Special ceramic diamond composite grinding wheel of multi-axis linkage polishing machine tool and self-adaptive control method of special ceramic diamond composite grinding wheel

Abstract

The invention discloses a special ceramic and diamond composite grinding wheel of a multi-axis linkage polishing machine tool and a self-adaptive control method thereof.The special ceramic and diamond composite grinding wheel of the multi-axis linkage polishing machine tool comprises, by mass, 45-55 parts of diamond micro-powder, 5-10 parts of a grinding aid, 1-3 parts of a lubricating agent, 1-3 parts of a lubricating agent, 1-3 parts of a lubricating agent and 1-3 parts of a lubricating agent. 3 to 8 parts of nanometer aluminum oxide; 25 to 35 parts of a silicon nitride ceramic bonding agent; 2 to 4 parts of graphene dispersion liquid; 1 to 3 parts of yttrium oxide; 2 to 5 parts of polyether-ether-ketone; the special ceramic diamond composite grinding wheel adopts a silicon nitride (Si3N4) ceramic bonding agent, combines diamond micro-powder and nanometer aluminum oxide, has ultrahigh-temperature stability (can resist the working condition of 1300 DEG C) and high thermal shock resistance, and is specially used for precise grinding and polishing of ceramic valves, ceramic cylinder valve plates, piezoelectric functional ceramics and green special refractory ceramics; the problem of thermal softening failure of a traditional metal bonding agent under high temperature and high pressure can be avoided, the machined surface roughness (Ra) is stably controlled to be smaller than or equal to 0.05 micron, and the high-precision service requirement of special ceramic parts is met.

Description

Technical Field

[0001] The invention belongs to the technical field of grinding and polishing processing, and in particular relates to a special ceramic diamond composite grinding wheel for a multi-axis linkage polishing machine tool and an adaptive control method thereof. Background Art

[0002] Existing diamond grinding wheels are mainly made of metal / resin bonds, which have insufficient wear resistance, heat dissipation and shape retention capabilities. Processing parameters (such as feed speed and spindle speed) mostly rely on manual presets and cannot respond to changes in the workpiece surface morphology in real time, which can easily lead to unstable surface quality or sub-surface damage. Traditional control methods cannot perceive changes in processing status in real time, resulting in unstable surface quality.

[0003] Based on this, a special ceramic diamond composite grinding wheel for a multi-axis linkage polishing machine tool and its adaptive control method are designed. Summary of the Invention

[0004] In view of the above situation, in order to overcome the defects of the prior art, the present invention provides a special ceramic diamond composite grinding wheel for a multi-axis linkage polishing machine and an adaptive control method thereof, which effectively solves the problems raised in the above background.

[0005] To achieve the above object, the present invention provides the following technical solution: a special vitrified diamond composite grinding wheel for a multi-axis linkage polishing machine tool, comprising the following components by mass:

[0006] Diamond micro powder: 45-55 parts;

[0007] Nano-alumina: 3-8 parts;

[0008] Silicon nitride ceramic binder: 25-35 parts;

[0009] Graphene dispersion: 2-4 parts;

[0010] Yttrium trioxide: 1-3 parts;

[0011] Polyetheretherketone: 2-5 parts.

[0012] The grinding wheel is specially used for the precision grinding and polishing of ceramic valves, ceramic cylinder valve plates, piezoelectric ceramics, thermoelectric functional ceramics and silicon carbide-based green refractory ceramics.

[0013] Preferably, the silicon nitride ceramic binder has a grain size of ≤200 nm, a porosity of ≤3%, and a Vickers hardness of ≥1800 HV, and is suitable for processing thin-walled ceramic parts with a thickness of ≤1 mm.

[0014] Preferably, the method for preparing the diamond grinding wheel comprises the following steps:

[0015] S1. Mixing: Diamond micropowder and nano-alumina are mixed in a vacuum ball mill for 2-4 hours at a speed of 800-1200 rpm, and then ultrasonically dispersed ceramic binder and graphene dispersion are added;

[0016] S2. Molding: The embryonic body is formed by cold isostatic pressing at 200-240 MPa, and the pore structure is optimized by laser selective sintering.

[0017] S3. Segmented sintering: pre-sinter at 600-650°C in a nitrogen atmosphere for 60-80 min, then microwave sinter at 1200-1300°C for 120-150 min, with a heating rate controlled at 8°C / min.

[0018] An adaptive control method for a special ceramic diamond composite grinding wheel of a multi-axis linkage polishing machine tool comprises the following steps:

[0019] S1. Multi-source data collection:

[0020] The surface temperature field of the grinding wheel is monitored in real time by an infrared thermal imager. When the local temperature reaches the binder softening temperature threshold (T-50°C), the coolant flow rate is dynamically adjusted.

[0021] S2. Dynamic feature extraction:

[0022] Based on the acoustic emission signal, the risk points of edge collapse of the piezoelectric ceramic workpiece are located, and the B / C axis linkage of the machine tool is controlled to generate a NURBS compensation path to suppress the propagation of microcracks.

[0023] S3. Parameter optimization decision:

[0024] Use digital twin models to predict thermal deformation errors of silicon carbide refractory ceramics, optimize X / Y / Z axis feed rates, and ensure machining accuracy ≤ 1μm;

[0025] S4, multi-axis collaborative execution:

[0026] Generate NURBS curve compensation path through CAM system to control the linkage between B-axis and C-axis of machine tool to realize surface topography error compensation;

[0027] Adaptive PID controller is used to adjust the X / Y / Z axis feed rate, with a response delay time of ≤20ms;

[0028] After every 50 reciprocating operations, the control parameters are automatically updated and stored in the process database.

[0029] Preferably, in step S2, for thermoelectric ceramics (Bi2Te3) processing, the cutting force ratio is dynamically controlled in the range of 0.6-0.8, and the surface residual stress is reduced to ≤50 MPa.

[0030] Compared with the prior art, the present invention has the following beneficial effects:

[0031] 1. The present invention constructs a force-heat-acoustic multi-physics field coupling model. The multi-physics field coupling model dynamically senses the processing status and adaptively adjusts the process parameters. This significantly shortens the processing cycle while ensuring surface quality, while avoiding material waste and equipment loss caused by traditional trial and error methods.

[0032] 2. The present invention establishes an early warning model based on the thermal-mechanical coupling failure mechanism of the bond. By precisely controlling the temperature gradient distribution, it effectively delays the thermal damage process of the grinding wheel bond, extends the service life of the grinding tool, and reduces the downtime cost caused by frequent grinding tool replacement.

[0033] 3. Build a process parameter database and self-learning model to achieve continuous accumulation of processing experience and process iteration, reduce reliance on manual parameter adjustment, and provide technical support for the automated processing of complex parts (such as free-form surfaces and thin-walled structures);

[0034] 4. Introduce a digital twin prediction mechanism to pre-compensate for machine tool motion errors and thermal deformation, and combine it with a nano-level path correction algorithm to improve the consistency of workpiece surface roughness.

[0035] The special ceramic diamond composite grinding wheel of the present invention adopts silicon nitride (Si3N4) ceramic binder, combined with diamond micropowder and nano-alumina, and has ultra-high temperature stability (withstands 1300°C working conditions) and high thermal shock resistance. It is specially used for the precision grinding and polishing of ceramic valves, ceramic cylinder valve plates, piezoelectric functional ceramics and green special refractory ceramics. It can avoid the thermal softening failure problem of traditional metal binders under high temperature and high pressure. The processing surface roughness (Ra) is stably controlled at ≤0.05μm, meeting the high-precision service requirements of special ceramic components.

[0036] Through the synergistic effect of yttrium trioxide (Y2O3) rare earth doping and graphene dispersion, the thermal conductivity (≥80W / m·K) and fracture toughness (≥6MPa·m^1 / 2) of the grinding wheel are significantly improved. When processing piezoelectric ceramics (such as PZT) and thermoelectric ceramics (such as Bi2Te3), it can effectively inhibit the propagation of microcracks and reduce the sub-surface damage depth by 60%, thereby ensuring the electrical performance and reliability of functional ceramic devices.

[0037] The grinding wheel adopts a microwave segmented sintering process (porosity ≤ 3%), combined with the temperature gradient warning mechanism (threshold T-50°C) in the adaptive control method. When processing silicon carbide (SiC)-based green refractory ceramics, the grinding ratio (G-ratio) is increased to 1200, and the tool life is extended by 3 times, which is suitable for the large-scale continuous processing needs of high-temperature kiln refractory linings.

[0038] Based on the digital twin model and particle swarm optimization algorithm, it can compensate for the thermal deformation of machine tools and the nonlinear deformation of ceramic workpieces in real time, realize the geometric tolerance (±1μm) of thin-walled parts such as ceramic cylinder valve plates (thickness ≤1mm), support the rapid changeover processing of industrial robot flexible manufacturing cells (FMC), and improve production efficiency by 40%. DETAILED DESCRIPTION

[0039] The technical solutions of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments; based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0040] The present invention provides a special ceramic diamond composite grinding wheel for a multi-axis linkage polishing machine tool, comprising the following components in parts by mass:

[0041] Diamond micro powder: 45-55 parts;

[0042] Nano-alumina: 3-8 parts;

[0043] Silicon nitride ceramic binder: 25-35 parts;

[0044] Graphene dispersion: 2-4 parts;

[0045] Yttrium trioxide: 1-3 parts;

[0046] Polyetheretherketone: 2-5 parts.

[0047] The ceramic binder in this embodiment is silicon nitride, and the rare earth element is yttrium trioxide.

[0048] The method for preparing the diamond grinding wheel of this embodiment comprises the following steps:

[0049] S1. Mixing: Diamond micropowder and nano-alumina are mixed in a vacuum ball mill for 2-4 hours at a speed of 800-1200 rpm, and then ultrasonically dispersed ceramic binder and graphene dispersion are added;

[0050] S2. Molding: The embryonic body is formed by cold isostatic pressing at 200-240 MPa, and the pore structure is optimized by laser selective sintering.

[0051] S3. Segmented sintering: pre-sinter at 600-650°C in a nitrogen atmosphere for 60-80 min, then microwave sinter at 1200-1300°C for 120-150 min, with a heating rate controlled at 8°C / min.

[0052] An adaptive control method for a special ceramic diamond composite grinding wheel of a multi-axis linkage polishing machine tool comprises the following steps:

[0053] S1. Multi-source data collection:

[0054] The surface temperature field of the grinding wheel is monitored in real time by an infrared thermal imager. When the local temperature reaches the binder softening temperature threshold (T-50°C), the coolant flow rate is dynamically adjusted.

[0055] S2. Dynamic feature extraction:

[0056] Based on the acoustic emission signal, the risk points of edge collapse of the piezoelectric ceramic workpiece are located, and the B / C axis linkage of the machine tool is controlled to generate a NURBS compensation path to suppress the propagation of microcracks.

[0057] S3. Parameter optimization decision:

[0058] Use digital twin models to predict thermal deformation errors of silicon carbide refractory ceramics, optimize X / Y / Z axis feed rates, and ensure machining accuracy ≤ 1μm;

[0059] S4, multi-axis collaborative execution:

[0060] Generate NURBS curve compensation path through CAM system to control the linkage between B-axis and C-axis of machine tool to realize surface topography error compensation;

[0061] Adaptive PID controller is used to adjust the X / Y / Z axis feed rate, with a response delay time of ≤20ms;

[0062] After every 50 reciprocating operations, the control parameters are automatically updated and stored in the process database.

[0063] In step S2 of this embodiment, for the processing of thermoelectric ceramics (Bi2Te3), the cutting force ratio is dynamically controlled at 0.6, and the surface residual stress is reduced to ≤50 MPa.

[0064] Example 1:

[0065] A special vitrified diamond composite grinding wheel for a multi-axis linkage polishing machine tool comprises the following components in parts by mass:

[0066] Diamond micro powder: 45 parts;

[0067] Nano-alumina: 3 parts;

[0068] Silicon nitride ceramic binder: 25 parts;

[0069] Graphene dispersion: 2 parts;

[0070] Graphene dispersion: 1 part;

[0071] Polyetheretherketone: 2 parts.

[0072] The ceramic binder in this embodiment is silicon nitride, and the rare earth element is yttrium trioxide.

[0073] The method for preparing the diamond grinding wheel of this embodiment comprises the following steps:

[0074] S1. Mixing: Diamond micropowder and nano-alumina were mixed in a vacuum ball mill for 2 h at a speed of 800 rpm, and then ultrasonically dispersed ceramic binder and graphene dispersion were added;

[0075] S2, molding process: cold isostatic pressing is used to form the embryonic body at 200MPa, and the pore structure is optimized by laser selective sintering;

[0076] S3. Segmented sintering: pre-sinter at 600°C for 60 min in a nitrogen atmosphere, then microwave sinter at 1200°C for 120 min, with a heating rate of 8°C / min.

[0077] An adaptive control method for a special ceramic diamond composite grinding wheel of a multi-axis linkage polishing machine tool comprises the following steps:

[0078] S1. Multi-source data collection:

[0079] The surface temperature field of the grinding wheel is monitored in real time by an infrared thermal imager. When the local temperature reaches the binder softening temperature threshold (T-50°C), the coolant flow rate is dynamically adjusted.

[0080] S2. Dynamic feature extraction:

[0081] Based on the acoustic emission signal, the risk points of edge collapse of the piezoelectric ceramic workpiece are located, and the B / C axis linkage of the machine tool is controlled to generate a NURBS compensation path to suppress the propagation of microcracks.

[0082] S3. Parameter optimization decision:

[0083] Use digital twin models to predict thermal deformation errors of silicon carbide refractory ceramics, optimize X / Y / Z axis feed rates, and ensure machining accuracy ≤ 1μm;

[0084] S4, multi-axis collaborative execution:

[0085] Generate NURBS curve compensation path through CAM system to control the linkage between B-axis and C-axis of machine tool to realize surface topography error compensation;

[0086] Adaptive PID controller is used to adjust the X / Y / Z axis feed rate, with a response delay time of ≤20ms;

[0087] After every 50 reciprocating operations, the control parameters are automatically updated and stored in the process database.

[0088] In step S2 of this embodiment, for the processing of thermoelectric ceramics (Bi2Te3), the cutting force ratio is dynamically controlled at 0.7, and the surface residual stress is reduced to ≤50 MPa.

[0089] Example 2:

[0090] A special vitrified diamond composite grinding wheel for a multi-axis linkage polishing machine tool comprises the following components in parts by mass:

[0091] Diamond micro powder: 55 parts;

[0092] Nano-alumina: 8 parts;

[0093] Silicon nitride ceramic binder: 35 parts;

[0094] Graphene dispersion: 4 parts;

[0095] Graphene dispersion: 3 parts;

[0096] Polyetheretherketone: 5 parts.

[0097] The ceramic binder in this embodiment is silicon nitride, and the rare earth element is yttrium trioxide.

[0098] The method for preparing the diamond grinding wheel of this embodiment comprises the following steps:

[0099] S1. Mixing: Diamond micropowder and nano-alumina were mixed in a vacuum ball mill for 4 h at a speed of 1200 rpm, and then ultrasonically dispersed ceramic binder and graphene dispersion were added;

[0100] S2. Molding: The embryonic body is formed by cold isostatic pressing at 240 MPa, and the pore structure is optimized by laser selective sintering.

[0101] S3. Segmented sintering: pre-sinter at 650°C for 80 min in a nitrogen atmosphere, then microwave sinter at 1300°C for 150 min, with a heating rate of 8°C / min.

[0102] An adaptive control method for a special ceramic diamond composite grinding wheel of a multi-axis linkage polishing machine tool comprises the following steps:

[0103] S1. Multi-source data collection:

[0104] The surface temperature field of the grinding wheel is monitored in real time by an infrared thermal imager. When the local temperature reaches the binder softening temperature threshold (T-50°C), the coolant flow rate is dynamically adjusted.

[0105] S2. Dynamic feature extraction:

[0106] Based on the acoustic emission signal, the risk points of edge collapse of the piezoelectric ceramic workpiece are located, and the B / C axis linkage of the machine tool is controlled to generate a NURBS compensation path to suppress the propagation of microcracks.

[0107] S3. Parameter optimization decision:

[0108] Use digital twin models to predict thermal deformation errors of silicon carbide refractory ceramics, optimize X / Y / Z axis feed rates, and ensure machining accuracy ≤ 1μm;

[0109] S4, multi-axis collaborative execution:

[0110] Generate NURBS curve compensation path through CAM system to control the linkage between B-axis and C-axis of machine tool to realize surface topography error compensation;

[0111] Adaptive PID controller is used to adjust the X / Y / Z axis feed rate, with a response delay time of ≤20ms;

[0112] After every 50 reciprocating operations, the control parameters are automatically updated and stored in the process database.

[0113] In step S2 of this embodiment, for the processing of thermoelectric ceramics (Bi2Te3), the cutting force ratio is dynamically controlled at 0.65, and the surface residual stress is reduced to ≤50 MPa.

[0114] Example 3:

[0115] A special vitrified diamond composite grinding wheel for a multi-axis linkage polishing machine tool comprises the following components in parts by mass:

[0116] Diamond micro powder: 50 parts;

[0117] Nano-alumina: 5.5 parts;

[0118] Silicon nitride ceramic bond: 30 parts;

[0119] Graphene dispersion: 3 parts;

[0120] Graphene dispersion: 2 parts;

[0121] Polyetheretherketone: 3.5 parts.

[0122] The ceramic binder in this embodiment is silicon nitride, and the rare earth element is yttrium trioxide.

[0123] The method for preparing the diamond grinding wheel of this embodiment comprises the following steps:

[0124] S1. Mixing: Diamond micropowder and nano-alumina were mixed in a vacuum ball mill for 3 h at a speed of 1000 rpm, and then ultrasonically dispersed ceramic binder and graphene dispersion were added;

[0125] S2. Molding process: The embryonic body is formed by cold isostatic pressing at 220 MPa, and the pore structure is optimized by laser selective sintering;

[0126] S3. Segmented sintering: pre-sinter at 625°C for 70 min in a nitrogen atmosphere, then microwave sinter at 1250°C for 135 min, with a heating rate of 8°C / min.

[0127] An adaptive control method for a special ceramic diamond composite grinding wheel of a multi-axis linkage polishing machine tool comprises the following steps:

[0128] S1. Multi-source data collection:

[0129] The surface temperature field of the grinding wheel is monitored in real time by an infrared thermal imager. When the local temperature reaches the binder softening temperature threshold (T-50°C), the coolant flow rate is dynamically adjusted.

[0130] S2. Dynamic feature extraction:

[0131] Based on the acoustic emission signal, the risk points of edge collapse of the piezoelectric ceramic workpiece are located, and the B / C axis linkage of the machine tool is controlled to generate a NURBS compensation path to suppress the propagation of microcracks.

[0132] S3. Parameter optimization decision:

[0133] Use digital twin models to predict thermal deformation errors of silicon carbide refractory ceramics, optimize X / Y / Z axis feed rates, and ensure machining accuracy ≤ 1μm;

[0134] S4, multi-axis collaborative execution:

[0135] Generate NURBS curve compensation path through CAM system to control the linkage between B-axis and C-axis of machine tool to realize surface topography error compensation;

[0136] Adaptive PID controller is used to adjust the X / Y / Z axis feed rate, with a response delay time of ≤20ms;

[0137] After every 50 reciprocating operations, the control parameters are automatically updated and stored in the process database.

[0138] In step S2 of this embodiment, for the processing of thermoelectric ceramics (Bi2Te3), the cutting force ratio is dynamically controlled at 0.75, and the surface residual stress is reduced to ≤50 MPa.

[0139] Example 4:

[0140] A special vitrified diamond composite grinding wheel for a multi-axis linkage polishing machine tool comprises the following components in parts by mass:

[0141] Diamond micro powder: 47 parts;

[0142] Nano-alumina: 4 parts;

[0143] Silicon nitride ceramic binder: 27 parts;

[0144] Graphene dispersion: 2.5 parts;

[0145] Graphene dispersion: 1.5 parts;

[0146] Polyetheretherketone: 3 parts.

[0147] The ceramic binder in this embodiment is silicon nitride, and the rare earth element is yttrium trioxide.

[0148] The method for preparing the diamond grinding wheel of this embodiment comprises the following steps:

[0149] S1. Mixing: Diamond micropowder and nano-alumina were mixed in a vacuum ball mill for 2.5 h at a speed of 900 rpm, and then ultrasonically dispersed ceramic binder and graphene dispersion were added;

[0150] S2. Molding process: The embryo is made by cold isostatic pressing at 210MPa, and the pore structure is optimized by laser selective sintering; a high-strength, anti-sticking and high-temperature solid and liquid packaging bag with a temperature range of -40 degrees to 300 degrees

[0151] S3. Segmented sintering: pre-sinter at 620°C for 65 min in a nitrogen atmosphere, then microwave sinter at 1230°C for 130 min, with a heating rate of 8°C / min.

[0152] An adaptive control method for a special ceramic diamond composite grinding wheel of a multi-axis linkage polishing machine tool comprises the following steps:

[0153] S1. Multi-source data collection:

[0154] The surface temperature field of the grinding wheel is monitored in real time by an infrared thermal imager. When the local temperature reaches the binder softening temperature threshold (T-50°C), the coolant flow rate is dynamically adjusted.

[0155] S2. Dynamic feature extraction:

[0156] Based on the acoustic emission signal, the risk points of edge collapse of the piezoelectric ceramic workpiece are located, and the B / C axis linkage of the machine tool is controlled to generate a NURBS compensation path to suppress the propagation of microcracks.

[0157] S3. Parameter optimization decision:

[0158] Use digital twin models to predict thermal deformation errors of silicon carbide refractory ceramics, optimize X / Y / Z axis feed rates, and ensure machining accuracy ≤ 1μm;

[0159] S4, multi-axis collaborative execution:

[0160] Generate NURBS curve compensation path through CAM system to control the linkage between B-axis and C-axis of machine tool to realize surface topography error compensation;

[0161] Adaptive PID controller is used to adjust the X / Y / Z axis feed rate, with a response delay time of ≤20ms;

[0162] After every 50 reciprocating operations, the control parameters are automatically updated and stored in the process database.

[0163] In step S2 of this embodiment, for the processing of thermoelectric ceramics (Bi2Te3), the cutting force ratio is dynamically controlled at 0.8, and the surface residual stress is reduced to ≤50 MPa.

[0164] Example 5: Ceramic Cylinder Valve Plate Processing

[0165] The grinding wheel parameters of Example 1 were used to polish a silicon nitride ceramic cylinder valve plate (thickness 0.8 mm): the surface roughness after processing was Ra = 0.04 μm, with no edge chipping; the grinding wheel life was 3.2 times that of traditional resin bonds; the adaptive control response time was ≤ 20 ms, and the processing efficiency was improved by 45%.

[0166] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0167] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A special ceramic diamond composite grinding wheel for a multi-axis linkage polishing machine tool, characterized in that: It includes the following components by mass: Diamond micro powder: 45-55 parts; Nano-alumina: 3-8 parts; Silicon nitride ceramic binder: 25-35 parts; Graphene dispersion: 2-4 parts; Yttrium trioxide: 1-3 parts; Polyetheretherketone: 2-5 parts. The grinding wheel is specially used for the precision grinding and polishing of ceramic valves, ceramic cylinder valve plates, piezoelectric ceramics, thermoelectric functional ceramics and silicon carbide-based green refractory ceramics.

2. The special ceramic diamond composite grinding wheel for a multi-axis linkage polishing machine tool according to claim 1, characterized in that: The silicon nitride ceramic binder has a grain size of ≤200 nm, a porosity of ≤3%, and a Vickers hardness of ≥1800 HV, and is suitable for processing thin-walled ceramic parts with a thickness of ≤1 mm.

3. The special ceramic diamond composite grinding wheel for a multi-axis linkage polishing machine tool according to claim 1, characterized in that: The preparation method of the diamond grinding wheel comprises the following steps: S1. Mixing: Diamond micropowder and nano-alumina are mixed in a vacuum ball mill for 2-4 hours at a speed of 800-1200 rpm, and then ultrasonically dispersed ceramic binder and graphene dispersion are added; S2. Molding: The embryonic body is formed by cold isostatic pressing at 200-240 MPa, and the pore structure is optimized by laser selective sintering. S3. Segmented sintering: pre-sinter at 600-650°C in a nitrogen atmosphere for 60-80 min, then microwave sinter at 1200-1300°C for 120-150 min, with a heating rate controlled at 8°C / min.

4. An adaptive control method for a special ceramic diamond composite grinding wheel of a multi-axis linkage polishing machine tool, characterized in that: The following steps are involved: S1. Multi-source data collection: The surface temperature field of the grinding wheel is monitored in real time by an infrared thermal imager. When the local temperature reaches the binder softening temperature threshold (T-50°C), the coolant flow rate is dynamically adjusted. S2. Dynamic feature extraction: Based on the acoustic emission signal, the risk points of edge collapse of the piezoelectric ceramic workpiece are located, and the B / C axis linkage of the machine tool is controlled to generate a NURBS compensation path to suppress the propagation of microcracks. S3. Parameter optimization decision: Use digital twin models to predict thermal deformation errors of silicon carbide refractory ceramics, optimize X / Y / Z axis feed rates, and ensure machining accuracy ≤ 1μm; S4, multi-axis collaborative execution: Generate NURBS curve compensation path through CAM system to control the linkage between B-axis and C-axis of machine tool to realize surface topography error compensation; Adaptive PID controller is used to adjust the X / Y / Z axis feed rate, with a response delay time of ≤20ms; After every 50 reciprocating operations, the control parameters are automatically updated and stored in the process database.

5. The adaptive control method for a special ceramic diamond composite grinding wheel of a multi-axis linkage polishing machine according to claim 4, characterized in that: In step S2, for the processing of thermoelectric ceramics (Bi2Te3), the cutting force ratio is dynamically controlled in the range of 0.6-0.8, and the surface residual stress is reduced to ≤50 MPa.