Mainboard, processing method, device, storage medium and electronic equipment

Abstract

This application discloses a motherboard, processing method, device, storage medium, and electronic device, relating to the field of circuit design technology. By embedding a metal conduit in a printed circuit board and connecting one side of the conduit to the power layer, an integrated structure with both power supply and heat dissipation functions is constructed. The flow of conductive and heat-conducting liquid is achieved directly within the motherboard, significantly shortening the power supply path between the power module and high-power consumption components, reducing path impedance and the risk of voltage drop fluctuations. At the same time, the liquid circulating in the conduit can efficiently remove the heat generated during operation, effectively alleviating the heat dissipation bottleneck in high heat density areas, and solving the problem of external cold plates occupying motherboard space. The technical effects of improving power supply stability, thermal management efficiency, simplifying motherboard wiring, improving signal integrity, and reducing system design complexity are achieved.

Description

Technical Field

[0001] The present application relates to the field of circuit design technology, and in particular to a motherboard, a processing method, a device, a storage medium, and an electronic device. Background Art

[0002] As the core equipment of data centers, the operational stability of servers depends on efficient cooling and power supply systems. Key components such as high-performance computing units, graphics processing modules, and memory generate a large amount of heat during operation. If this heat cannot be dissipated in a timely manner, it will lead to performance degradation, shortened lifespan, and even system failure. The power supply system must provide low-voltage, high-current output for key components, requiring high reliability and good energy efficiency. Currently, mainstream servers mostly use air cooling, usually with a radiator installed above the computing module and air cooling via an external fan on the motherboard. With the development of cooling technology, some servers have introduced liquid-cooled cold plate structures, which install metal cold plates outside the heat-generating area and remove heat through internal liquid circulation.

[0003] However, as computing power increases, power consumption per unit area rises rapidly, making it difficult for air cooling and cold plate liquid cooling, the common technologies, to meet the heat dissipation needs of high-heat-density areas. To improve heat dissipation efficiency, the volume and coverage of cold plates have gradually expanded, further occupying the core space of the motherboard and compressing the layout of the power modules. This significantly increases the distance of the power supply path and increases the path impedance. This is especially true when the supply voltage continues to drop while the current increases rapidly, which can easily cause voltage fluctuations. In severe cases, this can lead to unstable operation of key components or even system downtime. In addition, the routing of high-speed signals is restricted, which can easily cause signal integrity issues, increasing the difficulty of motherboard design and manufacturing.

[0004] Therefore, how to design a structure that can dissipate heat for a server motherboard and also reduce the power supply path is a technical problem that those skilled in the art urgently need to solve. Summary of the Invention

[0005] The present application provides a motherboard, processing method, device, storage medium and electronic device, which at least solves the problem of external cold plate occupying motherboard space, and achieves the technical effects of improving power supply stability, thermal management efficiency, simplifying motherboard wiring, improving signal integrity and reducing system design complexity.

[0006] The present application provides a motherboard, comprising: a printed circuit board, comprising at least one power supply layer; at least one metal conduit, arranged in the printed circuit board, with one side plane of the metal conduit in contact with the power supply layer, and both ends of the metal conduit passing through the printed circuit board and extending to the bottom of the printed circuit board; a power supply board, arranged below the printed circuit board, comprising a liquid power supply module and a hydraulic pump; the outlet and inlet of the liquid power supply module are respectively connected to the two ends of the metal conduit, for supplying power to the power supply layer through the conductive and heat-conductive liquid flowing in the metal conduit; the hydraulic pump is connected to the metal conduit, for driving the flow of the conductive and heat-conductive liquid in the metal conduit.

[0007] The present application also provides a method for processing a motherboard, comprising: generating at least one metal conduit; milling a milling groove on a printed circuit board that matches the size of the metal conduit; embedding the metal conduit into the milling groove and pressing the printed circuit board so that the metal conduit is in contact and connected with the power supply layer of the printed circuit board; injecting a conductive and heat-conductive liquid into the metal conduit through a power supply board and driving the liquid to flow.

[0008] The present application also provides an electronic device, comprising the above-mentioned mainboard.

[0009] The present application also provides a motherboard processing device, comprising: a memory for storing a computer program; and a processor for implementing the steps of any of the above-mentioned motherboard processing methods when executing the computer program.

[0010] The present application also provides a computer-readable storage medium, in which a computer program is stored. When the computer program is executed by a processor, the steps of any of the above-mentioned motherboard processing methods are implemented.

[0011] The present application also provides a computer program product, including a computer program, which implements the steps of any of the above-mentioned motherboard processing methods when executed by a processor.

[0012] This application embeds a metal conduit within a printed circuit board and connects one side of the conduit to the power layer, creating an integrated structure that combines power supply and heat dissipation. This allows for the flow of conductive and heat-conducting liquid directly within the motherboard, significantly shortening the power supply path between the power module and high-power components, reducing path impedance and the risk of voltage drop fluctuations. Furthermore, the liquid circulating within the conduit efficiently removes heat generated during operation, effectively alleviating heat dissipation bottlenecks in high-heat-density areas and resolving the issue of external cold plates occupying motherboard space. This results in improved power supply stability, thermal management efficiency, simplified motherboard wiring, enhanced signal integrity, and reduced system design complexity. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0014] Figure 1 A front view of a metal conduit embedded in a printed circuit board provided in an embodiment of the present application.

[0015] Figure 2 A top view of a via fan-out of a motherboard provided in an embodiment of the present application.

[0016] Figure 3 A cross-sectional view of a via fan-out of a motherboard provided in an embodiment of the present application.

[0017] Figure 4 A top view of a metal conduit embedded in a printed circuit board provided in an embodiment of the present application.

[0018] Figure 5 A cross-sectional view of a metal conduit provided in an embodiment of the present application.

[0019] Figure 6 A cross-sectional view of an inverted U-shaped metal conduit provided in an embodiment of the present application.

[0020] Figure 7 A schematic diagram of the design of a power supply board provided in an embodiment of the present application.

[0021] Figure 8 A schematic diagram of the assembly of a main board and a power supply board provided in an embodiment of the present application.

[0022] Figure 9 A flowchart of a processing method provided in an embodiment of the present application. DETAILED DESCRIPTION

[0023] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0024] It should be noted that, in the description of this application, the terms "comprises," "includes," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. The terms "first," "second," etc., in this application are used to distinguish similar objects, and are not used to describe a particular order or sequence.

[0025] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0026] like Figure 1 , which shows a mainboard provided by this application, Figure 2 Shows the top view of the motherboard's via fan-out. Figure 3 The diagram shows the via fan-out cross-section of the motherboard. The peripheral common and high-speed signal pins on the motherboard are designed in accordance with the conventional method, with through-hole fan-out wiring, and the through-hole diameter is 0.2mm; the power pins of the motherboard are connected to the corresponding plane layer by blind holes according to the plane layer where the metal conduit embedded in the corresponding power network is located, and the blind hole diameter is 0.3mm. Figure 2 The center-to-center distance between each power pin fanout hole on the motherboard matches the pin spacing, typically 0.9-1mm. The pad diameter is typically 0.4-0.5mm. This design ensures a more stable electrical connection between each pin and its corresponding power layer and effectively reduces conflicts between routing and hole placement. All vias utilize a via-on-pad process, which helps accurately create holes on the PCB (Printed Circuit Board) for connecting to the power pins of the components being powered, ensuring accurate hole placement and proper conductivity. During the manufacturing process, vias are directly drilled onto the pads, effectively facilitating the connection between the chip pins and the PCB copper, while ensuring good electrical connection and thermal conductivity. This design ensures that the power pins of the components being powered are securely connected to the power layer, enhancing electrical conductivity. It also more effectively conducts heat through the PCB copper, optimizing chip heat dissipation and improving system stability and performance. This design is particularly suitable for high-power, highly integrated computing modules, meeting their current and heat dissipation requirements.

[0027] like Figure 1The mainboard provided in the present application includes: a printed circuit board, including at least one power layer 11; at least one metal conduit 12, arranged in the printed circuit board, and one side plane of the metal conduit 12 is in contact with the power layer 11, and both ends of the metal conduit 12 pass through the printed circuit board and extend to the bottom of the printed circuit board; a power supply board, arranged below the printed circuit board, including a liquid power module and a hydraulic pump; the outlet and inlet of the liquid power module are respectively connected to the two ends of the metal conduit 12, for supplying power to the power layer 11 through the conductive and heat-conductive liquid flowing in the metal conduit 12; the hydraulic pump is connected to the metal conduit 12, for driving the conductive and heat-conductive liquid in the metal conduit 12 to flow.

[0028] This motherboard structure integrates power supply and heat dissipation by embedding at least one metal conduit 12 within the printed circuit board. One side of the metal conduit 12 is in contact with the power layer 11, forming a conductive path that directly delivers current to the power layer 11. The conductive and heat-conducting liquid flowing within the metal conduit 12 not only serves as a high-current carrier for the power layer 11, but also simultaneously removes heat generated by the power layer 11 during high-power operation, reducing its temperature and improving the overall thermal stability of the system.

[0029] Both ends of the metal conduit 12 extend through the printed circuit board and below it, enabling connection to a power supply board located below the printed circuit board. This power supply board integrates a liquid power module and a hydraulic pump. The liquid power module provides a power output in the form of an electrically conductive and heat-conductive liquid, forming a closed-loop circuit with the metal conduit 12 to ensure a continuous supply of power to the power supply layer 11. Compared to traditional line structures, this structure reduces voltage drop losses caused by long-distance transmission and is particularly suitable for low-voltage, high-current power supply needs.

[0030] The hydraulic pump is connected to the metal conduit 12, maintaining a stable circulation of liquid within the conduit. The continuous flow of liquid within the conduit not only ensures continuous power supply to the power layer 11, but also, through its excellent thermal capacity and fluidity, promptly removes heat, achieving dynamic heat dissipation management for the power layer 11. This fluid heat conduction mechanism is more responsive and efficient in heat dissipation than static thermal conductive materials, making it easier to manage transient or localized high temperatures generated by the motherboard during operation.

[0031] The overall structure eliminates the need for additional heat sinks above the motherboard, saving limited motherboard space and preventing interference with high-speed signal routing. Because the power supply path runs directly from the power board below the motherboard through metal conduit 12 to the power layer 11, the short path and low impedance further enhance power supply stability and rapid response, providing an efficient and reliable power supply and cooling solution for high-density, highly integrated server systems.

[0032] like Figure 4, showing a top view of four metal conduits 12 embedded in a printed circuit board. Figure 1 and Figure 4 correspond, Figure 1 It is equivalent to cutting the corresponding cross-sectional view from the fourth via from bottom to top. Figure 4 The first and second ones on the left are sections cut from "one of the two ends of the metal conduit 12", and the third one is Figure 1 Not shown in the fourth one Figure 1 The cross section shown in FIG. 1 is a cross section excluding both ends of the metal conduit 12 .

[0033] In an exemplary embodiment, Figure 1 As shown, a component to be powered is arranged above the mainboard, and at least one metal blind hole 13 is provided between the top layer of the printed circuit board and the power layer 11; the power pin of the component to be powered is connected to the power layer 11 through the metal blind hole 13.

[0034] In this motherboard architecture, the components to be powered, typically high-performance processors (such as central processing units, graphics processing units, or other high-power computing components), are located on the printed circuit board and are the target units for power supply. Because these components typically operate at low voltage and high current, the stability of their power supply path directly impacts the overall performance and reliability of the system.

[0035] To ensure efficient energy transfer from the power layer 11 to the components being powered, at least one metal blind via 13 is provided between the top layer of the PCB and the power layer 11. This metal blind via 13 is a partially penetrating structure, extending downward from the top layer of the PCB to the power layer 11, establishing a vertical electrical connection path without penetrating the entire board. This structure shortens the power supply path without compromising the overall integrity of the PCB, facilitating high-speed signal routing and compact interlayer layout.

[0036] Metal blind vias 13, made of conductive material, connect directly to the power plane 11, effectively transmitting current from the power plane 11 to the top layer of the printed circuit board. During motherboard assembly, the power pins of the component to be powered are aligned and soldered to the metal blind vias 13, completing the full electrical connection from the metal conduit 12, through the power plane 11, and to the component to be powered. This structure establishes a vertical power supply channel through the metal blind vias 13, significantly reducing the impedance and voltage drop of the power supply path compared to traditional long wiring methods.

[0037] This design not only improves power supply uniformity and stability but also enhances soldering reliability, making it particularly suitable for high-power, multi-pin, and densely packaged components. While meeting high-current power requirements, the internal metal conduit 12 and liquid flow system also collaborate to rapidly dissipate heat, enhancing the motherboard's overall electrical and thermal management capabilities.

[0038] like Figure 1 In an exemplary embodiment, the structure of the metal blind hole 13 is a solid metal copper column structure formed by an electroplating filling process.

[0039] Specifically, the metal blind vias 13 are formed into solid copper pillars using an electroplating fill process. This process deposits conductive copper material inside the metal blind vias 13, filling the entire hole and forming a dense, continuous solid copper pillar. This ensures a low-impedance, high-thermal-conductivity metal connection path in the vertical direction. This structure establishes a stable and efficient electrical path between the power layer 11 and the top layer of the printed circuit board, making it suitable for power supply needs with high current density.

[0040] The copper network on the planar layer where the metal blind vias 13 are located matches the network connected to the chip pins on the top layer of the printed circuit board, ensuring the integrity of their electrical connection. Because both are in the same power network, the metal copper pillars directly connect them without causing short circuits, and instead improve the reliability and consistency of the connection. This structure effectively avoids localized voltage drops or hot spots, ensuring balanced power supply to the motherboard and stable chip operation.

[0041] Solid copper pillars offer significant conductivity advantages over hollow vias or conventional fillers. Solid copper's larger cross-sectional area significantly increases the current-carrying capacity per unit path. Its excellent thermal conductivity also allows it to quickly disperse energy from high-heat areas to the surrounding areas, preventing localized heat buildup. This design is particularly well-suited for the power supply and heat dissipation requirements of high-heat-density, high-power chips operating at high speeds.

[0042] Furthermore, the solid structure formed through the electroplating filleting process offers excellent solderability, enabling high-quality solder connections during motherboard assembly and improving the mechanical strength and thermal stability of the overall solder joint. Compared to hollow blind vias, solid copper pillars also offer enhanced thermal fatigue resistance, facilitating long-term stable operation through multiple thermal cycles, meeting the demands of high-reliability applications such as high-performance servers.

[0043] like Figure 5 In an exemplary embodiment, the cross section of the metal conduit 12 is rectangular.

[0044] Specifically, the metal conduit 12 has a rectangular cross-section. This ensures maximum contact area between the metal conduit 12 and the planar surface of the power layer 11 within the printed circuit board (PCB). The rectangular design of the metal conduit 12 helps improve thermal and electrical conductivity. This larger contact area allows the conduit to better transfer heat carried by the flowing conductive and thermally conductive fluid to the PCB's power layer 11, while ensuring stable current transmission and low impedance. Compared to other cross-sectional shapes, the rectangular structure also makes it easier to fit into milling slots during PCB manufacturing and assembly, improving overall mechanical strength and heat dissipation performance.

[0045] This structural design fully considers the power supply and heat dissipation requirements of high-power motherboards, effectively supporting the stable operation of high-current, high-power components. Through reasonable size control and optimized cross-sectional shape, the metal conduit 12 maximizes heat dissipation and electrical conductivity within a limited space, improving the overall performance and reliability of the server motherboard.

[0046] In an exemplary embodiment, the width of the cross section of the metal conduit 12 is determined according to the center-to-center distance of power pins of the component to be powered.

[0047] Specifically, since the power pins of the motherboard are usually densely arranged in the core area, the center distance is generally 0.9~1mm, so the cross-sectional width of the metal conduit 12 is also set to the same range (such as Figure 5 ) for precise alignment in board layout design.

[0048] Keeping the cross-sectional width of the metal conduit 12 consistent with the center-to-center distance of the power pins facilitates the drilling and fan-out process of the motherboard's power pins within the printed circuit board. This design minimizes conflicts between the conduit area and other signal networks, thereby preventing damage to the integrity of high-speed signal routing. Furthermore, since no additional space is required for the conduit, this helps achieve higher integration within the limited motherboard area.

[0049] In high-density PCB designs, this design approach enables spatial reuse of power and signal paths, improving routing efficiency and reducing congestion, thereby enhancing the overall electrical performance and manufacturing feasibility of the motherboard. Furthermore, the matching relationship between the conduit and the power network helps reduce local path impedance, thereby improving power supply stability.

[0050] In an exemplary embodiment, the length of the cross section of the metal conduit 12 is determined according to the current carrying requirement and the heat dissipation and thermal conductivity requirement of the power layer 11 .

[0051] To ensure power supply efficiency, the metal conduit 12 must have sufficient conductive cross-sectional area to meet the current carrying capacity of the core area power layer 11. At the same time, as a heat conduction path, the conduit must also have a good thermal conductivity cross-sectional area to improve heat dissipation efficiency.

[0052] However, the feasibility of the printed circuit board manufacturing process must be comprehensively considered in the specific design. If the cross-sectional length of the metal conduit 12 is designed to be too large, the required milling slot size will become larger, thereby increasing the overall thickness of the board layer, further affecting the pressing quality and drilling accuracy of the PCB, and reducing the manufacturing yield. Based on this, on the basis of meeting the current carrying and heat dissipation requirements, it is preferred to control the long side dimension of the cross-sectional area of ​​the metal conduit 12 within the range of 1-2 mm (e.g. Figure 5 ).

[0053] This design not only effectively reduces the path impedance of the power channel and improves the power supply stability of the power layer 11, but also enhances the heat dissipation efficiency per unit area of ​​the metal conduit 12. Furthermore, controlling the dimensions within a reasonable range facilitates high-yield batch processing of PCB boards and improves the manufacturing stability and consistency of the overall structure.

[0054] In an exemplary embodiment, the number of metal conduits 12 is determined based on the heat generated by the power layer 11 per unit time and the heat dissipated by the metal conduits 12 per unit time. The heat generated by the power layer 11 per unit time is determined based on the current carrying requirement of the power layer 11.

[0055] Specifically, the heat generated by the power layer 11 is determined by its required current carrying capacity. The greater the current, the higher the heat. In order to ensure that the packaging structure maintains thermal balance during long-term operation, the number of metal conduits 12 needs to be reasonably configured according to the specific current carrying requirements.

[0056] When a single metal conduit 12 alone cannot meet the required electrical and thermal conductivity requirements for a single power network, multiple metal conduits 12 with consistent structural parameters can be added to the printed circuit board and connected in parallel to the same power network. This approach increases the total thermal cross-sectional area and current carrying capacity, effectively reducing local power transmission impedance and improving voltage stability on the power layer 11.

[0057] In order to take into account the manufacturing process of the PCB and the heat dissipation efficiency of the conduit, the cross-sectional width of the metal conduit 12 must be controlled within 2 mm. A conduit that is too wide not only affects the arrangement of other functional layers, but also easily causes local deformation of the board structure, affecting the pressing quality. At the same time, the wall thickness of the metal conduit 12 is preferably 0.3 mm (such as Figure 5 ), while ensuring that it has sufficient mechanical strength and stress resistance, it ensures that it does not collapse or warp during the PCB board pressing and subsequent drilling process, thereby improving the manufacturing reliability of the overall structure.

[0058] In summary, Figure 5 In the embodiment, the outer surface size of the metal conduit 12 is (0.9-1 mm)×(1-2 mm), the wall thickness of the metal conduit 12 is 0.3 mm, and the inner wall size of the metal conduit 12 is 0.3-0.4 mm.

[0059] In an exemplary embodiment, a milling groove for embedding the metal conduit 12 is provided in the printed circuit board, the width of the milling groove is the same as the width of the cross section of the metal conduit 12 , and the depth of the milling groove is the same as the length of the cross section of the metal conduit 12 .

[0060] Specifically, the milling groove is used to precisely reserve space for the metal conduit 12 within the PCB's inner structure, facilitating subsequent conduit insertion and press-fitting. The milling groove's design parameters must strictly match the cross-sectional dimensions of the metal conduit 12 to ensure structural stability and functional reliability after installation.

[0061] Specifically, the width of the milled slot matches the cross-sectional width of the metal conduit 12, ensuring that the conduit fits snugly against the slot's sidewalls after insertion, providing stable mechanical support and preventing process defects such as conduit deviation and skew during the press-fit process. Furthermore, the depth of the milled slot matches the cross-sectional length of the metal conduit 12, ensuring that the conduit is fully embedded in the PCB and in full contact with the pre-set power layer 11, achieving a good electrical and thermal conduction path.

[0062] This structural design not only enhances the firmness of the fit between the metal conduit 12 and the PCB board, but also significantly improves the heat dissipation efficiency of the printed circuit board during high current transmission, which is beneficial to reducing the impedance of the power layer 11 and stabilizing the power supply voltage, thus meeting the stable operation requirements of high-performance motherboards in complex thermoelectric environments.

[0063] like Figure 6 In an exemplary embodiment, the metal conduit 12 is an inverted U-shaped structure, the top plane of the inverted U-shaped structure is in contact with the power layer 11, and the two side legs of the inverted U-shaped structure respectively pass through the printed circuit board and extend to the bottom of the printed circuit board and are connected to the power supply board.

[0064] Specifically, the top plane of the inverted U-shaped structure is arranged horizontally, located within the printed circuit board, and achieves surface contact with the power layer 11, thus forming a stable electrical and thermal conduction path. By directly attaching the top plane of the metal conduit 12 to the power layer 11, efficient current input and heat conduction are achieved, effectively supporting the power supply and heat dissipation requirements of the motherboard's high-power components.

[0065] The two legs of the inverted U-shaped structure extend downward from the top plane, penetrating the multiple layers of the printed circuit board and extending beneath it. These extensions not only serve as the fluid inlet and outlet for the conduit but also form docking terminals that plug into the power supply board, ensuring stable flow of conductive and thermally conductive fluids between the motherboard and the power supply board. This structure reduces the structural complexity and manufacturing difficulties associated with traditional discrete power and heat dissipation paths.

[0066] To ensure that the flow resistance of the conductive and heat-conducting liquid is uniform throughout the metal conduit 12, the cross-sectional dimensions of the metal conduit 12 remain consistent throughout the inverted U-shaped path, without any contraction or expansion structure, thereby reducing flow interference and energy loss. In addition, to meet the requirements of soldering assembly and electrical connection of PCB boards, the vertical leg length of the inverted U-shaped structure is preferably set to be greater than 10 mm (e.g. Figure 6 This length ensures that the metal conduit 12 can fully protrude from the bottom surface of the printed circuit board after the motherboard is processed. It also facilitates precise docking, welding, or fixing with the power supply card below in subsequent processes, ensuring the reliability and assembly efficiency of the overall motherboard structure and liquid cooling power supply system.

[0067] In an exemplary embodiment, the horizontal length of the top plane of the inverted U-shaped structure is greater than or equal to the length of the corresponding power pin distribution area in the component to be powered. Figure 6 20~30mm in the middle.

[0068] Specifically, the structural design aims to ensure that the metal conduit 12 covers all core power pins, thereby achieving uniform and efficient power supply and heat dissipation. Since components to be powered (such as high-performance logic devices such as central processing units, graphics processing units, and field-programmable gate arrays) typically have multiple power pins, these pins are distributed in a matrix at the bottom of the logic device. If the horizontal length of the conduit's top plane is smaller than the pin distribution area, some power pins may not be fully connected to the power layer 11 below, resulting in local power shortages or reduced heat dissipation efficiency, affecting the stable operation of the device. By designing a coverage area greater than or equal to , these problems can be avoided, ensuring that every row or every critical power pin is above the metal conduit 12, thereby unifying the power supply surface and reducing the impedance of the power network.

[0069] This structure also provides optimal layout space for electrical connection between the metal blind vias 13 and the conduit plane, facilitating the drilling of multiple metal blind vias 13 above the metal conduit 12 and their subsequent filling to form metal pillars, enabling parallel power supply to multiple power points. This overall structural design not only improves heat dissipation efficiency but also enhances the motherboard's electrical integrity and system stability in high-power applications.

[0070] In an exemplary embodiment, the electrically and thermally conductive liquid is an organic ionic liquid.

[0071] Specifically, the liquid material is composed of organic cations and inorganic or organic anions, has good thermal and electrical conductivity, and can effectively undertake the dual tasks of power supply and heat dissipation of high-power devices in the motherboard.

[0072] In this example, a comprehensive evaluation of various conductive and thermally conductive liquid materials was conducted, comparing them across multiple dimensions, including thermal conductivity, electrical conductivity, safety, chemical stability, and affordability. Organic ionic liquids (ILs) excel in both thermal and electrical conductivity, and offer advantages such as non-flammability, low vapor pressure, and high thermal stability. Furthermore, compared to traditional liquid metal or water-based thermally conductive liquids, ILs are non-toxic and non-corrosive, making them more suitable for long-term operation in closed systems and reducing system maintenance risks.

[0073] Because the motherboard's metal conduits 12 must carry liquid for extended periods, operating in high-power density and high-temperature environments, the stable chemical properties of organic ionic liquids make them an ideal working medium. Their excellent fluidity and heat capacity help quickly dissipate the heat generated by the high-current operation of the power supply layer 11, while ensuring stable current transmission, effectively improving the reliability and performance of the entire power and cooling system.

[0074] In an exemplary embodiment, the metal conduit 12 is connected to the power supply board by welding or a detachable connection structure.

[0075] This connection method can be flexibly selected based on system design requirements and maintenance strategies, ensuring a reliable electrical and thermal conduction path between the power supply board and the mainboard. When welded, the metal conduit 12 forms a permanent contact with the power supply board's inlet and outlet, resulting in low contact resistance and excellent thermal conductivity, making it suitable for applications requiring high reliability and high power density. Welded connections effectively reduce energy loss along the electrical and thermal paths, improving overall system stability under extreme operating conditions.

[0076] Removable connections (such as snap-on, threaded, or sealed connectors) are more suitable for applications requiring frequent replacement or maintenance. This approach facilitates replacing power boards or cleaning the fluid in the 12 channels of the metal conduit without damaging the mainboard structure, enhancing system maintainability and modular design flexibility.

[0077] In an exemplary embodiment, the metal conduit 12 is connected to the power board via a flexible conduit. This flexible conduit is located at the lower outlet of the metal conduit 12 and connects to the inlet and outlet of the liquid power module in the power board, establishing a flow channel for the conductive and heat-conducting liquid, thereby providing power and heat dissipation for the mainboard power layer 11.

[0078] Flexible conduits offer excellent bendability and deformation resistance, accommodating potential relative displacement or installation tolerances between the motherboard and power board, preventing stress concentration and conduit damage caused by rigid connections. Flexible connections offer enhanced assembly tolerance and mechanical compatibility, particularly within multi-board structures or complex server chassis.

[0079] To ensure the tightness and conductivity of the liquid channel, the ends of the flexible pipe can be securely connected to the metal conduit 12 and the power supply board using sealing clips, threaded connections, or pressurized sealing rings to prevent liquid leakage and poor contact. Furthermore, this connection method facilitates subsequent maintenance, replacement, or upgrades of the system, helping to improve the maintainability and modularity of the entire system.

[0080] Therefore, the flexible pipe, as a key component connecting the metal conduit 12 and the power supply board, not only ensures the continuity and reliability of the power supply system and the heat dissipation system, but also provides greater engineering adaptability and assembly flexibility.

[0081] In an exemplary embodiment, the power supply board further includes a control module connected to the hydraulic pump and configured to control the hydraulic pump to adjust the flow rate of the conductive and heat-conductive liquid according to the temperature and current carrying requirements of the power supply layer 11 .

[0082] Specifically, the control module monitors the temperature and current demand of the power layer 11 in real time, determining whether to increase or decrease the fluid flow rate to ensure efficient heat dissipation and power supply stability. When the temperature of the power layer 11 rises or the current demand increases, the control module transmits a signal to the hydraulic pump to adjust the fluid flow rate to enhance heat dissipation. Conversely, when the temperature of the power layer 11 is lower or the current demand decreases, the control module appropriately decreases the fluid flow rate, reducing energy consumption and maintaining efficient system operation.

[0083] This adaptive flow rate adjustment mechanism enables precise control of temperature and current requirements under varying load conditions, improving cooling efficiency while effectively avoiding energy waste caused by excessive liquid flow. By precisely controlling the liquid flow rate, the system maximizes energy efficiency and thermal management while ensuring stable power supply, enhancing the reliability and lifespan of the entire server system.

[0084] like Figure 7 , the present application also provides a mainboard processing method, comprising:

[0085] S11: Generate at least one metal conduit.

[0086] First, the metal conduits that will carry the conductive and thermally conductive liquid must be designed and manufactured. These conduits are typically made of copper, aluminum, or other highly conductive materials to ensure they can effectively remove heat from the motherboard's power planes while maintaining the ability to conduct current in subsequent steps. The conduits must be precisely sized to ensure they fit the subsequent printed circuit board (PCB) and have sufficient space for the conductive and thermally conductive liquid.

[0087] S12: Milling grooves matching the size of the metal guide tubes on the printed circuit board.

[0088] Grooving is a machining step performed on printed circuit boards (PCBs) to create a suitable insertion space for the metal conduit. Grooving allows precise control of the width and depth of the grooves, ensuring they match the shape and dimensions of the metal conduit. This ensures the conduit is securely embedded in the PCB and maintains good contact with the power plane. Grooving requires high precision to avoid mismatches that could affect subsequent heat dissipation and electrical conductivity.

[0089] S13: Embed the metal conduit into the milling groove, and press the printed circuit board to ensure that the metal conduit is in contact with and connected to the power supply layer of the printed circuit board.

[0090] The metal conduit is inserted into the previously milled slot and secured to the PCB using heat and pressure. This ensures full contact between the metal conduit and the power plane, ensuring good electrical and thermal conductivity. Careful attention must be paid during the pressure-bonding process to ensure the conduit does not deform due to excessive or uneven pressure, which could result in poor contact.

[0091] S14: Injecting conductive and heat-conductive liquid into the metal conduit through the power supply board and driving the liquid to flow.

[0092] Finally, the power supply board is responsible for injecting a conductive and heat-conducting liquid into the metal conduit. Once injected, a hydraulic pump drives the liquid through the conduit. This flow of liquid not only dissipates heat generated by the power supply layer but also provides the necessary power to maintain stable operation. The liquid flow rate and temperature are dynamically adjusted based on the power supply layer's current requirements and temperature fluctuations, optimizing heat dissipation and ensuring efficient system operation.

[0093] In an exemplary embodiment, generating at least one metal conduit includes: generating at least one metal conduit with both ends closed; embedding the metal conduit into a milling groove, and pressing the printed circuit board, and further including: opening both ends of the metal conduit to form a connected liquid channel.

[0094] Specifically, the metal conduit is initially closed at both ends. This design prevents etching solution or other debris from entering the conduit during subsequent board processing, potentially causing blockage. This stage ensures the conduit remains clean and fully functional during subsequent processing and assembly. The closed design of the metal conduit helps protect its internal flow channels, preventing contamination or blockage during board manufacturing and soldering, thereby ensuring the conduit's performance.

[0095] Once the metal conduit is inserted and pressed together, the ends of the conduit must be opened to complete the liquid channel. This ensures that the liquid can flow smoothly through the conduit. This operation is performed after the board is finished, preventing the ends of the conduit from being accidentally sealed during the manufacturing process. This ensures that the conduit interior remains clean and can smoothly transmit power and heat through the liquid.

[0096] During the soldering and assembly process, the various small components on the mainboard and power board are first soldered. Before soldering, the metal conduit connections must be sealed to prevent debris or solder from entering the conduits during soldering, potentially causing blockage or poor conductivity. After soldering, the mainboard and power board are assembled together, ensuring that all debris from the metal conduit connections is cleaned and the connections are properly opened. Next, the metal conduits on the mainboard and power board are connected using a brazing process to ensure connectivity. Once the metal conduits are connected, the hydraulic pump activates, injecting conductive and thermal fluid into the conduits. This step, driven by the hydraulic pump, ensures stable power supply and effectively dissipates heat generated by the power supply layer. The injection of conductive and thermal fluid not only enhances the heat dissipation capacity of the power supply layer but also ensures long-term stable operation of the system.

[0097] In an exemplary embodiment, after the metal conduit is embedded in the milling groove and the printed circuit board is pressed, it also includes: drilling a blind hole between the top layer of the printed circuit board and the power layer, and filling it through electroplating to form a solid metal copper column, so that the power pin of the component to be powered is conductively connected to the power layer of the printed circuit board through the solid metal copper column.

[0098] Specifically, after the metal conduit is embedded in the milled groove and pressed together, a blind via is drilled from the top layer of the printed circuit board to the power layer. The depth of the blind via is designed to extend from the top surface of the PCB to the corresponding metal conduit plane layer. The purpose is to establish an electrical connection between the power layer and the power pins of the component to be powered. This drilling process uses a controlled depth drilling process to ensure the accuracy of the hole depth, thereby avoiding any damage or error to the power layer.

[0099] After drilling, to ensure reliable electrical continuity between the power pins and the power plane, the blind holes are filled with solid copper pillars using electroplating. The length of the pillars matches the depth of the blind holes, with a diameter of approximately 0.2-0.25mm. This filling process ensures stable electrical contact and good electrical continuity between the power plane and the power pins of the component being powered. If electroplating filling is costly, an alternative approach is to pre-fill the blind holes with copper pillars, followed by electroplating to ensure good electrical continuity.

[0100] In this invention, by removing the CPU core power module from the server motherboard and designing a separate power supply board, the motherboard size can be effectively reduced, thereby lowering production costs. In traditional designs, the power module is typically integrated into the motherboard. By separating it onto a dedicated power supply board, power supply routing can be more flexibly arranged, reducing wiring density on the motherboard. This design not only reduces the motherboard area but also allows for more focused and efficient placement and thermal management of the power module.

[0101] like Figure 8 and Figure 9 , multiple liquid power modules can be integrated on the power supply board, which can output the required power supply voltage and current to ensure stable power supply to various key components inside the server. At the same time, in order to improve the heat dissipation efficiency, a hydraulic pump and a liquid-cooled flat metal cold plate (on which a liquid power module and corresponding outlets and inlets, as well as a total liquid outlet and inlet) are also welded and assembled on the power supply board. The hydraulic pump is indirectly connected to the metal conduit through the overall liquid outlet and inlet, which can promote the flow of conductive and heat-conducting liquid. The metal conduit forms a closed loop between the power supply board and the motherboard, providing a heat transfer channel, thereby removing the heat generated by the power layer and other high-temperature areas, ensuring that the entire system can maintain a stable working state under high load.

[0102] By integrating the power modules and liquid cooling onto a single power supply board, the layout of the liquid cooling system is optimized, reducing the heat dissipation burden on the motherboard. Each power module is connected to a corresponding subdivided metal conduit, allowing the current output of each power module to be adjusted as needed, ensuring power supply while reducing power consumption and temperature rise. The liquid cooling system's design allows for efficient liquid circulation, removing heat from the power modules and cooling components. A hydraulic pump ensures that heat is promptly transferred to the metal cold plate, completing the heat dissipation process.

[0103] The present application also provides an electronic device, comprising the above-mentioned mainboard. The electronic device is a server.

[0104] An embodiment of the present application also provides a motherboard processing device, including a memory and a processor, wherein the memory stores a computer program, and the processor is configured to run the computer program to execute the steps in any of the above-mentioned motherboard processing method embodiments.

[0105] An embodiment of the present application further provides a computer-readable storage medium, in which a computer program is stored, wherein the computer program is configured to execute the steps of any of the above-mentioned motherboard processing method embodiments when run.

[0106] In an exemplary embodiment, the computer-readable storage medium may include, but is not limited to, various media that can store computer programs, such as a USB flash drive, a read-only memory (ROM), a random access memory (RAM), a mobile hard disk, a magnetic disk, or an optical disk.

[0107] An embodiment of the present application further provides a computer program product, which includes a computer program. When the computer program is executed by a processor, the steps in any of the above-mentioned motherboard processing method embodiments are implemented.

[0108] An embodiment of the present application also provides another computer program product, including a non-volatile computer-readable storage medium, which stores a computer program. When the computer program is executed by a processor, it implements the steps in any of the above-mentioned motherboard processing method embodiments.

[0109] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the above description has generally described the components and steps of each example according to their functions. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0110] The above is a detailed introduction to a motherboard, processing method, device, storage medium, and electronic device provided by this application. Specific examples are used herein to illustrate the principles and implementation methods of this application. The description of the above embodiments is only intended to help understand the method and core ideas of this application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of this application, several improvements and modifications can be made to this application, and these improvements and modifications also fall within the scope of protection of the claims of this application.

Claims

1. A motherboard, characterized in that: include: a printed circuit board comprising at least one power plane; At least one metal conduit is disposed in the printed circuit board, with one side plane of the metal conduit in contact with the power layer, and both ends of the metal conduit pass through the printed circuit board and extend to the bottom of the printed circuit board; a power supply board, disposed below the printed circuit board, comprising a liquid power supply module and a hydraulic pump; The outlet and inlet of the liquid power module are respectively connected to the two ends of the metal conduit, and are used to supply power to the power layer through the conductive and heat-conductive liquid flowing in the metal conduit; The hydraulic pump is communicated with the metal conduit and is used for driving the flow of the electrically conductive and heat conductive liquid in the metal conduit.

2. The motherboard according to claim 1, wherein: A component to be powered is provided above the mainboard, and at least one metal blind hole is provided between the top layer of the printed circuit board and the power layer; The power pin of the component to be powered is connected to the power layer through the metal blind via.

3. The mainboard according to claim 2, wherein: The structure of the metal blind hole is a solid metal copper column structure formed by an electroplating filling process.

4. The mainboard according to claim 2, wherein: The cross section of the metal conduit is rectangular.

5. The mainboard according to claim 4, wherein: The width of the cross section of the metal conduit is determined according to the center distance of the power pins of the component to be powered.

6. The mainboard according to claim 4, wherein: The length of the cross section of the metal conduit is determined according to the current carrying requirement and the heat dissipation and thermal conductivity requirement of the power supply layer.

7. The mainboard according to claim 6, wherein: The number of the metal conduits is determined according to the heat generation of the power layer per unit time and the heat dissipation of the metal conduits per unit time. The heat generation of the power layer per unit time is determined according to the current carrying requirement of the power layer.

8. The mainboard according to claim 4, wherein: The printed circuit board is provided with a milling groove for embedding the metal conduit, the width of the milling groove is the same as the width of the cross section of the metal conduit, and the depth of the milling groove is the same as the length of the cross section of the metal conduit.

9. The mainboard according to any one of claims 2 to 8, characterized in that: The metal conduit is an inverted U-shaped structure, the top plane of the inverted U-shaped structure is in contact with the power supply layer, and the two side legs of the inverted U-shaped structure respectively pass through the printed circuit board and extend to the bottom of the printed circuit board and are connected to the power supply board.

10. The mainboard according to claim 9, wherein: The horizontal length of the top plane of the inverted U-shaped structure is greater than or equal to the length of the corresponding power pin distribution area in the component to be powered.

11. The mainboard according to claim 1, wherein: The electrically and thermally conductive liquid is an organic ionic liquid.

12. The mainboard according to claim 1, wherein: The metal conduit is connected to the power supply board via welding or a detachable connection structure.

13. The mainboard according to claim 1, wherein: The power supply board further includes a control module connected to the hydraulic pump and configured to control the hydraulic pump to adjust the flow rate of the electrically conductive and heat conductive liquid according to the temperature and current carrying requirements of the power supply layer.

14. An electronic device, characterized in that: Comprising the mainboard as described in any one of claims 1-13.

15. The electronic device according to claim 14, characterized in that The electronic device is a server.

16. A method for processing a motherboard, characterized in that: include: generating at least one metal conduit; milling a milling groove on the printed circuit board that matches the size of the metal guide tube; Embedding the metal conduit into the milling groove and pressing the printed circuit board so that the metal conduit is in contact with the power supply layer of the printed circuit board; The conductive and heat-conductive liquid is injected into the metal conduit through the power supply board, and the liquid is driven to flow.

17. The method for processing a motherboard according to claim 16, wherein: Generating at least one metal conduit, comprising: generating at least one metal conduit with both ends closed; After embedding the metal conduit into the milling groove and pressing the printed circuit board, the method further includes: Both ends of the metal conduit are opened to form a communicating liquid channel.

18. The method for processing a mainboard according to claim 16 or 17, characterized in that: After embedding the metal conduit into the milling groove and pressing the printed circuit board, the method further includes: A blind hole is drilled between the top layer of the printed circuit board and the power layer, and a solid metal copper column is formed by an electroplating filling process, so that the power pin of the component to be powered is conductively connected to the power layer of the printed circuit board through the solid metal copper column.

19. A motherboard processing device, characterized in that: include: memory for storing computer programs; A processor, configured to implement the steps of the method for processing a motherboard as described in any one of claims 16 to 18 when executing the computer program.

20. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a computer program, wherein when the computer program is executed by a processor, the steps of the method for processing a motherboard according to any one of claims 16 to 18 are implemented.

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