A housing assembly and a terminal device

Abstract

The application provides a shell assembly and a terminal device. The middle frame is provided with a heat dissipation structure, which includes a first heat dissipation group and / or a second heat dissipation group, so that the heat of the circuit board assembly in the mainboard area can be quickly dissipated. The circuit board assembly can normally operate in a high-load scene, and the heat dissipation experience is good. In the first heat dissipation group, the heat of the circuit board assembly is conducted to the first phase change material layer through the first heat conduction piece, and the first phase change material layer absorbs and stores the heat of the first heat conduction piece. The first phase change material layer is adjacent to the screen area, so that the heat of the circuit board assembly is conducted to the vicinity of the screen area. In the second heat dissipation group, the heat of the circuit board assembly is conducted to the second phase change material layer through the second heat conduction piece, and the second phase change material layer absorbs and stores the heat of the second heat conduction piece. The second phase change material layer is adjacent to the battery area, so that the heat of the circuit board assembly is conducted to the vicinity of the battery area. The first phase change material layer and the second phase change material layer store heat, and the user basically does not feel a large temperature rise.

Description

Technical Field

[0001] This application relates to the field of heat dissipation structure technology for terminal devices, and in particular to a housing assembly and a terminal device. Background Technology

[0002] In terminal devices using related technologies, the heat generated by heat-generating components such as heat source chips needs to be dissipated through heat dissipation structures. With the development of terminal device technology, the power consumption and heat generation of chips will gradually increase. How to provide a housing assembly and terminal device with high heat dissipation capabilities to quickly dissipate heat from these components is a challenge that the industry needs to address. Summary of the Invention

[0003] This application provides a housing assembly and a terminal device with high heat dissipation capacity, enabling the heat from the heat-generating device to dissipate quickly.

[0004] The embodiments of this application adopt the following technical solutions:

[0005] In a first aspect, embodiments of this application provide a housing assembly, including: a mid-frame and a heat dissipation structure. The mid-frame has a first side and a second side facing away from each other. The first side of the mid-frame has a screen area. The second side of the mid-frame has a motherboard area and a battery area, the motherboard area being used to mount a circuit board assembly, the circuit board assembly having a first heat-conducting surface and a second heat-conducting surface facing away from each other. The heat dissipation structure includes a first heat dissipation group and / or a second heat dissipation group.

[0006] The first heat dissipation group is located on the first side of the middle frame. The first heat dissipation group includes a first heat-conducting component and a first phase change material layer. A portion of the first heat-conducting component is used to connect with the first heat-conducting surface of the circuit board assembly. The first phase change material layer is adjacent to the screen area and connected with the first heat-conducting component.

[0007] The second heat dissipation group is located on the second side of the middle frame. The second heat dissipation group includes a second heat-conducting element and a second phase change material layer. A portion of the second heat-conducting element is used to connect with the second heat-conducting surface of the circuit board assembly. The second phase change material layer is adjacent to the battery area and connected to the second heat-conducting element.

[0008] The housing assembly provided in this application embodiment has a heat dissipation structure in its middle frame. This structure includes at least one of a first heat dissipation group and a second heat dissipation group, enabling rapid heat dissipation from the circuit board assembly in the motherboard area. This allows the circuit board assembly to operate normally under high load conditions, reducing the need for temperature control and providing a better heat dissipation experience. In the first heat dissipation group, the heat generated by the circuit board assembly is conducted through the first heat-conducting surface to the first phase change material layer via the first heat-conducting component. The first phase change material layer absorbs and stores the heat from the first heat-conducting component, maintaining a relatively constant temperature. The first phase change material layer releases heat when its temperature drops below the phase change point. Placing the first phase change material layer adjacent to the screen area fully utilizes the limited space of the housing assembly, allowing heat from the circuit board assembly to be conducted to the vicinity of the screen area, thus improving heat dissipation capacity. In the second heat dissipation group, the heat generated by the circuit board assembly is conducted through the second heat-conducting surface to the second phase change material layer via the second heat-conducting component. The second phase change material layer absorbs and stores the heat from the second heat-conducting component, maintaining a relatively constant temperature. The second phase change material layer releases heat when its temperature drops below the phase change point. By placing the second phase change material layer adjacent to the battery area, the limited space of the housing assembly is fully utilized, allowing heat from the circuit board assembly to be conducted to the vicinity of the battery area, which serves as a cold zone in the mid-frame, thus improving heat dissipation. With heat stored by the first and second phase change material layers, users will not experience a significant temperature rise, resulting in a better user experience.

[0009] In one alternative implementation, the mid-frame can be generally rectangular or other shapes. The mid-frame may include a support plate and a frame, with the support plate connected within the frame. The support plate is used to mount components such as circuit board assemblies. The frame serves as the exterior component of the terminal device. The support plate and frame can be a one-piece molded structure or an assembled structure.

[0010] In one optional implementation, the first heat-conducting element includes at least one of a first graphite sheet and a first vacuum chamber heat spreader. Only the first graphite sheet, only the first vacuum chamber heat spreader, or both the first graphite sheet and the first vacuum chamber heat spreader can be used, enabling the heat of the circuit board assembly to be conducted from the first heat-conducting element to the first phase change material layer.

[0011] In one optional implementation, the first heat-conducting component includes a first vacuum chamber heat spreader, which is connected to a first heat-conducting surface of the circuit board assembly. A first phase change material layer is stacked on the first vacuum chamber heat spreader. The heat generated by the circuit board assembly is conducted from the first heat-conducting surface through the first vacuum chamber heat spreader, dissipated by the heat spreader, and then transferred to the first phase change material layer. The first phase change material layer absorbs and stores the heat from the first heat-conducting component, and its temperature remains essentially constant.

[0012] In one alternative implementation, the first phase change material layer and the first vacuum chamber heat exchange plate can be bonded together by adhesive backing or dispensing, which facilitates assembly.

[0013] In one alternative implementation, the first vacuum chamber heat spreader is adjacent to the screen area, which facilitates the arrangement of a large area of ​​the first vacuum chamber heat spreader on the first side of the middle frame, thereby improving heat dissipation capacity.

[0014] In one alternative implementation, the projection of the first vacuum chamber heat spreader at least partially covers the projections of the motherboard area and the battery area along the thickness direction of the mid-frame. A larger area of ​​the first vacuum chamber heat spreader results in stronger heat dissipation capabilities, allowing heat to diffuse to different locations on the heat spreader. The more the projection of the first vacuum chamber heat spreader covers the projections of the motherboard area and the battery area, the higher the proportion of the projected area of ​​the first vacuum chamber heat spreader to the projected area of ​​the screen area, which is more conducive to the rapid conduction of heat generated by the circuit board assembly to the first phase change material layer.

[0015] In one alternative implementation, the first phase change material layer is disposed on the side of the first vacuum chamber heat exchanger facing away from the circuit board assembly. The larger the area of ​​the first phase change material layer, the stronger its heat storage capacity.

[0016] In one alternative implementation, the projection of the first vacuum chamber heat exchanger overlaps the projection of the first phase change material layer along the thickness direction of the middle frame. A larger area of ​​the first vacuum chamber heat exchanger results in stronger heat dissipation. A larger area of ​​the first phase change material layer results in stronger heat storage capacity, thus enhancing the heat absorption and storage capabilities of the first phase change material layer.

[0017] In one alternative implementation, the first vacuum chamber heat spreader and the first phase change material layer are adjacent to the screen area, with the first phase change material layer located between the first vacuum chamber heat spreader and the screen area. In the thickness direction of the mid-frame, the first vacuum chamber heat spreader substantially covers the motherboard area and the battery area. The area of ​​the first phase change material layer is comparable to or close to the area of ​​the first vacuum chamber heat spreader. This gives the first vacuum chamber heat spreader high heat dissipation capacity, while the first phase change material layer has high heat storage capacity.

[0018] In one optional implementation, the first heat-conducting component includes a first vacuum chamber heat spreader, which is connected to a first heat-conducting surface of the circuit board assembly. A first phase change material is laminated on the first vacuum chamber heat spreader. The first heat-conducting component also includes a first graphite sheet, which is connected between the first heat-conducting surface of the circuit board assembly and the first vacuum chamber heat spreader. Combining the first graphite sheet and the first vacuum chamber heat spreader can improve heat dissipation capacity.

[0019] In one alternative implementation, the area of ​​the first graphite sheet is slightly larger than the area of ​​the first heat-conducting surface, allowing the operating heat of the circuit board assembly to be quickly conducted to the first vacuum chamber heat spreader via the first graphite sheet. The area of ​​the first vacuum chamber heat spreader is larger than the area of ​​the first graphite sheet, allowing the heat transferred through the first graphite sheet to diffuse to different locations on the first vacuum chamber heat spreader, achieving efficient heat dissipation.

[0020] In one optional implementation, the second heat-conducting element includes at least one of a second graphite sheet and a second vacuum chamber heat spreader. It is possible to use only the second graphite sheet, only the second vacuum chamber heat spreader, or both, enabling the heat from the circuit board assembly to be conducted from the second heat-conducting element to the second phase change material layer.

[0021] In one alternative implementation, the second heat-conducting element includes a second graphite sheet, one end of which is connected to a second shield, and the other end is connected to a second phase change material layer. The operating heat of the circuit board assembly is conducted to the second shield, then rapidly conducted from the second graphite sheet to the second phase change material layer, where the heat is absorbed and stored.

[0022] In one alternative implementation, the second phase change material layer is located on the side of the second heat conductor facing the battery area. The second phase change material layer absorbs and stores heat from the circuit board assembly and conducts it to the second heat conductor. The second phase change material layer releases heat when the temperature drops below the phase change point. This reduces heat conduction to the rear cover on the second side of the mid-frame during heat dissipation from the second phase change material layer.

[0023] In one alternative implementation, the second phase change material layer has a clearance groove on the side facing the battery region, which is used to accommodate a flexible circuit board. The small circuit board and the main board can be electrically connected via the flexible circuit board. The flexible circuit board is disposed within the clearance groove of the second phase change material layer. The thickness of the second phase change material layer varies at different locations, with a smaller thickness in the area with the clearance groove and a larger thickness in the area without the clearance groove. By arranging the flexible circuit board on the second side of the frame with a limited thickness, the overall volume of the second phase change material layer is increased, thereby improving its heat absorption and storage capacity.

[0024] In one alternative implementation, the thickness of the second phase change material layer is equal at different locations. This uniformly thick second phase change material layer absorbs and stores heat conducted from the circuit board assembly to the second heat conductor.

[0025] In one alternative implementation, the thickness of the second phase change material layer ranges from [0.03 mm to 0.3 mm]. The second phase change material layer occupies a small portion of the mid-frame thickness, thus having minimal impact on the mid-frame thickness. A larger area of ​​the second phase change material layer can be used; for example, the area of ​​the second phase change material layer may be comparable to or close to the area of ​​the screen area, thereby improving the heat storage capacity of the second phase change material layer.

[0026] Secondly, embodiments of this application provide a terminal device, including a circuit board assembly and the aforementioned housing assembly. The housing assembly includes a mid-frame and a heat dissipation structure. The mid-frame has a first side and a second side facing away from each other. The first side of the mid-frame has a screen area. The second side of the mid-frame has a motherboard area and a battery area. The circuit board assembly is located in the motherboard area and includes a motherboard, a first heat-generating device, and a second heat-generating device. The motherboard has a first surface and a second surface facing away from each other. The first heat-generating device is disposed on the first surface, and the second heat-generating device is disposed on the second surface. The first surface is provided with a first shielding member, which covers the first heat-generating device, and the side of the first shielding member facing away from the motherboard forms a first heat-conducting surface. The second surface is provided with a second shielding member, which covers the second heat-generating device, and the side of the second shielding member facing away from the motherboard forms a second heat-conducting surface.

[0027] The terminal device provided in this application embodiment has a circuit board assembly disposed in the motherboard area of ​​the mid-frame. A first surface of the motherboard has a first heating element and a first shielding element, the first shielding element providing electromagnetic shielding for the first heating element. A second surface of the motherboard has a second heating element and a second shielding element, the second shielding element providing electromagnetic shielding for the second heating element. The surface of the first shielding element serves as a first heat-conducting surface, and the surface of the second shielding element serves as a second heat-conducting surface. Combined with the heat dissipation structure in the housing assembly, heat from the circuit board assembly is rapidly dissipated. This allows the circuit board assembly to operate normally under high load conditions, reduces the need for temperature control triggering, and provides a better heat dissipation experience.

[0028] In one alternative implementation, the first heat-generating device includes a system-on-a-chip.

[0029] In one alternative implementation, the second heating device may include devices such as capacitors and resistors.

[0030] In one alternative implementation, the first heating device is arranged on the first surface of the motherboard, which facilitates the arrangement of a large-area first heat-conducting component on the side of the first shield away from the motherboard, and the setting of a large-area first vacuum cavity heat spreader and a first phase change material layer.

[0031] In one alternative implementation, the mid-frame has a through-hole corresponding to the motherboard area; the first shield is at least partially located in the through-hole, or the first shield is oriented towards the through-hole. Arranging the first thermal conductive element and the first phase change material layer on the first side of the mid-frame facilitates increasing the area of ​​the first thermal conductive element and the first phase change material layer, thereby improving heat dissipation and heat storage capabilities.

[0032] In one alternative implementation, when the heat dissipation structure includes a first heat dissipation group, a first thermally conductive gel is provided between the top of the first shield and the first heat-generating device; a second thermally conductive gel is provided between the top of the first shield and the first thermally conductive element of the first heat dissipation group. The top of the first shield refers to the position on the first shield furthest from the motherboard. This reduces thermal resistance and improves thermal conductivity.

[0033] In one alternative implementation, the first shielding member includes a frame-shaped portion and a cover. The frame-shaped portion is mounted and connected to a first surface, and the cover is connected to the side of the frame-shaped portion facing away from the motherboard. The frame-shaped portion and the cover form a first receiving cavity, and a first heat-generating device is located within the first receiving cavity. The side of the cover facing away from the motherboard forms a first heat-conducting surface. The frame-shaped portion and the cover provide electromagnetic shielding for the first heat-generating device. This is suitable for situations where a first heat dissipation assembly is provided on the first heat-conducting surface of a circuit board assembly.

[0034] In one alternative implementation, the first shielding component includes an integral first metal shield, the side of which facing away from the motherboard forming a first thermally conductive surface. The edge of the first metal shield is connected to a first surface of the motherboard, and the first metal shield provides electromagnetic shielding for the first heat-generating device. This is suitable for situations where a second heat dissipation group is provided on the second thermally conductive surface of the circuit board assembly, while the first thermally conductive surface does not have a first heat dissipation group.

[0035] In one alternative implementation, when the heat dissipation structure includes a second heat dissipation assembly, a third thermally conductive gel is filled within the second shielding component. The third thermally conductive gel covers the second heat-generating device and is connected to the top of the second shielding component. The third thermally conductive gel can reduce thermal resistance and improve thermal conductivity.

[0036] In one optional implementation, the second shielding component includes an adapter plate, a top plate, and a metal shielding layer. The adapter plate is connected to the second surface, and the top plate is connected to the side of the adapter plate opposite to the main board. The adapter plate has an inner hole, and the adapter plate and the top plate form a second receiving cavity. The second heating device is located within the second receiving cavity. The metal shielding layer is disposed on the side of the adapter plate opposite to the main board, forming a second heat-conducting surface. The main board, adapter plate, and top plate constitute a circuit board sandwich structure. Components can be arranged on one or both sides of the main board, and components can be arranged on one or both sides of the top plate, allowing for the arrangement of more components within a limited area and making full use of the limited space. The main board and the top plate are connected through electroplated through holes in the adapter plate. Electromagnetic shielding of the second heating device is achieved through the metal shielding layer.

[0037] In one alternative implementation, the metal shielding layer can be a sheet-like structure made of metal materials such as copper alloy or steel. The metal shielding layer can be easily formed by surface mount technology applied to the top plate.

[0038] In one alternative implementation, the second shielding component includes an integral second metal cover, the side of which facing away from the motherboard forming a second heat-conducting surface. The edge of the second metal cover is connected to a second surface of the motherboard, providing electromagnetic shielding for the second heat-generating device.

[0039] In one alternative implementation, the first heat-generating device is located in the middle of the motherboard along its width. The middle position of the motherboard is allowed to have a certain offset along its width, and the center of the first heat-generating device can move within a range of 3 millimeters to the left or right of the middle position in the motherboard's width direction. The heat generated by the first heat-generating device can be conducted relatively evenly from the middle of the motherboard along different directions to different locations on the motherboard, resulting in a more uniform heat distribution across different parts of the motherboard.

[0040] In one alternative implementation, the first heating element is located in the middle of the middle frame along its width. The middle position of the middle frame is allowed to have a certain offset along its width, and the center of the first heating element can move within a range of 3 mm to the left or right of the middle position in the width direction of the middle frame. The working heat of the first heating element can be relatively evenly conducted along different directions to different positions on the first heat conductor, resulting in a more uniform heat distribution at different positions on the first heat conductor.

[0041] In one alternative implementation, the screen area includes a first screen. The first screen is used to output light to display information. If a first heat sink is located on the first side of the mid-frame, the first screen may cover the first heat sink. The first screen may also have touch functionality for detecting touch operations applied to or near it.

[0042] In one alternative implementation, a back cover is provided on the second side of the mid-frame. The back cover serves as the exterior component of the terminal device and protects the components on the second side of the mid-frame. If a second heat sink is provided on the second side of the mid-frame, the back cover can cover the second heat sink.

[0043] In one alternative implementation, a second screen is provided on the second side of the mid-frame. The second screen is used to output light to display information. If a second heat sink is provided on the second side of the mid-frame, the second screen can completely or partially cover the heat sink. The second screen may also have touch functionality to detect touch operations applied to or near it.

[0044] In one alternative implementation, the battery area includes a battery, which is electrically connected to a circuit board assembly. The battery is used to power various electrical components of the terminal device.

[0045] In one alternative implementation, the second heat dissipation assembly includes a second thermally conductive element and a second phase change material layer, the second phase change material layer being located between the second thermally conductive element and the battery. The second phase change material layer releases heat when the temperature drops below the phase change point. This reduces heat conduction to the back cover during heat dissipation from the second phase change material layer. Attached Figure Description

[0046] Figure 1 This is a schematic diagram of the structure of a terminal device provided in an embodiment of this application;

[0047] Figure 2 This is a schematic diagram of the structure of a terminal device provided in another embodiment of this application;

[0048] Figure 3 This is a schematic diagram of the structure of a terminal device provided in another embodiment of this application;

[0049] Figure 4 This is a schematic diagram of the structure of a terminal device provided in another embodiment of this application;

[0050] Figure 5 A three-dimensional assembly drawing of a terminal device provided in another embodiment of this application;

[0051] Figure 6 for Figure 5 An exploded 3D view of the terminal equipment;

[0052] Figure 7 for Figure 6 An exploded three-dimensional view of the terminal device from another perspective;

[0053] Figure 8 for Figure 6 An exploded perspective view of the housing components in the terminal device;

[0054] Figure 9 for Figure 7 An exploded perspective view of the housing components in the terminal device;

[0055] Figure 10 (a) and (b) in the figure are temperature simulation diagrams of the relevant technology terminal equipment and the terminal equipment of this embodiment, respectively.

[0056] Explanation of reference numerals in the attached figures:

[0057] 1000 - Terminal equipment; 100 - Housing assembly;

[0058] 110 - Mid-frame; 110a - First side; 110b - Second side; 111 - Screen area; 112 - Motherboard area; 113 - Battery area; 114 - Support plate; 115 - Bezel; 116 - Through hole;

[0059] 120 - Heat dissipation structure; 120a - First heat dissipation group; 121 - First heat conduction component; 1211 - First graphite sheet; 1212 - First vacuum chamber heat spreader;

[0060] 122-First phase change material layer; 123-First thermally conductive gel; 124-Second thermally conductive gel; 120b-Second heat dissipation assembly; 125-Second thermally conductive component; 1251-Second graphite sheet; 1252-Second vacuum chamber heat spreader; 126-Second phase change material layer; 1261-Allowing groove; 127-Third thermally conductive gel;

[0061] 200 - Circuit board assembly; 200a - First heat-conducting surface; 200b - Second heat-conducting surface;

[0062] 210 - Mainboard; 210a - First surface; 210b - Second surface;

[0063] 220 - First heating element; 230 - Second heating element;

[0064] 240 - First shielding component; 241 - Frame-shaped part; 242 - Cover; 243 - First receiving cavity; 244 - First metal cover;

[0065] 250 - Second shielding component; 251 - Adapter plate; 252 - Top plate; 253 - Second receiving cavity; 254 - Metal shielding layer; 255 - Second metal cover;

[0066] 300 - First screen; 400 - Back cover; 500 - Battery. Detailed Implementation

[0067] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application. Although the description of this application is presented in conjunction with some embodiments, this does not mean that the features of this application are limited to this implementation. On the contrary, the purpose of describing the application in conjunction with embodiments is to cover other options or modifications that may arise based on the claims of this application. To provide a thorough understanding of this application, many specific details will be included in the following description. This application may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this application, some specific details will be omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0068] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0069] It should be understood that, in the description of the embodiments of this application, unless otherwise expressly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. The terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0070] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0071] In the embodiments of this application, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0072] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0073] A terminal device in related technology includes a mid-frame, a screen, a back cover, and a motherboard. The screen and back cover are respectively located on opposite sides of the mid-frame, and the motherboard is located on the mid-frame, on which heat-generating devices (such as heat source chips) are mounted. A vacuum chamber heat sink can be disposed between the mid-frame and the screen, and the vacuum chamber heat sink is connected to the heat-generating devices, serving as a heat dissipation structure. The heat generated by the heat-generating devices can be dissipated through the vacuum chamber heat sink. Under high-load scenarios, the heat from the vacuum chamber heat sink can be conducted to the screen, causing localized overheating of the screen.

[0074] If the heat dissipation structure is insufficient, the heat source chip will have difficulty operating normally under high load conditions, which may trigger temperature control. This will reduce the power consumption and performance of the heat source chip, resulting in poor heat dissipation and a shorter lifespan for the terminal device.

[0075] See Figure 1 This application provides a terminal device 1000, including a circuit board assembly 200 and a housing assembly 100. The housing assembly 100 includes a mid-frame 110 and a heat dissipation structure 120. The mid-frame 110 has a first side 110a and a second side 110b opposite to each other. The first side 110a of the mid-frame 110 has a screen area 111. The second side 110b of the mid-frame 110 has a motherboard area 112 and a battery area 113. The circuit board assembly 200 is located in the motherboard area 112 and includes a motherboard 210, a first heat-generating device 220, and a second heat-generating device 230. The motherboard 210 has a first surface 210a and a second surface 210b opposite to each other. The first heat-generating device 220 is disposed on the first surface 210a, and the second heat-generating device 230 is disposed on the second surface 210b. A first shielding member 240 is provided on the first surface 210a, covering the first heating element 220. The side of the first shielding member 240 facing away from the motherboard 210 forms a first heat-conducting surface 200a. A second shielding member 250 is provided on the second surface 210b, covering the second heating element 230. The side of the second shielding member 250 facing away from the motherboard 210 forms a second heat-conducting surface 200b.

[0076] The terminal device 1000 provided in this application embodiment has a circuit board assembly 200 disposed in the motherboard area 112 of the middle frame 110. The first surface 210a of the motherboard 210 is provided with a first heat-generating device 220 and a first shielding member 240, the first shielding member 240 providing electromagnetic shielding for the first heat-generating device 220. The second surface 210b of the motherboard 210 is provided with a second heat-generating device 230 and a second shielding member 250, the second shielding member 250 providing electromagnetic shielding for the second heat-generating device 230. The surface of the first shielding member 240 serves as a first heat-conducting surface 200a, and the surface of the second shielding member 250 serves as a second heat-conducting surface 200b. Combined with the heat dissipation structure 120 in the housing assembly 100, heat from the circuit board assembly 200 is rapidly dissipated. This allows the circuit board assembly 200 to operate normally under high load conditions, reducing the need for temperature control triggering and providing a better heat dissipation experience.

[0077] To facilitate the description of the orientation and orientation of the housing assembly 100 and the terminal device 1000, the width direction, length direction and thickness direction of the middle frame 110 are defined as direction X, direction Y and direction Z, respectively.

[0078] See Figure 1 This application provides a housing assembly 100, including a mid-frame 110 and a heat dissipation structure 120. The mid-frame 110 has a first side 110a and a second side 110b facing away from each other. The first side 110a of the mid-frame 110 has a screen area 111. The second side 110b of the mid-frame 110 has a motherboard area 112 and a battery area 113. The motherboard area 112 is used to mount a circuit board assembly 200, and the circuit board assembly 200 has a first heat-conducting surface 200a and a second heat-conducting surface 200b facing away from each other. The heat dissipation structure 120 includes a first heat dissipation group 120a and / or a second heat dissipation group 120b.

[0079] The first heat dissipation group 120a is located on the first side 110a of the middle frame 110. The first heat dissipation group 120a includes a first heat-conducting element 121 and a first phase change material layer 122. A portion of the first heat-conducting element 121 is used to connect with the first heat-conducting surface 200a of the circuit board assembly 200. The first phase change material layer 122 is adjacent to the screen area 111 and connected to the first heat-conducting element 121.

[0080] The second heat dissipation group 120b is disposed on the second side 110b of the middle frame 110. The second heat dissipation group 120b includes a second heat conductor 125 and a second phase change material layer 126. A portion of the second heat conductor 125 is used to connect with the second heat conductor surface 200b of the circuit board assembly 200. The second phase change material layer 126 is adjacent to the battery area 113 and connected to the second heat conductor 125.

[0081] The first phase change material layer 122 and the second phase change material layer 126 are layered structures made of phase change material (PCM). Phase change material refers to a substance that changes its state of matter while maintaining a constant temperature and can provide latent heat.

[0082] See Figure 1 With the first heat dissipation group 120a and the second heat dissipation group 120b set up, the working heat of the circuit board assembly 200 is dissipated through the first heat dissipation group 120a and the second heat dissipation group 120b, achieving a double-sided heat dissipation effect for the middle frame 110.

[0083] See Figure 2 When the first heat dissipation group 120a is set, the working heat of the circuit board assembly 200 is dissipated through the first heat dissipation group 120a, thereby achieving heat dissipation of the first side 110a (i.e. the screen area 111 side) of the middle frame 110.

[0084] See Figure 3 , Figure 4 When the second heat dissipation group 120b is set, the working heat of the circuit board assembly 200 is dissipated through the second heat dissipation group 120b, thereby achieving heat dissipation on the second side 110b of the middle frame 110 (i.e., the motherboard area 112 side).

[0085] The housing assembly 100 provided in this application embodiment has a heat dissipation structure 120 in its middle frame 110. The heat dissipation structure 120 includes at least one of a first heat dissipation group 120a and a second heat dissipation group 120b, which enables the heat of the circuit board assembly 200 in the motherboard area 112 to be dissipated quickly. This allows the circuit board assembly 200 to operate normally under high load conditions, reduces the need for temperature control, and provides a better heat dissipation experience. In the first heat dissipation group 120a, the heat generated by the circuit board assembly 200 during operation is conducted through the first heat-conducting surface 200a to the first phase change material layer 122 via the first heat-conducting element 121. The first phase change material layer 122 absorbs and stores the heat from the first heat-conducting element 121, and its temperature remains essentially constant. The first phase change material layer 122 releases heat when its temperature drops below the phase change point. By placing the first phase change material layer 122 adjacent to the screen area 111, the limited space of the housing assembly 100 is fully utilized, allowing the heat of the circuit board assembly 200 to be conducted to the vicinity of the screen area 111, thereby improving heat dissipation capacity. In the second heat dissipation group 120b, the circuit board assembly 200 generates heat during operation. The heat from the second heat-conducting surface 200b is conducted to the second phase change material layer 126 via the second heat-conducting element 125. The second phase change material layer 126 absorbs and stores the heat from the second heat-conducting element 125, and its temperature remains essentially constant. The second phase change material layer 126 releases heat when its temperature drops below the phase change point. By placing the second phase change material layer 126 adjacent to the battery area 113, the limited space of the housing assembly 100 is fully utilized, allowing the heat from the circuit board assembly 200 to be conducted to the vicinity of the battery area 113, which serves as a cold zone for the middle frame 110, thus improving heat dissipation capacity. With heat stored by the first phase change material layer 122 and the second phase change material layer 126, users will not experience a significant temperature rise, resulting in a good user experience.

[0086] In some embodiments, see Figure 1 , Figures 5 to 7 The middle frame 110 can be generally rectangular or other shapes. The middle frame 110 may include a support plate 114 and a frame 115, with the support plate 114 connected within the frame 115. The support plate 114 is used to mount components such as circuit board assemblies. The frame 115 serves as the exterior component of the terminal device 1000. The support plate 114 and the frame 115 can be a one-piece molded structure or an assembled structure.

[0087] In some embodiments, see Figure 1 The middle frame 110 has a through hole 116 at the location corresponding to the motherboard area 112; the first shield 240 is at least partially located in the through hole 116, or the first shield 240 is oriented toward the through hole 116.

[0088] The first heat-conducting element 121 and the first phase change material layer 122 are arranged on the first side 110a of the middle frame 110 to increase the area of ​​the first heat-conducting element 121 and the first phase change material layer 122, thereby improving heat dissipation and heat storage capabilities. The circuit board assembly 200 generates heat during operation. This heat is conducted from the first heat-conducting surface 200a of the first shield 240 through the first heat-conducting element 121 to the first phase change material layer 122. The first phase change material layer 122 absorbs and stores the heat from the first heat-conducting element 121.

[0089] In some embodiments, see Figure 1 The first heat-generating device 220 includes a system-on-a-chip (SoC). For example, a SoC can be a main chip in a mobile phone that integrates a central processing unit (CPU), a graphics processing unit (GPU), and a communication module. SoCs generate significant heat during operation.

[0090] In some embodiments, see Figure 1 The second heating device 230 may include devices such as capacitors and resistors.

[0091] In some embodiments, see Figure 1 The first heating element 220 is arranged on the first surface 210a of the motherboard 210, which facilitates the arrangement of a large-area first heat-conducting element 121 on the side of the first shield 240 away from the motherboard 210. For example, a large-area first vacuum chamber heat spreader 1212 and a first phase change material layer 122 are set. The heat from the first heating element 220 is conducted through the first shield 240 to different positions of the first vacuum chamber heat spreader 1212, and the heat is absorbed and stored by the first phase change material layer 122. The heat dissipation capacity is high, and the user will not feel a large temperature rise.

[0092] In some embodiments, see Figure 1 In the case where the heat dissipation structure 120 includes a first heat dissipation group 120a, a first thermally conductive gel 123 is provided between the top of the first shield 240 and the first heat-generating device 220; a second thermally conductive gel 124 is provided between the top of the first shield 240 and the first thermally conductive element 121 of the first heat dissipation group 120a. The top of the first shield 240 refers to the position on the first shield 240 away from the motherboard 210.

[0093] The first thermally conductive gel 123 is filled between the first shield 240 and the first heating device 220, and the second thermally conductive gel 124 is filled between the first shield 240 and the first thermally conductive element 121. Both can reduce thermal resistance and improve thermal conductivity, so that the working heat of the first heating device 220 is efficiently conducted to the first shield 240 through the first thermally conductive gel 123, and then efficiently conducted to the first thermally conductive element 121 of the first heat dissipation group 120a through the second thermally conductive gel 124, and the first heat dissipation group 120a achieves rapid heat dissipation.

[0094] There are several possible implementation methods for setting the first shield 240. Two exemplary implementation methods for the first shield 240 are given below.

[0095] For the first implementation method of the first shielding component 240, please refer to [link / reference]. Figure 1 , Figure 2 The first shielding member 240 includes a frame-shaped portion 241 and a cover 242. The frame-shaped portion 241 is mounted on and connected to the first surface 210a, and the cover 242 is connected to the side of the frame-shaped portion 241 facing away from the motherboard 210. The frame-shaped portion 241 and the cover 242 form a first receiving cavity 243, and the first heating device 220 is located in the first receiving cavity 243. The side of the cover 242 facing away from the motherboard 210 forms a first heat-conducting surface 200a. The frame-shaped portion 241 and the cover 242 provide electromagnetic shielding for the first heating device 220. This method is suitable for situations where a first heat dissipation group 120a is provided on the first heat-conducting surface 200a of the circuit board assembly 200. A first thermal conductive gel 123 is provided on the top surface of the first heating device 220, and then the cover 242 is connected to the frame portion 241. Next, a second thermal conductive gel 124 is provided on the cover 242, and finally the first heat dissipation assembly 120a is installed, so that the first thermal conductive element 121 and the second thermal conductive gel 124 are connected.

[0096] For the second implementation method of the first shielding component 240, please refer to [link / reference]. Figure 3 , Figure 4 The first shielding component 240 includes an integral first metal cover 244, with a first heat-conducting surface 200a formed on the side of the first metal cover 244 facing away from the motherboard 210. The edge of the first metal cover 244 is connected to the first surface 210a of the motherboard 210, and the first metal cover 244 provides electromagnetic shielding for the first heat-generating device 220. This method is suitable for situations where a second heat dissipation group 120b is provided on the second heat-conducting surface 200b of the circuit board assembly 200, but the first heat-conducting surface 200a does not have a first heat dissipation group 120a.

[0097] In some embodiments, see Figure 1 , Figure 2The first heat-conducting element 121 includes at least one of a first graphite sheet 1211 and a first vacuum chamber heat spreader 1212. Only the first graphite sheet 1211, only the first vacuum chamber heat spreader 1212, or both can be used. These methods enable the heat from the circuit board assembly 200 to be conducted from the first heat-conducting element 121 to the first phase change material layer 122.

[0098] Among them, the graphite sheet and the vacuum chamber heat spreader are flexible thermal conductive materials with high heat dissipation capacity. They are also flexible enough to be bent and arranged in the middle frame 110, occupying little space and being lightweight.

[0099] Graphite sheets rely on the anisotropy of the graphite crystal structure to conduct heat uniformly in the horizontal direction, and can adapt well to any surface.

[0100] Vacuum chamber (VC) heat exchangers utilize the principle of phase change heat transfer. The liquid working fluid inside the vacuum chamber is heated and vaporized. The vapor diffuses to the condensation zone, releasing heat, and then flows back, forming a working fluid circulation. Vacuum chamber heat exchangers enable rapid and uniform heat dissipation.

[0101] In some embodiments, see Figure 1 and Figure 2 The first heat-conducting component 121 includes a first vacuum chamber heat spreader 1212, which is connected to the first heat-conducting surface 200a of the circuit board assembly 200. A first phase change material layer 122 is stacked on the first vacuum chamber heat spreader 1212. The heat generated by the circuit board assembly 200 is conducted from the first heat-conducting surface 200a through the first vacuum chamber heat spreader 1212, dissipated by the heat spreader 1212, and then conducted to the first phase change material layer 122. The first phase change material layer 122 absorbs and stores the heat from the first heat-conducting component 121, and its temperature remains essentially constant.

[0102] The first phase change material layer 122 and the first vacuum chamber heat spreader 1212 can be bonded together by adhesive backing or dispensing, making assembly convenient.

[0103] For example, the first vacuum chamber heat spreader 1212 is adjacent to the screen area 111, which facilitates the arrangement of a large area of ​​the first vacuum chamber heat spreader 1212 on the first side 110a of the middle frame 110, which is beneficial to improving heat dissipation capacity.

[0104] In some embodiments, see Figure 1 and Figure 2Along the thickness direction Z of the middle frame 110, the projection of the first vacuum chamber heat spreader 1212 at least partially covers the projection of the motherboard area 112 and the battery area 113. The larger the area of ​​the first vacuum chamber heat spreader 1212, the stronger its heat dissipation capacity, allowing heat to diffuse to different locations on the first vacuum chamber heat spreader 1212. The more the projection of the first vacuum chamber heat spreader 1212 covers the projection of the motherboard area 112 and the battery area 113, the higher the proportion of the projected area of ​​the first vacuum chamber heat spreader 1212 to the projected area of ​​the screen area 111, which is more conducive to the rapid conduction of heat generated by the circuit board assembly 200 to the first phase change material layer 122.

[0105] In some embodiments, see Figure 1 and Figure 2 The first phase change material layer 122 is disposed on the side of the first vacuum chamber heat spreader 1212 facing away from the circuit board assembly 200. The larger the area of ​​the first phase change material layer 122, the stronger its heat storage capacity. By making the area of ​​the first phase change material layer 122 larger, it is easier for the first phase change material layer 122 to absorb and store a large amount of heat from the first heat conductor 121, and the temperature of the first phase change material layer 122 remains basically constant. The user does not feel a significant temperature rise, resulting in a good user experience.

[0106] In some embodiments, see Figure 1 and Figure 2 In the thickness direction Z of the middle frame 110, the projection of the first vacuum chamber heat spreader 1212 overlaps the projection of the first phase change material layer 122. The larger the area of ​​the first vacuum chamber heat spreader 1212, the stronger its heat dissipation capacity. The larger the area of ​​the first phase change material layer 122, the stronger its heat storage capacity, thus improving the heat absorption and storage capacity of the first phase change material layer 122.

[0107] For example, the first vacuum chamber heat spreader 1212 and the first phase change material layer 122 are adjacent to the screen area 111, with the first phase change material layer 122 located between the first vacuum chamber heat spreader 1212 and the screen area 111. In the thickness direction Z of the mid-frame 110, the first vacuum chamber heat spreader 1212 substantially covers the motherboard area 112 and the battery area 113. The area of ​​the first phase change material layer 122 is comparable to or close to the area of ​​the first vacuum chamber heat spreader 1212. This gives the first vacuum chamber heat spreader 1212 a high heat dissipation capacity, while the first phase change material layer 122 has a high heat storage capacity.

[0108] In some embodiments, see Figure 1 and Figure 2The first heat-conducting component 121 includes a first vacuum chamber heat spreader 1212, which is connected to the first heat-conducting surface 200a of the circuit board assembly 200. A first phase change material layer 122 is stacked on the first vacuum chamber heat spreader 1212. The first heat-conducting component 121 also includes a first graphite sheet 1211, which is connected between the first heat-conducting surface 200a of the circuit board assembly 200 and the first vacuum chamber heat spreader 1212.

[0109] Combining the first graphite sheet 1211 and the first vacuum chamber heat spreader 1212 enhances heat dissipation. The heat generated by the circuit board assembly 200 is transferred from the first heat-conducting surface 200a, rapidly conducted through the first graphite sheet 1211 to the first vacuum chamber heat spreader 1212, and then dissipated through the heat spreader 1212, allowing the heat to diffuse to different locations on the first vacuum chamber heat spreader 1212. Finally, the heat is efficiently conducted to the first phase change material layer 122, where it is absorbed and stored.

[0110] For example, the area of ​​the first graphite sheet 1211 is slightly larger than the area of ​​the first heat-conducting surface 200a, which allows the working heat of the circuit board assembly 200 to be quickly conducted to the first vacuum chamber heat spreader 1212 via the first graphite sheet 1211. The area of ​​the first vacuum chamber heat spreader 1212 is larger than the area of ​​the first graphite sheet 1211, allowing the heat passing through the first graphite sheet 1211 to diffuse to different locations on the first vacuum chamber heat spreader 1212, achieving efficient heat dissipation.

[0111] In some embodiments, see Figure 1 , Figure 3 , Figure 4 In the case where the heat dissipation structure 120 includes a second heat dissipation group 120b, the second shield 250 is filled with a third thermally conductive gel 127, which covers the second heat-generating device 230 and is connected to the top of the second shield 250. The top of the second shield 250 refers to the position on the second shield 250 away from the motherboard 210.

[0112] The third thermal conductive gel 127 can reduce thermal resistance and improve thermal conductivity, so that the working heat of the first heating device 220 is conducted to the top of the second shield 250 through the motherboard 210 and the third thermal conductive gel 127, and the working heat of the second heating device 230 is conducted to the top of the second shield 250 through the third thermal conductive gel 127, and is quickly dissipated by the second heat dissipation group 120b.

[0113] There are several possible implementation methods for setting the second shield 250. Two exemplary implementation methods for the second shield 250 are given below.

[0114] For the first implementation method of the second shielding component 250, please refer to [link / reference]. Figures 1 to 3The second shielding component 250 includes an adapter plate 251, a top plate 252, and a metal shielding layer 254. The adapter plate 251 is connected to the second surface 210b, and the top plate 252 is connected to the side of the adapter plate 251 facing away from the main board 210. The adapter plate 251 has an inner hole. The adapter plate 251 and the top plate 252 form a second receiving cavity 253. The second heating device 230 is located in the second receiving cavity 253. The metal shielding layer 254 is disposed on the side of the adapter plate 251 facing away from the main board 210, and the side of the metal shielding layer 254 facing away from the main board 210 forms a second heat-conducting surface 200b.

[0115] The motherboard 210, adapter board 251, and top plate 252 form a circuit board sandwich structure. Components can be arranged on one or both sides of the motherboard 210 and the top plate 252, allowing for the arrangement of more components within a limited area and making full use of the limited space. This allows for more space to be reserved in the middle frame 110 for larger components (such as the battery 500). The motherboard 210 and top plate 252 are connected through electroplated through holes in the adapter board 251. A metal shielding layer 254 is provided on the top of the top plate 252 to provide electromagnetic shielding for the second heat-generating device 230, reducing electromagnetic interference from the second heat-generating device 230 to components other than the second shielding component 250 (such as the camera module). The metal shielding layer 254 also allows heat from the top plate 252 to be conducted to the second heat-conducting component 125 of the second heat dissipation group 120b.

[0116] The metal shielding layer 254 can be a sheet structure made of metal materials such as copper alloy or steel. The metal shielding layer 254 can be installed on the top plate 252 using surface mounted technology (SMT), which is easy to form.

[0117] For the second implementation method of the second shielding component 250, please refer to [link / reference]. Figure 4 The second shielding component 250 includes an integral second metal cover 255, on the side of the second metal cover 255 facing away from the motherboard 210, forming a second heat-conducting surface 200b. The edge of the second metal cover 255 is connected to the second surface 210b of the motherboard 210. The second metal cover 255 provides electromagnetic shielding for the second heat-generating device 230, reducing electromagnetic interference from the second heat-generating device 230 to other devices (such as camera modules) outside the second metal cover 255.

[0118] In some embodiments, see Figure 1 , Figure 3 , Figure 4The second heat-conducting element 125 includes at least one of a second graphite sheet 1251 and a second vacuum chamber heat spreader 1252. Only the second graphite sheet 1251, only the second vacuum chamber heat spreader 1252, or both can be used. These methods enable the heat from the circuit board assembly 200 to be conducted from the second heat-conducting element 125 to the second phase change material layer 126.

[0119] For example, the second heat-conducting element 125 includes a second graphite sheet 1251, one end of which is connected to the second shield 250, and the other end is connected to the second phase change material layer 126. The operating heat of the circuit board assembly 200 is conducted to the second shield 250, and then rapidly conducted by the second graphite sheet 1251 to the second phase change material layer 126, where the heat is absorbed and stored.

[0120] In some embodiments, see Figure 1 , Figure 3 , Figure 4 The second phase change material layer 126 is located on the side of the second heat conductor 125 facing the battery area 113. The second phase change material layer 126 is used to absorb and store heat from the circuit board assembly 200 and conduct it to the second heat conductor 125. The second phase change material layer 126 releases heat when the temperature drops below the phase change point. This reduces heat conduction to the back cover 400 of the second side 110b of the middle frame 110 during heat dissipation by the second phase change material layer 126, improving the user experience.

[0121] In some embodiments, see Figure 7 , Figure 8 The second phase change material layer 126 has a clearance groove 1261 on the side facing the battery region 113, which is used to accommodate a flexible circuit board (not shown).

[0122] A motherboard 210 can be installed in the mainboard area 112 of the middle frame 110, and a small circuit board (not shown) can be installed in a position of the middle frame 110 away from the motherboard area 112. The small circuit board and the motherboard 210 can be electrically connected via a flexible circuit board. The flexible circuit board is disposed in the clearance groove 1261 of the second phase change material layer 126. The thickness of the second phase change material layer 126 is not equal at different positions, with a smaller thickness in the part with the clearance groove 1261 and a larger thickness in the part without the clearance groove 1261. Under the limited thickness of the middle frame 110, the flexible circuit board is arranged on the second side 110b of the middle frame 110, which increases the overall volume of the second phase change material layer 126 and improves the heat absorption and storage capacity.

[0123] In other embodiments, see Figure 1The second phase change material layer 126 has the same thickness at different locations. The second phase change material layer 126 of equal thickness absorbs and stores the heat conducted from the circuit board assembly 200 to the second heat conductor 125.

[0124] In some embodiments, see Figure 1 , Figure 8 The thickness of the second phase change material layer 126 ranges from 0.03 mm to 0.3 mm. The second phase change material layer 126 occupies a small portion of the thickness of the middle frame 110, having minimal impact on its overall thickness. A larger area of ​​the second phase change material layer 126 can be used; for example, the area of ​​the second phase change material layer 126 can be equal to or close to the area of ​​the screen area 111, thereby improving the heat storage capacity of the second phase change material layer 126.

[0125] The thickness of the second phase change material layer 126 can be 0.03 mm, 0.10 mm, 0.15 mm, 0.20 mm, 0.25 mm, 0.30 mm, etc.

[0126] In some embodiments, see Figure 8 In the width direction X of the motherboard 210, the first heat-generating device 220 is located in the middle of the motherboard 210. The middle position of the motherboard 210 is allowed to be offset to a certain extent along the width direction X of the motherboard 210. For example, the center of the first heat-generating device 220 can be moved within a range of 3 mm to the left or right of the middle position in the width direction X of the motherboard 210.

[0127] The heat generated by the first heat-generating device 220 can be conducted relatively evenly from the middle of the motherboard 210 in the width direction X to different locations on the motherboard 210, resulting in a more uniform heat distribution and reducing the possibility of excessively high local temperatures on the first side 110a of the mid-frame 110 under high-load conditions. Combined with the first heat dissipation group 120a and / or the second heat dissipation group 120b in the heat dissipation structure 120, the heat generated by the first heat-generating device 220 can diffuse in different directions, achieving efficient heat dissipation.

[0128] In some embodiments, see Figure 5 In the width direction X of the middle frame 110, the first heating element 220 is located in the middle of the middle frame 110. The middle position of the middle frame 110 is allowed to be offset to a certain extent along the width direction X of the middle frame 110. For example, the center of the first heating element 220 can be moved within 3 mm to the left or right of the middle position of the middle frame 110 in the width direction X.

[0129] The working heat of the first heating element 220 can be conducted relatively evenly along different directions to different positions of the first heat conductor 121, so that the heat distribution at different positions of the first heat conductor 121 is relatively uniform, reducing the situation of excessive local temperature on the first side 110a of the middle frame 110 under high load scenarios.

[0130] In some embodiments, see Figure 1 , Figures 5 to 7 The screen area 111 is provided with a first screen 300. The first screen 300 is used to output light to display information. When a first heat dissipation group 120a is provided on the first side 110a of the middle frame 110, the first screen 300 can cover the first heat dissipation group 120a. The first screen 300 may also have a touch function to detect touch operations applied to or near it.

[0131] In some embodiments, see Figure 1 , Figures 5 to 7 A back cover 400 is provided on the second side 110b of the middle frame 110. The back cover 400 serves as an exterior component of the terminal device 1000 and protects the components on the second side 110b of the middle frame 110. When a second heat sink 120b is provided on the second side 110b of the middle frame 110, the back cover 400 can cover the second heat sink 120b.

[0132] In some embodiments, a second screen is provided on the second side 110b of the mid-frame 110. The second screen is used to output light to display information. When a second heat dissipation assembly 120b is provided on the second side 110b of the mid-frame 110, the second screen may completely or partially cover the second heat dissipation assembly 120b. The second screen may also have touch functionality for detecting touch operations applied to or near it.

[0133] In some embodiments, see figure Figure 1 , Figures 7 to 9 Battery area 113 is equipped with battery 500, which is electrically connected to circuit board assembly 200. Battery 500 is used to supply power to various electrical components of terminal device 1000.

[0134] When the second heat dissipation group 120b is configured, it includes a second heat-conducting element 125 and a second phase change material layer 126, with the second phase change material layer 126 located between the second heat-conducting element 125 and the battery 500. The second phase change material layer 126 releases heat when its temperature drops below the phase change point. This reduces heat conduction to the back cover 400 during heat dissipation from the second phase change material layer 126, improving the user experience.

[0135] The following simulation experiment compares the heat dissipation performance of the related technology terminal device and the terminal device of this embodiment. The related technology terminal device is referred to as the comparative example, and the terminal device of this embodiment is referred to as this embodiment. The mid-frame and circuit board assembly of both the comparative example and this embodiment have the same length and width dimensions. The circuit board assembly of both includes a motherboard and a first heat-generating device. The first heat-generating device is a SoC with a power of 4 watts (W).

[0136] In the comparative example, such as Figure 10As shown in (a), the first heating element 220' is not located in the middle of the motherboard in the width direction X, but rather at a position far from the middle of the motherboard. The shield of the first heating element 220' is connected to the vacuum chamber heat spreader, and no graphite sheet is disposed between the shield of the first heating element 220' and the vacuum chamber heat spreader, nor is a phase change material layer disposed on the vacuum chamber heat spreader.

[0137] In this embodiment, refer to Figure 8 , Figure 9 The first heating element 220 is located in the middle of the width direction X of the main board 210. A first graphite sheet 1211 is provided between the first shield 240 of the first heating element 220 and the first vacuum chamber heat spreader 1212, and a first phase change material layer 122 is stacked on the first vacuum chamber heat spreader 1212.

[0138] from Figure 10 As can be seen in (a) and (b) in the figures, the comparative example has localized overheating on the screen side. Compared to the comparative example, the temperature rise parameter of this embodiment is increased by approximately 0.7 mA / °C, demonstrating a higher steady-state heat dissipation capability. The temperature rise parameter represents the current value (e.g., 1 mA, 2 mA, etc.) corresponding to a 1°C increase in the device temperature of the terminal device, and can characterize the steady-state heat dissipation capability of the terminal device.

[0139] The junction temperature of the comparative SoC is 74.68℃, while the junction temperature of the SoC in this embodiment is 74.15℃. This embodiment reduces the junction temperature by approximately 0.5 degrees Celsius (℃), indicating that the SoC in this embodiment has better heat dissipation. Junction temperature refers to the actual operating temperature of the semiconductor in an electronic device.

[0140] Comparing the comparative example and this embodiment in a 4K resolution, 60FPS recording scenario, we can obtain their temperature rise curves, i.e., temperature-temperature control duration curves. At the same temperature of 46℃, compared to the comparative example's temperature control duration of approximately 1260 seconds, this embodiment's temperature control duration is approximately 1350 seconds, an extension of about 90 seconds, making it a longer temperature control duration. Frame rate (frames per second, FPS) represents the number of frames refreshed per second.

[0141] After confirming whether it is the housing assembly 100 and terminal device 1000 of this application embodiment, disassembly analysis revealed that the heat dissipation structure 120 includes a first heat dissipation group 120a and / or a second heat dissipation group 120b. The first heat dissipation group 120a is located on the first side 110a of the mid-frame 110 and includes a first thermally conductive element 121 and a first phase change material layer 122. A portion of the first thermally conductive element 121 is connected to the first thermally conductive surface 200a of the circuit board assembly 200, and the first phase change material layer 122 is adjacent to the screen area 111 and connected to the first thermally conductive element 121. The second heat dissipation group 120b is located on the second side 110b of the mid-frame 110 and includes a second thermally conductive element 125 and a second phase change material layer 126. A portion of the second thermally conductive element 125 is connected to the second thermally conductive surface 200b of the circuit board assembly 200, and the second phase change material layer 126 is adjacent to the battery area 113 and connected to the second thermally conductive element 125.

[0142] Finally, it should be noted that the above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A housing assembly characterized by, The shell assembly comprises: a middle frame and a heat dissipation structure; the middle frame has a first side and a second side opposite to each other; the first side of the middle frame has a screen area; the second side of the middle frame has a mainboard area and a battery area, the mainboard area is used for mounting a circuit board assembly, the circuit board assembly has a first heat conduction surface and a second heat conduction surface opposite to each other; the heat dissipation structure comprises a first heat dissipation group and / or a second heat dissipation group; the first heat dissipation group is arranged on the first side of the middle frame, the first heat dissipation group comprises a first heat conduction member and a first phase change material layer, a part of the first heat conduction member is used for connecting the first heat conduction surface of the circuit board assembly, and the first phase change material layer is adjacent to the screen area and connected with the first heat conduction member; the second heat dissipation group is arranged on the second side of the middle frame, the second heat dissipation group comprises a second heat conduction member and a second phase change material layer, a part of the second heat conduction member is used for connecting the second heat conduction surface of the circuit board assembly, and the second phase change material layer is adjacent to the battery area and connected with the second heat conduction member.

2. The housing assembly of claim 1, wherein, The first heat conduction member comprises at least one of a first graphite sheet and a first vacuum cavity heat plate. And / or, the second heat conduction member comprises at least one of a second graphite sheet and a second vacuum cavity heat plate.

3. The housing assembly of claim 1, wherein, The first heat conduction member comprises a first vacuum cavity heat plate, the first vacuum cavity heat plate is connected with the first heat conduction surface of the circuit board assembly, and the first phase change material layer is arranged on the side of the first vacuum cavity heat plate opposite to the circuit board assembly.

4. The housing assembly of claim 3, wherein, In the thickness direction of the middle frame, the projection of the first vacuum cavity heat plate at least partially covers the projection of the mainboard area and the projection of the battery area.

5. The housing assembly of claim 3, wherein, The first phase change material layer is arranged on the side of the first vacuum cavity heat plate opposite to the circuit board assembly.

6. The housing assembly of claim 5, wherein, In the thickness direction of the middle frame, the projection of the first vacuum cavity heat plate covers the projection of the first phase change material layer.

7. The housing assembly of claim 3, wherein, The first heat conduction member further comprises a first graphite sheet, the first graphite sheet is connected between the first heat conduction surface of the circuit board assembly and the first vacuum cavity heat plate.

8. The housing assembly of any one of claims 1 to 7, wherein, The second phase change material layer is located on the side of the second heat conduction member facing the battery area.

9. The housing assembly of any one of claims 1 to 7, wherein, The side of the second phase change material layer facing the battery area has a avoiding slot for accommodating a flexible circuit board. Or, the thickness of the second phase change material layer at different positions is equal.

10. The housing assembly of any one of claims 1 to 7, wherein, The thickness of the second phase change material layer ranges from 0.03 mm to 0.3 mm.

11. A terminal device, comprising: The shell assembly comprises a circuit board assembly and a shell assembly as claimed in any one of claims 1 to 10. The circuit board assembly is located in the mainboard area, and the circuit board assembly comprises a mainboard, a first heat generating device and a second heat generating device, the mainboard has a first surface and a second surface opposite to each other; the first heat generating device is arranged on the first surface, and the second heat generating device is arranged on the second surface; the first surface is provided with a first shielding member, the first shielding member covers the first heat generating device, and the side of the first shielding member opposite to the mainboard forms the first heat conduction surface; The second surface is provided with a second shielding element, the second shielding element covers the second heat generating element, and a side of the second shielding element opposite to the mainboard forms the second heat conduction surface.

12. The terminal device according to claim 11, characterized by The middle frame is provided with a through hole corresponding to the mainboard area; and the first shielding element is at least partially located in the through hole, or the first shielding element is arranged towards the through hole.

13. The terminal device of claim 11, wherein, In the case where the heat dissipation structure comprises the first heat dissipation group, a first heat conduction gel is arranged between the top of the first shielding element and the first heat generating element; and a second heat conduction gel is arranged between the top of the first shielding element and the first heat conduction element of the first heat dissipation group. In the case where the heat dissipation structure comprises the second heat dissipation group, a third heat conduction gel is filled in the second shielding element, the third heat conduction gel covers the second heat generating element and is connected to the top of the second shielding element.

14. The terminal device according to any one of claims 11 to 13, characterized by, The first shielding element comprises a frame-shaped portion and a cover body, the frame-shaped portion is mounted to the first surface, the cover body is connected to a side of the frame-shaped portion opposite to the mainboard, the frame-shaped portion and the cover body enclose a first accommodating cavity, the first heat generating element is located in the first accommodating cavity, and a side of the cover body opposite to the mainboard forms the first heat conduction surface.

15. The terminal device according to any one of claims 11 to 13, characterized by, The first shielding element comprises an integrated first metal cover, and a side of the first metal cover opposite to the mainboard forms the first heat conduction surface.

16. The terminal device according to any one of claims 11 to 13, characterized by, The second shielding element comprises a conversion plate, a top plate and a metal shielding layer, the conversion plate is connected to the second surface, the top plate is connected to a side of the conversion plate opposite to the mainboard, the conversion plate is provided with an inner hole, the conversion plate and the top plate enclose a second accommodating cavity, the second heat generating element is located in the second accommodating cavity, the metal shielding layer is arranged on a side of the conversion plate opposite to the mainboard, and a side of the metal shielding layer opposite to the mainboard forms the second heat conduction surface.

17. The terminal device according to any one of claims 11 to 13, characterized by, The second shielding element comprises an integrated second metal cover, and a side of the second metal cover opposite to the mainboard forms the second heat conduction surface.

18. The terminal device according to any one of claims 11 to 13, characterized by, In the width direction of the mainboard, the first heat generating element is located in the middle of the mainboard. In the width direction of the middle frame, the first heat generating element is located in the middle of the middle frame.

19. The terminal device according to any one of claims 11 to 13, characterized by, The screen area is provided with a first screen. In the width direction of the middle frame, the first heat generating element is located in the middle of the middle frame.

20. The terminal device according to any one of claims 11 to 13, characterized by, The battery area is provided with a battery, and the battery is electrically connected to the circuit board assembly.

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