A flexible hinge and semiconductor positioning apparatus

Abstract

This invention belongs to the field of semiconductor positioning technology, and specifically relates to a flexible hinge and a semiconductor positioning device. The flexible hinge includes a hinge body, a first fixing part, a second fixing part, and a connecting part. The connecting part is disposed between the second fixing part and the hinge body, and the connecting part is capable of deformation along a third direction to compensate for assembly deviations between the fixing device and the moving device in the third direction. When installing the flexible hinge, the first fixing part and the second fixing part are connected to the fixing device and the moving device respectively. Under the action of preload, the connecting part can automatically deform along the third direction to compensate for assembly deviations between the fixing device and the moving device without manual adjustment. Furthermore, the connecting part can limit local deformation caused by the preload to the connecting part, preventing it from being transmitted to the moving device, thereby further ensuring the assembly accuracy between the fixing device and the moving device.

Description

Technical Field

[0001] This invention relates to the field of semiconductor positioning technology, and more particularly to a flexible hinge and a semiconductor positioning device. Background Technology

[0002] A flexible hinge is a frictionless, lubrication-free mechanism that achieves movement through the elastic deformation of materials. It is widely used in scenarios with high motion accuracy requirements, such as positioning equipment for semiconductor wafers. For example, when adjusting the position of a wafer to measure the thickness, stress, and other values ​​at different points, the total travel of the wafer is approximately ±2mm. The flexible hinge can achieve measurement at different points on the wafer through multiple deformations.

[0003] When installing flexible hinges, one end of the flexible hinge is usually connected to a fixed device such as a frame, and the other end is connected to a moving device such as a motion platform, using screws. However, during the installation process, due to the preload of the screws, the assembly accuracy between the frame and the motion platform in the height direction is easily deviated, resulting in a deviation in the position of the motion platform, which in turn makes it impossible to guarantee the positioning accuracy of the wafer.

[0004] Therefore, the above problems urgently need to be solved. Summary of the Invention

[0005] The purpose of this invention is to provide a flexible hinge and a semiconductor positioning device to compensate for assembly deviations between the fixed device and the moving device, thereby ensuring the positioning accuracy of semiconductor products.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] A flexible hinge includes a hinge body, a first fixing part, and a second fixing part. The first fixing part and the second fixing part are respectively disposed at both ends of the hinge body along a first direction. The first fixing part is configured to be connected to an external fixing device, and the second fixing part is configured to be connected to an external moving device. The moving device is capable of relative movement with respect to the fixing device along a second direction, so that the hinge body deforms along the second direction.

[0008] The flexible hinge also includes:

[0009] A connecting part is disposed between the second fixing part and the hinge body, and the connecting part is capable of elastic deformation in a third direction to compensate for the assembly deviation of the fixing device and the moving device in the third direction.

[0010] The first direction, the second direction, and the third direction are set perpendicular to each other.

[0011] Preferably, the hinge body, the first fixing part, the second fixing part, and the connecting part are integrally formed.

[0012] Preferably, the connection position between the second fixing part and the hinge body is provided with decoupling grooves with openings on both sides along the third direction, and the length direction of any one of the decoupling grooves is arranged along the second direction and penetrates the second fixing part;

[0013] The area between the two decoupling slots constitutes the connection portion.

[0014] Preferably, the connecting part is made of a plate-shaped elastic metal material.

[0015] Preferably, the hinge body includes:

[0016] Two bases are respectively connected to the first fixing part and the second fixing part;

[0017] The deformable body has a deformation direction along the second direction, and both ends of the deformable body are fixedly connected to the two bases respectively.

[0018] Preferably, the deformable material is sheet-like, and the ratio of the height to the thickness of the deformable material is greater than or equal to 10:1.

[0019] Preferably, the deformable forms are arranged in a plurality of parallel and spaced apart along the second direction.

[0020] Preferably, the first fixing part and / or the second fixing part can extend along the first direction to the deformation region of the deformed shape, and a gap is provided between the first fixing part and / or the second fixing part and the deformed shape.

[0021] Preferably, the first fixing part or the second fixing part includes a fixing block, the top of the fixing block is provided with a mounting groove, and the bottom of the mounting groove is provided with a mounting hole for a through screw.

[0022] A semiconductor positioning device includes a fixing device, a moving device, a linear drive device, and at least two flexible hinges as described above. The moving device is used to carry a semiconductor product and is disposed on the fixing device via the at least two flexible hinges. The driving end of the linear drive device is connected to the moving device and is used to drive the moving device to move along a second direction.

[0023] The beneficial effects of this invention are:

[0024] The flexible hinge and semiconductor positioning device of the present invention, when installing the flexible hinge, connect the first fixing part and the second fixing part to the fixing device and the moving device respectively. Under the action of pre-tightening force, the connecting part can automatically generate deformation in the third direction to automatically compensate for the assembly deviation between the fixing device and the moving device. Furthermore, the setting of the connecting part can limit the local deformation caused by the pre-tightening force to the connecting part and prevent it from being transmitted to the moving device, thereby further ensuring the assembly accuracy between the fixing device and the moving device. In addition, the connecting part only generates elastic deformation in the third direction and does not generate elastic deformation in the second direction, thereby ensuring the stiffness of the connecting part in the second direction during the movement of the moving device, and thus ensuring the positioning accuracy of the semiconductor product during the movement. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the semiconductor positioning device in an embodiment of the present invention;

[0026] Figure 2 This is a schematic diagram of the flexible hinge structure in an embodiment of the present invention;

[0027] Figure 3 yes Figure 2 Top view;

[0028] Figure 4 This is a schematic diagram of the hinge body, connecting part, and second fixing part in an embodiment of the present invention.

[0029] In the picture:

[0030] 100. Fixed device; 200. Moving device; 300. Linear drive device; 400. Flexible hinge;

[0031] 1. Hinge body; 11. Base; 12. Deformation element;

[0032] 2. First fixing part;

[0033] 3. Second fixing part; 31. Fixing block; 32. Mounting groove; 33. Mounting hole;

[0034] 4. Connecting part; 5. Decoupling groove. Detailed Implementation

[0035] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0036] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0037] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0038] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0039] Please see Figure 1 This embodiment proposes a semiconductor positioning device, which includes a fixing device 100, a moving device 200, a linear drive device 300, and at least two flexible hinges 400. The moving device 200 is used to carry semiconductor products and is mounted on the fixing device 100 via at least two flexible hinges 400. The driving end of the linear drive device 300 is connected to the moving device 200 and is used to drive the moving device 200 to move along a second direction.

[0040] It is understood that the fixing device 100 is a fixed frame or some other fixed structure, and the moving device 200 is a moving platform used in the prior art to support and fix semiconductor products or some other structure that needs to move. The linear drive device 300 is preferably a linear drive structure such as a linear driver in the prior art. The two opposite sides of the moving platform are connected to the frame through flexible hinges 400, and the flexible hinges 400 are usually locked to the frame or moving platform with screws. When measuring or processing semiconductor products, it is necessary to adjust the position of the semiconductor products. That is, according to actual needs, the moving platform can be driven to move along the second direction by the linear drive device 300. At this time, the flexible hinges 400 can bend along the second direction to realize the relative movement between the moving platform and the frame, thereby completing the adjustment of the position of the semiconductor products.

[0041] Furthermore, to ensure the accuracy of semiconductor product positioning, the assembly precision requirements between the fixing device 100, the flexible hinge 400, and the moving device 200 are extremely high. However, when assembling the flexible hinge 400, the preload of the screws can easily cause misalignment between the fixing device 100 and the moving device 200 in a third direction, resulting in a positional deviation of the motion platform and consequently compromising the wafer positioning accuracy. Therefore, this embodiment proposes a flexible hinge 400 to compensate for the assembly deviation between the fixing device 100 and the moving device 200 in a third direction, thereby ensuring the accuracy of the motion platform during semiconductor positioning.

[0042] Specifically, please combine Figure 1 See Figures 2 to 4 The flexible hinge 400 includes a hinge body 1, a first fixing part 2, a second fixing part 3, and a connecting part 4. The first fixing part 2 and the second fixing part 3 are respectively disposed at both ends of the hinge body 1 along a first direction. The first fixing part 2 is configured to connect with an external fixing device 100, and the second fixing part 3 is configured to connect with an external moving device 200. The moving device 200 can move relative to the fixing device 100 along a second direction, so that the hinge body 1 deforms along the second direction. The connecting part 4 is disposed between the second fixing part 3 and the hinge body 1, and the connecting part 4 can deform along a third direction to compensate for the assembly deviation between the fixing device 100 and the moving device 200 in the third direction. The first direction, the second direction, and the third direction are mutually perpendicular. Specifically, in this embodiment, the first direction and the second direction are two mutually perpendicular horizontal directions, and the third direction is a vertical direction.

[0043] Understandably, when installing the flexible hinge 400, the first fixing part 2 and the second fixing part 3 are connected to the fixing device 100 and the moving device 200 respectively. Under the action of the pre-tightening force, the connecting part 4 can automatically deform in the third direction to compensate for the assembly deviation between the fixing device and the moving device. Furthermore, the setting of the connecting part 4 can limit the local deformation caused by the pre-tightening force to the connecting part 4 and prevent it from being transmitted to the moving device 200, so as to further ensure the assembly accuracy between the fixing device 100 and the moving device 200. In addition, the connecting part 4 only generates elastic deformation in the third direction and does not generate elastic deformation in the second direction, thereby ensuring the rigidity of the connecting part 4 in the second direction during the movement of the moving device 200, and thus ensuring the positioning accuracy of the semiconductor product during the movement.

[0044] In this embodiment, the hinge body 1, the first fixing part 2, the second fixing part 3, and the connecting part 4 are integrally formed. It can be understood that the entire flexible hinge 400 is processed from the same raw material, and no additional connecting structures are needed between different parts (the different parts refer to the hinge body 1, the first fixing part 2, the second fixing part 3, and the connecting part 4). This reduces processing and assembly errors between different parts, thereby ensuring the moving accuracy of the moving device 200.

[0045] Preferably, the connection position between the second fixing part 3 and the hinge body 1 is provided with decoupling grooves 5 with openings on both sides along the third direction. The length direction of any decoupling groove 5 is arranged along the second direction and penetrates the second fixing part 3. The area between the two decoupling grooves 5 constitutes the connecting part 4. It can be understood that when processing the flexible hinge 400, the hinge body 1 and the second fixing part 3 are processed first, at which point the hinge body 1 and the second fixing part 3 are directly connected. Then, decoupling grooves 5 are processed on both sides at the connection position between the hinge body 1 and the second connecting part 4. The position between the two decoupling grooves 5 is the connecting part 4. The setting of the decoupling grooves 5 can reduce the stiffness of the connection position between the hinge body 1 and the second connecting part 4 in the third direction, thereby allowing the connecting part 4 to undergo elastic deformation to automatically offset assembly deviations without manual adjustment. Furthermore, it will not affect the stiffness in the second direction, thus ensuring the stiffness of the connecting part 4 when it moves along the second direction.

[0046] In some other feasible embodiments, the connecting part 4 is made of a plate-shaped elastic metal material. It is understood that when processing the flexible hinge 400, the hinge body 1, the connecting part 4, and the second fixing part 3 are processed separately, and then the hinge body 1, the connecting part 4, and the second fixing part 3 are processed into a whole by welding or other processing methods. The elastic metal material is preferably a material such as titanium alloy in the prior art.

[0047] In this embodiment, the hinge body 1 includes two bases 11 and a deformable part 12. The two bases 11 are respectively connected to the first fixing part 2 and the second fixing part 3. The deformation direction of the deformable part 12 is arranged along the second direction, and both ends of the deformable part 12 are respectively fixedly connected to the two bases 11. It can be understood that by placing the base 11 between the deformable part 12 and the connecting part 4, the base 11 can eliminate the influence of the preload on the deformable part 12, so as to further ensure the positioning accuracy of the semiconductor product during the movement process.

[0048] Preferably, the deformable part 12 is sheet-like, and the ratio of its height to its thickness is greater than or equal to 10:1. It is understood that the sheet-like deformable part 12 is relatively thin, thus enabling it to deform along its thickness direction. During processing, the length direction of the deformable part 12 is aligned with a first direction to ensure high rigidity along that direction; the thickness direction is aligned with a second direction to ensure low rigidity along that direction; and the width direction is aligned with a third direction to ensure high rigidity in that direction. The thickness of the deformable part 12 is 0.5–1.2 mm, preferably 0.8 mm.

[0049] Furthermore, multiple deformable forms 12 are arranged parallel to each other at intervals along the second direction. It is understood that increasing the number of deformable forms 12 can increase the stiffness of the flexible hinge 400 along both the first and second directions, thereby ensuring the stability of the flexible hinge 400 during deformation. However, too many deformable forms 12 will reduce the displacement fluctuation of the flexible hinge 400 in a single operation. Therefore, the number of deformable forms 12 in a single flexible hinge 400 is preferably one, two, three, or four, depending on the length of the moving device 200, and no specific limit is set here. Of course, in some other feasible embodiments, the stability of the flexible hinge 400 during deformation can be ensured by changing the number of flexible hinges 400.

[0050] For example, when the motion platform is rectangular and its length along the second direction is relatively short, each side can be provided with a flexible hinge 400. The number of deformable parts 12 in the flexible hinge 400 is preferably 3 or 4. When the length of the motion platform along the second direction is relatively long, each side can be provided with at least two flexible hinges 400. The number of deformable parts 12 in a single flexible hinge 400 can be 1 or 2. When multiple sets are used symmetrically, linear frictionless motion of the motion platform can be achieved, and it has excellent repeatability.

[0051] In this embodiment, the first fixing part 2 and / or the second fixing part 3 can extend along the first direction to the deformation area of ​​the deformable part 12, and a gap is provided between the first fixing part 2 and / or the second fixing part 3 and the deformable part 12. It can be understood that one or both of the first fixing part 2 and the second fixing part 3 can extend into the deformation area of ​​the deformable part 12, thereby shortening the length of the entire flexible hinge 400, and the gap can separate the first fixing part 2 or the second fixing part 3 from the deformable part 12, thereby further avoiding the influence of preload on the deformable part 12 during installation.

[0052] Preferably, the first fixing part 2 extends along the first direction to the deformation region of the deformable part 12. During processing, a groove is machined between the first fixing part 2 and the deformable part 12 to form a gap. The gap can also relatively increase the length of the deformable part 12 to reduce the stiffness of the deformable part 12 along the second direction. The second fixing part 3 extends in a direction away from the deformable part 12, and a decoupling groove 5 is machined between the second fixing part 3 and the base 11. This prevents the preload generated by the first fixing part 2 and the second fixing part 3 during assembly from affecting the deformable part 12. The fact that the second fixing part 3 extends in a direction away from the deformable part 12 ensures that the load applied by the flexible hinge 400 to the moving device 200 is less than the load applied by the flexible hinge 400 to the fixing device 100. This arrangement further ensures the assembly accuracy of the moving device 200. Furthermore, the choice of the second fixing part 3 to extend in a direction away from the deformable part 12 also facilitates the machining of the decoupling groove 5.

[0053] In this embodiment, the first fixing part 2 and the second fixing part 3 have the same structure. The structure of the second fixing part 3 will be used as an example for explanation. The second fixing part 3 includes a fixing block 31. A mounting groove 32 is provided at the top of the fixing block 31, and a mounting hole 33 for a screw to pass through is provided at the bottom of the mounting groove 32. It is understood that when tightening the screw, the mounting groove 32 can evenly transmit the preload to the fixing block 31, avoiding localized stress concentration.

[0054] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art will be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A flexible hinge, comprising a hinge body (1), a first fixing part (2) and a second fixing part (3), wherein the first fixing part (2) and the second fixing part (3) are respectively disposed at both ends of the hinge body (1) along a first direction, and the first fixing part (2) is configured to be connected to an external fixing device (100), and the second fixing part (3) is configured to be connected to an external moving device (200), wherein the moving device (200) is capable of relative movement relative to the fixing device (100) along a second direction, so that the hinge body (1) deforms along the second direction; Its features are, The flexible hinge (400) also includes: A connecting part (4) is disposed between the second fixing part (3) and the hinge body (1), and the connecting part (4) is capable of elastic deformation along a third direction to compensate for the assembly deviation of the fixing device (100) and the moving device (200) in the third direction; wherein the first direction, the second direction and the third direction are arranged perpendicular to each other; The second fixing part (3) and the hinge body (1) are respectively provided with decoupling grooves (5) with openings on both sides along the third direction. The length direction of any one of the decoupling grooves (5) is arranged along the second direction and penetrates the second fixing part (3). The area between the two decoupling slots (5) constitutes the connection part (4).

2. The flexible hinge according to claim 1, characterized in that, The hinge body (1), the first fixing part (2), the second fixing part (3) and the connecting part (4) are integrally formed.

3. The flexible hinge according to claim 1, characterized in that, The connecting part (4) is made of a plate-shaped elastic metal material.

4. The flexible hinge according to claim 1, characterized in that, The hinge body (1) includes: Two bases (11) are respectively connected to the first fixing part (2) and the second fixing part (3); The deformation form (12) is arranged in the second direction, and the two ends of the deformation form (12) are respectively fixedly connected to the two bases (11).

5. The flexible hinge according to claim 4, characterized in that, The deformable shape (12) is sheet-like, and the ratio of the height to the thickness of the deformable shape (12) is greater than or equal to 10:

1.

6. The flexible hinge according to claim 4, characterized in that, The deformable form (12) is arranged in multiple parallel intervals along the second direction.

7. The flexible hinge according to claim 4, characterized in that, The first fixing part (2) and / or the second fixing part (3) can extend along the first direction to the deformation area of ​​the deformable part (12), and a gap is provided between the first fixing part (2) and / or the second fixing part (3) and the deformable part (12).

8. The flexible hinge according to claim 1, characterized in that, The first fixing part (2) or the second fixing part includes a fixing block (31), the top of the fixing block (31) is provided with a mounting groove (32), and the bottom of the mounting groove (32) is provided with a mounting hole (33) for a through screw.

9. A semiconductor positioning device, characterized in that, The device includes a fixed device (100), a moving device (200), a linear drive device (300), and at least two flexible hinges (400) as described in any one of claims 1-8. The moving device (200) is used to carry a semiconductor product and is disposed on the fixed device (100) via at least two of the flexible hinges (400). The driving end of the linear drive device (300) is connected to the moving device (200) and is used to drive the moving device (200) to move along the second direction.

Images