Micro fluid heat dissipation device and electronic equipment based on housing inner wall groove structure

Abstract

The present invention discloses a microfluid heat dissipation device and an electronic device based on a groove structure on the inner wall of a shell. The heat dissipation device includes a heat absorption flow channel module, a heat release flow channel module and a driving element. The heat absorption flow channel module is a multi-layer composite film structure. The heat release flow channel module includes a sealing film and a groove flow channel provided on the inner side surface of the electronic device shell. The sealing film is fixed on the inner side surface of the shell of the electronic device, covering and closing the groove flow channel. The present invention uses the groove provided on the inner side surface of the electronic device shell as the heat release flow channel of the heat dissipation device, and utilizes the good thermal conductivity of the electronic device shell and the large contact area with the external environment to improve the heat dissipation effect of the liquid cooling heat dissipation device of the electronic device, thereby ensuring the long-term stable operation of the electronic device. The heat absorption flow channel module in the present invention adopts a multi-layer composite film structure, and there is only a thin film between the cooling medium and the heating element, so the heat transfer path is short, thereby improving the heat dissipation ability of the heat dissipation device for the heating element.

Description

Technical Field

[0001] The present invention belongs to the technical field of micro cooling equipment, and in particular relates to a micro fluid heat dissipation device based on a housing inner wall groove structure and an electronic device. Background Art

[0002] In today's digital age, AI technology is booming at an unprecedented pace. From intelligent voice assistants to image recognition systems, from autonomous driving to a variety of intelligent applications, AI has become deeply integrated into every aspect of our lives. As AI technology continues to evolve, its demand for computing power is growing exponentially. To meet this growing demand, mobile devices such as tablets and mobile phones are constantly upgrading their hardware configurations to enhance their computing capabilities.

[0003] However, this upgrade process has brought new challenges. While the computing power of mobile devices continues to increase, their power consumption is also rising. When running large AI applications, mobile phones and tablets consume significantly more power, and core components such as processors become increasingly overheated. For example, when users use their phones to edit high-definition videos or play AI-powered games, the devices quickly become overheated. This excessive heat not only affects the device's battery life but can also lead to performance degradation, even causing system lag and freezes, severely impacting the user experience.

[0004] Therefore, heat dissipation in mobile devices has become a critical issue that urgently needs to be addressed. Effective heat dissipation technology is crucial for maintaining stable device performance, extending device lifespan, and ensuring a smooth user experience. Failure to address this challenge promptly will significantly hinder the further development of mobile devices in the field of AI applications.

[0005] In order to solve the heat dissipation problem of mobile device terminals, the industry has tried a variety of heat dissipation solutions, but all have certain limitations.

[0006] Common heat sinks used in existing mobile device terminals, such as VC vapor chambers and graphene, have shortcomings. VC vapor chambers transfer heat by absorbing heat through evaporation at high temperatures and releasing heat through condensation at low temperatures. However, their heat flux density is relatively low. When faced with the high heat generated by the increased AI computing power of mobile device terminals, they are prone to "dry heating" and are unable to quickly and effectively dissipate heat. Although graphene has excellent electrical conductivity and other properties, its thermal conductivity is low, and in practical applications it does not meet the ideal requirements for efficient heat dissipation. As a result, when the device is operating at high load, heat accumulates on these heat sinks and cannot be transferred away in a timely manner, thus affecting the overall heat dissipation of the device.

[0007] In terms of air cooling solutions, while traditional fans are widely used and effective in devices like desktop computers, integrating fans into mobile devices, where space is extremely limited, is difficult. Because mobile devices strive for lightweight and portable design, the size and structure of fans conflict with these design requirements. While air cooling with piezoelectric micropumps addresses the size issue to some extent, its adaptability is relatively low. Air-cooled piezoelectric micropumps require very high waterproof and dustproof performance, which cannot meet the waterproof and dustproof requirements of mobile phones. This significantly limits the practical application of piezoelectric micropump air cooling.

[0008] There is also a liquid cooling method such as liquid cooling film. Liquid cooling film increases the thickness and weight of the entire machine and cannot meet the trend of extremely light and thin mobile phones.

[0009] For example, the Chinese patent with patent number CN116489975A discloses "A heat spreader and electronic device", which specifically discloses the following content: "In the related art, electronic devices usually use a heat spreader 40 or a graphite sheet for heat dissipation. The heat spreader 40 or the graphite sheet is set in the electronic device and is close to or abuts against the heating element of the electronic device. The heat generated by the heating element of the electronic device is conducted to other areas of the electronic device through the heat spreader 40 or the graphite sheet, thereby reducing the temperature near the heating element and achieving the purpose of heat dissipation of the electronic device." (Paragraph 0028 of the specification). It can be seen that in the comparative document, the heat dissipation of the mobile device is carried out by the heat spreader or the graphite sheet, and the following content is disclosed about the heat dissipation process: "When the heat spreader is installed inside the electronic device, the second cover plate can be attached to the electronic device. The heat dissipated by the heating device of the electronic device is conducted away through the heat spreader. When the heat spreader is installed inside the electronic device, the second cover plate can be attached to the heating device of the electronic device, and the heat dissipated by the heating device of the electronic device is conducted away through the heat spreader. "(Paragraph 0076 of the specification). It can be seen that the comparative document directly adheres to the heating device of the electronic device (such as the CPU of a mobile phone) through the heat spreader, and conducts the heat of the heating device through the heat spreader. When facing the high heat generated by the mobile device terminal due to the increase in AI computing power, that is, when encountering power shock during AI calculations, this method cannot quickly and effectively disperse the heat, affecting the overall heat dissipation effect of the device. When facing high power shock, a very thick VC heat spreader is required, and the VC heat spreader is rigid as a whole and cannot be folded.

[0010] For another example, the Chinese patent with patent number CN117615557A discloses "A mobile terminal heat dissipation device", which specifically discloses the following content: "The battery cover 11 is arranged on the outside of the shielding cover 3, and the middle part of the battery cover 11 of the mobile terminal 1 is provided with an air inlet 63, and the area and shape are not limited; it also includes a cooling structure 5; the cooling structure 5 is fitted on the outside of the shielding cover 3 and is arranged corresponding to the main heating chip SOC4; the cooling structure 5 provides cooling to the main heating chip SOC4, and the cooling structure 5 adopts a TEC semiconductor cooling plate. It also includes a heat dissipation structure 6; the heat dissipation structure 6 includes a cooling fan 61 and a cooling fin 62, the cooling fan 61 is installed on the upper side of the shell body 12 close to the battery 13, the cooling fan 61 is arranged corresponding to the air inlet 63, the frame 14 is symmetrically provided with air outlets 64 on both sides of the air outlet position of the cooling fan 61, and the cooling fins 62 are symmetrically arranged on both sides of the cooling fan 61, and The heat dissipation fins 62 are horizontally provided with an air duct 65, and the air duct 65 is connected to the air outlet 64” (paragraphs 0040 to 0042 of the specification). It can be seen that in the comparative document, a fan is used to dissipate heat from the mobile terminal, and the specific heat dissipation process is as follows: “When using the present invention, after the main heating chip S0C4 generates heat, the heat is transferred to the shielding device through the thermally conductive TIM material, and then transferred to the thermally conductive TIM material on the other side through the shielding device. The thermally conductive TIM material transfers the heat to the cold surface of the TEC semiconductor refrigeration sheet, and then the cold surface of the TEC semiconductor refrigeration sheet is transferred to the hot surface. The hot surface of the TEC semiconductor refrigeration sheet contacts the cold end of the VC heat sink, and the hot end of the VC heat sink is close to the heat dissipation fins 62. The heat is discharged from the mobile terminal 1 through the air duct 65 and the air outlet 64” (paragraphs 0047 of the specification). It can be seen that the heat dissipation process in the comparative document is to first conduct heat to the main heating chip S0C, and then discharge the heat from the mobile terminal through the fan. With reference to the drawings in the specification of the comparative document Figures 1 to 4 It can be seen that after the fan is integrated into mobile terminals such as mobile phones, its thickness and volume increase. However, mobile devices pursue the design concept of being light, thin and portable. The volume and structure of the fan are contrary to this design requirement and are not suitable for the high-integration light and thin requirements.

[0011] For another example, the Chinese patent with patent number CN119255565A discloses an "Electronic Device", which specifically discloses the following content: "The electronic device 1 includes a back shell 10, a decorative component 20, a heating device 30 and a piezoelectric air-cooling module 40. The back shell 10 has a first opening 10a. The decorative component 20 has a receiving groove 20a, a first air inlet 20b and a first air outlet 20c. The receiving groove 20a is connected to the first opening 10a to form a receiving space 10b. The first air inlet 20b and the first air outlet 20c are both connected to the receiving groove 20a. The heating device 30 is arranged in the receiving space 10b. The piezoelectric air-cooling module 40 is arranged in the receiving space 10b and corresponds to the heating device 30. The piezoelectric air-cooling module 40 includes one or more piezoelectric air-cooling components 410. The piezoelectric air-cooling component 41 0 includes one or more piezoelectric air-cooling units 411." (Paragraph 0028 of the specification). It can be seen that in the comparative document, piezoelectric air-cooling units are used for heat dissipation. The specific heat dissipation process is as follows: "The piezoelectric element 4112 of the piezoelectric air-cooling unit 411 can deform under the control of a control signal, and drive the vibration element 4111 to deform, thereby forming active air cooling to dissipate heat from the heating element 30, thereby achieving a good heat dissipation effect." (Paragraph 0038 of the specification). That is, the piezoelectric air-cooling unit vibrates under the action of the piezoelectric effect, thereby driving the vibration element to vibrate, similar to the effect of a fan, to dissipate heat from the heating element. Although the use of piezoelectric elements for air cooling solves the volume problem to a certain extent, piezoelectric elements for air cooling are very susceptible to external influences. For example, the piezoelectric air-cooling micropump is easily infiltrated by dust and water, and is not easily dustproof and waterproof, which makes it difficult to meet the waterproof and dustproof requirements of mobile phones.

[0012] For another example, the Chinese patent with patent number CN117596838B discloses a "heat sink using a liquid cooling system and a liquid cooling radiator using the heat sink", which specifically discloses the following content: "In order to overcome the defects of the prior art, the technical problem to be solved by the present invention is to propose a heat sink using a liquid cooling system and a liquid cooling radiator using the heat sink, which can overcome the problem that the existing mobile phone case equipped with an air cooling radiator can protect the mobile phone while improving the heat dissipation effect, but a large number of heat dissipation holes need to be opened on the surface of the air cooling mobile phone case, and dust entering can easily cause the air cooling structure to malfunction, resulting in low heat dissipation reliability." (Paragraph 0004 of the description in the comparative document). It can be seen that the invention purpose of the comparative document is to overcome the problem of low reliability of air cooling for mobile phones. In order to achieve the above-mentioned invention purpose, the following technical solutions are disclosed in the comparative document. The solution is "a heat sink using a liquid cooling system, comprising: a mainboard mechanism, the mainboard mechanism comprising a control mainboard, a micro water pump installed near the middle of the top of the control mainboard, four liquid cooling mechanisms arranged on the front side of the control mainboard, the four liquid cooling mechanisms each comprising a first liquid cooling tube, a first connecting tube fixedly connected to the outside of the first liquid cooling tube, a micro solenoid valve installed at the rear end of the first connecting tube, a connecting tube fixedly connected to the top center of the first liquid cooling tube, a second liquid cooling tube fixedly connected to the top of the connecting tube, a second connecting tube fixedly connected to the outside of the second liquid cooling tube, a through-layer tube fixedly connected to the rear end of the second connecting tube, and a bottom end of the through-layer tube connected to the input end of the micro solenoid valve" (paragraph 0006 of the description in the comparative document). It can be seen that in the comparative document, heat is dissipated by the liquid in the liquid cooling tube. Referring again to Figure 3 , it can be seen that two heat absorbing plates and one fin plate are used in the comparative document to conduct heat. The specific working process is as follows: "By pressing the shell 1 on the back of the mobile phone, the shell 1 and the heat sink of the liquid cooling system are fixed to the back of the mobile phone under the action of the curling edge 11. At this time, the processing and analysis module 205 cooperates with the first patch temperature sensor 508 and the second patch temperature sensor 509 to detect the temperature of the mobile phone. When the temperature is high and affects the performance of the mobile phone, the control module 206 controls the micro water pump 202 to start and the micro solenoid valve 307 to start according to the electrical signal transmitted by the processing and analysis module 205, so that the cooling inside the first liquid cooling tube 301 is cooled. "The cooling liquid begins to flow. The cooling liquid inside the first cooling tube 301 absorbs the heat dissipated by the mobile phone and then enters the second cooling tube 304 on the upper layer through the connecting tube 303. The cooling liquid at room temperature in the second cooling tube 304 passes through the through-layer tube 306 and the micro solenoid valve 307 and then enters the first cooling tube 301 to form a circulation, thereby continuously absorbing the heat generated by the mobile phone" (paragraph 0041 of the specification in the reference document). First, its multi-layer plate design is not conducive to improving space utilization, resulting in a large volume and area of ​​the heat sink and the entire liquid cooling radiator, making it difficult to integrate into a micro device and requiring external installation. Summary of the Invention

[0013] The purpose of the present invention is to solve the problems of low thermal conductivity, long heat transfer path and excessive thermal resistance of existing heat dissipation devices, and to provide a micro fluid heat dissipation device and electronic equipment based on a groove structure on the inner wall of a shell.

[0014] In a first aspect, the present invention provides a microfluidic heat dissipation device based on a groove structure on the inner wall of a housing. The device comprises a heat absorption channel module, a heat release channel module, and a drive element. The heat absorption channel module comprises a multi-layer composite membrane structure, including a central channel layer. The channel layer defines a heat absorption channel with a through-groove structure. The two side openings of the heat absorption channel are sealed by adjacent membrane layers.

[0015] The heat-releasing flow channel module includes a sealing film and a groove flow channel provided on the inner side surface of the electronic device housing. The sealing film is fixed to the inner side surface of the electronic device housing, covering and closing the groove flow channel. The sealing film is provided with a first medium exchange interface and a medium drive interface connected to the groove flow channel. The heat-absorbing flow channel module is provided with a second medium exchange interface. The first medium exchange interface is docked with the second medium exchange interface, and the heat-absorbing flow channel and the groove flow channel are connected to form a circulation flow channel. The driving element is connected to the medium drive interface of the sealing film.

[0016] During operation, the drive element continuously drives the cooling medium to circulate, flowing from the heat-absorbing channel of the heat-absorbing channel module to the groove channel of the heat-releasing channel module. This process continuously transfers heat input into the heat-absorbing channel to the groove channel for release through the housing, thereby dissipating heat from the heat source. In the present invention, the cooling medium and the heat source are separated only by a thin film, resulting in an extremely short heat transfer path, a higher heat exchange coefficient, low thermal resistance, and enhanced heat dissipation capability.

[0017] Preferably, there are a plurality of drive elements. The medium drive interface includes a plurality of drive flow interfaces corresponding to the plurality of drive elements. The groove flow channel includes a drive portion and a heat release portion. The drive portion includes a plurality of drive branches arranged in sequence. A partition structure is provided in the middle of the drive branch. The partition structure divides the drive branch into an input section and an output section. Each drive branch corresponds to a drive flow interface. The drive flow interface includes two second flow holes respectively connected to the input section and the output section of the corresponding drive branch. The input port and the output port of the drive element are respectively connected to the two second flow holes of the corresponding drive flow interface.

[0018] Preferably, the heat release portion adopts a multi-stage bifurcated flow channel structure, including a diverter portion and a converging portion. The diverter portion has multiple diverter points. At each diverter point, a flow channel branches into multiple branch flow channels. The converging portion has multiple converging points. At each converging point, multiple flow channels converge into a single converging flow channel.

[0019] Preferably, the microfluidic heat dissipation device further includes a first fluid docking plate. The first fluid docking plate is provided with a plurality of positioning groove structures. A plurality of driving elements are positioned and mounted in the plurality of positioning groove structures. Each positioning groove structure is provided with a transition flow interface. The first fluid docking plate is fixed to the medium drive interface of the sealing film. Corresponding driving elements are connected to the drive flow interfaces via the transition flow interfaces.

[0020] Preferably, the sealing film is provided with a plurality of positioning holes at positions staggered from the groove flow channel, wherein the positioning holes match the positioning posts provided on the inner side of the electronic device housing.

[0021] Preferably, the inner side surface of the housing is provided with a heat dissipation groove whose contour shape matches that of the sealing film. The groove flow channel is provided on the bottom surface of the heat dissipation groove. The sealing film is fitted in the heat dissipation groove.

[0022] Preferably, the sealing film is provided with an infusion hole and an exhaust hole. The infusion hole is used to input cooling medium into the heat absorption channel module and the heat release channel module. The infusion hole is closed after the cooling medium is completed.

[0023] Preferably, the heat absorption channel is divided into a heat exchange portion and a flow collection portion that are interconnected. The heat exchange portion is connected to the second medium exchange interface via the flow collection portion. The heat exchange portion comprises one or more independent heat dissipation units. Each heat dissipation unit corresponds to an input flow channel and an output flow channel in the flow collection portion, and to a fluid inlet and a fluid outlet in the second medium exchange interface. The heat dissipation unit is provided with a bifurcated flow channel structure. The heat exchange portion is used to absorb heat released by the heating element.

[0024] Preferably, the heat absorption channel module includes a first heat dissipation layer, a channel layer, and a second heat dissipation layer stacked in sequence. The first heat dissipation layer and the second heat dissipation layer respectively cover and seal the openings on both sides of the heat absorption channel. The second medium exchange interface is provided on the second heat dissipation layer.

[0025] Preferably, a second fluid docking plate is provided between the first medium exchange interface of the sealing film and the second medium exchange interface of the heat absorption flow channel module.

[0026] In a second aspect, the present invention provides an electronic device comprising a housing and a heating element. The electronic device further comprises the aforementioned microfluid heat sink based on the groove structure on the inner wall of the housing. The heat absorption channel module of the microfluid heat sink is attached to the heating element.

[0027] The present invention has the following beneficial effects.

[0028] The present invention uses a groove opened on the inner side of the electronic device housing as a heat release flow channel of the heat dissipation device, utilizing the good thermal conductivity of the electronic device housing and the large contact area with the external environment to improve the heat dissipation effect of the electronic device liquid cooling heat dissipation device and ensure the long-term stable operation of the electronic device.

[0029] The present invention uses a sealing film to cover the groove opened on the inner side of the electronic device shell to achieve sealing of the groove, and the sealing film is embedded in the groove structure on the inner side of the shell, so that the heat release flow channel module, which originally occupies the most space, is completely integrated with the electronic device shell and no longer occupies the internal space of the electronic device, thereby promoting the lightweight and thinness of the electronic device.

[0030] The heat absorption flow channel module in the present invention adopts a multi-layer composite membrane structure, with only a layer of thin film between the cooling medium and the heating element. The heat transfer path is short and the thermal conductivity coefficient is large, which improves the heat dissipation ability of the heat dissipation device for the heating element. When facing high-power impact, the temperature of the heat source can be more effectively reduced.

[0031] The present invention uses a driving element to drive the cooling medium to flow in the heat-absorbing flow channel module. After absorbing heat from the heat source, the cooling medium enters the groove flow channel of the housing to dissipate heat. The continuous circulation process has a stronger heat dissipation capacity and more effective heat removal. In addition, the present invention uses a piezoelectric micropump as the driving element of the cooling medium. The only sounds in the entire heat dissipation device are the flow of the cooling medium and the operating sound of the piezoelectric micropump. Compared with a fan, its noise is extremely low. At the same time, the piezoelectric micropump has very low power consumption, which helps to improve the endurance of electronic equipment compared to traditional air-cooling solutions. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 This is an overall schematic diagram of Example 1 of the present invention.

[0033] Figure 2 Schematic diagram of the connection between the heat absorbing flow channel module and the heat releasing flow channel module in Example 1 of the present invention.

[0034] Figure 3 It is an exploded view of the heat absorption flow channel module in Example 1 of the present invention.

[0035] Figure 4 Schematic diagram of the groove flow channel in Example 1 of the present invention.

[0036] Figure 5 Schematic diagram of the sealing film in Example 1 of the present invention.

[0037] Figure 6 This is a schematic diagram of the installation positions of the two fluid docking plates in Example 1 of the present invention.

[0038] Figure 7 Schematic diagram of the driving element in Example 1 of the present invention.

[0039] Figure 8 Schematic diagram of the flow path of the cooling medium in Example 1 of the present invention.

[0040] Figure 9 It is an exploded view of the heat absorption flow channel module in Example 2 of the present invention.

[0041] Figure 10 Schematic diagram of the flow channel layer in Example 2 of the present invention.

[0042] Figure 11 Schematic diagram of the groove flow channel in Example 3 of the present invention.

[0043] Figure 12 Schematic diagram of the internal structure of the electronic device in Example 3 of the present invention.

[0044] Reference numerals: 100, housing; 200, heat-releasing flow channel module; 210, sealing film; 211, infusion hole; 212, exhaust hole; 213, drive flow interface; 214, first flow hole; 220, groove flow channel; 221, driving part; 222, heat-releasing part; 223, partition structure; 230, heat dissipation groove; 300, heat-absorbing flow channel module; 310, first heat dissipation layer; 320, second heat dissipation layer; 321, fluid inflow hole; 322, fluid outflow Hole; 330, flow channel layer; 331, heat absorption flow channel; 332, heat exchange part; 340, third heat dissipation layer; 400, heat source; 500, driving element; 510, flow port; 600, second fluid docking plate; 610, fluid inflow channel; 620, fluid outflow channel; 700, first fluid docking plate; 710, transition flow interface; 800, electronic device; 810, chip; 820, screen module; 830, mainboard module; 840, battery module. DETAILED DESCRIPTION

[0045] The present invention will be further described below with reference to the accompanying drawings.

[0046] Example 1

[0047] like Figures 1 to 8 As shown, a microfluidic heat dissipation device based on a housing inner wall groove structure includes a heat absorption channel module 300, a heat release channel module 200, and a driving element 500 installed in the same housing 100 of an electronic device. The housing 100 of the electronic device is made of metal and is an integrated housing structure that does not deform.

[0048] Figure 1 The present embodiment describes the components of a micro fluid heat dissipation device based on the groove structure on the inner wall of the housing. Figure 1As shown, the housing 100 is rectangular in shape and has flange structures around it to form the interior space of the housing 100. The heat absorbing channel module 300 is a three-layer composite flexible film structure, including a first heat dissipation layer 310, a channel layer 330, and a second heat dissipation layer 320 stacked in sequence.

[0049] The heat release channel module 200 includes a sealing film 210 and a groove channel 220 formed on the inner sidewall of the housing. The sealing film 210 is adhered to the inner sidewall of the housing and covers the groove channel 220, sealing the top opening of the groove channel 220. The sealing film 210 is provided with a first medium exchange interface and a medium drive interface. The first medium exchange interface and the medium drive interface of the sealing film 210 are located at one end of the sealing film 210. The drive element 500 is mounted at the medium drive interface of the sealing film 210.

[0050] The end of the heat absorption channel module 300 is provided with a second medium exchange interface. The first medium exchange interface on the sealing film 210 is bonded and connected to the second medium exchange interface on the heat absorption channel module 300. In this embodiment, the sealing film 210 is located in the upper center of the housing 100.

[0051] The heat absorbing channel module 300 is attached to the heat source 400 inside the electronic device. In this embodiment, thermal grease can be applied to the surface of the heat source 400, and then the heat exchange portion 332 of the heat absorbing channel module 300 is fixed to the thermal grease. In other embodiments, thermal adhesive can also be used to glue the heat exchange portion 332 and the heat source 400 together.

[0052] Figure 2 The connection relationship of a micro fluid heat dissipation device based on the groove structure on the inner wall of the shell is described in this embodiment. Figure 2 As shown, in this embodiment, the medium drive interface of the sealing membrane 210 is connected to the input and output ports of the drive element 500 via a first fluid docking plate 700. The first medium exchange interface of the sealing membrane 210 is connected to the second medium exchange interface of the heat absorption channel module 300 via a second fluid docking plate 600. In this embodiment, there are four drive elements 500. The first fluid docking plate 700 is provided with four corresponding transition flow interfaces. In this embodiment, the first and second fluid docking plates 700 and 600 serve to secure and position the seals. The first fluid docking plate 700 and the drive element 500, and the second fluid docking plate 600 and the sealing membrane 210 can be secured using methods such as gluing, welding, soldering, brazing, and friction welding. In this embodiment, the thickness of the heat absorption channel module 300 is 200 to 300 microns, and the thickness of the sealing membrane 210 is 50 to 100 microns. Positioning holes are provided at three corners of the sealing membrane 210.

[0053] Figure 3 The structure and components of the heat absorption channel module 300 of a micro fluid heat dissipation device based on the groove structure on the inner wall of the shell are described in this embodiment. Figure 3 As shown, in this embodiment, the heat absorption channel module 300 includes a second heat dissipation layer 320, a channel layer 330, and a first heat dissipation layer 310, which are stacked in sequence. The channel layer 330 is provided with a heat absorption channel 331 with a through-slot structure. The second heat dissipation layer 320 and the first heat dissipation layer 310 respectively cover and seal the openings on both sides of the through-slot heat absorption channel 331, thereby forming a closed channel within the heat absorption channel module 300.

[0054] The second heat dissipation layer 320 is in contact with the surface of the heat source 400. The cooling medium in the heat absorption channel 331 absorbs the heat of the heat source 400. The outer contours of the second heat dissipation layer 320, the channel layer 330 and the first heat dissipation layer 310 are the same, all in the shape of the letter L. In other embodiments, the outer shape of the heat absorption channel module 300 can be changed according to actual needs. In this embodiment, the second heat dissipation layer 320, the channel layer 330 and the first heat dissipation layer 310 in the heat absorption channel module 300 are the same or different, and can be made of materials such as polymer PET, stainless steel, pure copper, copper alloy, metal polymer composite material, etc.

[0055] In this embodiment, Figure 3 As shown, the heat absorption channel 331 is divided into a heat exchange section 332 and a flow collector, which are interconnected. Compared to the flow collector, the heat exchange section 332 has denser flow channels, a smaller width, and more branches. In the heat absorption channel module 300, the heat exchange section 332 and the second medium exchange interface are located at opposite ends of the heat absorption channel module 300 and connected through the flow collector. The heat exchange section 332 is aligned with the heat source 400.

[0056] In this embodiment, the heat exchange portion 332 is divided into two independent heat dissipation units. The first heat dissipation unit is connected between the first input flow channel and the first output flow channel. The second heat dissipation unit is connected between the second input flow channel and the second output flow channel. The flow channel of each heat dissipation unit is serpentine and adopts a bifurcated flow channel structure that is divided into two relative to the manifold.

[0057] The manifold includes two input channels and two output channels arranged side by side. The second medium exchange interface is located at the side end of the second heat dissipation layer 320 of the heat absorption channel module 300. The second medium exchange interface includes two fluid inlet holes 321 and two fluid outlet holes 322 arranged side by side. The two fluid inlet holes 321 are located at the ends of the two input channels; the two fluid outlet holes 322 are located at the ends of the two output channels; the two fluid inlet holes 321 and the two fluid outlet holes 322 are located at the center, and the two fluid outlet holes 322 are located on both sides.

[0058] The second fluid docking plate 600 is provided with two fluid inlet channels 610 and two fluid outlet channels 620. The two fluid inlet channels 610 are connected to the two fluid inlet holes 321, respectively; the two fluid outlet channels 620 are connected to the two fluid outlet holes 322, respectively. The cooling medium enters the heat absorption channel module 300 through the fluid inlet holes 321, passes through the input channel, the heat exchange portion 332, and the output channel in sequence, and then flows out through the fluid outlet holes 322.

[0059] Figure 4 The structure inside the housing 100 of the electronic device is described. Figure 4 As shown, in this embodiment, the housing 100 is rectangular. A heat dissipation groove 230 is provided on the inner side surface of the housing 100. The groove flow channel 220 is provided on the bottom surface of the heat dissipation groove 230. The sealing film 210 is embedded in the heat dissipation groove 230 and completely covers the groove flow channel 220. The groove flow channel 220 is a heat dissipation groove 230, not a through-groove structure. The heat dissipation groove 230 and the groove flow channel 220 can be formed by etching, laser cutting, and CNC machine milling. The heat dissipation groove 230 is rectangular, and its length, width, and depth are respectively consistent with the length, width, and thickness of the sealing film 210, so that the side of the sealing film 210 facing away from the groove flow channel 220 is flush with the inner surface of the housing 100, thereby making the heat release flow channel module 200 completely not occupy the normal internal space of the electronic device. In addition, the embedded sealing film 210 can improve the sealing performance between the sealing film 210 and the housing 100, reducing the risk of leakage of the cooling medium.

[0060] The cooling medium that absorbs heat in the heat absorption channel module 300 enters the groove channel 220 through the second medium exchange interface, and dissipates heat through the surface of the shell 100 to achieve cooling.

[0061] The groove flow channel 220 includes a driving portion 221 and a heat release portion 222. The driving portion 221 includes four driving branches arranged side by side in sequence. A partition structure 223 is provided in the middle of the driving branch. The partition structure 223 divides the driving branch into an input section and an output section. Each driving branch corresponds to a driving element 500. The input port and the output port of the driving element 500 are aligned and connected with the input section end and the output section end of the driving branch respectively. Every two driving branches form a group. The two driving branches in the same group are connected in parallel. The two groups of driving branches are respectively connected to the two first flow holes 214 located in the middle of the first medium exchange interface of the sealing film 210.

[0062] The heat release portion 222 is connected between the first flow holes 214 on both sides of the first medium exchange interface of the sealing film 210 and the input flow channel of the driving portion 221. The heat release portion 222 adopts a multi-stage bifurcated flow channel structure, including a diversion portion and a converging portion. The diversion portion has multiple levels of diversion points. At each level of diversion point, a flow channel branches into two branch flow channels (it can also branch into a greater number of branch flow channels, such as 3, 4, or 5). The converging portion has multiple levels of converging points. At each level of converging point, two flow channels converge into a converging flow channel (a greater number of flow channels can also converge into a converging flow channel, such as 3, 4, or 5). In this embodiment, the number of levels of the diversion portion and the converging portion are both two. Therefore, the heat release portion 222 presents a structure of "one input flow channel → two first-level branch flow channels → four second-level heat release flow channels → two first-level converging flow channels → one output converging flow channel".

[0063] Figure 5 The structure of the sealing film 210 of the micro fluid heat dissipation device based on the groove structure on the inner wall of the shell is described in this embodiment. Figure 5 As shown, in this embodiment, the sealing film 210 is rectangular with rounded corners. The first medium exchange interface on the sealing film 210 includes four first flow holes 214 arranged side by side. The two first flow holes 214 in the middle are connected to the two fluid inlet holes 321 on the second fluid docking plate 600, respectively; the two first flow holes 214 on the sides are connected to the two fluid outlet holes 322 on the second fluid docking plate 600, respectively.

[0064] The four first flow holes 214 include two first output flow holes located in the middle and first input flow holes located on both sides. The medium drive interface on the sealing membrane 210 includes a first fluid docking plate 700. The first fluid docking plate 700 includes four drive flow interfaces 213 arranged side by side. The drive flow interface 213 includes two second flow holes that are respectively connected to the input section and output section of the corresponding drive branch. The two second flow holes are close to each other and independent, namely the second input flow hole and the second output flow hole. Each drive flow interface 213 corresponds to a drive element 500. The second output flow hole and the second input flow hole of the drive flow interface 213 are connected to the input port and the output port of the corresponding drive element 500 through the first fluid docking plate 700. During operation, the cooling medium flows through the drive flow interface 213 to the two first flow holes 214 in the middle and enters the heat absorption flow channel module 300. The cooling medium outputted from the heat absorption channel module 300 flows back through the first flow holes 214 on both sides to the groove channel 220 to complete the circulation.

[0065] In this embodiment, the sealing film is further provided with an infusion hole 211 and an exhaust hole 212. The infusion hole 211 is used to inject cooling medium into the flow channels of the heat absorption channel module 300 and the heat release channel module 200. The exhaust hole 212 is used to exhaust gas in the flow channels during the injection of cooling medium.

[0066] In some embodiments, the process of injecting the cooling medium is as follows: the infusion hole 211 is sealed, the exhaust hole 212 is vacuumed using a negative pressure pump, the interface for outputting the cooling medium is connected to the infusion hole 211, and the exhaust hole 212 is vacuumed by the negative pressure pump until the cooling medium is injected, and the infusion hole 211 and the exhaust hole 212 are sealed. The infusion hole 211 and the exhaust hole 212 can be sealed using a PET sheet and glue.

[0067] In some embodiments, the sealing film 210 can be made of materials such as high molecular weight PET, stainless steel, copper, copper alloy, and metal-polymer composite materials.

[0068] Figure 6 The structure of the fluid docking plate in a micro fluid heat dissipation device based on the groove structure on the inner wall of the shell is described in this embodiment. Figure 6 As shown, in this embodiment, the driving element 500 is connected to the driving flow interface 213. The driving element 500 and the driving flow interface 213 are connected via a first fluid docking plate 700. The first fluid docking plate 700 is provided with four sequentially arranged transition flow interfaces 710. Each transition flow interface 710 is connected to a corresponding driving flow interface 213. Each transition flow interface 710 is provided with a positioning groove structure for providing positioning for the driving element.

[0069] Figure 7 The structure of the driving element 500 in the micro fluid heat dissipation device based on the groove structure on the inner wall of the shell is described in this embodiment. Figure 7 As shown, in this embodiment, the driving element 500 is a piezoelectric micropump, one end of which is provided with a PCB connection cable for power supply and control. The PCB connection cable is connected to an external power supply and control module. The driving element 500 is provided with two flow ports 510 corresponding to the transition flow interface 710. The cooling medium is driven by the driving element 500, then flows through one side of the driving flow interface 213 to the transition flow interface 710 on one side, and then enters the driving element 500 through the flow port 510 for input. After the driving element 500 pressurizes the cooling medium, it is output through the flow port 510 for output to the flow port 510 on the other side, and then enters the transition flow interface 710 on the other side. During this process, the cooling medium passes through the partition structure of the groove flow channel 220, and finally enters the heat absorption flow channel module 300 through the first circulation hole 214.

[0070] Figure 8 This embodiment describes the flow path of the entire cooling medium of a micro fluid heat dissipation device based on the groove structure on the inner wall of the shell. Figure 8 As shown, in this embodiment, the cooling medium used can be a coolant such as pure water, plasma water, deionized water and fluorinated liquid. In this embodiment, the flow path of the cooling medium is: the driving element 500 drives the cooling medium in the groove channel 220 to pass through the partition structure 223 and enter the fluid inlet hole 321, and flows through the fluid inlet hole 321 to the heat exchange part 332 in the heat absorption channel 331 of the heat absorption channel module 300. After absorbing the heat of the heat source 400 in the heat exchange part 332, it returns to the groove channel 220 again through the fluid outflow holes 322 on both sides. After dissipating the heat in the groove channel 220, it flows to the partition structure 223 in the groove channel 220 again and enters the heat absorption channel module 300, thereby circulating to dissipate heat.

[0071] The heat absorption channel module 300 is flexible and can be bent to a certain extent, so as to facilitate the installation of the heat dissipation device in the complex space inside the electronic equipment.

[0072] Example 2

[0073] A micro fluid heat dissipation device based on a housing inner wall groove structure, the difference between this embodiment and embodiment 1 is that the structures of the heat-releasing flow channel module 200 and the heat-absorbing flow channel module 300 are different.

[0074] In this embodiment, a third heat dissipation layer is provided on the side of the first heat dissipation layer 310 facing away from the flow channel layer 330. The third heat dissipation layer is made of materials such as high-molecular-weight PET, stainless steel, copper, copper alloy, or metal-polymer composite materials. For Example 1, the number of layers can be set as needed. The composite heat dissipation film in this embodiment has stronger sealing capabilities, but is slightly thicker.

[0075] Figure 9 and 10 The present embodiment describes the components of the composite heat dissipation film and the structure of the flow channel layer in a flexible micro fluid circulation heat dissipation device. Figure 9 and 10 As shown, in this embodiment, the heat exchange portion 332 of the heat absorption channel 331 includes two independent heat dissipation units. The first heat dissipation unit is respectively connected between the first input channel and the first output channel. The second heat dissipation unit is respectively connected between the second input channel and the second output channel. In this embodiment, the two input channels and the two output channels are arranged alternately in sequence, wherein the first input channel, the second output channel, the second input channel, and the first output channel are arranged in sequence. The two fluid inlet holes 321 and the two fluid outlet holes 322 on the second heat dissipation layer 320 match the positions of the two input channels and the two output channels, and are respectively connected to the two first output through-flow holes and the two first input through-flow holes arranged alternately on the sealing film 210.

[0076] The heat dissipation unit includes a plurality of heat-absorbing channel groups. Each heat-absorbing channel group includes a plurality of heat-absorbing channels arranged in parallel. The heat-absorbing channel groups in the same heat dissipation unit are arranged in series in sequence. In this embodiment, each heat dissipation unit includes two heat-absorbing channel groups. In the same heat dissipation unit, one of the heat-absorbing channel groups includes two heat-absorbing channels. The other heat-absorbing channel group includes three heat-absorbing channels. Compared with Example 1, although the first flow hole position of this embodiment has not changed, its flow channel density is denser, and the groove flow channel includes three long bends, so its heat dissipation capacity is stronger. Compared with Example 1, its thermal conductivity is simultaneously increased by 30%, but its processing difficulty will be greater.

[0077] like Figure 11 As shown, the groove flow channel 220 in the heat release flow channel module 200 includes a driving part and a heat release part. The driving part includes four driving branches arranged side by side in sequence. A partition structure 223 is provided in the middle of the driving branch. The partition structure 223 divides the driving branch into an input section and an output section. Each driving branch corresponds to a driving element 500. The input port and the output port of the driving element 500 are aligned and connected with the input section end and the output section end of the driving branch respectively. Every two driving branches form a group. The two driving branches in the same group are connected in parallel. The two groups of driving branches are respectively connected to the two first output flow holes on the sealing film 210.

[0078] The heat release portion is connected between the first input flow hole of the sealing film 210 and the input flow channel of the driving portion. It utilizes a two-way parallel serpentine flow channel structure. Compared to the groove flow channel 220 in Example 1, the serpentine flow channel structure in this embodiment is denser and more uniform, helping to improve heat dissipation uniformity.

[0079] Example 3

[0080] like Figure 12 As shown, an electronic device 800 includes a housing 100, a screen module 820, and a heat sink, a battery module 840, and a motherboard module 830 installed in the housing. The screen module 820 is installed on the front of the housing 100. A chip 810 is installed on the motherboard module 830. The heat sink is the microfluid heat sink provided in Example 1 or 2. The groove flow channel 220 in the heat release flow channel module 200 is opened on the inner side surface corresponding to the back of the housing 100. In this embodiment, the chip 810 is the main heating element.

[0081] In this embodiment, the housing 100 is integrally formed. The housing 100 is rectangular in shape and has flanged edges, forming a housing structure with an internal space. The screen module 820 is fixedly connected to the flanged edges of the housing 100, sealing the housing 100. The battery module 840, motherboard module 830, and heat sink are fixed to the inner surface of the housing 100. The chip 810 is mounted on the motherboard module 830. The heat absorption channel module 300 is bonded to the chip 810, and the heat exchange portion 332 of the heat absorption channel module 860 completely covers the chip 810. The heat release channel module 200 is completely embedded in the inner surface of the housing and does not protrude from the inner surface of the housing.

[0082] In this embodiment, the housing 100 is made of metal or other materials with good thermal conductivity.

[0083] The electronic device 800 of this embodiment operates as follows: During operation, the electronic components and chip 810 on the mainboard module 830 of the electronic device 800 continue to operate. The battery module 840 of the electronic device 800 provides energy to the electronic components and chip 810 on the mainboard module 830. The screen module 820 of the electronic device 800 displays content. When the electronic components and chip 810 on the mainboard module 830 of the electronic device 800 operate, heat is generated. The heat dissipation device and the mainboard module 830 operate synchronously, and the cooling medium in the heat dissipation device circulates between the heat absorption channel module 300 and the heat release channel module 200. The heat released by the electronic components and chip 810 on the mainboard module 830 is absorbed by the cooling medium in the heat absorption channel module 300. After absorbing the heat, the cooling medium is transferred to the heat release channel module 200, where it is dissipated through the large surface area of ​​the housing 100, thereby achieving heat dissipation for the electronic device 800.

[0084] In this embodiment, the electronic device 800 is a tablet computer. In some other embodiments, the electronic device 800 can be a mobile phone, a laptop computer, a computer, a wearable device, a drone, a robot, or other device with communication functions.

Claims

1. A microfluid heat dissipation device based on a housing inner wall groove structure, comprising a heat absorption channel module (300), a heat release channel module (200), and a driving element (500); characterized in that: The heat absorption channel module (300) is a multi-layer composite membrane structure, comprising a channel layer (330) located in the middle; a heat absorption channel (331) with a through-groove structure is provided in the channel layer (330); The heat-releasing flow channel module (200) comprises a sealing film (210) and a groove flow channel (220) provided on the inner side of the electronic device housing (100); the sealing film (210) is fixed on the inner side of the housing of the electronic device, covering and sealing the groove flow channel (220); the sealing film (210) is provided with a first medium exchange interface and a medium drive interface communicating with the groove flow channel (220); the heat-absorbing flow channel module (300) is provided with a second medium exchange interface; the first medium exchange interface is docked with the second medium exchange interface, and the heat-absorbing flow channel (331) is connected to the groove flow channel (220) to form a circulation flow channel; the drive element (500) is connected to the medium drive interface of the sealing film (210).

2. The micro fluid heat dissipation device based on the housing inner wall groove structure according to claim 1, characterized in that: There are a plurality of drive elements; the medium drive interface includes a plurality of drive flow interfaces (213) corresponding to the plurality of drive elements; the groove flow channel (220) includes a drive portion (221) and a heat release portion (222); the drive portion (221) includes a plurality of drive branches arranged in sequence; a partition structure (223) is provided in the middle of the drive branch; the partition structure (223) divides the drive branch into an input section and an output section; each drive branch corresponds to a drive flow interface (213); the drive flow interface (213) includes two second flow holes respectively connected to the input section and the output section of the corresponding drive branch; the input port and the output port of the drive element (500) are respectively connected to the two second flow holes of the corresponding drive flow interface (213).

3. The micro fluid heat dissipation device based on the housing inner wall groove structure according to claim 2, characterized in that: The heat release portion (222) adopts a multi-stage bifurcated flow channel structure, including a diversion portion and a confluence portion; the diversion portion has multiple stages of diversion points; at each stage of diversion points, a flow channel branches into multiple branch flow channels; the confluence portion has multiple stages of confluence points; at each stage of confluence points, multiple flow channels converge into a convergent flow channel.

4. The micro fluid heat dissipation device based on the housing inner wall groove structure according to claim 2, characterized in that: The invention also includes a first fluid docking plate (700); a plurality of positioning groove structures are provided on the first fluid docking plate (700); a plurality of driving elements (500) are respectively positioned and installed in the plurality of positioning groove structures; a transition flow interface (710) is provided in each positioning groove structure; the first fluid docking plate (700) is fixed at the medium drive interface of the sealing film (210); the corresponding driving elements (500) are connected to the drive flow interface (213) through the transition flow interface (710).

5. The micro fluid heat dissipation device based on the housing inner wall groove structure according to claim 1, characterized in that: A plurality of positioning holes are provided on the sealing film (210) at positions staggered from the groove flow channel (220); the positioning holes match positioning posts provided on the inner side of the electronic device housing (100).

6. The micro fluid heat dissipation device based on the housing inner wall groove structure according to claim 1, characterized in that: The inner side surface of the housing (100) is provided with a heat dissipation groove (230) whose contour shape matches that of the sealing film (210); the groove flow channel (220) is provided on the bottom surface of the heat dissipation groove (230); and the sealing film (210) is fitted into the heat dissipation groove (230).

7. The micro fluid heat dissipation device based on the housing inner wall groove structure according to claim 1, characterized in that: The sealing film is provided with an infusion hole (211) and an exhaust hole (212); the infusion hole (211) is used to input a cooling medium into the heat absorption channel module (300) and the heat release channel module (200); the infusion hole (211) and the exhaust hole (212) are closed after the cooling medium is input.

8. The micro fluid heat dissipation device based on the housing inner wall groove structure according to claim 1, characterized in that: The heat absorption channel (331) is divided into a heat exchange portion (332) and a collecting portion that are interconnected; the heat exchange portion (332) is connected to the second medium exchange interface through the collecting portion; the heat exchange portion (332) is divided into one or multiple independent heat dissipation units; each heat dissipation unit corresponds to an input channel and an output channel in the collecting portion, and corresponds to a fluid inflow hole (321) and a fluid outflow hole (322) in the second medium exchange interface; a bifurcated channel structure is provided in the heat dissipation unit; the heat exchange portion (332) is used to absorb heat released by the heating element.

9. The micro fluid heat dissipation device based on the housing inner wall groove structure according to claim 1, characterized in that: A second fluid docking plate (600) is provided between the first medium exchange interface of the sealing film (210) and the second medium exchange interface of the heat absorption flow channel module (300).

10. An electronic device comprising a housing (100) and a heating element, characterized in that: The electronic device further comprises a micro fluid heat dissipation device based on the housing inner wall groove structure as claimed in claim 1; the heat absorption channel module (300) of the micro fluid heat dissipation device is attached to the heating element.

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