Electronic module and method for manufacturing electronic module

Abstract

The invention provides an electronic module which can improve heat dissipation performance compared with a conventional electronic module and can restrain resin from adhering to a heat dissipation surface of a substrate. An electronic module (1) of the present invention includes a first substrate (10), a first heat generating component (12), and a molded resin, and further includes a second substrate (20), and support members (18, 28). A first heat dissipation surface 11 in the first substrate 10 and a second heat dissipation surface 21 in the second substrate 20 are exposed outside the electronic module 1. According to the electronic module (1), heat can be dissipated from both sides, and therefore heat dissipation performance can be improved compared with a conventional electronic module. Furthermore, during manufacturing, a pressing force is applied to the opposite side of the part where the first substrate (10) and the second substrate (20) are in contact with the support members (18, 28), so that the first heat dissipation surface (11) and the second heat dissipation surface (21) are in close contact with a mold, and adhesion of resin to the heat dissipation surfaces can be suppressed.

Description

Technical Field

[0001] The invention relates to an electronic module and a manufacturing solution of the electronic module. Background Art

[0002] In the past, an electronic module was known, comprising: a substrate; a heat-generating component (for example, a semiconductor chip such as MOSFET) arranged on the substrate; and a molded resin for sealing the surface of the substrate on the side where the heat-generating component is arranged and the heat-generating component, wherein the surface of the substrate on the side opposite to the side where the heat-generating component is arranged is exposed outside the electronic model (see patent document 1).

[0003] According to the conventional electronic module, the surface of the substrate opposite to the side where the heat generating component is arranged is exposed to the outside of the electronic module. Therefore, heat generated by the heat generating component can be easily dissipated to the outside of the electronic module through the substrate.

[0004]

Prior Technical Literature

[0005] [Patent Document 1] International Publication No. 2020 / 208741

[0006] However, electronic components are the most common heat-generating components in electronic modules. Research on these components has advanced rapidly in recent years, with the practical application of next-generation electronic components using semiconductor materials such as SiC and GaN. While these components can be miniaturized (and thus, densified), they require greater attention to heat dissipation. Consequently, within the electronic module technology field, there is a need to improve their heat dissipation.

[0007] As a structure for improving the heat dissipation of electronic modules, a structure that includes an additional substrate (second substrate) that is separated from the existing substrate (first substrate) can be considered. In an electronic module with this structure, it is possible to use a component that transfers heat generated by heat-generating components arranged on the first substrate to the second substrate, or to disperse the heat-generating components between the first and second substrates. Therefore, with this structure, the electronic module can improve heat dissipation compared to existing electronic modules by dissipating heat from two sides.

[0008] In order to manufacture the above-mentioned electronic module, it is necessary to form a molded resin in order to protect the internal structure of the electronic module. The formation of the molded resin is implemented using a molding die. In the existing method for manufacturing electronic modules, a method is used in which support pins are provided on the mold, and components (such as pin terminals) that are in contact with the substrate and protrude toward the side where the heat-generating component is arranged are pressed. By utilizing this method, the surface of the substrate opposite to the side where the heat-generating component is arranged (the heat-dissipating surface) is brought into close contact with the mold, which can suppress the adhesion of the resin to the heat-dissipating surface.

[0009] However, when manufacturing an electronic module that includes two substrates and dissipates heat from both sides, since the substrates exist on both sides of the electronic module, it is impossible to directly press components protruding from the substrates as in conventional manufacturing methods.

[0010] The present invention has been made in view of the above problems and aims to provide an electronic module that can improve heat dissipation compared to conventional electronic modules and can prevent resin from adhering to the heat dissipation surface of the substrate. Furthermore, the present invention aims to provide a method for manufacturing such an electronic module. Summary of the Invention

[0011] The electronic module of the present invention includes: a first substrate; a first heat-generating component, arranged on the first substrate; and a molded resin, used to seal the surface of the first substrate on the side where the first heat-generating component is arranged and the first heat-generating component, and is characterized in that it further includes: a second substrate, arranged on the side of the first substrate where the first heat-generating component is arranged in a state separated from the first substrate and the first heat-generating component; and a supporting member, arranged between the first substrate and the second substrate, in contact with both the first substrate and the second substrate, wherein a first heat dissipation surface which is a surface of the first substrate on the opposite side to the side where the first heat-generating component is arranged and a second heat dissipation surface which is a surface of the second substrate on the opposite side to the first substrate are exposed to the outside of the electronic module.

[0012] The manufacturing method of the electronic module of the present invention is used to manufacture the electronic module according to claim 1, and is characterized in that it includes: a preparation step of preparing an unsealed electronic module including the first substrate, the first heat-generating component, the second substrate, and the supporting member; a configuration step of configuring the unsealed electronic module in a molding die, applying pressing pressure to a portion of the first heat dissipation surface corresponding to the back side of the portion where the first substrate contacts the supporting member and a portion of the second heat dissipation surface corresponding to the back side of the portion where the second substrate contacts the supporting member, so that the first heat dissipation surface and the second heat dissipation surface are in close contact with the molding die; and a molding step of injecting resin into the molding die to form the molding resin.

[0013] Effects of the Invention

[0014] The electronic module of the present invention comprises a first substrate on the side of the first substrate where a first heat-generating component is located, and a second substrate disposed separately from the first heat-generating component. Furthermore, the first heat-dissipating surface, which is the surface of the first substrate opposite the side where the first heat-generating component is located, and the second heat-dissipating surface, which is the surface of the second substrate opposite the first substrate, are exposed to the outside of the electronic module. Therefore, the electronic module of the present invention can dissipate heat from two sides, thereby improving heat dissipation compared to existing electronic modules.

[0015] The electronic module of the present invention also includes a support member disposed between and in contact with the first and second substrates. During manufacturing, the electronic module of the present invention can be manufactured by applying pressure to the sides of the first substrate opposite to the contact with the support member and the second substrate opposite to the contact with the support member, thereby ensuring close contact between the first and second heat dissipation surfaces and the molding die. Consequently, the electronic module of the present invention can prevent resin from adhering to the heat dissipation surfaces of the substrates.

[0016] Therefore, the electronic module of the present invention can improve heat dissipation performance compared to conventional electronic modules and can suppress adhesion of resin to the heat dissipation surface of the substrate.

[0017] The manufacturing method of the electronic module of the present invention includes a preparation step of preparing an unsealed electronic module including a first substrate, a first heat-generating component, a second substrate, and a support member. In addition, the manufacturing method of the electronic module of the present invention includes a configuration step, in which the unsealed electronic module is configured in a molding die, and a pressing force is applied to a portion of the first heat dissipation surface corresponding to the back side of the portion where the first substrate contacts the support member, and a portion of the second heat dissipation surface corresponding to the back side of the portion where the second substrate contacts the support member, so that the first heat dissipation surface and the second heat dissipation surface are in close contact with the molding die. Therefore, compared with conventional electronic modules, the manufacturing method of the electronic module of the present invention can improve heat dissipation and can suppress the adhesion of resin to the heat dissipation surface of the substrate, and is a manufacturing method of an electronic module capable of manufacturing the electronic module of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a perspective view of the electronic module 1 according to this embodiment.

[0019] Figure 2 1 is an external view of the electronic module 1 according to the embodiment. Figure 2 (a) is a plan view of the electronic module 1. Figure 2 (b) is a left side view of the electronic module 1. Figure 2 (c) is a bottom view of the electronic module 1 .

[0020] Figure 3 It is a perspective view of the internal structure of the electronic module 1 according to this embodiment. Figure 3 The figure shows a mold resin 40 (not shown) that includes the components of the electronic module 1 .

[0021] Figure 4 is a plan view for explaining the internal structure of the electronic module 1 according to the embodiment; Figure 4 (a)~ Figure 4 (c) is a plan view of the internal structure of the electronic module 1. Figure 4 In (a), the second substrate 20, the second heat generating component 22, the second spacer 25, and the mold resin 40 among the components of the electronic module 1 are not shown. Figure 4 (b), except Figure 4 In addition to the components not shown in (a), the first heat transfer member 14, the first spacer 15, the first internal connection terminal 16, and the external connection terminals 30 and 35 are not shown. Figure 4 (c), except Figure 4 In addition to the components not shown in (b), the second heat transfer member 24, the second internal connection terminal 26, and the external connection terminals 32a, 32b, 34, 36, and 37 are not shown. Figure 4 In (c), the outer edge of the central region, i.e., the rectangular shape b, is indicated by a dotted line, and the center of gravity G of the first substrate 10, which is common to the center of gravity of the central region, is indicated by a dot. The area surrounded by the rectangular shape b is the central region, and the area outside the rectangular shape b is the peripheral region. Furthermore, a portion of the rectangular shape B overlaps with the outer shape of the first heat-generating component 12, making it difficult to observe. However, the "point F of the first heat-generating component 12 farthest from the center of gravity G of the first substrate 10" overlaps with the vertex of the rectangular shape B.

[0022] Figure 5 is a side view for explaining the internal structure of the electronic module 1 according to the embodiment. Figure 5 (a) is a left side view of the internal structure of the electronic module 1. Figure 5 (b) is an enlarged representation Figure 5 (a) is a diagram of the vicinity of the support member 18. Figure 5 (c) is a right side view of the internal structure of the electronic module 1. Figure 5 (d) is an enlarged representation Figure 5 (c) is a view of the vicinity of the support member 28. Figure 5 (a)~ Figure 5 In (d), the mold resin 40 among the components of the electronic module 1 is not shown.

[0023] Figure 6 It is a side view for explaining the internal structure of the electronic module 1 according to the present embodiment. Figure 6 (a) is a left side view of the internal structure of the electronic module 1. Figure 6 (b) Figure 6(a) is an enlarged view showing the vicinity of the first heat transfer member 14. Figure 6 (c) is a right side view of the internal structure of the electronic module 1. Figure 6 (d) is to Figure 6 (c) is an enlarged view of the vicinity of the second heat transfer member 24. Figure 6 (a)~ Figure 6 In (d), the supporting members 18 and 28 , the external connection terminals 34 and 37 , and the mold resin 40 among the components of the electronic module 1 are not shown. Figure 6 (b) and Figure 6 Arrows H1 to H4 indicated by dotted lines in (d) indicate heat transfer (heat dissipation) during operation.

[0024] Figure 7 1 is a bottom view for explaining the internal structure of the electronic module 1 according to the embodiment. Figure 7 (a) and 7 (b) are bottom views of the internal structure of the electronic module 1. Figure 7 In (a), the first substrate 10, the first heat generating component 12, the first spacer 15, and the molded resin 40 among the components of the electronic module 1 are not shown. Figure 7 (b), except Figure 7 In addition to the components not shown in (a), the second heat transfer member 24, the second spacer 25, the second internal connection terminal 26, and the external connection terminals 32a, 32b, and 36 are not shown.

[0025] Figure 8 is a side view illustrating a method of manufacturing an electronic module according to an embodiment. Figure 8 (a) is a left side view showing the state of the preparation step S10. Figure 8 (b) is a left side view showing the arrangement step S20. Figure 8 (c) is a left side view showing the molding step S30. Figure 8 The arrows indicated by the symbol P in (b) indicate positions where pressing force is applied in the arrangement step S20 . DETAILED DESCRIPTION

[0026] The electronic module of the present invention is described below based on the embodiments shown in the accompanying drawings. The embodiments described below do not limit the inventions involved in the claims. In addition, not all elements and their combinations described in the embodiments are essential to the solutions of the present invention.

[0027] [Implementation Method]

[0028] 1. Electronic Module 1 of Embodiment

[0029] like Figures 1 to 8As shown, the electronic module 1 of the embodiment includes: a first substrate 10, a first heat-generating component 12, a first heat-transfer member 14, a first spacer 15, a first internal connection terminal 16, support members 18 and 28, a second substrate 20, a second heat-generating component 22, a second heat-transfer member 24, a second spacer 25, a second internal connection terminal 26, external connection terminals 30, 32a, 32b, 34, 35, 36, and 37, and a molded resin 40. The electronic module 1 may include other components in addition to the above components. Each component is described below.

[0030] The first substrate 10 is a substrate on which the first heat generating component 12 is arranged. The first substrate 10 is composed of a structure in which copper plates are arranged on both sides of a ceramic substrate (for example, a DCB substrate). The first heat dissipation surface 11, which is the surface opposite to the side on which the first heat generating component 12 is arranged, is exposed to the outside of the electronic module 1 (outside the molded resin 40) (see Figure 2 (c) The first substrate 10 has a first heat generating component 12 and is electrically connected to a first drain electrode (first and second electrodes, described later).

[0031] The term “electrically connected” in this specification includes not only a case where current-carrying portions between elements are in direct contact but also a case where elements are in contact via other conductive elements (for example, solder or spacers).

[0032] The first heat-generating component 12 is disposed on the first substrate 10. In this specification, a "heat-generating component" refers to an electronic component that generates heat when in use (when powered on). Examples of heat-generating components include, but are not limited to, electronic elements (typically semiconductor chips), resistors, coils, and capacitors.

[0033] The first heat-generating component 12 is a vertical electronic component having a first electrode and a first second electrode. In this specification, a "vertical electronic component" refers to an electronic component having at least two electrodes (a first electrode and a second electrode) on its surface, with the first electrode disposed on the side opposite to the second electrode. A "vertical electronic component" can also be referred to as an "electronic component having electrodes on both sides."

[0034] Specifically, the first heat generating component 12 is a vertical MOSFET having: a first source electrode (first first electrode) 12a arranged on the second substrate 20 side, a first drain electrode (first second electrode) arranged on the first substrate 10 side (not shown), and a first gate electrode 12b arranged on the same side as the first source electrode 12a (see FIG. Figure 4 (b) In addition, the first heat generating component 12 has three first source electrodes 12a.

[0035] The first heating component 12 and the second heating component 22 generate heat at different times. If the timings of the increase and decrease in heat generation of the first heating component and the second heating component are inconsistent during actual use, the condition of "different timings of heating" in this specification is satisfied. In addition, the above-mentioned "timing of heating" is preferably "the timing of maximum heat generation". In this case, the above-mentioned feature can also be expressed as "when the electronic module 1 is in use, the first heating component 12 and the second heating component 22 are controlled to have different timings of maximum heat generation". The electronic module 1 of this embodiment is used to form a half-bridge circuit, with the first heating component 12 as the high side and the second heating component 22 as the low side.

[0036] The first heat transfer member 14 is a member that transfers the heat generated in the first heat generating component 12 to the second substrate 20 (see Figure 6 (a) and Figure 6 (b)). The first heat transfer member 14 is a roughly columnar member that is connected to the first heat-generating component 12 and the second substrate 20 in a manner that enables heat exchange, and the main part is formed integrally. With respect to the first heat transfer member, "connected in a manner that enables heat exchange" includes not only the case where the first heat transfer member is in direct contact with the object member, but also the case where the first heat transfer member is in contact with the object member through other members (for example, solder or spacers). The above-mentioned "other members" are preferably composed of a material with good thermal conductivity (for example, a metal material). The same applies to the second heat transfer member with respect to the above matters.

[0037] Here, use Figure 6 (b) illustrates heat transfer (heat dissipation) associated with the first heat-generating component 12 of the electronic module 1. The first heat-generating component 12 is disposed on the first substrate 10. Therefore, heat generated by the first heat-generating component 12 is dissipated outside the electronic module 1 via the first substrate 10 (see arrow H1).

[0038] The electronic module 1 includes a first heat transfer member 14 that transfers heat generated by the first heat-generating component 12 to the second substrate 20. Therefore, heat generated by the first heat-generating component 12 is dissipated outside the electronic module 1 via a path through the first heat transfer member 14 and the second substrate 20, separate from the path through the first substrate 10 (see arrow H2).

[0039] The first heat transfer member 14 is made of a conductive material and is electrically connected to the electrode of the first heat-generating component 12. In other words, the first heat transfer member 14 can also be said to have the function of being a member that exists inside the electronic module 1 and is used for electrical exchange, i.e., an internal connection terminal. The first heat transfer member 14 is electrically connected to the first source electrode (first first electrode) 12a. The electronic module 1 and the first heat-generating component 12 have three first source electrodes 12a and are provided with three first heat transfer members 14 accordingly. In addition, the end of the first heat transfer member 14 on the side opposite to the first heat-generating component 12 is electrically connected to the wiring pattern of the second substrate 20.

[0040] The first spacer 15 is a tray-shaped member made of a conductive material and interposed between the first source electrode 12a of the first heat-generating component 12 and the first heat transfer member 14. Although not shown, the first source electrode 12a and the first spacer 15 are joined together by a conductive bonding material (e.g., solder). Furthermore, the first spacer 15 and the first heat transfer member 14 are also joined together by a conductive bonding material.

[0041] The first internal connection terminal 16 is a member that exists inside the electronic module 1 and is used for electrical exchange. The first internal connection terminal 16 is electrically connected to the first gate electrode 12 b of the first heat generating component 12 and the external connection terminal 35 .

[0042] The supporting members 18 and 28 are members disposed between the first substrate 10 and the second substrate 20 and in contact with both the first substrate 10 and the second substrate 20 (see Figure 5 ,in particular Figure 5 (b) and Figure 5 (d) The electronic module 1 includes two or more supporting members 18 and 28. In this embodiment, the electronic module 1 includes three supporting members 18 and three supporting members 28, respectively.

[0043] When the electronic module 1 is viewed from above with the surface of the first substrate 10 on one side where the first heat-generating component 12 is disposed as a reference, its outer edge is formed by a rectangular shape B and has a common center of gravity with the center of gravity G of the first substrate 10. The area where the outer edge is in contact with the point F in the first heat-generating component 12 that is farthest from the center of gravity G of the first substrate 10 (in the electronic module 1, the corner of the first heat-generating component 12) is defined as the central area. In addition, the area outside the central area is defined as the peripheral area. In the electronic module 1, the end portions of at least two of the support members 18 and 28 (in the electronic module 1, there are a total of 6 support members 18 and 28) on the first substrate 10 side are in contact with the peripheral area (refer to Figure 4 (c)).

[0044] Furthermore, the electronic module 1 is arranged such that, when viewed from above with reference to the first substrate 10, all of the support members 18 and 28 are not aligned in a straight line. Furthermore, when evaluating the above structure, the evaluation is conducted not only on the support members 18 or 28, but on all of the support members 18 and 28.

[0045] Support members 18 and 28 are made of a conductive material and are electrically connected to other components of electronic module 1. Support member 18 is electrically connected to first substrate 10 and external connection terminals 34. Support member 28 is electrically connected to second substrate 20 and external connection terminals 37.

[0046] The second substrate 20 is a substrate that is arranged on the side of the first substrate 10 on which the first heat-generating component 12 is arranged, in a state separated from the first substrate 10 and the first heat-generating component 12. With respect to the second substrate, "a state separated from the first substrate and the first heat-generating component" means a state in which the second substrate is not in direct contact with the first substrate and the first heat-generating component. Therefore, if the second substrate is not in direct contact with the first substrate and the first heat-generating component, then even if the component in contact with the second substrate is also in contact with the first substrate or the first heat-generating component, it can be said that the second substrate is in a "state separated from the first substrate and the first heat-generating component."

[0047] The second substrate 20 is formed by placing copper plates on both sides of a ceramic substrate (e.g., a DCB substrate). The second heat dissipation surface 21 of the second substrate 20 opposite to the first substrate 10 is exposed to the outside of the electronic module 1 (see Figure 1 and Figure 2 (a) The second substrate 20 has a second heat generating component 22 electrically connected to a second drain electrode (a second electrode, described later).

[0048] The second heat generating component 22 is arranged on the surface of the second substrate 20 on the side of the first substrate 10. The second heat generating component 22 is a vertical electronic component having a second first electrode and a second second electrode. Specifically, the second heat generating component 22 is a vertical MOSFET having: a second source electrode (second first electrode) 22a arranged on the side of the first substrate 10, a second drain electrode (second second electrode) arranged on the side of the second substrate 20. (not shown) and a second gate electrode 22b arranged on the same side as the second source electrode 22a (refer to Figure 7 (b) In addition, the second heat generating component 22 has three second source electrodes 22a.

[0049] The second heat transfer member 24 is a member that transfers the heat generated in the second heat generating component 22 to the first substrate 10 (see Figure 6 (c) and Figure 6(d) The second heat transfer member 24 is a substantially columnar member connected to the second heat generating component 22 and the first substrate 10 so as to be able to exchange heat with each other, and the main portion thereof is integrally formed.

[0050] Here, use Figure 6 (d) illustrates heat transfer (heat dissipation) associated with the second heat-generating component 22 in the electronic module 1. The second heat-generating component 22 is disposed on the second substrate 20. Therefore, heat generated by the second heat-generating component 22 is dissipated outside the electronic module 1 via the second substrate 20 (see arrow H3).

[0051] The electronic module 1 includes a second heat transfer member 24 that transfers heat generated by the second heat-generating component 22 to the first substrate 10. Therefore, heat generated by the second heat-generating component 22 is dissipated outside the electronic module 1 through a path through the second heat transfer member 24 and the first substrate 10, separately from the path through the second substrate 20 (see arrow H4).

[0052] The second heat transfer member 24 is made of a conductive material and is electrically connected to the electrode of the second heat generating component 22. In other words, the second heat transfer member 24 can be said to also have the function of an internal connection terminal of a member that exists inside the electronic module 1 and is used for electrical exchange. The second heat transfer member 24 is electrically connected to the second source electrode (second first electrode) 22a. The electronic module 1 and the second heat generating component 22 have three second source electrodes 22a and are provided with three second heat transfer members 24 correspondingly. In addition, the end of the second heat transfer member 24 on the opposite side to the second heat generating component 22 is connected to the wiring pattern of the first substrate 10.

[0053] The second spacer 25 is made of a conductive material and is a tray-shaped member interposed between the second source electrode 22a of the second heat-generating component 22 and the second heat transfer member 24. Although not shown, the second source electrode 22a and the second spacer 25 are joined by a conductive bonding material (e.g., solder). Furthermore, the second spacer 25 and the second heat transfer member 24 are also joined by a conductive bonding material.

[0054] The second internal connection terminal 26 is a member that exists inside the electronic module 1 and is used for electrical exchange. The second internal connection terminal 26 is electrically connected to the second gate electrode 22b of the second heat generating component 22 and the external connection terminal 36.

[0055] The external connection terminals 30, 32a, 32b, 34, 35, 36, and 37 are electrically connected to the components of the electronic module 1 between the first substrate 10 and the second substrate 20, and are components with at least one end exposed to the outside of the molded resin 40. The external connection terminal 30 is a detection terminal for the first source electrode 12a of the first heat-generating component 12. The external connection terminal 32a is a power terminal corresponding to large currents. The external connection terminal 32b is a detection terminal for the second source electrode 22a of the second heat-generating component 22. In addition, the external connection terminals 32a and 32b are integral components.

[0056] The external connection terminal 34 is a power terminal electrically connected to the support member 18. The external connection terminal 35 is a control terminal electrically connected to the first internal connection terminal 16. The external connection terminal 36 is a control terminal electrically connected to the second internal connection terminal 26. The external connection terminal 37 is a power terminal electrically connected to the support member 28.

[0057] The mold resin 40 seals the surface of the first substrate 10 on the side where the first heat generating component 12 is arranged and the first heat generating component 12 (see Figure 1 and Figure 2 ) In addition, the mold resin 40 also seals the surface of the second substrate 20 on the side where the second heat generating component 22 is arranged and the second heat generating component 22 .

[0058] 2. Embodiments of the electronic module manufacturing method

[0059] The following describes a method for manufacturing an electronic module according to an embodiment. This method is used to manufacture the electronic module 1 according to this embodiment and includes a preparation step S10, a placement step S20, and a molding step S30. Furthermore, the method for manufacturing an electronic module according to this embodiment may include steps other than those described above. Each step is described below.

[0060] The preparation step S10 is a step of preparing an unsealed electronic module 1a including a first substrate 10, a first heat generating component 12, a second substrate 20, and support members 18 and 28 (see Figure 8 (a)) The above-mentioned components are the minimum components, and the unsealed electronic module 1 a of the present embodiment includes all components of the electronic module 1 except the mold resin 40 .

[0061] Furthermore, the unpackaged electronic module 1a prepared in preparation step S10 may include components that differ in shape and configuration from those included in the electronic module 1. For example, the external connection terminals 30, 32a, 32b, 34, 35, 36, and 37 in preparation step S10 may be fully or partially integrated with a frame member (not shown). In this case, the external connection terminals 30, 32a, 32b, 34, 35, 36, and 37 must be removed from the frame member in a step subsequent to molding step S30.

[0062] The placement step S20 includes a step of placing the unsealed electronic module 1a in a mold (not shown). In the placement step S20, a pressing force is applied to a portion of the first heat dissipation surface 11 corresponding to the back side of the portion where the first substrate 10 contacts the support members 18 and 28, and a portion of the second heat dissipation surface 21 corresponding to the back side of the portion where the second substrate 20 contacts the support members 18 and 28 (hereinafter referred to as a "pressing portion"), so that the first heat dissipation surface 11 and the second heat dissipation surface 21 are in close contact with the mold (see FIG. Figure 8 (b)).

[0063] In addition, the above-mentioned pressing portion is a portion to which a high pressing force should be applied (a portion that can withstand a high pressing force), and the above description does not exclude the possibility that a pressing force is applied to portions other than the pressing portion of the first heat dissipation surface 11 and the second heat dissipation surface 21 or that a pressing force is inevitably applied. Therefore, when performing the configuration step S20, Figure 8 As in (b), pressing force may be applied to each pressing portion, or to a linear or planar region including a plurality of pressing portions, or a combination thereof.

[0064] The molding step S30 is a step of injecting resin into a molding die to form a molded resin 40 ( Figure 8 (c)) The electronic module 1 may be manufactured by performing the molding step S30.

[0065] 3. Effects of the Electronic Module 1 and the Method for Manufacturing the Electronic Module According to the Embodiment

[0066] Hereinafter, effects of the electronic module 1 and the method for manufacturing the electronic module according to the present embodiment will be described.

[0067] The electronic module 1 of this embodiment includes a second substrate 20, which is separated from the first substrate 10 and the first heat-generating component 12, on the side of the first substrate 10 where the first heat-generating component 12 is located. Furthermore, the first heat dissipation surface 11, which is the surface of the first substrate 10 opposite to the side where the first heat-generating component 12 is located, and the second heat dissipation surface 21, which is the surface of the second substrate 20 opposite to the first substrate 10, are exposed to the outside of the electronic module 1. Therefore, the electronic module 1 of this embodiment can dissipate heat from two sides, thereby achieving improved heat dissipation compared to conventional electronic modules.

[0068] Furthermore, the electronic module 1 of this embodiment includes support members 18 and 28 disposed between and in contact with the first and second substrates 10 and 20. During manufacturing, the electronic module 1 of this embodiment applies pressure to the sides of the first substrate 10 opposite to the contact with the support members 18 and 28, and to the sides of the second substrate 20 opposite to the contact with the support members 18 and 28, bringing the first and second heat dissipation surfaces 11 and 21 into close contact with the molding die. Consequently, the electronic module 1 of this embodiment can prevent resin from adhering to the heat dissipation surfaces of the substrates.

[0069] Therefore, the electronic module 1 of the present embodiment can improve heat dissipation performance compared to conventional electronic modules, and is an electronic module capable of suppressing adhesion of resin to the heat dissipation surface of the substrate.

[0070] Furthermore, the electronic module 1 of this embodiment includes a first heat transfer member 14 that transfers heat generated by the first heat-generating component 12 to the second substrate 20. Therefore, according to the electronic module 1 of this embodiment, heat generated by the first heat-generating component 12 can be dissipated not only through the first substrate 10 but also through the second substrate 20 via the first heat transfer member 14.

[0071] Furthermore, the electronic module 1 of this embodiment includes two or more support members 18, 28, and the ends of at least two of the support members 18, 28 on the first substrate 10 side contact the outer peripheral region. Therefore, according to the electronic module 1 of this embodiment, by arranging the support members 18, 28 outside the first substrate 10, the first substrate 10 and the second substrate 20 can be stably supported during manufacturing.

[0072] Furthermore, in the electronic module 1 according to this embodiment, the support members 18 and 28 are made of a conductive material and are electrically connected to other components of the electronic module 1. Therefore, according to the electronic module 1 according to this embodiment, the support members 18 and 28 can be used for electrical exchange within the electronic module 1, and the functions can be concentrated to achieve miniaturization of the electronic module 1.

[0073] Furthermore, the electronic module 1 of this embodiment includes a second heat-generating component 22 disposed on the surface of the second substrate 20 on the first substrate 10 side. Therefore, the electronic module 1 of this embodiment can also be configured with the second heat-generating component 22 on the second substrate 20, thereby increasing mounting density. Furthermore, the electronic module 1 of this embodiment can further improve heat dissipation by distributing the first heat-generating component 12 and the second heat-generating component 22 across the first substrate 10 and the second substrate 20.

[0074] Furthermore, the electronic module 1 of this embodiment includes a second heat transfer member 24 that transfers heat generated by the second heat-generating component 22 to the first substrate 10. Therefore, according to the electronic module 1 of this embodiment, heat generated by the second heat-generating component 22 can be dissipated not only through the second substrate 20 but also through the first substrate 10 via the second heat transfer member 24.

[0075] Furthermore, in the electronic module 1 of this embodiment, the first substrate 10 and the second substrate 20 are formed by placing copper plates on both sides of a ceramic plate. Therefore, the electronic module 1 of this embodiment can further improve heat dissipation by using substrates having high thermal conductivity.

[0076] The manufacturing method of the electronic module of the embodiment includes: a preparation step S10 of preparing an unsealed electronic module 1a having a first substrate 10, a first heat-generating component 12, a second substrate 20, and support members 18 and 28. In addition, the manufacturing method of the electronic module of the embodiment includes a configuration step of placing the unsealed electronic module 1a in a molding die, applying a pressing force to a portion of the first heat dissipation surface 11 corresponding to the back side of the portion where the first substrate 10 contacts the support members 18 and 28, and a portion of the second heat dissipation surface 21 corresponding to the back side of the portion where the second substrate 20 contacts the support members 18 and 28, so that the first heat dissipation surface 11 and the second heat dissipation surface 21 are in close contact with the molding die. Therefore, the manufacturing method of the electronic module of the present embodiment is a manufacturing method for an electronic module 1 that can improve heat dissipation compared to conventional electronic modules and can suppress the adhesion of resin to the heat dissipation surface of the substrate.

[0077] The present invention has been described above based on the above embodiment, but the present invention is not limited to the above embodiment and can be implemented in various forms within the scope of the present invention. For example, the following modifications are possible.

[0078] (1) The shape, number, size, position, etc. of the components of the present invention are not limited to those described above or shown in the drawings, and may be modified as appropriate without impairing the characteristics of the present invention.

[0079] For example, in the above embodiment, the number of the first heat generating component 12 is one, but the present invention is not limited thereto. The number of the first heat generating component may be multiple. The above matters also apply to the second heat generating component.

[0080] As another example, in the above embodiment, the number of support members 18 and 28 is three, respectively. However, the present invention is not limited to this. While the total number of support members is preferably two or more, the present invention is also applicable even with a single support member. Furthermore, the arrangement and shape of support members 18 and 28 in the above embodiment are merely illustrative and can be appropriately determined based on the structure of the electronic module.

[0081] (2) The electronic module of the present invention may further include a heat-generating component other than the first heat-generating component (a heat-generating component without a corresponding first heat transfer member) and other structures on the first substrate. Furthermore, the electronic module of the present invention may further include a heat-generating component other than the second heat-generating component (a heat-generating component without a corresponding second heat transfer member) and other structures on the second substrate.

[0082] (3) The electronic module according to the present invention may not include the second heating member.

[0083] (4) The electronic module of the present invention may not include the first heat transfer member. In addition, the electronic module of the present invention may not include the second heat transfer member when it does not include the second heat generating component.

[0084] (5) The electronic module of the present invention may not include the first spacer and the second spacer.

[0085] (6) The functions of the external connection terminals 30, 32a, 32b, 34, 35, 36, and 37 described in the above embodiment are examples, but the present invention is not limited thereto. The function of each external connection terminal can be appropriately set according to the structure of the electronic module.

[0086] (7) As the first heat-generating component of the electronic module of the present invention, a heat-generating component other than a vertical MOSFET may be used. Examples of heat-generating components other than a vertical MOSFET include electronic components other than a vertical MOSFET (diodes, transistors, thyristors, etc.), resistors, coils, and capacitors. The same applies to the second heat-generating component.

[0087] Explanation of symbols

[0088] 1…electronic module; 1a…unpackaged electronic module; 10…first substrate; 11…first heat dissipation surface; 12…first heat generating component; 14…first heat transfer member; 18, 28…support member; 20…second substrate; 21…second heat dissipation surface; 22…second heat generating component; 24…second heat transfer member; 40…molded resin.

Claims

1. An electronic module comprising: a first substrate; A first heat-generating component is disposed on the first substrate; and a molded resin for sealing the surface of the first substrate on the side where the first heat-generating component is disposed and the first heat-generating component, characterized in that it further comprises: a second substrate disposed on a side of the first substrate where the first heat-generating component is disposed, in a state separated from the first substrate and the first heat-generating component; and a supporting member disposed between the first substrate and the second substrate and in contact with both the first substrate and the second substrate; The first heat dissipation surface of the first substrate opposite to the side where the first heat generating component is arranged and the second heat dissipation surface of the second substrate opposite to the first substrate side are exposed to the outside of the electronic module.

2. The electronic module according to claim 1, wherein: Further including: The first heat transfer member transfers heat generated by the first heat generating component to the second substrate.

3. The electronic module according to claim 1, wherein: The electronic module includes two or more supporting members. When the electronic module is viewed from above with respect to the surface of the first substrate on which the first heat-generating component is disposed, the outer edge thereof is formed into a rectangular shape, the electronic module has a center of gravity common to the center of gravity of the first substrate, and an area where the outer edge and a point of the first heat-generating component farthest from the center of gravity of the first substrate are connected is defined as a central area, and an area outside the central area is defined as a peripheral area. Ends of at least two of the supporting members on the first substrate side are in contact with the outer peripheral region.

4. The electronic module according to claim 1, wherein: Further including: The support member is made of a conductive material and is electrically connected to other components of the electronic module.

5. The electronic module according to claim 1, characterized in that Further including: The second heat-generating component is disposed on a surface of the second substrate on the first substrate side.

6. The electronic module according to claim 5, characterized in that Further including: The second heat transfer member transfers heat generated by the second heat-generating component to the first substrate.

7. The electronic module according to claim 1, wherein: The first substrate and the second substrate are formed by placing copper plates on both surfaces of a ceramic plate.

8. A method for manufacturing an electronic module, for manufacturing the electronic module according to claim 1, characterized in that: include: a preparation step of preparing an unsealed electronic module including the first substrate, the first heat-generating component, the second substrate, and the support member; a placement step of placing the unsealed electronic module in a molding die, applying a pressing force to a portion of the first heat dissipation surface corresponding to a backside of a portion where the first substrate contacts the support member, and to a portion of the second heat dissipation surface corresponding to a backside of a portion where the second substrate contacts the support member, so that the first heat dissipation surface and the second heat dissipation surface are in close contact with the molding die; as well as In the molding step, resin is injected into the molding die to form the molding resin.

Images