Cold plate device with intersection type double flow channels

Abstract

The invention relates to a cold plate device with intersected double flow channels. The cold plate device comprises a cold plate body and a cover plate, the cold plate body comprises a substrate, a peripheral structure, an inner side flow guide structure and at least two heat dissipation fins. The substrate is provided with a heat dissipation surface. The peripheral structure is arranged on the heat dissipation surface, and a heat exchange space is defined by the peripheral structure. The inner side flow guide structure is arranged on the heat dissipation face in the peripheral structure and forms an intersection type double flow channel which distributes and converges in a reciprocating mode. The at least two heat dissipation fins are arranged in the intersection type double flow channel. The cover plate covers the cold plate body and is provided with a fluid input port and a fluid output port. After a cooling fluid enters the cold plate body through the fluid input port, heat exchange is carried out between the cooling fluid and the heat dissipation fins in the intersection type double flow channels.

Description

Technical Field

[0001] The present application relates to a cold plate device, and in particular to a cold plate device with intersecting double flow channels. Background Art

[0002] In electronic devices such as personal computers or servers, a heat dissipation module is usually installed inside to cool the processor, and most common heat dissipation modules are cold plate modules that use water cooling.

[0003] Generally speaking, common cold plate modules on the market mainly allow cooling fluid to enter the cold plate from an inlet on one side, flow through the entire row of fins for heat exchange, and finally be discharged from the outlet on the other side. Among them, although a large number of fins are installed inside the cold plate for heat exchange, this unidirectional flow design can easily cause the cooling fluid to concentrate in the shortest direct path between the inlet and outlet in actual applications, resulting in insufficient fluid flux in the edge area of the cold plate. This uneven fluid distribution can cause a significant difference in the heat dissipation effect of the cold plate, especially in the corners, where heat is easily accumulated, resulting in reduced overall heat dissipation efficiency and even possible local overheating of the processor, which in turn leads to problems with system stability and reliability. Summary of the Invention

[0004] In view of the fact that in conventional technologies, existing cold plates often have a relatively simple design for the flow path of the cooling fluid, resulting in uneven heat dissipation efficiency across the cold plate, which is relatively easy to affect the stability of electronic components. Therefore, the main purpose of the present invention is to provide a cold plate device that can evenly dissipate heat from electronic components through a unique structural design.

[0005] In order to solve the problems of the conventional technology, the present invention adopts a necessary technical means to provide a cold plate device with intersecting double flow channels, which includes a cold plate body and a cover plate.

[0006] The cold plate body includes a base plate, a peripheral structure, an inner guide structure and at least two heat dissipation fins. The base plate has a heat dissipation surface and a heat absorption surface opposite to the heat dissipation surface and is used for thermal connection with an electronic component.

[0007] The peripheral structure is disposed on the heat dissipation surface and includes two side panels and two end panels. The two side panels are spaced apart from each other and extend along a length direction. The two end panels extend from one end of the two side panels to the other end of the two side panels along a width direction perpendicular to the length direction to enclose a heat exchange space, and the heat exchange space is provided with at least two fin setting areas along the length direction, and each of the fin setting areas includes a central channel, two fin setting partitions, and two side channels. The two fin setting partitions are located on both sides of the central channel, and the two side channels are located on the other side of the two fin setting partitions relative to the central channel.

[0008] The inner guide structure is arranged on the heat dissipation surface within the outer structure, and the central channel is connected to the two side channels respectively through the two fin arrangement partitions to form an intersecting double flow channel that reciprocates between the diversion and confluence.

[0009] At least two heat dissipating fins are arranged along the length direction in the two fin arrangement partitions of the fin arrangement area and extend along the width direction respectively.

[0010] The cover plate is covered with the cold plate body and has a fluid input port and a fluid output port, the fluid input port corresponds to the central channel of one of the input end fin setting areas of the fin setting area, and the fluid output port corresponds to the central channel of one of the output end fin setting areas of the fin setting area, and the fin setting areas are arranged in sequence along the length direction from the input end fin setting area to the output end fin setting area.

[0011] When a cooling fluid enters the cold plate body through the fluid input port, it exchanges heat with the heat dissipation fins in the intersecting double flow channels to dissipate heat from the electronic components.

[0012] In an auxiliary technical means derived from the above-mentioned necessary technical means, the inner guide structure also includes n central diversion guide plates and (2n-2) side guide structures, and the n central diversion guide plates and the (2n-2) side guide structures are arranged in sequence and staggered along the length direction between the fin setting areas, and n is a positive integer greater than 0.

[0013] In an auxiliary technical means derived from the above necessary technical means, each of the heat dissipation fins has a fin thickness, and there is a fin spacing between any two adjacent heat dissipation fins, and the fin spacing is between 1 times and 1.5 times the fin thickness.

[0014] In an auxiliary technical means derived from the above necessary technical means, each of the fin setting areas has a fin area length in the length direction, and the fin area lengths of the fin setting areas decrease along the length direction.

[0015] As described above, the cold plate device with a curved flow channel of the present invention mainly forms an intersecting double flow channel in the peripheral structure that diverts and converges each other through the inner side guide structure. Therefore, the flow rate of the cooling fluid will gradually increase after entering the heat exchange space, which can effectively make the entire electronic component dissipate heat evenly, thereby avoiding the occurrence of local overheating of the electronic component and effectively increasing the stability of the overall heat dissipation.

[0016] The specific embodiments of the present invention will be further described with reference to the following embodiments and accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0018] Figure 1 A three-dimensional schematic diagram showing a cold plate device with intersecting dual flow channels provided by a preferred embodiment of the present invention;

[0019] Figure 2 A schematic exploded perspective view showing a cold plate device with intersecting dual flow channels according to a preferred embodiment of the present invention;

[0020] Figure 3 A schematic plan view showing the cold plate body of the present invention;

[0021] Figure 4 Schematic diagram of regional distribution of heat exchange space;

[0022] Figure 5 for Figure 3 A magnified schematic diagram of circle A;

[0023] Figure 6 A schematic plan view showing the flow direction of the cooling fluid within the cold plate body;

[0024] Figure 7 A schematic exploded perspective view showing a cold plate device with intersecting dual flow channels and electronic components provided by a preferred embodiment of the present invention; and

[0025] Figure 8 A three-dimensional schematic diagram showing a cold plate device with intersecting dual flow channels and electronic components provided by a preferred embodiment of the present invention.

[0026] Description of the accompanying drawings:

[0027] 100: Cold plate device with intersecting double flow channels

[0028] 1: Cold plate body

[0029] 11:Substrate

[0030] 111: Heat dissipation surface

[0031] 12: Peripheral structure

[0032] 121,122: Side panels

[0033] 123,124: End plate

[0034] 13: Inner guide structure

[0035] 131: Center diversion guide

[0036] 132,133: Side guide structure

[0037] 134: Center diversion guide

[0038] 14: Heat sink fins

[0039] 2: Cover

[0040] 21: Cover body

[0041] 211: Fluid input port

[0042] 212: Fluid output port

[0043] 22: Fluid Supply Department

[0044] 23: Fluid output

[0045] 200: Electronic components

[0046] 300: Circuit board

[0047] 400: Heat dissipation module fixing seat

[0048] D1: Length direction

[0049] D2: width direction

[0050] t1: fin thickness

[0051] d1: Fin spacing

[0052] HS: Heat exchange space

[0053] FS1, FS2, FS3, FS4: fin setting area

[0054] FS11,FS12,FS21,FS22,FS31,FS32,FS41,FS42: Fin setting partition

[0055] h1,h2,h3,h4: fin area length

[0056] CP1, CP2, CP3, CP4: Center channel

[0057] SW11, SW12, SW21, SW22, SW31, SW32, SW41, SW42: Side channel DETAILED DESCRIPTION

[0058] See also Figure 1 and Figure 2 , Figure 1 A three-dimensional schematic diagram showing a cold plate device with intersecting dual flow channels provided by a preferred embodiment of the present invention; Figure 2 A schematic diagram of a three-dimensional decomposition of a cold plate device with intersecting double flow channels provided by a preferred embodiment of the present invention is shown. Figure 1 and Figure 2 As shown, a cold plate device 100 with intersecting double flow channels includes a cold plate body 1 and a cover plate 2 .

[0059] The cold plate body 1 includes a base plate 11 , a peripheral structure 12 , an inner guide structure 13 and at least two heat dissipation fins 14 (only one is shown in the figure). The base plate 11 has a heat dissipation surface 111 .

[0060] The peripheral structure 12 is disposed on the heat dissipation surface 111 and includes two side panels 121 and 122 and two end panels 123 and 124. The side panels 121 and 122 are spaced apart and extend along a longitudinal direction D1. The end panels 123 and 124 extend from one end of each side panel 121 and 122 to the other end of each side panel 121 and 122 along a width direction D2 perpendicular to the longitudinal direction D1. In this embodiment, the entire peripheral structure 12 is integrally connected to the heat dissipation surface 111, and the side panels 121 and 122 and the end panels 123 and 124 are also integrally connected to each other to enclose a heat exchange space HS.

[0061] Please continue reading Figure 3 and Figure 4 , Figure 3 A schematic plan view showing the cold plate body of the present invention, Figure 4 Figure 2 is a schematic diagram of the regional distribution of heat exchange space. Figures 1 to 4As shown, the heat exchange space HS is provided with four fin setting areas FS1, FS2, FS3 and FS4 along the length direction D1, and the fin setting areas FS1, FS2, FS3 and FS4 respectively have a fin area length h1, h2, h3 and h4 in the length direction D1, and the fin area lengths h1, h2, h3 and h4 decrease along the length direction D1; wherein, taking the fin setting area FS1 as an example, the fin setting area FS1 includes a central channel CP1, two fin setting partitions FS11 and FS12 and two side channels SW11 and SW12, the two fin setting partitions FS11 and FS12 are located on both sides of the central channel CP1, and the two side channels SW11 and SW12 are respectively located on the other side of the two fin setting partitions FS11 and FS12 relative to the central channel CP1.

[0062] Similarly, fin arrangement area FS2 includes a central channel CP2, two fin arrangement subareas FS21 and FS22, and two side channels SW21 and SW22. The two fin arrangement subareas FS21 and FS22 are located on either side of central channel CP2, and the two side channels SW21 and SW22 are located on the other side of the two fin arrangement subareas FS21 and FS22 relative to central channel CP2. The two side channels SW21 and SW22 are connected to the two side channels SW11 and SW12, respectively.

[0063] Fin arrangement area FS3 includes a central channel CP3, two fin arrangement subareas FS31 and FS32, and two side channels SW31 and SW32. The two fin arrangement subareas FS31 and FS32 are located on either side of central channel CP3, and the two side channels SW31 and SW32 are located on the other side of the two fin arrangement subareas FS31 and FS32 relative to central channel CP3. Central channel CP3 is connected to central channel CP2.

[0064] Fin arrangement area FS4 includes a central channel CP4, two fin arrangement subareas FS41 and FS42, and two side channels SW41 and SW42. The two fin arrangement subareas FS41 and FS42 are located on either side of central channel CP4, and the two side channels SW41 and SW42 are located on the other side of the two fin arrangement subareas FS41 and FS42 relative to central channel CP4. The two side channels SW41 and SW42 are connected to the two side channels SW31 and SW32, respectively.

[0065] The inner flow guide structure 13 includes a central flow diverter plate 131, two side flow diverter structures 132 and 133, and a central flow diverter plate 134. The central flow diverter plate 131, the two side flow diverter structures 132 and 133, and the central flow diverter plate 134 are arranged in a staggered manner along the length direction D1 between the fin arrangement areas FS1, FS2, FS3, and FS4. Furthermore, in the present invention, the inner flow diverter structure 13 may include n central flow diverter plates and (2n-2) side flow diverter structures, where n is a positive integer greater than 0. In this embodiment, n = 2 is used as an example, but this is not limited to other embodiments.

[0066] To summarize, and more specifically, central flow guide plate 131 is located between fin mounting areas FS1 and FS2, thereby blocking central channels CP1 and CP2, connecting side channel SW11 to side channel SW21, and connecting side channel SW12 to side channel SW22. Side flow guide structures 132 and 133 are located between fin mounting areas FS2 and FS3. Side flow guide structure 132 blocks side channel SW21 from side channel SW31, while side flow guide structure 133 blocks side channel SW22 from side channel SW32, connecting central channel CP2 to central channel CP3. Central flow guide plate 134 is located between fin mounting areas FS3 and FS4, thereby blocking central channels CP3 and CP4, connecting side channel SW31 to side channel SW41, and connecting side channel SW32 to side channel SW42.

[0067] As a result, the inner guide structure 13 will construct a converging double flow channel (not shown in the figure) within the outer structure 12, which diverts and converges the flow back and forth with each other, wherein a bending flow channel (not shown in the figure) of the converging double flow channel is connected from the center channel CP1 to the fin setting partition FS11, the side channel SW11, the side channel SW21, the fin setting partition FS21, the center channel CP2, the center channel CP3, the fin setting partition FS31, the side channel SW31, the side channel SW41, the fin setting partition FS41 and the center channel CP4 in sequence; and the other bending flow channel (not shown in the figure) of the converging double flow channel is connected from the center channel CP1 to the fin setting partition FS12, the side channel SW12, the side channel SW22, the fin setting partition FS22, the center channel CP2, the center channel CP3, the fin setting partition FS32, the side channel SW32, the side channel SW42, the fin setting partition FS42 and the center channel CP4 in sequence.

[0068] At least two heat dissipating fins 14 are arranged along the length direction D1 to form fin arrangement sections FS11 , FS12 , FS21 , FS22 , FS31 , FS32 , S41 , and FS42 , and extend along the width direction D2 .

[0069] Please continue reading Figure 5 , Figure 5 for Figure 4 A magnified diagram of circle A. Figure 5 As shown, each heat dissipating fin 14 has a fin thickness t1 , and there is a fin spacing d1 between any two adjacent heat dissipating fins 14 , and the fin spacing d1 is between 1 and 1.5 times the fin thickness t1 .

[0070] Please continue reading Figure 6 , Figure 6 A schematic plan view showing the flow direction of the cooling fluid within the cold plate body. Figures 1 to 6 As shown, the cover plate 2 includes a cover plate body 21, a fluid supply portion 22, and a fluid output portion 23. The cover plate body 21 defines a fluid input port 211 and a fluid output port 212. The fluid supply portion 22 is connected to the cover plate body 21 and communicates with the fluid input port 211. The fluid output portion 23 is connected to the cover plate body 21 and communicates with the fluid output port 212. Among them, the cover plate body 21 is used to cover the cold plate body 1 and seal the heat exchange space HS. When the cold plate body 21 covers the cold plate body 1, the fluid input port 211 is correspondingly connected to the central channel CP1, and the fluid output port is correspondingly connected to the central channel CP4. Therefore, when the cooling fluid enters the heat exchange space HS from the fluid supply part 22 through the fluid input port 211, it will first enter the central channel CP1, and then flow from the central channel CP1 to both sides through the above-mentioned two curved flow channels respectively, and finally, after converging in the central channel CP4, it is discharged from the heat exchange space HS from the fluid output port 212 through the fluid output part 23.

[0071] To summarize, taking the above-mentioned curved flow channel as an example, since in this embodiment, the fin area lengths h1, h2, h3 and h4 decrease along the length direction D1, when the cooling fluid passes through the fin setting partition FS11, the side channel SW11, the side channel SW21, the fin setting partition FS21, the center channel CP2, the center channel CP3, the fin setting partition FS31, the side channel SW31, the side channel SW41, the fin setting partition FS41 and the center channel CP4 in sequence, the gradually decreasing fin area lengths h1, h2, h3 and h4 can make the cross-sectional areas of the fin setting partitions FS11, FS21, FS31 and FS41 also decrease relatively, thereby increasing the flow rate of the cooling fluid when passing through the fin setting partitions FS11, FS21, FS31 and FS41.

[0072] In addition, since in this embodiment, the above-mentioned intersecting dual flow channels share the central channels CP1, CP2, CP3 and CP4, when the cooling fluid flows from the central channel CP1 to the intersecting dual flow channels, it will first converge in the central channel CP2, then diverge in the central channel CP3, and finally converge and discharge in the central channel CP4.

[0073] Please continue reading Figure 7 and Figure 8 , Figure 7 A schematic exploded perspective view showing a cold plate device with intersecting dual flow channels and electronic components provided by a preferred embodiment of the present invention; Figure 8 A three-dimensional schematic diagram showing a cold plate device with intersecting dual flow channels and electronic components provided by a preferred embodiment of the present invention.

[0074] like Figures 1 to 8 As shown, the cold plate device 100 with intersecting dual flow channels of this embodiment is used in practical applications to cool down an electronic component 200. The cold plate device 100 with intersecting dual flow channels of the present invention is thermally connected to the electronic component 200 via a heat-conducting material such as thermal paste, by a heat-absorbing surface (not shown) of a substrate 11 (i.e., the other surface opposite the heat-dissipating surface 111). This allows heat energy generated by the electronic component 200 during operation to be transferred to the heat-dissipating fins 14 disposed on the substrate 11. This allows the cooling fluid entering the curved flow channels to remove the heat energy generated by the electronic component 200 by contacting the heat-dissipating fins 14. Furthermore, as can be seen from the above description, the flow rate of the cooling fluid gradually increases as it passes through the fin-arranged partitions FS11, FS21, FS31, and FS41. Therefore, although the temperature of the cooling fluid gradually increases after entering the heat exchange space, the gradually increasing flow rate allows the entire electronic component 200 to dissipate heat evenly without causing a relatively high temperature in any area, thereby effectively improving the overall heat dissipation stability.

[0075] It should be noted that the electronic component 200 in this embodiment is, for example, a central processing unit, and the electronic component 200 is arranged on a circuit board 300, and the circuit board 300 is also provided with a heat dissipation module fixing seat 400 surrounding the electronic component 200. In actual application, the cold plate device 100 with an intersecting double flow channel of the present invention can be fixed to the heat dissipation module fixing seat 400 through an installation component (not shown in the figure), thereby fixing the cold plate body 1 to the electronic component 200 in a fixed thermal connection.

[0076] The cold plate device with intersecting dual flow channels provided in a preferred embodiment of the present invention can be installed in a server host, for example. The server host can be used for artificial intelligence (AI) computing, edge computing, etc., and can also be used as a 5G server, cloud server, or Internet of Vehicles server.

[0077] In summary, since the cold plate device with a curved flow channel of the present invention is provided with an inner guide structure within the outer structure to form an intersecting double flow channel that diverts and converges each other, and the heat dissipating fins are dispersedly arranged in the intersecting double flow channel, therefore, when the cooling fluid enters the heat exchange space, the gradually increasing flow rate can be used to uniformly dissipate heat for the entire electronic component, effectively avoiding the occurrence of uneven temperature of the electronic component. Therefore, the present invention can indeed effectively increase the stability of the overall heat dissipation.

[0078] The detailed description of the preferred specific embodiments above is intended to more clearly describe the features and spirit of the present invention, rather than to limit the scope of the present invention with the preferred specific embodiments disclosed above. On the contrary, its purpose is to cover various changes and arrangements with equivalents within the scope of the patent scope to be applied for by the present invention. The above-mentioned embodiments only express several implementation methods of the present application, and their descriptions are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that for ordinary technicians in this field, without departing from the concept of the present application, several variations and improvements can be made, which all fall within the scope of protection of the present application. Therefore, the scope of protection of the patent application of this application shall be based on the attached claims.

Claims

1. A cold plate device with a converging double flow channel, characterized in that: include: A cold plate body, comprising: A substrate having a heat dissipation surface and a heat absorption surface disposed opposite to each other, the heat absorption surface facing away from the heat dissipation surface and used for thermal connection to an electronic component; A peripheral structure, disposed on the heat dissipation surface, and comprising: Two side panels are spaced apart from each other and extend along a length direction respectively; and Two end plates, respectively extending from one end of the two side plates along a width direction perpendicular to the length direction to the other end of the two side plates to enclose a heat exchange space, and the heat exchange space is provided with at least two fin arrangement areas along the length direction, and each of the fin arrangement areas includes a central channel, two fin arrangement partitions and two side channels, the two fin arrangement partitions are located on both sides of the central channel, and the two side channels are respectively located on the other side of the two fin arrangement partitions relative to the central channel; an inner flow guide structure, disposed on the heat dissipation surface within the outer structure, and allowing the central channel to connect to the two side channels through the two fin-arranged partitions, thereby forming a reciprocating flow diversion and confluence of the two intersecting double flow channels; and At least two heat dissipating fins are arranged in the two fin arrangement partitions of the fin arrangement area along the length direction and extend along the width direction respectively; and a cover plate covering the cold plate body and having a fluid input port and a fluid output port, wherein the fluid input port corresponds to the central channel of one of the input-end fin arrangement areas of the fin arrangement areas, and the fluid output port corresponds to the central channel of one of the output-end fin arrangement areas of the fin arrangement areas, and the fin arrangement areas are sequentially arranged along the length direction from the input-end fin arrangement area to the output-end fin arrangement area; When a cooling fluid enters the cold plate body through the fluid input port, it exchanges heat with the heat dissipation fins in the intersecting double flow channels to dissipate heat from the electronic components.

2. The cold plate device with intersecting double flow channels according to claim 1, characterized in that: The inner guide structure also includes n central diversion guide plates and 2n-2 side guide structures. The n central diversion guide plates and the 2n-2 side guide structures are arranged in sequence and staggered along the length direction between the fin setting areas, and n is a positive integer greater than 0.

3. The cold plate device with intersecting double flow channels according to claim 1, characterized in that: Each of the heat dissipation fins has a fin thickness, and there is a fin spacing between any two adjacent heat dissipation fins, and the fin spacing is between 1 times and 1.5 times the fin thickness.

4. The cold plate device with intersecting double flow channels according to claim 1, characterized in that: Each of the fin arrangement areas has a fin area length in the length direction, and the fin area lengths of the fin arrangement areas decrease gradually along the length direction.

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