Measurement system

Abstract

According to one form of the invention, an assay system is provided. The determination system comprises a heat flow sensor and a housing. The heat flow sensor includes a substrate having an electrically insulating property and a thermoelectric conversion portion provided on the substrate. The thermoelectric conversion unit is configured so as to generate an electromotive force on the basis of a temperature gradient along a gradient direction that is a direction from the substrate toward the thermoelectric conversion unit. The housing is configured to accommodate the heat flow sensor, and includes a first wall portion and a second wall portion. The first wall portion is configured to face the substrate. The second wall portion is configured to extend in the gradient direction from the first wall portion so as to cover the heat flow sensor, and includes an opening portion. The opening portion is configured to penetrate through the second wall portion such that at least a portion of the thermoelectric conversion portion is continuous with the outside of the case without passing through the substrate.

Description

Technical Field

[0001] The present invention relates to an assay system. Background Art

[0002] Patent Document 1 discloses a heat flux sensor-related technology that can suppress a subject's discomfort and measure the subject's physiological heat with high accuracy.

[0003] A heat flux sensor for measuring heat released from or received by the human body comprises a porous membrane and a thermocouple circuit array. The porous membrane is formed into a thin plate and has a continuous porous structure with multiple pores extending from one surface to the other in the thickness direction. The thermocouple circuit array is located within the porous membrane and outputs a sensor signal corresponding to the heat flux through the porous membrane in the thickness direction.

[0004] Prior art literature

[0005] [Patent Document]

[0006] Patent Document 1: Japanese Patent Publication No. 2019-132802 Summary of the Invention

[0007] Problems to be solved by the invention

[0008] However, there is still room for improvement in the technology for practically incorporating a thermoelectric conversion unit such as a heat flux sensor into a measurement system.

[0009] Means for solving problems

[0010] According to one form of the present invention, a measurement system is provided. The measurement system includes a heat flow sensor and a housing. The heat flow sensor includes a substrate having electrical insulation and a thermoelectric conversion portion provided on the substrate. The thermoelectric conversion portion is configured to generate an electromotive force based on a temperature gradient along a direction from the substrate toward the thermoelectric conversion portion, i.e., a gradient direction. The housing is configured to accommodate the heat flow sensor and includes a first wall portion and a second wall portion. The first wall portion is configured to be opposite to the substrate. The second wall portion is configured to extend from the first wall portion along the gradient direction to cover the heat flow sensor and includes an opening portion. The opening portion is configured to pass through the second wall portion, whereby at least a portion of the thermoelectric conversion portion is continuous with the outside of the housing without passing through the substrate.

[0011] According to such a configuration, practical application of a measurement system including a thermoelectric conversion unit can be promoted.

[0012] Brief description of the attached figure

[0013] Figure 1 It is a side cross-sectional view of a configuration example of the measurement system 1 as viewed from the y-axis direction.

[0014] Figure 2 yes Figure 1 FIG. 1 is a plan view of a configuration example of the measurement system 1 as viewed from the z-axis direction.

[0015] Figure 3 It is a diagram showing a configuration example of the thermoelectric conversion section 33 .

[0016] Figure 4 1 is a diagram showing a configuration example of a thermal flow sensor 3 including a plurality of thermoelectric conversion units 33 .

[0017] Figure 5 1 is a diagram showing another example of the measurement system 1 .

[0018] Figure 6 4 is a plan view of the coil layer 4 incorporated in the thermal flow sensor 3 as viewed from the z-axis direction.

[0019] Figure 7 It is a diagram showing the configuration of another example of the measurement system 1 .

[0020] Figure 8 It is a diagram showing the configuration of another example of the measurement system 1 .

[0021] Figure 9 Yes Figure 8 FIG. 1 is a diagram showing another example of the measurement system 1 .

[0022] Figure 10 1 is a diagram showing an example of a measurement system 1 including a magnetic field applying unit.

[0023] Figure 11 It is a diagram showing a configuration example of the measurement system 1 .

[0024] Figure 12 1 is a diagram showing a configuration example of a measurement system 1 including an optical filter 71 as the optical filter 7 .

[0025] Figure 13 It is a diagram showing a configuration example of the measurement system 1 . DETAILED DESCRIPTION

[0026] Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. Note that in this specification and the accompanying drawings, components having substantially the same functional configuration are denoted by the same reference numerals to omit repeated description.

[0027] In addition, the program for implementing the software appearing in this embodiment can be provided as a computer-readable non-transitory storage medium (Non-Transitory Computer-Readable Medium), can be provided as a downloadable medium from an external server, and can also be provided so that its functions can be realized on a client terminal by launching the program through an external computer (so-called cloud computing).

[0028] Furthermore, the term "unit" in this embodiment may include, for example, a combination of hardware resources implemented by a broad circuit and software information processing specifically implemented by such hardware resources. Furthermore, while various information is processed in this embodiment, this information is physically represented by numerical values, such as voltage or current signal values, or can be represented as the high or low values of binary bit sets consisting of 0s and 1s, or can be represented by quantum superpositions (so-called qubits), and communication or calculations can be performed on a broad circuit.

[0029] In a broad sense, a circuit is a circuit implemented by appropriately combining at least circuits, circuit classes, processors, and memory. This includes application-specific integrated circuits (ASICs), programmable logic devices (PLDs), such as simple programmable logic devices (SPLDs), complex programmable logic devices (CPLDs), and field programmable gate arrays (FPGAs).

[0030] 1. Example of the configuration of the measurement system 1

[0031] In this chapter, an example of the configuration of the measurement system 1 will be described. The measurement system 1 of this embodiment is configured to generate an electromotive force based on a temperature gradient in the z-axis direction, thereby measuring the heat flow in the z-axis direction. As described below, the z-axis direction is an example of a gradient direction. Hereinafter, for ease of explanation, the two directions in a plane perpendicular to the z-axis direction will be referred to as the x-axis direction and the y-axis direction, respectively. Note that the x-axis direction, the y-axis direction, and the z-axis direction form an orthogonal coordinate system by being orthogonal to each other. In addition, the plane defined by the x-axis direction and the y-axis direction is sometimes referred to as the xy plane.

[0032] Figure 1 It is a side cross-sectional view of a configuration example of the measurement system 1 as viewed from the y-axis direction. Figure 2 yes Figure 1 The structure example of the measurement system 1 shown in FIG is a top view viewed from the z-axis direction. Note that the scale, positional relationship, etc. are examples and are not limited to these. Figure 1 and Figure 2 As shown, the measuring system 1 includes a housing 2 and a heat flow sensor 3 .

[0033] <Shell 2>

[0034] The housing 2 is configured to accommodate the heat flow sensor 3, described later. The material of the housing 2 is arbitrary, but preferably a material with relatively low thermal resistance and heat capacity is used to transfer heat to the heat flow sensor 3 with minimal delay. For example, the housing 2 can be made of metal or carbon. The housing 2 in this embodiment includes a first wall portion 21 and a second wall portion 22.

[0035] <First Wall 21>

[0036] The first wall 21 forms the bottom of the housing. It extends within a plane whose normal is the z-axis, i.e., the xy plane. While the specific shape of the first wall 21 is arbitrary, in this embodiment, it is a flat plate, for example, a square plate.

[0037] <Second Wall 22>

[0038] The second wall portion 22 extends from the first wall portion 21 along the gradient direction. Thus, the first wall portion 21 and the second wall portion 22 form a storage space SP capable of accommodating the thermal flow sensor 3, described later. For example, at least a portion of the second wall portion 22 is configured to face the first wall portion 21 in the z-axis direction, thereby covering the storage space SP. The second wall portion 22 includes an opening 22a. The opening 22a extends through the second wall portion 22. Thus, the storage space SP communicates with the exterior of the housing 2.

[0039] Specifically, for example, the second wall portion 22 may include a peripheral wall portion 221 . In this embodiment, the second wall portion 22 may further include an end wall portion 222 .

[0040] <Surrounding Wall 221>

[0041] The peripheral wall portion 221 is configured to extend from the peripheral edge of the first wall portion 21 along the z-axis, which serves as a gradient direction. In this embodiment, the peripheral wall portion 221 is formed into a square tube shape, extending from the outer peripheral edge of the first wall portion 21 along the z-axis. Thus, the inner circumferential surface of the peripheral wall portion 221 forms the side wall of the accommodation space SP. For ease of description, the end of the peripheral wall portion 221 connected to the first wall portion 21 is referred to as the first end 221a, and the end opposite the first end is referred to as the second end 221b.

[0042] <End wall portion 222>

[0043] The end wall portion 222 is connected to an end portion (i.e., the second end portion 221b) of the peripheral wall portion 221 that is different from the end portion (i.e., the first end portion 221a) connected to the first wall portion 21. In this embodiment, the end wall portion 222 is formed so as to extend from the second end portion 221b toward the center of the first wall portion 21 in the xy plane. Thus, the end wall portion 222 is opposed to at least a portion of the first wall portion 21 in the z-axis direction.

[0044] <Opening 22a>

[0045] In the present embodiment, the opening 22a is formed in the end wall 222. For example, the end wall 222 is configured to extend in the xy plane toward the center of the first wall 21 so as not to close the opening formed by the second end 221b in the z-axis direction. Thus, in the present embodiment, an open space SP1 is formed in the center of the end wall 222 along the outer edge of the first wall 21 as a through hole. The inner peripheral surface of the end wall 222 that defines the open space SP1 corresponds to the opening 22a. In other words, the opening 22a is configured to penetrate the housing 2 (the second wall 22 in the present embodiment) along the z-axis direction. According to such a configuration, the movement of heat in the z-axis direction, which is the gradient direction, can be promoted, thereby further improving the stability of the electromotive force from the heat flow sensor 3.

[0046] <Heat flow sensor 3>

[0047] The heat flow sensor 3 is housed in the housing 2 . The heat flow sensor 3 includes an adhesive layer 31 , a substrate 32 , and a thermoelectric converter 33 . The heat flow sensor 3 may further include a catalyst layer 34 .

[0048] <Adhesive Layer 31>

[0049] The adhesive layer 31 is a layer for bonding a member to the first wall portion 21. The specific form of the adhesive layer 31 is arbitrary, but it is preferably a material with relatively small thermal resistance and heat capacity.

[0050] <Substrate 32>

[0051] The substrate 32 is configured to have electrical insulation properties. From the perspective of durability within the housing 2, the substrate 32 preferably has rigidity against external forces along the z-axis. In this embodiment, the substrate 32 is formed into a flat plate with the z-axis as the normal direction. The specific form of the substrate 32 is arbitrary. For example, the substrate 32 can be a chip assembled with an LSI (large-scale integrated circuit) such as Si. However, it can also be a component in which an IC is mounted on a substrate with good heat dissipation, such as an insulating film such as polyamide, a flexible board, a PCB, Al, Cu, MgO, a sapphire substrate, GaN, SiC, SiO2 / Si, Ta2O5 / Ta, Al2O3, Al2O3 / Al, SiN, Ti, TiO2 / Ti, CuO / Cu, Ga2O3, GaAs, InAs, InSb, and their composites, or a combination of these. The substrate 32 is bonded to the first wall 21 via the adhesive layer 31. Thus, the first wall 21 is configured to face the substrate 32 in the z-axis direction via the adhesive layer 31. Note that the first wall portion 21 may be configured to directly face the substrate 32 without interposing the adhesive layer 31. In other words, the presence or absence of the adhesive layer 31 is optional.

[0052] <Thermoelectric Conversion Section 33>

[0053] The thermoelectric converter 33 is configured to generate an electromotive force based on a temperature gradient along the z-axis. For example, the thermoelectric converter 33 can generate an electromotive force based on the anomalous Nernst effect. This configuration allows the measurement system 1 to be more compact in the direction of the gradient compared to using a Seebeck element. Note that at least a portion of the thermoelectric converter 33 can also be configured to generate an electromotive force based on the Seebeck effect.

[0054] The thermoelectric conversion section 33 is disposed on the substrate 32 along the z-axis. The z-axis is an example of a gradient direction, extending from the substrate 32 toward the thermoelectric conversion section 33. Specifically, the thermoelectric conversion section 33 is disposed on the surface of the substrate 32 opposite the surface connected to the first wall 21. Thus, the first wall 21 is configured to exchange heat with the thermoelectric conversion section 33 via the substrate 32.

[0055] Here, a configuration example of one thermoelectric conversion section 33 will be described. Figure 3 33 is a diagram showing a configuration example of the thermoelectric conversion unit 33. Figure 3 As shown, the thermoelectric conversion section 33 includes a plurality of thermoelectric conversion elements 331 , wiring 332 , and a pair of output terminals 333 .

[0056] <Thermoelectric Conversion Element 331>

[0057] The thermoelectric conversion element 331 is configured to generate an electromotive force based on the thermoelectric effect and due to a temperature gradient in the z-axis direction (i.e., the movement of heat). Each of the multiple thermoelectric conversion elements 331 is formed to extend along the y-axis direction. In addition, each of the thermoelectric conversion elements 331 is configured to have spontaneous magnetization in a direction different from the z-axis direction as the gradient direction (in this embodiment, the x-axis direction), thereby being configured to generate an electromotive force in the in-plane direction due to the above-mentioned temperature gradient. The thermoelectric conversion element 331 can be formed in a thin film shape, for example. The thermoelectric conversion portion 33 can include magnetic domains configured to be magnetized along the x-axis direction as one of the in-plane directions of the thin film. Note that the thermoelectric conversion element 331 can also be formed in a block shape. Note that the material constituting the thermoelectric conversion element 331 can be, for example, composed of a topological ferromagnet or a topological antiferromagnet called a Weyl semimetal, or can be composed of a ferrimagnet, or can be a combination of these. These specific materials will be described in detail below.

[0058] <Wiring 332>

[0059] The wiring 332 is configured to connect the plurality of thermoelectric conversion elements 331 in series so that the respective polarities are aligned.

[0060] <Output Terminal 333>

[0061] The output terminal 333 is a terminal configured to output the sum of the electromotive forces outputted from the plurality of thermoelectric conversion elements 331 as a whole. Note that the output terminal 333 does not need to be installed as an actual connection terminal, but can be a dummy terminal connected to an external component. In this embodiment, the thermoelectric conversion section 33 includes a pair of output terminals 333, from which a total electromotive force V1, which is the sum of the electromotive forces of the thermoelectric conversion elements 331, is outputted. In this embodiment, the thermoelectric conversion section 33 outputs the total electromotive force V1 outputted from the output terminals 333 due to the heat flow associated with the temperature gradient. Ideally, V1 = n × k × M × Q (where k is the proportionality constant, M is the magnetization of the thermoelectric conversion element 331, Q is the amount of heat transferred, and n is the number of thermoelectric conversion elements 331 connected in series). Note that the direction of heat transfer corresponds to the temperature gradient. The polarity of the thermoelectric conversion elements 331 contained in a single thermoelectric conversion section 33 is the same.

[0062] For convenience of explanation, the surface of the thermoelectric conversion unit 33 stacked on the substrate 32 is referred to as the first surface 33p, and the surface opposite to the first surface 33p in the z-axis direction (in other words, the gradient direction) is referred to as the second surface 33s (see FIG. Figure 1Note that the first surface 33p and the second surface 33s can be defined based on the region where heat flowing into or out of the thermoelectric conversion element 331 from other components occurs. The thermoelectric conversion portion 33 generates an electromotive force based on the transfer of heat between the first surface 33p and the second surface 33s. Note that an insulating film (not shown) may be laminated on the second surface 33s.

[0063] <Catalytic Layer 34>

[0064] like Figure 1 and Figure 2 As shown, the catalytic layer 34 is an example of an interaction portion, which is configured to generate heat absorption or heat generation due to a change in the binding state caused by contact with the target particles, and to perform heat exchange with the thermoelectric conversion portion 33 through the generated heat absorption or heat generation. For example, the catalytic layer 34 is configured so that when activated, the amount of heat during heat exchange changes due to the degree of interaction with the target particles contained in the gas G1. In this embodiment, the catalytic layer 34 is configured to change the state of the target particles contained in the gas G1 by adsorbing the target particles contained in the gas G1 on its surface or inside. When the target particles are hydrogen molecules, the catalytic layer 34 is configured to include Pt metal, for example. Note that the interaction portion is not limited to a catalyst such as the catalytic layer 34, and can be any substance as long as it interacts with the target particles contained in the gas G1. For example, the interaction portion can also be configured to adsorb target particles like a hydrogen storage alloy.

[0065] Furthermore, the catalytic layer 34, serving as the interaction portion, can also be configured to selectively absorb external electromagnetic waves (e.g., visible light or infrared light). With this configuration, the catalytic layer 34 undergoes a temperature change due to light absorption. This temperature change alters the amount of heat transferred within the thermoelectric conversion portion 33, thereby causing a change in electromotive force. Consequently, the measurement system 1 can be used as an electromagnetic wave measurement system.

[0066] The catalytic layer 34 is laminated on the second surface 33s of the thermoelectric converter 33 so as to face the substrate 32 in the z-axis direction via the thermoelectric converter 33. This allows the thermoelectric converter 33 to exchange heat directly with the catalytic layer 34 without intervening through rigid components such as the substrate 32. In this embodiment, the catalytic layer 34 is configured to exchange heat with the heat flow sensor 3 via an insulating film (not shown), so that the catalytic layer 34 covers the entire area of the opening 22a. It should be noted that the catalytic layer 34 is not a required component.

[0067] like Figure 2As shown, the heat flow sensor 3 of this embodiment is disposed throughout the first wall 21 that defines the storage space SP. Thus, the second wall 22 is configured to cover the heat flow sensor 3 within the storage space SP. Furthermore, the opening 22a is configured so that at least a portion of the thermoelectric converter 33 is continuous with the exterior of the housing 2 without passing through the substrate 32. This configuration allows heat accumulated within the housing 2 to be released through the opening 22a, thereby improving the stability of the electromotive force associated with heat exchange with the exterior. The opening 22a is configured to overlap at least a portion of the thermoelectric converter 33 when viewed from above in the z-axis direction, which serves as the gradient direction. This configuration promotes contact between the thermoelectric converter 33 and the outside air through thermal convection. In this embodiment, the opening 22a is formed to encompass the outer edge of the heat flow sensor 3. Furthermore, the end wall 222 defining the opening 22a is configured to cover a portion of the thermoelectric converter 33 without passing through a substrate that is the same as or different from the substrate 32. With this configuration, since the thermoelectric converter 33 performs heat exchange through the opening 22a without passing through the substrate 32, etc., it is possible to improve thermal conductivity from the outside to the thermoelectric converter 33, thereby providing a measurement system 1 with a fast response speed. Note that "different substrate" refers to a member that can serve as a substrate, such as a member made of the material described above for the substrate 32, and particularly refers to a rigid, block-shaped member. Note that "substrate" does not include a member that maintains its shape by relying on other members, such as a thin film laminated on a substrate. Furthermore, in this embodiment, the catalytic layer 34 is configured to be exposed from the opening 22a when viewed from above the thermoelectric converter 33 in the z-axis direction, which serves as the gradient direction. With this configuration, by drawing in external air through the opening 22a, a reaction between target particles contained in the external air and the catalytic layer 34 can be induced, and based on the heat of the reaction, an electromotive force of an amount related to the reaction of the target particles can be generated. The catalytic layer 34 can be configured to be exposed to the outside by being arranged within the open space SP1 defined by the opening 22a. According to such a configuration, it is possible to suppress degradation of the catalyst layer 34 that may occur due to interference between the catalyst layer 34 and external elements.

[0068] like Figure 1As shown, the measurement system 1 may further include an integrated circuit IC 1 configured to obtain the electromotive force from the heat flow sensor 3. The integrated circuit IC 1 is configured to perform predetermined signal processing based on at least the electromotive force output from the thermoelectric conversion section 33. In the present embodiment, the integrated circuit IC 1 is provided together with the thermoelectric conversion section 33 on the substrate 32. According to such a configuration, a measurement system 1 can be provided that can perform a series of processes from the generation of the electromotive force of the thermoelectric conversion section 33 to the signal processing. Note that the integrated circuit IC 1 may also be assembled as a component inside the substrate 32. In other words, the substrate 32 may also be a large-scale integrated circuit (LSI) configured as a built-in integrated circuit IC 1.

[0069] An example of the hardware configuration of the integrated circuit IC1 will be described below. The integrated circuit IC1 includes, for example, a communication unit, a storage unit, and a processor, and these components are electrically connected via a communication bus within the integrated circuit IC1.

[0070] The communication unit is preferably a wired communication device, such as USB, IEEE1394, Thunderbolt (registered trademark), or wired LAN network communication. However, it may also include wireless LAN network communication, mobile communication such as 3G / LTE / 5G, and Bluetooth (registered trademark) communication, as needed. Specifically, it is more preferably implemented as a combination of these multiple communication devices. In other words, the integrated circuit IC1 can communicate various information with the outside world via the communication unit and the network.

[0071] The storage unit stores the various information defined above. This can be implemented, for example, as a storage device such as a solid-state drive (SSD) that stores various programs related to measurement system 1 and executed by the processor, or as a memory such as random access memory (RAM) that stores temporary information (parameters, arrays, etc.) required for program operations. The storage unit stores various programs and variables related to integrated circuit IC1 and executed by the processor.

[0072] The processor processes and controls the overall actions related to the measurement system 1. The processor is, for example, a central processing unit (CPU) not shown in the figure. The processor implements various functions related to the measurement system 1 by reading predetermined programs stored in the storage unit. That is, the information processing performed by the software stored in the storage unit is specifically implemented by the processor as an example of hardware, so that it can be executed as each functional unit included in the processor. This will be explained in further detail in the next section. Note that the processor is not limited to a single one, and can also be implemented as having multiple processors for each function. It can also be a combination of these. Note that the integrated circuit IC1 can also be composed of only a processor. In addition, the integrated circuit IC1 is not limited to a digital circuit including a processor, but can also be an analog circuit.

[0073] <Lead Frame LF>

[0074] like Figure 1 and Figure 2 As shown, the measuring system 1 also includes a lead frame LF as a conducting portion. The lead frame LF is configured to be electrically connected to the thermoelectric conversion portion 33 via the substrate 32 and to pass through the peripheral wall portion 221. Thus, the lead frame LF can transmit the electromotive force from the heat flow sensor 3 to the outside of the housing 2. According to such a configuration, a measuring system 1 with a more compact thickness in the gradient direction can be provided. For example, at least a portion of the lead frame LF is configured to be exposed to the outside of the housing 2. The end of the lead frame LF located outside the housing 2 is connected to the wiring substrate BP. The wiring substrate BP is a substrate engraved with an arbitrary circuit pattern. The signal transmitted from the end of the lead frame LF is transmitted to various devices via the circuit pattern engraved on the wiring substrate BP. Note that the lead frame LF is not limited to a device for transmitting the electromotive force of the heat flow sensor 3, but can also be configured to transmit a signal obtained by processing the electromotive force of the heat flow sensor 3 through the above-mentioned integrated circuit IC1.

[0075] The thermal flow sensor 3 may include a plurality of thermoelectric conversion parts 33 . Figure 4 3 is a diagram showing a configuration example of a heat flow sensor 3 having a plurality of thermoelectric conversion units 33. Note that configurations common to the above configurations may be assigned the same reference numerals and their description may be omitted.

[0076] like Figure 4 As shown in the embodiment, the heat flow sensor 3 includes four thermoelectric conversion parts 33a to 33d and an insulating film lns1 having electrical insulation properties as a plurality of thermoelectric conversion parts 33. The plurality of thermoelectric conversion parts 33a to 33d are similar to the reference Figure 3The thermoelectric conversion section 33 described above also includes a plurality of thermoelectric conversion elements 331, wiring 332, and output terminals 333. Each of the plurality of thermoelectric conversion sections 33a to 33d is stacked on the substrate 32 in sequence in the z-axis direction starting from the thermoelectric conversion section 33a. The thermoelectric conversion section 33a is connected to the substrate 32. Thus, the four thermoelectric conversion sections 33a to 33d form a stack. In other words, the measuring system 1 also includes a stack. The stack is formed by stacking a plurality of thermoelectric conversion elements 331 along a gradient direction on the substrate 32. According to such a structure, the volume of the measuring system 1 in the in-plane direction can be made smaller. Note that each of the plurality of thermoelectric conversion sections 33a to 33d constituting the stack has approximately the same heat flow.

[0077] In this embodiment, each thermoelectric conversion element 331 included in the thermoelectric conversion section 33a and the thermoelectric conversion section 33c is configured to extend along the x-axis direction and have a spontaneous magnetization in the y-axis direction. Furthermore, the thermoelectric conversion elements 331 in the thermoelectric conversion section 33a and the thermoelectric conversion elements 331 in the thermoelectric conversion section 33c are configured so that their spontaneous magnetizations are in opposite directions (e.g., antiparallel). Consequently, the polarity of the thermoelectric conversion section 33a is reversed from the polarity of the thermoelectric conversion section 33c. This allows each of the thermoelectric conversion section 33a and the thermoelectric conversion section 33c to output an electromotive force in opposite directions in response to the same temperature gradient in the z-axis direction. The thermoelectric conversion sections 33a and 33c are examples of first thermoelectric conversion elements, and the y-axis direction is an example of a first output direction. In other words, each of the multiple first thermoelectric conversion elements is configured to output an electromotive force in a first output direction, which is one of the in-plane directions of the substrate 32, based on the temperature gradient. At least one of the plurality of first thermoelectric conversion elements has a different polarity from at least one of the plurality of first thermoelectric conversion elements. With this configuration, for example, the influence of electromotive force due to an in-plane temperature gradient can be canceled, thereby providing a more accurate measurement system 1.

[0078] In this embodiment, the thermoelectric conversion elements 331 included in each of the thermoelectric conversion sections 33b and 33d are each configured to extend in a different in-plane direction (specifically, the y-axis direction) than the thermoelectric conversion elements 331 included in each of the thermoelectric conversion sections 33a and 33c, and are configured to have spontaneous magnetization in the x-axis direction. Furthermore, the thermoelectric conversion elements 331 in the thermoelectric conversion section 33b and the thermoelectric conversion elements 331 in the thermoelectric conversion section 33d are configured so that their spontaneous magnetizations are in opposite directions (e.g., antiparallel). Consequently, the polarity of the thermoelectric conversion section 33b is reversed from the polarity of the thermoelectric conversion section 33d. This allows each of the thermoelectric conversion sections 33b and 33d to output electromotive forces in opposite directions in response to the same temperature gradient in the z-axis direction. The thermoelectric conversion elements 331 included in the thermoelectric conversion sections 33b and 33d are examples of second thermoelectric conversion elements, and the x-axis direction is an example of the second output direction. In other words, the thermoelectric conversion section 33 includes a plurality of second thermoelectric conversion elements. Each of the plurality of second thermoelectric conversion elements is configured to output an electromotive force based on a temperature gradient along a second output direction that is one of the in-plane directions of the substrate 32 and is different from the first output direction. The polarity of at least one of the plurality of second thermoelectric conversion elements is different from the polarity of at least another of the plurality of second thermoelectric conversion elements. According to such a configuration, the influence of the in-plane temperature gradient in multiple directions can be reduced. Note that the thermoelectric conversion sections 33a and 33b can also be considered to constitute a thermoelectric conversion unit, and the thermoelectric conversion sections 33c and 33d can constitute a thermoelectric conversion unit, and the polarities of these thermoelectric conversion units are different. Note that the first output direction and the second output direction can be arbitrary as long as they are along one of the in-plane directions and do not have to be perpendicular to the z-axis direction (in other words, the gradient direction). In addition, the first output direction and the second output direction can be intersecting and do not have to be orthogonal to each other. In addition, the number of stacked thermoelectric conversion sections 33 is not limited to four.

[0079] 2. Another Example of Measurement System 1

[0080] In this chapter, another example of the above-mentioned measurement system 1 will be described. Figure 5 1 is a diagram showing another example of the measurement system 1. Note that descriptions of components common to the above-described measurement system 1 may be omitted by assigning the same component reference numerals.

[0081] like Figure 5As shown, the measurement system 1 in this embodiment may include, in addition to the components of the measurement system 1 described in the previous chapter, a coil layer 4. The coil layer 4 is configured to apply an external magnetic field H to the heat flow sensor 3 (specifically, the thermoelectric converter 33). For example, the coil layer 4 applies the external magnetic field H in a manner that reverses the magnetization direction of the magnetic domains of the thermoelectric converter 33. In other words, the coil layer 4 may be configured to use the external magnetic field H to reverse the sign of the component of the thermoelectric tensor of the thermoelectric converter 33 that is due to the anomalous Nernst effect, thereby applying the external magnetic field to the thermoelectric converter 33. With this configuration, since the components of the thermoelectric tensor are reversed by the external magnetic field H, the signal intensity in the modulation frequency fm band of the electrical signal (total electromotive force V1) output from the heat flow sensor 3 can be amplified. For example, the coil layer 4 may be positioned relative to the thermoelectric converter 33 so as to induce the external magnetic field H on the thermoelectric converter 33 along the x-axis, which is the in-plane direction. This configuration facilitates modulation of the magnetic domains by inducing a small in-plane magnetic field in the thin film, thereby further amplifying the signal strength in the modulation frequency band. In this embodiment, the coil layer 4 is configured to apply an external magnetic field H along the x-axis, which is the magnetization direction of the magnetic domains of the thermoelectric conversion unit 33. In this embodiment, the coil layer 4 is positioned between the adhesive layer 31 and the substrate 32, but this is not limiting and the coil layer 4 may be positioned anywhere.

[0082] Next, a configuration example of the coil layer 4 will be described. Figure 6 : is a top view of the coil layer 4 assembled in the heat flow sensor 3 as viewed from the z-axis direction. The coil layer 4 of this embodiment is formed as a stacked body stacked on the first wall portion 21. Figure 6 As shown, the coil layer 4 includes a first coil 41 serving as a first magnetic field generating element and a second coil 42 serving as a second magnetic field generating element. The first coil 41 and the second coil 42 are each mounted on the substrate 32 as a coil pattern stacked in a quadrangular spiral along the z-axis. The first coil 41 and the second coil 42 are each configured to apply a magnetic field in the z-axis direction by passing a current. They are arranged along the x-axis, which is the magnetization direction of the thermoelectric conversion unit 33.

[0083] Here, when the polarity of first coil 41 is opposite to that of second coil 42, the magnetic lines of force extending from the north pole of first coil 41 are directed toward the south pole of second coil 42, while the magnetic lines of force generated from the north pole of second coil 42 are directed toward the north pole of first coil 41. As a result, a circular external magnetic field H is formed, centered in the y-axis direction. Consequently, at least a portion of the external magnetic field H is induced in the thermoelectric converter 33 along the x-axis, which is the in-plane direction of the thin-film thermoelectric converter 33. Defining the positional relationship between first coil 41 and second coil 42 and setting their polarity accordingly is an example of "generating a magnetic field based on an input signal having a phase difference corresponding to the positional relationship between first coil 41 and second coil 42." This configuration enables a more compact signal processing system integrated with the thermoelectric converter 33. Note that first coil 41 and second coil 42 can also be configured to have opposite chirality. In this case, first coil 41 and second coil 42 can be connected in series. According to this configuration, the current flowing into the first coil 41 is transmitted to the second coil 42 , thereby reversing the polarity of the first coil 41 and the second coil 42 . This simplifies the control of the first coil 41 and the second coil 42 .

[0084] Alternatively, the coil layer 4 can be configured so that its outer edge surrounds the first wall portion 21 when viewed from above the substrate 32 in the z-axis direction. This configuration makes it easier to apply an external magnetic field H to the entire thermoelectric conversion section 33 disposed on the substrate 32. Alternatively, the first coil 41 and the second coil 42 can be spaced apart in the x-axis direction. This configuration makes it easier to apply an external magnetic field H along the y-axis direction to the thermoelectric conversion section 33. The integrated circuit IC1 can also be configured to control the drive of the coil layer 4.

[0085] Note that the coil layer 4 is not necessarily used to apply a magnetic field to the thermoelectric conversion section 33. For example, the coil layer 4 can also be used as a heater for high-frequency heating. In this way, for example, the temperature of the catalytic layer 34 can be maintained above the activation temperature at which the catalytic reaction is activated, thereby improving the measurement accuracy of the target particles. In addition, the coil layer 4 can also be configured to control the temperature of the first surface 33p of the thermoelectric conversion section 33 within a predetermined range. According to such a configuration, by stabilizing the temperature of the first surface 33p of the thermoelectric conversion section 33, the temperature of the second surface 33s can be accurately inferred from the electromotive force based on the heat flow.

[0086] 3. Another Example of Measurement System 1

[0087] This chapter describes another example of the measurement system 1 described in Chapter 2. Note that the configuration related to this another example also applies to the measurement system 1 described in Chapter 1. Figure 7 It is a diagram showing the configuration of another example of the measurement system 1 .

[0088] like Figure 7 As shown, the first wall portion 21 of the measurement system 1 may further include an opening portion 21a. The opening portion 21a is formed to pass through the first wall portion 21 in the z-axis direction. Thus, an open space SP2 that connects the accommodating space SP with the outside is further specified. The coil layer 4 is configured to be exposed to the outside via the lead frame LF. According to such a configuration, the heat accumulated in the coil layer 4 for applying the magnetic field can be released to the outside, thereby reducing the amount of heat transferred from the coil layer 4 to the heat flow sensor 3. Therefore, the effect of the coil layer 4 on the measurement result of the heat flow sensor 3 can be reduced, thereby enabling a higher-precision heat flow measurement.

[0089] Note that the measurement system 1 according to this embodiment does not necessarily need to include the coil layer 4. In this case, the adhesive layer 31 only needs to be provided in the contact area between the substrate 32 and the first wall portion 21. In this case, since at least a portion of the substrate 32 is exposed through the opening 21a, the substrate 32 can directly exchange heat with the outside. This allows the outside to be used as a heat bath, thereby providing a more compact measurement system 1 while suppressing any degradation in electromotive force output stability.

[0090] 4. Another Example of Measurement System 1

[0091] This chapter describes another example of the measurement system 1 described in Chapter 2. Note that the configuration related to this another example also applies to the measurement system 1 described in Chapter 1 or Chapter 3. Figure 8 It is a diagram showing the configuration of another example of the measurement system 1 .

[0092] like Figure 8 As shown, the measuring system 1 may further include a heat conducting portion 5. Note that Figure 8 The measurement system 1 shown does not include the catalytic layer 34. The heat-conducting portion 5 can be made of a member with high thermal conductivity, such as metal. The heat-conducting portion 5 is configured to be connected to the second surface 33s of the thermoelectric conversion portion 33 via the open space SP1 defined by the opening portion 22a. Note that an insulating film (not shown) is interposed between the heat-conducting portion 5 and the thermoelectric conversion portion 33. Thus, the heat-conducting portion 5 and the thermoelectric conversion portion 33 are configured to be able to exchange heat and to be electrically insulated. According to such a configuration, it is possible to improve the thermal conductivity to the thermoelectric conversion portion 33 while reducing the possibility of degradation of the thermoelectric conversion portion 33 due to mechanical interference with the external machine. In this embodiment, the heat-conducting portion 5 is configured to cover the entire area of the open space SP1. In addition, the heat-conducting portion 5 is configured to be evenly connected to the entire surface of the second surface 33s of the thermoelectric conversion portion 33. Thus, the unevenness of the temperature distribution of the thermoelectric conversion portion 33 can be reduced.

[0093] Note that the measurement system 1 may further include a catalytic layer 34 . Figure 9 Yes Figure 8 FIG. 1 is another example of the measurement system 1 shown in FIG. Figure 9 As shown, the catalytic layer 34 is connected to the end of the heat conducting portion 5 opposite the end connected to the second surface 33s of the thermoelectric conversion portion 33. In this embodiment, the catalytic layer 34 is exposed outside the open space SP1. This configuration improves the reactivity of the catalytic layer 34 by allowing the catalytic layer 34 to more easily come into contact with the gas G1, thereby improving the detection accuracy of target particles contained in the gas G1.

[0094] [other]

[0095] The coil layer 4 for applying the external magnetic field H is not limited to the structure assembled inside the housing 2 . Figure 10 1 is a diagram showing an example of a measurement system 1 having a magnetic field applying unit. Figure 10 As shown, for example, the measurement system 1 may include a magnet 6 disposed outside the housing 2 as a magnetic field applying unit for applying an external magnetic field H. The magnet 6 may be any structure capable of electrically or mechanically controlling the polarity of the external magnetic field H, such as a permanent magnet, an electromagnet, a coil, or the like.

[0096] The position of the opening 22a can be arbitrary as long as it allows the thermoelectric conversion unit 33 to be exposed. For example, the opening 22a can be positioned toward the wiring board BP. In other words, the measurement system 1 can also be configured to be reversed in the z-axis direction toward the wiring board BP.

[0097] The lead frame LF is not limited to being configured to penetrate the second wall portion 22 , and may be configured to penetrate any position of the housing 2 .

[0098] The integrated circuit IC1 may be provided outside the housing 2, for example, on a wiring board BP.

[0099] The catalytic layer 34 may contain catalysts having different reactivities to enable detection of multiple types of target particles.

[0100] Figure 11 1 is a diagram showing an example of the configuration of the measurement system 1. Figure 11 As shown, the measuring system 1 has Figure 1In addition to the same structure as the measuring system 1 shown, the measuring system 1 may further include a filter 7. The filter 7 is configured to cover at least a portion of the opening 22a, for example, the entire portion. The outer edge of the filter 7 is connected to the second end 221b of the peripheral wall portion 221, for example. The filter 7 may be, for example, a dust filter. Thereby, it is possible to suppress the performance degradation of the measuring system 1 caused by dust and the like adhering to the thermoelectric conversion portion 33 or the catalytic layer 34. In addition, the measuring system 1 may include a particle filter (for example, a gas filter) as the filter 7, which is configured to selectively transmit a fluid (for example, a gas) containing target particles that interact with the catalytic layer 34. According to such a structure, the reaction efficiency of the target particles in the catalytic layer 34 can be improved.

[0101] Figure 12 1 is a diagram showing a configuration example of a measurement system 1 including an optical filter 71 as the filter 7. Figure 12 As shown, the measurement system 1 may include an optical filter 71 as an example of the optical filter 7. The optical filter 71 is configured to selectively transmit light within a specific wavelength range. With this configuration, the electromotive force output from the thermoelectric converter 33 varies depending on, for example, the intensity of light transmitted through the optical filter 71. Therefore, the measurement system 1 can be used to measure quantities related to the light transmitted through the optical filter 71. In this case, the measurement system 1 may further include a light-absorbing layer 8. The light-absorbing layer 8 is configured to absorb light within the wavelength range transmitted through the optical filter 71. For example, the light-absorbing layer 8 is connected to the second surface 33s of the thermoelectric converter 33 and is configured to exchange heat with the thermoelectric converter 33 via the second surface 33s. The light-absorbing layer 8 generates heat by absorbing the light transmitted through the optical filter 71. The generated heat is transferred from the light-absorbing layer 8 to the thermoelectric converter 33 via the second surface 33s, and this heat flow is reflected in the electromotive force. With this configuration, the measurement system 1 can be used to perform measurements related to light within a specific wavelength range. Therefore, for example, the measurement system 1 can be used as an optical measurement system. In particular, when the gas G1 absorbs this light, the electromotive force output from the thermoelectric conversion section 33 changes according to the intensity of the light transmitted through the gas G1, thereby enabling the measurement system 1 to be used as a system for selectively detecting a specific gas. Note that the optical filter 71 may be provided in place of the catalytic layer 34, may be connected to the second surface 33s in parallel with the catalytic layer 34, or may be connected to the second surface 33s via the catalytic layer 34.

[0102] Figure 13 It is a diagram showing a configuration example of the measurement system 1 . Figure 13 The measurement system 1 shown is Figure 8The measurement system 1 shown differs in that it further includes a heat conducting portion 9. The heat conducting portion 9 is configured to exchange heat with the heat conducting portion 5 by being connected to the heat conducting portion 5. This allows, for example, heat Q to be transferred between the wiring substrate BP and the heat conducting portion 9 via the thermoelectric conversion portion 33, and this transfer of heat Q is detected as an electromotive force of the thermoelectric conversion portion 33. Therefore, a quantity related to the heat exchanged with the wiring substrate BP can be measured as an electromotive force. The heat conducting portion 9 can be made of a different material from the heat conducting portion 5, or the same material. Furthermore, the heat conducting portion 5 and the heat conducting portion 9 can be integrated. The shape of the heat conducting portion 9 is arbitrary, but it is preferably configured to cover the opening 22a in the z-axis direction. This configuration can prevent a decrease in heat exchange efficiency caused by the concentration of heat transferred to the heat conducting portion 9. Furthermore, the heat conducting portion 9 can be configured so that, when the measurement system 1 is viewed from above in the z-axis direction, its outer edge includes the outer edge of the second wall portion 22. This configuration further expands the area for absorbing or dissipating heat, thereby further minimizing a decrease in heat exchange efficiency. Furthermore, the heat conducting portion 9 is configured to protrude from the second end portion 221b in the z-axis direction. More specifically, the heat conducting portion 9 may be a plate extending along the second end portion 221b and defined by a normal direction along the z-axis. Note that the heat conducting portion 9 is electrically insulated from the thermoelectric converter 33.

[0103] Furthermore, it can be provided in various forms as described below.

[0104] (1) A measurement system comprising a heat flow sensor and a housing; the heat flow sensor comprising an electrically insulating substrate and a thermoelectric conversion portion provided on the substrate, the thermoelectric conversion portion being configured to generate an electromotive force based on a temperature gradient along a direction from the substrate toward the thermoelectric conversion portion, i.e., a gradient direction; the housing being configured to accommodate the heat flow sensor and comprising a first wall portion and a second wall portion, the first wall portion being configured to be opposite to the substrate, the second wall portion being configured to extend from the first wall portion along the gradient direction to cover the heat flow sensor, and comprising an opening portion, the opening portion being configured to pass through the second wall portion, whereby at least a portion of the thermoelectric conversion portion is continuous with the exterior of the housing without passing through the substrate.

[0105] According to such a configuration, heat accumulated inside the housing can be released from the opening, and thus the stability of the electromotive force accompanying heat exchange with the outside can be improved.

[0106] (2) The measurement system according to (1) above, wherein the opening is configured to penetrate the housing along the gradient direction relative to the thermoelectric conversion unit.

[0107] According to such a configuration, heat transfer in the gradient direction can be promoted, and thus the stability of the electromotive force can be further improved.

[0108] (3) The measurement system according to (1) or (2) above, wherein the opening is configured to overlap at least a portion of the thermoelectric conversion portion when the thermoelectric conversion portion is viewed from above in the gradient direction.

[0109] According to such a configuration, the contact between the thermoelectric conversion unit and the outside air can be promoted by thermal convection.

[0110] (4) A measurement system according to any one of (1) to (3) above, further comprising an interaction portion, wherein the interaction portion is configured to absorb heat or generate heat due to a change in the binding state caused by contact with the target particles, and to exchange heat with the thermoelectric conversion portion through the generated absorption or heat, and the interaction portion is configured to be exposed from the opening portion when the thermoelectric conversion portion is viewed from above in the gradient direction.

[0111] According to this configuration, by taking in external air from the opening, a reaction between target particles contained in the external air and the interacting portion occurs, and an electromotive force of an amount related to the reaction of the target particles is obtained based on the reaction heat generated thereby.

[0112] (5) A measuring system according to any one of (1) to (4) above, wherein the second wall portion includes a peripheral wall portion, the peripheral wall portion is configured to extend from the periphery of the first wall portion along the gradient direction, and the measuring system further includes a conduction portion, the conduction portion is configured to be electrically connected to the thermoelectric conversion portion via the substrate and pass through the peripheral wall portion, thereby being able to transmit the electromotive force to the outside of the housing.

[0113] According to such a configuration, a more compact thickness measurement system in the gradient direction can be provided.

[0114] (6) A measuring system according to any one of (1) to (5) above, wherein the second wall portion includes a peripheral wall portion and an end wall portion, the peripheral wall portion is configured to extend from the peripheral edge of the first wall portion along the gradient direction, and the end wall portion is configured to be connected to an end portion of the peripheral wall portion that is different from the end portion connected to the first wall portion, and does not cover a portion of the thermoelectric conversion portion via a substrate that is the same as or different from the substrate.

[0115] According to this configuration, since the thermoelectric conversion portion performs heat exchange through the opening without passing through the substrate, etc., heat conductivity from the outside to the thermoelectric conversion portion can be improved, thereby providing a measurement system with a fast response speed.

[0116] (7) A measurement system according to any one of (1) to (6) above, further comprising an integrated circuit configured to obtain the electromotive force, wherein the integrated circuit is configured to perform predetermined signal processing based on at least the electromotive force output from the thermoelectric conversion unit, and is arranged on the substrate together with the thermoelectric conversion unit.

[0117] According to such a configuration, a measurement system capable of executing a series of processes from the generation of electromotive force in the thermoelectric conversion section to signal processing can be provided.

[0118] (8) The measurement system according to any one of (1) to (7) above, wherein the thermoelectric conversion unit is configured to generate the electromotive force based on an anomalous Nernst effect.

[0119] According to such a configuration, the volume of the measurement system in the gradient direction can be made more compact compared to the case of using a Seebeck element.

[0120] Of course, it’s not limited to this.

[0121] Finally, although various embodiments of the present disclosure have been described, these are provided for illustrative purposes only and are not intended to limit the scope of the invention. The new embodiments may be implemented in various other forms, and various omissions, substitutions, and modifications may be made without departing from the spirit of the invention. Such embodiments and their variations are intended to be within the scope and spirit of the invention and are encompassed by the invention as described in the claims and their equivalents.

[0122] In addition, please note the following forms.

[0123] Conventional heat flux sensors utilize the Seebeck effect. These sensors, which utilize the Seebeck effect, have high thermal capacitance and thermal resistance, and are therefore protected by a robust housing, resulting in a robust structure. Consequently, sensors with high thermal resistance and capacitance obstruct the flow of heat, preventing accurate heat flow measurement.

[0124] Therefore, in the device and system using the device according to this embodiment, for example, a heat flow sensor film exhibiting the anomalous Nernst effect and having high thermal conductivity is fabricated on a substrate with good thermal conductivity, and the sensor substrate is housed in an insulating and highly thermally conductive housing. This enables more accurate heat flow measurement.

[0125] Regarding the heat flow sensor (an example of a device) involved in this embodiment, from the perspective of responsiveness, a heat flow sensor based on the anomalous Nernst effect of a thin film type is preferred. The element (thermoelectric conversion element) of the heat flow sensor (i.e., the thermoelectric conversion device) can be composed of a compound that exhibits the anomalous Nernst effect. The element can be, for example, a topological ferromagnet or a topological antiferromagnet known as a Weyl semimetal, or a ferrimagnet, or a combination thereof. The topological ferromagnet can be a metal composed of Co2Tx such as Co2MnGa (X is any one of Si, Ge, Sn, Al, and Ga), or an alloy of a known topological ferromagnet such as a metal represented by a composition formula of Fe3X (X is a stoichiometric or non-stoichiometric composition of a typical element such as Al or Ga, or a transition element). In addition, the topological antiferromagnet can be a known topological antiferromagnet such as Mn3X (X is one or more elements selected from Sn, Ge, Ga, Pt, Ir, Rh, or a compound thereof). Regarding the composition ratio of the alloy constituting the topological ferromagnet or the topological antiferromagnet, it is not necessarily the stoichiometric composition ratio as described above, as long as it partially has a stoichiometric structure, there is no special limitation on the composition ratio. Regarding the compound constituting the element, for example, it is composed of an alloy with a transition metal, and the alloy is a compound having a crystal structure of a Kagome lattice plane composed of a transition metal, and can exhibit the abnormal Nernst effect. There is no special limitation on the ferrimagnet as long as it can exhibit the abnormal Nernst effect. There is no special limitation on the structure of the element, and a known structure can be used. In addition, the element involved in this embodiment can be set by sputtering, evaporation, MBE, electroplating, sintering, printing, pasting, etc. The heat flow sensor involved in this embodiment is not only a device for measuring heat, but can also be configured as a device for detecting light or chemical substances, etc.

[0126] In the heat flow sensor of this embodiment, the heat flow sensor film (a circuit composed of thermoelectric conversion elements) is formed on a substrate, which is then bonded to a housing. The top surface of the heat flow sensor film can also be bonded to the housing. In this case, the adhesive film or housing is preferably made of a material with relatively low thermal resistance and heat capacity. For example, the housing can be made of metal or carbon.

[0127] In addition, the heat flow sensor film can be a multilayer film, a film including a magnetite layer (hard magnetic layer), a film including a coil layer, a film with an insulating layer inserted and a thermoelectric conversion element circuit superimposed, and any combination of these. In addition, in order to offset the Seebeck effect, which becomes the noise of the abnormal Nernst effect, a heat flow sensor with multiple (preferably four) different polarities can also be made on a plane or in the form of a multilayer film. For example, the sum of the A, B, C, and D signals shown in the figure can offset the Seebeck effect and extract the abnormal Nernst effect (heat flow in the z direction). A and D can detect the heat flow in the x direction from the Seebeck effect, and C and B can detect the heat flow in the y direction from the Seebeck effect. The order in the figure can be arbitrary. In addition, there can also be a thin adhesive layer between the sensor film and the substrate. As long as the thermal resistance of the adhesive layer is low, there is no strict requirement on its material. The shell is preferably made of a material with low thermal resistance.

[0128] Furthermore, by providing a signal processing integrated circuit (IC) for signal processing that includes a multiplexer or amplifier, ADC, processor, DSP, memory, and communication functions, higher-precision measurements can be achieved. The substrate can be, for example, a chip assembled with an LSI such as Si, but can also be a structure in which an IC is mounted on a substrate with good heat dissipation, such as an insulating film such as polyamide, a flexible printed circuit board, PCB, Al, Cu, MgO, sapphire substrate, GaN, SiC, SiO2 / Si, Ta2O5 / Ta, Al2O3, Al2O3 / Al, SiN, Ti, TiO2 / Ti, CuO / Cu, Ga2O3, GaAs, InAs, InGaAs, InSb, or their composites, or combinations thereof. Terminals can also be extended to the flexible substrate. These structures are not particularly limited.

[0129] Furthermore, by opening the top or bottom of the heat flux sensor, creating a contact point with the outside, thermal resistance can be reduced. The opening can be a physical opening or a structure that connects to a component with low thermal resistance. Furthermore, the IC's package can be either the PKG shown in the figure or a package like a WLCSP.

[0130] The following describes a variation of this embodiment. For example, by providing a film capable of absorbing electromagnetic waves including light on the heat flow sensor portion, electromagnetic waves can be detected. In addition, by further providing an optical filter, only electromagnetic waves (light) within a selected wavelength range can be detected, thereby improving selectivity. In addition, by coating or providing a substance that reacts or adsorbs to a gas, liquid, or solution on the heat flow sensor, gases that react to the substance can be detected. In addition, the above-mentioned substance only needs to be thermally coupled to the heat flow sensor and does not necessarily need to be directly provided on the heat flow sensor.

[0131] The following describes other variations of this embodiment. Coils for generating the magnetic field modulated by the heat flow sensor or heat for catalyst heating can also be placed inside the LSI or in other layers. Because heat can be conducted through these coils, proper measurement is possible. The coils can be placed in any location that provides good heat dissipation. This is not limited to the specific application of the heat flow sensor; for example, any heat flow sensor that utilizes the anomalous Nernst effect can be used, not necessarily a device that detects electromagnetic waves or matter.

[0132] Description of Reference Numerals

[0133] 1: Measurement system,

[0134] 2: Shell,

[0135] 21: First wall portion,

[0136] 21a: opening,

[0137] 22: Second wall portion,

[0138] 22a: opening,

[0139] 221: wall part,

[0140] 221a: first end portion,

[0141] 221b: second end portion,

[0142] 222: End wall part,

[0143] 3: Heat flow sensor,

[0144] 31: Adhesive layer,

[0145] 32: Substrate,

[0146] 33: Thermoelectric conversion unit,

[0147] 331: Thermoelectric conversion element,

[0148] 332: Wiring,

[0149] 333: output terminal,

[0150] 33a: Thermoelectric conversion unit,

[0151] 33b: Thermoelectric conversion unit,

[0152] 33c: Thermoelectric conversion unit,

[0153] 33d: Thermoelectric conversion unit,

[0154] 33p: first page,

[0155] 33s: Side 2,

[0156] 34: Catalytic layer,

[0157] 4: Coil layer,

[0158] 41: First coil,

[0159] 42: Second coil,

[0160] 5: Heat conduction part,

[0161] 6: Magnet,

[0162] 7: Filter,

[0163] 71: Optical filter,

[0164] 8: Light absorption layer,

[0165] 9: Heat conduction part,

[0166] BP: wiring board,

[0167] G1: Gas,

[0168] H: external magnetic field,

[0169] IC1: integrated circuit,

[0170] Ins1: insulating film,

[0171] LF: Lead Frame,

[0172] SP: Accommodation space,

[0173] S P1: Open space,

[0174] SP2: Open space.

Claims

1. A measurement system, wherein: Equipped with a heat flow sensor and a housing; The thermal flow sensor includes a substrate having electrical insulation properties and a thermoelectric conversion portion provided on the substrate. The thermoelectric conversion portion is configured to generate an electromotive force based on a temperature gradient along a direction from the substrate toward the thermoelectric conversion portion, that is, a gradient direction. The housing is configured to accommodate the thermal flow sensor and includes a first wall portion and a second wall portion. The first wall portion is configured to face the substrate. The second wall portion is configured to extend from the first wall portion along the gradient direction so as to cover the thermal flow sensor, and includes an opening. The opening is configured to penetrate the second wall portion, whereby at least a portion of the thermoelectric conversion portion is continuous with the outside of the housing without passing through the substrate.

2. The measurement system according to claim 1, wherein The opening is configured to penetrate the housing along the gradient direction relative to the thermoelectric conversion portion.

3. The measurement system according to claim 1 or 2, wherein The opening is configured to overlap at least a portion of the thermoelectric conversion portion when the thermoelectric conversion portion is viewed in plan from the gradient direction.

4. The measurement system according to any one of claims 1 to 3, wherein It also has an interaction part, The interaction portion is configured to absorb heat or generate heat due to a change in the binding state caused by contact with the target particles, and to exchange heat with the thermoelectric conversion portion through the generated absorption or heat. The interaction portion is configured to be exposed from the opening when the thermoelectric conversion portion is viewed in plan from the gradient direction.

5. The measurement system according to any one of claims 1 to 4, wherein The second wall portion includes a peripheral wall portion, and the peripheral wall portion is configured to extend from the peripheral edge of the first wall portion along the gradient direction. The measuring system further comprises a conducting unit, The conduction portion is configured to be electrically connected to the thermoelectric conversion portion via the substrate and to penetrate the peripheral wall portion, thereby being capable of transmitting the electromotive force to the outside of the housing.

6. The measurement system according to any one of claims 1 to 5, wherein The second wall portion includes a peripheral wall portion and an end wall portion, The peripheral wall portion is configured to extend from the peripheral edge of the first wall portion along the gradient direction. The end wall portion is connected to an end portion of the peripheral wall portion that is different from the end portion connected to the first wall portion, and is configured to cover a portion of the thermoelectric conversion portion without interposing a substrate that is the same as or different from the substrate.

7. The measurement system according to any one of claims 1 to 6, wherein further comprising an integrated circuit configured to obtain the electromotive force, The integrated circuit is configured to execute predetermined signal processing based on at least the electromotive force output from the thermoelectric conversion portion, and is provided on the substrate together with the thermoelectric conversion portion.

8. The measurement system according to any one of claims 1 to 7, wherein The thermoelectric conversion unit is configured to generate the electromotive force based on the anomalous Nernst effect.

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