Soldering flux dipping method and soldering flux dipping machine

Abstract

The invention relates to the technical field of integrated circuits, in particular to a soldering flux dipping method and a soldering flux dipping machine table. A soldering flux dipping method comprises the steps that a soldering flux dipping machine table is provided, a groove is formed in the soldering flux dipping machine table, and the groove is used for containing soldering flux; a soldering flux is put into the groove; a target chip is provided, the first surface of the target chip is provided with a solder ball, and the solder ball has a first height; and the solder ball of the target chip is immersed in the groove to dip the soldering flux, so that the soldering flux on the surface of the solder ball has a second height, and the ratio of the second height to the first height is 20%-35%. In the application, the ratio of the second height to the first height is set to be 20%-35%, so that the capillary action between the soldering flux and the solder ball is reduced, the probability that the soldering flux remains between the two welding parts to be welded is further improved, the binding force between the two welding parts to be welded is increased, and the probability that the soldering flux remains between the two welding parts to be welded in the transportation process is reduced. And the probability of deviation of the chip product is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of integrated circuits, and in particular to a method for dipping a soldering flux and a soldering flux dipping machine. Background Art

[0002] Flux is a chemical substance used in soldering to aid and promote the soldering process. In the atmosphere, the surface of the base metal being soldered is often covered with an oxide film, which prevents the solder from wetting the base metal, affecting soldering quality. Flux dissolves the oxide film on the base metal, allowing for full contact between the solder and the base metal, ensuring smooth soldering.

[0003] As chip products evolve, their aspect ratios tend to become larger. Consequently, weak bonding strength often occurs in the soldering areas of chip products, causing them to shift during transport and affecting their normal use. Summary of the Invention

[0004] Based on this, it is necessary to provide a flux dipping method and a flux dipping machine to address the problem of weak bonding strength often occurring in the welding area of chip products in the prior art.

[0005] In order to achieve the above object, on the one hand, a method for dipping soldering flux is provided, the method comprising:

[0006] A flux dipping machine is provided, wherein the flux dipping machine is provided with a groove for holding the flux;

[0007] placing the soldering flux into the groove;

[0008] Providing a target chip, wherein a solder ball is provided on a first surface of the target chip, and the solder ball has a first height;

[0009] The solder ball of the target chip is immersed in the groove to be dipped in the soldering flux, so that the soldering flux on the surface of the solder ball has a second height, and the ratio of the second height to the first height is between 20% and 35%.

[0010] In one embodiment, before immersing the solder ball of the target chip into the groove to dip into the soldering flux, the method includes:

[0011] A scraping member is used to scrape the soldering flux in the groove at a preset scraping cycle, wherein the preset scraping cycle is between 500s and 1000s.

[0012] In one embodiment, before immersing the solder ball of the target chip into the groove to dip into the soldering flux, the method includes:

[0013] The solder balls are inspected.

[0014] In one embodiment, providing a target chip includes:

[0015] A welding head assembly is used to pick up the target chip from the second surface of the target chip, where the second surface is arranged opposite to the first surface. The welding head assembly includes a first picking member, a connecting rod and a second picking member. The first picking member is used to contact the second surface of the target chip, and the surface of the first picking member in contact with the second surface has a first side length. The second picking member is used to connect a vacuum interface, and the connecting rod is used to connect the first picking member and the second picking member. The dimension value of the connecting rod in a direction perpendicular to the extension direction is not less than the product of the first side length and a preset ratio.

[0016] In one aspect, a flux dipping machine is provided, comprising:

[0017] substrate;

[0018] A groove is located on the substrate, the groove is used to hold flux, and the solder ball of the target chip is dipped in the flux in the groove and then flipped. The solder ball has a first height, and the groove has a preset depth. The ratio of the preset depth to the first height is between 20% and 35%.

[0019] In one embodiment, the bottom surface of the groove includes a flat surface or a convex surface, and the convex surface protrudes in a direction away from the bottom surface of the groove.

[0020] In one embodiment, the flux dipping machine includes:

[0021] a scraper, the scraper being used to scrape the soldering flux in the groove at a preset scraping cycle, wherein the preset scraping cycle is between 500s and 1000s;

[0022] and / or;

[0023] The inspection member is used to inspect the solder balls of the target chip before the solder balls are dipped into the soldering flux.

[0024] In one embodiment, the flux dipping machine includes:

[0025] A welding head assembly, the welding head assembly is used to pick up the target chip, the welding head assembly includes a first picking member, a connecting rod and a second picking member, the first picking member is used to contact the target chip, the surface of the first picking member in contact with the target chip has a first side length, the second picking member is used to connect the vacuum interface, the connecting rod is used to connect the first picking member and the second picking member, and the dimension value of the connecting rod in the direction perpendicular to the extension direction is not less than the product of the first side length and a preset ratio.

[0026] In one embodiment, the orthographic projection of the connecting rod on the first picking member is located within the orthographic projection of the first picking member.

[0027] In one embodiment, the connecting rod comprises a cylinder.

[0028] The flux dipping method and flux dipping machine of the present application have the following beneficial effects: by setting the ratio of the second height to the first height between 20%-35%, the capillary action between the flux and the solder ball is reduced, thereby increasing the probability of the flux remaining between the two welding parts to be welded, thereby increasing the bonding strength between the two welding parts to be welded, and reducing the probability of chip products being offset during transportation. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0030] Figure 1 It is a solder ball diagram in the related art;

[0031] Figure 2 is a flow chart of a flux dipping method provided in one embodiment;

[0032] Figure 3 A schematic diagram of a flux dipping machine provided in one embodiment;

[0033] Figure 4 A schematic diagram of a solder ball provided in one embodiment;

[0034] Figure 5 A schematic diagram of a solder ball provided in another embodiment;

[0035] Figure 6 A photograph of a solder ball provided in one embodiment;

[0036] Figure 7This is a photograph of a flux dipping machine provided in one embodiment;

[0037] Figure 8 is a schematic diagram of a welding head assembly provided in one embodiment;

[0038] Figure 9 A photograph of a welding head assembly provided in one embodiment;

[0039] Figure 10 A schematic diagram of a target chip provided in one embodiment;

[0040] Figure 11 A statistical graph of test results provided in one embodiment.

[0041] Description of reference numerals: target chip 100 ; solder ball 110 ; soldering head assembly 120 ; first pickup member 121 ; connecting rod 122 ; second pickup member 123 ; solder flux dipping machine 200 ; groove 210 ; solder flux 220 .

[0042] In order to better describe and illustrate the embodiments and / or examples of the inventions disclosed herein, reference may be made to one or more of the accompanying drawings. The additional details or examples used to describe the accompanying drawings should not be considered to limit the scope of the disclosed inventions, the presently described embodiments and / or examples, and any of the best modes currently understood for these inventions. DETAILED DESCRIPTION

[0043] To facilitate understanding of the present application, a more comprehensive description of the present application will be provided below with reference to the accompanying drawings. The drawings illustrate preferred embodiments of the present application. However, the present application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present disclosure.

[0044] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application.

[0045] In each embodiment, unless otherwise specified or limited, the terms "installed," "connected," "connected," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two elements, or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in each embodiment based on the specific circumstances.

[0046] It should be understood that when an element or layer is referred to as being "on, adjacent to, connected to, or coupled to" another element or layer, it may be directly on, adjacent to, connected to, or coupled to the other element or layer, or there may be intervening elements or layers. In contrast, when an element is referred to as being "directly on, directly adjacent to, directly connected to, or directly coupled to" another element or layer, there may be no intervening elements or layers. It should be understood that although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers, doping types, and / or portions, these elements, components, regions, layers, doping types, and / or portions should not be limited by these terms. These terms are merely used to distinguish one element, component, region, layer, doping type, or portion from another element, component, region, layer, doping type, or portion. Therefore, without departing from the teachings of the present embodiment, the first element, component, region, layer, doping type, or portion discussed below may be represented as a second element, component, region, layer, or portion.

[0047] Spatially relative terms such as "below," "beneath," "beneath," "above," "above," etc., may be used herein to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that in addition to the orientations shown in the figures, spatially relative terms also include different orientations of the device in use and operation. For example, if the device in the drawings is turned over, an element or feature described as "below" or "beneath" or "beneath" the other elements will be oriented "above" the other elements or features. Thus, the exemplary terms "below" and "below" can include both the above and below orientations. In addition, the device can also include alternative orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptors used herein are to be interpreted accordingly.

[0048] As used herein, the singular forms "a," "an," and "the" may also include the plural forms, unless the context clearly indicates otherwise. It should also be understood that when the terms "comprising" and / or "including" are used in this specification, they may specify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. At the same time, when used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0049] While embodiments of the present invention are described herein with reference to schematic diagrams that represent idealized embodiments (and intermediate structures) of the present invention, variations from the illustrated shapes due to, for example, manufacturing techniques and / or tolerances are to be expected. Accordingly, embodiments of the present invention should not be limited to the specific shapes of regions illustrated herein but are intended to encompass deviations in shapes due to, for example, manufacturing techniques. The regions shown in the figures are schematic in nature, and their shapes do not represent the actual shapes of regions of a device and do not limit the scope of the embodiments of the present invention.

[0050] See also Figure 1 As mentioned in the background, chip products often experience weak bonding in the soldering area. The inventors discovered that when solder balls are dipped in flux for soldering, the flux backflows through capillary action, resulting in less flux on top of the solder balls. This, in turn, weakens the bonding area and causes insufficient adhesion, leading to chip product misalignment during transfer.

[0051] Based on this, in one embodiment, see Figure 2 , providing a method for dipping the soldering flux 220. The method for dipping the soldering flux 220 comprises the following steps:

[0052] Step S100 : providing a flux 220 dipping machine 200 , wherein the flux 220 dipping machine 200 is provided with a groove 210 for containing the flux 220 .

[0053] Step S200 : placing soldering flux 220 into the groove 210 .

[0054] Step S300 : providing a target chip 100 , wherein a solder ball 110 is disposed on a first surface of the target chip 100 , and the solder ball 110 has a first height.

[0055] Step S600 : immersing the solder ball 110 of the target chip 100 into the groove 210 to dip in the solder flux 220 , so that the solder flux 220 on the surface of the solder ball 110 has a second height, and the ratio of the second height to the first height is between 20% and 35%.

[0056] In step S100, refer to Figure 3 As an example, the groove 210 (Cavity) may have a preset depth, which may be 17.5 μm. The preset depth of the groove 210 is merely an example. In actual embodiments, the preset depth of the groove 210 is not limited to the above data.

[0057] Furthermore, the bottom surface of the groove 210 (Cavity Dip Plate) can be a flat surface or a convex surface. In one possible example, when the bottom surface of the groove 210 is a convex surface, the convex surface can be raised in a direction away from the bottom surface of the groove 210. This embodiment does not limit the size of the bottom surface of the groove 210.

[0058] In step S200, refer to Figure 3 The actual controlled liquid level depth of the soldering flux 220 in the groove 210 can be between 9 μm and 11 μm. The above-mentioned actual controlled liquid level depth of the soldering flux 220 is only for illustrative purposes. In actual embodiments, the actual controlled liquid level depth of the soldering flux 220 is not limited to the above-mentioned data.

[0059] As an example, the soldering flux 220 may be an organic soldering flux 220 . For example, the soldering flux 220 may contain an organic acid component, such as lactic acid, citric acid, resin, and the like.

[0060] In step S300, the target chip 100 has a first surface and a second surface opposite to each other, and the first surface may be provided with a plurality of solder balls 110. As an example, the material of the solder balls 110 may include tin or the like.

[0061] The solder ball 110 may have a first height. As an example, the first height may be greater than the actual controlled liquid level of the soldering flux 220 in the groove 210 , or the first height may be greater than a preset depth of the groove 210 .

[0062] In step S600, refer to Figure 4 , the solder ball 110 of the target chip 100 can be immersed in the groove 210 to be dipped in the flux 220. At this time, the surface of the solder ball 110 will be covered with the flux 220. The flux 220 on the surface of the solder ball 110 can have a second height. As an example, the ratio of the second height to the first height is between 20% and 35%. For example, the ratio of the second height to the first height can be 25%.

[0063] Furthermore, the force of dipping the flux can be controlled to be F (F is controlled by parameters such as speed, F can be obtained through experiments, and F is related to the type of flux, flux depth, type of target chip, and size of solder balls).

[0064] In this embodiment, the ratio of the second height to the first height is set between 20% and 35%, thereby reducing the capillary action between the flux 220 and the solder ball 110 (such as Figure 5 As shown), the probability of the flux 220 remaining between the two welding parts to be welded is increased, thereby increasing the bonding force between the two welding parts to be welded and reducing the probability of the chip product shifting during transportation.

[0065] For details, please refer to Figure 6 After using the flux dipping method provided in this application, the solder balls after welding are clear and regular.

[0066] In a possible example, before step S600, the following steps are included:

[0067] Step S400: scraping the soldering flux 220 in the groove 210 using a scraper at a preset scraping cycle, where the preset scraping cycle is between 500s and 1000s.

[0068] The scraper can be arranged corresponding to the groove 210. As an example, the height of the scraper can be consistent with the preset depth of the groove 210, and the shape of the bottom of the scraper can be consistent with the shape of the bottom of the groove 210. As an example, the preset scraping cycle of the scraper can be 600s.

[0069] In this example, the preset scraping cycle / frequency of the scraping member is increased to prevent the flux 220 from drying out, which would reduce the adhesion and thus affect the welding.

[0070] Also, see Figure 7 When dipping, the machine can confirm that there is no abnormal sound, ripples, drawing, glue leakage, etc. on the scraper. The flatness of the machine can be tightened to 2μm. The nuts of the bite parts of the scraper are fixed in the tightest bite state to prevent glue leakage.

[0071] In another possible example, before step S600, the following steps are included:

[0072] Step S500 : inspecting the solder balls 110 .

[0073] As an example, inspection light may be used to illuminate the solder ball 110. When it is found that the solder ball 110 is not positioned correctly or the target chip 100 is not positioned correctly, an alarm signal may be issued for manual review or correction.

[0074] In this example, by first inspecting the solder ball 110 and then dipping the solder ball 110 of the target chip 100 into the groove 210 to pick up the flux 220, it is avoided that the flux 220 on the surface of the solder ball 110 dries up during the inspection time or after the alarm signal is issued, resulting in a decrease in adhesion.

[0075] In one embodiment, step S300 includes:

[0076] Step S310: Using the welding head assembly 120, the target chip 100 is picked up from the second surface of the target chip 100. The second surface is arranged opposite to the first surface. The welding head assembly 120 includes a first pickup member 121, a connecting rod 122, and a second pickup member 123. The first pickup member 121 is used to contact the second surface of the target chip 100. The surface of the first pickup member 121 in contact with the second surface has a first side length. The second pickup member 123 is used to connect to the vacuum interface. The connecting rod 122 is used to connect the first pickup member 121 and the second pickup member 123. The dimension of the pickup member in a direction perpendicular to the extension direction is not less than the product of the first side length and a preset ratio.

[0077] See also Figure 8 and Figure 9 The bonding head assembly 120 includes a first pickup member 121, a connecting rod 122, and a second pickup member 123. The first pickup member 121 can be a hard tip, while the second pickup member 123 can connect to the vacuum port on the bonding head arm. When the bonding head assembly 120 picks up a target chip 100, the vacuum port applies negative pressure to the target chip 100 via the second pickup member 123, thereby sucking the target chip 100 into the bonder.

[0078] The connecting rod 122 is used to connect the first picking member 121 and the second picking member 123. The dimension of the first picking member 121 in a direction perpendicular to the extension direction of the connecting rod 122 is not less than the product of the first side length and a preset ratio. As an example, the preset ratio may be 50%. Furthermore, when the surface where the first picking member 121 contacts the second surface has a long side and a short side, the first side length may be the long side.

[0079] In one possible example, the orthographic projection of the connecting rod 122 on the first pickup member 121 is located within the orthographic projection of the first pickup member 121. In this case, the connecting rod 122 does not extend beyond the surface of the first pickup member 121 in contact with the second surface, thereby preventing the connecting rod 122 from damaging the target chip 100. In another possible example, the connecting rod 122 may comprise a cylinder to avoid stress concentration. Specifically, the diameter of the connecting rod 122 may be 12 mm.

[0080] In this embodiment, the size of the connecting rod 122 of the bonding head assembly 120 is set so that the solder balls 110 on the target chip 100 are evenly stressed during bonding (e.g. Figure 10 As shown), the soldering flux 220 can also be distributed more evenly when the solder balls 110 on the target chip 100 are dipped in the soldering flux 220.

[0081] Based on the same inventive concept, in one embodiment, a flux 220 dipping machine 200 is provided. The flux 220 dipping machine 200 can employ the flux 220 dipping method provided in any of the aforementioned embodiments and combinations thereof. The flux 220 dipping machine 200 can include a base and a recess 210.

[0082] The substrate can be used to support the soldering flux 220 to be dipped into the multiple structures on the platform 200 .

[0083] The soldering flux 220 dipping machine 200 is provided with a groove 210 for holding the soldering flux 220. As an example, the soldering flux 220 may be an organic soldering flux 220, for example, the soldering flux 220 may contain an organic acid component, such as lactic acid, citric acid, resin, and the like.

[0084] The groove 210 may have a preset depth, which may be 17.5 μm. The preset depth of the groove 210 is only for illustrative purposes. In practical embodiments, the preset depth of the groove 210 is not limited to the above data.

[0085] The solder ball 110 of the target chip 100 can be dipped into the solder flux 220 in the groove 210 and then flip-chip mounted. At this point, the solder ball 110 has a first height, and the groove 210 has a predetermined depth. The predetermined depth can be less than the first height. Furthermore, the ratio of the predetermined depth to the first height is between 20% and 35%.

[0086] Furthermore, the actual controlled liquid level depth of the soldering flux 220 in the groove 210 may be between 9 μm and 11 μm. The above-mentioned actual controlled liquid level depth of the soldering flux 220 is only for illustrative purposes. In actual embodiments, the actual controlled liquid level depth of the soldering flux 220 is not limited to the above-mentioned data.

[0087] After solder ball 110 is dipped in flux 220, flux 220 on the surface of solder ball 110 may have a second height. As an example, the ratio of the second height to the first height is between 20% and 35%. For example, the ratio of the second height to the first height may be 25%.

[0088] In this embodiment, by setting the preset depth of the groove 210 to be smaller than the first height of the solder ball 110, the ratio of the second height of the flux 220 on the surface of the solder ball 110 to the first height can be controlled between 20% and 35%, thereby reducing the capillary action between the flux 220 and the solder ball 110, thereby increasing the probability of the flux 220 remaining between the two welding parts to be welded, thereby increasing the bonding strength between the two welding parts to be welded, and reducing the probability of the chip product being offset during transportation.

[0089] In one embodiment, the bottom surface of the groove 210 includes a flat surface or a convex surface, and the convex surface is raised in a direction away from the bottom surface of the groove 210 .

[0090] When the solder balls 110 of the target chip 100 are dipped into the solder flux 220, the solder balls 110 corresponding to the connecting rods 122 (the solder balls 110 near the center) are subjected to greater pressure, causing the solder balls 110 corresponding to the connecting rods 122 (the solder balls 110 near the center) to receive more solder flux 220, while the solder balls 110 near the edges receive less solder flux 220, resulting in uneven distribution of the solder flux 220. In this embodiment, by configuring the bottom surface of the recess 210 to be convex, solder balls 110 located in different areas can all receive sufficient solder flux 220, thereby improving soldering quality.

[0091] In one embodiment, the flux 220 dipping machine 200 includes a squeegee and / or an inspection member.

[0092] The scraper is used to scrape the solder flux 220 in the groove 210 at a preset scraping cycle. The scraper can be arranged corresponding to the groove 210. As an example, the height of the scraper can be consistent with the preset depth of the groove 210, and the shape of the bottom of the scraper can be consistent with the shape of the bottom of the groove 210.

[0093] The preset scraping cycle can be between 500s and 1000s. As an example, the preset scraping cycle of the scraping member for scraping glue can be 600s.

[0094] The inspection member is used to inspect the solder balls 110 of the target chip before the solder balls 110 are dipped into the solder flux 220. As an example, the inspection member may emit an inspection light.

[0095] First, in this embodiment, by increasing the preset scraping cycle / frequency of the scraping member, the flux 220 is prevented from drying out, which would reduce adhesion and thus affect soldering. Second, in this embodiment, by first inspecting the solder balls 110 and then dipping the solder balls 110 of the target chip 100 into the recess 210 to dip in the flux 220, the flux 220 on the surface of the solder balls 110 is prevented from drying out during the inspection period or after the alarm signal is issued, which would reduce adhesion.

[0096] In one embodiment, the flux 220 dipping tool 200 includes a bonding head assembly 120 .

[0097] The welding head assembly 120 can pick up the target chip 100. Specifically, the welding head assembly 120 includes a first pickup member 121, a connecting rod 122, and a second pickup member 123. The first pickup member 121 is used to contact the target chip 100. The surface of the first pickup member 121 in contact with the target chip 100 has a first side length. The second pickup member 123 is used to connect to the vacuum interface. As an example, the first pickup member 121 can be a hard tip, and the second pickup member 123 can be connected to the vacuum interface of the machine bonding head arm. When using the welding head assembly 120 to pick up the target chip 100, the vacuum interface can provide negative pressure to the target chip 100 via the second pickup member 123, thereby sucking the target chip 100.

[0098] The connecting rod 122 is used to connect the first picking member 121 and the second picking member 123. The dimension of the connecting rod 122 in a direction perpendicular to the extension direction is not less than the product of the first side length and a preset ratio. As an example, the preset ratio can be 50%. Furthermore, when the surface where the first picking member 121 contacts the second surface has a long side and a short side, the first side length can be the long side.

[0099] In one possible example, the orthographic projection of the connecting rod 122 on the first pickup member 121 is located within the orthographic projection of the first pickup member 121. In this case, the connecting rod 122 does not extend beyond the surface of the first pickup member 121 in contact with the second surface, thereby preventing the connecting rod 122 from damaging the target chip 100. In another possible example, the connecting rod 122 may include a cylinder to avoid stress concentration.

[0100] In this embodiment, the size of the connecting rod 122 of the welding head assembly 120 is set so that the solder balls 110 on the target chip 100 are evenly stressed during bonding, and the flux 220 is evenly distributed when the solder balls 110 on the target chip 100 are dipped in the flux 220.

[0101] See also Figure 11 , using a flux dipping machine formed by one or more embodiments and combinations thereof in this application to test multiple series of target chips. The tests showed that after using the flux dipping machine provided by this application, the failure rate of solder balls 110 was reduced, indicating that the yield rate of solder balls 110 of the target chips was significantly improved.

[0102] project condition Flip number <![CDATA[180 。 Number of surviving particles]]> Number of drops Flip survival rate Flux coverage 1 CPU+17.5+200+connecting rod in traditional technology+flux card control The actual liquid level depth is 9μm~11μm 40 40 0 100% B~D 2 CPU+17.5+400+connecting rod in traditional technology+flux card control The actual liquid level depth is 9μm~11μm 40 37 3 93% B~D 3 CPU+17.5+600+connecting rod in traditional technology+flux card control The actual liquid level depth is 9μm~11μm 40 27 13 68% 0~D 4 CPU+17.5+200+connecting rod provided in this application+flux card control actual liquid level depth is 9μm~12μm 30 30 0 100% C~D 5 CPU+17.5+400+connecting rod provided in this application+flux card control actual liquid level depth is 9μm~12μm 12 12 0 100% C~D 6 CPU+17.5+200+200+connecting rod provided by this application+flux card control actual liquid level depth is 9μm~12μm 16 16 0 100% C~D

[0103] Please refer to the table above, which shows the target chip 100 under different solder flux dipping conditions. As can be seen from the table, when the soldering head assembly 120 provided by the present application is used, the flip survival rate can reach a stable 100%.

[0104] It should be understood that although Figure 2 The steps in the flowchart are shown in sequence as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified in this document, there is no strict order restriction for the execution of these steps, and these steps can be executed in other orders. In addition, Figure 2 At least part of the steps may include multiple steps or multiple stages. These steps or stages are not necessarily performed at the same time, but can be performed at different times. The order of execution of these steps or stages is not necessarily one by one, but can be performed in turn or alternately with other steps or at least part of the steps or stages in other steps.

[0105] In the description of this application, the reference terms "some embodiments", "other embodiments", "ideal embodiments", etc. mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this application, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. It should be understood that "this embodiment" or "one embodiment" mentioned throughout the specification means that the specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment.

[0106] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features of the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of the present application.

[0107] The embodiments described above only express several implementation methods of the present application, and their descriptions are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that for ordinary technicians in this field, without departing from the concept of the present application, several variations and improvements can be made, which all fall within the scope of protection of the present application. Therefore, the scope of protection of the patent in this application shall be based on the attached claims. The above description is only the preferred implementation method of the present application, and does not limit the scope of the patent in this application. All equivalent structural transformations made by using the contents of the description and drawings of this application under the inventive concept of this application, or direct / indirect application in other related technical fields are included in the scope of protection of the patent in this application.

Claims

1. A method for dipping flux, characterized in that: The soldering flux dipping method comprises: A flux dipping machine is provided, wherein the flux dipping machine is provided with a groove for holding the flux; placing the soldering flux into the groove; Providing a target chip, wherein a solder ball is provided on a first surface of the target chip, and the solder ball has a first height; The solder ball of the target chip is immersed in the groove to be dipped in the soldering flux, so that the soldering flux on the surface of the solder ball has a second height, and the ratio of the second height to the first height is between 20% and 35%.

2. The soldering flux dipping method according to claim 1, wherein: Before immersing the solder ball of the target chip into the groove to dip into the soldering flux, the method includes: A scraping member is used to scrape the soldering flux in the groove at a preset scraping cycle, wherein the preset scraping cycle is between 500s and 1000s.

3. The soldering flux dipping method according to claim 1, wherein: Before immersing the solder ball of the target chip into the groove to dip into the soldering flux, the method includes: The solder balls are inspected.

4. The soldering flux dipping method according to claim 1, wherein: The providing of the target chip comprises: A welding head assembly is used to pick up the target chip from the second surface of the target chip, where the second surface is arranged opposite to the first surface. The welding head assembly includes a first picking member, a connecting rod and a second picking member. The first picking member is used to contact the second surface of the target chip, and the surface of the first picking member in contact with the second surface has a first side length. The second picking member is used to connect a vacuum interface, and the connecting rod is used to connect the first picking member and the second picking member. The dimension value of the connecting rod in a direction perpendicular to the extension direction is not less than the product of the first side length and a preset ratio.

5. A flux dipping machine, characterized in that: The flux dipping machine comprises: substrate; A groove is located on the substrate, the groove is used to hold flux, and the solder ball of the target chip is dipped in the flux in the groove and then flipped. The solder ball has a first height, and the groove has a preset depth. The ratio of the preset depth to the first height is between 20% and 35%.

6. The flux dipping machine according to claim 5, characterized in that: The bottom surface of the groove includes a flat surface or a convex surface, and the convex surface protrudes in a direction away from the bottom surface of the groove.

7. The flux dipping machine according to claim 5, characterized in that: The flux dipping machine comprises: a scraper, the scraper being used to scrape the soldering flux in the groove at a preset scraping cycle, wherein the preset scraping cycle is between 500s and 1000s; and / or; The inspection member is used to inspect the solder balls of the target chip before the solder balls are dipped into the soldering flux.

8. The flux dipping machine according to claim 5, characterized in that: The flux dipping machine comprises: A welding head assembly, the welding head assembly is used to pick up the target chip, the welding head assembly includes a first picking member, a connecting rod and a second picking member, the first picking member is used to contact the target chip, the surface of the first picking member in contact with the target chip has a first side length, the second picking member is used to connect the vacuum interface, the connecting rod is used to connect the first picking member and the second picking member, and the dimension value of the connecting rod in the direction perpendicular to the extension direction is not less than the product of the first side length and a preset ratio.

9. The flux dipping machine according to claim 8, characterized in that: The orthographic projection of the connecting rod on the first picking member is located within the orthographic projection of the first picking member.

10. The flux dipping machine according to claim 8, characterized in that: The connecting rod includes a cylindrical body.

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