Monocrystalline silicon wafer defect detection device

By designing the cooperation of the automated conveyor, lifting frame and flip frame with the clamping module, the problems of low detection efficiency and high cost of single crystal silicon wafers are solved, and the double-end detection of single crystal silicon wafers is realized, which improves detection efficiency and reduces costs.

CN120482686AInactive Publication Date: 2025-08-15JINAN KE SHENG ELECTRONIC CO LTD
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Patent Information

Application Number
CN202510751426.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-06-06
Publication Date
2025-08-15
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

The existing single crystal silicon wafers have low detection efficiency and high cost, and the robotic operation is complicated, resulting in inconvenient detection process.

Method used

A detection device including a conveyor, a lifting frame, a flip frame and a clamping module is designed to automatically load and unload the material through the cooperation between the conveyor and the clamping, and to switch the detection end face of the single crystal silicon wafer by using the cooperation between the flip frame and the clamping to improve the detection efficiency.

Benefits of technology

The double-end detection of single crystal silicon wafers is realized, which improves detection efficiency, reduces vibration, enhances detection stability, and reduces detection cost.

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Abstract

The invention relates to the field of monocrystalline silicon wafer detection, and discloses a monocrystalline silicon wafer defect detection device which comprises a table top and further comprises a conveyor fixed to the upper end of the table top and a lifting frame arranged on the table top, and a lifting driving assembly is arranged on the table top and used for driving the lifting frame to move up and down; an overturning frame is rotationally connected into the lifting frame, a first motor is fixed to the side wall of the lifting frame, and the rotating end of the first motor is connected with the overturning frame; two groups of clamping modules are rotationally connected in the turnover frame, the two groups of clamping modules are symmetrically arranged, and each clamping module comprises two clamping plates hinged in the turnover frame. Through cooperation of the conveyor and the clamping plate, automatic feeding and discharging before and after monocrystalline silicon wafer detection can be achieved, through cooperation of the turnover frame capable of being turned over and the clamping plate, switching of the detection end faces of the monocrystalline silicon wafer can be achieved, the two ends of the monocrystalline silicon wafer can be detected conveniently, and double-end detection of the monocrystalline silicon wafer can be achieved through one-time feeding and discharging; therefore, the detection efficiency of the monocrystalline silicon wafer is improved.
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Description

Technical Field

[0001] The present invention belongs to the field of single crystal silicon wafer detection, and in particular relates to a device for detecting defects in single crystal silicon wafers. Background Art

[0002] Monocrystalline silicon wafers are usually separated from silicon ingots by diamond wire cutting. During the cutting process, defects such as microcracks, edge collapse and line marks are easily generated at both ends. Silicon wafers need to go through key steps such as texturing, diffusion, coating and screen printing in the battery manufacturing process. Defects at both ends will lead to uneven texturing, abnormal PN junction diffusion, poor coverage of coatings (such as SiNx) and screen printing alignment deviation.

[0003] Therefore, it is necessary to inspect both ends of the single crystal silicon wafer and remove the defective silicon wafers in advance to avoid waste in subsequent processes.

[0004] Existing single-crystal silicon wafers are mostly loaded and unloaded by robots. After the inspection of one end of the single-crystal silicon wafer is completed, the robot is required to remove, flip and re-place the single-crystal silicon wafer, which makes the operation process complicated and the inspection efficiency low. In addition, the robot needs to be equipped with a corresponding control system, which makes the inspection cost of single-crystal silicon wafers high. Summary of the Invention

[0005] The purpose of the embodiments of the present invention is to provide a device for detecting defects in single crystal silicon wafers, aiming to solve the problems of low detection efficiency and high detection cost of existing single crystal silicon wafers.

[0006] The present invention is implemented as follows: a device for detecting defects in single-crystal silicon wafers comprises a desktop, and also includes: a conveyor fixed at the upper end of the desktop, and a lifting frame arranged on the desktop, the desktop being provided with a lifting drive assembly, the lifting drive assembly being used to drive the lifting frame to move up and down; a turning frame is rotatably connected to the lifting frame, a motor 1 is fixed on the side wall of the lifting frame, and the rotating end of the motor 1 is connected to the turning frame; two groups of clamping modules are rotatably connected to the turning frame, the two groups of clamping modules are symmetrically arranged, the clamping module includes two clamping plates hinged in the turning frame, and the ends of the two clamping plates close to each other are each provided with a storage groove, the turning frame is provided with four rotation drive mechanisms, the four rotation drive mechanisms are respectively used to drive the four clamping plates to rotate; a defect detection sensor is provided above the lifting frame, and a horizontal moving assembly is provided on the desktop, the horizontal moving assembly being used to drive the defect detection sensor to move horizontally.

[0007] A further technical solution is that the lifting drive assembly includes a concave plate 1 vertically slidably connected to the desktop, the lifting frame is fixed to the top of the concave plate 1, a concave plate 2 is fixed to the bottom of the desktop, a screw rod 1 is rotatably connected to the desktop, the screw rod 1 is threadedly connected to the bottom of the concave plate 1, a motor 2 is fixed to the bottom of the concave plate 2, and the rotating end of the motor 2 is connected to the screw rod 1.

[0008] A further technical solution is that the four rotation drive mechanisms are divided into two groups and are respectively arranged at both ends of the flip frame. The rotation drive mechanism includes a guide groove one provided at one end of the flip frame, a guide block one is slidably connected in the guide groove one, a connecting rod is hinged on the guide block one, the end of the connecting rod is hinged on the adjacent splint, a cylinder is fixed to the end of the flip frame, and the telescopic end of the cylinder is connected to the guide block one.

[0009] A further technical solution is that a limiting structure is provided on the two opposite inner walls of the lifting frame, and the limiting structure includes a fixed block fixed on the inner wall of the lifting frame, and the fixed block is provided with a horizontal limiting groove, and the flip frame is provided with two guide grooves 2, and the two guide grooves 2 are both slidably connected to the limited sliders, and the two limiting sliders are respectively connected to the two guide blocks 1 at the same end of the flip frame.

[0010] A further technical solution is that two positioning components are respectively provided at both ends of the flip frame, and the positioning component includes a guide groove three provided in the flip frame, and a guide block two is slidably connected in the guide groove three, and one end of the guide block two is fixed with a compression spring one and two positioning rods, and the compression spring one is provided in the guide groove three, and the two positioning rods are both extended into the storage groove, and the two positioning rods are located between the two splints, and the other end of the guide block two is fixed with a transmission rod, and the transmission rod extends out of the flip frame, and a transmission component is provided on the fixed block. When the splint located above the flip frame rotates upward, the transmission component overcomes the elastic force of the compression spring one and pushes the transmission rod to move.

[0011] A further technical solution is that the transmission assembly includes a driving rod slidably connected in the fixed block, and a transmission slider slidably connected in the limiting groove, the transmission slider is fixed with a compression spring at the end away from the flip frame, and the second end of the compression spring is fixed in the limiting groove, and a gear is rotatably connected between the driving rod and the transmission slider in the fixed block, the driving rod and the transmission slider are arranged in parallel, and the driving rod and the transmission slider are fixed with a rack at one end close to the gear and mesh with the gear.

[0012] A further technical solution is that the horizontal movement component includes a fixed frame fixed on the upper end of the desktop, two parallel guide rails are fixed on the top of the fixed frame, and a sliding plate is slidably connected to the two guide rails, the top of the fixed frame is rotatably connected to screw rod 2, and screw rod 2 is threadedly connected to the sliding plate, a motor 3 is fixed on the side wall of the fixed frame, the rotating end of the motor 3 is connected to screw rod 2, and an installation slider is slidably connected to the sliding plate along the length direction of the sliding plate, the defect detection sensor is fixed on the bottom of the installation slider, the sliding plate is rotatably connected to screw rod 3, and the screw rod 3 is threadedly connected to the installation slider, a motor 4 is fixed at one end of the sliding plate, and the rotating end of the motor 4 is connected to screw rod 3.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] 1. The cooperation between the conveyor and the clamping plate can realize automatic loading and unloading of single crystal silicon wafers before and after testing. The reversible turning frame cooperates with the clamping plate to realize the switching of the testing end face of the single crystal silicon wafer, which is convenient for testing both ends of the single crystal silicon wafer. The double-end testing of the single crystal silicon wafer can be realized through one loading and unloading, thereby improving the testing efficiency of the single crystal silicon wafer;

[0015] 2. The limiting slider is inserted into the limiting groove of the fixed block, thereby limiting the rotation of the flip frame, thereby preventing the flip frame from vibrating due to rotation, thereby improving the stability of the single crystal silicon wafer and reducing the vibration of the single crystal silicon wafer during detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic structural diagram of a device for detecting defects in single crystal silicon wafers provided by the present invention;

[0017] Figure 2 The present invention provides Figure 1 Schematic diagram of the structure when looking up at the tilt angle;

[0018] Figure 3 The present invention provides Figure 1 Schematic diagram of the structure after removing the table and conveyor;

[0019] Figure 4 The present invention provides Figure 3 Schematic diagram of the structure after removing the horizontal movement component;

[0020] Figure 5 The present invention provides Figure 4 Schematic diagram of the structure of the middle turning frame;

[0021] Figure 6 The present invention provides Figure 4 Schematic diagram of the internal structure of the middle turning frame, splint and fixing block;

[0022] Figure 7 The present invention provides Figure 6 Schematic diagram of the enlarged structure of A in the middle;

[0023] Figure 8 A schematic diagram of the structure of the splint provided by the present invention in a material-taking state;

[0024] Figure 9 This is a structural schematic diagram of the splint provided by the present invention in a defect detection state.

[0025] In the accompanying drawings: 101, tabletop; 102, conveyor; 103, lifting frame; 104, turning frame; 105, clamping plate; 106, motor 1; 107, storage slot; 108, defect detection sensor;

[0026] 2. Lifting drive assembly; 201. Concave plate 1; 202. Concave plate 2; 203. Screw rod 1; 204. Motor 2;

[0027] 3. Rotation drive mechanism; 301. Guide groove 1; 302. Guide block 1; 303. Connecting rod; 304. Cylinder;

[0028] 4. Limiting structure; 401. Fixed block; 402. Limiting groove; 403. Second guide groove; 404. Limiting slide block; 501. Third guide groove; 502. Second guide block; 503. Compression spring 1; 504. Positioning rod; 505. Transmission rod;

[0029] 6. Transmission assembly; 601. Drive rod; 602. Gear; 603. Transmission slider; 604. Compression spring 2;

[0030] 7. Horizontal moving assembly; 701. Fixed frame; 702. Guide rail; 703. Screw rod 2; 704. Motor 3; 705. Sliding plate; 706. Mounting slider; 707. Screw rod 3; 708. Motor 4. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0032] The specific implementation of the present invention is described in detail below with reference to specific embodiments.

[0033] like Figure 1 、 Figure 3 、 Figure 4 、 Figure 5 、 Figure 8 and Figure 9As shown in FIG. 1 , a device for detecting defects in single-crystal silicon wafers provided by an embodiment of the present invention comprises a table 101, a conveyor 102 fixed at the upper end of the table 101, and a lifting frame 103 provided on the table 101. The table 101 is provided with a lifting drive assembly 2, and the lifting drive assembly 2 is used to drive the lifting frame 103 to move up and down; a turning frame 104 is rotatably connected to the lifting frame 103, a motor 106 is fixed to the side wall of the lifting frame 103, and the rotating end of the motor 106 is connected to the turning frame 104; the turning frame 104 is internally connected to the turning frame 104. There are two groups of clamping modules that are rotatably connected and symmetrically arranged. The clamping modules include two clamping plates 105 hinged in the flip frame 104. The two clamping plates 105 are each provided with a storage groove 107 at one end close to each other. Four rotation driving mechanisms 3 are provided on the flip frame 104, and the four rotation driving mechanisms 3 are respectively used to drive the four clamping plates 105 to rotate; a defect detection sensor 108 is provided above the lifting frame 103, and a horizontal moving component 7 is provided on the table 101, and the horizontal moving component 7 is used to drive the defect detection sensor 108 to move horizontally.

[0034] In the embodiment of the present invention, the conveyor 102 can drive a belt conveyor, and the conveyor 102 is used to transport single crystal silicon wafers. The diameter of the single crystal silicon wafer is larger than the width of the conveyor 102. The single crystal silicon wafer is placed on the conveyor 102, and the conveyor 102 transports the single crystal silicon wafer to the bottom of the lifting frame 103. The rotation drive mechanism 3 drives the clamping plate 105 below to rotate to a vertical state (such as Figure 8 As shown in FIG, the lifting drive assembly 2 drives the lifting frame 103 to move downward until the lower clamping plate 105 moves to the bottom of the single crystal silicon wafer, and then the rotation drive mechanism 3 drives the lower clamping plate 105 to rotate to a horizontal state, so that the single crystal silicon wafer is located in the storage groove 107 of the clamping plate 105, thereby completing the collection of the single crystal silicon wafer, the lifting drive assembly 2 drives the lifting frame 103 to move upward, and the lifting frame 103 drives the single crystal silicon wafer to the detection height through the flip frame 104 and the clamping plate 105, and the rotation drive mechanism 3 drives the upper clamping plate 105 to rotate upward to a vertical state, so that the upper clamping plate 105 does not block the upper part of the single crystal silicon wafer, and the horizontal movement assembly 7 drives the defect detection sensor 108 to move horizontally, and the defect detection sensor 108 performs defect detection on the upper end of the single crystal silicon wafer;

[0035] After defect detection is completed on one end of the single crystal silicon wafer, the rotation drive mechanism 3 drives the upper clamping plate 105 to rotate downward to a horizontal state. At this time, the single crystal silicon wafer is located in the storage groove 107 of the upper and lower clamping plates 105. The motor 106 drives the flip frame 104 to flip. The flip frame 104 drives the single crystal silicon wafer to flip through the clamping plate 105, so that the other end of the single crystal silicon wafer faces upward. At this time, the rotation drive mechanism 3 drives the upper clamping plate 105 to rotate upward to a vertical state, thereby preventing the upper clamping plate 105 from blocking the upper part of the single crystal silicon wafer. The horizontal movement component 7 drives the defect detection sensor 108 to move horizontally, and the defect detection sensor 108 performs defect detection on the other end of the single crystal silicon wafer.

[0036] After the inspection of both ends of the single crystal silicon wafer is completed, the rotation drive mechanism 3 drives the upper clamping plate 105 to rotate downward to a horizontal state. At this time, the single crystal silicon wafer is located in the storage groove 107 of the upper and lower clamping plates 105. The motor 106 drives the flip frame 104 to flip and reset. The lifting drive assembly 2 drives the lifting frame 103 to move downward. The lifting frame 103 drives the single crystal silicon wafer downward through the flip frame 104 and the clamping plate 105, so that the lower end of the single crystal silicon wafer contacts the conveyor 102. The rotation drive mechanism 3 drives the lower clamping plate 105 to rotate downward to a vertical state (such as Figure 9 As shown in the figure, the single crystal silicon wafer falls on the conveyor 102, and the conveyor 102 unloads the single crystal silicon wafer. After one round of single crystal silicon wafer inspection is completed, the conveyor 102 cooperates with the clamping plate 105 to realize automatic loading and unloading before and after the single crystal silicon wafer inspection, and the flippable flip rack 104 cooperates with the clamping plate 105 to realize the switching of the inspection end face of the single crystal silicon wafer, which is convenient for inspecting both ends of the single crystal silicon wafer. The double-end inspection of the single crystal silicon wafer can be realized by loading and unloading once, thereby improving the inspection efficiency of the single crystal silicon wafer.

[0037] like Figure 1 and Figure 2 As shown, as a preferred embodiment of the present invention, the lifting drive assembly 2 includes a concave plate 1 201 vertically slidably connected to the desktop 101, the lifting frame 103 is fixed to the top of the concave plate 1 201, a concave plate 2 202 is fixed to the bottom of the desktop 101, a screw rod 1 203 is rotatably connected to the desktop 101, the screw rod 1 203 is threadedly connected to the bottom of the concave plate 1 201, a motor 204 is fixed to the bottom of the concave plate 202, and the rotating end of the motor 204 is connected to the screw rod 1 203.

[0038] In the embodiment of the present invention, the second motor 204 drives the first screw 203 to rotate, the first screw 203 drives the first concave plate 201 to move up and down through thread transmission, and the first concave plate 201 drives the lifting frame 103 to move up and down.

[0039] like Figure 4 and Figure 5As shown, as a preferred embodiment of the present invention, the four rotation drive mechanisms 3 are divided into two groups and are respectively arranged at both ends of the flip frame 104, the rotation drive mechanism 3 includes a guide groove 301 set at one end of the flip frame 104, a guide block 302 is slidably connected in the guide groove 301, a connecting rod 303 is hinged on the guide block 302, the end of the connecting rod 303 is hinged on the adjacent splint 105, a cylinder 304 is fixed to the end of the flip frame 104, and the telescopic end of the cylinder 304 is connected to the guide block 302.

[0040] In the embodiment of the present invention, in the initial state, the cylinder 304 is in an extended state and the splint 105 is in a horizontal state; when the cylinder 304 contracts, the cylinder 304 drives the guide block 302 to move, and the guide block 302 pulls the splint 105 to rotate through the connecting rod 303 until the splint 105 rotates to a vertical state.

[0041] like Figure 4 、 Figure 5 、 Figure 6 、 Figure 7 and Figure 9 As shown, as a preferred embodiment of the present invention, a limiting structure 4 is provided on the two opposite inner walls of the lifting frame 103, and the limiting structure 4 includes a fixed block 401 fixed on the inner wall of the lifting frame 103, and a horizontal limiting groove 402 is provided on the fixed block 401. Two guide grooves 2 403 are provided on the flip frame 104, and limited sliders 404 are slidably connected in the two guide grooves 2 403. The two limiting sliders 404 are respectively connected to the two guide blocks 1 302 at the same end of the flip frame 104.

[0042] In the embodiment of the present invention, in the initial state, the splint 105 is in a horizontal state, and the four limiting sliders 404 are respectively retracted in the four guide grooves 403; Figure 9 As shown, when the upper clamping plate 105 rotates upward to a vertical state, the guide block 302 drives the limiting slider 404 to move, and the limiting slider 404 is inserted into the limiting groove 402 of the fixed block 401, thereby limiting the rotation of the flip frame 104, thereby avoiding the flip frame 104 from vibrating due to rotation, thereby improving the stability of the single crystal silicon wafer and reducing the vibration of the single crystal silicon wafer during detection.

[0043] like Figure 4 、 Figure 5 、 Figure 6 、 Figure 7 、 Figure 8 and Figure 9As shown, as a preferred embodiment of the present invention, two positioning components are respectively provided at both ends of the flip frame 104, and the positioning component includes a guide groove three 501 provided in the flip frame 104, and a guide block two 502 is slidably connected in the guide groove three 501, and one end of the guide block two 502 is fixed with a compression spring one 503 and two positioning rods 504, and the compression spring one 503 is provided in the guide groove three 501, and the two positioning rods 504 are both extended into the receiving groove 107, and the two positioning rods 504 are located between the two splints 105, and the other end of the guide block two 502 is fixed with a transmission rod 505, and the transmission rod 505 extends out of the flip frame 104, and the transmission assembly 6 is provided on the fixed block 401, and the flip frame 104 When the upper splint 105 rotates upward, the transmission assembly 6 overcomes the elastic force of the compression spring 1 503 and pushes the transmission rod 505 to move; the transmission assembly 6 includes a driving rod 601 slidably connected in the fixed block 401, and a transmission slider 603 slidably connected in the limiting groove 402, and the transmission slider 603 is fixed with a compression spring 2 604 at the end away from the flip frame 104, and the end of the compression spring 2 604 is fixed in the limiting groove 402, and a gear 602 is rotatably connected between the driving rod 601 and the transmission slider 603 in the fixed block 401, and the driving rod 601 and the transmission slider 603 are arranged in parallel, and the driving rod 601 and the transmission slider 603 are fixed with racks at one end close to the gear 602 and mesh with the gear 602.

[0044] In the embodiment of the present invention, in the initial state, the limiting slider 404 is retracted into the second guide groove 403, the first compression spring 503 pushes the second guide block 502, and the positioning rod 504 does not extend into the receiving groove 107;

[0045] When the single crystal silicon wafer moves to the detection height, the rotation drive mechanism 3 drives the upper clamping plate 105 to rotate upward to a vertical state. When the limiting slider 404 is inserted into the limiting groove 402 of the fixed block 401, the limiting slider 404 overcomes the elastic force of the second compression spring 604 and pushes the transmission slider 603 to move. The transmission slider 603 pushes the gear 602 to rotate through the rack. The gear 602 drives the driving rod 601 to move in the opposite direction through the rack. The driving rod 601 overcomes the elastic force of the first compression spring 503 and pushes the transmission rod 505, the second guide block 502 and the positioning rod 504 to move. The positioning rod 504 extends into the storage groove 107. The four positioning rods 504 clamp the single crystal silicon wafer, thereby reducing the vibration of the single crystal silicon wafer during detection. Figure 4 and Figure 7 As shown, the fixed block 401 is located on one side of the rotation axis of the flip frame 104. Only when the upper clamping plate 105 rotates upward can the transmission slider 603 be driven to move, and the positioning rod 504 clamps the single crystal silicon wafer. Figure 8 As shown, when taking materials, the upper clamping plate 105 is horizontal, the lower clamping plate 105 is vertical, and the positioning rod 504 does not extend into the receiving groove 107. Figure 9 As shown, the upper clamping plate 105 is vertical, the lower clamping plate 105 is horizontal, and the positioning rod 504 extends into the receiving groove 107 to clamp the single crystal silicon wafer.

[0046] like Figure 1-Figure 3 As shown, as a preferred embodiment of the present invention, the horizontal movement component 7 includes a fixed frame 701 fixed on the upper end of the desktop 101, and two parallel guide rails 702 are fixed on the top of the fixed frame 701, and sliding plates 705 are slidably connected to the two guide rails 702, and the top of the fixed frame 701 is rotatably connected to the second screw rod 703, and the second screw rod 703 is threadedly connected to the sliding plate 705, and a motor three 704 is fixed on the side wall of the fixed frame 701, and the rotating end of the motor three 704 is connected to the second screw rod 703, and the sliding plate 705 is slidably connected to the installation slider 706 along the length direction of the sliding plate 705, and the defect detection sensor 108 is fixed to the bottom of the installation slider 706, and the sliding plate 705 is rotatably connected to the third screw rod 707, and the third screw rod 707 is threadedly connected to the installation slider 706, and one end of the sliding plate 705 is fixed to a motor four 708, and the rotating end of the motor four 708 is connected to the third screw rod 707.

[0047] In an embodiment of the present invention, when the defect detection sensor 108 moves left and right, the motor three 704 drives the screw rod two 703 to rotate. Under the guiding action of the guide rail 702, the rotating screw rod two 703 drives the sliding plate 705 to move left and right through thread transmission, the sliding plate 705 drives the installation slider 706 to move left and right, and the installation slider 706 drives the defect detection sensor 108 to move left and right; when the defect detection sensor 108 moves forward and backward, the motor four 708 drives the screw rod three 707 to rotate. Under the guiding action of the sliding plate 705, the rotating screw rod three 707 drives the installation slider 706 to move forward and backward through thread transmission, and the installation slider 706 drives the defect detection sensor 108 to move forward and backward, thereby enabling the defect detection sensor 108 to move horizontally.

[0048] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A device for detecting defects in single crystal silicon wafers, comprising a desktop, characterized in that: Also includes: A conveyor is fixed on the top of the table, and a lifting frame is provided on the table. A lifting drive assembly is provided on the table, and the lifting drive assembly is used to drive the lifting frame to move up and down; The lifting frame is rotatably connected to the turning frame, a motor 1 is fixed on the side wall of the lifting frame, and the rotating end of the motor 1 is connected to the turning frame; Two sets of clamping modules are rotatably connected in the turning frame. The two sets of clamping modules are symmetrically arranged. The clamping modules include two clamping plates hinged in the turning frame. The ends of the two clamping plates close to each other are each provided with a storage slot. The turning frame is provided with four rotation drive mechanisms, which are used to drive the four clamping plates to rotate respectively. A defect detection sensor is arranged above the lifting frame, and a horizontal moving component is arranged on the desktop. The horizontal moving component is used to drive the defect detection sensor to move horizontally.

2. The device for detecting defects in single crystal silicon wafers according to claim 1, wherein: The lifting drive assembly includes a concave plate 1 connected to the desktop for vertical sliding, a lifting frame fixed to the top of the concave plate 1, a concave plate 2 fixed to the bottom of the desktop, a screw rod 1 rotatably connected to the desktop, the screw rod 1 is threadedly connected to the bottom of the concave plate 1, a motor 2 is fixed to the bottom of the concave plate 2, and the rotating end of the motor 2 is connected to the screw rod 1.

3. The device for detecting defects in single crystal silicon wafers according to claim 1, wherein: The four rotation drive mechanisms are divided into two groups and are respectively arranged at both ends of the turning frame. The rotation drive mechanism includes a guide groove 1 set at one end of the turning frame, a guide block 1 is slidably connected in the guide groove 1, a connecting rod is hinged on the guide block 1, and the end of the connecting rod is hinged on the adjacent splint. A cylinder is fixed to the end of the turning frame, and the telescopic end of the cylinder is connected to the guide block 1.

4. The device for detecting defects in single crystal silicon wafers according to claim 3, wherein: A limiting structure is provided on the two opposite inner walls of the lifting frame. The limiting structure includes a fixed block fixed on the inner wall of the lifting frame, and a horizontal limiting groove is provided on the fixed block. Two guide grooves 2 are provided on the turning frame. Limited sliders are slidably connected in the two guide grooves 2, and the two limiting sliders are respectively connected to the two guide blocks 1 at the same end of the turning frame.

5. The device for detecting defects in single crystal silicon wafers according to claim 4, characterized in that: Two positioning components are respectively provided at both ends of the flip frame, and the positioning component includes a guide groove three provided in the flip frame, and a guide block two is slidably connected in the guide groove three. One end of the guide block two is fixed with a compression spring one and two positioning rods, and the compression spring one is provided in the guide groove three. The two positioning rods both extend into the storage groove. The two positioning rods are located between the two splints, and a transmission rod is fixed to the other end of the guide block two. The transmission rod extends out of the flip frame, and a transmission component is provided on the fixed block. When the splint located above the flip frame rotates upward, the transmission component overcomes the elastic force of the compression spring one and pushes the transmission rod to move.

6. The device for detecting defects in single crystal silicon wafers according to claim 5, characterized in that: The transmission assembly includes a driving rod slidably connected in the fixed block, and a transmission slider slidably connected in the limiting groove. The end of the transmission slider away from the flip frame is fixed with a compression spring 2, and the ends of the compression springs are fixed in the limiting groove. A gear is rotatably connected between the driving rod and the transmission slider in the fixed block. The driving rod and the transmission slider are arranged in parallel, and the ends of the driving rod and the transmission slider close to the gear are fixed with racks and mesh with the gears.

7. The device for detecting defects in single crystal silicon wafers according to claim 1, wherein: The horizontal moving component includes a fixed frame fixed on the upper end of the desktop, two parallel guide rails are fixed on the top of the fixed frame, and sliding plates are slidably connected to the two guide rails. The top of the fixed frame is rotatably connected to screw rod 2, and screw rod 2 is threadedly connected to the sliding plate. Motor 3 is fixed on the side wall of the fixed frame, and the rotating end of motor 3 is connected to screw rod 2. The sliding plate is slidably connected to the installation slider along the length direction of the sliding plate. The defect detection sensor is fixed on the bottom of the installation slider, and screw rod 3 is rotatably connected to the sliding plate, and screw rod 3 is threadedly connected to the installation slider. Motor 4 is fixed at one end of the sliding plate, and the rotating end of motor 4 is connected to screw rod 3.