Semiconductor device and power conversion device

Abstract

A semiconductor device having a semiconductor module and a power conversion device are provided with: a first cooling member and a second cooling member which are disposed on both surfaces of the semiconductor module, respectively, and through which a refrigerant flows; and a connection member that connects a first opening into which the refrigerant flows into the first cooling member and a second opening out of which the refrigerant is discharged from the first cooling member between the first cooling member and the second cooling member, and a second opening into which the refrigerant is discharged from the second cooling member between the first cooling member and the second cooling member. The second opening part flows the refrigerant into the second cooling component and discharges the refrigerant from the second cooling component between the second opening part and the first cooling component; and a sealing member disposed on the outer periphery of the connecting member at a position between the first cooling member and the second cooling member, the connecting member having a connecting member end portion extending into the second cooling member. The connecting member end portion includes a fixing portion formed by being bent along an inner wall surface of the second cooling member.

Description

Technical Field

[0001] The present invention relates to a semiconductor device and a power conversion device. Background Art

[0002] In a power conversion device structure that cools a power module by providing a water channel sandwiching the upper and lower portions of the power module, the water pressure from the refrigerant flowing through the water channel exerts a force on the seal at the connection between the power module and the upper and lower water channels, tending to separate the power module from the water channel. Therefore, a typical structure employs a leaf spring, leaf spring retaining member, and fastening member to secure the water channel and ensure the reliability of the seal. For example, Patent Document 1 below discloses a cooling device structure that forms a flow channel by overlapping finned components, enabling cost-effective manufacturing. Prior art literature Patent Literature

[0003] Patent Document 1: Japanese Patent Application Laid-Open No. 2022-029977 Summary of the Invention Problems to be solved by the invention

[0004] In the technology described in Patent Document 1, the watertightness between the upper and lower water channels is achieved by sealing with O-rings, which requires bolts to secure the O-rings. In order to achieve a device with the same structure while eliminating these bolts, the present invention aims to provide a semiconductor device and power conversion device that maintains cooling performance while further reducing the number of components and improving production efficiency. Technical means to solve the problem

[0005] 19. The cooling element as claimed in claim 18, wherein the cooling element is a first cooling member and a second cooling member, wherein the cooling element is arranged on opposite sides of the cooling element and allows a refrigerant to circulate therein; a connecting member connecting a first opening and a second opening, wherein the refrigerant flows into the first cooling member and is discharged from the first cooling member between the first opening and the second cooling member, and the refrigerant flows into the second cooling member and is discharged from the second cooling member between the second opening and the first cooling member; and a sealing member arranged on the periphery of the connecting member at a position between the first cooling member and the second cooling member, the connecting member having a connecting member end portion extending toward the interior of the second cooling member, the connecting member end portion including a fixing portion formed by bending along an inner wall surface of the second cooling member. Effects of the Invention

[0006] A semiconductor device and a power conversion device can be provided that maintain cooling performance while further reducing the number of components and improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 This is a circuit diagram of a power conversion device connected to a rotating electrical machine. Figure 2 This is a circuit diagram of a single-phase semiconductor module. Figure 3 It is an overall perspective view of the semiconductor device according to the first embodiment of the present invention. Figure 4 yes Figure 3 An overall exploded view of a semiconductor device. Figure 5 1 is a cross-sectional view of a connection portion between cooling members of a semiconductor device according to a first embodiment of the present invention ( Figure 3 AA cross-section of the ). Figure 6 It is an explanatory diagram of a method for forming the first fixing portion according to the first embodiment of the present invention. Figure 7 It is a cross-sectional view of a connection portion between cooling members of a semiconductor device according to a second embodiment of the present invention. Figure 8 It is a cross-sectional view of a connection portion between cooling members of a semiconductor device according to a third embodiment of the present invention. Figure 9 It is a cross-sectional view of a connection portion between cooling members of a semiconductor device according to a fourth embodiment of the present invention. Figure 10 It is an overall perspective view of a semiconductor device according to a fifth embodiment of the present invention. Figure 11 yes Figure 10 A cross-sectional view of a connection portion between cooling components of a semiconductor device. DETAILED DESCRIPTION

[0008] The following describes embodiments of the present invention with reference to the accompanying drawings. The following description and drawings are examples for illustrating the present invention and have been omitted or simplified as appropriate for clarity of description. The present invention may also be implemented in various other forms. Unless otherwise specified, each component may be singular or plural.

[0009] To facilitate understanding of the invention, the positions, sizes, shapes, and ranges of the components shown in the drawings may not necessarily represent their actual positions, sizes, shapes, and ranges. Therefore, the present invention is not necessarily limited to the positions, sizes, shapes, and ranges disclosed in the drawings.

[0010] (First embodiment and overall structure of the present invention) ( Figure 1 ) Power converter 1 converts DC power input from a DC power source 2, which is a battery, into AC power and outputs it to motor 6. Power converter 1 includes capacitor 3, control device 4, upper arm 300U, and lower arm 300L. Capacitor 3 smoothes the DC power output from DC power source 2 to the switching elements of power converter 1. Control device 4 controls the switching operation of upper arm 300U and lower arm 300L, which serve as switching elements, related to power conversion.

[0011] ( Figure 2 ) Semiconductor module 300, which functions as a power module, includes power semiconductor elements 321U, 321L, 322U, and 322L. Power semiconductor elements 321U and 321L are IGBTs (Insulated Gate Bipolar Transistors). Power semiconductor elements 322U and 322L are diodes. Alternatively, power semiconductor elements 321U, 321L, 322U, and 322L may be replaced with FETs (field-effect transistors).

[0012] Semiconductor module 300 consists of an upper arm 300U and a lower arm 300L. Upper arm 300U includes a power semiconductor element 321U and a diode 322U. Lower arm 300L also includes a power semiconductor element 321L and a diode 322L. Upper arm 300U has a DC positive terminal 311 and a signal terminal 314. Lower arm 300L has a DC negative terminal 312 and a signal terminal 315.

[0013] The DC positive terminal 311 and the DC negative terminal 312 are connected to the capacitor 3 and the like, and supply power to the power semiconductor elements 321U, 321L, 322U, and 322L from outside the semiconductor module 300. Signal terminals 314 and 315 are connected to a control substrate including the control device 4, whereby the switching operation of the power semiconductor elements 321U and 321L is controlled by the control device 4.

[0014] The semiconductor module 300 includes an AC terminal 313 . The AC terminal 313 electrically connects the upper arm 300U and the lower arm 300L, and outputs AC power converted from DC power by power semiconductor elements 321U and 321L as switching elements to the outside of the semiconductor module 300 .

[0015] ( Figure 3 ) The semiconductor device 100 constituting the power conversion device 1 has a semiconductor unit with a cooler, and includes at least one semiconductor module 300 on which a semiconductor element is mounted, a first cooling member 101, and a second cooling member 201. Figure 3 As shown, the semiconductor device 100 is equipped with a three-phase semiconductor module 300 , thereby forming a three-phase power conversion circuit. The three-phase semiconductor module 300 is molded and sealed with a sealing resin 330 .

[0016] The positive electrode terminal 311 of each semiconductor module 300 is exposed from the sealing resin 330. The negative electrode terminal 312 of each semiconductor module 300 is exposed from the sealing resin 330. The AC terminal 313 of each semiconductor module 300 is exposed from the sealing resin 330. The signal terminals 314 and 315 of each semiconductor module 300 are exposed from the sealing resin 330.

[0017] The semiconductor module 300 has a first cooling member 101 and a second cooling member 201 disposed on both sides thereof, in contact with each other. Thus, the semiconductor module 300 is sandwiched between the first cooling member 101 and the second cooling member 201 and is cooled by the refrigerant flowing through the first cooling member 101 and the second cooling member 201.

[0018] The second cooling member 201 has at least four flanges 202. Each flange 202 has a through hole 203. Fastening members such as screws and bolts are inserted into the through holes 203, thereby fixing the semiconductor device 100 to a housing (not shown) of the power conversion device 1.

[0019] ( Figure 4 ) The semiconductor module 300 has a plurality of heat dissipation surfaces 340 for dissipating heat from within the semiconductor module 300. The heat dissipation surfaces 340 are exposed surfaces provided on both sides of the semiconductor module 300 (the back side is not shown) and are not mold-sealed with the sealing resin 330. The semiconductor module 300, having these heat dissipation surfaces 340, dissipates heat generated within the semiconductor module 300 to the outside of the semiconductor module 300.

[0020] Adhesive members 500 are disposed between the semiconductor module 300 and the first cooling member 101, and between the semiconductor module 300 and the second cooling member 201, respectively. The adhesive members 500 are both thermally conductive and insulating, and are positioned so that the semiconductor module 300 is sandwiched therebetween. The adhesive members 500 are thermally connected to the heat dissipation surface 340. This improves the reliability of the connection between the semiconductor module 300 and the cooling members 101 and 201. Furthermore, if an insulating layer is provided within the semiconductor module 300, the adhesive member 500 does not necessarily have insulating properties.

[0021] The first cooling member 101 includes a cover 110, first fins 130, and first fin bases 140. The first cooling member 101 is connected to a connecting member 150. These members are made of aluminum alloy or copper alloy and are integrally joined by a joining method such as brazing.

[0022] The first fin base 140 has two first fin base openings 141. The first fin base openings 141 are openings for allowing refrigerant to flow into and out of the first cooling member 101 between the first fin base 140 and the second cooling member 201. The first fin base openings 141 are formed at both ends of the first fin base 140 so as to sandwich the first fins 130.

[0023] The first cooling member 101 includes a first fin housing portion 111 (described later) that houses first fins 130, which are heat sinks that dissipate heat from the semiconductor module 300. The first fin housing portion 111 is housed in a first fin housing portion 111 formed by the cover 110 and the first fin base 140, and is joined to the cover 110 and the first fin base 140, respectively.

[0024] The connecting member 150 has a connecting flow path 151. The connecting member 150 is joined to the first fin base 140. The connecting member 150 is arranged at a position where the connecting flow path 151 communicates with the first fin base opening 141 to form a flow path.

[0025] The second cooling member 201 includes a water channel base 210, a frame 220, second fins 230, and a second fin base 240. These members are made of aluminum alloy or copper alloy and are integrally joined together by a joining method such as brazing.

[0026] The water channel base 210 has two water channel base openings 211. The water channel base openings 211 allow refrigerant to flow into the second cooling member 201 and discharge refrigerant from the second cooling member 201. The water channel base openings 211 are formed at both ends of the water channel base 210 so as to sandwich the second fin 230. Of the two water channel base openings 211, one serves as an inlet hole for introducing refrigerant from the outside into the second cooling member 201, and the other serves as a discharge hole for discharging refrigerant from the second cooling member 201 to the outside. The water channel base opening 211 is an opening formed in the second cooling member 201 at a position opposite to the fixing portion 154 described later.

[0027] The frame 220 includes a second fin housing 221 that houses the second fins 230, which are heat sinks that dissipate heat from the semiconductor module 300. The second fin base 240 includes two second fin base openings 241. The second fin base openings 241 are formed at both ends of the second fin base so as to sandwich the second fins 230.

[0028] The two second fin base openings 241 are openings for the flow of refrigerant into and out of the first cooling member 101 and the second cooling member 201. The refrigerant introduced from the water channel base opening 211 is supplied from the second cooling member 201 to the first cooling member 101 via one of the two second fin base openings 241, and flows back from the first cooling member 101 to the second cooling member 201 via the other of the two second fin base openings 241.

[0029] The second fin 230 is housed in the second fin housing 221, with its two surfaces sandwiched between the waterway base 210 and the second fin base 240 and joined to various components. The frame 220 is sandwiched between the waterway base 210 and the second fin base 240 and joined to various components, thereby forming the second fin housing 221.

[0030] The first cooling member 101 and the second cooling member 201 are connected to form a single flow path via the connecting flow path 151 of the connecting member 150, the first fin base opening 141, and the second fin base opening 241. Therefore, the connecting member 150 connects the first fin base opening 141 and the second fin base opening 241.

[0031] The sealing member 400 is disposed on the outer periphery of the connecting member 150 between the first cooling member 101 and the second cooling member 201 and is disposed so as to contact the connecting member 150 and the second fin base 240. This ensures that the connection between the connecting member 150 and the second cooling member 201 is watertight.

[0032] The flow of refrigerant will be described. Refrigerant is supplied to the second cooling member 201 through one of the two water channel base openings 211. The refrigerant flow path within the second cooling member 201 is divided into a path toward the second fins 230 in the second fin housing 221, and a path from the second fin base opening 241 to the first fin housing 111 via the connecting flow path 151. The refrigerant that has passed through the first fins 130 in the first fin housing 111 flows back to the second cooling member 201 through the other connecting flow path 151, merges with the refrigerant that has passed through the second fins 230, and is discharged to the outside of the second cooling member 201 through the other water channel base opening 211.

[0033] ( Figure 5 ) Figure 5 yes Figure 3 The first cooling member 101 is formed with a first fin housing portion 111 by a cover 110 and a first fin base 140 . The first fin 130 is disposed in the first fin housing portion 111 .

[0034] The connecting member 150 connects the first cooling member 101 and the second cooling member 201. A sealing member receiving portion 152 is provided between the first cooling member 101 and the second cooling member 201 and on the outer periphery of the connecting member 150. The sealing member receiving portion 152 receives the sealing member 400, which is in close contact with the outer wall surface of the second fin base 240, thereby ensuring the watertightness of the water channel between the first cooling member 101 and the second cooling member 201.

[0035] The second fin base 240 includes a sealing member installation portion 243. The sealing member installation portion 243 is the portion surrounding the second fin base opening 241 and is a portion of the outer wall surface of the second fin base 240 to which the sealing member 400 is in close contact. The sealing member 400 is in contact with and in close contact with the sealing member installation portion 243, thereby ensuring watertightness of the water passage between the first cooling member 101 and the second cooling member 201.

[0036] In the second cooling member 201, the second fin base 240 includes an inclined portion 245 inclined toward the first cooling member 101 and a flat portion 244 extending from the inclined portion 245 to and in contact with the outer peripheral surface of the connecting member 150. The sealing member installation portion 243 is formed on the flat portion 244.

[0037] The connecting member 150 has a connecting member end portion 155 extending into the second cooling member 201. The connecting member end portion 155 includes a fixing portion 154 formed by bending the connecting member end portion 155 toward the inner wall surface of the second cooling member 201.

[0038] The connecting member 150 includes a connecting flow path wall 153 with which the refrigerant flowing through the connecting flow path 151 and the second cooling member 201 contacts. The connecting flow path wall 153 is inserted into the second cooling member 201 through the second fin base opening 241. The connecting flow path wall 153 is bent toward the flow path inner wall surface of the second fin base 240 so that the sealing member installation portion 243 accommodates the sealing member 400 in the sealing member accommodation portion 152. This allows the sealing member 400 to contact the sealing member installation portion 243, forming a fixing portion 154 within the second cooling member 201 that holds the sealing member 400 in the sealing member accommodation portion 152.

[0039] The second fin base 240 has a flat portion 244 and an inclined portion 245, thereby forming a connecting flow path accommodating portion 242. The connecting flow path accommodating portion 242 has a space capable of accommodating the fixing portion 154 formed in the second cooling member 201. Since the fixing portion 154 is formed by bending the connecting member end 155, the height of the connecting flow path accommodating portion 242 is preferably greater than the thickness of the fixing portion 154. As a result, in the second cooling member 201, the flow of the refrigerant flowing toward the second fin 230 side is not hindered by the thickness of the fixing portion 154, thereby preventing a reduction in the cooling performance of the second cooling member 201 due to difficulty in the flow of the refrigerant.

[0040] As shown in the figure, the diameter W2 of the water channel base opening 211 is larger than the inner diameter W1 of the top end of the fixing portion 154. This makes it easier to insert a tool, described later, for forming the fixing portion 154 through the water channel base opening 211 into the second cooling member 201. The fixing portion 154 can be formed after the first cooling member 101 and the second cooling member 201 are assembled, thereby improving production efficiency.

[0041] In the first cooling member 101, the cover 110 has a cover brazing portion 112. Figure 5 In the cross section of FIG. 1 , the cover soldering portion 112 is formed in the thickness direction of the semiconductor device 100 ( Figure 5 At a position where the sealing member 400 and the fixing portion 154 overlap in the vertical direction).

[0042] When the fixing portion 154 is formed using a fixing portion forming tool (described later) for forming the fixing portion 154, the cover brazing portion 112 receives the force of pressing the first cover 110 from the first fin base 140, among the forces generated by pressing the fixing portion 154. This can suppress deformation of the first cooling member 101, which is likely to occur when forming the fixing portion 154.

[0043] The first fin 130 is Figure 5 The length direction of the cross section ( Figure 5 The left and right directions) are larger than the second fin 230. In the first cooling member 101, Figure 5 On the cross section of FIG. 1 , a portion of the first fin 130 is arranged in the stacking direction ( Figure 5 At a position where the sealing member 400 and the fixing portion 154 overlap in the vertical direction).

[0044] When the fixing portion 154 is formed using a tool for forming the fixing portion 154 (described later), the first fin 130 receives a force from the first fin base 140 pressing against the interior of the first cooling member 101, part of the force generated by the pressing of the fixing portion 154. This can suppress deformation of the first cooling member 101, which is likely to occur when forming the fixing portion 154.

[0045] ( Figure 6 ) Figure 6 (a) is a cross-sectional view of the connection portion between the cooling components of the semiconductor device before the fixing portion 154 is formed. Figure 6 (b) is Figure 6 The perspective view of viewpoint B in (a) is a perspective view from which the second cooling member 201 and the sealing member 400 are removed. Figure 6 (c) is a cross-sectional view of the connection portion between the cooling components of the semiconductor device after the fixing portion 154 is formed. Figure 6 (d) is Figure 6 The perspective view from the viewpoint C in (c) is a perspective view from which the second cooling member 201, the sealing member 400, and the fixing portion forming tool 171 are removed.

[0046] like Figure 6 As shown in (a), the sealing member 400 is accommodated in the sealing member accommodating portion 152 of the first cooling member 101. A portion of the connecting member 150 is inserted into the second fin base opening 241. The connecting member 150 is bent in the opening direction by pressing the connecting flow path wall 153 with the fixing portion forming tool 171 inserted from the water path base opening 211 in the insertion direction 170. Figure 6 As shown in (c) , the connecting flow path wall 153 and the second fin base 240 are joined by pressing to form the fixing portion 154 .

[0047] The fixing portion 154 is formed closely along the inner wall surface of the second fin base 240 from the second fin base opening 241. This increases the force holding the sealing member 400, thereby achieving high watertightness of the flow path. In addition, as long as the force holding the sealing member 400 can be maintained, the fixing portion 154 does not need to be formed along the entire portion of the second fin base opening 241. The fixing portion 154 may be formed only on a portion of the second fin base opening 241.

[0048] Thus, the leaf spring or reinforcing plate required for fixing the connecting member 150 connected to the first cooling member 101 to the second cooling member 201 in the conventional structure is no longer required, and the number of parts can be reduced, thereby improving production efficiency.

[0049] (Second embodiment) ( Figure 7 ) In the second embodiment, the connecting member 150 provided in the first embodiment for connecting the first cooling member 101 and the second cooling member 201 is not provided. Instead, a portion of the first fin base 140 of the first cooling member 101 extends to the second cooling member 201 through the second fin base opening 241. Thus, a connecting flow path 151 is formed in which the first fin base 140 and the connecting member 150 are integrally formed.

[0050] The first fin base 140 is formed in the same shape as the second fin base 240 , thereby securing a space corresponding to the height of the semiconductor module 300 disposed between the first cooling member 101 and the second cooling member 201 .

[0051] The fixing portion forming tool 171 forms the fixing portion 154 by pressing the connecting flow path wall 153 of the second fin base 240 from the second cooling member 201 side. Furthermore, the sealing member 400 has a square cross-section and contacts the outer walls of the first fin base 140 and the second fin base 240, pressing and securing them as the fixing portion 154 is formed. This reduces the number of components and improves production efficiency.

[0052] (Third embodiment) ( Figure 8 ) The first cooling member 101 includes a cover 110, a first frame 120, and a first fin base 140. The difference from the first embodiment is that the shape of the cover 110 is different and the first frame 120 is provided in addition to the first cooling member 101.

[0053] The first frame 120 has a first fin housing 111. The first fins 130 are arranged in the first fin housing 111. The first frame 120 is a portion of the flow path wall of the first cooling member 101 and has a cover joint 122 and a first fin base joint 123 on both sides. The second cooling member 201 has the same structure as the above-described embodiment. The second frame 220 forms a portion of the flow path wall of the flow path formed within the second cooling member 201.

[0054] The cover joint portion 122 joins the cover 110 and the first frame 120. The first fin base joint portion 123 joins the first frame 120 and the first fin base 140. The cover 110 is a flat plate-shaped member.

[0055] Therefore, the first cooling component 101 has: a first fin base 140, which is a base component connected to the heat sink 130; a first frame 120, which is a frame component that forms a space for accommodating the heat sink 130; and a first cover 110 as a flat plate component, which is arranged opposite to the first fin base 140 across the first frame 120 and is connected to the first frame 120, thereby forming a flow path inside the first cooling component 101.

[0056] In addition, the second cooling component 201 has: a second fin base 240, which is a base component connected to the heat sink 230; a second frame 220, which is a frame component that forms a space for accommodating the heat sink 230; and a water channel base 210 as a flat plate component, which is arranged opposite to the second fin base 240 across the second frame 220 and is connected to the second frame 220, thereby forming a flow path inside the second cooling component 201.

[0057] With this structure, when forming the fixing portion 154, a load-bearing jig (not shown) can be arranged on the outer surface of the cover 110 to withstand the pressure of the fixing portion forming tool 171, thereby simplifying the shape of the arranged jig. Furthermore, since the ease of bending when forming the fixing portions 154 and 164 is improved, production efficiency is improved. Furthermore, since the design freedom of the area where the cover sealing member (details will be described later) is tightly fitted when the opening portion is not used in the flat plate members 110 and 210 is increased, miniaturization can be achieved.

[0058] (Fourth embodiment) ( Figure 9 ) The fourth embodiment forms a first cover opening 110a in the cover 110 of the third embodiment. The cooling member 101 is a flat plate member having a cover opening 110a for the flow and discharge of refrigerant and a cover sealing member 410 for sealing the cover opening 110a at a position facing the connecting member 150.

[0059] exist Figure 9 In the cross section shown, the cover opening portion 110a is formed at a position overlapping with the fixing portion 154 and the sealing member 400 in the stacking direction. The cover sealing member 410 ensures watertightness to the refrigerant flowing inside the cover 110 by blocking the cover opening portion 110a. In addition, by removing the cover sealing member 410 from the first cooling member 101, it is possible to further cope with a structure with a layered structure that increases the water path. In addition, the cover sealing member 410 is bonded to the first cooling member 101 by using a fixing member (not shown) fixed to the first cooling member 101 from the outside, or by applying an adhesive to the surface of the cooling member 101 for bonding.

[0060] The diameter W3 of the cover opening 110a is larger than the inner diameter W1 of the top end of the fixing portion 154. Thus, when the fixing portion 154 is formed using the fixing portion forming tool 171, a load-bearing jig (not shown) having a size corresponding to that of the fixing portion forming tool 171 can be easily inserted into the first cooling member 101 through the cover opening 110a. This can suppress deformation of the first cooling member 101 due to load, thereby improving production efficiency.

[0061] (Fifth embodiment) ( Figure 10 ) The semiconductor device 100 can also be configured as a two-layer structure by arranging three-phase semiconductor modules 300 in two overlapping layers. The two-layer semiconductor device 100 includes a first cooling member 101, a second cooling member 201, and a third cooling member 601. The third cooling member 601 includes two cover sealing members 410 for sealing the refrigerant inside. By including two cover sealing members 410 in the third cooling member 601 and providing a new opening in addition to the cover sealing members 410, the third cooling member 601 can further accommodate the need for a layered structure with additional water channels.

[0062] The first cooling member 101 and the second cooling member 201 are arranged with the three-phase semiconductor module 300 interposed therebetween. Similarly, the first cooling member 101 and the third cooling member 601 are arranged with the three-phase semiconductor module 300 interposed therebetween.

[0063] This configuration allows for more semiconductor modules 300 to be incorporated into the semiconductor device 100 than in the aforementioned embodiment, enabling the realization of a high-power semiconductor device 100 having two three-phase output systems and by connecting the semiconductor modules 300 in parallel. Furthermore, the arrangement of the semiconductor modules 300 is not limited to the six shown in the figure; multiple semiconductor modules 300 may be arranged.

[0064] ( Figure 11 ) The first cooling member 101 includes a first cover 110, a first frame 120, first fins 130, and a second cover 140. The first cooling member 101 is connected to a first connecting member 150 and a second connecting member 160, respectively.

[0065] The first cover 110 has a first cover opening 110 a. The second cover 140 has a second cover opening 141. The first cooling member 101 has a first fin housing portion 111. The first fin 130 is housed in the first fin housing portion 111.

[0066] The first cooling member 101 communicates with the first cover opening 110 a , the second cover opening 141 , and the first fin housing 111 , forming a flow path for the refrigerant to flow from the second cooling member 201 to the third cooling member 601 via the first cooling member 101 .

[0067] As shown in the figure, the first cover 110 and the second cover 140 may have the same shape. If the first cover 110 and the second cover 140 have the same shape, they can be produced by stamping using the same mold, thereby improving production efficiency.

[0068] The second connecting member 160 has the same structure as the first connecting member 150 and connects the first cooling member 101 and the third cooling member 601 via a water channel. The third fin base 640 has the same structure as the second fin base 240. The fixing portion 164 formed in the third cooling member 601 has the same shape as the fixing portion 154 formed in the second cooling member 201 and is formed in the same manner.

[0069] The third fins 630, which dissipate heat from the semiconductor module 300, are housed in a third fin housing 621 formed by a third frame 620 of the third cooling member 601. The cover sealing member 410 closely fits a third cover opening 611 formed in the third cover 610 of the third cooling member 601, thereby ensuring the watertightness of the third cooling member 601.

[0070] When the first connecting member 150 and the second connecting member 160 have the same shape, the same mold can be used, thereby improving production efficiency. Figure 11 As shown, the first connecting member 150 and the second connecting member 160 are arranged in a cross-section at a position overlapping in the stacking direction, thereby being able to simultaneously form the first fixing portion 154 formed on the second cooling member 201 and the second fixing portion 164 formed on the third cooling member 601, thereby improving production efficiency.

[0071] According to the embodiment of the present invention described above, the following effects are achieved.

[0072] (1) A semiconductor device having at least one semiconductor module 300 on which a semiconductor element is mounted, the semiconductor device comprising: a first cooling member 101 and a second cooling member 201, each disposed on opposite surfaces of the semiconductor module 300 and allowing a refrigerant to circulate therethrough; a connecting member 150 connecting a first opening 141, through which the refrigerant flows into and is discharged from the first cooling member 101, and a second opening 241, through which the refrigerant flows into and is discharged from the second cooling member 201; and a sealing member 400 disposed on the periphery of the connecting member 150 at a position between the first cooling member 101 and the second cooling member 201. The connecting member 150 has a connecting member end portion 155 extending toward the interior of the second cooling member 201. The connecting member end portion 155 includes a fixing portion 154 formed by bending along the inner wall surface of the second cooling member 201. Thus, it is possible to provide a semiconductor device 100 that maintains cooling performance while further reducing the number of components and improving production efficiency.

[0073] (2) In the second cooling member 201, the diameter W2 of the third opening 211 formed at a position opposite to the fixing portion 154 is larger than the inner diameter W1 of the top end of the fixing portion 154. This allows the fixing portion forming tool 171 for forming the fixing portion 154 to be easily inserted into the second cooling member 201 through the third opening 211.

[0074] (3) The second cooling member 201 includes an inclined portion 245 that is inclined toward the first cooling member 101, and a flat portion 244 that extends from the inclined portion 145 to the outer peripheral surface of the connecting member 150 and contacts the connecting member 150. Thus, a space capable of accommodating the fixing portion 154 can be ensured within the flow path, and the flow of the refrigerant toward the fin arrangement side is not hindered by the thickness of the fixing portion 154, thereby preventing a reduction in cooling performance.

[0075] (4) The first cooling member 101 and the second cooling member 201 include: base members 140, 240, which are joined to the heat sinks 130, 230; frame members 120, 220, which form a space for accommodating the heat sinks 130, 230; and flat plate members 110, 210, which are arranged opposite to the base members 140, 240 with the frame members 120, 220 interposed therebetween and joined to the frame members 120, 220, thereby forming a flow path inside the first cooling member 101 and the second cooling member 201. This increases the design freedom of the regional configuration of the cover sealing member on the flat plate members 110, 210, thereby contributing to miniaturization. In addition, since the ease of bending when forming the fixing portions 154, 164 is improved, production efficiency is improved.

[0076] (5) The flat plate member 110 has a fourth opening 110a for the flow and discharge of refrigerant at a position opposite the connecting member 150. This allows a load-bearing jig corresponding to the fixing portion forming tool 171 to be inserted into the cooling member 101, thereby improving production efficiency. Furthermore, the design freedom of the first cover opening 110a is increased.

[0077] (6) The diameter W3 of the cover opening 110a is larger than the inner diameter W1 of the top end of the fixing portion 154. Thus, when forming the fixing portion 154, it is easy to insert a load-bearing jig having a size corresponding to the fixing portion forming tool 171 into the cooling member 101 through the opening 110a, thereby improving production efficiency.

[0078] (7) Adhesive members 500 are disposed between the semiconductor module 300 and the first cooling member 101 and between the semiconductor module 300 and the second cooling member 201. This improves the connection reliability between the semiconductor module 300 and the cooling members 101 and 201.

[0079] (8) A power conversion device 1 including the semiconductor device 100 having the above-described structure is used. This provides a power conversion device 1 that maintains cooling performance while further reducing the number of components and improving production efficiency.

[0080] In addition, the present invention is not limited to the above-mentioned embodiment, and various modifications or other configurations can be combined within the scope of the present invention. In addition, the present invention is not limited to a structure having all the configurations described in the above-mentioned embodiment, and also includes a structure in which part of the configuration is deleted. Explanation of symbols

[0081] 1 Power conversion device 2 DC power supply 3 capacitors 4 Control device 6 motors 100 semiconductor devices 101 first cooling member 110 cover 110a First cover opening 111 1st fin receiving portion 112 cover brazing part 120 1st frame (frame member) 122 cover joint 123 1st fin base joint 130 1st fin 140 1st fin base (2nd cover) 141 1st fin base opening (2nd cover opening) 150 connecting member (1st connecting member) 151 connecting flow path 152 Sealing member accommodating portion 153 connecting flow path wall 154 fixed portion (first fixed portion) 155 connecting member end 160 2nd connecting member 164 Second Fixed Part 170 insertion direction 171 fixed portion forming tool 201 second cooling component 202 flange 203 through hole 210 waterway base 211 waterway base opening 220 frame (2nd frame) 221 2nd fin receiving part 230 2nd fin 240 2nd fin base 241 Second fin base opening 242 connecting flow path receiving portion 243 Sealing material setting part 244 plane part 245 inclined portion 300 semiconductor modules 311 positive terminal 312 negative terminal 313 AC terminal 314, 315 signal terminals 330 sealing resin 400 sealing components 410 cover sealing member 500 bonding components 601 third cooling component 610 Cover 3 611 Third cover opening 620 Frame 3 621 3rd fin receiving area 630 3rd fin 640 3rd fin base.

Claims

1. A semiconductor device comprising at least one semiconductor module on which a semiconductor element is mounted, The semiconductor device is characterized by comprising: a first cooling member and a second cooling member, each of which is disposed on both sides of the semiconductor module and allows a refrigerant to flow therethrough; a connecting member connecting a first opening portion and a second opening portion, wherein the refrigerant flows into the first cooling member and is discharged from the first cooling member between the first opening portion and the second cooling member, and wherein the refrigerant flows into the second cooling member and is discharged from the second opening portion; and a sealing member disposed on the outer periphery of the connecting member at a position between the first cooling member and the second cooling member, The connecting member has a connecting member end portion extending toward the interior of the second cooling member. The connecting member end portion includes a fixing portion formed by bending the connecting member end portion along an inner wall surface of the second cooling member.

2. The semiconductor device according to claim 1, wherein In the second cooling member, a third opening formed at a position facing the fixing portion and through which the refrigerant flows in and out has a diameter larger than an inner diameter of a distal end portion of the fixing portion.

3. The semiconductor device according to claim 1, wherein The second cooling member includes an inclined portion inclined toward the first cooling member and a flat portion extending from the inclined portion to and in contact with the outer peripheral surface of the connecting member.

4. The semiconductor device according to claim 1, wherein The first cooling member and the second cooling member include: a base member, which is joined to a heat sink; a frame member, which forms a space for accommodating the heat sink; and a flat plate member, which is arranged opposite to the base member across the frame member and is joined to the frame member, thereby forming a flow path inside the first cooling member and the second cooling member.

5. The semiconductor device according to claim 4, wherein The flat plate member has a fourth opening for the refrigerant to flow in and out at a position facing the connecting member.

6. The semiconductor device according to claim 5, wherein The diameter of the fourth opening is larger than the inner diameter of the distal end of the fixing portion.

7. The semiconductor device according to claim 1, wherein Adhesive members are disposed between the semiconductor module and the first cooling member and between the semiconductor module and the second cooling member.

8. A power conversion device, characterized in that: have: The semiconductor device according to any one of claims 1 to 6.

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