Semiconductor drying equipment

Abstract

The invention discloses semiconductor drying equipment, and relates to the technical field of semiconductor production, the semiconductor drying equipment comprises a case, and an inner cavity of the case is divided into an air supply chamber and an electrical chamber by a first partition plate assembly; the air supply chamber is divided into an inner circulation chamber and an outer circulation chamber by a second partition plate assembly, the inner circulation chamber is distributed between the outer circulation chamber and the electrical chamber, and the volume of the inner circulation chamber is larger than that of the outer circulation chamber. Through the arrangement of the inner circulation cavity and the outer circulation cavity, all the cavities are reasonable in layout, it is guaranteed that the inner circulation cavity has a large enough space to achieve sufficient heat exchange, and the overall structure is compact; the clamping assembly is reasonable in structural arrangement, effective contact between the two heat conduction plates and the semiconductor chilling plate can be guaranteed, the heat exchange efficiency is improved, and assembling and maintaining are convenient and fast.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor production, and in particular to semiconductor drying equipment. Background Art

[0002] Traditional heat pump dryers are a common type of drying equipment. They transfer heat through the circulation of a compressor and refrigerant to achieve both heating and dehumidification. These dryers require components such as a compressor, evaporator, and condenser, resulting in complex structures, large size, high energy consumption, and slow response times. Heat pumps, with their moving parts like the compressor, are subject to wear and tear, requiring regular maintenance and high installation and maintenance costs. Furthermore, the compressor generates noise during operation. Due to these characteristics, traditional heat pump dryers are not suitable for certain application environments, such as homes, laboratories, and vehicles. Summary of the Invention

[0003] The present invention provides a semiconductor drying device to solve the problem proposed in the above background technology that heat is transferred through the circulation of a compressor and a refrigerant to achieve heating and dehumidification, which requires components such as a compressor, an evaporator, and a condenser. The device has a complex structure, a large volume, high energy consumption, and a slow response. The heat pump has moving parts such as a compressor, which are subject to wear and tear and require regular maintenance. The installation and maintenance costs are high, and the compressor of the heat pump generates noise when running.

[0004] In order to solve the above technical problems, the technical solution adopted by the present invention is: A semiconductor drying device comprises a chassis, wherein the inner cavity of the chassis is divided into an air supply chamber and an electrical chamber by a first partition assembly; the air supply chamber is divided into an inner circulation chamber and an outer circulation chamber by a second partition assembly, the inner circulation chamber is distributed between the outer circulation chamber and the electrical chamber, and the volume of the inner circulation chamber is greater than the volume of the outer circulation chamber, the inner circulation chamber is connected to an external drying chamber through an air inlet pipe and an air outlet pipe provided on the chassis, and the outer circulation chamber is connected to the outside world through an air inlet window and an air outlet window provided on the chassis; the second partition assembly comprises an assembly plate, and the assembly plate is assembled by a clamping assembly There is a heat exchange mechanism, which includes a first heat conduction plate, a semiconductor refrigeration plate and a second heat conduction plate stacked from top to bottom. An assembly window running through the assembly plate is provided, and the semiconductor refrigeration plate is embedded in the assembly window. The first heat conduction plate contacts the cold end of the semiconductor refrigeration plate, and the second heat conduction plate contacts the hot end of the semiconductor refrigeration plate; a first radiator connected to the first heat conduction plate is installed in the external circulation chamber, and first fans are installed on both sides of the first radiator; a second radiator connected to the second heat conduction plate is installed in the internal circulation chamber, and second fans are installed on both sides of the second radiator.

[0005] A further improvement of the technical solution of the present invention is that the clamping assembly includes a first clamping plate located above the first heat conducting plate, and a second clamping plate located below the second heat conducting plate. The first clamping plate, the second clamping plate and the assembly plate are provided with aligned through holes, and tightening bolts are passed through the through holes.

[0006] A further improvement of the technical solution of the present invention is that the clamping assembly also includes two first limit plates assembled on both sides of the first heat conduction plate, and two second limit plates assembled on both sides of the second heat conduction plate, each of the first limit plates is provided with a first limit groove, and the two first limit grooves are arranged opposite to each other, and each of the second limit plates is provided with a second limit groove, and the two second limit grooves are arranged opposite to each other.

[0007] A further improvement of the technical solution of the present invention is that: the first limiting groove includes a first longitudinal groove wall that abuts against the longitudinal side wall of the first heat conducting plate, and two first transverse groove walls that abut against the transverse side wall of the first heat conducting plate, and a first arc-shaped clearance gap is provided at the connection position between the first transverse groove wall and the first longitudinal groove wall; the second limiting groove includes a second longitudinal groove wall that abuts against the longitudinal side wall of the second heat conducting plate, and two second transverse groove walls that abut against the transverse side wall of the second heat conducting plate, and a second arc-shaped clearance gap is provided at the connection position between the second transverse groove wall and the second longitudinal groove wall.

[0008] A further improvement of the technical solution of the present invention is that: the main body of the chassis is a rectangular box body, the external circulation chamber is a rectangular chamber, and is arranged at the end corner of the chassis cavity; the second partition assembly also includes a second longitudinal partition perpendicular to the assembly plate.

[0009] A further improvement of the technical solution of the present invention is that: the first partition assembly includes a first longitudinal partition and an oblique partition, the first longitudinal partition is parallel to the second longitudinal partition; the oblique partition is connected to the bottom of the first longitudinal partition and is inclined toward the second radiator, and the second radiator is located directly below the first radiator.

[0010] A further improvement of the technical solution of the present invention is that the chassis includes a top wall, side walls and rear wall that intersect vertically, the air inlet duct is opened on the top wall, and the air outlet duct is opened on the side wall. The central axes of the air inlet duct and the air outlet duct are perpendicular to each other, and the intersection of the two central axes falls on the inclined partition.

[0011] A further improvement of the technical solution of the present invention is that: the inclination angle of the oblique partition compared to the top wall and the side wall is 45°; the air outlet duct and the second fan have the same central axis, and one of the second fans is arranged adjacent to the air outlet duct.

[0012] A further improvement of the technical solution of the present invention is that: the air outlet window is opened on the side wall and is located directly above the air outlet pipe, and the air inlet window is opened on the rear wall; the air outlet window and the first fan have the same central axis, and one of the first fans is arranged adjacent to the air outlet window.

[0013] Further improvements to the technical solution of the present invention are that: the inner wall of the external circulation chamber is coated with a hydrophobic coating; the surface of the second radiator is coated with a high-temperature anti-oxidation coating; and a detachable activated carbon filter is installed in the air outlet pipe.

[0014] Due to the adoption of the above technical solution, the present invention has the following technical advancements compared to the prior art: The present invention provides a semiconductor drying equipment. Through the arrangement of an inner circulation chamber and an outer circulation chamber, the layout of each chamber is reasonable, ensuring that the inner circulation chamber has a large enough space to achieve sufficient heat exchange, and the overall structure is compact; the clamping component structure is reasonably arranged, which can ensure that the two heat conducting plates are in effective contact with the semiconductor refrigeration plate, thereby improving the heat exchange efficiency, and convenient assembly and maintenance; the distribution position of the first partition assembly is reasonable, which not only has the function of separating the chambers, but also has the function of guiding air, the first longitudinal partition cooperates with the second longitudinal partition to form an air duct, the oblique partition is inclined, and cooperates with the air inlet and the air outlet to efficiently guide the air in the air duct to the second heat exchanger, thereby improving the heat exchange efficiency; the inner wall of the outer circulation chamber is coated with a hydrophobic coating to avoid corrosion of the device caused by condensed water retention, thereby extending its service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the main structure of the present invention; Figure 2 It is a side structural schematic diagram of the present invention; Figure 3 Schematic diagram of the internal structure of the present invention; Figure 4 It is a schematic diagram of the local structure of the present invention; Figure 5 Schematic diagram of the heat exchange mechanism structure of the present invention; Figure 6 It is a schematic diagram of the radiator structure of the present invention.

[0016] In the figure: 10, drying chamber; 20, chassis; 21, air inlet duct; 22, air outlet duct; 23, air inlet window; 24, air outlet window; 31, first clamping plate; 32, first heat conducting plate; 33, semiconductor refrigeration plate; 34, second heat conducting plate; 35, second clamping plate; 36, first limit plate; 37, second limit plate; 38, tightening bolt; 40, electrical chamber; 50, external circulation chamber; 51, first radiator; 52, first fan; 60, internal circulation chamber; 61, second radiator; 62, second fan; 71, first longitudinal partition; 72, oblique partition; 81, second longitudinal partition; 82, assembly plate. DETAILED DESCRIPTION

[0017] The present invention is described in further detail below in conjunction with the embodiments: Example

[0018] like Figure 1-6 As shown, the present invention provides a semiconductor drying equipment, including a chassis 20, the inner cavity of the chassis 20 is separated into an air supply chamber and an electrical chamber 40 by a first partition assembly; the air supply chamber is separated into an inner circulation chamber 60 and an outer circulation chamber 50 by a second partition assembly, the inner circulation chamber 60 is distributed between the outer circulation chamber 50 and the electrical chamber 40, and the volume of the inner circulation chamber 60 is greater than the volume of the outer circulation chamber 50, the inner circulation chamber 60 is connected to the external drying chamber 10 through an air inlet pipe 21 and an air outlet pipe 22 provided on the chassis 20, and the outer circulation chamber 50 is connected to the outside through an air inlet window 23 and an air outlet window 24 provided on the chassis 20; the second partition assembly includes an assembly plate 82, The clamping assembly is equipped with a heat exchange mechanism, which includes a first heat conducting plate 32, a semiconductor refrigeration plate 33 and a second heat conducting plate 34 stacked from top to bottom. An assembly window is provided on the assembly plate 82, which runs through the assembly plate 82 from top to bottom. The semiconductor refrigeration plate 33 is embedded in the assembly window. The first heat conducting plate 32 contacts the cold end of the semiconductor refrigeration plate 33, and the second heat conducting plate 34 contacts the hot end of the semiconductor refrigeration plate 33; a first radiator 51 connected to the first heat conducting plate 32 is installed in the external circulation chamber 50, and first fans 52 are installed on both sides of the first radiator 51; a second radiator 61 connected to the second heat conducting plate 34 is installed in the internal circulation chamber 60, and second fans 62 are installed on both sides of the second radiator 61.

[0019] In this embodiment, the interior of the chassis 20 is divided into an air supply chamber and an electrical chamber 40 by a first baffle assembly. The electrical chamber is independently provided, effectively isolating the air supply chamber from the humid and hot environment and protecting the stability of the internal electronic control components. The air supply chamber is further divided into an inner circulation chamber 60 and an outer circulation chamber 50 by a second baffle assembly. The inner circulation chamber 60 is located in the middle position, utilizing the larger volume of the inner circulation chamber 60 to ensure dry air volume while also allowing heat to be discharged externally through the outer circulation chamber. The assembly window provided in the assembly plate 82 precisely embeds the semiconductor cooling plate 33. Its cold end is connected to the first heat sink 51 of the outer circulation chamber 50 via the first heat conducting plate 32, and its hot end is connected to the second heat sink 61 of the inner circulation chamber 60 via the second heat conducting plate 34. Both the first radiator 51 and the second radiator 61 adopt an aluminum fin structure to increase the heat dissipation area: the first fan 52 of the external circulation chamber 50 pushes the outside air to flow through the first radiator 51, absorbs the low temperature of the cold end of the semiconductor refrigeration plate 33 and discharges it; the second fan 62 of the internal circulation chamber 60 pushes the drying air flow to flow through the second radiator 61, absorbs the high temperature of the hot end and then sends it into the drying chamber 10, the internal circulation chamber 60 inhales the low-temperature air discharged from the drying chamber 10 through the top wall air inlet pipe 21, and after being heated by the second radiator 61, it is sent back to the drying chamber 10 through the side wall air outlet pipe 22; the external circulation chamber 50 inhales the outside normal temperature air through the rear wall air inlet window 23, and after being cooled by the first radiator 51, it is discharged through the side wall air outlet window 24, forming a "internal heating-external heat dissipation" two-way heat exchange system. Example

[0020] like Figure 1-6As shown in the figure, on the basis of Embodiment 1, the present invention provides a technical solution: Preferably, the clamping assembly includes a first clamping plate 31 located above the first heat conducting plate 32 and a second clamping plate 35 located below the second heat conducting plate 34. Through holes for alignment are provided on the first clamping plate 31, the second clamping plate 35 and the assembly plate 82. Compression bolts 38 are inserted into the through holes. The clamping assembly further includes two first limiting plates 36 assembled on both sides of the first heat conducting plate 32 and two second limiting plates 37 assembled on both sides of the second heat conducting plate 34. First limiting grooves are provided on the first limiting plates 36, and the two first limiting grooves are arranged oppositely. Second limiting grooves are provided on the second limiting plates 37, and the two second limiting grooves are arranged oppositely. The first limiting groove includes a first longitudinal groove wall abutting against the longitudinal side wall of the first heat conducting plate 32 and two first transverse groove walls abutting against the transverse side walls of the first heat conducting plate 32. A first arc-shaped relief notch is provided at the connection position between the first transverse groove wall and the first longitudinal groove wall. The second limiting groove includes a second longitudinal groove wall abutting against the longitudinal side wall of the second heat conducting plate 34 and two second transverse groove walls abutting against the transverse side walls of the second heat conducting plate 34. A second arc-shaped relief notch is provided at the connection position between the second transverse groove wall and the second longitudinal groove wall. The main body of the chassis 20 is a cuboid box, and the external circulation chamber 50 is a cuboid chamber and is arranged at the corner of the inner cavity of the chassis 20. The second partition assembly further includes a second longitudinal partition 81 perpendicular to the assembly plate 82.

[0021] In this embodiment, the first clamping plate 31 and the second clamping plate 35 form a symmetric clamping force from top to bottom by the compression bolts 38 passing through the through holes of the assembly plate 82, ensuring that the cold end of the first heat conducting plate 32 is closely adhered to the cold end of the semiconductor refrigeration chip 33 and the hot end of the second heat conducting plate 34 is closely adhered to the hot end, and the contact thermal resistance is reduced by 40%. The bolts are made of copper material, with both electrical conductivity and corrosion resistance. The first limiting plates 36 and the second limiting plates 37 are respectively fixed on both sides of the assembly plate 82 by screws. The first limiting grooves and the second limiting grooves on their inner sides are in a "U" shape. The longitudinal groove walls are in contact with the long side walls of the heat conducting plates, and the transverse groove walls are in contact with the short side walls, forming three-dimensional positioning. The external circulation chamber 50 is arranged at the corner of the chassis 20, using the corner space of the chassis 20 to reduce internal structure interference. The second longitudinal partition 81 perpendicular to the assembly plate 82 completely isolates the external circulation chamber 50 from the internal circulation chamber 60, preventing air flow crosstalk and ensuring the heat dissipation efficiency of the external circulation. Embodiment

[0022] As Figure 1-6As shown, based on Example 1, the present invention provides a technical solution: preferably, the first partition assembly includes a first longitudinal partition 71 and an oblique partition 72, the first longitudinal partition 71 is parallel to the second longitudinal partition 81; the oblique partition 72 is connected to the bottom of the first longitudinal partition 71 and is inclined toward the second radiator 61, and the second radiator 61 is located directly below the first radiator 51, the chassis 20 includes a top wall, side walls and a rear wall that intersect vertically, the air inlet duct 21 is opened on the top wall, the air outlet duct 22 is opened on the side wall, the central axes of the air inlet duct 21 and the air outlet duct 22 are perpendicular to each other, and the intersection of the two central axes falls on the oblique partition. On the plate 72, the inclination angle of the oblique partition 72 compared with the top wall and the side wall is 45°; the air outlet duct 22 and the second fan 62 have the same central axis, and one of the second fans 62 is arranged adjacent to the air outlet duct 22, the air outlet window 24 is opened on the side wall and is located directly above the air outlet duct 22, and the air inlet window 23 is opened on the rear wall; the air outlet window 24 and the first fan 52 have the same central axis, and one of the first fans 52 is arranged adjacent to the air outlet window 24, and the inner wall of the external circulation chamber 50 is coated with a hydrophobic coating; the surface of the second radiator 61 is coated with a high-temperature anti-oxidation coating; a removable activated carbon filter is assembled in the air outlet duct 22.

[0023] In this embodiment, the first longitudinal partition 71 and the second longitudinal partition 81 are arranged in parallel to form an internal circulation chamber 60 in the middle; the lower oblique partition 72 connects the first longitudinal partition 71 and the bottom wall of the chassis 20 at a 45° angle, tilted toward the second radiator 61, and guides the internal circulation airflow to flow evenly along the inclined surface to the second fan 62. The second radiator 61 is located directly below the first radiator 51, and uses the principle of rising hot air to form a symmetrical heat exchange layout. The central axis of the air inlet pipe 21 and the air outlet pipe 22 intersect perpendicularly at the midpoint of the oblique partition 72, and the air outlet pipe 22 is coaxial with the second fan 62 and is arranged close to the fan outlet to reduce airflow turning losses; the air outlet window 24 is located directly above the air outlet pipe 22 and coaxial with the first fan 52, forming an external circulation air duct of "air inlet window 23-first radiator 51-air outlet window 24", with lower wind resistance and hydrophobic coating: The inner wall of the external circulation chamber 50 is coated with a polytetrafluoroethylene hydrophobic layer (thickness 50μm), and the surface contact angle is ≥110°, which can effectively prevent condensation of external humid air and avoid rust and mold growth in the chamber. The surface of the second radiator 61 is sprayed with an alumina ceramic coating, which can withstand high temperature environment and has a longer anti-oxidation life: a honeycomb activated carbon filter element can be removably installed in the air outlet duct 22. It uses coconut shell activated carbon material with a higher iodine adsorption value, which can filter out impurities such as dust and oil mist in the air to ensure that the air cleanliness sent into the drying chamber 10 meets the standard.

[0024] The following is a detailed description of the working principle of the semiconductor drying equipment.

[0025] like Figure 1-6As shown, during use, the interior of the semiconductor drying equipment's chassis 20 is separated by a first partition assembly into an air supply chamber and an electrical chamber 40. The air supply chamber is further divided by a second partition assembly into an internal circulation chamber 60 and an external circulation chamber 50. The internal circulation chamber 60 has a larger volume than the external circulation chamber 50 and communicates with the external drying chamber 10, while the external circulation chamber 50 communicates with the outside world. Heat is exchanged between the internal circulation chamber 60 and the external circulation chamber 50 via a heat exchange mechanism, providing the external drying chamber 10 with the necessary heat for drying. Within the internal circulation chamber 60, a second heat sink 61 is connected to the second heat conducting plate 34, which contacts the hot end of the semiconductor cooling fin 33. When the semiconductor cooling fin 33 is operating, heat generated at the hot end is transferred to the second heat conducting plate 34, and then conducted through the second heat conducting plate 34 to the second heat sink 61. A second fan 62 is mounted on either side of the second heat sink 61. When the second fan 62 operates, it pushes air within the internal circulation chamber 60 through the second heat sink 61. The air exchanges heat with the second radiator 61, absorbing heat and increasing its temperature to form high-temperature air. The high-temperature air is then transported through the air outlet duct 22 to the external drying chamber 10, where it dries the semiconductors. During the drying process, the high-temperature air releases heat, cooling to low-temperature air. This air then returns to the internal circulation chamber 60 through the air inlet duct 21, completing an internal cycle. Within the external circulation chamber 50, the first radiator 51 is connected to the first heat conducting plate 32, which contacts the cold end of the semiconductor cooling fins 33. Outside air enters the external circulation chamber 50 through the air inlet window 23. The first fan 52 is located on either side of the first radiator 51, and its operation forces air to flow through the first radiator 51. At this point, the low temperature at the cold end of the semiconductor cooling fins 33 is transferred to the first radiator 51 through the first heat conducting plate 32. The outside air exchanges heat with the first radiator 51, releasing its own heat and cooling down. The first radiator 51 absorbs the heat and then transfers it to the cold end of the semiconductor cooling fins 33. The cooled air carries less heat and is discharged to the outside through the air outlet window 24, completing the external circulation. The semiconductor refrigeration plate 33 serves as the core heat exchange component, and realizes the transfer of heat from the cold end to the hot end through the electrical effect. The cold end absorbs the heat of the air in the external circulation chamber 50, cooling the external circulation air and discharging it; the hot end transfers the heat to the second radiator 61 in the internal circulation chamber 60, heating the internal circulation air and providing a drying heat source for the external drying chamber 10. This heat transfer and distribution realizes the energy exchange between the internal circulation chamber 60 and the external circulation chamber 50, ensuring the efficient operation of the equipment. At the same time, the structural design of the chassis 20 plays an important auxiliary role in air flow and heat exchange. The first longitudinal partition 71 and the oblique partition 72 in the first partition assembly separate the air supply chamber from the electrical chamber 40. The oblique partition 72 is inclined toward the second radiator 61, and the second radiator 61 is located directly below the first radiator 51. This layout is conducive to the rational flow of air and the effective transfer of heat.The air inlet duct 21 is opened on the top wall, and the air outlet duct 22 is opened on the side wall. The central axes of the two are perpendicular to each other and the intersection falls on the oblique partition 72. The oblique partition 72 has an inclination angle of 45 degrees. The air outlet duct 22 and the second fan 62 have the same central axis. These designs make the internal circulation air flow smoothly and improve the heat exchange efficiency. The air inlet window 23 of the external circulation chamber 50 is opened on the rear wall, and the air outlet window 24 is opened on the side wall and is located directly above the air outlet duct 22. It has the same central axis as the first fan 52, ensuring the smooth inflow and outflow of the external circulation air and enhancing the heat dissipation effect. The inner wall of the external circulation chamber 50 is coated with a hydrophobic coating to prevent condensation of water vapor in the air and protect the internal structure of the chamber; the surface of the second radiator 61 is coated with a high-temperature anti-oxidation coating to increase its service life in high-temperature environments; the detachable activated carbon filter element installed in the air outlet duct 22 can filter impurities in the air, ensuring the cleanliness of the air entering the external drying chamber 10 and preventing contamination of semiconductors.

[0026] While the present invention has been generally described above, modifications and improvements are readily apparent to those skilled in the art. Therefore, modifications and improvements that do not depart from the spirit of the present invention are intended to be within the scope of the present invention.

Claims

1. A semiconductor drying equipment, characterized in that: The invention comprises a case (20), wherein the inner cavity of the case (20) is divided into an air supply chamber and an electrical chamber (40) by a first partition assembly; the air supply chamber is divided into an inner circulation chamber (60) and an outer circulation chamber (50) by a second partition assembly, wherein the inner circulation chamber (60) is distributed between the outer circulation chamber (50) and the electrical chamber (40), and the volume of the inner circulation chamber (60) is larger than the volume of the outer circulation chamber (50), the inner circulation chamber (60) is connected to the external drying chamber (10) through an air inlet pipe (21) and an air outlet pipe (22) provided on the case (20), and the outer circulation chamber (50) is connected to the outside through an air inlet window (23) and an air outlet window (24) provided on the case (20); the second partition assembly comprises an assembly plate (82), and the assembly plate (82) is equipped with a A heat exchange mechanism, comprising a first heat conducting plate (32), a semiconductor refrigeration plate (33) and a second heat conducting plate (34) stacked from top to bottom, an assembly window penetrating from top to bottom is provided on the assembly plate (82), the semiconductor refrigeration plate (33) is embedded in the assembly window, the first heat conducting plate (32) contacts the cold end of the semiconductor refrigeration plate (33), and the second heat conducting plate (34) contacts the hot end of the semiconductor refrigeration plate (33); a first radiator (51) connected to the first heat conducting plate (32) is assembled in the outer circulation chamber (50), and first fans (52) are assembled on both sides of the first radiator (51); a second radiator (61) connected to the second heat conducting plate (34) is assembled in the inner circulation chamber (60), and second fans (62) are assembled on both sides of the second radiator (61).

2. The semiconductor drying equipment according to claim 1, characterized in that: The clamping assembly includes a first clamping plate (31) located above the first heat conducting plate (32), and a second clamping plate (35) located below the second heat conducting plate (34). The first clamping plate (31), the second clamping plate (35) and the assembly plate (82) are provided with aligned through holes, and the through holes are provided with tightening bolts (38).

3. The semiconductor drying equipment according to claim 1, characterized in that: The clamping assembly further includes two first limiting plates (36) mounted on both sides of the first heat conducting plate (32), and two second limiting plates (37) mounted on both sides of the second heat conducting plate (34), wherein the first limiting plates (36) are each provided with a first limiting groove, and the two first limiting grooves are arranged opposite to each other, and the second limiting plates (37) are each provided with a second limiting groove, and the two second limiting grooves are arranged opposite to each other.

4. The semiconductor drying equipment according to claim 3, characterized in that: The first limiting groove includes a first longitudinal groove wall abutting against the longitudinal side wall of the first heat conducting plate (32), and two first transverse groove walls abutting against the transverse side walls of the first heat conducting plate (32), and a first arc-shaped clearance notch is provided at the connection position between the first transverse groove wall and the first longitudinal groove wall; the second limiting groove includes a second longitudinal groove wall abutting against the longitudinal side wall of the second heat conducting plate (34), and two second transverse groove walls abutting against the transverse side walls of the second heat conducting plate (34), and a second arc-shaped clearance notch is provided at the connection position between the second transverse groove wall and the second longitudinal groove wall.

5. The semiconductor drying equipment according to claim 1, characterized in that: The main body of the chassis (20) is a rectangular parallelepiped box body, and the external circulation chamber (50) is a rectangular parallelepiped chamber and is arranged at an end corner of the inner cavity of the chassis (20); the second partition assembly further includes a second longitudinal partition (81) perpendicular to the assembly plate (82).

6. The semiconductor drying equipment according to claim 1, characterized in that: The first partition assembly includes a first longitudinal partition (71) and an oblique partition (72), wherein the first longitudinal partition (71) is parallel to the second longitudinal partition (81); the oblique partition (72) is connected below the first longitudinal partition (71) and is inclined toward the second radiator (61), and the second radiator (61) is located directly below the first radiator (51).

7. The semiconductor drying equipment according to claim 1, characterized in that: The chassis (20) comprises a top wall, side walls and a rear wall that intersect vertically. The air inlet duct (21) is provided on the top wall, and the air outlet duct (22) is provided on the side wall. The central axes of the air inlet duct (21) and the air outlet duct (22) are perpendicular to each other, and the intersection of the two central axes falls on the oblique partition (72).

8. The semiconductor drying equipment according to claim 6, characterized in that: The inclined partition (72) has an inclination angle of 45° compared to the top wall and the side wall; the air outlet pipe (22) and the second fan (62) have the same central axis, and one of the second fans (62) is arranged adjacent to the air outlet pipe (22).

9. The semiconductor drying equipment according to claim 1, characterized in that: The air outlet window (24) is provided on the side wall and is located directly above the air outlet pipe (22), and the air inlet window (23) is provided on the rear wall; the air outlet window (24) and the first fan (52) have the same central axis, and one of the first fans (52) is provided adjacent to the air outlet window (24).

10. The semiconductor drying equipment according to claim 1, characterized in that: The inner wall of the external circulation chamber (50) is coated with a hydrophobic coating; the surface of the second radiator (61) is coated with a high-temperature anti-oxidation coating; and a detachable activated carbon filter element is installed in the air outlet pipe (22).

Images