Plane polishing machine

Abstract

The invention discloses a plane polishing machine, which relates to the technical field of metal processing equipment, and comprises a machine body, a workbench, a moving device, a polishing device and a chip blocking device, the working table comprises a table body, a clamp and a first driving part; the moving device comprises a second driving piece and is used for driving the table body to slide relative to the machine body; the polishing device comprises a frame body, a third driving piece, a polishing roller, a fourth driving piece and a water dripping assembly. The dripping assembly is arranged on the frame body and comprises a water storage tank, a plurality of droppers and a plurality of valves; the chip blocking device comprises two chip blocking curtains, the chip blocking curtains have flexibility and water absorption performance, and a plurality of water drawing pipes are connected between the chip blocking curtains and the water storage tank. According to the surface treatment device, the phenomena of splashing and raising of metal chippings during surface treatment of the metal workpiece can be effectively inhibited, so that the influence of the metal chippings on the environment, workers and the plane polishing effect can be effectively reduced.

Description

Technical Field

[0001] The present application relates to the technical field of metal processing equipment, and in particular to a plane polishing machine. Background Art

[0002] Metal processing is a vital part of the manufacturing industry, widely used in the automotive, aerospace, and electronic equipment industries. Since metal workpieces are prone to surface damage such as wire drawing, rust, and burrs during processing, surface treatment is necessary to meet quality requirements.

[0003] With the development of industrial technology, the requirements for the surface quality of metal workpieces are getting higher and higher, which means that the difficulty of metal surface treatment is gradually increasing. Traditional metal processing equipment (such as surface polishing machines) can no longer meet the needs of high efficiency and high precision processing.

[0004] Currently, common surface polishing machines on the market tend to generate large amounts of metal debris when surface-treating metal workpieces with large flat surfaces. This large amount of metal debris not only easily splashes and blows up, impacting the surrounding environment and nearby workers, but also easily remains on the surface of the metal workpiece, affecting the surface polishing effect. Summary of the Invention

[0005] The present application provides a plane polishing machine that can effectively suppress the splashing and flying of metal debris during the surface treatment of a metal workpiece, thereby effectively reducing the impact of the metal debris on the environment, workers and the plane polishing effect.

[0006] This application provides a plane polishing machine, which adopts the following technical solution: A plane polishing machine comprises a machine body, a workbench, a moving device, a polishing device and a chip blocking device; The workbench includes a table body, a clamp and a first driving member; the table body is slidably connected to the machine body in a horizontal direction, the clamp is rotatably mounted on the top of the table body with a vertical rotation axis, and the first driving member is provided on the table body and is used to drive the clamp to rotate; The moving device includes a second driving member, and the second driving member is used to drive the platform to slide relative to the machine body; The polishing device includes a frame, a third driving member, a polishing roller, a fourth driving member, and a dripping assembly; the frame is movably arranged on the machine body, and the position of the frame is higher than the position of the table; the third driving member is used to drive the frame to move and control the distance between the frame and the table; the polishing roller is rotatably arranged on the frame, and its rotation axis coincides with its own axis, and its rotation axis is horizontal and perpendicular to the sliding direction of the table; the fourth driving member is arranged on the frame, and is used to drive the polishing roller to rotate; The drip assembly is arranged on the frame and located above the polishing roller, and includes a water storage tank, a plurality of drip pipes, and a plurality of valves; the water storage tank has a water storage space inside, and the plurality of drip pipes are arranged on a side of the water storage tank close to the polishing roller and are in communication with the water storage space; the plurality of valves correspond to the plurality of drip pipes one by one, and the valves are used to control the opening and closing of the corresponding drip pipes; The chip blocking device includes two chip blocking curtains, which are respectively arranged on both sides of the frame and located on both sides of the platform; the chip blocking curtains are flexible and water-absorbent, and several water suction pipes are connected between the chip blocking curtains and the water tank, and the chip blocking curtains are connected to the water storage space through the water suction pipes.

[0007] By adopting the above technical solution, during the process of plane polishing of metal workpieces, the water dripping from the dripping component can wash away the metal debris remaining on the surface of the polishing roller and the surface of the workpiece, reducing the probability of metal debris splashing and lifting, and at the same time can also have a cooling effect on the polishing roller and the metal workpiece, effectively improving the effect of plane polishing of the metal workpiece; at the same time, when metal debris splashes and lifts, the wet chip curtain can prevent the metal debris from splashing, so that the splashed and lifted metal debris adheres to the surface, thereby further reducing the probability of metal debris splashing and lifting, and thus can effectively reduce the impact of metal debris on the environment, staff and plane polishing effect.

[0008] Optionally, the chip blocking device further includes two baffles; The baffle is arranged on the machine body, the two baffles are respectively located on both sides of the platform, a sliding space for the platform to slide is formed between the two baffles, and the top of the baffle is higher than the top of the platform.

[0009] By adopting the above technical solution, the part of the baffle that is higher than the platform can prevent metal debris from splashing away from both sides, and at the same time can prevent water from leaving from both sides, making it easier for metal debris to leave the platform with the water flow, thereby reducing the probability of metal debris and water splashing affecting the surrounding environment and staff.

[0010] Optionally, the moving device further comprises two bellows; The two corrugated members are respectively located on both sides of the sliding direction of the platform, the two ends of the corrugated track of the corrugated member are respectively connected to the platform and the machine body, and the two sides of the corrugated member are respectively close to the two baffles.

[0011] By adopting the above technical solution, the bellows can receive metal debris and water leaving the platform, while reducing the probability of metal debris and water directly flowing into the sliding space and affecting the sliding of the platform.

[0012] Optionally, a slot for the corrugated member to be inserted into is formed on a side of the baffle close to the sliding space.

[0013] By adopting the above technical solution, the effect of the bellows on absorbing metal debris and water leaving the platform can be further improved.

[0014] Optionally, the baffle is provided with a dirt collecting groove, which is located below the card slot and communicates with the card slot.

[0015] By adopting the above technical solution, the metal debris and water received by the bellows can be easily flowed into the sewage collecting tank through the card slot for collection.

[0016] Optionally, after the corrugated member is folded, a plurality of drainage channels are formed at the bottom, two ends of the drainage channels are respectively communicated with the two card slots, and the bottom inner walls of the drainage channels are inclined downward toward the two card slots.

[0017] By adopting the above technical solution, the corrugated member can conveniently drive the metal debris it carries into the card slot along with the water flow and salt drainage channel during the folding process, thereby effectively improving the mobile phone effect of metal debris and water.

[0018] Optionally, the bottom of the chip-blocking curtain is located in the corresponding dirt-collecting trough, and there is a distance between the chip-blocking curtain and the bottom wall of the dirt-collecting trough.

[0019] By adopting the above-mentioned technical solution, the chip curtain's blocking effect on flying metal debris and water can be effectively improved, and at the same time, the chip curtain's wetting degree can be made more uniform, effectively improving its adsorption effect on metal debris; in addition, it can be convenient for staff to clean the chip curtain, and the metal debris and water obtained after cleaning can enter the sump.

[0020] Optionally, the top of the platform has guide surfaces on both sides of its sliding direction, and the guide surfaces are inclined downward toward the direction of the adjacent corrugated member.

[0021] By adopting the above technical solution, the water flow above the platform can conveniently carry metal debris along the guide surface to flow onto the corrugated member.

[0022] Optionally, a recovery pipe is connected between the baffle and the water tank, and both ends of the recovery pipe are respectively connected to the sewage collecting tank and the water storage space; the recovery pipe is equipped with a water pump, and a filter is provided at one end of the recovery pipe close to the baffle.

[0023] By adopting the above technical solution, it is possible to conveniently filter the sewage in the sewage collecting tank to obtain recyclable water and use it in the drip assembly.

[0024] Optionally, the chip blocking device further includes two transparent shielding plates; The two shields are both arranged on the frame and are respectively located on both sides of the top of the polishing roller. A gap is formed between the two shields below the drip assembly, and the shield is arranged downwardly and tilted away from the other shield.

[0025] By adopting the above technical solution, metal debris and water splashes can be further effectively blocked, and at the same time, it can be convenient for workers to observe the surface polishing condition of the metal workpiece through the light shield.

[0026] In summary, this application has at least one of the following beneficial effects: 1. It can effectively suppress the splashing and flying of metal debris during the surface treatment of metal workpieces, thereby effectively reducing the impact of metal debris on the environment, workers and surface polishing effects; 2. It can effectively collect the splashing metal debris and water, and recycle the water, thereby effectively improving the sustainability of suppressing the splashing and blowing of metal debris; 3. It can effectively improve the surface polishing effect of metal workpieces and can adapt to surface polishing of metal workpieces of different shapes and sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a structural diagram of a plane polishing machine according to an embodiment of the present application; Figure 2 This is a cross-sectional view of a plane polishing machine according to an embodiment of the present application along its length direction; Figure 3 This is a cross-sectional view of a plane polishing machine according to an embodiment of the present application along its width direction; Figure 4 This is a cross-sectional view of the bellows in a normal state in an embodiment of the present application; Figure 5 It is a cross-sectional view of the bellows in the folded state in the embodiment of the present application.

[0028] Explanation of the accompanying drawings: 1. Machine body; 11. Sliding space; 2. Workbench; 21. Table body; 211. Guide surface; 22. Clamp; 23. First driving member; 3. Moving device; 31. Second driving member; 32. Corrugated member; 321. Sewage discharge channel; 4. Polishing device; 41. Frame; 42. Third driving member; 43. Polishing roller; 44. Fourth driving member; 45. Drip assembly; 451. Water tank; 4511. Water storage space; 452. Drip tube; 453. Valve; 5. Chip blocking device; 51. Baffle; 511. Card slot; 512. Sewage collecting tank; 52. Chip blocking curtain; 53. Shield; 6. Recovery pipe; 7. Water pump; 8. Filter element; 9. Water suction pipe. DETAILED DESCRIPTION

[0029] The following is combined with Figure 1-5 This application is described in further detail.

[0030] Reference Figure 1 and Figure 2 The present invention discloses a surface polishing machine for polishing a metal workpiece, comprising a machine body 1, a worktable 2, a moving device 3, a polishing device 4, and a chip guard 5. The machine body 1 serves as a mounting carrier for other structures; the worktable 2 is used to mount the metal workpiece for surface polishing; the moving device 3 is used to control the movement of the metal workpiece to facilitate surface polishing of a larger area; the polishing device 4 is used to perform surface polishing on the metal workpiece; and the chip guard 5 is used to suppress the splashing and flying of metal debris generated during the surface polishing process.

[0031] Reference Figure 1 and Figure 3 The workbench 2 is installed at the bottom of the machine body 1 and includes a table body 21, a clamp 22 and a first driving member 23.

[0032] The table 21 is a rectangular parallelepiped structure as a whole, and is slidably connected to the body 1. Its sliding direction is horizontal and parallel to its own length direction, and its height direction is vertical. The clamp 22 is rotatably mounted on the top of the table 21, and is used to clamp and position the metal workpiece, and its rotation axis is parallel to the height direction of the table 21; the first drive member 23 is fixedly mounted inside the body 1, and is used to drive the clamp 22 to rotate relative to the table 21. In this embodiment, the clamp 22 is preferably centered on the top of the table 21, and after the metal workpiece is clamped and positioned by the clamp 22, its surface to be polished is horizontal; and the first drive member 23 is preferably a servo motor; since the clamp 22 and servo motor with the above functions are both common existing technologies, they are not described in detail here, and they are only briefly shown in the accompanying drawings.

[0033] Reference Figure 1 and Figure 2The polishing device 4 is installed on the top of the machine body 1 and is higher than the workbench 2. It includes a frame 41, a third driving member 42, a polishing roller 43, a fourth driving member 44 and a dripping assembly 45.

[0034] The frame 41 is movably mounted on the machine body 1, and the distance between it and the table 21 will change during its movement relative to the machine body 1. The third driving member 42 is fixedly mounted on the machine body 1, and is used to control the movement of the frame 41 relative to the machine body 1. The polishing roller 43 is a cylindrical structure as a whole, and the polishing roller 43 is rotatably mounted on the frame 41, and its rotation axis coincides with its own axis and is parallel to the width direction of the table 21. The fourth driving member 44 is fixedly mounted on the frame 41, and is used to drive the polishing roller 43 to rotate relative to the frame 41. In this embodiment, the third driving member 42 is preferably a servo cylinder, and the fourth driving member 44 is a servo motor; and the third driving member 42 is preferably used to drive the frame 41 to move in the vertical direction; since the servo cylinder and the polishing roller 43 having the above-mentioned functions are both common existing technologies, they will not be described in detail here, and they are only briefly indicated in the accompanying drawings.

[0035] Reference Figure 1 and Figure 3 The drip assembly 45 is installed on the frame 41 and is located above the polishing roller 43. It includes a water storage tank 451, multiple drip tubes 452 and multiple valves 453.

[0036] Reference Figure 2 and Figure 3 The water tank 451 is a rectangular parallelepiped structure, with its length parallel to the axis of the polishing roller 43. It contains a water storage space 4511 for storing water. A dropper 452 is fixedly mounted at the bottom of the water tank 451, with one end communicating with the water storage space 4511 and the other end facing the top of the polishing roller 43. Multiple droppers 452 are evenly spaced along the length of the water tank 451. Multiple valves 453 correspond to the droppers 452, and are fixedly mounted inside corresponding droppers 452 to control whether water can pass through the droppers 452. In this embodiment, the valves 453 are preferably remotely controlled, normally closed, and capable of keeping the droppers 452 open to allow water to drip onto the polishing roller 43 during the surface polishing process. Since the droppers 452 and valves 453 with the above-described functions are common in the prior art, they will not be described in detail here, and are only briefly illustrated in the accompanying drawings.

[0037] Reference Figure 1 and Figure 3At this time, when the table 21 slides relative to the machine body 1 to the bottom of the polishing roller 43 and the metal workpiece is clamped and positioned by the clamp 22, the third driving member 42 drives the frame 41 to move downward so that the polishing roller 43 can contact and abut the flat surface of the metal workpiece to be polished; during the flat surface polishing process, the fourth driving member 44 will drive the polishing roller 43 to maintain contact with the flat surface of the metal workpiece while rotating, the first driving member 23 will drive the clamp 22 to drive the metal workpiece to rotate, and the table 21 can slide back and forth relative to the machine body 1 to make the polishing effect of the polishing roller 43 on the flat surface of the metal workpiece more uniform, eliminating dead angles.

[0038] At the same time, during the plane polishing process, the dripping assembly 45 will maintain a certain frequency of dripping water onto the polishing roller 43. The water will flow through the polishing roller 43 to the plane of the metal workpiece and then flow to the top of the table 21. While having a cooling effect on both the polishing roller 43 and the metal workpiece, it can come into contact with the metal debris generated during the plane polishing process, allowing the metal debris to leave with the water flow, and at the same time reducing the probability of metal debris splashing and lifting.

[0039] Reference Figure 1 and Figure 2 The chip guard device 5 includes two baffles 51, which are fixedly installed on the bottom of the body 1 in a vertical position, and the two baffles 51 are parallel to each other; the two baffles 51 are respectively located on both sides of the width direction of the table 21, and a sliding space 11 is formed between the two baffles 51 for the table 21 to slide relative to the body 1, and the top of the sliding space 11 is open, and the two ends and the bottom in the longitudinal direction are blocked by the inner wall formed by the body 1; the top of the baffle 51 is higher than the top of the table 21, and the part of the baffle 51 higher than the table 21 can block metal debris and water splashing horizontally toward the sides of the width direction of the table 21 during the plane polishing process.

[0040] The moving device 3 includes a second driving member 31 and two bellows 32 .

[0041] The second driving member 31 is used to drive the platform 21 to slide relative to the machine body 1. In this embodiment, the second driving member 31 is preferably a servo motor, which is fixedly mounted on the bottom of the machine body 1 and located on one side of the sliding space 11 in the longitudinal direction. The second driving member 31 preferably drives the platform 21 to slide relative to the machine body 1 via a screw drive. Since screw drive is a common driving method, it will not be described in detail here and is only briefly illustrated in the drawings.

[0042] Two corrugated members 32 are mounted on either side of the platform 21 in the longitudinal direction and are both located within the sliding space 11. The corrugated members 32 are sheet-like structures with repeating corrugations, with the corrugated traces extending along their length. Their ends in the longitudinal direction are fixedly connected to the platform 21 and the inner wall of one end of the sliding space 11 in the longitudinal direction, and their ends in the width direction are respectively adjacent to the two baffles 51. In this embodiment, the corrugated members 32 are preferably mounted in a position with their widths parallel to the width of the platform 21 and perpendicular to the length of the platform 21. Furthermore, the corrugated members 32 are preferably capable of extending or folding as the platform 21 slides. When the platform 21 slides to its extreme position relative to the machine body 1, one corrugated member 32 is fully extended and the other is fully folded. Since the corrugated members 32 with the above-mentioned functions are common in the prior art, they will not be described in detail here, and are only briefly illustrated in the accompanying drawings.

[0043] Reference Figure 2 and Figure 3 , the two baffles 51 are provided with a slot 511 on one side of the sliding space 11 for one side of the corrugated member 32 in the width direction to be locked in. At this time, the two corrugated members 32 can form a shield in the area on both sides of the length direction of the table 21 in the sliding space 11, respectively, to receive metal debris and water splashed during the plane polishing process, and effectively prevent metal debris and water from directly entering the bottom of the sliding space 11, thereby affecting the probability of the table 21 sliding relative to the body 1.

[0044] Reference Figure 1 and Figure 3 A boss is extended outward from the side of the baffle 51 away from the sliding space 11, and a sewage collecting trough 512 for collecting metal debris and water is opened in the baffle 51 near the boss. The part of the sewage collecting trough 512 located on the boss has an opening formed at the top of the boss. The sewage collecting trough 512 is located below the adjacent card slot 511, and the interior of the baffle 51 is hollowed out downward at the end of the card slot 511 away from the sliding space 11 so that the card slot 511 and the sewage collecting trough 512 are connected.

[0045] Reference Figure 4 and Figure 5 The turning position of the corrugated member 32 has an arc-shaped design. When the corrugated member 32 is folded to a certain extent, a drainage channel 321 for metal debris to move with the water flow will be formed at the turning position at the bottom of the corrugated member 32. The two ends of the drainage channel 321 are respectively connected to the two card slots 511, and the inner wall of the bottom of the drainage channel 321 is inclined downward from the middle position of its own length direction toward the position of the two card slots 511, so that the metal debris can move with the water flow.

[0046] Reference Figure 2 and Figure 4When the platform 21 remains stationary, the bellows 32 can be used to receive the splashing metal debris and water. When the amount of water falling into the multiple grooves formed on the bellows 32 exceeds a certain amount, the water can flow along the grooves toward the card slot 511, and at the same time, it can carry some metal debris into the card slot 511. Reference Figure 2 and Figure 5 As the platform 21 slides and gradually folds a bellows 32, the metal debris and water previously dropped into the plurality of grooves formed on the bellows 32 will flow along the drainage channel 321 toward the slot 511 due to the reduction in the receiving space, thereby promoting the metal debris received on the bellows 32 to move into the slot 511 along with the water flow.

[0047] Reference Figure 1 and Figure 2 Furthermore, to facilitate the metal debris and water on the top of the platform 21 to fall onto the bellows 32 after leaving, the top of the platform 21 preferably has guide surfaces 211 at both ends of its length for guiding the movement of the metal debris and water. In this embodiment, the guide surfaces 211 are preferably inclined surfaces, and they are inclined downward toward the adjacent bellows 32.

[0048] Reference Figure 1 and Figure 3 Furthermore, in order to improve the utilization rate of water during the plane polishing process, it is preferred that a recovery pipe 6 for water recycling is installed between the two baffles 51 and the water tank 451, and the recovery pipe 6 is equipped with a water pump 7 for providing power and a filter 8 for intercepting metal debris.

[0049] The recovery pipe 6 is a hose, one end of which is in communication with the bottom of the sewage sump 512, and the other end of which is in communication with the water storage space 4511. The water pump 7 is fixedly mounted on the body 1, and is used to drive the water in the sewage sump 512 to flow into the water storage space 4511 through the recovery pipe 6. The filter element 8 is fixedly mounted on one end of the recovery pipe 6 near the sewage sump 512, and can effectively prevent metal debris from entering the recovery pipe 6. In this embodiment, since the water pump 7 and the filter element 8 having the above-mentioned functions are both common existing technologies, they will not be described in detail here, and they are only briefly shown in the accompanying drawings.

[0050] Reference Figure 1 and Figure 3 The chip blocking device 5 also includes two chip blocking curtains 52 and two shielding plates 53.

[0051] The chip blocking curtain 52 is flexible and water-absorbent. The tops of the two chip blocking curtains 52 are fixedly connected to the two ends of the frame 41 in the length direction, and the bottoms of the chip blocking curtains 52 are located on the side of the adjacent baffle 51 away from the sliding space 11; the two chip blocking curtains 52 can form a barrier on both sides of the width direction of the table body 21. When there is metal debris and water splashing outward in the width direction of the table body 21, the chip blocking curtain 52 can effectively block the metal debris and water, and the chip blocking curtain 52 can allow metal debris to adhere to the surface of one side close to the table body 21.

[0052] A water drawing pipe 9 is fixedly connected between the top of the chip-blocking curtain 52 and the water tank 451. One end of the water drawing pipe 9 is connected to the bottom of the water storage space 4511 and the other end leads to the top of the chip-blocking curtain 52. The chip-blocking curtain 52 can draw water from the water storage space 4511 through the water drawing pipe 9 according to its own needs, so that the chip-blocking curtain 52 remains moist, making it easier for the chip-blocking curtain 52 to suppress the splashing and lifting of metal debris.

[0053] The bottom of the dust curtain 52 is located in the adjacent dirt collecting trough 512 and is vertically aligned with the opening of the adjacent dirt collecting trough 512. As the dust curtain 52 moves up and down relative to the machine body 1 along with the frame 41, the bottom of the dust curtain 52 remains located in the dirt collecting trough 512 and maintains a distance from the bottom wall of the dirt collecting trough 512.

[0054] During the surface polishing process, metal debris and water entering the sump 512 are separated into layers due to sedimentation. The bottom of the chip curtain 52 is able to contact the water in the sump 512 and directly absorb the water therein, making the overall moisture level of the chip curtain 52 more uniform, thereby ensuring that it effectively serves as a barrier for metal debris to adhere. Simultaneously, the bottom of the chip curtain 52 in the sump 512 can absorb metal debris in the sump 512, further reducing the risk of metal debris moving with the water toward the recovery pipe 6, thereby reducing the probability of filter element 8 being clogged by metal debris.

[0055] When the chip curtain 52 blocks the metal debris and causes the amount of metal debris attached to the side close to the platform 21 to reach a certain amount, the staff can directly squeeze and clean it, so that the water absorbed by the chip curtain 52 flows into the corresponding sewage collection tank 512, and the water can help the metal debris attached to the chip curtain 52 enter the sewage collection tank 512 in the process of flowing down, thereby making the cleaning process of the chip curtain 52 more convenient and quick.

[0056] Reference Figure 1 and Figure 2Shields 53 are fixedly mounted on the frame 41. Two shields 53 are located on either side of the top of the polishing roller 43, with their lengths parallel to the axis of the polishing roller 43. Shields 53 are tilted on the frame 41, slanting downward away from the other shield 53. Space is defined between the two shields 53 for the drip assembly 45 to drip water onto the polishing roller 43. The two shields 53 effectively prevent metal debris and water from splashing upward on either side of the polishing roller 43. In this embodiment, shields 53 are preferably transparent to facilitate observation of the polishing progress of the metal workpiece through them. Since shields 53 with the aforementioned functions are common in the prior art, they will not be described in detail here, and are only briefly illustrated in the accompanying drawings.

[0057] The implementation principle of a plane polishing machine in the embodiment of the present application is as follows: During the surface polishing of the metal workpiece, the drip assembly 45 drips water onto the surface of the polishing roller 43, causing the water to flow through the surface of the metal workpiece and the table 21, thereby cooling the polishing roller 43 and the metal workpiece while also washing away the generated metal debris, causing the metal debris to fall onto the corrugated member 32 along with the water flow. When metal debris and water splash, the two baffles 51, the two chip curtains 52 and the two shields 53 can effectively suppress it, reducing its impact on the surrounding environment and staff; when metal debris splashes and rises, the chip curtain 52 can block and absorb the metal debris; the metal debris and water falling on the corrugated member 32 can also enter the card slot 511 along the corrugated member 32, and finally flow into the sewage collecting tank 512 for collection, and the water collected in the sewage collecting tank 512 can also be recycled to the drip assembly 45 for utilization.

[0058] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A plane polishing machine, characterized in that, It comprises a machine body (1), a workbench (2), a moving device (3), a polishing device (4) and a chip blocking device (5); The workbench (2) comprises a table body (21), a clamp (22) and a first driving member (23); the table body (21) is slidably connected to the machine body (1) in a horizontal direction, the clamp (22) is rotatably mounted on the top of the table body (21) with a vertical axis of rotation, and the first driving member (23) is arranged on the table body (21) and is used to drive the clamp (22) to rotate; The moving device (3) includes a second driving member (31) and is used to drive the platform (21) to slide relative to the machine body (1); The polishing device (4) comprises a frame (41), a third driving member (42), a polishing roller (43), a fourth driving member (44) and a dripping assembly (45); the frame (41) is movably arranged on the machine body (1), and the position of the frame (41) is higher than the position of the table (21); the third driving member (42) is used to drive the frame (41) to move and control the distance between the frame (41) and the table (21); the polishing roller (43) is rotatably arranged on the frame (41), and its rotation axis coincides with its own axis, and its rotation axis is horizontal and perpendicular to the sliding direction of the table (21); the fourth driving member (44) is arranged on the frame (41) and is used to drive the polishing roller (43) to rotate; The drip assembly (45) is arranged on the frame (41) and located above the polishing roller (43), and comprises a water storage tank (451), a plurality of dripping tubes (452) and a plurality of valves (453); the water storage tank (451) has a water storage space (4511) inside, and the plurality of dripping tubes (452) are all arranged on a side of the water storage tank (451) close to the polishing roller (43) and are all in communication with the water storage space (4511); the plurality of valves (453) correspond to the plurality of dripping tubes (452) one by one, and the valves (453) are used to control the opening and closing of the corresponding dripping tubes (452); The chip blocking device (5) includes two chip blocking curtains (52), which are respectively arranged on both sides of the frame (41) and located on both sides of the platform (21); the chip blocking curtains (52) are flexible and water-absorbent, and a plurality of water-drawing pipes (9) are connected between the chip blocking curtains (52) and the water storage tank (451), and the chip blocking curtains (52) are in communication with the water storage space (4511) through the water-drawing pipes (9).

2. A plane polishing machine according to claim 1, characterized in that, The chip blocking device (5) further includes two baffles (51); The baffle (51) is arranged on the machine body (1), the two baffles (51) are respectively located on both sides of the platform (21), and a sliding space (11) for the platform (21) to slide is formed between the two baffles (51), and the top of the baffle (51) is higher than the top of the platform (21).

3. A plane polishing machine according to claim 2, characterized in that, The moving device (3) further includes two corrugated members (32); The two corrugated members (32) are respectively located on both sides of the sliding direction of the platform (21), the two ends of the corrugated track of the corrugated member (32) are respectively connected to the platform (21) and the machine body (1), and the two sides of the corrugated member (32) are respectively close to the two baffles (51).

4. A plane polishing machine according to claim 3, characterized in that, A slot (511) for the corrugated member (32) to be snapped into is provided on one side of the baffle (51) close to the sliding space (11).

5. A plane polishing machine according to claim 4, characterized in that: The baffle (51) is provided with a dirt collecting groove (512), and the dirt collecting groove (512) is located below the card slot (511) and communicates with the card slot (511).

6. A plane polishing machine according to claim 5, characterized in that: After the corrugated member (32) is folded, a plurality of drainage channels (321) are formed at the bottom. The two ends of the drainage channels (321) are respectively connected to the two card slots (511), and the bottom inner walls of the drainage channels (321) are inclined downwards towards the two card slots (511).

7. A plane polishing machine according to claim 5, characterized in that: The bottom of the chip-blocking curtain (52) is located in the corresponding dirt collecting trough (512), and there is a distance between the chip-blocking curtain (52) and the bottom wall of the dirt collecting trough (512).

8. A plane polishing machine according to claim 5, characterized in that: The top of the platform (21) has guide surfaces (211) on both sides of its own sliding direction, and the guide surfaces (211) are inclined downward in a direction close to the adjacent corrugated member (32).

9. A plane polishing machine according to claim 5, characterized in that: A recovery pipe (6) is connected between the baffle (51) and the water storage tank (451), and both ends of the recovery pipe (6) are in communication with the sewage collecting tank (512) and the water storage space (4511), respectively. A water pump (7) is provided on the recovery pipe (6), and a filter element (8) is provided at one end of the recovery pipe (6) close to the baffle (51).

10. A plane polishing machine according to claim 1, characterized in that: The chip blocking device (5) further includes two transparent shielding plates (53); The two shielding plates (53) are both arranged on the frame (41) and are respectively located on both sides of the top of the polishing roller (43), a gap is formed between the two shielding plates (53) below the drip assembly (45), and the shielding plates (53) are arranged to be tilted downward in a direction away from the other shielding plate (53).

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