Electronic module and method for manufacturing electronic module

Abstract

Provided is an electronic module having heat dissipation surfaces disposed on both upper and lower surfaces, the heat dissipation surfaces being mounted with high mounting accuracy in the height direction, thereby having excellent heat dissipation characteristics. An electronic module (1) includes a first substrate (10), a first electronic component (13) disposed on the first substrate (10), a second substrate (20), a second electronic component (23) disposed on the second substrate (20), and an internal connection terminal (36) connecting the first substrate (10) and the second substrate (20). The second substrate (20) has, in plan view, a protruding portion (25) that protrudes further outward than the outer periphery of the first substrate (10).

Description

Technical Field

[0001] The present invention relates to an electronic module and a method for manufacturing the electronic module. Background Art

[0002] Conventionally, electronic modules (semiconductor devices) 900 are known in which heat dissipation components (back metal bodies) 923 and 933 are disposed on both surfaces to dissipate heat from these two surfaces. Patent Document 1 describes an electronic module 900 comprising a semiconductor element 910 having electrodes on both surfaces, a pair of substrates 920 and 930 disposed to sandwich the semiconductor element 910, and a conductive spacer 940 interposed between the substrates 930 and the semiconductor element 910. The substrates 920 and 930 each comprise insulating substrates 921 and 931, surface metal bodies 922 and 932 connected to the corresponding electrodes of the semiconductor element 910, and heat dissipation components 923 and 933. Heat generated by the semiconductor element 910 is dissipated from both surfaces of the electronic module 900 via the conductive spacers 940, the surface metal bodies 922 and 932, and the heat dissipation components 923 and 933.

[0003]

Prior technical literature

[0004] [Patent Document] Japanese Patent Application Laid-Open No. 2022-181822

[0005] However, such an electronic module that radiates heat from both sides requires that the heat dissipation surfaces disposed on both sides of the electronic module be in contact with the heat sink (see Figure 7 ). Therefore, the distance between the heat dissipation surfaces needs to be kept within the specified tolerance range.

[0006] On the other hand, electronic modules constructed with multiple stacked substrates are manufactured by stacking components such as the substrates, internal connectors, and external connectors along the height of the module. Conventional single-sided heat dissipation electronic modules have a heat dissipation surface located only on one side of the module, eliminating the need for strict tolerance management when stacking internal components. On the other hand, when heat dissipation surfaces are located on both sides of an electronic module, the height-direction position of the heat dissipation surface significantly influences the heat dissipation characteristics, requiring high-precision management of the heat dissipation surface position.

[0007] The present invention has been made in view of the above-mentioned problems, and its purpose is to provide an electronic module having heat dissipation surfaces arranged on both sides, wherein the heat dissipation surfaces are mounted with high mounting accuracy in the height direction, thereby having excellent heat dissipation characteristics, and to provide an electronic module manufacturing method capable of manufacturing such an electronic module. Summary of the Invention

[0008] The electronic module of the present invention includes: a first substrate; a first electronic component arranged on the first substrate; a second substrate; a second electronic component arranged on the second substrate; and an internal connection terminal arranged between the first substrate and the second substrate, characterized in that: the second substrate has an extension portion that extends outward from the outer periphery of the first substrate when viewed from above.

[0009] The manufacturing method of the electronic module of the present invention uses an assembly fixture having a first loading portion and a second loading portion, and is characterized in that it includes: a first substrate loading process, loading the first substrate on the first loading portion; an internal connection terminal configuration process, configuring one end of the internal connection terminal on the first substrate; and a second substrate loading process, loading the second substrate on the other end of the internal connection terminal and the second loading portion, wherein the second substrate, when assembled as the electronic module, has an extension portion extending outward from the outer periphery of the first substrate when viewed from above, and the second substrate is loaded on the second loading portion by being locked to the second loading portion by the extension portion, and the second loading portion is configured at a position specified height from the first loading portion, and the extension portion is configured at a position that can be locked by the second loading portion when viewed from above.

[0010] Effects of the Invention

[0011] The electronic module of the present invention comprises a first substrate, a second substrate, and internal connection terminals disposed between the first and second substrates. The second substrate has an extension extending outward from the outer periphery of the first substrate when viewed from above. The electronic module of the present invention utilizes the first heat dissipation surface of the first substrate and the extension of the second substrate to mount the first and second substrates with high height precision. According to the present invention, in an electronic module having heat dissipation surfaces on both sides, the heat dissipation surfaces are mounted with high height precision, thereby providing an electronic module with excellent heat dissipation characteristics.

[0012] The manufacturing method of the electronic module of the present invention is manufactured using an assembly fixture having a first loading portion and a second loading portion. The method includes: a first substrate loading step of loading the first substrate on the first loading portion; and a second substrate loading step of loading the second substrate on the second loading portion. When the second substrate is assembled as an electronic module, it has a protruding portion that protrudes outward from the outer periphery of the first substrate when viewed from above. The second loading portion is arranged at a position with a predetermined height from the first loading portion, and is arranged to be able to lock the protruding portion when viewed from above. Thus, the first substrate and the second substrate can be mounted with high precision in the height direction. According to the present invention, a manufacturing method of an electronic module can be provided in which, in an electronic module having heat dissipation surfaces on both sides, the heat dissipation surfaces are mounted with high mounting precision in the height direction and the heat dissipation characteristics are excellent. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 : is a perspective view of the electronic module 1 of this embodiment. Figure 1 In FIG, the mold resin 40 among the components of the electronic module 1 is not shown.

[0014] Figure 2 1 is an external view of the electronic module 1 according to the embodiment.

[0015] Figure 3 1 is a side view for explaining the internal structure of the electronic module 1 of this embodiment. Figure 3 In the figure, the mold resin 40 and part of the internal connection terminals 36 among the components of the electronic module 1 are omitted.

[0016] Figure 4 1 is a plan view for explaining a change in the extension portion 25 in the electronic module 1 according to the embodiment. Figure 4 In FIG, the molded resin 40, the first external connection terminal 32, and the second external connection terminal 34 of the components of the electronic module 1 are omitted. Figure 4 , the second substrate 20 is indicated by a solid line, and the first substrate 10 is indicated by a dotted line. In addition, the dotted line is omitted in the portion where the solid line and the dotted line overlap. Figure 4 (a) is used to illustrate Figures 1 to 3 A diagram showing the configuration of the extension portion 25 in the electronic module 1 according to the embodiment. Figure 4 (b) is a diagram for explaining the configuration of the extension portion 25 of the electronic module according to the first modification. Figure 4 (c) is a diagram for explaining the configuration of the extension portion 25 of the electronic module according to the second modified example.

[0017] Figure 5 1 is a schematic diagram for explaining a jig 50 that can be used to manufacture the electronic module 1 according to the embodiment.

[0018] Figure 6 It is a schematic diagram for explaining the manufacturing method of the electronic module 1 according to the embodiment.

[0019] Figure 7 Schematic diagram for explaining an electronic module 900 according to the conventional technology. DETAILED DESCRIPTION

[0020] Hereinafter, the electronic module and the method for manufacturing the electronic module of the present invention will be described based on the embodiments shown in the drawings. In addition, not all elements and their combinations described in the embodiments are essential to the solution means of the present invention.

[0021] 1. Electronic module

[0022] like Figures 1 to 3As shown, the electronic module 1 of the embodiment includes a first substrate 10, a first heat dissipating member 12, a first electronic component 13, a second substrate 20, a second heat dissipating member 22, a second electronic component 23, a first external connection terminal 32, a second external connection terminal 34, and an internal connection terminal 36. The electronic module 1 may include other components in addition to the above. Each component is described below.

[0023] The first substrate 10 is a substrate on which a first heat dissipating member 12 is arranged on one surface and a first electronic element 13 is arranged on the other surface (see Figure 3 As the first substrate 10, a ceramic substrate can be used, and preferably a substrate having a structure in which copper plates are arranged on both sides of the ceramic substrate (for example, a DCB substrate) is used. When a DCB substrate is used as the first substrate 10, the copper plate arranged on one side can be used as the first heat dissipation member 12. The first heat dissipation member 12 is exposed to the outside of the molded resin 40. The first substrate 10 has a wiring 11 (see Figure 3 ), the wiring 11 is electrically connected to the electrode of the first electronic component 13.

[0024] The term “electrically connected” in this specification includes not only a case where current-carrying portions between elements are in direct contact but also a case where elements are in contact via other conductive elements (eg, solder or pads).

[0025] The first electronic component 13 is an electronic component arranged in the first substrate 10. The first electronic component 13 is provided on the second substrate 20 side of the first substrate 10 and is sealed with a mold resin 40. The first electronic component 13 has electrodes (not shown) that are electrically connected to the wiring 11 provided on the first substrate 10 and the internal connection terminal 36. The first electronic device 13 may be, for example, a vertical MOSFET.

[0026] The second substrate 20 is a substrate that is disposed on the side of the first substrate 10 where the first electronic component 13 is disposed, in a state separated from the first substrate 10 and the first electronic component 13. Regarding the second substrate 20, "being separated from the first substrate 10 and the first electronic component 13" means that the second substrate 20 is not in direct contact with the first substrate 10 and the first electronic component 13.

[0027] The second substrate 20 is a substrate having a second heat dissipation member 22 on one side and a second electronic component 23 on the other side. A ceramic substrate can be used as the second substrate 20, and preferably a substrate (e.g., a DCB substrate) can be used in which copper plates are arranged on both sides of a ceramic substrate. When a DCB substrate is used as the second substrate 20, the copper plate arranged on one side can be used as the second heat dissipation member 22. The second heat dissipation member 22 is exposed outside the molded resin 40 (see Figure 2 The second substrate 20 includes wiring 21 (see Figure 3 ), the wiring 21 is electrically connected to the electrode of the second electronic component 23.

[0028] The second substrate 20 has an extension 25 extending outward from the outer periphery of the first substrate 10 in a plan view. The extension 25 is the portion of the second substrate 20 extending from the outer periphery of the first substrate 10 in a plan view of the electronic module 1. The extension 25 is preferably formed of a ceramic substrate.

[0029] The shape of the extension 25 and the number of extensions 25 provided on the second substrate 20 can be appropriately determined as long as the second substrate 20 can be stably supported during assembly of the electronic module 1. Stably supporting the second substrate 20 includes supporting the second substrate 20 by the extension 25 and also supporting the second substrate 20 by the extension 25 and the internal connection terminals 35.

[0030] The following will refer to Figure 4 A description will be given of variations of the protrusion 25 in the electronic module 1 .

[0031] In the electronic module 1 of the embodiment, the second substrate 20 is larger than the first substrate 10 in the longitudinal direction (vertical direction in the figure) and the transverse direction (horizontal direction in the figure) (see Figure 4 (a) Thus, when the first substrate 10 and the second substrate 20 are stacked with their respective centers of gravity aligned, the outer periphery of the second substrate 20 is positioned outside the outer periphery of the first substrate 10 in all portions, thereby forming the overhanging portion 25 .

[0032] In the first modification, the second substrate 20 is formed longer than the first substrate 10 in the short side direction (left-right direction in the figure) and is formed the same as the first substrate 10 in the long side direction (up-down direction in the figure) (see FIG. Figure 4 (b)). Therefore, when the first substrate 10 and the second substrate 20 are stacked in the height direction so that their centers of gravity coincide with each other, the protruding portions 25 of the second substrate 20 protrude outward from the outer periphery of the first substrate 10, which are provided on the left and right sides of the second substrate 20 in the figure.

[0033] The outer shape of the first substrate 10 and the second substrate 20 is not limited to a rectangular shape. One or both of the first substrate 10 and the second substrate 20 may be a shape different from a rectangular shape. For example, Figure 4 In the second modification shown in (c), the outer periphery of the second substrate 20 partially extends relative to the outer periphery of the first substrate 10 in a plan view, thereby forming an extension portion 25. In the second modification, Figure 4 In (c), the protruding portions 25 are formed at a total of five locations on the second substrate 20 : two locations on the left, one location from the top to the right, one location on the right, and one location from the right to the bottom.

[0034] The shape of the extension portion 25 and the arrangement position of the extension portion 25 are merely examples, and the above-mentioned shape is not limited thereto. Since the second substrate 20 has the extension portion 25 formed to extend outward from the outer periphery of the first substrate 10, the effect of being able to mount the first substrate 10 and the second substrate 20 with high precision in the height direction can be achieved.

[0035] The second electronic component 23 is an electronic component arranged on the second substrate 20. The second electronic component 23 is provided on the first substrate 10 side of the second substrate 20 and is sealed with a mold resin 40. The second electronic component 23 has electrodes that are electrically connected to the wiring 21 provided on the second substrate 20 and the internal connection terminal 36. For example, a vertical MOSFET can be exemplified as the second electronic component 23.

[0036] The internal connection terminal 36 is disposed between the first substrate 10 and the second substrate 20. The internal connection terminal 36 is a columnar member that serves as a member for adjusting the height of the second substrate 20 relative to the first substrate 10. One end of the internal connection terminal 36 is disposed on the first substrate 10 or on the first electronic component 13 disposed on the first substrate 10 via a bonding material (e.g., solder). The other end of the internal connection terminal 36 is disposed on the second substrate 20 or on the second electronic component 23 disposed on the second substrate 20 via a bonding material (e.g., solder).

[0037] The internal connection terminal 36 is also a member used for conducting electrical exchange within the electronic module 1. One end of the internal connection terminal 36 is electrically connected to the wiring 11 of the first substrate 10 or the electrode of the first electronic component 13. The other end of the internal connection terminal 36 is electrically connected to the wiring 21 of the second substrate 20 or the electrode of the second electronic component 23. Furthermore, the internal connection terminal 36 is electrically connected to the first external connection terminal 32 or the second external connection terminal 34. The cross-sectional area and material of the internal connection terminal 36, as well as the number of internal connection terminals 36 used, are preferably selected in consideration of the amount of current flowing through the internal connection terminal 36.

[0038] The first external connection terminal 32 is a terminal that connects the wiring 11 of the first substrate 10, the electrodes of the first electronic component 13, the wiring 21 of the second substrate 20, or the electrodes of the second electronic component 23 to the outside of the electronic module 1 via the internal connection terminal 36. The first external connection terminal 32 is a power terminal capable of handling large currents. At least one end of the first external connection terminal 32 is exposed outside the molded resin 40 and is configured to be connectable to an external terminal (not shown).

[0039] The second external connection terminals 34 are terminals that connect the wiring 11 of the first substrate 10, the electrodes of the first electronic component 13, the wiring 21 of the second substrate 20, or the electrodes of the second electronic component 23 to the outside of the electronic module 1 via the internal connection terminals 36. The second external connection terminals 34 are electrically connected to the internal connection terminals 36 between the first substrate 10 and the second substrate 20. The second external connection terminals 34 are configured so that at least one end is exposed to the outside of the molded resin 40 and can be connected to an external terminal (not shown).

[0040] The mold resin 40 seals the surface of the first substrate 10 on the side where the first electronic element 13 is arranged and the first electronic element 13 (see Figure 2 ) In addition, the mold resin 40 seals the surface of the second substrate 20 on the side where the second electronic element 23 is arranged and the second electronic element 23 .

[0041] 2. Manufacturing method of electronic module

[0042] Next, a method for manufacturing the electronic module 1 according to the embodiment will be described.

[0043] 2.1. Assembling the fixture

[0044] The electronic module 1 of the present embodiment is manufactured by arranging the first substrate 10 , the internal connection terminals 36 , the first external connection terminals 32 , the second external connection terminals 34 , and the second substrate 20 in the height direction using an assembly jig 50 .

[0045] like Figure 5 As shown, an assembly jig 50 that can be used when manufacturing the electronic module 1 includes a first placement portion 52 , an upright portion 53 , a second placement portion 54 , and a wall 55 .

[0046] The first placement portion 52 is a flat surface formed on the assembly jig 50 and is a placement portion on which the first substrate 10 is placed. Figure 5 , the first placement portion 52 is shown as a region surrounded by solid and dotted lines. By placing the first substrate 10 on the first placement portion 52, the height of the first substrate 10 can be adjusted with the surface where the first placement portion 52 is formed as a reference surface.

[0047] A vertical installation portion 53 is arranged around the first placement portion 52. Figure 5 The illustrated assembly jig 50 is provided with five upright portions 53. Furthermore, when viewed from above, each upright portion 53 is arranged so as to abut the boundary between the first receiving portion 52 and the area outside the first receiving portion 52. This restricts the free in-plane movement of the first substrate 10 when it is placed on the first receiving portion 52, allowing for accurate in-plane alignment of the first substrate 10.

[0048] In the electronic module 1 , the upright portion 53 avoids positions where the first external connection terminals 32 and the second external connection terminals 34 are arranged.

[0049] The upright setting portion 53 has a second loading portion 54. The second loading portion 54 is a loading portion that locks the protruding portion 25 of the second substrate 20 when determining the height of the second substrate 20. The second loading portion 54 is formed on the surface of the upright setting portion 53 opposite to the first loading portion 52. The second loading portion 54 is provided at a position corresponding to the protruding portion 25 of the second substrate 20 when the second substrate 20 is mounted on the assembly jig 50. The second loading platform 54 is arranged at a position having a predetermined height relative to the first loading platform 52. When the second substrate 20 is arranged on the second loading portion 54, by locking the protruding portion 25 on the second loading portion 54, the second substrate 20 can be mounted with high precision in the height direction relative to the reference surface of the first loading portion 52.

[0050] The upright portion 53 includes a wall 55. The upper wall 55 is positioned to restrict the in-plane movement of the second substrate 20 when the extension 25 engages the second receiving portion 54. This allows for in-plane alignment of the second substrate 20 when the second substrate 20 is placed on the second receiving portion 54.

[0051] 2.2. Manufacturing method of electronic module

[0052] Below, refer to Figure 6 A method for manufacturing an electronic module is described.

[0053] The manufacturing method of the electronic module 1 includes: a first substrate mounting step of mounting the first substrate 10 on the first mounting portion 52, an internal connection terminal setting step of setting one end of the internal connection terminal 36 on the first substrate 10, and a second substrate mounting step of mounting the second substrate 20 on the other end of the internal connection terminal 36 and on the second mounting portion 54.

[0054] Furthermore, in the method for manufacturing the electronic module 1, the second substrate 20 has an extension portion 25 that, when assembled into the electronic module 1, extends outward from the outer periphery of the first substrate 10 in a plan view. The second substrate 20 is mounted on the second mounting portion 54 by engaging the extension portion 25 with the second mounting portion 54.

[0055] Furthermore, in the method of manufacturing the electronic module 1, the second placement portion 54 is disposed at a predetermined height from the first placement portion 52. Furthermore, the second placement portion 54 is disposed at a position capable of locking the extension portion 25 in a plan view.

[0056] The manufacturing method of the electronic module 1 will be described in detail below.

[0057] Prepare the assembly jig 50. Figure 5 and Figure 6 As shown, an assembly jig 50 that can be used in the method for manufacturing the electronic module 1 includes a first placement portion 52 for placing the first substrate 10 , a standing portion 53 , and a second placement portion 54 for placing the second substrate 20 .

[0058] The upright portion 53 is positioned so as to be able to pass through the first substrate 10 from above when the first substrate 10 is mounted on the first mounting portion 52. The second receiving portion 54 is disposed on the upright portion 53 at a predetermined height relative to the first receiving portion 52. Furthermore, the second receiving portion 54 is positioned so as to be able to engage the extending portion 25 of the second substrate 20 when viewed from above.

[0059] In the first substrate placement step, Figure 6 As shown in FIG. 1 , the first substrate 10 is placed on the first receiving portion 52 of the assembly jig 50. When the first substrate 10 is placed on the first receiving portion 52, the upright portion 53 including the second receiving portion 54 is positioned, when viewed from above, so that the first substrate 10 can pass through. Therefore, the first substrate 10 can pass between the upright portions 53 and be placed on the first receiving portion 52.

[0060] The first substrate 10 is placed so that the surface on which the first heat dissipation member 12 is disposed abuts the first receiving portion 52. This ensures that the height of the surface of the first substrate 10 on which the first heat dissipation member 12 is disposed is aligned with the height of the reference surface of the first receiving portion 52. Furthermore, the outer periphery of the first substrate 10 abuts the inner periphery of the upright portion 53 of the assembly jig 50. This restricts the free movement of the first substrate 10 in the in-plane direction. Consequently, the in-plane alignment of the first substrate 10 is possible.

[0061] In the internal connection terminal setting process, Figure 6 As shown in (b), the internal connection terminal 36 is vertically arranged on the first substrate 10. Next, the first external connection terminal 32 and the second external connection terminal 34 are arranged. Alternatively, instead of the above process, the internal connection terminal 36 can be inserted into a hole formed in the first external connection terminal 32 or the second external connection terminal 34, thereby forming a component in which the internal connection terminal 36 and the first external connection terminal 32 and / or the second external connection terminal 34 are assembled. Alternatively, the internal connection terminal 36 and the first external connection terminal 32 and / or the second external connection terminal 34 can be assembled together and arranged on the first substrate 10.

[0062] In the second substrate placement step, Figure 6 As shown in FIG. 5( c ), the second electronic component 23 is placed on the other end of the internal connection terminal 36 and the second placement portion 54 (see FIG. 5( c )). Figure 3). The second substrate 20 has an extension 25. By engaging the extension 25 with the second receiving portion 54, the second substrate 20 can be placed on the second receiving portion 54. In this way, the height of the second substrate 20 can be adjusted based on the height of the first receiving portion 52.

[0063] Furthermore, the outer periphery of the second substrate 20 is brought into contact with the wall 55. This restricts the free movement of the second substrate 20 in the in-plane direction when the second substrate 20 is placed on the second placement portion 54. Consequently, the in-plane positioning of the second substrate 20 can be performed.

[0064] After the second substrate 20 is placed, the module is sealed with mold resin 40 to complete the electronic module 1. The sealing portion seals the surface of the first substrate 10 on the side where the first electronic component 13 is arranged, as well as the first electronic component 13, with mold resin 40. Furthermore, the surface of the second substrate 20 on which the second electronic component 23 is arranged, as well as the second electronic component 23, is sealed with mold resin 40.

[0065] Next, the effects of the electronic module 1 according to this embodiment will be described.

[0066] The electronic module 1 of the embodiment includes a first substrate 10, a second substrate 20, and internal connection terminals 36 connecting the first and second substrates 10, 20. The second substrate 20 has an extension 25 that extends outward from the outer periphery of the first substrate 10 when viewed from above. With this electronic module 1, the use of the heat dissipation surface of the first substrate 10 and the extension 25 of the second substrate 20 allows the first and second substrates 10, 20 to be mounted with high precision in the height direction. This provides an electronic module 1 with excellent heat dissipation characteristics.

[0067] In the electronic module 1 of this embodiment, the second substrate 20 comprises a ceramic substrate and a second heat dissipation member 22 formed on one surface of the ceramic substrate. The extension 25 is formed from the ceramic substrate. Using a ceramic substrate as the second substrate 20 allows for high-precision mounting of the first and second substrates 10, 20 in the height direction, while also improving heat dissipation from the second substrate 20. Furthermore, forming the second heat dissipation member 22 on the surface of the second substrate 20 further enhances heat dissipation. This provides an electronic module 1 with excellent heat dissipation characteristics.

[0068] The first substrate 10 includes a ceramic substrate and a first heat dissipation member 12 formed on one surface of the ceramic substrate. Using a ceramic substrate as the first substrate 10 allows for high-precision mounting of the first substrate 10 and the second substrate 20 in the height direction, improving heat dissipation from the first substrate 10. Furthermore, forming the first heat dissipation member 12 on one surface of the first substrate 10 further enhances heat dissipation. This allows for the provision of an electronic module 1 with excellent heat dissipation characteristics.

[0069] The electronic module 1 according to the embodiment further includes first external connection terminals 32 and / or second external connection terminals 34, and the internal connection terminals 36 are inserted into the first external connection terminals 32 and / or second external connection terminals 34. By properly managing the length of the internal connection terminals 36, the first substrate 10 and the second substrate 20 can be mounted with high precision in the height direction. Furthermore, the first electronic component 13 or the second electronic component 23 can be electrically connected to the first external connection terminals 32 or the second external connection terminals 34.

[0070] The manufacturing method of the electronic module 1 according to the embodiment includes: a first substrate placement step of placing the first substrate 10 on the first placement portion 52 of an assembly jig 50, which includes a first placement portion 52 for placing the first substrate 10 and a second placement portion 54 for placing the second substrate 20; and a second substrate placement step of placing the second substrate 20 on the second placement portion 54. When assembled into the electronic module 1, the second substrate 20 has an extension portion 25 extending outward from the outer periphery of the first substrate 10 in a plan view. The second placement portion 54 is positioned at a predetermined height from the first placement portion 52 and is positioned to engage with the extension portion 25 in a plan view. This allows the first and second substrates 10, 20 to be mounted with high precision in the height direction. According to the present invention, a method for manufacturing an electronic module 1 having heat dissipation surfaces on both sides can be provided, in which the heat dissipation surfaces are mounted with high precision in the height direction and exhibit excellent heat dissipation characteristics.

[0071] The present invention has been described above based on the above embodiment, but the present invention is not limited to the above embodiment and can be implemented in various forms within the scope of the present invention. For example, the following modifications are possible.

[0072] (1) The shape, number, size, position, etc. of the components of the present invention are not limited to those described above or shown in the drawings, and may be modified as appropriate without impairing the characteristics of the present invention.

[0073] For example, in the above embodiment, the number of the first electronic component 13 and the number of the second electronic component 23 are both one, but the present invention is not limited thereto. The number of the first electronic component 13 and the number of the second electronic component 23 may also be multiple.

[0074] (2) The electronic module of the present invention may further include electronic components and structures other than the first electronic component 13 on the first substrate 10 . Also, electronic components and structures other than the second electronic component 23 may further include electronic components and structures on the second substrate 20 .

[0075] (3) As the first electronic component 13 in the electronic module of the present invention, electronic components other than MOSFET (for example, various diodes, transistors other than vertical MOSFET, thyristors) may be used. This also applies to the second electronic component 23.

[0076] Explanation of symbols

[0077] 1…electronic module; 10…first substrate; 12…first heat dissipation member; 13…first electronic component; 20…second substrate; 22…second heat dissipation member; 23…first electronic component; 25…extension portion; 32…first external connection terminal; 34…second external connection terminal; 36…internal connection terminal; 40…molded resin; 50…assembly jig; 52…first loading portion; 53…upright setting portion, 54…second loading portion, 55…wall.

Claims

1. An electronic module comprising: a first substrate; a first electronic component disposed on the first substrate; a second substrate; a second electronic component disposed on the second substrate; as well as The internal connection terminal disposed between the first substrate and the second substrate is characterized in that: The second substrate has a protruding portion that protrudes outward from the outer periphery of the first substrate in a plan view.

2. The electronic module according to claim 1, wherein: The second substrate includes a ceramic substrate and a heat dissipation member formed on one surface of the ceramic substrate. The protruding portion is formed by the ceramic substrate.

3. The electronic module according to claim 2, wherein: The first substrate includes a ceramic substrate and a heat dissipation member formed on one surface of the ceramic substrate.

4. The electronic module according to any one of claims 1 to 3, characterized in that: The electronic module further comprises external connection terminals, The internal connection terminal is inserted through the external connection terminal.

5. A method for manufacturing an electronic module, using an assembly jig having a first loading portion and a second loading portion, characterized in that: Include: a first substrate placing step of placing the first substrate on the first placing portion; an internal connection terminal disposing step of disposing one end of an internal connection terminal on the first substrate; as well as a second substrate placement step of placing the second substrate on the other end of the internal connection terminal and the second placement portion; When the second substrate is assembled as the electronic module, it has a protruding portion that protrudes outward from the outer periphery of the first substrate in a plan view. The second substrate is placed on the second placement portion by being locked by the protruding portion. The second placement portion is disposed at a predetermined height from the first placement portion, and the extending portion is disposed at a position where it can be engaged by the second placement portion in a plan view.

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