Thermally enhanced electro-optical device

Abstract

The invention relates to a thermally enhanced electro-optical device. In various embodiments, an electro-optical device is provided. The electro-optical device includes a transparent layer. The electro-optical device also includes a heat sink mechanically coupled to and embedded in the transparent layer, wherein the heat sink includes a first heat sink portion and a second heat sink portion. The electro-optical device also includes electronic circuitry disposed on the substrate, a first post configured to mechanically couple a first heat sink portion to an electronic circuit system and to transfer heat generated by the electronic circuit system to the first heat sink portion, and a second post configured to mechanically couple a second heat sink portion to an electronic circuit system and to transfer heat generated by the electronic circuit system to the second heat sink portion and a second column.

Description

Technical Field

[0001] Example embodiments of the present disclosure relate generally to heat dissipation, and particularly to heat dissipation in electro-optical devices. Background Art

[0002] Various electro-optical devices may generate heat while performing their respective functions. However, the temperature of the various parts of the electro-optical device may need to be maintained within operating limits.

[0003] Applicants have discovered many technical challenges and difficulties associated with heat dissipation in electro-optical devices. Through effort, ingenuity and innovation, Applicants have addressed the problems associated with heat dissipation by developing solutions embodied in the present disclosure, which are described in detail below. Summary of the Invention

[0004] Various embodiments described herein relate to systems, apparatus, devices, products, and / or methods for thermal improvement of electro-optical devices.

[0005] In various embodiments, an electro-optical device includes a transparent layer. The electro-optical device also includes a heat sink mechanically coupled to and embedded in the transparent layer, wherein the heat sink includes a first heat sink portion and a second heat sink portion. The electro-optical device also includes: electronic circuitry disposed on the substrate; a first post configured to mechanically couple the first heat sink portion to the electronic circuitry and transfer heat generated by the electronic circuitry to the first heat sink portion; and a second post configured to mechanically couple the second heat sink portion to the electronic circuitry and transfer heat generated by the electronic circuitry to the second heat sink portion.

[0006] In various embodiments, the first pillar and the second pillar include thermally conductive paste. In various embodiments, the first pillar includes a first copper layer mechanically coupled to the electronic circuitry and a first solder layer mechanically coupled to the first heat sink portion, and the second pillar includes a second copper layer mechanically coupled to the electronic circuitry and a second solder layer mechanically coupled to the second heat sink portion.

[0007] In various embodiments, the first heat sink portion includes a first ledge disposed between the first post and the transparent layer and mechanically coupled to the transparent layer using glue, and the second heat sink portion includes a second ledge disposed between the second post and the transparent layer and mechanically coupled to the transparent layer using glue. In various embodiments, the first heat sink portion includes one or more first fins and the second heat sink portion includes one or more second fins, wherein the one or more first fins and the one or more second fins are configured to increase a heat exchange surface between the heat sink and the environment and increase heat dissipation of the heat sink.

[0008] In various embodiments, an electro-optical device includes: a transparent layer; a heat sink including bosses, wherein the bosses are mechanically coupled to the transparent layer; an electronic circuit system deployed on a substrate; and a support member configured to mechanically couple the bosses of the heat sink to the electronic circuit system and transfer heat generated by the electronic circuit system to the heat sink.

[0009] In various embodiments, the bosses of the heat sink are configured to be mechanically coupled to the transparent layer using glue.The electro-optical device may further include a cavity, wherein the cavity is created between the transparent layer, the electronic circuitry, and the support.

[0010] In various embodiments, the support member includes a first post and a second post, the heat sink includes a first heat sink portion and a second heat sink portion, the first post is configured to mechanically couple the first heat sink portion to the electronic circuit system, and the second post is configured to mechanically couple the second heat sink portion to the electronic circuit system. In various embodiments, the support member includes a thermally conductive material.

[0011] In various embodiments, the transparent layer includes at least one of a lens, a lens array, a protective layer, or a refractive filter. In various embodiments, the electronic circuit system includes at least one of a light sensor, a photodiode, or a pixel. The electro-optical device may further include a molding material configured to surround the support and mechanically couple to and hold together the heat sink, the support, the electronic circuit system, and the substrate.

[0012] In various embodiments, the heat sink includes one or more fins configured to increase a heat exchange surface between the heat sink and the environment and to increase heat dissipation by the heat sink.

[0013] In various embodiments, the support member and the heat sink are configured to reduce thermal resistance from the electronic circuit system to the environment. In various embodiments, the support member and the heat sink are configured to maintain a maximum junction temperature of the electronic circuit system below a maximum junction temperature threshold. In various embodiments, the heat sink comprises copper or a copper alloy.

[0014] The electro-optical device may further include one or more bond wires configured to electronically couple at least one of the photosensor, the photodiode, or the pixel to the one or more conductive traces of the substrate.

[0015] In various embodiments, an electro-optical device includes a transparent layer, a heat sink mechanically coupled to the transparent layer, an electronic circuit system disposed on a substrate, and a support configured to mechanically couple the heat sink to the electronic circuit system and transfer heat generated by the electronic circuit system to the heat sink. In various embodiments, the heat sink includes an opening configured to be embedded in the transparent layer. The electro-optical device may also include one or more fins configured to increase the heat exchange surface between the heat sink and the environment and increase heat dissipation of the heat sink. The electro-optical device may also include an electronic circuit system including one or more photosensitive components. The electro-optical device may also include a support surrounding the one or more photosensitive components.

[0016] The above summary of the invention is provided only to summarize some example embodiments to provide a basic understanding of some aspects of the present disclosure. Therefore, it will be appreciated that the above embodiments are merely examples and should not be interpreted as narrowing the scope or spirit of the present disclosure in any way. It will also be appreciated that the scope of the present disclosure encompasses many potential embodiments in addition to the embodiments summarized here, some of which will be further described below. Other technical features can be readily discerned by those skilled in the art from the following figures, description, and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of an electro-optical device.

[0018] Figure 2 is a schematic diagram of an electro-optical device according to various embodiments.

[0019] Figure 3 is a schematic diagram of an electro-optical device according to various embodiments.

[0020] Figure 4 is a schematic diagram of various portions of an electro-optical device according to various embodiments.

[0021] Figure 5 is a flow chart illustrating a method according to various embodiments. DETAILED DESCRIPTION

[0022] Embodiments of the present disclosure will now be described more fully with reference to the accompanying drawings, which illustrate some, but not all, embodiments of the disclosure. Indeed, the various embodiments of the present disclosure may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will satisfy applicable legal requirements. Like reference numerals refer to like elements throughout.

[0023] The phrases "in one embodiment," "according to one embodiment," "in some embodiments," "in various embodiments," etc. generally mean that the particular feature, structure, or characteristic following the phrase may be included in at least one embodiment of the present disclosure, and may be included in more than one embodiment of the present disclosure (importantly, such phrases are not necessarily referring to the same embodiment).

[0024] The word “example” or “exemplary” is used herein to mean “serving as an example, instance, or illustration.” Any implementation described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other implementations.

[0025] If the specification states that a component or feature "may," "could," "may," "should," "will," "preferably," "likely," "typically," "optionally," "for example," "often," or "might" (or other such language) be included or have a certain characteristic, then the particular component or feature is not required to be included or have that characteristic. Such a component or feature may optionally be included in some embodiments, or may be excluded.

[0026] The terms “electronically coupled,” “electronically coupled,” “electronically coupled to,” “in communication with,” “in electronic communication with,” or “coupled” in this disclosure refer to two or more elements or components being coupled by wired means and / or wireless means such that signals, voltage / current, data, and / or information can be sent to and / or received from these elements or components.

[0027] The use of the term "circuitry" as used herein with respect to components of a system or device should be understood to include specific hardware configured to perform the functions associated with the particular circuitry as described herein. The term "circuitry" should be broadly interpreted to include hardware and, in some embodiments, software used to configure the hardware. For example, in some embodiments, "circuitry" may include processing circuitry, communication circuitry, input / output circuitry, etc. In some embodiments, other elements may provide or supplement the functionality of a particular circuitry.

[0028] The term "mechanically coupled" in this disclosure refers to two or more mechanical elements (for example, but not limited to, frames, surfaces, support units, joints, etc.) being physically coupled in various ways, such as directly coupled, coupled through intermediate elements, and / or coupled using (one or more) fasteners, clamps, joints, pin joints, shafts, hinges, adhesives, etc. The term "mechanically coupled" may refer to any of movable, rotatable, rotating, pivoting, fixed, and / or stationary, etc.

[0029] Now refer to Figure 1, provides a schematic diagram illustrating an electro-optical device 100. The electro-optical device may include an electronic circuit system 112 disposed or mounted on a substrate 108. The electronic circuit system 112 may be an electronic chip or die fabricated using silicone. The substrate 108 may be a laminate substrate and may be fabricated using dielectric materials and conductive traces configured to electronically couple to various electronic components. For example, the conductive traces may be electronically coupled to one or more solder balls 104. The electronic circuit system 112 may be electronically coupled to the conductive traces of the substrate using one or more bond wires 114.

[0030] The electronic circuit system 112 may include one or more light-sensitive components 116. The one or more light-sensitive components 116 may include, for example, photodiodes, pixels, light sensors such as infrared sensors, transistors, etc. In an example, the one or more light-sensitive components 116 is a pixel array.

[0031] During operation of the electro-optical device 100, the temperature of the electronic circuit system 112 may increase due to the operation of its various components. It is desirable to maintain the junction temperature of the electronic circuit system 112 below a maximum junction temperature threshold to prevent damage to the electro-optical device 100. For example, the maximum junction temperature may indicate the temperature of the hottest point on the electronic circuit system 112, and it may be necessary to maintain it below the maximum junction temperature threshold. For example, the maximum junction temperature threshold may be between 120° C. and 170° C., such as approximately 150° C.

[0032] The electro-optical device 100 may include one or more molding materials 110 and 118 to improve the mechanical stability of the electro-optical device 100. For example, the molding material may mechanically couple the transparent layer 106 to the substrate 108 to improve the mechanical stability of the electro-optical device 100. The molding material may, for example, include a resin. However, the resin may not be thermally conductive and may not be able to dissipate the heat generated in the electronic circuit system 112 at a sufficient rate. As a result, the junction temperature of the electronic circuit system 112 may increase to the point of failure.

[0033] Various embodiments of the present disclosure provide systems, devices, and methods to facilitate dissipation of heat generated by electronic circuitry in electro-optical devices and to maintain the junction temperature of the electronic circuitry below a maximum junction temperature.

[0034] Now refer to Figure 2 , a schematic diagram illustrating an electro-optical device 200 is provided in accordance with various embodiments of the present disclosure. In various embodiments, a heat sink 204 is provided that is embedded in a transparent layer 210. The heat sink 204 can be configured to dissipate heat generated by the operation of an electronic circuit system 214 and / or one or more photosensitive components 222 disposed on the electronic circuit system 214.

[0035] In various embodiments, electro-optical device 200 includes a transparent layer 210, a heat sink 204 mechanically coupled to transparent layer 210, an electronic circuit system 214 disposed on a substrate 208, and a support 216 configured to mechanically couple heat sink 204 to the electronic circuit system. Support 216 can be configured to transfer heat generated by electronic circuit system 214 to heat sink 204.

[0036] In various embodiments, transparent layer 210 includes at least one of a lens, a lens array, a protective layer, and / or a refractive filter. For example, a lens or lens array can focus or otherwise manipulate incident light beam 234 onto various portions of one or more photosensitive components 222 on electronic circuit system 214. In some examples, transparent layer 210 can serve as a protective layer for one or more photosensitive components 222. In various embodiments, transparent layer 210 is made of at least one of glass, plastic, and / or any other transparent material.

[0037] In various embodiments, electro-optical device 200 can be a light receiving device as described above, or can be a light emitting device. Electronic circuit system 214 can include one or more light emitting components, and transparent layer 210 can be configured to pass emitted light through or otherwise manipulate the emitted light, such as by collimating the emitted light. In various embodiments, heat generated by emitting light, receiving light, and / or various operations of electronic circuit system 214 can be dissipated to the environment using heat sink 204.

[0038] In various embodiments, the heat sink 204 includes an opening configured to be embedded in the transparent layer 210. For example, the heat sink 204 can include a cutout configured to fit within the transparent layer 210. In various embodiments, the heat sink 204 is mechanically coupled to and embedded in the transparent layer 210. The heat sink 204 can, for example, include a boss 240 configured to support the transparent layer 210. The boss 240 can be located between the transparent layer 210 and the support 216.

[0039] In various embodiments, the heat sink 204 is mechanically coupled to the transparent layer 210 at one edge using a layer of glue 236 and directly coupled to the transparent layer 210 at another edge 238. For example, the boss 240 of the heat sink 204 can be mechanically coupled to the support 216 using a layer of glue 236.

[0040] The electro-optical device 200 can include a cavity created between the support 216, the transparent layer 210, the electronic circuit system 214, and / or the heat sink 204. The cavity can be a hollow area through which the incident light beam 234 passes after passing through the transparent layer 210, or through which the light emitted by the electro-optical device 200 passes before reaching the transparent layer 210. In various embodiments, the boss 240 of the heat sink 204 can protrude into the cavity. In various embodiments, the boss 240 of the heat sink 204 can be flush with the support 216. In various embodiments, heat generated by emitting light, receiving light, and / or various operations of the electronic circuit system 214 can pass through the cavity and / or through the support 216 to reach the heat sink 204. In various embodiments, the support 216 is made of a thermally conductive material, such as a thermally conductive adhesive.

[0041] In various embodiments, heat sink 204 completely surrounds transparent layer 210 and / or the cavity. For example, heat sink 204 can be circularly circumscribed around transparent layer 210 and / or the cavity. In some examples, heat sink 204 can be oval, square, or any other geometric shape surrounding transparent layer 210. In some examples, support member 216 can be a single piece, for example, having an annular shape that mechanically couples a single-part heat sink completely surrounding the transparent layer.

[0042] In various embodiments, the heat sink 204 includes multiple portions, each of which is mechanically coupled to one side of the transparent layer 210. For example, the heat sink 204 can include a first heat sink portion 202 and a second heat sink portion 206. The first heat sink portion 202 can be mechanically coupled to one side of the transparent layer 210, and the second heat sink portion 206 can be mechanically coupled to the other side of the transparent layer 210.

[0043] In various embodiments, support member 216 mechanically couples heat sink 204 to electronic circuit system 214. Support member 216 can have various shapes and / or mechanical forms. For example, support member 216 can include a first post 220 and a second post 218, each of which mechanically couples heat sink 204 to electronic circuit system 214. First post 220 can mechanically couple to a first boss of heat sink 204, and second post 218 can mechanically couple to a second boss of heat sink 204.

[0044] In various embodiments, support member 216 transfers heat generated by electronic circuit system 214 to heat sink 204, where it is then dissipated into the environment. In various embodiments, first post 220 is configured to mechanically couple a first heat sink portion to the electronic circuit system and transfer heat generated by the electronic circuit system to the first heat sink portion. In various embodiments, second post 218 is configured to mechanically couple a second heat sink portion to the electronic circuit system and transfer heat generated by the electronic circuit system to the second heat sink portion.

[0045] In various embodiments, the support member 216 is made of a thermally conductive material. For example, the support member 216 (such as the first column 220 and the second column 218) is made of a thermally conductive glue.

[0046] In an exemplary embodiment, the support 216 and the heat sink 204 are configured to reduce the thermal resistance from the electronic circuit system 214 to the environment surrounding the electro-optical device 200. For example, by using a heat sink 204 embedded in the transparent layer 210, and for example by Figure 1 Compared to the electro-optical device 100 shown in which the transparent layer 106 is surrounded by resin, the thermal resistance of the path from the electronic circuitry 214 to the environment is reduced.

[0047] Therefore, in an exemplary embodiment, in electro-optical device 200 , support 216 and heat sink 204 are configured to maintain the maximum junction temperature of the electronic circuitry below a maximum junction temperature threshold. This can reduce the likelihood of malfunctions due to temperature increases in electro-optical device 200 .

[0048] In various embodiments, heat sink 204 includes first heat sink portion 202 and second heat sink portion 206. First post 220 can be configured to mechanically couple first heat sink portion 202 to electronic circuitry 214, and second post 218 can be configured to mechanically couple second heat sink portion 206 to electronic circuitry 214.

[0049] In various embodiments, the heat sink 204 includes one or more fins. The heat sink 204 may include, for example, one or more first fins 230, for example, on the first heat sink portion 202, and one or more second fins 228, for example, on the second heat sink portion 206. The one or more fins are configured to increase the heat exchange surface between the heat sink and the environment and increase the heat dissipation of the heat sink to the environment.

[0050] In various embodiments, the heat sink is made of copper or a copper alloy. Copper has high thermal conductivity and can increase the heat dissipation of the heat sink.

[0051] The electronic circuit system 214 may include one or more light-sensitive components 222. The one or more light-sensitive components 222 may include, for example, photodiodes, pixels, light sensors such as infrared sensors, transistors, etc. In an example, the one or more light-sensitive components 222 are a pixel array.

[0052] In various embodiments, electronic circuit system 214 is disposed on substrate 208. Electro-optical device 200 can be a wire-bonded electro-optical device. For example, electro-optical device 200 can include one or more bonding wires 212. One or more bonding wires 212 can be configured to electronically couple electronic circuit system 214, or components of electronic circuit system 214, to one or more conductive traces of substrate 208.

[0053] In various embodiments, the electro-optical device 200 may include a molding material 224. The molding material 224 may be configured to surround the support 216 and mechanically couple to the heat sink, the support, the electronic circuitry, and the substrate and hold them together. In an example embodiment, the molding material 224 increases the mechanical robustness of the electro-optical device 200. The molding material 224 may include a resin. In an example embodiment, although the molding material 224 may have a high thermal resistance, the use of a heat sink and a low thermal resistance path from the electronic circuitry 214 to the heat sink 204 allows heat dissipation and maintains the maximum junction temperature below the maximum junction temperature threshold. Therefore, in an example embodiment, the electro-optical device described herein provides high mechanical strength and high heat dissipation.

[0054] Now refer to Figure 3 , a schematic diagram illustrating an electro-optical device 300 is provided according to various embodiments of the present disclosure. In various embodiments, the electro-optical device 300 includes a support 216. The support 216 may include a first layer made of copper and / or a copper alloy and a second solder layer made of, for example, tin and / or silver. The support 216 may have various forms and / or shapes as described above.

[0055] In various embodiments, support member 216 includes a first pillar 220 and a second pillar 218. First pillar 220 may include a first copper layer 308 mechanically coupled to electronic circuitry 214 and a first solder layer 310 mechanically coupled to first heat sink portion 202. Similarly, second pillar 218 may include a second copper layer 316 mechanically coupled to electronic circuitry 214 and a second solder layer 318 mechanically coupled to second heat sink portion 206.

[0056] In various embodiments, the first heat sink portion 202 can include a first boss 314, and the second heat sink portion 206 can include a second boss 312. In various embodiments, one end of either boss can extend into the cavity or be flush with the interior of the support member 216. In various embodiments, the first boss 314 is disposed between the first post and the transparent layer and mechanically coupled to the transparent layer using glue. In various embodiments, the second boss 312 is disposed between the second post and the transparent layer and mechanically coupled to the transparent layer using glue. In various embodiments, another surface of the heat sink is in direct contact with the transparent layer. For example, surface 320 or surface 322 of the heat sink 204 can be mechanically coupled to and in direct contact with the transparent layer 210.

[0057] In various embodiments, the first heat sink portion 202 includes one or more first fins 230, and the second heat sink portion 206 includes one or more second fins 228. In various embodiments, the one or more first fins 230 and the one or more second fins 228 are configured to increase the heat exchange surface between the heat sink and the environment and increase heat dissipation of the heat sink.

[0058] In various embodiments, the heat sink may include a portion surrounding the transparent layer, for example having a circular, oval, and / or any other shape. In various embodiments, the heat sink may include one or more fins, each fin also surrounding the transparent layer.

[0059] In various embodiments, the heat sink may also be mechanically coupled to the support, electronic circuitry, and / or substrate using a molded material such as a resin. For example, the area surrounding the support or on either side of the first and second posts may be molded with a reference Figure 2 The mold material 224 is shown and described as similar to the mold material fill. In an exemplary embodiment, the use of a mold material increases the mechanical robustness of the electro-optical device 300.

[0060] Now refer to Figure 4 , a schematic diagram 400 illustrating a disk-shaped transparent layer 408, a ring-shaped heat sink 410, and a ring-shaped support 406 is provided according to various exemplary embodiments of the present disclosure. In various embodiments, the heat sink 410 is shaped to be embedded in the transparent layer 408, and the support 406 is shaped to mechanically couple the heat sink 410 to the electronic circuit system. Figure 4 The shapes of the support, heat sink and transparent layer shown are for illustrative purposes only, and they may have various other shapes, such as oval, square, rectangular, etc. as previously described.

[0061] In various embodiments, the heat sink can have fins of various shapes and / or arrangements. For example, the fins can extend radially from the center of the heat sink or can be arranged as concentric rings on the heat sink.

[0062] Figure 5 is a flow chart illustrating a method 500 for manufacturing an electro-optical device according to various embodiments of the present disclosure. For example, the method 500 may be used to manufacture a reference Figure 2 The electro-optical device 200 described or referenced Figure 3 An electro-optical device 300 is described.

[0063] In various embodiments, the method 500 fabricates the electronic circuit system 214 on the silicone layer at block 502. In various embodiments, the method 500 fabricates one or more optical components, such as light-sensitive components or light-emitting components, on the electronic circuit system 214 at block 504. In various embodiments, the method 500 mounts the silicone layer or the electronic circuit system 214 on the substrate 208 at block 506.

[0064] In various embodiments, the method 500 electronically couples the electronic circuit system 214 to the substrate 108 using one or more bonding wires 212 at block 508. In various embodiments, the method 500 fabricates a support 216 on the silicone layer or electronic circuit system 214 at block 510. In various embodiments, the method 500 includes mounting the heat sink 204 on the support 216 at block 512. In various embodiments, the method 500 embeds the transparent layer 210 in the heat sink 204 at block 514. Figure 5 In various embodiments, fabrication may be performed in any other order(s).

[0065] Many modifications and other embodiments of the disclosures set forth herein will occur to those skilled in the art having the benefit of the foregoing description and the teachings presented in the associated drawings. Although the drawings illustrate certain components of the apparatus and systems according to the various embodiments described herein, it will be understood that various other components may be used in conjunction with the systems according to the various embodiments. Therefore, it will be understood that the disclosure is not limited to the specific embodiments disclosed, and modifications and other embodiments are intended to be included within the scope of the appended claims. Moreover, the steps in the methods according to the various embodiments described above do not necessarily occur in the order depicted in the drawings, and in some cases, one or more of the depicted steps may occur substantially simultaneously, or may involve additional steps. Although specific terms are employed herein, they are used in a general and descriptive sense only, and not for purposes of limitation.

[0066] Additionally, section headings are used herein for consistency or to otherwise provide organizational clarity as suggested by 37 CFR 1.77. These headings should not limit or characterize the disclosure that may be set forth in any claim(s) that may issue from this disclosure.

[0067] The use of broader terms such as "including," "comprising," and "having" should be understood to provide support for narrower terms such as "consisting of," "consisting essentially of," and "consisting essentially of." Use of terms such as "optionally," "may," "might," and "might" with respect to any element of an embodiment means that the element is not required, or, alternatively, the element is required, both options being within the scope of the embodiment(s). Moreover, references to examples are provided for illustrative purposes only and are not intended to be exclusive.

[0068] Although this detailed description has set forth certain embodiments of the disclosure, the appended claims cover other embodiments of the disclosure that differ from the described embodiments according to various modifications and improvements.

Claims

1. An electro-optical device comprising: Transparent layer; a heat sink mechanically coupled to and embedded in the transparent layer, wherein the heat sink comprises: a first heat sink portion; and a second radiator portion; an electronic circuit system disposed on a substrate; The first column is constructed as: mechanically coupling the first heat sink portion to the electronic circuitry; and transferring heat generated by the electronic circuit system to the first heat sink portion; and The second column is constructed as: mechanically coupling the second heat sink portion to the electronic circuitry; and Heat generated by the electronic circuit system is transferred to the second heat sink portion.

2. The electro-optical device according to claim 1, wherein The first pillar and the second pillar include thermally conductive paste.

3. The electro-optical device of claim 1 , wherein: the first pillar comprising a first copper layer mechanically coupled to the electronic circuitry and a first solder layer mechanically coupled to the first heat spreader portion; and The second post includes a second copper layer mechanically coupled to the electronic circuitry and a second solder layer mechanically coupled to the second heat spreader portion.

4. The electro-optical device of claim 1 , wherein: the first heat sink portion comprising a first boss disposed between the first post and the transparent layer and mechanically coupled to the transparent layer using glue; and The second heat sink portion includes a second boss disposed between the second post and the transparent layer and mechanically coupled to the transparent layer using glue.

5. The electro-optical device according to claim 1, wherein The first heat sink portion includes one or more first fins and the second heat sink portion includes one or more second fins, wherein the one or more first fins and the one or more second fins are configured as: increasing the heat exchange surface between the radiator and the environment; as well as Increase the heat dissipation of the radiator.

6. An electro-optical device comprising: Transparent layer; a heat sink comprising a boss, wherein the boss is mechanically coupled to the transparent layer; an electronic circuit system disposed on a substrate; as well as The support member is constructed as follows: mechanically coupling the heat sink boss to the electronic circuitry; and Heat generated by the electronic circuit system is transferred to the heat sink.

7. The electro-optical device according to claim 6, wherein The bosses of the heat sink are configured to be mechanically coupled to the transparent layer using glue.

8. The electro-optical device according to claim 7, wherein The heat sink includes one or more fins, and the one or more fins are configured as follows: increasing the heat exchange surface between the radiator and the environment; as well as Increase the heat dissipation of the radiator.

9. The electro-optical device of claim 6, comprising a cavity, wherein the cavity is created between the transparent layer, the electronic circuitry and the support.

10. The electro-optical device of claim 6, wherein: The support member includes a first column and a second column; The heat sink includes a first heat sink portion and a second heat sink portion; the first post being configured to mechanically couple the first heat sink portion to the electronic circuitry; as well as The second post is configured to mechanically couple the second heat sink portion to the electronic circuitry.

11. The electro-optical device according to claim 6, wherein The support member includes a thermally conductive material.

12. The electro-optical device according to claim 11, wherein The support and the heat sink are configured to reduce thermal resistance from the electronic circuit system to ambient.

13. The electro-optical device according to claim 11, wherein The support and the heat sink are configured to maintain a maximum junction temperature of the electronic circuit system below a maximum junction temperature threshold.

14. The electro-optical device according to claim 11, wherein The heat sink includes copper or a copper alloy.

15. The electro-optical device according to claim 6, wherein The transparent layer includes at least one of a lens, a lens array, a protective layer, or a refractive filter.

16. The electro-optical device according to claim 6, wherein The electronic circuitry includes at least one of a light sensor, a photodiode, or a pixel.

17. The electro-optical device of claim 16, further comprising one or more bond wires configured to electronically couple at least one of the light sensor, the photodiode, or the pixel to one or more conductive traces of the substrate.

18. The electro-optical device of claim 6, further comprising a molding material configured to: surrounding the support member; Mechanically coupled to and holding together the heat sink, the support, the electronic circuitry, and the substrate.

19. An electro-optical device comprising: Transparent layer; a heat sink mechanically coupled to the transparent layer; an electronic circuit system disposed on a substrate; as well as The support member is constructed as follows: mechanically coupling the heat sink to the electronic circuitry; as well as Heat generated by the electronic circuit system is transferred to the heat sink.

20. The electro-optical device of claim 19, wherein: The radiator comprises: an opening configured to be embedded in the transparent layer; and One or more fins, configured to: increasing the heat exchange surface between the heat sink and the environment; and increasing the heat dissipation of the radiator; The electronic circuit system includes one or more light-sensitive components; and The support member surrounds the one or more photosensitive components.

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