Ultrasonic-laser composite equipment for micro-hole machining and use method of ultrasonic-laser composite equipment

Abstract

The invention relates to the technical field of micropore machining, in particular to ultrasonic-laser composite equipment for micropore machining and a using method of the ultrasonic-laser composite equipment. The ultrasonic-laser composite equipment for micropore machining comprises a machining adjusting device, a workpiece adjusting device and a mounting table, the machining adjusting device comprises an ultrasonic laser head, a first driving mechanism and a first adjusting mechanism, and the first adjusting mechanism comprises a transverse adjusting structure, a longitudinal adjusting structure and a horizontal adjusting structure. The first driving mechanism is used for driving the longitudinal adjusting structure, the horizontal adjusting structure and the ultrasonic laser head to realize three-dimensional position adjustment of the ultrasonic laser head; the workpiece adjusting device comprises a second driving mechanism and a second adjusting mechanism, the second adjusting mechanism comprises an angle adjusting structure and a position adjusting structure, and the second driving mechanism drives the angle adjusting structure and the position adjusting structure to adjust the angle and the position of the workpiece to be machined placed on the workpiece adjusting device.

Description

Technical Field

[0001] The present invention relates to the technical field of micro-hole processing, and in particular to an ultrasonic-laser composite device for micro-hole processing and a use method thereof. Background Art

[0002] Micro-hole machining technology plays a vital role in high-end manufacturing fields such as electronic chip manufacturing, precision medical device processing, and aerospace component production. With the increasing demand for product refinement and miniaturization, traditional single processing methods can no longer meet the processing requirements of complex structures and high precision. Ultrasonic-laser composite processing technology combines the high-frequency vibration characteristics of ultrasound with the high energy density advantages of lasers, which can significantly improve processing efficiency and quality, becoming a current research hotspot and development direction for micro-hole machining. However, in the actual processing process, the workpiece often needs to be micro-machined at different angles and positions to meet the design requirements of complex parts. How to achieve rapid and precise position and direction adjustment of the workpiece has become a key issue in further improving the processing accuracy and applicability of ultrasonic-laser composite equipment.

[0003] Existing micro-hole processing equipment mostly uses manual adjustment tooling or simple mechanical positioning structures to adjust the workpiece position. Manual adjustment tooling usually requires operators to use tools such as wrenches and clamps to calibrate and fix the position and angle of the workpiece one by one.

[0004] However, existing micro-hole processing equipment has the problem of difficulty in flexibly adjusting the position and direction of the workpiece. In the actual processing process, since traditional equipment lacks an effective workpiece position adjustment mechanism, when micro-hole processing is required at different positions of the workpiece, it often takes a lot of time to re-clamp and adjust the workpiece. Traditional equipment is difficult to quickly adjust the workpiece posture, resulting in low processing efficiency, and multiple clamping can easily cause damage to the workpiece surface, affecting the processing accuracy and product quality. To address this problem, existing devices need to provide a more accurate and convenient workpiece adjustment structure to achieve dynamic adjustment of different workpieces during processing, thereby improving the overall quality and production efficiency of micro-hole processing. Summary of the Invention

[0005] The purpose of the present invention is to provide an ultrasonic-laser composite device for micro-hole processing, so as to solve the problem in the prior art that micro-hole processing equipment is difficult to flexibly adjust the position and direction of the workpiece to be processed and process.

[0006] In order to solve the above problems, the present invention proposes an ultrasonic-laser composite equipment for micro-hole processing, and the technical solution adopted is: An ultrasonic-laser composite device for micro-hole processing includes a processing adjustment device, a workpiece adjustment device and a mounting table. The processing adjustment device includes an ultrasonic laser head, a first drive mechanism and a first adjustment mechanism. The first adjustment mechanism includes a lateral adjustment structure, a longitudinal adjustment structure and a horizontal adjustment structure. The lateral adjustment structure is arranged on both sides of the mounting table. Two longitudinal adjustment structures are slidably mounted on the two lateral adjustment structures and move laterally along the lateral adjustment structure. The horizontal adjustment structure is slidably mounted on the two longitudinal adjustment structures and moves up and down along the longitudinal adjustment structure. The ultrasonic laser head is slidably mounted on the horizontal adjustment structure and moves horizontally along the horizontal adjustment structure. The first drive mechanism is used to drive the longitudinal adjustment structure, the horizontal adjustment structure and the ultrasonic laser head to realize three-dimensional position adjustment of the ultrasonic laser head; the workpiece adjustment device includes a second drive mechanism and a second adjustment mechanism. The second adjustment mechanism includes an angle adjustment structure and a position adjustment structure. The second drive mechanism drives the angle adjustment structure and the position adjustment structure to adjust the angle and position of the workpiece to be processed placed on the workpiece adjustment device.

[0007] Furthermore, the angle adjustment structure includes a first rotation angle adjustment structure and a second rotation angle adjustment structure, the second driving mechanism drives the first rotation angle adjustment structure to rotate around the horizontal direction to achieve the adjustment of the rotation angle of the workpiece to be processed around the horizontal direction; the second driving mechanism drives the second rotation angle adjustment structure to rotate around the direction perpendicular to the horizontal direction to achieve the adjustment of the rotation angle of the workpiece to be processed around the direction perpendicular to the horizontal direction.

[0008] Furthermore, the first rotation angle adjustment structure includes a rotating shaft arranged along the horizontal direction and a rotating frame arranged on the rotating shaft, the second driving mechanism includes a driving motor 1, a driving wheel 1 and a driven wheel 1, the driven wheel 1 is installed on the rotating shaft at one side of the rotating frame, the driving motor 1 is connected to the driving wheel 1, and the driving wheel 1 and the driven wheel 1 are connected in transmission connection, the driving motor drives the driving wheel 1 and drives the driven wheel 1 to rotate, thereby driving the rotating shaft and the rotating frame to rotate around the rotating shaft, so as to realize the adjustment of the rotation angle of the workpiece to be processed around the horizontal direction.

[0009] Furthermore, the second rotation angle adjustment structure includes a rotating column arranged in a rotating frame, and the second driving mechanism also includes a second driving motor, a second driving wheel and a second driven wheel. The second driving motor is arranged in the rotating frame and connected to the second driving wheel. The rotating column is arranged perpendicular to the rotating axis, and its top end is rotatably connected to the second driven wheel. The second driven wheel is transmission-connected to the second driving wheel and is installed on the top of the rotating frame. The second driving motor drives the second driving wheel and drives the second driven wheel to rotate, so as to realize the adjustment of the rotation angle of the workpiece to be processed around the direction perpendicular to the horizontal direction.

[0010] Furthermore, a connecting component is provided above the angle adjustment structure, and the position adjustment structure includes a placement plate for placing the workpiece to be processed and a third driving mechanism, the placement plate is slidably connected to the connecting component, and the third driving mechanism drives the placement plate to slide along the horizontal direction on the connecting component to achieve horizontal linear position adjustment of the workpiece to be processed.

[0011] Furthermore, slide rails are provided on both sides of the connecting component, the storage plate is slidably connected to the slide rails, and a chip removal port is opened in the storage plate. A collection box is provided between the connecting component and the storage plate, and a limiting rod is provided on the inner side of the slide rail, and limiting grooves are provided on both sides of the collection box. The limiting rod and the limiting groove cooperate to make the collection box slidably connected to the slide rail, so as to realize the collection box sliding in the horizontal direction on the connecting component.

[0012] Furthermore, L-shaped brackets are provided on both sides of the storage plate corresponding to the slide rails, the vertical sides of the L-shaped brackets are connected to the storage plate, a sliding column is provided through the horizontal side of the L-shaped bracket, and a pressure plate is provided at the bottom end of the sliding column, and a clamping ring is provided at the upper end. An elastic component is provided on the sliding column between the pressure plate and the horizontal side of the L-shaped bracket, and the space between the pressure plate and the storage plate is used to place the workpiece to be processed.

[0013] Furthermore, the connecting component includes a transmission shaft arranged at the upper end of the second driven wheel, a turntable at the top of the transmission shaft and a fixed seat on the turntable, the slide rails are arranged on both sides of the fixed seat, and the storage plate is slidably installed on the slide rails; the third driving mechanism includes a connecting frame and an electric push rod, the connecting frame is connected to one side of the fixed seat, the electric push rod is arranged on the connecting frame and connected to the storage plate, and is used to drive the storage plate to move in the horizontal direction.

[0014] Furthermore, the first driving mechanism includes a plurality of driving motors three, and the lateral adjustment structure, longitudinal adjustment structure and horizontal adjustment structure are all provided with ball screws, and one end of the ball screw is connected to the driving motor three; the longitudinal adjustment structure, the horizontal adjustment structure and the ultrasonic laser head are provided with sliders, and the ball screw is slidably connected to the sliders, so that the slider on the longitudinal adjustment structure is slidably connected to the ball screw on the lateral adjustment structure, the slider on the horizontal adjustment structure is slidably connected to the ball screw on the longitudinal adjustment structure, and the slider on the ultrasonic laser head is slidably connected to the ball screw on the horizontal adjustment structure.

[0015] The present invention also proposes a method for using an ultrasonic-laser composite device for micro-hole processing, and the technical solution adopted is: A method for using an ultrasonic-laser composite device for micro-hole processing, based on the ultrasonic-laser composite device for micro-hole processing described above, comprises the following steps: Step 1: The first driving mechanism drives the longitudinal adjustment structure to move laterally along the transverse adjustment structure, the horizontal adjustment structure to move up and down along the longitudinal adjustment structure, and the ultrasonic laser head to move horizontally along the horizontal adjustment structure, thereby achieving three-dimensional position adjustment of the ultrasonic laser head; Step 2: The second driving mechanism drives the angle adjustment structure and the position adjustment structure to adjust the angle and position of the workpiece to be processed placed on the workpiece adjustment device; Step 3: Turn on the equipment to process the workpiece.

[0016] Compared with the prior art, this application has the following beneficial effects: The present invention is an improved invention. The present invention uses a first drive mechanism to drive the longitudinal adjustment structure to move laterally along the transverse adjustment structure, the horizontal adjustment structure to move up and down along the longitudinal adjustment structure, and the ultrasonic laser head to move horizontally along the horizontal adjustment structure, thereby achieving three-dimensional position adjustment of the ultrasonic laser head. A second drive mechanism drives the angle adjustment structure and the position adjustment structure to adjust the angle and position of the workpiece to be processed placed on the workpiece adjustment device, thereby achieving adjustment of the position of the processing equipment and flexible adjustment of the angle and position of the workpiece to be processed. This solves the problem of requiring a large amount of time to re-clamp and adjust the workpiece when performing micro-hole processing on different positions of the workpiece to be processed, making it difficult to flexibly adjust the position and direction of the workpiece, thereby improving the flexibility of the micro-hole processing equipment. The ultrasonic-laser composite equipment for micro-hole processing of the present invention provides a more accurate and convenient workpiece adjustment structure, achieving dynamic adjustment of different workpieces to be processed during the processing process, thereby improving the overall quality and production efficiency of micro-hole processing.

[0017] The angle adjustment structure includes a first rotation angle adjustment structure and a second rotation angle adjustment structure. The second drive mechanism drives the first rotation angle adjustment structure to rotate horizontally to adjust the rotation angle of the workpiece to be processed. The second drive mechanism drives the second rotation angle adjustment structure to rotate perpendicularly to the horizontal direction to adjust the rotation angle of the workpiece to be processed. This structure accurately adjusts the rotation angle of the workpiece to be processed around the horizontal direction and the rotation angle around the perpendicular horizontal direction, further improving the flexibility of dynamic angle adjustment of the workpiece during processing.

[0018] Slide rails are provided on both sides of the connecting component, and a storage plate is slidably connected to the slide rails. A chip removal opening is provided in the storage plate, and a collection box is provided between the connecting component and the storage plate. A limit rod is provided on the inner side of the slide rail, and a limit slot is provided on both sides of the collection box. The limit rod and the limit slot cooperate to enable the collection box to slide in a horizontal direction on the connecting component. This structure allows debris generated during the processing to fall into the collection box through the chip removal opening in the storage plate. The collection box slides within the slide rails and is stabilized by the limit rods, achieving the effect of facilitating the collection and unloading of waste materials. This solves the problems of difficult waste collection and cumbersome unloading operations in traditional equipment, which affect processing efficiency and neatness. It improves the practicality of micro-hole processing equipment and reduces manual cleaning and unloading time.

[0019] L-shaped brackets are provided on both sides of the storage plate corresponding to the slide rails. The vertical sides of the L-shaped brackets are connected to the storage plate. Slide posts are provided through the horizontal sides of the L-shaped brackets, and a pressure plate is provided at the bottom end of the slide post, and a retaining ring is provided at the top end. An elastic component is sleeved on the slide post between the pressure plate and the horizontal side of the L-shaped bracket. The space between the pressure plate and the storage plate is used to place the workpiece to be processed. This structure uses the workpiece to be processed to press the pressure plate, driving the slide post to slide inside the bracket and compressing the elastic component. The pressure plate, under the action of the elastic component, elastically presses and fixes the workpiece to be processed. The retaining ring acts as a limiter, achieving the effect of facilitating the fixation of workpieces of different sizes. This solves the problem that traditional equipment has a single fixing structure, is difficult to adapt to workpieces of various sizes, and limits the application scenarios of the equipment, thereby improving the applicability of micro-hole processing equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a perspective view of an ultrasonic-laser composite apparatus for micro-hole processing according to the present invention; Figure 2 It is a structural schematic diagram of a processing adjustment device in an ultrasonic-laser composite device for micro-hole processing of the present invention; Figure 3 It is a schematic structural diagram of a workpiece adjustment device in an ultrasonic-laser composite device for micro-hole processing according to the present invention; Figure 4 It is a structural schematic diagram of the first rotation angle adjustment structure in the ultrasonic-laser composite equipment for micro-hole processing of the present invention; Figure 5 2 is a schematic structural diagram of a second rotation angle adjustment structure in an ultrasonic-laser composite device for micro-hole processing according to the present invention; Figure 6 It is a schematic structural diagram of the position adjustment structure in the ultrasonic-laser composite equipment for micro-hole processing of the present invention; Figure 7 yes Figure 6An enlarged schematic diagram of point A in the ultrasonic-laser composite device for micro-hole processing of the present invention; Figure 8 It is a schematic structural diagram of a collecting box in the ultrasonic-laser composite equipment for micro-hole processing of the present invention; In the figure, 1. support frame; 2. fixed frame; 3. slide 1; 4. electric push rod; 5. slide 2; 6. slide 3; 7. ultrasonic laser head; 8. slider; 9. drive motor 3; 10. ball screw; 11. shaft seat; 12. drive motor 1; 13. driving wheel 1; 14. rotating shaft; 15. rotating frame; 16. driven wheel 1; 17. rotating column; 18. driven wheel 2; 19. drive motor 2; 20. driving wheel 2; 21. transmission shaft; 22. turntable; 23. fixed seat; 24. slide rail; 25. storage plate; 26. L-shaped bracket; 27. slide column; 28. pressure plate; 29. spring; 30. retaining ring; 31. chip discharge port; 32. limit rod; 33. collection box; 34. limit slot; 35. connecting frame. DETAILED DESCRIPTION

[0021] The following describes in detail embodiments of the present application, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application.

[0022] It should be noted that the terms "first", "second", etc. in the description and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0023] Specific embodiment 1 of the ultrasonic-laser composite equipment for micro-hole processing of the present invention: In this embodiment, Figure 1 、 Figure 2 、 Figure 3 and Figure 4As shown, an ultrasonic-laser hybrid device for micro-hole machining includes a machining adjustment device, a workpiece adjustment device, and a mounting platform. The mounting platform includes a support frame 1 and a fixed frame 2 fixedly connected to the left and right sides of the support frame 1. The machining adjustment device includes an ultrasonic laser head 7, a first drive mechanism, and a first adjustment mechanism. The first adjustment mechanism includes a transverse adjustment structure, a longitudinal adjustment structure, and a horizontal adjustment structure. The transverse adjustment structure is arranged on either side of the mounting platform. Two longitudinal adjustment structures are slidably mounted on the two transverse adjustment structures and move laterally along the transverse adjustment structures. The horizontal adjustment structure is slidably mounted on the two longitudinal adjustment structures and moves up and down along the longitudinal adjustment structures. The ultrasonic laser head 7 is slidably mounted on the horizontal adjustment structure and moves horizontally along the horizontal adjustment structure. The first drive mechanism is used to drive the longitudinal adjustment structure, the horizontal adjustment structure, and the ultrasonic laser head 7 to achieve three-dimensional position adjustment of the ultrasonic laser head 7. The workpiece adjustment device includes a second drive mechanism and a second adjustment mechanism. The second adjustment mechanism includes an angle adjustment structure and a position adjustment structure. The second drive mechanism drives the angle adjustment structure and the position adjustment structure to adjust the angle and position of the workpiece to be machined, which is placed on the workpiece adjustment device.

[0024] Specifically, the lateral adjustment structure is mounted on two fixed frames 2, the longitudinal adjustment structure is slide 1 3, and the horizontal adjustment structure is slide 2 5. The sliding connection between slide 1 3 and the lateral adjustment structure ensures lateral freedom of movement, while the sliding connection between slide 2 5 and slide 1 3 provides vertical freedom. Slide 3 6 is internally slidably connected to slide 2 5, and an ultrasonic laser head 7 is mounted on one side of slide 3 6, providing horizontal freedom. As the core processing tool, ultrasonic laser head 7 is capable of providing high-intensity, high-precision laser energy for micro-hole processing. Ultrasonic laser head 7 uses the existing Jiaqiang VB106 ultrasonic laser processing head.

[0025] Among them, the first driving mechanism includes multiple driving motors three 9, and the lateral adjustment structure, longitudinal adjustment structure and horizontal adjustment structure are all provided with ball screws 10, and one end of the ball screw 10 is connected to the driving motor three 9; the longitudinal adjustment structure, the horizontal adjustment structure and the ultrasonic laser head 7 are provided with sliders 8, and the ball screw 10 is slidably connected to the slider 8, so that the slider 8 on the longitudinal adjustment structure is slidably connected to the ball screw 10 on the lateral adjustment structure, the slider 8 on the horizontal adjustment structure is slidably connected to the ball screw 10 on the longitudinal adjustment structure, and the slider 8 on the ultrasonic laser head 7 is slidably connected to the ball screw 10 on the horizontal adjustment structure.

[0026] Specifically, drive motors 3 9 are fixedly connected to one side of the ball screws 10 on the two lateral adjustment structures, the tops of the two slides 1 3, and one side of the slide 2 5. The output ends of the drive motors 3 9 are fixedly connected to the ball screws 10. Sliders 8 are fixedly connected to the bottoms of the two slides 1 3 and one side of the slides 2 5 and 3 6. Multiple slides 8 are connected to multiple ball screws 10. These drive motors 3 9 are responsible for driving the ball screws 10 to precisely control the movement of the slides. This precise sliding mechanism ensures that the entire device can be precisely adjusted in multiple directions to meet the needs of ultrasonic-laser hybrid processing.

[0027] Specific embodiment 2 of the ultrasonic-laser composite equipment for micro-hole processing of the present invention: Based on the technical concept of the present invention described above, or based on the specific embodiment of the present invention described above, another embodiment is provided below.

[0028] In this embodiment, Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 and Figure 5 As shown, the angle adjustment structure includes a first rotation angle adjustment structure and a second rotation angle adjustment structure. The second driving mechanism drives the first rotation angle adjustment structure to rotate around the horizontal direction to achieve adjustment of the rotation angle of the workpiece to be processed around the horizontal direction; the second driving mechanism drives the second rotation angle adjustment structure to rotate around a direction perpendicular to the horizontal direction to achieve adjustment of the rotation angle of the workpiece to be processed around the direction perpendicular to the horizontal direction.

[0029] Specifically, the top of the support frame 1 is fixedly connected to an axle seat 11. The first rotation angle adjustment structure includes a rotating shaft 14 arranged along the horizontal direction and a rotating frame 15 arranged on the rotating shaft 14. The rotating shaft 14 is rotatably connected to the interior of the axle seat 11. The second drive mechanism includes a driving motor 12, a driving wheel 13, and a driven wheel 16. The driven wheel 16 is mounted on the rotating shaft 14 at a side position of the rotating frame 15. The driving motor 12 is connected to the driving wheel 13. The driving wheel 13 and the driven wheel 16 are in transmission connection. The driving motor drives the driving wheel 13 and drives the driven wheel 16 to rotate, thereby driving the rotating shaft 14 and the rotating frame 15 to rotate around the rotating shaft 14 to adjust the rotation angle of the workpiece to be processed around the horizontal direction. This structure can provide greater flexibility and dynamic adjustment space for laser processing. In particular, when processing complex micro-holes, the rotating shaft 14 and the rotating frame 15 provide additional directional adjustment capabilities, which helps to achieve more complex processing paths. Among them, the bottom of the driving motor 12 is fixedly connected to the inside of the support frame 1, one end of the driving wheel 13 is fixedly connected to the output end of the driving motor 12, and the rotating shaft 14 is fixedly connected to the driven wheel 16. Its main function is to control the rotation angle of the rotating shaft 14 and further improve the equipment's adaptability to micro-hole processing accuracy.

[0030] The second rotation angle adjustment structure includes a rotating column 17 disposed in the rotating frame 15. The second drive mechanism also includes a drive motor 19, a driving wheel 20, and a driven wheel 18. The drive motor 19 is disposed in the rotating frame 15. The output end of the drive motor 19 is connected to the driving wheel 20. The rotating column 17 is disposed perpendicular to the rotating shaft 14, and its top end is rotationally connected to the driven wheel 2 18. The driven wheel 2 18 is transmission-connected to the driving wheel 2 20 and is mounted on the top of the rotating frame 15. The drive motor 19 drives the driving wheel 2 20 and drives the driven wheel 2 18 to rotate, thereby adjusting the rotation angle of the workpiece to be processed around a direction perpendicular to the horizontal. This structure ensures that the angle of the workpiece to be processed can be precisely adjusted as needed, thereby providing adjustable power support for the combination of ultrasonic processing and laser processing.

[0031] Specific embodiment 3 of the ultrasonic-laser composite equipment for micro-hole processing of the present invention: Based on the technical concept of the present invention described above, or based on the specific embodiment of the present invention described above, another embodiment is provided below.

[0032] In this embodiment, Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 and Figure 6As shown, a connecting component is provided above the angle adjustment structure, and the position adjustment structure includes a placement plate 25 for placing the workpiece to be processed and a third driving mechanism. The placement plate 25 is slidably connected to the connecting component, and the third driving mechanism drives the placement plate 25 to slide along the horizontal direction on the connecting component to achieve horizontal linear position adjustment of the workpiece to be processed.

[0033] Specifically, slide rails 24 are provided on both sides of the connecting component, and a storage plate 25 is slidably connected to the slide rails 24. A chip removal opening 31 is provided in the storage plate 25. A collection box 33 is provided between the connecting component and the storage plate 25. Limit rods 32 are provided on the inner sides of the slide rails 24, and limit slots 34 are provided on both sides of the collection box 33. The limit rods 32 and limit slots 34 cooperate to enable the collection box 33 to slide in connection with the slide rails 24, thereby enabling the collection box 33 to slide horizontally on the connecting component. The collection box 33 effectively collects small chips generated during the machining process, preventing the chips from interfering with subsequent processing.

[0034] The connecting components include a drive shaft 21 mounted on the upper end of the second driven wheel 18, a turntable 22 mounted on the top of the drive shaft 21, and a fixed base 23 mounted on the turntable 22. Slide rails 24 are mounted on either side of the fixed base 23, and a storage plate 25 is slidably mounted on the slide rails 24. The third drive mechanism includes a connecting frame 35 and an electric push rod 4. The connecting frame 35 is connected to one side of the fixed base 23. The electric push rod 4 is mounted on the connecting frame 35 and connected to the storage plate 25, driving the storage plate 25 to move horizontally. This provides the ability to automatically adjust the horizontal position of the storage plate 25, effectively improving work efficiency and enhancing the convenience of operation during unloading. Specific embodiment 4 of the ultrasonic-laser composite equipment for micro-hole processing of the present invention: Based on the technical concept of the present invention described above, or based on the specific embodiment of the present invention described above, another embodiment is provided below.

[0035] In this embodiment, Figure 6 、 Figure 7 and Figure 8As shown, L-shaped brackets 26 are installed on both sides of the storage plate 25 corresponding to the slide rails 24. The vertical edges of the L-shaped brackets 26 are connected to the storage plate 25. Slide posts 27 are installed through the horizontal edges of the L-shaped brackets 26. A pressure plate 28 is installed at the bottom end of the slide posts 27, and a snap ring 30 is installed at the top end. An elastic component is mounted on the slide posts 27 between the pressure plate 28 and the horizontal edge of the L-shaped bracket 26. The space between the pressure plate 28 and the storage plate 25 is used to place workpieces to be processed. The design of the slide posts 27 allows for adjustable space on the storage plate 25 to accommodate workpieces of varying sizes. The elastic component is a spring 29. The two ends of the spring 29 are fixedly connected between the inner side of the horizontal edge of the L-shaped bracket 26 and the pressure plate 28. The spring 29 provides the necessary restoring force to ensure stable and precise movement of the pressure plate 28. The snap ring 30 secures the pressure plate 28, further strengthening the stability of the workpiece and preventing it from shifting during processing.

[0036] The working principle of the ultrasonic-laser composite equipment for micro-hole processing is: When using the ultrasonic-laser composite equipment for micro-hole processing, the workpiece to be processed is first placed on the storage plate 25 for fixation, and then the driving motor three 9 is started, and its output end drives the ball screw 10 to rotate, and the slider 8 connected to the ball screw 10 slides on slide one 3, slide two 5, and slide three 6, thereby controlling the movement of slide one 3 on the fixed frame 2, slide two 5 on slide one 3, and slide three 6 in slide two 5, respectively, and finally realizing the position adjustment of the ultrasonic laser head 7 on one side of slide three 6 in the three-dimensional direction, which is convenient for precise positioning processing of the workpiece.

[0037] When the angle and position of the workpiece to be processed need to be adjusted during the processing, the driving motor 12 is started, and the active wheel 13 at its output end rotates and engages with the driven wheel 16, driving the rotating shaft 14 to rotate in the shaft seat 11, thereby rotating the rotating frame 15; at the same time, the driving motor 2 19 in the rotating frame 15 is started, and the active wheel 2 20 at its output end rotates and engages with the driven wheel 2 18, driving the transmission shaft 21 and the turntable 22 at the top to rotate, thereby realizing the rotation of the workpiece to be processed, which is convenient for micro-hole processing at different positions of the workpiece to be processed.

[0038] When fixing the workpiece to be processed, the workpiece to be processed is first placed on the placement plate 25, and the workpiece to be processed squeezes the two pressure plates 28 above the placement plate 25, so that the pressure plates 28 drive the top sliding column 27 to slide inside the L-shaped bracket 26, and at the same time the pressure plates 28 compress the spring 29, so that the pressure plates 28 can elastically press and fix the workpiece to be processed under the action of the spring 29, and the retaining ring 30 plays a limiting role to prevent the sliding column from falling out, thereby achieving the effect of facilitating the fixation of workpieces of different sizes.

[0039] During the processing, the debris generated by the processing falls into the collection box 33 above the fixed seat 23 through the chip discharge port 33 inside the storage plate 25. The collection box 33 slides in the slide rail 24, and the limit rod 32 fits with the limit groove 34 in the collection box 33 to ensure that the collection box 33 can stably collect debris for easy cleaning. At the same time, after the processing is completed, the storage plate 25 is driven to slide on the slide rail 24 through the output end of the electric push rod 4, and then the workpiece to be processed is pulled out from the bottom of the pressure plate 28 for unloading, thereby achieving the effect of facilitating the collection of waste materials and facilitating unloading.

[0040] The present invention also provides a method for using an ultrasonic-laser composite device for micro-hole processing, based on the above-mentioned ultrasonic-laser composite device for micro-hole processing, comprising the following steps: Step 1: The first driving mechanism drives the longitudinal adjustment structure to move laterally along the transverse adjustment structure, the horizontal adjustment structure to move up and down along the longitudinal adjustment structure, and the ultrasonic laser head 7 to move horizontally along the horizontal adjustment structure, thereby achieving three-dimensional position adjustment of the ultrasonic laser head 7; Step 2: The second driving mechanism drives the angle adjustment structure and the position adjustment structure to adjust the angle and position of the workpiece to be processed placed on the workpiece adjustment device; Step 3: Turn on the equipment to process the workpiece.

[0041] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. The scope of patent protection of the present invention shall be based on the claims. Any equivalent structural changes made using the contents of the description and drawings of the present invention shall be included in the scope of protection of the present invention.

Claims

1. An ultrasonic-laser composite device for micro-hole processing, characterized in that: The invention comprises a processing adjustment device, a workpiece adjustment device and a mounting table, wherein the processing adjustment device comprises an ultrasonic laser head (7), a first driving mechanism and a first adjusting mechanism, wherein the first adjusting mechanism comprises a transverse adjusting structure, a longitudinal adjusting structure and a horizontal adjusting structure, wherein the transverse adjusting structure is arranged on both sides of the mounting table, the two longitudinal adjusting structures are slidably mounted on the two transverse adjusting structures and move transversely along the transverse adjusting structures, the horizontal adjusting structure is slidably mounted on the two longitudinal adjusting structures and move up and down along the longitudinal adjusting structures, the ultrasonic laser head (7) is slidably mounted on the horizontal adjusting structure and moves horizontally along the horizontal adjusting structure, and the first driving mechanism is used to drive the longitudinal adjusting structure, the horizontal adjusting structure and the ultrasonic laser head (7) to achieve three-dimensional position adjustment of the ultrasonic laser head (7); the workpiece adjustment device comprises a second driving mechanism and a second adjusting mechanism, wherein the second adjusting mechanism comprises an angle adjusting structure and a position adjusting structure, and the second driving mechanism drives the angle adjusting structure and the position adjusting structure to adjust the angle and position of the workpiece to be processed placed on the workpiece adjustment device.

2. The ultrasonic-laser composite equipment for micro-hole processing according to claim 1, characterized in that: The angle adjustment structure includes a first rotation angle adjustment structure and a second rotation angle adjustment structure, and the second driving mechanism drives the first rotation angle adjustment structure to rotate around the horizontal direction to adjust the rotation angle of the workpiece to be processed around the horizontal direction; The second driving mechanism drives the second rotation angle adjustment structure to rotate around a direction perpendicular to the horizontal direction, so as to adjust the rotation angle of the workpiece to be processed around the direction perpendicular to the horizontal direction.

3. The ultrasonic-laser composite equipment for micro-hole processing according to claim 2, characterized in that: The first rotation angle adjustment structure includes a rotation shaft (14) arranged along the horizontal direction and a rotation frame (15) arranged on the rotation shaft (14); the second driving mechanism includes a driving motor (12), a driving wheel (13) and a driven wheel (16); the driven wheel (16) is installed on the rotation shaft (14) at one side of the rotation frame (15); the driving motor (12) is connected to the driving wheel (13); the driving wheel (13) and the driven wheel (16) are connected in a transmission manner; the driving motor drives the driving wheel (13) and drives the driven wheel (16) to rotate, thereby driving the rotation shaft (14) and the rotation frame (15) to rotate around the rotation shaft (14), so as to achieve adjustment of the rotation angle of the workpiece to be processed around the horizontal direction.

4. The ultrasonic-laser composite equipment for micro-hole processing according to claim 3, characterized in that: The second rotation angle adjustment structure includes a rotating column (17) arranged in the rotating frame (15), and the second driving mechanism also includes a second driving motor (19), a second driving wheel (20) and a second driven wheel (18). The second driving motor (19) is arranged in the rotating frame (15) and is connected to the second driving wheel (20). The rotating column (17) is arranged perpendicular to the rotating shaft (14), and its top end is rotationally connected to the second driven wheel (18). The second driven wheel (18) and the second driving wheel (20) are transmission-connected and installed on the top of the rotating frame (15). The second driving motor (19) drives the second driving wheel (20) and drives the second driven wheel (18) to rotate, so as to realize the adjustment of the rotation angle of the workpiece to be processed around the perpendicular horizontal direction.

5. The ultrasonic-laser composite equipment for micro-hole processing according to claim 4, characterized in that: A connecting component is provided above the angle adjustment structure, and the position adjustment structure comprises a placement plate (25) for placing a workpiece to be processed and a third driving mechanism, wherein the placement plate (25) is slidably connected to the connecting component, and the third driving mechanism drives the placement plate (25) to slide on the connecting component along a horizontal direction to achieve position adjustment of the workpiece to be processed in a horizontal linear direction.

6. The ultrasonic-laser composite equipment for micro-hole processing according to claim 5, characterized in that: Slide rails (24) are provided on both sides of the connecting component, a storage plate (25) is slidably connected to the slide rails (24), and a chip removal opening (31) is provided in the storage plate (25). A collection box (33) is provided between the connecting component and the storage plate (25), a limiting rod (32) is provided on the inner side of the slide rail (24), and limiting grooves (34) are provided on both sides of the collection box (33). The limiting rod (32) and the limiting groove (34) cooperate with each other so that the collection box (33) is slidably connected to the slide rail (24), so that the collection box (33) can slide along the horizontal direction on the connecting component.

7. The ultrasonic-laser composite equipment for micro-hole processing according to claim 6, characterized in that: L-shaped brackets (26) are provided on both sides of the storage plate (25) corresponding to the slide rails (24), the vertical sides of the L-shaped brackets (26) are connected to the storage plate (25), a sliding column (27) is provided through the horizontal side of the L-shaped bracket (26), and a pressure plate (28) is provided at the bottom end of the sliding column (27), and a clamping ring (30) is provided at the upper end. An elastic component is sleeved on the sliding column (27) between the pressure plate (28) and the horizontal side of the L-shaped bracket (26), and a workpiece to be processed is placed between the pressure plate (28) and the storage plate (25).

8. The ultrasonic-laser composite equipment for micro-hole processing according to claim 6, characterized in that: The connecting component includes a transmission shaft (21) arranged at the upper end of the second driven wheel (18), a turntable (22) at the top end of the transmission shaft (21), and a fixed seat (23) on the turntable (22); the slide rails (24) are arranged on both sides of the fixed seat (23); and the storage plate (25) is slidably mounted on the slide rails (24); the third driving mechanism includes a connecting frame (35) and an electric push rod (4); the connecting frame (35) is connected to one side of the fixed seat (23); the electric push rod (4) is arranged on the connecting frame (35) and connected to the storage plate (25) for driving the storage plate (25) to move in the horizontal direction.

9. The ultrasonic-laser composite equipment for micro-hole processing according to claim 1, characterized in that: The first driving mechanism includes a plurality of driving motors three (9), and the lateral adjustment structure, the longitudinal adjustment structure and the horizontal adjustment structure are all provided with ball screws (10), and one end of the ball screw (10) is connected to the driving motor three (9); the longitudinal adjustment structure, the horizontal adjustment structure and the ultrasonic laser head (7) are provided with sliders (8), and the ball screw (10) is slidably connected to the slider (8), so that the slider (8) on the longitudinal adjustment structure is slidably connected to the ball screw (10) on the lateral adjustment structure, the slider (8) on the horizontal adjustment structure is slidably connected to the ball screw (10) on the longitudinal adjustment structure, and the slider (8) on the ultrasonic laser head (7) is slidably connected to the ball screw (10) on the horizontal adjustment structure.

10. A method for using an ultrasonic-laser composite device for micro-hole processing, characterized in that: The ultrasonic-laser composite equipment for micro-hole processing according to any one of claims 1 to 9 comprises the following steps: Step 1: The first driving mechanism drives the longitudinal adjustment structure to move laterally along the transverse adjustment structure, the horizontal adjustment structure to move up and down along the longitudinal adjustment structure, and the ultrasonic laser head (7) to move horizontally along the horizontal adjustment structure, thereby achieving three-dimensional position adjustment of the ultrasonic laser head (7); Step 2: The second driving mechanism drives the angle adjustment structure and the position adjustment structure to adjust the angle and position of the workpiece to be processed placed on the workpiece adjustment device; Step 3: Turn on the equipment to process the workpiece.

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