High-power-consumption chip heat dissipation test seat

Abstract

The invention discloses a high-power-consumption chip heat dissipation test seat which comprises a manual test cover body, a pressure head and a test seat body, a test seat bottom plate is installed in the test seat body, a test probe is arranged on the upper end face of the test seat bottom plate, a chip limiting frame is arranged above the test seat bottom plate, and a chip to be detected is located in the chip limiting frame. The pressing head corresponds to the chip limiting frame up and down, the pressing head is installed in the middle of the manual detection cover body, an upper refrigeration flow channel body is arranged in the pressing head, penetrates through the pressing head and is limited on the pressing head, and an upper cover plate is installed at the top of the upper refrigeration flow channel body; the upper cover plate is provided with a refrigeration pressure head water inlet pipe and a refrigeration pressure head water outlet pipe which are communicated with the flow channel of the upper refrigeration flow channel body; a lower refrigeration flow channel is arranged in the test seat main body, and a test seat water inlet pipe and a test seat water outlet pipe which are respectively communicated with the lower refrigeration flow channel are arranged on the test seat main body. The upper surface and the lower surface of the to-be-detected chip can dissipate heat, and the heat dissipation effect in the high-power-consumption chip testing process is guaranteed.

Description

Technical Field

[0001] The present invention relates to the field of chip testing, and in particular to a heat dissipation test socket for a high-power chip. Background Art

[0002] With the popularization of advanced processes (such as 5nm and 3nm), chip integration has been greatly improved, and computing power requirements have increased sharply (such as AI training and graphics rendering), but power consumption has also skyrocketed. For example, the peak power consumption of high-end GPUs (such as NVIDIA H100) can reach 700W, and traditional air cooling can no longer meet the heat dissipation requirements. The application of technologies such as 3D stacking and chiplets has led to localized heat density (such as the power density of hot spots exceeding 1000W / cm 2 ), which puts higher requirements on heat dissipation efficiency.

[0003] Bottleneck of air cooling solution: The upper limit of air cooling efficiency is about 0.2W / cm 2 When dealing with chips with power consumption exceeding 200W, heat sinks are bulky and noisy, making them difficult to deploy in compact test environments.

[0004] Thermal throttling: If the temperature exceeds the chip junction temperature (Tjmax, usually 125°C to 150°C) during testing, the chip will trigger thermal throttling protection, causing test data distortion (such as frequency fluctuation of ±15%) and affecting yield judgment.

[0005] Extended test cycle: Traditional solutions require frequent test interruptions to cool the chip, resulting in reduced production test efficiency (for example, test time increases by more than 30%).

[0006] Advantages of water cooling: High heat dissipation efficiency: The heat dissipation capacity of the water cooling system can reach 1-10W / cm 2 ·K, can remove hundreds of watts of heat in 1 second and maintain the chip surface temperature within ±1℃.

[0007] However, conventional water-cooled test sockets only dissipate heat by taking away the heat from the upper surface of the chip. For chips with higher power consumption, the heat dissipation capacity of the upper surface alone is not enough. Therefore, in order to solve the problem, I conceived a new type of heat dissipation structure to improve the test capability of the test socket. Summary of the Invention

[0008] To overcome the above shortcomings, the present invention aims to provide a high-power chip heat dissipation test socket that can dissipate heat from both the upper and lower surfaces of the chip to be tested, thereby improving the heat dissipation effect during chip testing.

[0009] In order to achieve the above objectives, one of the technical solutions adopted by the present invention is: a large-power chip heat dissipation test seat, including a hand-testing cover main body, a pressure head, and a test seat main body, a test seat base plate is installed in the test seat main body, a test probe is provided on the upper end surface of the test seat base plate, a chip limiting frame is provided above the test seat base plate, and the chip to be tested is located in the chip limiting frame, the pressure head and the chip limiting frame correspond to each other up and down, the pressure head is installed in the middle of the hand-testing cover main body, an upper cooling flow channel body is provided in the pressure head, the upper cooling flow channel body passes through the pressure head and is limited on the pressure head, an upper cover plate is installed on the top of the upper cooling flow channel body, a cooling pressure head water inlet pipe and a cooling pressure head water outlet pipe connected to the flow channel of the upper cooling flow channel body are provided on the upper cover plate; a lower cooling flow channel is provided in the test seat main body, and a test seat water inlet pipe and a test seat water outlet pipe respectively connected to the lower cooling flow channel are provided on the test seat main body.

[0010] The beneficial effects of the present invention are as follows: circulating cold water is pumped into and drawn out of the upper refrigeration flow channel body through the refrigeration pressure head water inlet pipe and the refrigeration pressure head water outlet pipe, thereby realizing heat dissipation of the upper surface of the chip to be tested; similarly, circulating cold water in the test seat water inlet pipe and the test seat water outlet pipe is pumped into and drawn out of the test seat main body, thereby realizing heat dissipation of the lower surface of the chip to be tested; and by synchronously coordinating the temperature settings of the external refrigeration compressor, cooling operations on the upper and lower surfaces of the chip are realized.

[0011] Preferably, the main body of the manual test cover has a circular mounting hole, in which a threaded ring is installed through the cooperation of an internal thread and an external thread, the bottom of the threaded ring abuts a plane needle bearing, the bottom of the plane needle bearing abuts a pressure head adapter plate, the pressure head adapter plate is installed on the lower end surface of the main body of the manual test cover through a guide structure, the pressure head adapter plate can move relative to the main body of the manual test cover, the pressure head is locked and fixed to the lower end surface of the pressure head adapter plate, the middle part of the pressure head is provided with a through hole for the upper cooling flow body to pass through, and a limiting structure for limiting the descent of the upper cooling flow body is provided between the through hole and the upper cooling flow body. The present application can realize the lifting and lowering of the upper cooling flow body through the cooperation of the threaded ring and the plane needle bearing, and can be compatible with the testing requirements of chips of different thicknesses by moving away from or close to the bottom plate of the test seat.

[0012] Preferably, the limiting structure includes a limiting groove provided on the upper surface of the through hole and a circle of limiting protrusions provided on the outer side wall of the upper cooling channel body. The limiting protrusions correspond to the limiting grooves in a vertical manner and can be snapped into the limiting grooves. A gap is left between the limiting protrusions and the pressure head adapter plate, and multiple springs are provided. The pressure head is limited to the upper cooling channel body by the limiting groove, and the pressure head adapter plate is elastically connected to the limiting protrusions by the provision of springs.

[0013] Preferably, a rotating cap is provided above the main body of the hand-test cover, the rotating cap is annular, and is locked and fixed to the top of the threaded ring. The rotating cap drives the threaded ring to rotate, thereby adjusting the height of the upper refrigeration flow channel body, which is convenient for adjustment.

[0014] Preferably, the refrigeration pressure head water inlet pipe and the refrigeration pressure head water outlet pipe are both connected and fixed to the upper cover plate through a quick threaded joint, a quick-release pagoda head and a hose clamp, so as to achieve quick installation.

[0015] Preferably, a heightened support frame is provided between the hand test cover body and the test seat body, and the heightened support frame surrounds the pressure head.

[0016] Preferably, the upper refrigeration flow channel of the upper refrigeration flow channel body is in a maze shape.

[0017] Preferably, the lower cooling channel is arranged around the test seat body.

[0018] Preferably, a rubber sealing ring is provided between the upper cooling channel body and the upper cover plate to ensure sealing.

[0019] Preferably, an indium sheet is provided between the upper cooling channel body and the test probe. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a perspective view of this embodiment;

[0021] Figure 2 This is a three-dimensional diagram of the embodiment after the upper cover and the rotary cover are disassembled;

[0022] Figure 3 This is a three-dimensional diagram of the embodiment after the upper cover plate, rotary cover, and manual cover body are disassembled;

[0023] Figure 4 This is a three-dimensional diagram of the embodiment after the upper cover plate, rotary cover, manual cover body and thread ring are disassembled;

[0024] Figure 5 This is a three-dimensional diagram of the cooperation between the test socket body and the chip to be tested in this embodiment;

[0025] Figure 6 This is a cross-sectional view of the test socket body and the chip to be tested in this embodiment;

[0026] Figure 7 This is an exploded view of the first perspective of this embodiment;

[0027] Figure 8 This is an exploded view from the second perspective of this embodiment.

[0028] 1. Hand test cover body; 2. Pressure head; 2a. Through hole; 2b. Limiting groove; 3. Test seat body; 4. Test seat bottom plate; 5. Test probe; 6. Chip limiting frame; 7. Pressure head adapter plate; 8. Upper cooling channel body; 8a. Limiting protrusion; 8b. Upper cooling channel; 9. Upper cover plate; 10. Cooling pressure head water inlet pipe; 11. Cooling pressure head water outlet pipe; 12. Lower cooling channel; 13. Test seat water inlet pipe; 14. Test seat water outlet pipe; 15. Circular mounting hole; 16. Threaded ring; 17. Plane needle bearing; 18. Spring; 19. Screw cap; 20. Quick threaded connector; 21. Quick-release pagoda head; 22. Hose clamp; 23. Heightened support frame; 24. Rubber sealing ring; 25. Indium sheet; 26. Chip to be tested. DETAILED DESCRIPTION

[0029] The preferred embodiments of the present invention are described in detail below with reference to the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more precise definition of the protection scope of the present invention.

[0030] See Figures 1 to 8 As shown, this embodiment discloses a high-power chip heat dissipation test socket, including a hand-test cover body 1, a pressure head 2, and a test socket body 3. A test socket base plate 4 is installed in the test socket body 3, and a test probe 5 is provided on the upper end surface of the test socket base plate 4. A chip limiting frame 6 is provided above the test socket base plate 4. The chip 26 to be tested is located in the chip limiting frame 6. The pressure head 2 corresponds to the chip limiting frame 6 in upper and lower directions. The pressure head 2 is installed in the middle of the hand-test cover body 1. An upper cooling flow channel body 8 is provided in the pressure head 2. The upper cooling flow channel body 8 passes through the pressure head 2 and It is limited on the pressure head 2, the upper cooling flow channel 8b of the upper cooling flow channel body 8 is maze-shaped, an upper cover plate 9 is installed on the top of the upper cooling flow channel body 8, a rubber sealing ring 24 is provided between the upper cooling flow channel body 8 and the upper cover plate 9, and a cooling pressure head water inlet pipe 10 and a cooling pressure head water outlet pipe 11 connected to the flow channel of the upper cooling flow channel body 8 are provided on the upper cover plate 9; a lower cooling flow channel 12 is provided in the test seat body 3, and a test seat water inlet pipe 13 and a test seat water outlet pipe 14 respectively connected to the lower cooling flow channel 12 are provided on the test seat body 3, as shown Figure 5 、 Figure 6 As shown, the lower cooling channel 12 is arranged around the test seat body 3 .

[0031] Among them, such as Figure 8As shown, the manual measurement cover body 1 has a circular mounting hole 15, and a thread ring 16 is installed in the circular mounting hole 15 through the cooperation of the internal thread and the external thread. The bottom of the thread ring 16 abuts against a plane needle bearing 17, and the bottom of the plane needle bearing 17 abuts against the pressure head adapter plate 7. The pressure head adapter plate 7 is installed on the lower end surface of the manual measurement cover body 1 through a guide structure. The guide structure can be realized by the cooperation of the guide column and the guide hole. The pressure head adapter plate 7 can move relative to the manual measurement cover body 1. The pressure head 2 is locked and fixed on the lower end surface of the pressure head adapter plate 7. A through hole 2a for the upper refrigeration flow channel body 8 to pass through is provided in the middle of the pressure head 2, and a limiting structure for limiting the descent of the upper refrigeration flow channel body 8 is provided between the through hole 2a and the upper refrigeration flow channel body 8.

[0032] like Figure 8 As shown, the limiting structure includes a limiting groove 2b arranged on the upper surface of the through hole 2a and a circle of limiting protrusions 8a arranged on the outer wall of the upper cooling channel body 8. The limiting protrusions 8a correspond to the limiting grooves 2b up and down, and the limiting protrusions 8a can be inserted into the limiting grooves 2b. There is a gap between the limiting protrusions 8a and the pressure head adapter plate 7 and multiple springs 18 are provided.

[0033] In this embodiment, a rotary cover 19 is provided above the hand-test cover body 1 . The rotary cover 19 is annular and is locked and fixed to the top of the threaded ring 16 .

[0034] like Figure 1 As shown, the refrigeration pressure head water inlet pipe 10 and the refrigeration pressure head water outlet pipe 11 are both connected and fixed to the upper cover plate 9 through a quick threaded joint 20, a quick-release pagoda head 21 and a throat clamp 22.

[0035] like Figure 1 、 Figure 7 、 Figure 8 As shown, a heightened support frame 23 is provided between the hand test cover body 1 and the test seat body 3 , and the heightened support frame 23 surrounds the pressure head 2 .

[0036] like Figure 7 、 Figure 8 As shown, an indium sheet 25 is provided between the upper cooling channel body 8 and the test probe 5 .

[0037] In this embodiment, circulating cold water is pumped into and out of the upper refrigeration flow channel body 8 through the refrigeration head water inlet pipe 10 and the refrigeration head water outlet pipe 11, thereby achieving heat dissipation on the upper surface of the chip to be tested 26; the circulating cold water in the test seat water inlet pipe 13 and the test seat water outlet pipe 14 will be pumped into the test seat main body 3, thereby achieving heat dissipation on the lower surface of the chip to be tested 26, and by synchronously coordinating the temperature settings of the external refrigeration compressor, cooling operations on the upper and lower surfaces of the chip are achieved.

[0038] In addition, this embodiment can adjust the distance between the pressure head 2, the upper cooling flow channel body 8 and the chip to be tested 26 by adjusting the rotary cover 19, so that it can be compatible with the testing requirements of chips of different thicknesses. The specific adjustment principle is as follows: during the adjustment process, the manual test cover body 1, the elevated support frame 23 and the test seat body 3 are fixed, and the corresponding components in the test seat body 3 are also fixed. During adjustment, the rotary cover 19 is rotated, and the rotary cover 19 moves downward during rotation, forcing the upper cover plate of the plane needle roller bearing 25 to rotate and move downward accordingly. The lower cover plate of the needle roller bearing 25 abuts the pressure head adapter plate 7 and moves downward along the bottom guide structure of the manual test cover body 1. The pressure head adapter plate 7 drives the bottom pressure head 2 to move downward, and the upper cooling flow channel body 8 limited on the pressure head 2 also moves downward, thereby adjusting the distance between the pressure head 2 and the upper cooling flow channel body 8 to the test seat bottom plate 4, so that it can be compatible with the testing requirements of chips of different thicknesses.

[0039] The above embodiments are only for illustrating the technical concept and features of the present invention. Its purpose is to enable people familiar with this technology to understand the content of the present invention and implement it. It cannot be used to limit the scope of protection of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the scope of protection of the present invention.

Claims

1. A high-power chip heat dissipation test seat, comprising a hand test cover body (1), a pressure head (2), and a test seat body (3), wherein a test seat base plate (4) is installed in the test seat body (3), a test probe (5) is provided on the upper end surface of the test seat base plate (4), a chip limiting frame (6) is provided above the test seat base plate (4), a chip to be tested (26) is located in the chip limiting frame (6), and the pressure head (2) corresponds to the chip limiting frame (6) in upper and lower directions, characterized in that: The pressure head (2) is installed in the middle of the hand-test cover body (1); an upper refrigeration flow channel body (8) is provided in the pressure head (2); the upper refrigeration flow channel body (8) passes through the pressure head (2) and is limited on the pressure head (2); an upper cover plate (9) is installed on the top of the upper refrigeration flow channel body (8); a refrigeration pressure head water inlet pipe (10) and a refrigeration pressure head water outlet pipe (11) which are connected to the flow channel of the upper refrigeration flow channel body (8) are provided on the upper cover plate (9); A lower cooling channel (12) is provided in the test seat body (3), and a test seat water inlet pipe (13) and a test seat water outlet pipe (14) respectively connected to the lower cooling channel (12) are provided on the test seat body (3).

2. The high power consumption chip heat dissipation test socket according to claim 1, characterized in that: The hand-measurement cover body (1) has a circular mounting hole (15), a thread ring (16) is mounted in the circular mounting hole (15) through the cooperation of an internal thread and an external thread, the bottom of the thread ring (16) abuts against a plane needle bearing (17), the bottom of the plane needle bearing (17) abuts against a pressure head adapter plate (7), the pressure head adapter plate (7) is mounted on the lower end surface of the hand-measurement cover body (1) through a guide structure, the pressure head adapter plate (7) can move relative to the hand-measurement cover body (1), the pressure head (2) is locked and fixed on the lower end surface of the pressure head adapter plate (7), a through hole (2a) for the upper refrigeration flow channel body (8) to pass through is provided in the middle of the pressure head (2), and a limiting structure for limiting the descent of the upper refrigeration flow channel body (8) is provided between the through hole (2a) and the upper refrigeration flow channel body (8).

3. The high power consumption chip heat dissipation test socket according to claim 2, characterized in that: The limiting structure includes a limiting groove (2b) arranged on the upper surface of the through hole (2a) and a circle of limiting protrusions (8a) arranged on the outer wall of the upper cooling channel body (8). The limiting protrusions (8a) correspond to the limiting groove (2b) in upper and lower positions. The limiting protrusions (8a) can be inserted into the limiting groove (2b). A gap is left between the limiting protrusions (8a) and the pressure head adapter plate (7), and a plurality of springs (18) are provided.

4. The high power consumption chip heat dissipation test socket according to claim 2, characterized in that: A rotary cover (19) is provided above the hand-test cover body (1). The rotary cover (19) is annular and is locked and fixed to the top of the threaded ring (16).

5. The high power consumption chip heat dissipation test socket according to claim 2, characterized in that: The refrigeration pressure head water inlet pipe (10) and the refrigeration pressure head water outlet pipe (11) are both connected and fixed to the upper cover plate (9) via a quick threaded joint (20), a quick-release pagoda head (21) and a throat clamp (22).

6. The high power consumption chip heat dissipation test socket according to claim 1, characterized in that: A heightened support frame (23) is provided between the hand-test cover body (1) and the test seat body (3), and the heightened support frame (23) surrounds the pressure head (2).

7. The high power consumption chip heat dissipation test socket according to claim 1, characterized in that: The upper refrigeration flow channel (8b) of the upper refrigeration flow channel body (8) is labyrinthine.

8. The high power consumption chip heat dissipation test socket according to claim 1, characterized in that: The lower cooling channel (12) is arranged around the test seat body (3).

9. The high power consumption chip heat dissipation test socket according to claim 1, characterized in that: A rubber sealing ring (24) is provided between the upper refrigeration flow channel body (8) and the upper cover plate (9).

10. The high power consumption chip heat dissipation test socket according to claim 1, characterized in that: An indium sheet (25) is provided between the upper refrigeration flow channel body (8) and the test probe (5).

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