power data during the fifth preset time period of the heat dissipation process of the chip to be cooled using the heat dissipation strategy under the first gear; Updating the first gear according to the accumulated heat to obtain an updated first gear, and updating the second gear according to the plurality of second heat dissipation computing power data to obtain an updated second gear; When the updated first gear and the updated second gear are inconsistent, the steps of continuing to obtain the cumulative heat during the fifth preset time period of the heat dissipation process of the chip to be cooled using the heat dissipation strategy under the first gear and multiple second heat dissipation computing power data are repeated until the updated first gear and the updated second gear are consistent, and the second target gear is obtained.

21. The method according to claim 8, characterized in that After determining the highest gear of the first gear and the second gear as the first target gear, the method further includes: When the first target gear is the second gear, continue to obtain the accumulated computing power and a plurality of second heat dissipation current data during the heat dissipation process of the chip to be cooled for a sixth preset time period using the heat dissipation strategy under the second gear; updating the second gear position according to the accumulated power to obtain an updated second gear position, and updating the first gear position according to the plurality of second heat dissipation current data to obtain an updated first gear position; When the updated first gear and the updated second gear are inconsistent, the steps of continuing to obtain the cumulative power and multiple second heat dissipation current data during the sixth preset time period of heat dissipation of the chip to be cooled using the heat dissipation strategy under the second gear are repeated until the updated first gear and the updated second gear are consistent, thereby obtaining the second target gear.

22. The method according to claim 2, characterized in that Also includes: When it is detected that the ambient temperature inside the vehicle does not meet the preset temperature condition, it is determined that the target heat dissipation strategy is the 0-level heat dissipation strategy.

23. The method according to claim 22, characterized in that Also includes: Collecting a historical vehicle usage environment period of a user of the vehicle when the ambient temperature inside the vehicle does not meet the preset temperature condition, the historical vehicle usage environment period including a plurality of historical periods; When the current vehicle usage environment period of the user is consistent with the historical period, the target heat dissipation strategy is determined to be the 0-level heat dissipation strategy.

24. The method according to claim 21, characterized in that Also includes: Establishing a correspondence between historical vehicle usage data of a user of the vehicle and a corresponding historical cooling gear when the ambient temperature inside the vehicle satisfies the preset temperature condition, the historical cooling gear being one of the first gear, the second gear, the first target gear, or the second target gear; The target cooling gear of the vehicle at the current moment is determined according to the user's current vehicle usage data and the corresponding relationship.

25. The method according to claim 24, characterized in that The historical vehicle usage data includes the historical vehicle usage scenarios of the user; the correspondence between the historical vehicle usage data of the user of the vehicle and the corresponding historical cooling gear when the ambient temperature inside the vehicle meets the preset temperature condition includes: Acquire historical current data and / or historical computing power data of each of the chips to be cooled under different historical vehicle usage scenarios of the user when the ambient temperature inside the vehicle meets the preset temperature condition; Determining a historical heat dissipation gear corresponding to the historical vehicle usage scenario based on the historical current data and / or the historical computing power data; A mapping relationship between the historical vehicle usage scenarios and the historical heat dissipation gears is constructed to obtain the corresponding relationship.

26. The method according to claim 25, characterized in that The determining, based on the user's current vehicle usage data and the corresponding relationship, a target cooling gear of the vehicle at a current moment includes: According to the user's current vehicle usage scenario and the corresponding relationship, a target cooling gear of the vehicle at the current moment is determined.

27. A heat dissipation control device for a vehicle, characterized in that: The device comprises: A determination module is used to determine a target heat dissipation strategy for the chip to be cooled based on the ambient temperature inside the vehicle and the chip operating data of the chip to be cooled in the vehicle, or to determine the target heat dissipation strategy for the chip to be cooled based on the chip operating data of the chip to be cooled in the vehicle.

28. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the heat dissipation control method for a vehicle according to any one of claims 1 to 26 is implemented.

29. A computer program product comprising a computer program, characterized in that When the computer program is executed by a processor, the heat dissipation control method for a vehicle according to any one of claims 1 to 26 is implemented.

30. A computer device, characterized in that: include: a memory having a computer program stored thereon; A processor, configured to execute the computer program in the memory to implement the heat dissipation control method for a vehicle according to any one of claims 1 to 26.

31. A vehicle, characterized in that: Comprising the computer device of claim 30.

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